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CMOS: CMOS Technology depends on using both N-Type and P-Type devices on the same chip. The two main technologies: P-Well: The substrate is N-Type. The N-Channel device is built into a P-Type well within the parent N-Type substrate. The P-channel device is built directly on the substrate. N-Well: The substrate is P-Type. The N-channel device is built directly on the substrate, while the P-channel device is built into a N-type well within the parent P-Type substrate.
ADVANCED TECHNOLOGIES:
Twin Tub
Both an N-Well and a P-Well are manufactured on a lightly doped N-type substrate.
SOI allows the creation of independent, completely isolated nMOS and pMOS transistors virtually side-by-side on an insulating substrate.
P WELL PROCESS
STEP 1:
N-SUBSTRATE
STEP 2: P-well is formed by ion Implantation and diffusion. The depth of the p-well depends on the level of diffusion. Normally shallow well is preferred. Other areas are masked with Field Oxide(FOX).
STEP 3: Active masks are placed over the substrate, it defines the places for gate, source, drain implantation
SiO2
P-Well N-SUBSTRATE
STEP4: The oxide layer is protected by the protection ring consisting of SiN.
P-Well
N-SUBSTRATE
STEP5: Photo resist mask is used to mask the p-well from P+ implantation.
P-Well
N-SUBSTRATE
STEP 6:
P+ Implantation
P+
n+
P-Well N-SUBSTRATE
STEP 7: Polysilicon coating in done, gate and source points are marked and other areas are itched out.
Polysilico n
Oxide Layer
P-Well
N-SUBSTRATE
p+
p+
P-Well
N-SUBSTRATE
STEP 9:
p+
p+
P-Well N-SUBSTRATE
p+
p+
n+ P-Well
n+
N-SUBSTRATE
STEP 10:
METALIZATION
METAL n+ P-Well n+
p+
p+
N-SUBSTRATE
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