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Cu lc b Nghin Cu Khoa Hc Khoa in in t

ADVANCE PCB DESIGN

HOW TO WORK WITH SURFACE MOUNT DEVICES?

25-02-2012
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Linh kin SMD Surface(SMT) Mount Devices

Surface Mount Technology

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Value: 4k7, 56k, Size (footprint): 0603, 0805, 1206, Power Rate: 1/20, 1/10, 1/8, Tolerance: 0.25%, 1%, 5%,

SMD Resistor

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SMD Capacitor Ceramic (non-polar)

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SMD Capacitor Tantalum Capacitors

100uF 10V 226 = 22uF

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16V,

SMD Capacitor Electrolytic Capacitors

(Aluminum)

22uF 16V
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100uF 10V

Capacitors Polarity marking

SMD Capacitor

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SMD Package
Reference EIA 0201 0402 0603 0805 1206 1210 2010 2512 3/24/13 Reference ISO 0503 1005 1808 2012 3216 3225 5025 6332

Resistors
L (mm) 0.05 1.00.1 1.60.1 2.10.1 3.10.1 3.10.1 5.00.1 6.350.1 W (mm) 0.03 0.50.05 0.850.1 1.30.1 1.60.1 2.60.1 2.50.1 3.20.1 Power Rate

Ceramic Capacitors SMD Reference Reference Package L (mm) W (mm) EIA ISO
0201 0402 0603 0805 1206 1210 1812 1825 2220 2225 3/24/13 0503 1005 1808 2012 3216 3225 4532 4564 5650 5664 0.50.1 1.00.1 1.60.1 2.00.1 3.20.1 3.20.1 4.50.1 4.50.1 5.60.1 5.60.1 0.30.1 0.50.1 0.80.1 1.250.1 1.60.1 2.50.1 3.20.1 6.40.1 5.00.1 6.30.1

SMD Package
Reference Reference EIA ISO A B C D E 3216 3528 6032 7343 7343H

Tantalum Capacitors
L (mm) 3.2 3.5 6.0 7.3 7.3 W (mm) 1.6 2.8 3.2 4.3 4.3 1206

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Electrolytic Capacitors SMD Package Referenc D (mm) L (mm) A (mm) C (mm) W (mm) P (mm)
e B C D E F G 4.0 5.0 6.3 8.0 8.0 10.0 5.4 5.4 5.4 6.2 10.2 10.2 4.3 5.3 6.6 8.3 8.3 10.3 1.8 2.2 2.4 3.4 3.4 3.5 0.65 0.65 0.65 0.65 0.9 0.9 1.0 1.5 1.8 2.2 3.1 4

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Semiconductors SMD Package

& more
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Diode SMD Package

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Led SMD Package

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Led SMD Package

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Inductor SMD Package

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SOIC SMD Package

SOIC / SO: Small Outline IC

P = 1.27 mm = 50 mils

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SOIC SMD Package

SOIC / SO: Small Outline IC

P = 1.27 mm = 50 mils

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SOIC SMD Package

Narrow SOIC package Wide (or extended) SOIC package Mini- or microSOIC package 3.9 mm Body 7.5 mm Body 3/24/13 5.41 mm

SOP SMD Package

Small outline package(SOP) Plastic small-outline package (PSOP) Thin small-outline package(TSOP) Shrink small-outline package(SSOP) Thin-shrink small-outline package = 0.635 mm (TSSOP)

= 25 mils

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SOP SMD Package

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QFP SMD Package

QFP(quad-flat Package)

Lead Spacing: P = 12 25 mils

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QFP SMD Package

BQFP: Bumpered Quad Flat Package BQFPH: Bumpered Quad Flat Package with heat spreader CQFP: Ceramic Quad Flat Package EQFP: Plastic Enhanced Quad Flat Package FQFP: Fine Pitch Quad Flat Package MQFP: Metric Quad Flat Package SQFP: Small Quad Flat Package TQFP: Thin Quad Flat Package VQFP: Very small Quad Flat Package VTQFP: Very Thin Quad Flat Package
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QFP SMD Package

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QFN, DFN SMD Package

QFN(quad-flat no- DFN TDFN leads) DFN(dual-flat UTDF ML (microno-leads) N leadframe) XDFN LP (LeadLess) QFN
QFNTEP TQFN LLP LPCC MLF MLPD dual flat no-lead package thin dual flat no-lead package ultra-thin dual flat no-lead package extremely thin dual flat no-lead package quad flat no-lead package quad flat no-lead package with top-exposed pad thin quad flat no-lead package leadless leadframe package leadless plastic chip carrier micro-leadframe micro-leadframe package dual

MLPM micro-leadframe package micro MLPQ micro-leadframe package quad

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DRML dual-row micro-leadframe

Ex: FTDI FT232 Package

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Soldering SM Devices

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Hn linh kin SMD

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References

http:// www.elettropoint.net/index.php?option=com_content&view=a http://en.wikipedia.org http://www.sparkfun.com/

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PCB Module Examples:

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2-layer PCB

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