Samsung DVD v5600 v6600 SM

DVD-VCR COMBINATION
Chassis : Midas DVD-V5600/ XAX, XAP, XAO, GEN, RCL, STR DVD-V6600/ XAX, XAP, XAO, GEN, RCL, STR
SERVICE MANUAL DVD-V5600 / V6600
SERVICE
DVD-VCR COMBINATION
Manual
Main Features
ELECTRONICS
The One Unit Solution Digital Theater System Digital Photo (JPEG) Viewer Advanced GUI 4 Head Hi-Fi Stereo DVD-V5600 Multi Language Menu Screen Various User Convenience Function DivX Playback DVD-V6600
This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable international and/or domestic law.
Samsung Electronics Co., Ltd. MAR. 2006 Printed in Korea AK82-01065A
CONTENTS
1. Precautions
1-1 1-2 1-3 1-4 1-5 Safety Precaution Servicing Precautions ESD Precautions Handling the optical pick-up Pick-up disassembly and reassembly
1-1 ~ 1-6
(1-1) (1-3) (1-4) (1-5) (1-6)
2. Product Specification
2-1 Product Specification 2-2 Chassis Product Specification 2-3 Option Product Specification
2-1 ~ 2-4
(2-1) (2-2) (2-3)
3. Alignment and Adjustments

3-1 VCR Adjustment 3-2 DVD Adjustment 3-3 VCR Mechanical Adjustment
3-1 ~ 3-14
(3-1) (3-4) (3-7)
4. Disassembly and Reassembly

4-1 4-2 4-3 4-4 4-5 Cabinet and PCB Circuit Board Locations VCR Deck Parts Locations VCR Deck The table of cleaning, Lubrication and replacement time about principal parts 4-6 DVD Deck
4-1 ~ 4-26
(4-1) (4-3) (4-4) (4-7) (4-21) (4-22)
5. Trouble Shooting 6. Exploded View and Parts List

6-1 6-2 6-3 6-4 6-5 Cabinet Assembly (DVD-V5600) Cabinet Assembly (DVD-V6600) VCR Mechanical Parts (Top Side) VCR Mechanical Parts (Bottom Side) DVD Mechanical Parts
5-1 ~ 5-34 6-1 ~ 6-12

(6-2) (6-4) (6-6) (6-8) (6-10)
CONTENTS
7. Electrical Parts List 8. Block Diagram
8-1 8-2 8-3 8-4 8-5 All Block Diagram U5 (Motor Driver IC) Block Diagram U4 (SDRAM) Block Diagram U1 (Flash Memory) Block Diagram U3 (Decoder IC) Block Diagram
7-1 ~ 7-10 8-1 ~ 8-6

(8-2) (8-3) (8-4) (8-5) (8-6)
9. Wiring Diagram 10. PCB Diagrams

10-1 VCR Main PCB (Inclusive of S.M.P.S PCB) 10-2 DVD Main PCB 10-3 Function PCB
9-1 ~ 9-2 10-1 ~ 10-8

(10-2) (10-5) (10-7)
11. Schematic Diagrams

11-1 S.M.P.S. (VCR Main PCB) 11-2 Power (VCR Main PCB) 11-3 Logic/Function (VCR Main PCB) 11-4 A/V (VCR Main PCB) 11-5 Hi-Fi/MTS (VCR Main PCB) 11-6 TM/Input-Output (VCR Main PCB) 11-7 DVD I/O (VCR Main PCB) 11-8 DVD AV-Decoder (DVD Main PCB) 11-9 DVD M_Drive/RF (DVD Main PCB) 11-10 DVD Audio (DVD Main PCB)
11-1 ~ 11-12
(11-3) (11-4) (11-5) (11-6) (11-7) (11-8) (11-9) (11-10) (11-11) (11-12)
CONTENTS
12. Operating Instructions 13. Circuit Operating Descriptions
13-1 S.M.P.S. 13-2 VCR System Control 13-3 VCR Servo 13-4 VCR Video 13-5 Hi-Fi Audio 13-6 Linear Audio 13-7 TM 13-8 OSD 13-9 Input-Output 13-10 DVD System Control 13-11 RF 13-12 Servo 13-13 DVD Data Processor 13-14 Video 13-15 Audio
12-1 ~ 12-12 13-1 ~ 13-54

(13-1) (13-10) (13-20) (13-24) (13-32) (13-37) (13-40) (13-43) (13-44) (13-45) (13-46) (13-47) (13-50) (13-51) (13-52)
14. Reference Information

14-1 14-2 14-3 14-4 14-5 14-6 14-7 14-8 VCR Deck Operating Description Basic Configuration of Mechanism Main Mechanism and Functions Basis of the Mechanism System Control System Control and Mechanical Operations Introduction to DVD DVD-Video Fromat
14-1 ~ 14-34
(14-1) (14-1) (14-2) (14-4) (14-9) (14-10) (14-26) (14-28)
IMPORTANT SERVICE GUIDE

MODE SWITCH (PROGRAM SWITCH) ASSEMBLY POINT
1) When installing the assy deck on the Main PCB, be sure to align the assembly point of mode switch.
ASSEMBLY POINT
VCR MAIN PCB Fig. 1
HOW TO EJECT THE CASSETTE TAPE (If the tape is stuck in the unit)
1) Turn the Gear Worm clockwise in the direction of arrow with a screwdriver. (See Fig. 2) (Other method ; Remove the screw of Motor Load Assy, Separate the Motor Load Assy) 2) When Slider S, T approachs the unloading position, rotate holder Clutch counterclockwise after inserting screwdriver in the frames bottom hole in order to wind the unwound tape. (Refer to Fig. 3) (If you rotate Gear Worm continuously when tape is unwinding, you may cause tape contamination by grease and tape damage. Be sure to wind the unwound tape with the unit in the horizontall position.) 3) Rotate Gear Worm clockwise using a screwdriver until the mecha is in the eject state. Remove the tape. (Refer to Fig. 2)
FRAME
GEAR WORM
Fig. 2
Fig. 3
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer, always make a safety check of the entire instrument, including, but not limited to, the following items: (1) Be sure that no built-in protective devices are defective or have been defeated during servicing. (1)Protective shields are provided to protect both the technician and the customer. Correctly replace all missing protective shields, including any removed for servicing convenience. (2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place all protective devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and compartment covers/shields, and isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and functioning. (2) Be sure that there are no cabinet openings through which adults or children might be able to insert their fingers and contact a hazardous voltage. Such openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back cover. (3) Leakage Current Hot Check-With the instrument completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards institute (ANSI) C101.1 Leakage Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instruments AC switch first in the ON position and then in the OFF position, measure from a known earth ground (metal water pipe, conduit, etc.) to all exposed metal parts of the instrument (antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis. Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1. Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated before returning the instrument to the customer.
(READING SHOULD NOT BE ABOVE 0.5mA) DEVICE UNDER TEST TEST ALL EXPOSED METER SURFACES 2-WIRE CORD ALSO TEST WITH PLUG REVERSED (USING AC ADAPTER PLUG AS REQUIRED) EARTH GROUND
LEAKAGE CURRENT TESTER
Fig. 1-1 AC Leakage Test

(4) Insulation Resistance Test Cold Check-(1) Unplug the power supply cord and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is not within the limits specified, there is the possibility of a shock hazard, and the instrument must be repaired and rechecked before it is returned to the customer. See Fig. 1-2.
Antenna Terminal
Exposed Metal Part
ohm
ohmmeter
Fig. 1-2 Insulation Resistance Test

Samsung Electronics 1-1
Precautions
2) Read and comply with all caution and safety related notes on or inside the cabinet, or on the chassis. 3) Design Alteration Warning-Do not alter or add to the mechanical or electrical design of this instrument. Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the user. Any design alterations or additions will make you, the servicer, responsible for personal injury or property damage resulting therefrom. 4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas: (1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or frayed wiring, Do not change spacing between a component and the printed-circuit board. Check the AC power cord for damage.
5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with components, parts and/ or wiring that meet original specifications. Additionally, determine the cause of overheating and/or damage and, if necessary, take corrective action to remove any potential safety hazard. 6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics which are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading, an ( )or a ( )on schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might create shock, fire and/or other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.
1-2
Samsung Electronics
Precautions
1-2 Servicing Precautions

CAUTION : Before servicing units covered by this service manual and its supplements, read and follow the Safety Precautions section of this manual. Note : If unforseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions. Remember: Safety First. (4) An insulation tube or tape is sometimes used and some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install such elements as they were. (5) After servicing, always check that the removed screws, components, and wiring have been installed correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plug and accessible conductive parts.
1-2-1 General Servicing Precautions

(1) a. Always unplug the instruments AC power cord from the AC power source before (1) re-moving or reinstalling any component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or other electrical connection, (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument. b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service manual might be equipped. c. Do not apply AC power to this instrument and /or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. d. Always connect a test instruments ground lead to the instrument chassis ground before connecting the test instrument positive lead. Always remove the test instrument ground lead last. Note : Refer to the Safety Precautions section ground lead last. (2) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials. (3) The components used in the unit have a specified flame resistance and dielectric strength. When replacing components, use components which have the same ratings. Components identified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact replacement components.
1-2-2 Insulation Checking Procedure

Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible conductive parts(see note) should be more than 1 Megohm. Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.
Samsung Electronics
1-3
Precautions
1-3 ESD Precautions

Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. (1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. (2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. (3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices. (4) Use only an anti-static solder removal devices. Some solder removal devices not classified as anti-static can generate electrical charges sufficient to damage ESD devices. (5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices. (6) Do not remove a replacement ESD device from its protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials). (7) Immediately before removing the protective materials from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. (8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
1-4
Samsung Electronics
Precautions
1-4 Handling the optical pick-up

The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body. The following method is recommended. (1) Place a conductive sheet on the work bench (The black sheet used for wrapping repair parts.) (2) Place the set on the conductive sheet so that the chassis is grounded to the sheet. (3) Place your hands on the conductive sheet(This gives them the same ground as the sheet.) (4) Remove the optical pick up block (5) Perform work on top of the conductive sheet. Be careful not to let your clothes or any other static sources to touch the unit. Be sure to put on a wrist strap grounded to the sheet. Be sure to lay a conductive sheet made of copper etc. Which is grounded to the table.
THE UNIT WRIST-STRAP FOR GROUNDING
1M
1M
CONDUCTIVE SHEET
Fig.1-3
(6) Short the short terminal on the PCB, which is inside the Pick-Up ASSY, before replacing the PickUp. (The short terminal is shorted when the PickUp Assy is being lifted or moved.) (7) After replacing the Pick-up, open the short terminal on the PCB.
Samsung Electronics
1-5
Precautions
1-5 Pick-up disassembly and reassembly

1-5-1 Disassembly
1) Remove the power cord. 2) Disassemble the Deck-Assy. 3) Make solder land 2 points short on Pick-up. (See Fig. 1-4) 4) Disassemble the Pick-up.
1-5-2 Assembly
1) Replace the Pick-up. 2) Remove the soldering 2 points on Pick-up. 3) Reassemble the Deck-Assy.
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
PICK-UP ASS'Y
SOLDER LAND 2 POINTS SHORT
Fig. 1-4
1-6
Samsung Electronics
2. Product Specification
2-1 Product Specification
AUDIO Inputs VIDEO RF AUDIO AUDIO (DVD only) Outputs VIDEO VIDEO (DVD only) RF VIDEO SYSTEM AUDIO TRACK VCR PLAY/RECORD FF/REW TIME HEADS Stereo audio inputs, RCA Connector, -8dbm, 47K, front and rear Composite video inputs, RCA Connector, 75, 1Vp-p Antenna or CATV Input, F-Connector, 75 Stereo audio outputs, RCA Connector, -8dbm, 1.5K Digital audio output (1coaxial and 1 optical)) Pair Stereo audio outputs Composite video output, RCA Connector, 75, 1Vp-p S-Video output, S-Connector, 75, Y=1.0Vp-p, C=0.286Vp-p Component video output, 75, Y=1.0Vp-p, Pb=0.7Vp-p, Pr=0.7Vp-p Channel 3 or 4 1/2-inch VHS system, 4 rotary head helical scanning; FM azimuth luminance;chrominance: converted sub system phase shift Normal: 1 track; Hi-Fi: 2 track T-180 tape: SP 3 hours, SLP 9 hours T-120 tape: <2 minutes Video: DA 4 rotary Audio: 2 rotary heads (Hi-Fi); 1 stationary head (Linear) Control: 1 stationary head Erase: 1 full track, 1 audio track WOW & FLUTTER FREQ. RESPONSE DISC COMPATIBILITY DVD FREQ. RESPONSE S/N RATIO DYNAMIC RANGE THD POWER REQUIREMENT System ENVIRONMENT WEIGHT Less than 0.005% (Hi-Fi) 20-20,000 Hz (Hi-Fi) CD, CD-R, CD-RW DVD-Video, CD-Digital Audio (5and 3.5) 96/48 kHz Sampling: 4 Hz-22kHz 110 dB 96 dB 0.003 % 120V AC, 60 Hz, 25 watts 41-104F (5-40C); 10%-75% humidity 13.8 lbs.
Samsung Electronics
2-1
Product Specification
2-2 Chassis Product Specification

Features Design Power Pront Pannel Design Front Pannel Color POWER DVD Region Code Disc Support VCD Playback Divx Playback VCR HEAD S-VHS Quasi Playback VCR VCR Hi-Fi Timer Recording Copy TV RF Tuner Composite Video Out Component Video Out AV Terminal Progressiv Scan out S-Video Optical Digital Audio Coaxial Digital Audio Remocon Remocon Type 2006 product DVD-V5600/XAX 06-SECCOM430C1 Silver 100-240V 4 Yes Yes 6HD Yes Yes 7E/1M No Yes 1 out (Rear) 1 out Yes 1 out 1 out 1 out DVD-V6600/XAX 06-SECCOM430B1 Black 100-240V 4 Yes Yes 6HD Yes Yes 7E/1M No Yes 1 out (Rear) 1 out Yes 1 out 1 out 1 out 2005 product DVD-V5500/XAX 05-SECCOM430A Silver 100-240V 4 Yes No 6HD Yes Yes 7E/1M No Yes 1 out (Rear) 1 out Yes 1 out 1 out 1 out DVD-V6500/XAX 05-SECCOM430B Silver 100-240V 4 Yes No 6HD Yes Yes 7E/1M No Yes 1 out (Rear) 1 out Yes 1 out 1 out 1 out
VR7147(47key-Mullti) VR7147(47key-Mullti) VR6144(44key-Multi) VR6144(44key-Multi)
Difference between '06 year product and existing '05 year product
SAMSUNG '06 year MIDAS NTSC Combo(DVD-V5600/V6600) have same features in '05 year product operation. But use Different outlook. DVD-V5600/V6600 model uses S5L5010 DVD Processor of Samsung Semiconductor co. 1. Generally, all the features in User Operating is same with '05 product. 2. But in view of Circuitry Architecture, RF-IC for DVD Deck Servo operation are built-in S5L5010 DVD Processor. This is the only difference between DVD Block of '06 product and '05 product. 3. In view of bundle accessory, MIDAS NTSC Combo gives newly designed Remocon Assembly. The design of Remocon is SAMSUNG '06 Style - Black colored. 4. And there is one change of A/V terminal location. AUX Input terminal(RCA Input jack) in the Front Panel Assembly is moved from Right side to Left side in Front View. This is the difference in VCR Board Assembly.
2-2
Samsung Electronics
2-3 Option Product Specification

Description Fig Description Parts No Remark
Remote Control
AK59-00052C
Model Standard of DVD-V5600/XAX
Batteries for Remote Control
Model Standard of AC43-12002H DVD-V5600/XAX S.N.A
Owners Instructions
AK68-00956C
Video/Audio Cable
AC39-00073A
RF Cable
AC39-42001J
Samsung Electronics
2-3
MEMO
2-4
Samsung Electronics
3. Alignment and Adjustments

3-1 VCR Adjustment
3-1-1 Reference
1) X-Point (Tracking center) adjustment, Head switching adjustment and NVRAM option setting can be adjusted with remote control. 2) When replacing the VCR Main PCB Micom (IC601) and NVRAM (IC603 ; EEPROM) be sure to adjust the Head switching adjustment and NVRAM option setting. 3) When replacing the cylinder assy, be sure to adjust the X-Point and Head switching adjustment. 4) How to adjust. - Intermittently short-circuit the Test Point on VCR Main PCB with pincers to the adjustment mode. - If the corresponding adjustment button is pressed, the adjustment is performed automatically. - When the adjustment is completed, be sure to turn the power off. 3-1-1(a) Location of adjustment button of remote control
X-Point (Tracking Center) Adjustment ; NVRAM Option Setting ; Head Switching Adjustment ;
Fig. 3-1
Samsung Electronics
3-1
Alignment and Adjustments
3-1-1(b) TEST location for adjustment mode setting
Short-Circuit for few seconds and release. (Just one time)
Fig. 3-2 VCR Main PCB (Top View)
3-2
Samsung Electronics
3-1-2 Head Switching Point Adjustment

1) Playback the alignment tape. 2) Intermittently short-circuit the two Test Points on VCR Main PCB while setting the adjustment mode. (See Fig. 3-2) 3) Press the 1, 0 buttons; remote control adjustment operates automatically. (See Fig. 3-1)
3-1-3 NVRAM Option Setting

1) NVRAM Option is adjusted in the factory. 2) In case VCR Main PCB Micom (IC601) and NVRAM (IC603 ; EEPROM) are replaced, be sure to set the corresponding option number of the required model. (If the option is not set, the unit will not operate.) 1) Intermittently short-circuit the two Test Points on VCR Main PCB. (See Fig. 3-2) 2) Press the 1, 4 button on the remote control. The option setting appears. (See Fig. 3-3) 3) Select the option number (See table 3-1) of corresponding model with , , , buttons on the remote control. 4) After selecting the option number is completed, press the button of remote control. (If button is pressed, the selected number is changescolor. ; See Fig. 3-4) 5) Press the ENTER button of remote control again to store the option number. 6) Turn the Power off.
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 MOVE : SAVE :
Fig.3-3
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 MOVE : COMPLETE
Fig.3-4
ENTER
<Table 3-1 NVRAM Option Table>

MODEL OPTION NUMBERS
DVD-V5600/ XAX, XAP, XAO DVD-V6600/ XAX, XAP, XAO DVD-V5600/ GEN, RCL, STR DVD-V6600/ GEN, RCL, STR 2, 4, 7, 8, 9, 14, 16, 17, 20, 22, 25, 26, 29, 31 2, 4, 7, 8, 9, 14, 16, 28, 22, 25, 26, 29, 31
Samsung Electronics
3-3
3-2 DVD Adjustment

3-2-1 Location of Test Point
U1
U3
U5
U3
Pin 136
Fig. 3-5 Location of test Point (DVD Main PCB - Top Side)
3-4
Samsung Electronics
3-2-2 Skew Adjustment

3-2-2(a) Adjustment Spec. and Test Point <Table 3-2> Test Disc TDV-533 Chapter 14 Adjustment Spec. Flat Waveform Test Point Pin 142 (DVD Main PCB - Top Side) (See Fig. 3-5) Test Disc ; Service not Available Adjustment Location Assy Deck - Top Side (See Fig. 3-6)
Fig.3-6 Assy Deck (Top Side)
Samsung Electronics
3-5
3-2-2(b) SKEW Adjustment Method Needed to minimize the variations in Skew of the Pickup unit and to provide optimum match with the recorded signal on the Disc. 1) Connect an Oscilloscope to the Pin 142 Test Point (See Fig. 3-5). 2) Connect Power, Open the Tray and Play Ch.14 Which is in the TDV-533 Disc. Set the Oscilloscope Range as follows : (Voltage ; 50mV/Div., Frequency ; 10m Sec.) 3) Adjust the Screws A and B (See Fig. 3-6) using a Hex screwdriver until you obtain a Flat Waveform and the picture is stable. Then, go to Chapter 1 and make sure the Waveform is Flat here as well. If not, you have to go back to Chapter 14 and adjust again. If you cannot obtain a Flat waveform, then the unit is defective. Note : The Deck must be in a horizontal position. Use both A and B screws to adjust.
Typical Waveform before Adjustment
Waveform after Correct Adjustment
Fig. 3-7 Envelope Waveform
3-2-3 Firmware Upgrade with CD

Follow as below 1) 2) 3) 4) 5) Power On the SET Play Upgrade Disc Then, SET is automatically Upgrade Software During Upgrade, You can see READ and ERASE, WRITE , DONE in your TV. If Upgrade is finished, Picture of TV is goes out to Black, and Only -- -- is remain in LED Display (But this state is not Stanby) 6) Input STANBY/ON Button In your REMOCON or Front Pannel to Turn off the SET. 7) Power On the set, and input OPEN button before Disc is loaded. When Tray is open, Delete the Upgrade Disc. 8) This is the end of Software upgrade.
3-6
Samsung Electronics
3-3 VCR Mechanical Adjustment

3-3-1 Tape Transport System and Adjustment Locations
The tape transport system has been adjusted precisely in the factory. Alignment is not necessary except for the following : 1) Noise observed on the screen. 2) Tape damage. 3) Parts replacement in the tape transport system. Lower flange height of tape guide is used as the reference for the transport adjustment. To maintain the height of the tape guide and prevent damage, do not apply excessive force onto the main base.
CYLINDER ASS' Y GUIDE ROLLER "S" GUIDE ROLLER "T"
FULL ERASE HEAD #3 GUIDE POST TENSION POST TI LT SCREW X-POSITION ADJUST SLIT AZIMUTH SCREW
HIGH T SCREW PINCH ROLLER #9 GUIDE POST CAPSTAN #8 GUIDE POST
SUPPLY REEL DISK
TAKE UP REEL DISK
Fig. 3-8 Location of Tape Transport Adjustment PINCH ROLLER FE HEAD CYLINDER ASS'Y GUIDE ROLLER "S" GUIDE ROLLER "T" POST TENSION #8 GUIDE POST #9 GUIDE POST
#3 GUIDE POST
AC HEAD CAPSTAN SHAFT Fig. 3-9 Tape Travel Diagram
MAIN BASE
Samsung Electronics
3-7
3-3-2 Tape Transport System Adjustment

When parts are replaced, perform the required adjustments by referring to procedures for the tape transport system. If there are any changes to the tape path, first run a T-120 tape and make sure excessive tape wrinkle does not occur at the tape guides. If tape wrinkle is observed at the guide roller S, T, turn the guide roller S, T until wrinkle disappears. If the tape wrinkle is still observed at the tape guide, perform the tilt adjustment of the AC head. (1) AC Head Assembly Adjustment a. AC HEAD HEIGHT ADJUSTMENT 1) Run the alignment tape (Color bar) in the playback mode. 2) Observe surface of the audio head using a dental mirror. 3) Turn screw (C) clockwise or counterclockwise until the gap of lower tape edge and the lower edge of the control head is about 0.25mm. (Refer to Fig. 3-10 and 3-11)
SCREW (A) TI LT SCREW X-POSITION ADJUST SLIT SCREW (B) AZIMUTH ADJUST
SCREW (C) HIGHT SCREW SCREW (D) X-POSITION LOCKING
Fig. 3-10 Location of AC Head Adjustment Screw

AUDIO HEAD VIDEO HEAD
0 ~ 0 .25 mm CONTROL HEAD
Fig. 3-11 AC Head Height Adjustment
3-8
Samsung Electronics
b. AC HEAD TILT ADJUSTMENT 1) Playback a blank tape and observe the position of the tape at the lower flange of tape guide. 2) Confirm that there is no curl or wrinkle at the lower flange of tape guide as shown in Fig. 3-12 (B). 3) If a curl or wrinkle of the tape occurs, slightly turn the screw (A) tilt adjust on the AC head assy. 4) Reconfirm the AC head height.
(A)
(B)
WRINKLE
(BAD)
Fig. 3-12 Tape Guide Check c. AUDIO AZIMUTH ADJUSTMENT 1) Load alignment tape (Mono scope) and playback the 7KHz signal. 2) Connect channel-1 scope probe to audio output. 3) Adjust screw (B) to achieve maximum audio level. (See Fig. 3-10)
(GOOD)
Samsung Electronics
3-9
d. AC HEAD POSITION (X-POINT) ADJUSTMENT 1) Playback the alignment tape (Color bar) 2) Intermittently short-circuit the two Test Points on VCR Main PCB. (See Fig. 3-2) 3) Press the 0, 5 remote control buttons, then adjustment is operates automatically. (See Fig. 3-1) 4) Connect the CH-1 probe to Envelope the CH-2 probe to HD switching pulse and then trigger to CH-1. 5) Insert the (-) driver into the X-Point adjustment hole and adjust it so that envelope waveform is maximum. Test point : TP2 (Audio Output) TP3 (Envelope) TP4 (HD S/W -Trigger) TP5 (Control Pulse)
CONTROL PULSE HEAD SWITCHING ENVELOPE AUDIO OUTPUT
Fig. 3-13 Location of Test point (VCR Main PCB-Top View)
3-10
Samsung Electronics
(2) Linearity adjustment (Guide roller S, T adjustment) 1) Playback the Mono Scope alignment tape (SP mode). 2) Observe the video envelope signal on an oscilloscope (triggered by the video switching pulse). 3) Make sure the video envelope waveform (at its minimum) meets the specification shown in Fig. 3-14. If it does not, adjust as follows : Note : a=Maximum output of the video RF envelope. b=Minimum output of the video RF envelope at the entrance side. c=Minimum output of the video RF envelope at the center point. d=Maximum output of the video RF envelope at the exit side. 4) If the section A in Fig. 3-15 does not meet the specification, adjust the guide roller S up or down. 5) If the section B in Fig. 3-15 does not meet the specification, adjust the guide roller T up or down.
c d
abcd c,b,d/a 63%
Fig. 3-14 Envelope Waveform Adjustment
H'D SWITCHING PULSE
ENVELOPE
Fig. 3-15 Adjustment Points
Samsung Electronics
3-11
6) Play back the Mono Scope alignment tape (SP mode). 7) Connect an oscilloscope CH-1 to the Envelope and CH-2 to the HD SW Pulse for triggering. 8) Turn the guide roller heads with a flat head ( ) driver to obtain a flat video RF envelope as shown in Fig. 3-16.
IDEAL ENVELOPE
S HEIGHT TOO HIGH
S HEIGHT TOO LOW
T HEIGHT TOO HIGH
T HEIGHT TOO LOW
GUIDE ROLLER S
GUIDE ROLLER T
Fig. 3-16 Guide Roller S, T Height Adjustment
3-12
Samsung Electronics
(3) Check Transitional Operation from RPS to Play Check transition from RPS mode to play mode : Using a pre-recorded SP tape, make sure the entry side of envelope comes to an appropriate steady state within 3 seconds (as shown in Fig. 3-17). If the envelope waveform does not reach specified peak-to peak amplitude within 3 seconds, adjust as follows : 1) Make sure there is no gap between the supply roller lower flange and the tape. If there is a gap, adjust the supply guide roller again. 2) Change operation mode from the RPS to the play mode (again) and make sure the entry side of envelope rises within 3 seconds.
ENTRANCE SIDE ENVELOPE
Fig.3-17 Video Envelope Rising when Operation mode Changes from RPS to Play Mode
(4) Envelope Check

1) Make recordings on T-120 (E-120) and T-160 (E-180) tape. Make sure the playback output envelope meets the specification as shown in Fig. 3-18. 2) Play back a self recorded tape (recording made on the unit using with T-120 (E-120). The video envelope should meet the specification as shown in Fig. 3-18. In SP mode, (A) should equal (B). If the head gap is wide, upper cylinder should be checked.
Fig. 3-18 Envelope Input and Output Level
(5) Tape Wrinkle Check

1) Run the T-160 (E-180) tape in the playback, FPS, RPS and Pause modes and observe tape wrinkle at each guide. 2) If excessive tape wrinkle is observed, perform the following adjustments in Playback mode : Tape wrinkle at the guide roller S, T section : Linearity adjustment. Tape wrinkle at tape guide flange : AC head assembly coarse adjustment. Samsung Electronics 3-13
3-3-3 Reel Torque

1) The rotation of the capstan motor causes the holder clutch assy to rotate through the belt pulley. 2) The spring wrap PLAY/REV of holder clutch assy drives the disk reel S, T through gear idler by rotation of gear center assy. 3) Brake is operated by slider cam at FF/REW mode. 4) Transportation of accurate driving force is done by gears. (Gear Center Assy) Note : If the spec. does not meet the followings specifications, replace the holder clutch assy and then recheck. <Table 3-3> MODE PB RPS TORQUE g/cm 42 11 145 30 GAUGE Cassette Torquemeter Cassette Torquemeter
3-14
Samsung Electronics
4. Disassembly and Reassembly

4-1 Cabinet and PCB
4-1-1 Cabinet Top Removal 4-1-3 Assy Front Panel Removal
REMOVE 2 SCREWS
(3 X 10 B)
RELEASE 3 HOOKS (Top View)
Fig. 4-1 Cabinet Top Removal
4-1-2 Assy Bottom Cover Removal

RELEASE 2 HOOKS
RELEASE 3 HOOKS (Bottom View) Fig.4-3 Assy Front Panel Removal (Bottom View)
4-1-4 Function PCB Removal

Fig. 4-2 Assy Bottom Cover Removal
RELEASE 1 HOOK Fig. 4-4 Function PCB Removal Samsung Electronics 4-1
Disassembly and Reassembly
4-1-5 Chassis Removal

REMOVE 2 SCREWS
(3 X 12 Y)
REMOVE 4 SCREWS
(4 X 10 Y)
REMOVE 3 SCREWS
(3 X 12 Y)
REMOVE 3 SCREWS
(3 X 8 Y)
REMOVE 2 SCREWS
(3 X 8 Y)
REMOVE 2 SCREWS
(3 X 8 Y)
REMOVE 2 SCREWS
(3 X 10 B)
Fig. 4-5 Chassis Removal
4-1-6 VCR Main PCB Removal

REMOVE 4 SCREWS
(4 X 12 Y)
Fig. 4-6 VCR Main PCB Removal 4-2 Samsung Electronics
4-2 Circuit Board Locations
SMPS PCB
DVD MAIN PCB VCR MAIN PCB
FUNCTION PCB
Fig. 4-7 Circuit Board Locations
Samsung Electronics
4-3
4-3 VCR Deck Parts Locations

4-3-1 Top View
Fig. 4-8 Top parts Location-1
GEAR FL CAM ASSY MOTOR LOADING ASSY LEVER ARM ASSY HOLDER CASSETTE LEVER DOOR SLIDER FL DRIVE
4-4
Samsung Electronics

Fig.4-9 Top Parts Location-2
FE HEAD ASSY CYLINDER ASSY CE HEAD ASSY LEVER UNIT PINCH ASSY LEVER #9 GUIDE ASSY LEVER TENSION ASSY BAND BRAKE
DISK S REEL ASSY LEVER S BRAKE GEAR IDLE LEVER IDLE ASSY LEVER T BRAKE DISK T REEL
Samsung Electronics
4-5
4-3-2 Bottom View
Fig. 4-10 Bottom Parts Location GEAR JOINT 1 GEAR JOINT 2 BRAKET GEAR ASSY MOTOR CAPSTAN ASSY LEVER T LOAD GEAR LOADING DRIVE ASSY LEVER S LOAD ASSY CLUTCH BELT PULLEY SLIDER CAM
4-6
Samsung Electronics
4-4 VCR Deck

4-4-1 Assy Holder Cassette Removal
1) Pull the Ass'y Holder Cassette to the eject position. 2) Pull the Ass'y Holder Cassette as grasping the Ass'y Holder Cassette and Lever Lock in the same time to release hooking from Main Base until the Boss [A] of Ass'y Holder Cassette is taken out from the Rail [B]. 3) Lift the Ass'y Holder Cassette , in this time, you have to grasp the Lever Lock Continuously until the Ass'y Holder Cassette is taken out completely. Note : Be sure to insert Lever Lock in the direction of A to prevent separation and breakage of the Lever Lock at disassembling and reassembling.
4-4-2 Assy Lever Arm Removal

1) Push the hole A in the direction of arrow B use the pin.(about Dia. 2.5) 2) Pull out the Ass'y Lever Arm from the Boss of Main Base. 3) Remove the Ass'y Lever Arm in the direction of arrow C.
HOLE "A"
PIN "B" "C"
ASS'Y LEVER ARM
Fig. 4-12 Assy Lever Arm Removal
ASS`Y HOLDER CASSETTEE BOSS [A]
RAIL [B] "A" LEVER LOCK
Fig. 4-11 Assy Holder Cassette Removal
Samsung Electronics
4-7
4-4-3 Lever Door Removal

1) Release the Hook and Remove the Lever Door in the direction of arrow A.
4-4-4 Slider FL Drive, Gear FL Cam Removal

1) Pull the Slider FL Drive to the front direction. 2) Remove the Slider FL Drive in the direction of arrow. (Refer to Fig. 4-13) 3) Remove the Gear FL cam . Note : When reinstalling be sure to reassemble Slider FL drive after you insert the Boss of Lever ARM-R in Groove of Slider Fl drive .
LEVER FL DOOR
"A"
Assembly : Align the Gear FL Cam with the Gear worm wheel Post as shown drawing. (Refer to Timing point)
SLIDER FL DRIVE "B" "C"
Fig.4-13 Lever Door Removal
GEAR FL CAM SLIDER FL DRIVE
Fig.4-14 Slider FL Drive Removal GEAR FL CAM GEAR WORM WHEEL
POST TIMING POINT Fig. 4-15 Gear FL Cam, Gear Worm
4-8
Samsung Electronics
4-4-5 Gear Worm Wheel Removal

1) Remove the Gear Worm wheel .
4-4-6 Cable Flat Removal

1) Remove the Drum connecting part of Cable Flat from Connector Waffer , . CABLE FLAT
CONNECTOR WAFER
CONNECTOR WAFER
GEAR WORM WHEEL
Fig. 4-16 Gear Worm Wheel Removal Fig. 4-17 Cable Flat Removal
Samsung Electronics
4-9
4-4-7 Assy Motor Loading Removal

1) Remove the Screw . 2) Remove the Assy Motor Loading .
4-4-8 Bracket Gear, Gear Joint 2, 1 Removal

1) Remove the Screw . 2) Remove the Bracket Gear . 3) Remove the Gear Joint 2 . 4) Remove the Gear Joint 1 . Assembly : 1) Be sure to align dot mark of Gear Joint 1 with dot mark of Gear Joint 2 as shown Fig 4-20. (Refer to Timing point1) 2) Confirm the Timing Point 2 of the Gear Joint 2 and Slider Cam .
ASS`Y MOTOR LOADING SCREW GEAR JOINT 1
GEAR JOINT 2 SCREW BRAKET GEAR
Fig.4-18 Assy Motor Loading Removal
Fig. 4-19 Bracket Gear, Gear Joint 1,2 Removal GEAR JOINT1 GEAR JOINT2 SLIDER CAM
TIMING POINT 1
TIMING POINT 2
Fig. 4-20 Gear Joint 1,2 Assembly
4-10
Samsung Electronics
4-4-9 Gear Loading Drive, Slider Cam, Assy Lever Load S, T Removal
1) Remove the Belt Pulley. (Refer to Fig. 4-38) 2) Remove the Gear Loading Drive after releasing Hook [A] in the direction arrow as shown in detail drawing. 3) Remove the Slider Cam . 4) Remove the Assy Lever Load S & Assy Lever Load T .
4-4-10 Gear Loading Drive, Slider Cam, Assy Lever Load S, T Assembly
1) When reinstalling, be sure to align dot of Ass'y Lever Load T with dot of Ass'y Lever Load S as shown in drawing, (Refer to Timing Point 1). 2) Insert the Pin A,B,C,D into the Slider Cam hole, 3) Be sure to align dot of Assy Lever Load T and dot of Gear Loading Drive , (Refer to Timing Point 2). 4) Aline dot of Gear Loading drive with mark of Slider Cam as shown in drawing(Refer to Timing Point 3). TIMING POINT 1 LEVER LOAD T LEVER LOAD S
HOOK(A) SLIDE CAM
GEAR LOADING DRIVE ASS'Y LEVER LOAD T ASS'Y LEVER LOAD S
TIMING POINT 2 TIMING POINT 3
Fig. 4-21 Gear Loading Drive, Slider Cam, Assy Lever T, S Load Removal
PIN A
PIN D PIN B PIN C SLIDER CAM
Fig.4-22 Gear Loading Drive, Slider Cam, Assy Lever Load S, T Assembly
Samsung Electronics
4-11
4-4-11 Lever Pinch Drive, Lever Tension Drive Removal

1) Remove the Lever Pinch Drive , Lever Tension Drive . LEVER PINCH DRIVE LEVER TENSION DRIVE
4-4-12 Assy Lever Tension , Assy Band Brake Removal

1) Remove the Ass'y Lever Brake S (Refer to Fig 4-25). 2) Remove the Spring Tension Lever . 3) Rotate stopper of Main Base in the direction of arrow A. 4) Lift the Ass'y Lever Tension & Ass'y Band brake . Note : 1) When replacing the Ass'y Lever Tension , be sure to apply Grease on the post, 2) Take care not to touch stain on the felt side, and not to be folder and broken Ass'yBand brake. 3) After Ass'y Lever Tension seated, Rotate stopper of Main Base to the Mark[B].
ASS`Y BAND BRAKE Fig. 4-23 Lever Pinch Drive, Lever Tension Drive Removal ASS`Y LEVER TENTION SPRING TENTION LEVER STOPPER "A" MARK[B]
Fig. 4-24 Assy Lever Tension , Assy Band Brake Removal
4-12
Samsung Electronics
4-4-13 Assy Lever Brake S, T Removal

1) Release the Hook [A] and the Hook [B], [C] in the direction of arrow as shown in Fig 4-25. 2) Lift the Ass'y Lever S, T Brake , with spring brake . Assembly : 1)Assembly the Ass'y Lever S Brake on the Main Base. 2)Assembly the Ass'y Lever T Brake with spring brake .
4-4-14 Assy Gear Idle Removal

1) Push the Lever Idle in the direction of arrow A, B. 2) Lift the Lever Idle . Assembly : 1) Apply oil in two Bosses of Lever Idle . 2) Assemble the Gear Idle with the Lever Idle . Note : When replacing the Gear Idle , be sure to add oil in the boss of Lever Idle .
Note : Take extreme care not to be folded and transformed Spring Brake at removing or reinstalling. GEAR IDLE HOOK(A)
"A" LEVER IDLE "B" HOOK "C" GEAR IDLE
SPRING BRAKE ASS'Y LEVER S BRAKE HOOK(C) HOOK(B) ASS`Y LEVER T BRAKE
Fig. 4-26 Assy Gear Idle Removal
Fig. 4-25 Assy Lever Brake S, T Removal
Samsung Electronics
4-13
4-4-15 Disk S, T Reel Removal

1) Lift the Disk S, T Reel , . REEL S
4-4-16 Assy Holder Clutch Removal

1) Remove the Washer Slit . 2) Lift the Assy Holder Clutch . Note : When you reinstall Ass'yHolder Clutch. 1) Check the condition of spring as shown in detail A. 2) Don't push Ass'y Holder Clutch down with excessive force Just insert Holder Clutch Ass'y into post center with dead force and Rotate it smoothly. Be sure to confirm that spring is in the slit of Ass'y Gear Center as shown in detail B. WASHER SLIT ASS`Y CLUTCH
REEL T
Fig. 4-27 Disk S, T Reel Removal
DETAIL A
DETAIL B
Fig. 4-28 Assy Holder Clutch Removal
4-14
Samsung Electronics
4-4-17 Assy Lever Up Down, Assy Gear Center Removal

1) Remove the 2 hooks in the direction of arrow as shown Fig. 4-28 and lift the Assy Lever Up Down . 2) Lift the Assy Gear Center . Assembly : 1) Insert the Ass'y Lever Up Down in the rectangular holes on Main Base as shown in Fig 4-30. 2) Lift the Lever Ass'y Up Down about 35. (Refer to Fig 4-30) 3) Insert Ring of the Ass'y Gear Center in the Guide of the Ass'y Lever Up Down . 4) Insert the Ass'y Gear Center in the post on Main Base. 5) Push down the Ass'y Lever Up Down for locking of the Hook. Note : 1) Take care not to separate and sentence does not mark sense. 2) Be sure to confirm that Ring of the Ass'y Gear Center is in the Guide of the Ass'y Lever Up Down after finishing assembly of Ass'y Lever Up Down and Ass'y Gear Center . ASS`Y LEVER UP DOWN ASS`Y GEAR CENTER
4-4-18 Guide Cassette Door Removal

1) Lift the Hook [A]. 2) Rotate the Guide Cassette Door in the direction of arrow. Note : After reinstalling the Guide Cassette Door sure the Hook [A].
GUIDE CASSETTE DOOR
HOOK [A]
Fig. 4-31 Guide Cassette Door Removal
Fig.4-29 Assy Lever Up Down Removal

ASS'Y GEAR CENTER GUIDE ASS'Y LEVER UP DOWN RING GEAR POST
HOOK
35
MAIN BASE
Fig. 4-30 Assy Lever Up Down Removal Samsung Electronics 4-15
4-4-19 Assy Lever Unit Pinch , Plate Joint, Spring Pinch Drive Removal
1) Lift the Assy Unit Pinch . 2) Remove the Plate Joint from Lever Pinch Drive. 3) Remove the Spring Pinch Drive . Note : 1) Take extreme care not to touch the grease on the Roller Pinch. 2) When reinstalling, be sure to apply grease on the post pinch roller. ASS`Y LEVER UNIT PINCH
4-4-20 Assy Lever #9 Guide Removal

1) Remove the Spring #9 Guide . 2) Lift the Assy Spring #9 Guide in the direction of arrow A. Note : 1) Take extreme care not to get grease on the tape Guide Post. 2) After reinstalling, check the bottom side of the Post #9 Guide to the top side of Main Base. "A" SPRING #9 GUIDE ASS`Y LEVER #9 GUIDE
PLATE JOINT SPRING PINCH DRIVE "B"
Fig. 4-33 Assy Lever #9 Guide Removal
Fig. 4-32 Assy Lever Unit Pinch , Plate Joint, Spring Pinch Drive Removal
4-16
Samsung Electronics
4-4-21 FE Head Removal

1) Remove the Screw . 2) Lift the FE Head .
4-4-22 Assy AC Head Removal

1) Pull out the FPC from connector of Assy AC Head . 2) Remove the screw . 3) Lift the Assy AC Head . SCREW
FE HEAD
ASS`Y HEAD AC
Fig. 4-34 FE Head Removal
Fig. 4-35 Assh AC Head Removal
Samsung Electronics
4-17
4-4-23 Assy Slider S, T Removal

1) Move the Assy Slider S, T , to slot, and then lift it to remove. (Refer to arrow)
4-4-24 Plate Ground Deck, Assy Cylinder Removal

1) Remove the 3 Screws . 2) Lift the Plate Ground Deck . 3) Lift the Assy Cylinder . Assembly : 1) Match the 3 holes in the bottom of Ass'y Cylinder to the 3 holes of Main Base as attending not to drop or knock the Ass'y Cylinder . 2) Tighten the 1 Screw . 3) Match the Plate Ground Deck to the Hole of Base Main. 4) Tighten the other 2 Screws .
ASS`Y SLIDER S ASS`Y SLIDER T
Note : 1) Take care not to touch the Ass'y Cylinder and the tape guide post at reinstalling. 2) When reinstalling, Don't push down too much on Screw Driver. 3 SCREWS Fig. 4-36 Assy Slider S, T Removal PLATE GROUND DECK
ASS'Y CYLINDER
Fig. 4-37 Plate Ground Deck, Assy Cylinder Removal
4-18
Samsung Electronics
2-4-25 Hook Capstan, Belt Pulley Removal

1) Remove the Hook Capstan after realeasing Hook in the direction arrow as shown in detail drawing. 2) Remove the Belt Pulley . Note : Take extreme care not to get grease on Belt Pulley at assembling or reassembling.
4-4-26 Assy Motor Capstan Removal

1) Remove the 3 Screws . 2) Remove the Assy Motor Capstan . Assembly : 1) Match the 3 holes of Assy Motor Capstan to the 3 holes of Main Base. Be careful not to drop or knock the Ass'y Motor Capstan . 2) Tighten the 3 Screws in the direction of arrow as shown detail drawing. Note : After tightening screws, check if there is gap between the head of screws and the top side of Main Base. There should have no gap between the head of screws and the top side of Main Base. After reinstalling, adjusting the tape transport system again.
HOOK BELT PULLEY
HOOK CAPSTAN
3 SCREWS
Fig. 2-38 Belt Pulley Removal
ASS'Y MOTOR CAPSTAN
Fig. 4-39 Assy Motor Capstan Removal
Samsung Electronics
4-19
4-4-27 Assy Post #8 Guide Removal

1) Rotate the Assy Post #8 Guide in the direction of arrow to lift up.
4-4-29 How to Eject the Cassette Tape (If the tape is stuck in the unit)
1) Turn the Gear worm clockwise with screw driver. (Refer to arrow) (Other method : Remove the Screw of Ass'y Motor Load , Separate the Ass'yMotor Load )
ASS'Y POST #8 GUIDE
GEAR WORM Fig. 4-40 Assy Post #8 Guide Removal Fig.4-42
4-4-28 Assy Level Head Cleaner Removal (Optional)

1) Release the Hook . 2) Lift the Assy Lever Head Cleaner .
LEVER HEAD CLEANER ASS'Y
HOOK
2) When Slider S,T are approched in the position of unloading, rotate holder Clutch counterclockwise after inserting screw driver in the hole of frame's bottom in order to wind the unwinded tape. (Refer to Fig.4-43) (If you rotate Gear Worm continuously when tape is in state of unwinding, you may cause a tape contamination by grease and tape damage. Be sure to wind the unwinded tape in the state of set horizently.) 3) Rotate Gear Worm clockwise using screw driver again up to the state of eject mode and then pick out the tape.(Refer to Fig.4-42)
FRAME
Fig. 4-41 Assy Lever Head Cleaner Removal 4-20
Fig. 4-43 Samsung Electronics
4-5 The table of cleaning, Lubrication and replacement time about principal parts
1) The replacement time of parts is not life of parts. 2) The table 4-1 is that the VCR Set is in normal condition (normal temperature, normal humidity). The checking period may be changed owing to the condition of use, runtime and environmental conditions. 3) Life of the Cylinder Assy is depend on the condition of use. 4) See exploded view for location of each parts. <Table 4-1> * Parts Name POST TENSION SLANT POST S, T #8 GUIDE SHAFT CAPSTAN SHAFT #9 GUIDE POST #3 GUIDE POST GUIDE ROLLER S, T CYLINDER ASSY FE HEAD ACE HEAD PINCH ROLLER POST REEL S, T SLEEVE TENSION POST CENTER LEVER IDLE BOSS (2Point) CAPSTAN MOTOR PULLEY BELT PULLEY HOLDER CLUTCH ASSY GEAR CENTER ASSY GEAR IDLE (2Point) LOADING MOTOR BAND BRAKE ASSY BRAKE T ASSY : Cleaning Checking Period 500 1000 O O O O O O O O O 1500 O O O 2000 O O O O O O O O O O O O 2500 O O O O O 3000 O O O O O O O O O O O O O 3500 O O O O O 4000 O O O O O O O O O O O O O 4500 O O O O O 5000 O O O O O O O O O O O O O : Add Oil Remark - To clean the parts, use patch and alcohol (solvent). - After cleaning, use the video tape after alcohol is gone away completely. - We recommend to use oil [EP-50] or solvent. - One or two drops of oil should be applied after cleaning with alcohol. - Periodic time of applying oil (Apply oil after cleaning) - The excessive applying oil may be the cause of malfunction.
T A PE P A T H S Y S T E M
D R I V I N G
B R A K E
S Y S T E M
S Y S T E M
O O O O O O
O O O O O O O
O O O O O O O O
O O O O O O O O
O : Check and replacement in necessary
Samsung Electronics
4-21
4-6 DVD Deck

4-6-1 Holder Chuck Removal
1) Push 4 Hooks in the direction of arrow A and lift up the Holder Chuck . HOLDER CHUCK 2 HOOKS "A"
2 HOOKS "A"
Fig. 4-44 Holder Chuck Removal
4-22
Samsung Electronics
4-6-2 Tray Disc Removal

1) Insert a Screw Driver into Emergency Hole and push the Slider Housing in the direction arrow A. 2) When the Tray Disc comes out a little, pull it in the direction arrow B by hand.
SLIDER HOUSING
TRAY DISC "B" "A" EMERGENCY HOLE SCREW DRIVER
Fig.4-45 Tray Disc Removal
Samsung Electronics
4-23
4-6-3 Assy P/U Deck Removal

1) Remove the 4 Soldering (SL+, SL-, SP+, SP-). 2) Remove the 1 Screw and lift up the Assy P/U Deck
1 SCREW
ASS'Y P/U DECK CHASSIS SUB <Assembly Point>
4 SOLDERING
SP + (RED) SP - (BLK) SL - (BLK) SL + (RED) TM - (BLK) TM + (BLK)
Fig. 4-46 Assy P/U Deck Removal
4-24
Samsung Electronics
4-6-4 Assy Housing Removal

1) Remove the 2 Soldering . (TM+, TM-) 2) Push the 2 Hooks in the direction of arrow A and remove Assy PCB Deck . 3) Push the Slider Housing in the direction arrow B. 4) Push the 1 Hook in the direction of arrow C and lift up the Slider Housing . 5) Remove the Belt Pulley and 2 Screws , Assy Motor Load . 6) Push the 1 Hook in the direction of arrow D and lift up the Gear Pulley , Gear Tray . SLIDER HOUSING "B"
BELT PULLEY GEAR TRAY GEAR PULLEY 2 SCREWS
1 HOOK
"D"
"C" 2 HOOKS ASS'Y MOTOR LOAD 1 HOOK
"A" "A" ASS'Y PCB DECK 2 SOLDERING Fig 4-47 Assy Housing Removal
Samsung Electronics
4-25
4-6-5 Assy Bracket Deck Removal

1) Push the Hook in the direction of arrow A and lift up the Gear Feed B . 2) Push the Hook in the direction of arrow B and lift up the Gear Feed B . 3) Remove the 2 Screws and lift up Motor Feed Assy . 4) Remove the 2 Screws and lift down Motor Spindl Assy . 5) Remove the 3 Screws and remove 3 Holder Cam Skew , Shaft Pick Up , Assy Pick Up . 6) Remove the 1 Screws and remove Gear Back Lash .
3 SCREWS
3 HOLDER CAM SKEW ASS'Y PICK UP
SHAFT PICK UP
GEAR BACK LASH 2 SCREWS
MOTOR FEED ASS'Y 2 SCREWS "B"
HOOK
2 SCREWS "A" CHASSIS SUB GEAR FEED A GEAR FEED B MOTOR SPINDLE
HOOK
Fig. 4-48 Assy Bracket Deck Removal
4-26
Samsung Electronics
5. Troubleshooting
No Power Detected (stand by LED OFF)
F1SD01 is normal?
No
Change fuse
Yes
D1SS11, D1SR10, D1SS11 SHORT and OPEN are normal? Yes
No
Change short circuited or opened parts
Is there voltage at Collector of Q1SD11 Yes
No
Check 2'st Voltage and ZD1SS1
Operation of Q1SD11 is normal? Yes
No
Replace Q1SD11
Check feedback Q1SD11
Samsung Electronics
5-1
Troubleshooting
Key Operation or Remote Control Error
Is the measurement of power with in normal value? is the SMPS to Main connector properly connected? Yes
No
Check power and front connector
IC601-38Pin 14.318MHz oscillation is normal? Yes
No
Check the circuity around the clock
Check the circuity around IC601 reset? Yes
No
Check the circuity around IC601 reset
Check the soldering around IC601 good? Yes
No
Check the soldering around the IC601
Key operatious such as STOP,PLAY,OPEN are normal? Yes
No
Check the circuity around the swich. check the condition of commmunication with Main Micom (IC601,4,6,14,15,16,PRQ, SRQ, SCLK DATA-IN, DATA-OUT) Yes
End repairs
STOP,PLAY,OPEN Key operatious are normal? Yes
Change IC701
5-2
Samsung Electronics
Troubleshooting
Play Mode Inoperative
(VCR Section)
Ee-video Yes Insert the casette tape recorded by anothe VCR and press play button
No
See (Video Missing In EE Mode)
Play indicator in the display Yes
No
Press play key in remote control Yes
No
Check IC601, RFSC1, CFSC1
Check timer
Mechanism operation Yes
No
See (Mechanism Does Not Operate In Play Mode)
PB-Video
No
See video missing in play mode
Yes
See (PB Video) audio missing in play mode
Samsung Electronics
5-3
Troubleshooting
Mechanism Doesn't Operate In Play Mode
(VCR Section)
Turn VCR power on Yes Load a tape and press play button
Tape loading operation Yes
No
(Load) IC601-59 : High IC601-60 : Low Yes
No
Check SW604 IC601
Check CN604 pin 8 12V
Cylinder rotation Yes
No
Check cylinder
SW 25hz IC601-23 Yes
No
CYL FG.PG IC601-65
5-4
Samsung Electronics
Troubleshooting
Capstan rotation Yes
No
See (Capstan does not rotate)
(S.T Reel) IC601-1, 2 Pulse
DC
Take up reel sensor supply reel sensor (PT601.PT602)
Prog.sw state IC601- 62, 63, 64 Yes
Stop Mode
Check Loading Motor Mechanism or SW603
Change IC601
Samsung Electronics
5-5
Troubleshooting
Record Mode Doesn't Operate
(VCR Section)
Play operation Yes
No
See (Play mode doesn't operate)
Load VCR with a blank tape and press record button
REC mode
No
Safety tab Yes
No
Change tape
Yes
Change SW602
D-REC A (H) IC601-30 Yes
No
Check IC601
REC-Video Yes
No
See (video missing in record mode)
See (Audio missing in record mode)
5-6
Samsung Electronics
Troubleshooting
Fast Forward Doesn't Operate
(VCR Section)
Load tape and press F.FWD button
F.FWD indicator in the display Yes
No
Press FF key in remote control Yes
No
Change IC601
Check timer
Check CN604 2pin 15V? 4pin 5V? 5.9pin 3.2V? Yes
No
Check Power Block
CHECK CN604 5.9pin 3.2V Yes
No
Check IC601
IC601 68pin FG pulse Yes
No
Check capstan motor
Check mechanism
Samsung Electronics
5-7
Troubleshooting
Fwd Search Doesn't Operate
(VCR Section)
Play operation Yes Press F.FWD for forward search
No
See (play doesn't operate)
Is capstan speed changed? Yes
No
Change deck
No
Search operation Yes
No
Change IC601
END
Noise bar locking Yes
No
(Control pulse) IC601-76 Yes
No
Adjust A/CE head
Check IC601
Check capstan motor
5-8
Samsung Electronics
Troubleshooting
Cassette Loading Mechanism Does Not Operate
(VCR Section)
Turn the VCR power on and insert a tape
Tape detected Yes
No
Casset sen (IC601-71) : High (5V) Yes
No
Check SW604 IC601
CN604 8pin 12V? Press eject button Yes
No
Check DM B+ line
IC601-59 : High(5V) IC601-58 : Low(0V) Yes Check cassett loading mechanism
No
Change IC601
IC601-59 : Low(0V) IC601-58 : High(5V) Yes
No
Change IC601
Samsung Electronics
5-9
Troubleshooting
Video Missing In EE Mode
(VCR Section)
Place VCR in stop mode
LINE 2 INPUT
IC301-26 video out Yes
No
IC301-53,54 VIDEO DATA/ CLOCK Yes
No
Check IC601
Change IC301
IC601-49, 50 video in Yes
No
IC601-50 SYNC IN Yes
No
Check R638, C626, C622
Check OSD picture IC802-E video out Yes No
Check IC801, Q801
Check line out and C832, R806, R812
5-10
Samsung Electronics
Troubleshooting
Video Missing In Record Mode
(VCR Section)
IC301-21pin VIDEO signal out? Yes
No
E-E mode and IC301-26pin Check VIDEO signal out
IC301-22pin VIDEO signal out? Yes
No
Check C305
IC301-14pin Check REC FM signal? Yes
No
Check IC301-23pin Power 5Vp-p
IC301-70pin REC FM signal in? Yes
No
Check IC301-68pin Power 5Vp-p and R320
IC301-73pin (SP) IC301-66pin (SLP) Check REC FM signal? Yes
No
Check drum wafen and VIDEO head
No defect record mode
Samsung Electronics
5-11
Troubleshooting
Video Missing In Play Mode
(VCR Section)
Video EE mode operation Yes
No
SEE PAGE 6-6 (VIDEO MISSING IN EE MODE)
Place the VCR play Mode
Video FM IC301-14 Yes
No
H'D SW IC301-57 Yes
No
Check IC601-23
Check Video head Video IC301-22 Yes No Check C305
Video IC301-26 No
Yes
Video IC601-49, 47 No
Yes
Video IC801-2 No
Yes
Check video Out line
Change IC301
Check IC601
Check IC801
5-12
Samsung Electronics
Troubleshooting
Color Missing In Record Mode
(VCR Section)
NOTE: XT301 - Always (3.579545MHz)
(Video in) Record mode Yes
No
See page 6-6 (Video missing in record mode)
Color signal IC301-46 Yes
No
Check XT301 Yes Change IC301
No
Change XT301
Color killer IC301 60 (2V) Yes
No
Check the REC line
Change IC301
Samsung Electronics
5-13
Troubleshooting
Color Missing In Play Mode
(VCR Section)
NOTE: XT301 - Always (3.579545MHz)
FM-ENV IC301-14 Yes
No
See page 6-7 (Video missing in play mode)
Color-monitor IC301-46 Yes
No
Color-killer IC30166 (2V) No
Yes
Color rotery IC301-57 Check IC301-26 Yes Check IC301-48,51 XT301
No
Check IC601
Change IC301
5-14
Samsung Electronics
Troubleshooting
OSD Picture Missing
(VCR Section)
Check IC601-37, 38pin 14.318MHz signal out Yes
No
Check RFSC1, CFSC1
Check IC601-52,53pin AFC signal out Yes
No
Check C626, R639
Change IC601
Samsung Electronics
5-15
Troubleshooting
Blue Missing In Stop Mode
(VCR Section)
Select line mode without input signal
Show Weak channel no in channel setup of OSP setup Yes
No
Set the show weak channels to "NO"
Check IC601-37, 38pin 14.318MHz out Yes
No
Check RFSC1, CFSC1
Check IC601-52, 53pin AFC signal Yes
No
Check C626, R639
Check IC601-50pin SYNK signal Yes
No
Check C622, R638
Change IC601
5-16
Samsung Electronics
Troubleshooting
Audio Missing In EE Mode
(VCR Section)
VCR stop mode
Input choice mode TUNER
L1/L2
IC501-7, 9, 69, 71 pin audio signal input YES
No
Check R505,R513 R523,R525
Check C528
No
IC501-57pin audio signal input Yes
Check IC601
No
Check IC501-37,38 pin Yes
Change IC501
No
IC501-78, 80 pin audio signal Yes
Check C543, C544 L516, R517
Samsung Electronics
5-17
Troubleshooting
Audio Missing In REC Mode
(VCR Section)
Check audio missing in EE mode
Missing audio
MONO
MONO
HIFI
IC501-78, 80 audio signal Yes
No
Change IC501
IC501-26 audio FM Yes
No
Check C511, R506 change IC501
Check cylinder
5-18
Samsung Electronics
Troubleshooting
MONO
Check audio missing in PB mode
No
Check PB mode
IC301-76 audio signal Yes
No
IC501-4 audio signal Yes Change IC501
No
Check C502, R526, R527
No
Check IC301-58, 59 and change IC301
IC301-9 audio fm signal Yes
No
Change IC301
IC301-7 MIX signal (audio+70khz) Yes
No
Check R331
No
IC301-53,54 Check (CLOCK, DATA)
Q304 oscillation Yes
No
Check Q304, Q305, C354
Check A/CE head
Samsung Electronics
5-19
Troubleshooting
Audio Missing In PB Mode
(VCR Section)
Check "audio missing in EE mode"
Place the VCR in pb mode
MONO
Audio select
HIFI
IC501-24, 27 audio FM(mixed) Yes Change IC501
No
Check IC501-29 (A.H D SW) change cylinder or IC501
No
Check ACE head C353, C348, R332 and change IC301
Check C349, R333 or Change IC301
5-20
Samsung Electronics
Troubleshooting
No Servo Lock
(VCR Section)
Play
IC601-68 C-FG Yes
No
Check CN604-1
IC601-76 CTL pulse Yes
No
Check CTL pulse AC level (SP. SLP: over 1vp-p) Yes
No
Check A/CE head
Change IC601
Samsung Electronics
5-21
Troubleshooting
Capstan Does Not Rotate
(VCR Section)
CN604-2 15V Yes
No
Check B + in the power block
CN604-3 AL 5V Yes
No
Check 5V at AL5V line in the power block
Place the VCR in play mode
CN604-9 3.2V Yes
No
IC601-35 output(PWM) Yes Check R607
No
Change IC601
CN604-5 2.6V No Check capstan motor
No
CN601-33 output(PWM) Yes
No
Check IC601
Check R615, C606, R671
5-22
Samsung Electronics
Troubleshooting
Drum Does Not Rotate
(VCR Section)
CN604-6 12V Yes
No
Check 12V at PC12V line in the power block
CN604-3 5V Yes
No
Check 5V line
CN604-12 2.5V Yes
No
IC601-34 PWM out Yes
No
Change IC601
Check cylinder motor
Check R631, R617, R618, C609, C610
Samsung Electronics
5-23
Troubleshooting
No focus incoming
FE in U3-128 is within specified range? (1.7V) Yes
No
Check U3 and A, B, C, D input (2.6V).
Check open state from CN2 (M/D) to pick-up (A, B, C, D).
5-24
Samsung Electronics
Troubleshooting
No pick-up home positing
U3 (SLED-PWM) output is normal? (1.7V) Yes
No
Check U3.
SLED+, SLEDU5-13,14 output are normal? (2.7V) Yes
No
Check U5.
U13-175
Check the Sled Motor and connection.
Samsung Electronics
5-25
Troubleshooting
NO LD CD ON
U3-157 is 5V?
No
Check U3.
Yes
Divide RQ2 emitter terminal voltage and 3.3V real voltage difference into 4.7ohm. Yes
Current exceeds 0.1A?
No
Open check in related circuit.
Yes
LD out pick-up replace.
5-26
Samsung Electronics
Troubleshooting
No Search Operation
MIRR, U3-142 output is normal? (3.2V) Yes
No
U3-163 output level is normal?
No
Yes
Check pick-up.
Check U3 peripheral circuit.
Actual velocity occurs at U3-176 terminal? Yes
No
Actual velocity occurs at U5-15,16 terminal?
No
Yes
U3-170 TE occurs in search range? (TE Error level 1.7V) Yes
No
Focus On? (U3-128)
No
See "Fine Seek Check"
Samsung Electronics
5-27
Troubleshooting
FINE SEEK Check
FINE SEEK MIRR signal (U3-163) is missing? (3.2V) No
Yes
Check U3 Peripheral curcuit.
Track incomming is delayed? Yes
No
Time out due to many jump counts.
TE is within 2V ? (U3-170) Yes
No
U3-173 output is normal? (1.7V) Yes
Pick-up transfer smooth.
No
U5-26, 25 (T+, T-) terminal outputs are normal? (2.7V) Yes
No
Yes Check Deck.
Check CN2 and pick-up.
5-28
Samsung Electronics
Troubleshooting
Abnormal rotation of disc motor
U3-144
Input of RF SUM signal is normal? (U3-144 Vpp 1V) Yes
U3-176 SPD output is normal? (Vpp 1.25V) Yes
No
U5-15, 16 (SP+, SP-) output is normal? (2~3V) Yes
No
Check U5 soldering and power.
U3-176
Check or replace disc motor.
Samsung Electronics
5-29
Troubleshooting
No Tray open/close
U3-91 (1.65V) Open ; "L > 1.65V" Close ; "H < 1.65V" Yes
No
Check U5-17, 18 output at OPEN/CLOSE. (3V L,H) Yes
No
Check signal line state from U5-17, 18 to tray motor.
5-30
Samsung Electronics
Troubleshooting
CD/VCD/DVD L/R output error (Mixed Audio output)
Normal DATA 0 is input in U11-2? (Vpp 3.3V) Yes
No
Check U3-99 output.
Analog output of U11-7, 8(Vout) is normal? (Vpp 500mV) Yes
No
Check U3-100 (CD/VCD ; 16.9344MHz, DVD ; 18.432MHz)
U11-1, 3 output is normal? Yes
No
Check JACK1 peripheral soldering shot.
Samsung Electronics
5-31
Troubleshooting
S-Video output error
(DVD Section)
Did the screen select with the s-video Yes
No
Change a screen set
VIC1-28, 31 output is normal? Yes
No
Check the cincuit of U3, VIC1
S-JACK output is normal? Yes
No
Check the connection between VIC1 and S-JACK
Check the connection of s-video cable
5-32
Samsung Electronics
Troubleshooting
Y/Pr/Pb output error
(DVD Section)
Did the screen select with the component Yes
No
Change a sceen set
VIC1-21, 23, 24pin output is normal? Yes
No
Check the circuit U3 and VIC1
JACK1 output level is normal? Yes
No
Check the connection between VIC1 and JACK1
Check the connection component cable
Samsung Electronics
5-33
Troubleshooting
CVBS output error
Pin of VDDP in U3 has normal level? Yes 27MHz clock input is normal at pin 112 in U3? Yes Analog output is normal at pin 80,82 in U3? Yes Analog signals are inputted normally VIC1-6.8? Yes Power is normal at VIC1-1, 34? Yes Pin 5 in VIC1 is in high stste? Yes Peak to peak voltage level of VIC1-33? Yes Peak to peak voltage level of IC801-2 Yes Video signal of about 1V appears at output jack? Yes Check the RCA cable.
No
Check the connection CN4.
No
Check ZY1.
No
Check the soldering of U3.
No
Check the connection between pin 68 in U3 and VIC1.
No
Check the connection betwen VIC1-1 and CN4
No
Check the connection between CN4 and pin 1 in VIC1.
No
Check the soldering of VIC1.
No
Check the IC801.
No
Check the connection between VIC1 and output jack.
5-34
Samsung Electronics
6. Exploded View and Parts List
6-1 Cabinet Assembly (DVD-V5600) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-2 6-2 Cabinet Assembly (DVD-V6600) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-4 6-3 VCR Mechanical Parts (Top Side) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-6 6-4 VCR Mechanical Parts (Bottom Side) - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-8 6-5 DVD Mechanical Parts - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-10
Samsung Electronics
6-1
6-2 P025 W200

(M3 *8 Y)
Exploded View and Parts List
BRACKET-FRAME (S.N.A.)
(M3 x 8 Y)
W200 W001 W200

(M3 x 8 Y) (M3 x 10 B)
P003
W202 P002
(M3 x 12 Y)
W202
6-1 Cabinet Assembly (DVD-V5600)
(M3 x 12 Y)
DVD DECK (S.N.A.)
(M4 x 12 Y)
W252 P001
C015
P005
A001
VCR DECK (S.N.A.)
ASSY FRAME (S.N.A) C002 C011 C022 C012 C003
Samsung Electronics
C001
Loc. No A001 C001 C002 C003 C011 C012 C015 C022 P001 P002 P003 P005 P025 W001 W200 W202 W252
Parts No. AK59-00052C AK97-01486B AK64-01575A AK64-01574B AK64-00551A AC61-62032A AK64-00895A AK64-01582A AK92-00841B AK92-00842B AK92-00934A AK92-00843C AC39-10200A 6003-000275 6003-001375 6003-000277 AC60-12126A
Description ; Specification REMOCON-ASSY;DVD-V9600/XAA,SEC,197 ASSY-PANEL FRONT;HIPS94V2,DVD-V560 DOOR-TRAY;DVD-V5600,ABS94HB,T2.35, DOOR-CASSETTE;DVD-V5600,ABS94HB,T2 DOOR-SPRING;04-SNYCOM,SUS304,T0.32 SPRING ETC-MASK;SV-C130,SUS,4.4,-, CABINET-TOP;DVD-V4600C,PCM,T0.525, DOOR-FRONT;DVD-V5600,HIPS 94HB,T2. ASSY PCB-MAIN VCR;DVD-V5600/XAX,MI ASSY PCB-MAIN DVD;DVD-V5600/XAX,MI ASSY PCB-SMPS;DVD-V5600/XAX,SMPS F ASSY PCB-FUNCTION;DVD-V5650/XAA,MI CBF-POWER CORD;AT,-,EP2/N,HOUING(2 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC( SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL SCREW-TAPTITE;BH,+,B,M3,L12,ZPC(YE SCREW-MACHINE;TH,+,-,M4,L12,ZPC(YE
Q ty S.N.A 1 1 1 1 1 1 1 1 1 1 1 1 1 2 7 5 4 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SC
Remark
Samsung Electronics
6-3
6-4 P025 W200

(M3 *8 Y)
BRACKET-FRAME (S.N.A.)
(M3 x 8 Y)
W200 W001 W200

(M3 x 8 Y) (M3 x 10 B)
P003
W202 P002
(M3 x 12 Y)
W202
6-2 Cabinet Assembly (DVD-V6600)
(M3 x 12 Y)
DVD DECK (S.N.A.)
(M4 x 12 Y)
W252 P001
C015
P005
A001
VCR DECK (S.N.A.)
ASSY FRAME (S.N.A) C002 C011 C012 C022
Samsung Electronics
C001
Loc. No A001 C001 C002 C011 C012 C015 C022 P001 P002 P003 P005 P025 W001 W200 W202 W252
Parts No. AK59-00052C AK97-01497B AK64-01575B AK64-00334A AC61-62032A AK64-00895B AK64-01612A AK92-00841B AK92-00842B AK92-00934A AK92-00843C AC39-10200A 6003-000275 6003-001375 6003-000277 AC60-12126A
Description ; Specification REMOCON-ASSY;DVD-V9600/XAA,SEC,197 ASSY-PANEL FRONT;HIPS94HB,DVD-V660 DOOR-TRAY;SV-C470,ABS94HB,T2.35,H2 DOOR-SPRING;DVD-V3500,SWPB,,,,-,, SPRING ETC-MASK;SV-C130,SUS,4.4,-, CABINET-TOP;DVD-V4600C,PCM,T0.525, DOOR-FRONT;DVD-V6600,HIPS 94HB,T2. ASSY PCB-MAIN VCR;DVD-V5600/XAX,MI ASSY PCB-MAIN DVD;DVD-V5600/XAX,MI ASSY PCB-SMPS;DVD-V5600/XAX,SMPS F ASSY PCB-FUNCTION;DVD-V5650/XAA,MI CBF-POWER CORD;AT,-,EP2/N,HOUING(2 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC( SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL SCREW-TAPTITE;BH,+,B,M3,L12,ZPC(YE SCREW-MACHINE;TH,+,-,M4,L12,ZPC(YE
Q ty S.N.A 1 1 1 1 1 1 1 1 1 1 1 1 2 7 5 4 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SC
Remark
Samsung Electronics
6-5
6-3 VCR Mechanical Parts (Top Side)
T001
T072 T073 T074 T013 T009 T015 T008 W016 T010 T025 T023 T024 T057 T006 T071 T007 (Optional)
T003 T019 T021 T026 T027 T075 T022 T028 T011 W015 T020 T002 T028 W201 T004 T005 T029
6-6
Samsung Electronics
Loc. No T001 T002 T003 T004 T005 T006 T007 T008 T009 T010 T011 T013 T015 T019 T020 T021 T022 T023 T024 T025 T026 T027 T028 T029 T057 T071 T072 T073 T074 T075 W015 W016 W201
Parts No. AC97-02624A AC61-00391A AC31-00018A AC66-00101A AC66-00102A AC61-00105A AC61-00390A AC97-02570A AC97-02556A AC97-02625A AC66-00094A AC33-00018A AC97-02620A AC66-00124A AC66-00123A AC66-00115A AC66-00114A AC97-02562A AC61-00107A AC97-02560A AC97-02567A AC97-02568A AC61-00106A AC66-00104A AC61-00386A AC61-00388A AC97-02622A AC61-00397A AC97-02564A AC66-00108A 6006-001092 6006-001154 6001-001711
Description ; Specification ASSY-CYLINDER;6NSJ/6NJ,CX13A-MIRIO PLATE-GROUND DECK;X-13,SPTE,T0.3,MOTOR-LOADING ASSY;-,SCORPIO2(TS-1 GEAR-WORM WHEEL;X-13,POM(M90-44 EQ GEAR-FL CAM;X-13,POM(M90-44 EQU),SPRING ETC-PINCH DRIVE;TS-10,SUS30 PLATE-JOINT;X-13,SECC 20/20,T0.8,ASSY-SLIDER SUPPLY;(PPS),X-13,ASSY-SLIDER TAKE UP;-,X-13,ASSY-HEAD A/C;-,X-13A,LEVER-9 GUIDE;X-13,PPS,-,-,-,-,BRO HEAD-FULL ERASE;-,-,X-13,-,ASSY-UNIT PINCH;-,X-13A,REEL-S;X-13,POM,-,BLK,2.5,-,27,REEL-T;X-13,POM,-,BLK,2.5,-,36.5,LEVER-IDLE;X-13,POM,T15,W38,L25,-, GEAR-IDLE;X-13,PET,0.5,54,27,NAT,2 ASSY-LEVER TENSION;-,X-13,SPRING ETC-TENSION LEVER;TS-10,SUS ASSY-BAND BRAKE;-,X-13,ASSY-LEVER BRAKE S;-,X-13,ASSY-LEVER BRAKE T;-,X-13,SPRING ETC-BRAKE;TS-10,SUS304-WPB, SLIDER-FL DRIVE;X-13,SECC,T1.0,W15 SLEEVE-TENSION;X-13,-,-,2.5,-,-,-, GUIDE-CASS DOOR;X-13,POM(M90-44 EQ ASSY-HOLDER CASSETTE;SECC+POM+SUS, SPRING ETC-LOCK;X-13,SWP-B,0.25,2. ASSY-LEVER ARM;-,X-13,LEVER-DOOR;X-13,POM,-,W30,L75,-,NA SCREW-MACHINE;WS,PH,+,M3.0,L6.0,ZP SCREW-TAPTITE;WSP,PH,+,M2.6,L5.6,Z SCREW-MACHINE;PH,+,M3,L3.3,ZPC(YEL
Q ty S.N.A 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 2 1 1 1 1 1 1 1 3 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Remark
Samsung Electronics
6-7
6-4 VCR Mechanical Parts (Bottom Side)
T046
W018 T036 T034 T037 T035 T044 T043 T042 T041 T038 T039
T049 T076
T050 T048
T040
W019
6-8
Samsung Electronics
Loc. No T034 T035 T036 T037 T038 T039 T040 T041 T042 T043 T044 T046 T048 T049 T050 T076 W018 W019
Parts No. AC66-00103A AC66-00077A AC61-00389A AC66-00092A AC66-00099A AC70-00003A AC66-00100A AC66-00078A AC97-02557A AC97-02558A 3101-001430 AC66-60051A AC97-02566A AC60-30306A AC66-00111A AC97-02569A 6003-001450 6003-000108
Description ; Specification GEAR-JOINT 1;X-13,POM(M90-44 EQU), GEAR-JOINT 2;X-11,POM(K300),-,-,-, BRACKET-GEAR;X-13,SECC 20/20,T0.8, SLIDER-CAM;X-13,SECC 20/20,T1.2,-, LEVER-PINCH DRIVE;X-13,SECC 20/20, HOOK-CAPSTAN;-,-,L10,W10,H10,POM(M LEVER-TENSION DRIVE;X-13,SECC 20/2 GEAR-LOADING DRIVE;X-11,POM(K300), ASSY-LEVER LOADING S;-,X-13,ASSY-LEVER LOADING T;-,X-13,MOTOR-CAPSTAN;-,-,12V,90mA BELT-PULLEY;-,5CM-70,2 * 2,-,71.3, ASSY-GEAR CENTER;-,X-13,FASTENER-WASHER SLIT;-,-,ID2.1,OD5 LEVER-UP DOWN;X-13,POM,T15,E25,L55 ASSY-CLUTCH;-,X-13,SCREW-TAPTITE;PH,+,S,M2.6,L5,ZPC(Y SCREW-TAPTITE;BH,+,B,M2.6,L6,ZPC(Y
Q ty S.N.A 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Remark
Samsung Electronics
6-9
6-5 DVD Mechanical Parts

W212 H213
H212 H102 W012 H241
H206 H211 H203 W273 W274 H210 W010 H202 H214
W274 H204 H105 H205 H107 H207 H106 H103 W011
H108
H104 H109
6-10
Samsung Electronics
Loc. No H102 H103 H104 H105 H106 H107 H108 H109 H202 H203 H204 H205 H206 H207 H210 H211 H212 H213 H214 H241 W010 W011 W012 W212 W273 W274
Parts No. AK61-00360A AK66-00042A AK97-00608A 6602-001076 AK66-00041A AK66-00045A AK63-00101D AK92-00328A AK73-00005B AH61-50327A AK66-00043A AK66-00044A AK61-00363A AK31-00017A AK31-00005A AK97-01453A AK61-00359A AK61-00357A AK66-00057A AK41-00250A 6003-001157 6001-001370 6002-001086 6003-001251 6003-000233 6001-001730
Description ; Specification BODY CLAMPER-DISC;DP-16,POM,T0.7,GEAR-PULLEY;DP-15,POM,-,-,-,WHT,-, ASSY-MOTOR LOAD;-,DP-15,BELT-RECTANGULAR;CR,T1.2,4.3%,1.2X GEAR-TRAY;DP-15,POM,-,-,-,WHT,-,-, SLIDER HOUSING;DP-15,POM,-,W17.8,L TRAY-DISC;DP-16,ABS,-,W120,L186.3, ASSY PCB-DECK;DP-15,RUBBER-INSULATOR;DP-15,BUTYL,12, SHAFT-P/U;DP-3,SUS,L84.7,OD3,-,-,GEAR-FEED A;DP-15,POM,-,-,-,-,-,-, GEAR-FEED B;DP-15,POM,-,-,-,-,-,-, HOLDER-CAM SKEW;DP-16,POM,-,-,-,BL MOTOR DC-SPINDLE;RF300FA-12350,DPMOTOR-FEED ASSY;-,DP-9,-,-,-,-,-,ASSY-PICK UP;-,DP-19,LD VE HOLDER-CHUCK;DP-16,POM,T3,W140,L96 SPRING ETC-CLAMPER;-,SUS304CSP,-,GEAR-BACKLASH;DP-16,POM,0.5,-,-,WH FFC-PU;DP-17,-,-,23P,-,1mm SCREW-TAPTITE;PWH,+,B,M2,L6,ZPC(YE SCREW-MACHINE;CH,+,M1.7,L3.0,ZPC(Y SCREW-TAPPING;PH,+,B,M1.7,L5.0,ZPC SCREW-TAPTITE;CH,+,-,B,M1.7,L3,ZPC SCREW-TAPTITE;PH,+,-,B,M2,L6,ZPC(B SCREW-MACHINE;BH,+,-,M1.7,L2.5,ZPC
Q ty S.N.A 1 1 1 1 1 1 1 1 1 2 1 1 3 1 1 1 1 1 1 1 1 2 3 1 1 4 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Remark
Samsung Electronics
6-11
MEMO
6-12
Samsung Electronics
7. Electrical Parts List

Loc.No Part No P001 AC14 AC21 AC23 AC24 AC25 AC26 AC27 AC9 AD1 AD2 AE11 AE12 AE13 AE14 AE3 AE5 AIC4 AQ1 AQ2 AQ3 AQ4 AQ5 AQ6 AR14 AR15 AR16 AR17 AR28 AR29 AR30 AR31 AR41 AR42 AR43 AR44 AR45 AR46 AR47 AR48 AR49 AR50 A-SUB C1P101 C1P102 C1P103 C1P104 C1P107 C1P108 C1P110 AK92-00841B 2203-001607 2203-000315 2203-000125 2203-005148 2203-000315 2203-000125 2203-005148 2203-001607 0407-000123 0407-000123 2401-000918 2401-003107 2401-000918 2401-003107 2401-000918 2401-000918 1201-000163 0504-000128 0504-000156 0501-000341 0504-000128 0504-000156 0501-000341 2007-000090 2007-000074 2001-000281 2001-000429 2007-000090 2007-000074 2001-000281 2007-000078 2007-000090 2007-000078 2007-000092 2007-000097 2007-000097 2007-000090 2007-000078 2007-000092 2001-000786 2007-000097 AK97-01643Y 2401-001479 2401-001249 2401-001730 2401-000598 2401-002075 2401-003107 2401-003107 Description ; Specification ASSY PCB-MAIN VCR;DVD-V5600/XAX,MI C-CER,CHIP;0.22nF,5%,50V,NP0,1608 C-CER,CHIP;0.12nF,5%,50V,C0G,1608 C-CER,CHIP;1.2nF,10%,50V,X7R,TP,16 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.12nF,5%,50V,C0G,1608 C-CER,CHIP;1.2nF,10%,50V,X7R,TP,16 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 DIODE-ARRAY;DAN202K,80V,100mA,CA2DIODE-ARRAY;DAN202K,80V,100mA,CA2C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-AL;22uF,20%,16V,GP,-,6.3x7,5 IC-OP AMP;4560,SOP,8P,173MIL,DUAL, TR-DIGITAL;-,NPN,200MW,22K/22K,SOT TR-DIGITAL;KSR2103,PNP,200MW,22K/2 TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-DIGITAL;-,NPN,200MW,22K/22K,SOT TR-DIGITAL;KSR2103,PNP,200MW,22K/2 TR-SMALL SIGNAL;KSC1623-L,NPN,200m R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;47Kohm,5%,1/10W,TP,1608 ASSY-SUB MATERIAL;-,DVD-V5600,V865 C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-AL;4.7uF,20%,35V,GP,TP,4x5,2.5 C-AL;10UF,20%,50V,GP,TP,5X11,5 C-AL;1uF,20%,50V,GP,TP,4x7,5 C-AL;4.7uF,20%,50V,GP,TP,5x11,5 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-AL;10uF,20%,16V,GP,TP,4x7,5 Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SA SA SA SA SA SA Loc.No Part No C1P112 C1P114 C1P116 C1P117 C1P118 C1SS16 C1SS19 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310 C311 C312 C313 C314 C315 C316 C317 C318 C319 C320 C321 C322 C323 C324 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334 C335 C336 C337 C338 C340 C342 C343 C344 C345 C346 2401-001250 2401-001730 2401-003107 2203-000257 2401-001249 2401-002095 2401-001126 2203-005065 2203-006243 2203-005065 2203-000405 2203-005065 2203-005148 2401-001502 2401-000909 2401-000408 2203-005065 2401-000408 2203-000257 2401-000408 2203-005065 2203-005065 2203-005065 2203-005065 2202-000797 2202-000797 2203-000257 2401-001502 2203-005148 2203-005065 2203-000257 2203-005065 2203-002398 2203-005065 2401-001502 2203-000257 2203-000975 2203-000975 2203-000975 2203-000975 2401-001502 2203-005148 2203-005065 2401-001502 2203-000257 2401-000918 2401-001169 2203-005148 2203-001587 2203-000257 2401-000414 Description ; Specification C-AL;4.7uF,20%,35V,GP,TP,4x5,5 C-AL;10UF,20%,50V,GP,TP,5X11,5 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;4.7uF,20%,35V,GP,TP,4x5,2.5 C-AL;47uF,20%,25V,GP,TP,6.3x5,5 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;0.36nF,10%,50V,X7R,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;0.18nF,5%,50V,C0G,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-AL;22uF,20%,16V,GP,TP,5x5,2.5 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;22nF,10%,50V,X7R,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;47nF,10%,25V,X7R,TP,160 C-CER,CHIP;47nF,10%,25V,X7R,TP,160 C-CER,CHIP;47nF,10%,25V,X7R,TP,160 C-CER,CHIP;47nF,10%,25V,X7R,TP,160 C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-AL;33uF,20%,16V,GP,-,6.3x7,5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;18nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;10uF,20%,16V,GP,TP,4x7,5 Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
C1P111 2401-000414
Samsung Electronics
This Document can not be used without Samsungs authorization
7-1
Electrical Parts List
Loc.No Part No C347 C348 C349 C350 C351 C352 C353 C354 C355 C356 C357 C358 C359 C360 C371 C372 C401 C402 C403 C405 C406 C407 C408 C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C528 C529 C530 C531 C532 2203-000491 2203-001052 2401-001250 2203-001103 2203-001211 2203-000257 2401-001250 2203-002041 2301-000110 2401-003221 2301-000016 2203-000257 2203-000257 2203-000257 2203-001071 2203-005148 2203-005148 2203-005148 2203-005148 2401-001479 2203-000257 2203-002398 2401-001730 2203-001724 2203-005148 2401-000408 2203-005065 2401-000909 2401-000408 2203-001724 2203-000257 2401-000909 2203-000888 2203-000257 2203-000257 2203-001724 2401-000408 2203-000257 2401-000909 2203-000888 2203-000257 2203-001724 2401-000408 2203-005065 2202-000797 2203-005065 2203-005065 2203-001634 2401-001249 2203-005065 2203-005065 2203-005065 2203-005065 2401-001502 2203-000257
Description ; Specification C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-CER,CHIP;0.56nF,10%,50V,X7R,TP,1 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 C-CER,CHIP;6.8nF,10%,50V,X7R,1608 C-CER,CHIP;8.2nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 C-CER,CHIP;0.47nF,10%,50V,X7R,1608 C-FILM,LEAD-PEF;1.8nF,5%,100V,TP,7 C-AL;100uF,20%,16V,GP,TP,8X5,2.5 C-FILM,LEAD-PEF;22nF,5%,100V,TP,7. C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;0.056nF,5%,50V,C0G,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;22nF,10%,50V,X7R,1608 C-AL;10UF,20%,50V,GP,TP,5X11,5 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-AL;22uF,20%,16V,GP,TP,5x5,2.5 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;22uF,20%,16V,GP,TP,5x5,2.5 C-CER,CHIP;4.7nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;22uF,20%,16V,GP,TP,5x5,2.5 C-CER,CHIP;4.7nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;33nF,10%,50V,X7R,1608 C-AL;4.7uF,20%,35V,GP,TP,4x5,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Loc.No Part No C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C543 C544 C545 C546 C547 C548 C549 C550 C551 C603 C604 C605 C606 C607 C608 C609 C610 C611 C613 C614 C615 C616 C617 C620 C621 C622 C623 C624 C625 C626 C627 C628 C629 C630 C631 C632 C633 C634 C635 C636 C637 C643 C644 C653 2203-005065 2203-005065 2203-005148 2203-001724 2401-000918 2203-001724 2401-000918 2203-001724 2401-001250 2203-005065 2203-001724 2203-001724 2203-000257 2401-001775 2401-002419 2203-005065 2203-005065 2203-005065 2203-000257 2203-000257 2203-000257 2401-000360 2203-000257 2203-000257 2401-002165 2203-002398 2203-000975 2203-000783 2401-003107 2203-000257 2203-000257 2203-005148 2401-001502 2203-000681 2203-000626 2203-005065 2203-000236 2401-002165 2202-000797 2203-005148 2203-001697 2401-001168 2203-005221 2401-001502 2203-000257 2203-001071 2203-000140 2203-001071 2203-000257 2202-000797 2203-000257 2203-000257 2203-000257 2203-000257
Description ; Specification C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-AL;4.7uF,20%,35V,GP,TP,4x5,5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-CER,CHIP;4700nF,+80-20%,16V,Y5V, C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;470nF,20%,50V,GP,TP,4x7,5 C-AL;0.47uF,20%,50V,GP,TP,4x7,2.5 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;100uF,20%,50V,GP,TP,8x11.5,5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-CER,CHIP;22nF,10%,50V,X7R,1608 C-CER,CHIP;47nF,10%,25V,X7R,TP,160 C-CER,CHIP;0.33nF,5%,50V,C0G,1608 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.022nF,5%,50V,C0G,1608 C-CER,CHIP;1000nF,+80-20%,10V,Y5V, C-CER,CHIP;0.1nF,5%,50V,C0G,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.082nF,5%,50V,NP0,1608 C-AL;33uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;15nF,10%,50V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;0.056nF,5%,50V,C0G,1608 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 C-CER,CHIP;0.056nF,5%,50V,C0G,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
7-2
Samsung Electronics
Loc.No Part No C657 C6B01 C701 C702 C703 C704 C801 C802 C803 C804 C811 C812 C815 C829 C831 C832 CFSC1 CN101 CN102 CN301 CN302 CN303 CN701 D1P103 D1P105 D1P107 D1P108 D301 D601 D603 D604 D605 D606 D607 D701 D702 D703 D704 D706 D801 DOC3 DOC4 DOIC2 DOL1 DOL2 DOR1 DOR2 DOR3 DT701 FL042 GP601 IC301 IC501 IC601 2203-000257 2401-002259 2203-000440 2203-000257 2401-002165 2401-001992 2401-003107 2401-000408 2401-000408 2203-000257 2203-000440 2203-000257 2401-001479 2203-000491 2203-000491 2401-003107 2202-000797 3711-005565 3711-001246 3708-000391 AC37-00028A 3708-001165 3711-004013 0401-000101 0401-000101 0401-000101 0401-000101 0402-000127 0401-000101 0402-000127 0402-000127 0401-000101 0402-000127 0402-000127 0401-000101 0401-000101 0401-000101 0401-000101 0401-000005 0401-000101 2203-005148 2203-005148 3707-001065 2901-001125 3301-001419 2007-000402 2007-000402 2001-000515 AK07-00052A 3809-001206 AC63-00043A 1204-001952 1204-002222 AK09-00098A
Description ; Specification C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;100000uF,+80-20%,5.5V,-,TP,12 C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-AL;2200UF,20%,10V,WT,TP,10X20MM, C-AL;47uF,20%,16V,GP,TP,5x7,5 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-AL;10uF,20%,16V,GP,TP,3.5x5,2.5 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y HEADER-BOARD TO BOARD;NOWALL,24P,1 HEADER-BOARD TO BOARD;NOWALL,12P,1 CONNECTOR-FPC/FFC/PIC;10P,1.25mm,S CONNECTOR-SOCKET;-,X-11,T9.0,W8.5, CONNECTOR-FPC/FFC/PIC;6P,1.25MM,ST HEADER-BOARD TO CABLE;3WALL,10P,1R DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-RECTIFIER;1N4002,100V,1A,DODIODE-SWITCHING;1N4148,75V,150mA,D DIODE-RECTIFIER;1N4002,100V,1A,DODIODE-RECTIFIER;1N4002,100V,1A,DODIODE-SWITCHING;1N4148,75V,150mA,D DIODE-RECTIFIER;1N4002,100V,1A,DODIODE-RECTIFIER;1N4002,100V,1A,DODIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-SWITCHING;1N4148,75V,150mA,D C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 CONNECTOR-OPTICAL;PLUG,GP1FA550TZ, FILTER-EMI ON BOARD;50V,0.5A,-,220 BEAD-SMD;220ohm,1608,TP,133ohm/70M R-CHIP;150ohm,5%,1/10W,TP,1608 R-CHIP;150ohm,5%,1/10W,TP,1608 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X LED DISPLAY;BCD-9044A,MIDAS,40,9,4 CABLE-FLAT;30V,80C,140MM,6P,1.25MM SHIELD CASE-GROUND PCB;SV-643F,STP IC-VIDEO PROCESS;LA71207,QFP,80P,1 IC-SIGNAL PROCESSOR;LA72670M-MPB,Q IC MICOM;MN101D10G-CG,DVD-V8650,10 IC-EEPROM;S524A40X41,512x8Bit,DIP,
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SA SA
Loc.No Part No IC6B1 IC801 J505 J506 J507 J904 J905 JACK1 JFSC2 JK801 L1P101 L1P103 L1SS04 L302 L303 L304 L305 L306 L307 L308 L501 L502 L601 L602 L603 L604 L701 L803 P022 PIC3 PT601 PT602 Q1P101 Q1P102 Q1P103 Q1P104 Q1P105 Q1P106 Q1P107 Q1P110 Q302 Q303 Q304 Q305 Q306 Q307 Q308 Q601 Q701 Q702 Q703 Q704 Q705 Q708 AC14-12009W 1204-001927 2007-000070 2007-000033 2007-000070 2007-000070 2007-000070 3722-002302 2007-000070 3722-002301 2701-000002 2701-000002 AC27-12001N 3301-000297 3301-000297 3301-000297 AC27-92001M 2702-000120 2701-000002 2702-000166 3301-000297 3301-000297 2702-000108 2701-000002 2701-000002 3301-000297 2701-000002 2701-000002 AC37-00027A 1203-003216 0604-001141 0604-001141 0501-000362 0504-000142 0501-000341 0501-000362 0501-000362 0501-000362 0501-000362 0501-000362 0501-000002 0501-000341 0501-000002 0501-000442 0501-000002 0501-000442 0501-000442 0504-000129 0501-000290 0501-000290 0501-000290 0501-000290 0501-000290 0501-000341
Description ; Specification IC-RESET;PST572K,TO-92,R59-1766 2. IC-AUDIO PROCESSOR;MM1501,SOT,6P,R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/4W,TP,3216 R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 JACK-PIN;6P,Ni,WH-GN/RD-BU/BK-RD,A R-CHIP;0ohm,5%,1/10W,TP,1608 JACK-PIN;6P,Ni,YL/WH/RDx2,ANGLE INDUCTOR-AXIAL;100UH,10%,4298 INDUCTOR-AXIAL;100UH,10%,4298 COIL CHOKE;10UH-15%,RA,K-30,Q80,15 BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RAD INDUCTOR-RADIAL;15000uH,5%,6.2x7.4 INDUCTOR-AXIAL;100UH,10%,4298 INDUCTOR-RADIAL;47uH,5%,6.0x6.4mm BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T INDUCTOR-RADIAL;100uH,5%,6.0x6.4mm INDUCTOR-AXIAL;100UH,10%,4298 INDUCTOR-AXIAL;100UH,10%,4298 BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,T INDUCTOR-AXIAL;100UH,10%,4298 INDUCTOR-AXIAL;100UH,10%,4298 CONNECTOR-HEADER;20045WS,X-11,T8.5 IC-POSI.FIXED REG.;G9133,TO-220F,4 PHOTO-INTERRUPTER;-,-,0mW,SNAP,TP PHOTO-INTERRUPTER;-,-,0mW,SNAP,TP TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-DIGITAL;FJN4301R,PNP,300MW,4.7K TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-SMALL SIGNAL;KSC2328A-Y,NPN,100 TR-SMALL SIGNAL;KSA812,PNP,150MW,S TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSA812,PNP,150MW,S TR-SMALL SIGNAL;KTC3203-Y,NPN,400m TR-SMALL SIGNAL;KSA812,PNP,150MW,S TR-SMALL SIGNAL;KTC3203-Y,NPN,400m TR-SMALL SIGNAL;KTC3203-Y,NPN,400m TR-DIGITAL;KSR1104,NPN,200mW,47K/4 TR-SMALL SIGNAL;KSA643-Y,PNP,500mW TR-SMALL SIGNAL;KSA643-Y,PNP,500mW TR-SMALL SIGNAL;KSA643-Y,PNP,500mW TR-SMALL SIGNAL;KSA643-Y,PNP,500mW TR-SMALL SIGNAL;KSA643-Y,PNP,500mW TR-SMALL SIGNAL;KSC1623-L,NPN,200m
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SC SA SA SA SA SA SC SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
IC603 1103-001330
Samsung Electronics
7-3
Loc.No Part No Q709 Q710 Q711 Q712 Q713 Q714 Q715 Q801 QFSC1 R1P101 R1P102 R1P103 R1P104 R1P108 R1P109 R1P111 R301 R302 R303 R304 R305 R306 R308 R309 R310 R311 R312 R313 R314 R315 R316 R317 R318 R319 R320 R322 R326 R327 R328 R329 R330 R331 R332 R333 R334 R335 R336 R338 R339 R340 R341 R342 R343 R344 R345 0501-000341 0501-000341 0501-000341 0501-000341 0501-000341 0501-000341 0501-000341 0501-000002 2007-000070 2001-000855 2001-000008 2001-000362 2007-000124 2001-000062 2001-000062 2001-000062 2007-000092 2007-001056 2007-000079 2007-000079 2001-000734 2001-000362 2007-000106 2007-000105 2007-000124 2007-001114 2007-000122 2001-000258 2007-000123 2007-001179 2001-000290 2001-000387 2001-000387 2001-000290 2007-000079 2007-000082 2007-000122 2007-000070 2007-000127 2007-000133 2007-000402 2007-000129 2007-000078 2001-000221 2007-000094 2007-000097 2007-000090 2007-000074 2007-000124 2007-000124 2001-000522 2007-000090 2007-001002 2007-001002 2001-000429
Description ; Specification TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSA812,PNP,150MW,S R-CHIP;0ohm,5%,1/10W,TP,1608 R-CARBON;560OHM,5%,1/4W,AA,TP,2.4X R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X R-CHIP;2.2Kohm,5%,1/10W,TP,1608 R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CHIP;6.2Kohm,5%,1/10W,TP,1608 R-CHIP;1.8Kohm,5%,1/10W,TP,1608 R-CHIP;1.8Kohm,5%,1/10W,TP,1608 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X R-CHIP;220Kohm,5%,1/10W,TP,1608 R-CHIP;200Kohm,5%,1/10W,TP,1608 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 R-CHIP;680Kohm,5%,1/10W,TP,1608 R-CHIP;1.2Kohm,5%,1/10W,TP,1608 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8 R-CHIP;1.5Kohm,5%,1/10W,TP,1608 R-CHIP;8.2Kohm,5%,1/10W,TP,1608 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;16Kohm,5%,1/8W,AA,TP,1.8x R-CARBON;16Kohm,5%,1/8W,AA,TP,1.8x R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;1.8Kohm,5%,1/10W,TP,1608 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 R-CHIP;1.2Kohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;9.1Kohm,5%,1/10W,TP,1608 R-CHIP;330Kohm,5%,1/10W,TP,1608 R-CHIP;150ohm,5%,1/10W,TP,1608 R-CHIP;27Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8 R-CHIP;22Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 R-CARBON;22KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;510ohm,5%,1/10W,TP,1608 R-CHIP;510ohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
Loc.No Part No R346 R348 R3D05 R3D06 R401 R402 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R512 R513 R514 R515 R516 R517 R518 R523 R524 R525 R526 R527 R528 R601 R602 R603 R604 R606 R609 R610 R611 R613 R614 R615 R616 R617 R618 R619 R621 R622 R623 R624 R630 R631 R632 R633 R634 R637 R638 2007-000078 2007-000086 2007-000124 2001-000800 2007-000121 2007-000121 2007-000090 2007-000088 2007-000092 2007-000097 2001-000786 2007-000077 2007-000081 2007-000130 2001-000780 2001-000780 2007-000088 2001-000786 2001-000786 2007-000092 2007-000078 2007-000078 2007-000084 2007-000088 2001-000786 2001-000786 2007-000088 2007-000091 2007-000805 2001-000522 2001-000034 2007-000094 2001-000034 2001-000522 2001-000429 2001-000290 2001-000472 2001-000290 2001-000429 2007-000086 2001-000429 2007-000122 2007-000098 2001-000290 2007-000077 2007-000077 2007-000084 2007-000084 2007-000098 2007-000098 2007-000097 2007-000106 2007-000070 2007-000096 2007-000082
Description ; Specification R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;5.6Kohm,5%,1/10W,TP,1608 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 R-CARBON;5.1KOHM,5%,1/8W,AA,TP,1.8 R-CHIP;820ohm,5%,1/10W,TP,1608 R-CHIP;820ohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;7.5Kohm,5%,1/10W,TP,1608 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;470ohm,5%,1/10W,TP,1608 R-CHIP;2.7Kohm,5%,1/10W,TP,1608 R-CHIP;39Kohm,5%,1/10W,TP,1608 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X R-CHIP;7.5Kohm,5%,1/10W,TP,1608 R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;7.5Kohm,5%,1/10W,TP,1608 R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;7.5Kohm,5%,1/10W,TP,1608 R-CHIP;12Kohm,5%,1/10W,TP,1608 R-CHIP;36Kohm,5%,1/10W,TP,1608 R-CARBON;22KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;220OHM,5%,1/4W,AA,TP,2.4X R-CHIP;22Kohm,5%,1/10W,TP,1608 R-CARBON;220OHM,5%,1/4W,AA,TP,2.4X R-CARBON;22KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;2.7KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;5.6Kohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;1.2Kohm,5%,1/10W,TP,1608 R-CHIP;56Kohm,5%,1/10W,TP,1608 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;470ohm,5%,1/10W,TP,1608 R-CHIP;470ohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;56Kohm,5%,1/10W,TP,1608 R-CHIP;56Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CHIP;220Kohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;30Kohm,5%,1/10W,TP,1608 R-CHIP;3.3Kohm,5%,1/10W,TP,1608
7-4
Samsung Electronics
Loc.No Part No R639 R641 R643 R644 R645 R646 R647 R648 R649 R650 R651 R652 R653 R656 R660 R661 R662 R664 R666 R667 R668 R669 R670 R671 R677 R690 R691 R692 R694 R695 R6A01 R701 R702 R703 R704 R705 R706 R707 R708 R711 R712 R713 R714 R715 R716 R717 R718 R719 R720 R721 R722 R723 R724 R728 R729 2007-000081 2001-000290 2007-000090 2007-000090 2007-000090 2007-000086 2007-000076 2007-000076 2007-000084 2007-000084 2007-000084 2007-000090 2001-000429 2001-000290 2007-000100 2007-000078 2001-000290 2001-000429 2001-000281 2001-000281 2001-000429 2007-000074 2007-000074 2007-000074 2001-000429 2001-000429 2001-000429 2001-000429 2007-000078 2001-000449 2007-000090 2001-000429 2001-000290 2001-000429 2007-000092 2001-000429 2007-000092 2001-000429 2001-000290 2007-000090 2001-000449 2001-000449 2001-000449 2001-000449 2001-000449 2001-000290 2001-000290 2001-000290 2001-000290 2001-000290 2001-000290 2001-000290 2001-000290 2007-001166 2007-001166
Description ; Specification R-CHIP;2.7Kohm,5%,1/10W,TP,1608 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;5.6Kohm,5%,1/10W,TP,1608 R-CHIP;330ohm,5%,1/10W,TP,1608 R-CHIP;330ohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;68Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012
Loc.No Part No R730 R731 R732 R733 R734 R735 R801 R802 R804 R806 R808 R810 R811 R812 RFSC1 RM702 SJACK SW602 SW603 SW604 SW704 SW705 SW706 SW707 SW709 SW713 SW714 SW715 SW716 SW717 2007-001166 2007-001166 2007-001166 2007-001166 2007-001166 2007-001166 2001-000429 2001-000429 2001-000969 2007-000078 2007-000070 2007-000097 2007-000097 2001-000111 2007-000079 0609-001198 3722-001375 AC34-00006B AC34-00005A 3409-001165 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182 3404-001182
Description ; Specification R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012 R-CHIP;75ohm,5%,1/8W,TP,2012 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CHIP;47Kohm,5%,1/10W,TP,1608 R-CARBON;150OHM,5%,1/4W,AA,TP,2.4X R-CHIP;1.8Kohm,5%,1/10W,TP,1608 MODULE REMOCON;VERTICAL,19MM,TR JACK-DIN;4P,NI,BLK,ANGLE SWITCH-REC;LSA-1135-9,push,-,16,16 SWITCH MODE;-,-,-,-,-,-,-,-,-,-,-, SWITCH-DETECTOR;5V,1mA,-,50gf,ON-O SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 TM BLOCK;VHA35ASE,NTSC,181CH,-,25d GROUND-PLATE REAR;DVD-V5500,SUS,T0 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-AL;22uF,20%,16V,GP,-,6.3x7,5 C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-AL;330uF,20%,6.3V,GP,TP,8x5mm,5 C-AL;330uF,20%,6.3V,GP,TP,8x5mm,5 C-AL;330uF,20%,6.3V,GP,TP,8x5mm,5 IC-VIDEO PROCESS;LA73054,-,36P,-,S R-CHIP;0ohm,5%,1/10W,TP,1608 BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M R-CHIP;75ohm,1%,1/10W,TP,1608 R-CHIP;75ohm,1%,1/10W,TP,1608 R-CHIP;75ohm,1%,1/10W,TP,1608
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
TM401 AK40-00013A TM401B AK63-00234A VC10 2203-005148 VC11 2203-005148 VC13 2203-001607 VC17 VC18 VC50 VC6 VC7 VC8 VC9 VE1 VE2 VE4 VE5 VE6 VE7 VIC1 VJ3 VL1 VL2 VR30 VR31 VR32 2203-005148 2203-001607 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2401-002165 2401-000918 2401-001479 2401-003037 2401-003037 2401-003037 1204-001978 2007-000070 3301-001419 3301-001419 2007-001164 2007-001164 2007-001164
Samsung Electronics
7-5
Loc.No Part No VR33 VR34 W196 XT301 XT602 ZD1P02 ZD1P04 ZD1P05 ZD1P06 ZD401 2007-001164 2007-001164 2001-000568 2801-003399 2801-003318 0403-001211 0403-000717 0403-000720 0403-000717 0403-000390
Description ; Specification R-CHIP;75ohm,1%,1/10W,TP,1608 R-CHIP;75ohm,1%,1/10W,TP,1608 R-CARBON;27OHM,5%,1/8W,AA,TP,1.8X3 CRYSTAL-UNIT;3.579545MHz,15ppm,28CRYSTAL-UNIT;32.768KHz,20ppm,28-AA DIODE-ZENER;MTZJ12B,11.8-12.3V,500 DIODE-ZENER;MTZJ5.1B,4.94-5.2V,500 DIODE-ZENER;MTZJ9.1B,8.57-9.01V,50 DIODE-ZENER;MTZJ5.1B,4.94-5.2V,500 DIODE-ZENER;UZP33B,31.4-34.6V,1000
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SC SC SC SA
Loc.No Part No PE15 PE3 PE80 PE9 PL3 PL4 PL6 Q1 Q2 Q3 R19 R6 RC1 RC2 RC3 RC4 RC5 RC6 RC7 RC8 RC9 RD1 RE1 RE2 RL15 RL4 RQ1 RQ2 RR1 RR10 RR11 RR12 RR13 RR14 RR2 RR3 RR4 RR5 RR6 RR7 RR8 RR9 U1 U12 U2 U3 U4 U5 U7 VC1 VC2 VC3 VC4 VC5 2401-003036 2401-001479 2401-001479 2401-003036 2703-000398 2007-000033 3301-001419 0501-000341 0501-000341 0501-000341 2007-000070 2007-000070 2203-005148 2203-005148 2401-003107 2203-005148 2401-002165 2203-005148 2203-005148 2203-001634 2401-002165 0407-000116 2401-002042 2401-002042 3301-001419 3301-001419 0501-000279 0501-000279 2007-000090 2007-000078 2007-000881 2007-000881 2007-000090 2007-000905 2007-000075 2007-000090 2007-000090 2007-000090 2007-000134 2007-000075 2007-000075 2007-000100 1107-001369 1203-003806 1103-001133 1204-002556 1105-001397 1003-001735 0801-002701 2203-000681 2203-000681 2203-000681 2203-000681 2203-000681
Description ; Specification C-AL;100uF,20%,16V,GP,TP,5X11mm,5m C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-AL;470uF,20%,10V,GP,TP,6.3*11mm, C-AL;100uF,20%,16V,GP,TP,5X11mm,5m INDUCTOR-SMD;10uH,10%,3225 R-CHIP;0ohm,5%,1/4W,TP,3216 BEAD-SMD;220ohm,1608,TP,133ohm/70M TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m TR-SMALL SIGNAL;KSC1623-L,NPN,200m R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;0ohm,5%,1/10W,TP,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;33nF,10%,50V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 DIODE-ARRAY;DAP202K,80V,100mA,CK2C-AL;220uF,20%,10V,GP,TP,6.3x11,5 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M TR-SMALL SIGNAL;KSA1182-Y,PNP,150m TR-SMALL SIGNAL;KSA1182-Y,PNP,150m R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;1Kohm,5%,1/10W,TP,1608 R-CHIP;4.7ohm,5%,1/8W,TP,2012 R-CHIP;4.7ohm,5%,1/8W,TP,2012 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;430ohm,5%,1/10W,TP,1608 R-CHIP;220ohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;33Kohm,5%,1/10W,TP,1608 R-CHIP;220ohm,5%,1/10W,TP,1608 R-CHIP;220ohm,5%,1/10W,TP,1608 R-CHIP;68Kohm,5%,1/10W,TP,1608 IC-FLASH MEMORY;29LV800,8Mbit,1Mx8 IC-POSI.ADJUST REG.;KIA78R000,DPAK IC-EEPROM;24C020,256x8,SOP,8P,5.13 IC-DECODER;S5L5010,LQFP,216P,24x24 IC-DRAM;K4S641632,-,64Mbit,1Mx16x4 IC-MOTOR DRIVER;FAN8026G3,SSOPH,28 IC-CMOS LOGIC;74VHCT125A,BUFFER,TS C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SA SA SNA SA SA SA SA SA SA SA SA
P002 AC201 AC202 AE201 AE202 AIC8 AL101 C102 C50 CN2 CN3 CN4 FC10 FC11 FC3 FC4 FC7 FC8 FC9 FR1 FR10 FR12 FR13 FR14 FR15 FR16 FR17 FR18 FR19 FR2 FR20 FR21 FR22 FR3 FR4 FR5 FR7 FR8 FR9 PC11 PC13 PC15 PC80 PC9
AK92-00842B 2203-005148 2203-005148 2401-003036 2401-002165 1002-001395 3301-001419 2007-000070 2203-005148 3708-000491 3708-001266 3710-002050 2401-002165 2203-005148 2203-000140 2203-000491 2401-003107 2203-005148 2203-005148 2007-000082 2007-000134 2007-000090 2007-000088 2007-000091 2007-000093 2007-000090 2007-000431 2007-000092 2007-000431 2007-000091 2007-000458 2007-000090 2007-000091 2007-000082 2007-000084 2007-000091 2007-000090 2007-000102 2007-000134 2203-005148 2203-005148 2203-005148 2203-005148 2401-001479
ASSY PCB-MAIN DVD;DVD-V5600/XAX,MI C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,5X11mm,5m C-AL;100uF,20%,16V,GP,TP,6.3x7,5 IC-D/A CONVERTER;PCM1753,24Bit,SSO BEAD-SMD;220ohm,1608,TP,133ohm/70M R-CHIP;0ohm,5%,1/10W,TP,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 CONNECTOR-FPC/FFC/PIC;23P,1mm,STRA CONNECTOR-FPC/FFC/PIC;11P,1MM,STRA SOCKET-BOARD TO BOARD;12P,1R,2mm,S C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-AL;47uF,20%,16V,GP,TP,5x7,5 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 R-CHIP;33Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;7.5Kohm,5%,1/10W,TP,1608 R-CHIP;12Kohm,5%,1/10W,TP,1608 R-CHIP;20Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;16Kohm,5%,1/10W,TP,1608 R-CHIP;15Kohm,5%,1/10W,TP,1608 R-CHIP;16Kohm,5%,1/10W,TP,1608 R-CHIP;12Kohm,5%,1/10W,TP,1608 R-CHIP;18Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;12Kohm,5%,1/10W,TP,1608 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;12Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;100Kohm,5%,1/10W,TP,1608 R-CHIP;33Kohm,5%,1/10W,TP,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
7-6
Samsung Electronics
Loc.No Part No VC6 VR1 VR10 VR11 VR12 VR2 VR3 VR4 VR5 VR6 VR7 VR8 VR9 ZC01 ZC02 ZC03 ZC04 ZC05 ZC06 ZC07 ZC08 ZC09 ZC10 ZC11 ZC14 ZC15 ZC16 ZC17 ZC18 ZC19 ZC20 ZC21 ZC22 ZC23 ZC24 ZC25 ZC26 ZC27 ZC28 ZC29 ZC30 ZC31 ZC32 ZC33 ZC34 ZC35 ZC36 ZC37 ZC38 ZC39 ZC40 ZC41 ZC42 ZC43 ZC44 2203-000257 2007-000074 2007-001167 2007-001167 2007-000082 2007-000074 2007-000074 2007-000074 2007-000074 2007-001157 2007-001167 2007-001167 2007-001167 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-001554 2203-005148 2203-001554 2203-005148 2203-001554 2203-005148 2203-005148 2203-000681 2203-000681 2203-006035 2203-000140 2203-001630 2203-000140 2203-005148 2203-005148 2203-005148 2203-000140 2203-000257 2203-000440 2203-000440 2203-000491 2203-000491 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148
Description ; Specification C-CER,CHIP;10nF,10%,50V,X7R,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;75ohm,5%,1/10W,TP,1608 R-CHIP;75ohm,5%,1/10W,TP,1608 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;750ohm,5%,1/10W,TP,1608 R-CHIP;75ohm,5%,1/10W,TP,1608 R-CHIP;75ohm,5%,1/10W,TP,1608 R-CHIP;75ohm,5%,1/10W,TP,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 C-CER,CHIP;220nF,+-10%,10V,X7R,160 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 C-CER,CHIP;330nF,+80-20%,16V,Y5V,1 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1.5nF,10%,50V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-CER,CHIP;2.2nF,10%,50V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608
Loc.No Part No ZC45 ZC46 ZC47 ZC48 ZC49 ZC50 ZC53 ZC54 ZC55 ZC56 ZC57 ZC58 ZC59 ZC60 ZC61 ZC62 ZC63 ZC65 ZC66 ZC67 ZC68 ZC69 ZC70 ZC71 ZC72 ZC73 ZE1 ZE2 ZL1 ZL3 ZL5 ZL6 ZR01 ZR02 ZR03 ZR04 ZR05 ZR06 ZR10 ZR11 ZR12 ZR13 ZR14 ZR43 ZR44 ZR45 ZR46 ZR47 ZR48 ZR50 ZR51 ZR52 ZR53 ZR65 2203-000236 2203-006035 2203-005148 2203-000257 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-005148 2203-000626 2203-005148 2203-000440 2203-005148 2203-000531 2401-002165 2401-002165 3301-001309 3301-001419 3301-001419 3301-001419 2007-000125 2007-000074 2007-000126 2007-000074 2007-000084 2007-000084 3301-001419 3301-001419 3301-001419 3301-001419 3301-001419 2007-000070 2007-000109 2007-000608 2007-000608 2007-000116 2007-000116 2007-000093 2007-000090 2007-000102 2007-000102 2007-000123
Description ; Specification C-CER,CHIP;0.1nF,5%,50V,C0G,1608 C-CER,CHIP;220nF,+-10%,10V,X7R,160 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;10nF,10%,50V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;0.022nF,5%,50V,C0G,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;100nF,10%,16V,X7R,1608 C-CER,CHIP;2.7nF,10%,50V,X7R,1608 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 BEAD-SMD;47ohm,1608,TP,-,BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M R-CHIP;3.9Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;4.3Kohm,5%,1/10W,TP,1608 R-CHIP;100ohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M BEAD-SMD;220ohm,1608,TP,133ohm/70M R-CHIP;0ohm,5%,1/10W,TP,1608 R-CHIP;1Mohm,5%,1/10W,TP,1608 R-CHIP;240ohm,5%,1/10W,TP,1608 R-CHIP;240ohm,5%,1/10W,TP,1608 R-CHIP;120ohm,5%,1/10W,TP,1608 R-CHIP;120ohm,5%,1/10W,TP,1608 R-CHIP;20Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;100Kohm,5%,1/10W,TP,1608 R-CHIP;100Kohm,5%,1/10W,TP,1608 R-CHIP;1.5Kohm,5%,1/10W,TP,1608
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Samsung Electronics
7-7
Loc.No Part No ZR66 ZR79 ZR80 ZR83 ZR88 ZR89 ZR94 ZR97 ZR98 ZY1 2007-000130 2007-000084 2007-000084 2007-000084 2007-000090 2007-000090 2007-000090 2007-000113 2007-000081 2801-003554
Description ; Specification R-CHIP;39Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;10Kohm,5%,1/10W,TP,1608 R-CHIP;33ohm,5%,1/10W,TP,1608 R-CHIP;2.7Kohm,5%,1/10W,TP,1608 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA
Loc.No Part No IC1SS1 0604-001028 IC1SS2 AC14-12006D L1SS01 AC27-92001Q L1SS02 L1SS03 PT1SD1 Q1SS01 R1SD01 R1SD06 R1SD11 R1SD13 R1SD14 R1SF05 R1SF06 R1SF07 R1SQ11 R1SR01 R1SR02 R1SR03 R1SS01 R1SS03 R1SS04 R1SS05 R1SS06 R1SS08 VA1SS1 W004 ZD1SS2 AC27-12001N AC27-12001N AC26-00012A 0505-001729 2001-000281 2001-000780 2006-000273 2006-000273 2001-000598 2001-000527 2001-000449 2003-000105 2001-000281 2001-000546 2001-000546 2001-000546 2006-000262 2001-000429 2004-000869 2004-000459 2001-000290 2001-000793 1405-001026 6003-000283 0403-001318
Description ; Specification PHOTO-COUPLER;TR,50-600%,250mW,DIP IC;KA431Z,TO-92,TAPING COIL-LINE FILTER;-,25MH,-,-,-,-,-, COIL CHOKE;10UH-15%,RA,K-30,Q80,15 COIL CHOKE;10UH-15%,RA,K-30,Q80,15 TRANS SWITCHING;EER3530,DIVA(EUROP FET-SILICON;SPA04N60C3,N,600V,4.5A R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6. R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6. R-CARBON;3.3OHM,5%,1/8W,AA,TP,1.8X R-CARBON;22OHM,5%,1/8W,AA,TP,1.8X3 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8 R-METAL OXIDE;0.33ohm,5%,2W,AD,TP, R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X R-CARBON;270KOHM,5%,1/4W,AA,TP,2.4 R-CARBON;270KOHM,5%,1/4W,AA,TP,2.4 R-CARBON;270KOHM,5%,1/4W,AA,TP,2.4 R-CEMENT;2.7ohm,10%,2W,CB,TP,7.5x1 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3. R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3 VARISTOR;470V,600A,9x7mm,TP SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL DIODE-ZENER;MTZJ4.3B,4.17-4.43V,50 DIODE-ZENER;MTZJ20B,18.63-17.7V,50
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
P003 BD1S01 BD1SS3 C1S03 C1SD02 C1SD11 C1SD12 C1SD13 C1SD16 C1SF02 C1SF04 C1SS01 C1SS04 C1SS06 C1SS07 C1SS08 C1SS10 C1SS11 C1SS12 C1SS15 C1SS17 C1SS18 CN103 CN1SS1 D1SF01 D1SF02 D1SS01 D1SS02 D1SS03 D1SS04 D1SS05 D1SS07 D1SS08 D1SS09 D1SS11 D1SS12 D1SS13 F1SS01 FC1SS1 FC1SS2
AK92-00934A AC27-92001M AC27-92001M 2201-001008 2301-001719 2401-003903 2305-001029 2305-001029 2201-000012 2401-002608 2401-000598 2301-001719 2201-001008 2401-002608 2401-001992 2401-001992 2401-001992 2301-000129 2401-000385 2401-001126 2401-001992 2401-001992 3710-002036 3711-000203 0401-000101 0402-001195 0402-001196 0402-001196 0402-001196 0402-001196 0402-001194 0404-001235 0404-001235 0402-001195 0402-000012 0402-001195 0402-001194 3601-001122 3602-000103 3602-000103
ASSY PCB-SMPS;DVD-V5600/XAX,SMPS F COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RAD COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RAD C-CERAMIC,DISC;3.3nF,20%,250V,Y5U, C-FILM,LEAD;100nF,10%,275V,TP,17.5 C-AL;82uF,20%,400V,-,BK,22x25mm,10 C-FILM,LEAD-PEF;10nF,10%,630V,TP,1 C-FILM,LEAD-PEF;10nF,10%,630V,TP,1 C-CERAMIC,DISC;0.22nF,10%,1000V,Y5 C-AL;33uF,20%,35V,GP,TP,5x11,5 C-AL;1uF,20%,50V,GP,TP,4x7,5 C-FILM,LEAD;100nF,10%,275V,TP,17.5 C-CERAMIC,DISC;3.3nF,20%,250V,Y5U, C-AL;33uF,20%,35V,GP,TP,5x11,5 C-AL;2200UF,20%,10V,WT,TP,10X20MM, C-AL;2200UF,20%,10V,WT,TP,10X20MM, C-AL;2200UF,20%,10V,WT,TP,10X20MM, C-FILM,LEAD-PEF;100nF,5%,50V,TP,10 C-AL;10uF,20%,100V,GP,TP,6.3x11,5 C-AL;330uF,20%,25V,WT,TP,10x12.5,5 C-AL;2200UF,20%,10V,WT,TP,10X20MM, C-AL;2200UF,20%,10V,WT,TP,10X20MM, SOCKET-BOARD TO BOARD;12P,1R,2.5mm HEADER-BOARD TO CABLE;1WALL,2P/3P, DIODE-SWITCHING;1N4148,75V,150mA,D DIODE-RECTIFIER;F1T4,400V,1A,DO-20 DIODE-RECTIFIER;1T5,600V,1A,TS-1,T DIODE-RECTIFIER;1T5,600V,1A,TS-1,T DIODE-RECTIFIER;1T5,600V,1A,TS-1,T DIODE-RECTIFIER;1T5,600V,1A,TS-1,T DIODE-RECTIFIER;SHG2D,200V,2A,-,TP DIODE-SCHOTTKY;SHK65-45R,60V,3000m DIODE-SCHOTTKY;SHK65-45R,60V,3000m DIODE-RECTIFIER;F1T4,400V,1A,DO-20 DIODE-RECTIFIER;UF4007,1KV,1A,DO-4 DIODE-RECTIFIER;F1T4,400V,1A,DO-20 DIODE-RECTIFIER;SHG2D,200V,2A,-,TP FUSE-CARTRIDGE;250V,1.6A,FAST-ACTI FUSE-CLIP;-,-,10mohm FUSE-CLIP;-,-,10mohm HEAT SINK-MAIN;DVD-CM350,AL1050R,T IC-PWM CONTROLLER;ICE2BS01,PDIP,8P
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
SA SC SC SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SC SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SNA SNA SA
ZD1SS3 0403-000713
P005 C705 C706 CN702 D705 G-PLAT GRD GRD-F/ JK701 R710
AK92-00843C 2203-000440 2203-000440 3710-001385 0401-000005 AK63-00411A AK63-00410A AK97-01676A 3722-001811 2007-001167
ASSY PCB-FUNCTION;DVD-V5650/XAA,MI C-CER,CHIP;1nF,10%,50V,X7R,1608 C-CER,CHIP;1nF,10%,50V,X7R,1608 SOCKET-BOARD TO CABLE;10P,1R,2mm,A DIODE-SWITCHING;1N4148,75V,150mA,D GROUND-PLATE;DVD-V5650/XAA,SUS T0. GROUND-FUNCTION;DVD-V5650/XAA,PBS ASSY-GROUND FUNCTION;SUS304 T0.2+P JACK-PIN;3P,8.3PI,NI,BLK,R-CHIP;75ohm,5%,1/10W,TP,1608 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6 SWITCH-TACT;DC12V,50MA,100GF,6.0X6
1 1 1 1 1 1 1 1 1 1 1 1 1
SA SA SA SA SA SNA SNA SNA SA SA SA SA SA
SW711 3404-001182 SW712 3404-001182 SW718 3404-001182
HS1SSA AK62-00009A IC1SF1 1203-002805
ASSY-FULL DECK S.N.A AC97-02616A S.N.A AC97-02610A S.N.A AC97-02580A S.N.A AC61-00384A
ASSY-DECK;-,DX13A,L/SPEED ASSY-DECK COMMON;-,DX13A,ASSY-TENSION BLOCK;-,X-13,HOLDER-BAND BRAKE;X-13,POM,-,-,-,N
1 1 1 1
SNA SNA SNA SNA
7-8
Samsung Electronics
Loc.No Part No S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A AC61-00398A AC61-00399A AC66-00093A AC97-02581A AC66-00112A AC66-00113A AC61-00395A AC61-62030A AC61-62031A AC66-00109A AC97-02582A AC60-40645A AC66-00117A AC60-40645A AC61-60563A AC66-00116A AC69-12136A AC97-02583A AC61-60572A AC66-00079A AC66-00095A AC61-60572A AC66-00080A AC66-00096A AC97-02604A 0205-000129 0205-001033 0205-001035 AC97-02611A AC60-30304A AC61-00104A AC61-00404A AC61-21006A AC66-00015A AC66-00110A AC66-00128A AC97-02621A AC61-00385A AC61-00405A AC66-40154A AC61-00383A AC61-00405A AC66-40154A AC97-02618A 3708-001634 AC31-12016F AC41-00238A AC66-00010A AC97-02586A AC97-02555A AC61-00342A AC61-00380A AC61-00402A AC61-00403A AC61-50672A
Description ; Specification POST-TENSION GUIDE;X-13,SUS303C,2, POST-TENSION LEVER;X-13,SUS303,2.5 LEVER-TENSION;X-13,SECC,T0.8,-,-,ASSY-REEL BLOCK;-,X-13,GEAR-CENTER 1;X-13,POM,0.5,25,12.5 GEAR-CENTER 2;X-13,POM,0.5,46,23,N HOLDER-CLUTCH;X-13,POM(SW-01),-,W1 SPRING ETC-WRAP PLAY;X-9,SUS 304-W SPRING ETC-WRAP REV.;X-9,SUS 304-W PULLEY-CLUTCH;X-13,POM,-,NAT,2.5,ASSY-BRAKE BLOCK;-,X-13,FASTENER-PIN BRAKE;-,-,1.5,L=12,-, LEVER BRAKE-S;X-13,POM,T10,W20,L40 FASTENER-PIN BRAKE;-,-,1.5,L=12,-, SPRING ETC-T.BRAKE;X-9,SUS304-WPB, LEVER BRAKE-T;X-13,POM,T10,W20,L40 PAD-T.BRAKE;X-9,FUR FELT,1.5,10.7, ASSY-LOADING BLOCK;-,X-13,SPRING ETC-LOADING;X-9,SUS304WPB,O GEAR-S LOADING;X-11,POM(K300),-,-, LEVER-LOADING S;X-13,SECC 20/20,T1 SPRING ETC-LOADING;X-9,SUS304WPB,O GEAR-T LOADING;X-11,POM(K300),-,-, LEVER-LOADING T;X-13,SECC 20/20,T1 ASSY-SUB MATERIALS;-,DX11,GREASE-SILICON;SC102,JAPAN,1000G/C GREASE;PL-30G,W050030019,OIL;EP-56,W050050072,MICHANG ASSY-PINCH BLOCK;-,X-13A,FASTENER-WASHER PINCH;-,-,D2.7,D4. SPRING ETC-PINCH;TS-10,SUS304-WPB, POST-PINCH ROLLER;X-13,SUS XM-7,-, CAP-PINCH;X-9,POM,-,-,-,-,LEVER-PINCH SUB;TS-10,SECC E20/20, LEVER-PINCH MAIN;X-13,SECC,T1.2,W2 ROLLER-PINCH;-,Rubber,14,18,NAT,-, ASSY-GUIDE BLOCK;-,X-13A,BASE-TAKE UP SLIDER;X-13,PPS(Ryton POST-SLANT GUIDE;X-13,SUS303,PI 3. ROLLER-TAKE UP ASSY;-,VW-32,OD7,-, BASE-SUPPLY SLIDER;X-13,PPS(Ryton POST-SLANT GUIDE;X-13,SUS303,PI 3. ROLLER-TAKE UP ASSY;-,VW-32,OD7,-, ASSY-DECK ONLY;-,DX13A,L/Speed CONNECTOR-FPC/FFC/PIC;3P,1.25MM,AN MOTOR-LOADING;MDHB2B66,SCORPIO2(TS PCB-LOADING MOTOR;SCORPIO2(TS-10A) GEAR WORM;TS-10,POM,0.8,1,-,NAT,7. ASSY-M/B BLOCK;-,X-13,ASSY-BASE MAIN;-,X-13,POST-LOADING;X-11,SWCH18A,OD3.0,L9 BASE-MAIN;X-13,SECC,T1.2,-,-,NTR,POST-REEL;X-13,SWCH18A,3,-,-,Non-e POST-CENTER;X-13,SWCH18A,-,-,-,Non POST-PINCH LEVER;X-9,SWCH18A,-,L24
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0.2 1.16 0.04 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 6 1 1 1 1 SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA
Loc.No Part No S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A T001 T002 T003 T003 T004 T005 T006 T007 T008 T009 T010 T011 T013 T015 T016 T019 T020 T021 T022 T023 T024 T025 T026 T027 T028 T028 T029 T034 T035 T036 T037 T038 T039 T040 T041 T042 AC61-50677A AC61-00387A AC61-00401A AC97-02608A AC97-02613A 3708-001676 AC41-00130A AC61-00382A AC61-00406A AC33-00019A AC97-02623A AC61-00108A AC66-00106A AC66-00107A AC70-00004A AC61-00392A AC61-00393A AC61-00394A AC66-00105A AC97-02624A AC61-00391A AC97-01652A AC31-00018A AC66-00101A AC66-00102A AC61-00105A AC61-00390A AC97-02570A AC97-02556A AC97-02625A AC66-00094A AC33-00018A AC97-02620A AC97-02563A AC66-00124A AC66-00123A AC66-00115A AC66-00114A AC97-02562A AC61-00107A AC97-02560A AC97-02567A AC97-02568A AC61-00106A AC61-00106A AC66-00104A AC66-00103A AC66-00077A AC61-00389A AC66-00092A AC66-00099A AC70-00003A AC66-00100A AC66-00078A AC97-02557A
Description ; Specification POST-FL CAM GEAR;X-9,SWCH18A,-,L14 SLEEVE-8 GUIDE;X-13,-,-,-,-,-,-,BL POST-#8 GUIDE;X-13,SUS XM-7,2.5,-, ASSY-CAPSTAN BLOCK;-,X-13,Phenol/P ASSY-ACE HEAD BLOCK;-,X-13A,AE Les CONNECTOR-FPC/FFC/PIC;6P,1.25MM,AN PCB-ACE HEAD;TS-10,-,-,-,-,-,-,-,BASE-ACE MAIN;X-13,SECC,T1.2,-,-,N SPRING ETC-ACE;X-13,SWPB,1,-,7.2,HEAD-A/C;HVMXB1016A,-,X13A,-,ASSY-FL BLOCK;-,X-13A,SPRING ETC-FL ARM R;TS-10,SUS304-W LEVER-ARM R;X-13,POM,-,W35,L70,-,N LEVER-ARM L;X-13,POM,-,W35,L70,-,N PLATE-FL ARM;X-11,SECC E20/20,T1.6 PLATE-CASSETTE;X-13,SECC,T0.8,W28, HOLDER-CASSETTE R;X-13,POM,-,W35,L HOLDER-CASSETTE L;X-13,POM,-,W35,L LEVER-LOCK;X-13,SECC,T1.0,W25,L50, ASSY-CYLINDER;6NSJ/6NJ,CX13A-MIRIO PLATE-GROUND DECK;X-13,SPTE,T0.3,ASSY-LOADING MOTOR;SANKYO LOADING MOTOR-LOADING ASSY;-,SCORPIO2(TS-1 GEAR-WORM WHEEL;X-13,POM(M90-44 EQ GEAR-FL CAM;X-13,POM(M90-44 EQU),SPRING ETC-PINCH DRIVE;TS-10,SUS30 PLATE-JOINT;X-13,SECC 20/20,T0.8,ASSY-SLIDER SUPPLY;(PPS),X-13,ASSY-SLIDER TAKE UP;-,X-13,ASSY-HEAD A/C;-,X-13A,LEVER-9 GUIDE;X-13,PPS,-,-,-,-,BRO HEAD-FULL ERASE;-,-,X-13,-,ASSY-UNIT PINCH;-,X-13A,ASSY-POST #8 GUIDE;-,X-13,PI 2.5 REEL-S;X-13,POM,-,BLK,2.5,-,27,REEL-T;X-13,POM,-,BLK,2.5,-,36.5,LEVER-IDLE;X-13,POM,T15,W38,L25,-, GEAR-IDLE;X-13,PET,0.5,54,27,NAT,2 ASSY-LEVER TENSION;-,X-13,SPRING ETC-TENSION LEVER;TS-10,SUS ASSY-BAND BRAKE;-,X-13,ASSY-LEVER BRAKE S;-,X-13,ASSY-LEVER BRAKE T;-,X-13,SPRING ETC-BRAKE;TS-10,SUS304-WPB, SPRING ETC-BRAKE;TS-10,SUS304-WPB, SLIDER-FL DRIVE;X-13,SECC,T1.0,W15 GEAR-JOINT 1;X-13,POM(M90-44 EQU), GEAR-JOINT 2;X-11,POM(K300),-,-,-, BRACKET-GEAR;X-13,SECC 20/20,T0.8, SLIDER-CAM;X-13,SECC 20/20,T1.2,-, LEVER-PINCH DRIVE;X-13,SECC 20/20, HOOK-CAPSTAN;-,-,L10,W10,H10,POM(M LEVER-TENSION DRIVE;X-13,SECC 20/2 GEAR-LOADING DRIVE;X-11,POM(K300), ASSY-LEVER LOADING S;-,X-13,-
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SA SNA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA
Samsung Electronics
7-9
Loc.No Part No T043 T044 T046 T048 T049 T050 T053 T055 T057 T071 T072 T073 T074 T075 T076 W015 W016 W018 W019 W201 AC97-02558A 3101-001430 AC66-60051A AC97-02566A AC60-30306A AC66-00111A AC66-00097A AC66-00098A AC61-00386A AC61-00388A AC97-02622A AC61-00397A AC97-02564A AC66-00108A AC97-02569A 6006-001092 6006-001154 6003-001450 6003-000108 6001-001711
Description ; Specification ASSY-LEVER LOADING T;-,X-13,MOTOR-CAPSTAN;-,-,12V,90mA BELT-PULLEY;-,5CM-70,2 * 2,-,71.3, ASSY-GEAR CENTER;-,X-13,FASTENER-WASHER SLIT;-,-,ID2.1,OD5 LEVER-UP DOWN;X-13,POM,T15,E25,L55 LINK-LOADING S;X-13,SECC 20/20,-,T LINK-LOADING T;X-13,SECC 20/20,-,T SLEEVE-TENSION;X-13,-,-,2.5,-,-,-, GUIDE-CASS DOOR;X-13,POM(M90-44 EQ ASSY-HOLDER CASSETTE;SECC+POM+SUS, SPRING ETC-LOCK;X-13,SWP-B,0.25,2. ASSY-LEVER ARM;-,X-13,LEVER-DOOR;X-13,POM,-,W30,L75,-,NA ASSY-CLUTCH;-,X-13,SCREW-MACHINE;WS,PH,+,M3.0,L6.0,ZP SCREW-TAPTITE;WSP,PH,+,M2.6,L5.6,Z SCREW-TAPTITE;PH,+,S,M2.6,L5,ZPC(Y SCREW-TAPTITE;BH,+,B,M2.6,L6,ZPC(Y SCREW-MACHINE;PH,+,M3,L3.3,ZPC(YEL SCREW-MACHINE;PH,+,-,M2,L6,ZPC(YEL BAND-BRAKE SUB ASS'Y;TS-10,WOOL 10
Qty S.N.A Remark 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 3 1 1 3 1 3 1 SA SA SA SA SA SA SNA SNA SA SA SA SA SA SA SA SA SA SA SA SA SNA SNA
Loc.No Part No S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A S.N.A W010 W011 W012 W012 W212 AK41-00146A AK41-00147A AH31-00025A AK66-00006A AK97-01454A AK97-01106A AH66-00077A AK31-00006A AK61-00362A AK61-00361A 6003-001157 6001-001370 6002-001086 6002-001086 6003-001251
Description ; Specification PCB-DECK;DP-15,-,-,-,-,-,-,-,-,FFC-DECK;DP-15,-,FFC,11,T0.3,MOTOR-LOADING;RF-300EA-1D390,DP-7, PULLEY MOTOR;DP-9,POM ,-,BLK,-,-,ASSY-PU DECK;-,DP-19,LD VE ASSY-SUB DECK;-,DP-16S,SEM GEAR-FEED MOTOR;-,POM M90-44,-,-,MOTOR-FEED;RF-300EA-1D390,DP-9,90M BRACKET-DECK OUTSERT;DP-16,POM,T1. BRACKET-DECK;DP-16,SECC T1.2,T1.2, SCREW-TAPTITE;PWH,+,B,M2,L6,ZPC(YE SCREW-MACHINE;CH,+,M1.7,L3.0,ZPC(Y SCREW-TAPPING;PH,+,B,M1.7,L5.0,ZPC SCREW-TAPPING;PH,+,B,M1.7,L5.0,ZPC SCREW-TAPTITE;CH,+,-,B,M1.7,L3,ZPC SCREW-TAPTITE;PH,+,-,B,M2,L6,ZPC(B SCREW-MACHINE;BH,+,-,M1.7,L2.5,ZPC
Qty S.N.A Remark 0.067 1 1 1 1 1 1 1 1 1 1 2 1 2 1 1 4 SNA SNA SNA SNA SNA SNA SNA SNA SNA SNA SA SA SA SA SA SA SA
W273 6003-000233 W274 6001-001730
W291 6001-000506 AC69-00094A
REMOCON-ASSY CT01 2401-002144 CT02 2203-000192 CT03 2203-000192 LDT01 0601-000519 OP5 QT01 RT01 RT02 RT03 XT01 2007-000029 0501-000534 2007-000881 2007-000593 2007-000102 2802-001094
C-AL;47uF,20%,16V,GP,TP,5x11,5 C-CER,CHIP;100nF,+80-20%,50V,Y5V,2 C-CER,CHIP;100nF,+80-20%,50V,Y5V,2 LED-IR;ROUND,5mm,170mW,4V,940nm,TP R-CHIP;0ohm,5%,1/8W,TP,2012 TR-SMALL SIGNAL;2SC2412K,NPN,200mW R-CHIP;4.7ohm,5%,1/8W,TP,2012 R-CHIP;22ohm,5%,1/8W,TP,2012 R-CHIP;100Kohm,5%,1/10W,TP,1608 RESONATOR-CERAMIC;4.0MHz,0.5%,TP,8
1 1 1 1 1 1 1 1 1 1
SA SA SA SA SA SA SA SA SA SA
ASSY-DVD DECK DSW1 3409-001138 H102 AK61-00360A H103 AK66-00042A H104 AK97-00608A H105 H106 H107 H108 H109 H202 H203 H203 H204 H205 H206 H206 H207 H210 H211 H212 H213 H214 H241 H401 S.N.A S.N.A S.N.A S.N.A S.N.A 6602-001076 AK66-00041A AK66-00045A AK63-00101D AK92-00328A AK73-00005B AH61-50327A AH61-50327A AK66-00043A AK66-00044A AK61-00363A AK61-00363A AK31-00017A AK31-00005A AK97-01453A AK61-00359A AK61-00357A AK66-00057A AK41-00250A AK61-00252A AH97-00448B 0205-001033 0205-001048 AK97-01006A AK97-01071A
SWITCH-DETECTOR;5V DC,1A,DPST,30GF BODY CLAMPER-DISC;DP-16,POM,T0.7,GEAR-PULLEY;DP-15,POM,-,-,-,WHT,-, ASSY-MOTOR LOAD;-,DP-15,BELT-RECTANGULAR;CR,T1.2,4.3%,1.2X GEAR-TRAY;DP-15,POM,-,-,-,WHT,-,-, SLIDER HOUSING;DP-15,POM,-,W17.8,L TRAY-DISC;DP-16,ABS,-,W120,L186.3, ASSY PCB-DECK;DP-15,RUBBER-INSULATOR;DP-15,BUTYL,12, SHAFT-P/U;DP-3,SUS,L84.7,OD3,-,-,SHAFT-P/U;DP-3,SUS,L84.7,OD3,-,-,GEAR-FEED A;DP-15,POM,-,-,-,-,-,-, GEAR-FEED B;DP-15,POM,-,-,-,-,-,-, HOLDER-CAM SKEW;DP-16,POM,-,-,-,BL HOLDER-CAM SKEW;DP-16,POM,-,-,-,BL MOTOR DC-SPINDLE;RF300FA-12350,DPMOTOR-FEED ASSY;-,DP-9,-,-,-,-,-,ASSY-PICK UP;-,DP-19,LD VE HOLDER-CHUCK;DP-16,POM,T3,W140,L96 SPRING ETC-CLAMPER;-,SUS304CSP,-,GEAR-BACKLASH;DP-16,POM,0.5,-,-,WH FFC-PU;DP-17,-,-,23P,-,1mm FRAME-MAIN;DP-15,ABS,-,-,-,T36.3,W ASSY-SUB MATERIAL;DP-7S,-,GREASE;PL-30G,W050030019,GREASE-BEARING;G-754,BRN,1Kg/6 ASSY-HOLDER CHUCK;-,DP-16,ASSY-HOUSING;-,DP-16,COMBO
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 0.5 0.01 1 1
SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SA SNA SNA SNA SNA SNA SNA
CABLE AC39-00073A I/B AK68-00956C AK68-00956C AK68-00956J AK68-00956J AK68-00956J LEG AC64-80135B P-CASE AK69-00384C AK69-00384C AK69-00384C AK69-00384J AC39-42001J 6003-000275 6003-001375 6003-000277
CABLE-RCA;SJ01-08-099,1.2MT,3P,A/V MANUAL USERS;DVD-V5600,XAX,SPAIN,M MANUAL USERS;DVD-V5600,XAX,SPAIN,M MANUAL USERS;DVD-V5600/XAO,SEM,SPA MANUAL USERS;DVD-V5600/XAO,SEM,SPA MANUAL USERS;DVD-V5600/XAO,SEM,SPA LEG;SV-6000W,PLASTOMER,-,BLK,-,PACKING CASE;DVD-V5600/XAX,XAX,OFF PACKING CASE;DVD-V5600/XAX,XAX,OFF PACKING CASE;DVD-V5600/XAX,XAX,OFF PACKING CASE;DVD-V6600/XAX,SW2,OFF CABLE-RF ASSY;-,-,#1365,1200mm,3A, SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC( SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL SCREW-TAPTITE;BH,+,B,M3,L12,ZPC(YE SCREW-MACHINE;TH,+,-,M4,L12,ZPC(YE
1 1 1 1 1
SA SA SA SA SA
DVD-V5600/XAX DVD-V6600/XAX DVD-V5600/XAO DVD-V5600/XAP
2 1 1 1 1 1 4 7 5 4
DVD-V6600/XAX SA SA DVD-V5600/XAX SA DVD-V5600/XAO SA DVD-V5600/XAP SA DVD-V6600/XAX SA SA SA SA SC
RF/CBL W001 W200 W202
W252 AC60-12126A
7-10
Samsung Electronics
8. Block Diagrams
8-1 All Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8-2 8-2 U5 (Motor Driver IC) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8-3 8-3 U4 (SDRAM) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8-4 8-4 U1 (Flash Memory) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8-5 8-5 U3 (Decoder IC) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8-6
Samsung Electronics
8-1
Block Diagrams
8-1 All Block Diagram

AUDIO VIDEO Audio Common Video Common
Component
DECK ASS'Y (DP-16V)

Optical Coaxial Audio
Pick-up & I/V Amp
Disk Motor
Feed Motor
AIC8 (PCM1753) 2CH Audio DAC
VIC1 (LA73054) Video Amp 6CH S/W
Super
DVD Composite Video
IC801 (MM1501) Output Video Signal Switch VCR Composite Video
IC501 (LA72670BM) Hi-FI Audio Processor
U5 (FAN8026) Motor Driver
IC301 (LA71207) Video Signal Processor
U3 (S5L5010) A/V Decoder
U4 8MB SDRAM
Video IN U7 (TC74VHCT125) Level Shifter IC601 (MN101D10F) VCR Main Micom IC603 EEPROM
U1 (SST39VF080) 1MB Flash Memory
TR DRIVE (Q701~Q705, Q708~Q715) LED Drive Front A/V Jack
(DT701)
8-2
Samsung Electronics
Samsung Electronics
VM2
OPIN+ 1 3 OPOUT OPIN- 2
SVCC
OUT5
10K
8-2 U5 (Motor Driver IC) Block Diagram
VM2
IN5 4
10K Level Shift SVCC
27 DO5+
28 DO5-
24 VM2
VM2
OUT4 IN4 6
10K
10K
25 DO4+
Level Shift
SGND 8
26 DO4-
OUT3 20 IN3 21
10K
FIN
FIN
TSD
SVCC VM1 10K
13 DO3+
Level Shift
14 DO3-
SVCC VM1
12 VM1 OUT2 IN2 10 9

10K Level Shift 10K
16 DO2+
15 DO2MUTE 23 CH2,3,4,5
SVCC SVCC
19 SVCC REF IN1 22 11

10K
18 DO1+
Level Shif
17 DO1-
Block Diagrams
8-3
Block Diagrams
8-3 U4 (SDRAM) Block Diagram
I/O Control
LWE LDQM
Data Input Register Bank Select 4M x 4 / 2M x 8 / 1M x 16 Sense AMP 4M x 4 / 2M x 8 / 1M x 16 4M x 4 / 2M x 8 / 1M x 16 4M x 4 / 2M x 8 / 1M x 16 Refresh Counter
Output Buffer
Row Decoder
Row Buffer
DQi
Address Register
CLK ADD
Column Decoder Col. Buffer Latency & Burst Length
LRAS
LCBR
LCKE LRAS LCBR LWE LCAS Timing Register notice. CLK CKE CS RAS CAS
Programming Register LWCBR LDQM
WE
L(U)DQM
8-4
Samsung Electronics
Block Diagrams
8-4 U1 (Flash Memory) Block Diagram
RY/BY Buffer VCC VSS
RY/BY DQ15 to DQ0
Erase Voltage Generator
Input/Output Buffers
WE BYTE RESET
State Control
Command Register Program Voltage Generator Chip Enable Output Enable Logic STB Data Latch
CE OE
STB
Y-Decoder
Y-Gating
Low VCC Detector
Timer for Program/Erase
Address X-Decoder Latch
Cell Matrix
A18 to A 0 A-1
Samsung Electronics
8-5
Block Diagrams
8-5 U3 (Decoder IC) Block Diagram
SDRAM
UMA SDRAM Controller CCIR656 Interface
2D Graphic Engine(GA) BUS Interface ORF SERVO & DSP ARM946E-S

(processor core) 32- bit bus 4KB I-cache 4KB
Dcache
OBD/ Mixer
Video Processor ( Scaling ) Sub-picture Decoder
NTSC /PAL Encoder
Video 6-DAC Video Output
32- b it bus
BUS Interface
Divx Video DRM
CalmADM ( Audio DSP )

8KB I-cache 12KB
Dcache
MPEG Stream DEMUX Decoder Decryption ATAPI
MPEG Video Decoder Divx DB/DR

32- bit APB
Audio Interface IIS x 5 IIS In

SPDIF O SPDIF I
Bus Bridge
32-bit APB
16 bit Timer
SCR Timer
Ext M I/F
UART
JTAG
Flash ROM
Debugger
EEPROM
RS-232C
8-6
User I/F
Mic in
OSC
GPIO
PLLs
IIS In
WDT
SPI
IIC
Samsung Electronics
9. Wiring Diagram
CN 101
GND TXD SRQ RXD RRQ SCLK MRST ZERO R ZERO L DVD COAX PC 5V PC 5V-2 AUDIO-R GND AUDIO-L PC 9V CVBS PC 3.3V SUPER_Y SUPER_C GND Y Pb Pr CN 4
7 8 9 10
CN 701 GND AUTO V-IN L-IN R-IN K1 S6 S7 S8 VCC CN 702
7 8 9 10
Samsung Electronics
9-1
Wiring Diagram
MEMO
9-2
Samsung Electronics
10. PCB Diagrams

10-1 VCR Main PCB (Inclusive of S.M.P.S PCB) - - - - - - - - - - - - - - - - - - - - - - 10-2 DVD Main PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-2 Function PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-2 10-5 10-7
Samsung Electronics
10-1
PCB Diagrams
10-1 VCR Main PCB (Inclusive of S.M.P.S PCB)

COMPONENT SIDE
10-2
Samsung Electronics
PCB Diagrams
CONDUCTOR SIDE
V-OUT
A-OUT
ENV
HD SW
CTL
Samsung Electronics
10-3
PCB Diagrams
CONDUCTOR SIDE
IC301 IC501
IC601
10-4
Samsung Electronics
PCB Diagrams
10-2 DVD Main PCB

COMPONENT SIDE
Samsung Electronics
10-5
PCB Diagrams
CONDUCTOR SIDE
10-6
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PCB Diagrams
10-3 Function PCB

COMPONENT SIDE
CONDUCTOR SIDE
Samsung Electronics
10-7
PCB Diagrams
MEMO
10-8
Samsung Electronics
11. Schematic Diagrams

Block Identification of Main PCB- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-1 S.M.P.S. (VCR Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-2 Power (VCR Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-3 Logic/Function (VCR Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-4 A/V (VCR Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-5 Hi-Fi/MTS (VCR Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-6 TM/Input-Output (VCR Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-7 DVD I/O (VCR Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-8 DVD AV-Decoder (DVD Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-9 DVD M_Drive/RF (DVD Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-10 DVD Audio (DVD Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 11-2 11-3 11-4 11-5 11-6 11-7 11-8 11-9 11-10 11-11 11-12
For schematic Diagram - Resistors are in ohms, 1/8W unless otherwise noted. Special note : Most semiconductor devices are electrostatically sensitive and therefore require the special handling techniques described under the electrostatically sensitive (ES) devices section of this service manual. Note : Do not use the part number shown on this drawing for ordering. The correct part number is shown in the parts list (may be slightly different or amended since this drawing was prepared). Important safety notices : Components identified with the mark Use only the same type.
Note
have the special characteristics for safety. When replacing any of these components.
Samsung Electronics
11-1
Schematic Diagrams
Block Identification of Main PCB
- DVD Main PCB
- VCR Main PCB
Input/Output Block I/O Block TM Block Power Block
Audio Block
AV Block
A/V Block
Hi-Fi Block
SMPS Block M_Drive R/F Block
Logic Block
I/O Block
LED Display Block
11-2
Samsung Electronics
Schematic Diagrams
11-1 S.M.P.S. (VCR Main PCB)
Samsung Electronics
11-3
Schematic Diagrams
11-2 Power (VCR Main PCB)

POWER
11-4
Samsung Electronics
Schematic Diagrams
11-3 Logic/Function (VCR Main PCB)

POWER VIDEO PROCESS
Samsung Electronics
11-5
Schematic Diagrams
11-4 A/V (VCR Main PCB)

AUDIO PB PROCESS AUDIO REC PROCESS LIMI PB PROCESS LUMI REC PROCESS POWER
11-6
Samsung Electronics
Schematic Diagrams
11-5 Hi-Fi/MTS (VCR Main PCB)

AUDIO PB PROCESS AUDIO REC PROCESS
Samsung Electronics
11-7
Schematic Diagrams
11-6 TM/Input-Output (VCR Main PCB)

AUDIO PROCESS (OUT) AUDIO PROCESS (IN) VIDEO PROCESS (OUT) VIDEO PROCESS (IN)
11-8
Samsung Electronics
Schematic Diagrams
11-7 DVD I/O (VCR Main PCB)

VIDEO AUDIO
Samsung Electronics
11-9
Schematic Diagrams
11-8 DVD AV-Decoder (DVD Main PCB)

Video Audio
U3-75
U3-76
U3-78
These are the waveforms of DVD-V5600/ V6600. Caution) There can be some differences (Voltage, Frequency, stc.) among cameras.
11-10 This Document can not be used without Samsungs authorization Samsung Electronics
Schematic Diagrams
11-9 DVD M_Drive/RF (DVD Main PCB)
Samsung Electronics
11-11
Schematic Diagrams
11-10 DVD Audio (DVD Main PCB)
Video
Audio
11-12
Samsung Electronics
12. Operating Instructions
Samsung Electronics
12-1
Operating Instructions
12-2
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Samsung Electronics
12-3
12-4
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12-5
12-6
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12-7
12-8
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12-9
12-10
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12-11
MEMO
12-12
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13. Circuit Operating Descriptions

13-1 S.M.P.S.
13-1-1 Basic Principles of RCC
RCC is commonly used at low wattage (under 35W) SMPS (Switching Mode Power Supply) for reducing the number of electronic parts in SMPS. The basic functions are as follows. With power plugged in, Vin is applied and ignition current Ig. flows through Rg. From this, Quiescent point of S/W TR starts to flow and Vb is induced to base coil. With sufficient base current (Ib) flows and by the induced Vd. So, S/W TR becomes drastically saturated (swiched on mode). Ic of S/W TR swiftly moves to cut-off region. Fig. 13-1 describes coil voltage of S/W TR ON/OFF mode. The direction of current in the primary and secondary coil is reversed. When S/W TR is on, energy is reserved in primary coil. When S/W TR is off, the energy is supplied to output and then each coil. From this voltage, Ib is supplied again to S/W TR to be saturated.
Fig. 13-1 Basic Current of RCC
Fig. 13-2 Basic Waveform of RCC Samsung Electronics 13-1
Circuit Operating Descriptions
1) Analysis RCC (Ringing Choke Converter) IC Peak Current (Icp) when Q1SR12 is on: T Po Icp = 2 X Ton X Vin e, (e: efficiency) Maximum Icp when duty is 50%: Po Icp max = 4 X lin avg = 4 X Vin X e P1 impedance Lp: Vin X Ton Icp
Lp =
The time to supply reserved energy in transformer to output: L1 n2 T Off = Vo X n1 X Icp Output Voltage Vo: T on n2 Vo = Vin X T Off X n1 Applied Voltage to S/W TR Vce: n1 Vce = Vin + n2 X Vo
Fig. 13-3 Analysis on RCC
13-2
Samsung Electronics
2) Description on Each Circuit Block A. INPUT RECTIFYING CIRCUIT AC 120V-60Hz is rectified by bridge diodes (D1SS01, D1SS02, D1SS03, D1SS04), and then leveled by smoothing capacitor (C1SD11). To remove conduction noise line, filter (L1SS01) and X-capacitor (C1SS01) are used.
L1SS01 F1SS01 D1SS04 C1SS01 D1SS03 D1SS02 C1SD11 Vin D1SS01
Fig. 13-4 Input Rectifying Circuit B. DRIVE CIRCUIT When Vin is applied, ignition current Ig flows through R1SR02. Ic (value =Hfe x Ig) starts to flow in Q1SD11 and Vb is induced to base coil B. By this Vb, Ib starts flowing and Q1SD11 becomes saturated (S/W on). While Ib remains at constant value, Ic increases gradually by time. Base current will decrease and then Q1SD11 will become cut off (S/W OFF). PT1SD1 D1SS08
R1SR02 C1SS07
Q1SD11
R1SR03
R1SR04
C1SR12
Fig. 13-5 Drive Circuit
Samsung Electronics
13-3
C. CONTROL CIRCUIT If output current (Io) and (Vin) were constant, Vo could have the same value as the secondary coil ratio(N2/N1) proportion. However, it actually varies. So, to stabilize Vo, scorpio chassis SMPS adopts direct negative feedback control system using a photocoupler. The following are line voltage regulation and load regulations on Io variations. PT1SD1
L1SS03 D1SS08 C1SS07
R1SR02 R1SR03 R1SR04 Q1SR12 R1SR11 Q1SD11 C1SS10
D1SR11
R1SD01
C1SR12 IC1SS1 R1SR14 D1SR10
R1SD06
R1SS04
R1SS03
C1SS11
IC1SS2 R1SS05
Fig. 13-6 Control Circuit D. LINE VOLTAGE REGULATION Assume load (Io) is constant to analyze control function on voltage variation. Po = Io x Vo : Constant Input power (Pi) is constant and Po is constant. Pi = Vin x Ii : Constant However, as Vin actually varies, Ii should vary as much as Vin varies to make the total input power (Pi) constant. Ii is an average value of collector current (Ic) in Q1SD11 and only flows when S/W is on. So, the variation of Ii can be controlled by the variation of Ic. The only way to change Ic is by changing the time (Ton) to turn on S/W TR (Q1SD11).
13-4
Samsung Electronics
Fig. 13-7 Waveform of Line Voltage Regulation As Vin increases, Toff becomes constant and Ton gets decreased. T1 = T2 = T T Off 1 = T Off 2 T On 1 = T On 2 + T1 E. LOAD REGULATION Assume that the line voltage (Vin) is constant to analyze the control function on the load (Io) variation. As Io varies, Po varies accordingly. Po = Io x Vo : Variable As Po varies, input power (pi) should vary the same amount. Pi = Vin x Ii : Variable (Po = Pi x e, e : efficiency) As Vo and Vin are constant, Ii will vary in proportion to Io variation. As mentioned above, Io is the average value of IC only when S/W TR (Q1SD11) is off and this current (Is) is the average value of IC only when S/W TR is on. This current (Is) is proportional to IC. The variation of Is and Ic can only be controlled by variation of Toff and Ton of the SW TR.
Samsung Electronics
13-5
Fig. 13-8 Waveform of Load Regulation As Io increases, Toff and Ton increase also. (Frequency gets low)
Ton2 = Ton1 + T1 Toff2 = Toff1 + T2 In actual control circuit, as shown in Fig.6, photocoupler (IC1SS1) controls base current of TR (Q1SR12), then, Ton and Toff of S/W TR (Q1SD11) are controlled to perform both line regulator and load regulator functions. The variations of line voltage (Vin) and load (Io) are found in variation of Vo. R1SS34 Vs = R1SS33 + R1SS34 Reference voltage in IC1SS2 (shunt regulator, S431) varies. As Vo gets high, Vs increases and then cathode voltage (Vc) of IC1SS2 is made low. Increased forward current (If) makes collector current (Ipc) flow to control base current of TR (Q1SR12). Q1SR12 becomes saturated and Q1SD11 is cut off because base current in S/W TR (Q1SD11) is divided to make collector current (IC1SS2) in Q1SR12. When Vo becomes low, negative feedback can be performed to regulate Vo.
13-6
Samsung Electronics
3) Output Rectifying Circuit D1SS08 becomes forward biased only when S/W TR (Q1SD11) is off. In this case, Is flows through D1SS08. DC voltage can be made by rectifying Vs through D1SS08 and is passed through the LPF of C1SS07 and L1SS03. D1SS08
PT1SD1
L1SS03
C1SS07 C1SS10
Fig. 13-9 Output Rectifying Circuit
Fig. 13-10 Waveform of Output Rectification
Samsung Electronics
13-7
4) Snubber Circuit During Transformer Operation, leakage inductance exists in addition to normal inductance of primary and secondary coils. Assume that there is no leakage inductance (L1), when S/W TR (Q1SR02) is OFF. n1 Vce = Vin + n2 Vo In other words, Vce is the same as supplied Vin pulse induced by the voltage of Vo, but leakage inductance (L1) exists. n1 dis Vce = Vin + n2 Vo + L1 dit At this time, unless the voltage induced by L1 is suppressed, S/W TR (Q1SR02) will be destroyed because Vce exceeds its specification. To prevent this, Snubber circuit is constructed by using R1SS01, R1SS02, C1SR03 and D1SS05. To supply reserved energy in transformer to output (Toff), the voltage induced by L1 is passed through D1SS05 and charged in C1SR03, then discharged through R1SS01, R1SS02. Finally, it is discharged as heat in R1SS01, R1SS02.
C1SD12 R1SD11 R1SR02 R1SD13 D1SS11 C1SD16
D1SS08
C1SS07
R1SR03 R1SR04 Q1SD11
C1SR12
Fig. 13-11 Snubber Circuit
Fig. 13-12 Vce of Q1 13-8 Samsung Electronics
5) Protection Circuit in Open Loop This chassis SMPS applies direct negative feedback control using a photocoupler. If this photocoupler can not function due to defect of relevant circuit components, it becomes an open loop. When this occurs, output voltage surges three times faster than normal and then causes critical defects in VCR unit. To prevent this, the protection circuit is implemented to maintain holdback by stopping switching in case of open loop. In open loop, VOI increases to over 50V and this over voltage is applied to ZD1SS1. This surge will cause the zener to avalanche, thus shorting. In this case, no voltage is applied to the Vb. No base current flows in S/W TR(Q1SD11) and then it enters the hold-back mode. In this case, ZD401 can not function normally.
R1SR02 D1SS09 D1SS10 R1P101
Q1SD11 R1SR03 R1SR04 C1SS12 C1SR12 ZD1SS1 UZP43B (43V) ZD401 UZP33B (33V)
Fig. 13-13 Protection Circuit in Open Loop
Samsung Electronics
13-9
13-2 VCR System Control

REMOCON
LED DISPLAY
SYSTEM CONTROL MECHA BLOCK
DVD BLOCK
MICOM SERVO OSD
A/V IC
IIC COMMON
Hi-Fi/MTS
EPROM IC
SERVO BLOCK
I/O IC801
TM BLOCK
Fig. 13-14 Micom Block Diagram
(1) Outline
The system control circuit inputs the commands given by the operator to set the mechanism and circuit to the commanded mode. The circuit also inputs the detected output from the tape and mechanism protection sensor and protects the VCR and tape against abnormal operation. Fig. 13-14 is a simplified system control block diagram. The system control is performed by 4 control sections. (System and timer control, Servo control, F/S Tuner, On Screen Display).
13-10
Samsung Electronics
Fig. 13-15 IC601 Block Diagram
Samsung Electronics
13-11
(2) Mechanism/Circuit Control

When the u-COM inputs operators commands via the key input or remote input, the mechanism and circuits are set to the command mode. This function controls mechanism/servo section and audio/video processing section. 1) Cassette Loading Control Controls loading and ejection of a cassette and determines the mechanism operation mode; tape loading/ unloading, action/release of various breaks, tension, take up mechanism etc. 2) Tape Protection Sensor Monitoring Detects abnormal operation in tape using the supply and reel sensor and SW 30Hz pulse for drum rotation. 3) Capstan Motor Control Determines the tape speed and direction, fast forwards and rewinds the tape etc. 4) Tape Counter Control Counts the control pulses on the control track, picked up by the control head and shows it on the digital multidisplay. 5) Servo Control Determines the operation mode of the servo circuit. Control the speed of drum and capstan motor, and then Control the phase of drum and capstan motor. 6) Record Safety Tap Detection Detects the safety tab on the rear of a cassette to prevent a prerecorded program from being erased. 7) Loading/Unloading control Controls a series of loading/unloading operation after the u-COM judges the operation mode and sets the mechanism to suitable mode. Fig. 13-16 show correlation between u-COM and peripheral components during the loading/unloading operation. The mechanism state switch (PROG. SW) detects the mechanism position. When the driving gear is turned by the loading motor, the switch driving slider traces the groove, and this switch stops at the correct position corresponding to each mode. In other words, the u-COM judges the present mechanism state from the PROG SW after receiving the mode data, then it outputs the loading motor and capstan motor control signals. This continues until the PROG SW reaches the correct state by the u-COM.
FUNCTION-TIMER OPERATION MODE DISPLAY AND KEY MATRIX <u-COM> SYSTEM CONTROL/ OSD SERVO BLOCK DFG,DFG CFG CAPSTAN MOTOR ASSY (3 in 1)
MECHANISM STATE INFORMATION PROG SW
CAPSTAN / DRUM MOTOR
LOADING MOTOR
LOADING GEAR
Fig. 13-16 The Relationship Between u-COM, Capstan, Cylinder and Loading Motor
13-12
Samsung Electronics
(3) Program SW Input

The mechanism state for each mode is shown in table 1 below. The mechanism state is classified into position, and correlation between the switch position and mechanism state is shown in table 1, also. <Table 13-1 : Prog. SW State in Each Mode> POSION STANBY POWER OFF LOADING START LOADING END REV PLAY STOP 1 STOP 2 FF/REW 1 FF/REW 2 A 0 0 0 1 1 0 0 0 1 0 CAM S/W B 0 0 0 0 1 1 1 0 0 0 1 C 0 0 0 1 0 0 1 1 0 1 ACTION MODE Eject Unload POWER OFF (Tape loading start point (Tape loading end point) Reverse picture search, reverse SLOW Play, Rec, F-PS, Still, SLOW, F-ADV Stop (Play position 5 Min. over) (MAIN Break ON MODE) High speed Rew, Low speed FF High speed FF, Low speed Rew
(4) Motor Control

In case of Scorpio-2 Deck, Loading Motor Drive IC lies in Capstan Motor, not like Scorpio-1 Deck. In detail, Capstan Motor Drive IC is designed to drive Loading Motor + Capstan Motor + Cylinder Motor in one IC. (See Fig. 13-17) <Table 13-2 : Motor Control Logic> CN604-PIN10 0 ~ 1V 2 ~ 3V 4 ~ 5V MOTOR Reverse Stop Forward
Samsung Electronics
13-13
13-14
CN1 + HU HV HW R2 C11 C9 M.R(360PPR) C10 + +
C1
C2
PIN# 1 2 3 4 5 6 7 8 9 10 11
FUNCTION C FGOUT C Vco1(B+) C Vcc(5V) C F/R C I-LIM C M/T-GND C S-GND D/L Vco2(B+) C-VCTL L L-IN D PG-FG OUT
R3
LB11885 (48-SS0P)
R4
1 2 3 4 5 6 7 8 9 10 11 12 HVHV+ HWHW+ CFG(D) Vcc(5V) CFG(A) CFG(IN) I-LIM F.C PWM S-GND GND 48 47 46 45 44 43 42 41 40 39 38 37
HU+ HUF/R VCO (B+) RFS RFP M/T-GND W-OUT V-OUT U-OUT LD-L2 LD-GND
GND
C13
R5 C3 C7 C6 C12 C5
C4
12 PIN# 1 2 3 4 5 6
R8
D-VCTL
CN2
13 14 15 16 17 18 19 20 21 22 23 24 LD-VREG V-CTL D-BFG D-PGO2 D-CTL LD-IN D-C1 D-C2 D-F.C D-CX D-VCOIN D-PCOUT 36 35 34 33 32 31 30 29 28 27 26 25
LD-VCO LD-LI D-UOUT D-VOUT D-WOUT D-RS D-MCOM D-VCO D-M/T GND D-PGO1 D-PGIN+ D-PGIN-
FUNCTION D PG+ D PGD M/T-GND D M/T-COM D W-OUT D V-OUT 7 8 9 10 11 D U-OUT N.C LD OUT-1 N.C LD OUT-2
C14 C16 C15
Fig. 13-17 Loading Motor + Capstan Motor + Cylinder Motor Block Diagram
R6
C17
Samsung Electronics
(5) Stop Mode

The VCR enters the stop mode when the stop button is pressed during playback, record, rewind and fast forward mode. When trouble is detected, the VCR enters the stop mode to protect the tape and mechanism or when the tape reaches the end, etc. State Input ; Power switch on position. Stop button operation in all mode, except for timer recording and XPR.
(6) Play Mode

State input ; Play button operated in stop, fast forward, rewind, forward search, reverse search, still mode, etc., Indication output ; PLAY lights in VFD. Output at ; IC601 Pin 45 (CAP F/R) : H
(7) Trick Play Mode

Trick play modes are classified into forward search, reverse search, still, slow and frame advance. Audio signal is muted by pin 29 of IC601 (A.MUTE). V-lock is controlled by pin 24 of IC601.
(8) Forward Search Mode

7 Times play speed search in SP and SLP, 21 times play speed search in SLP. State input ; Press the fast forward button on the VCR front panel or the remote control in play or still mode. Indication output ; CUE display in VFD during 3 seconds. Output at ; IC601 Pin 25 (CAP F/R) : H IC601 Pin 50 (A.MUTE) : H
(9) Reverse Search Mode

7 times play speed reverse search in SP, 21 times play speed reverse search in SLP. State input ; Press the rewind button on the VCR front panel or on the remote control in play or still mode. Indication output ; REVIEW display in VFD during 3 seconds. Output ; IC601 Pin 45 (CAP F/R) :H IC601 Pin 29 (A.MUTE) :H
(10) Slow Mode

State input ; Press button and then press button on the remote control. The slow speed can be changed when or button is pressed. Indication output ; SLOW lights in VF display. Output at ; IC601 Pin 45 (CAP F/R) :H IC601 Pin 29 (A.MUTE) :H
Samsung Electronics
13-15
(11) Play/Still Mode

The same track is traced by the video heads. State input ; Press button in play modes. Indication output ; STILL display in VF display. Output at ; IC601 Pin 45 (CAP F/R) :H IC601 Pin 29 (A.MUTE) :H
(12) Record Mode

Must use a cassette with the safety tab. Index signal is recorded on the control track of the tape at the start of recording. State input ; Press the record button during stop mode and record pause mode or at the preset time reached in the timer record mode. Press the REC button in stop mode. Indication output ; RECORD lights in VF display in normal record mode, OTR display in timer XPR modes. Output at ; IC601 Pin 45 (CAP F/R) :H
(13) Record Pause Mode

The pinch roller is released from the capstan shaft in a moment. The brake is applied to the take up reel to prevent tape slack during the record pause mode. State input ; Press button in the record mode. Note : Inoperative during recording and XPR mode. Indication output ; PAUSEdisplay in VF display.
(14) Fast Forward Mode

Tape fast forward operation using capstan motor. State input ; Press the rewind button in the stop or fast forward modes. Indication output ; FF lights in VF display. Output at ; IC601 Pin 45 (CAP F/R) : H
(15) Rewind Mode

Tape rewind operation using the capstan motor. State input ; Press the rewind button in the stop or fast forward modes. Indication output ; REWIND lights in VF display. Output at ; IC601 Pin 45 (CAP F/R) : L
(16) Rewind Shut-Off Mode

Tape rewind operation then power off mode. State input ; Press the power button in the rewind mode.
13-16
Samsung Electronics
(17) Trouble Detection

The trouble detection circuits are provided to protect the from damage (Fig. 13-18). The reel lock sensor detects incorrect rotation of supply and take up reel. The reel lock sensor consists of the disk and photo sensor installed at the bottom of the reel disk. the disk has 6 or 8 shielder parts and the photo sensor consists of the LED and photo transistor assembly. When the light is shielded by the the shielder or enters the photo transistor, the output is obtained from the photo sensor. IC601 measures the period of the pulse. When it is 4 seconds or more during record/play, the VCR enters the reel emergency mode. The VCR maintains the unload-power-on state in the reel emergency.
65
R604
R603
2
R601
R602
Fig. 13-18 Reel and Cylinder Lock T.END/S.END Sensor
(18) Cylinder Lock Sensor

If the frequency of D-FG is less than 230Hz or more than 430Hz during 500msec, and such stuation occurs 3 times contined, micom makes the VCR drum emergency.
Samsung Electronics
13-17
(19) Tape Counter Control

Fig. 13-19 is a simplified diagram of the tape counter control circuit. The tape counter in the u-COM counts the control pulses derived from control head. The control signal on the control track of the tape is picked up by the control head and supplied to pins 74, 75 of IC601. The control pulse is amplified by the u-COM IC. The u-COM determines the tape direction so the counter counts up when the CAP F/Rsignal is Hi and the counter counts down when the CAP F/R signal is Low. By counting the control pulse, the counter data is supplied to the VF display. Counter displays the time and it is increased or decreased by one minute after counting 1800 control pulses. Counter mode is switched to clock mode when the display button is pushed or when the VCR goes to power off mode. When the Clear button is pressed, the counter is reset to 00 : 00. The tape counter has a memory stop function. LED DISPLAY
TR Discrete Circuit Block
Pin 83 ~ 86/90 ~ 93 : SEG Pin 8 ~ 12 : GRID
74 75
Fig. 13-19 Counter Display
13-18
Samsung Electronics
(20) Timer/OTR Control

The timer can preset 7 programs in one month including daily and weekly programs. Express recording lets the operator record up to 9 hours 30 minutes without programming the timer.
(21) Clock Display

The clock generator inside of the u-COM counts the oscillation signal of XT601 for the timer clock data.
(22) Power Failure Detection

u-COM goes to the power failure mode when the 61 port is lower than 4/5 of AD Vcc level.
(23) 4HD Control

During trick play (still,slow,F-advance), it is necessary to control pre-amp,video circuit. the micom control pin 29 (C-ROTARY), pin 30 (HD-AMP) of the IC601 during PB period in Slow mode. These port is applied to video IC to operate the trick play.
Samsung Electronics
13-19
13-3 VCR Servo

(1) Outline
The servo system is divided into three loops. The cylinder servo controls the rotation of video heads, the capstan servo controls the tape speed, and the tension. In addition its necessary to control cylinder motor, especially during trick play in 4HD models. The tension servo maintains the tape tension constant: it keeps the compression strength of tape against the video heads at the optimum level so that a stable RF signal is produced during recording and playback. The tension servo operation is entirely mechanical. The cylinder servo loop controls the phase and speed of the cylinder motor. The speed is kept at a constant 1800 RPM and the phase determines the mechanical position relative to the vertical Sync signal. The capstan servo loop controls the phase and speed of the capstan motor so that the video head can trace the video track correctly. It keeps tape speed constant according to the mode (SP, SLP)during playback and recording. <Table 13-3 : Servo System Signal> MOTOR SYSTEM MODE REC CYLINDER (VIDEO HEAD) (4H' D) SPEED SPEED& PHASE COMMON TRICK PLAY (STILL. SLOW) REC PHASE CAPSTAN SPEED (4H' D) PB COMMON CTL 30Hz 8MHz CAPSTAN FG 8MHz CYLINDER FG(720Hz) MICOM CONTROL CYLINDER SPEED TO MATCH H-SYNC SPEED DIVIDED CFG PULSE REF 30Hz PHASE PB REF30Hz REFERENCE SIGNAL V-SYNC SW 30Hz COMPARISON SIGNAL
SPEED& PHASE
TRICK PLAY (STILL. SLOW)
MICOM CONTROL CAPSTAN DRIVE SIGNAL WITH CAP C.L
13-20
Samsung Electronics
Samsung Electronics DPG comparator DPG signal DFG amplifier DFG signal Speed error detection Kv (Drum speed gain) Phase error detection Kp (Drum phase gain) Phase detection Kp Digital filter Bias value addition PWM conversion Motor driver (Capstan phase gain) Speed error detection Kv CFG amplifier CFG signal Carrier rejection filter Digital filter Carrier rejection filter Capstan motor M Digital filter Digital filter PWM conversion Motor driver M Drum motor Remark The broken line indicates the internal processing of the MICOM
HSW generation
RECCTL generation
Fig. 13-20 Block Diagram
RECCTL head
PBCTL amplifier
Vertical sync signal VSYNC separation circuit
composite sync signal
13-21
(2) Capstain Speed Error Detector

The capstan speed control operates so as to hold the capstan at a constant rotational speed, by measuring the period of the CFG signal. A digital counter detects the speed deviation from a preset value. The speed error data is added to phase error data in a digital filter. this filter controls a pulse-width modulate (PWM) output, which controls the rotational speed and phase the captain. When the error is zero, the PWM circuit outputs a waveform with a 50% duty cycle. The CFG input signal from the capstan motor is a square wave the CFG input signal is compared by a comparator and than sent to speed error detector as the CFG signal. The speed error detector uses the system clock to measure the period of the CFG signal, and detects the deviation from a preset data value. The preset data is the value that would result from measuring the CFG signal period with the clock signal if the capstan motor were running at the correct speed. The error detector operates by latching a counter value when it detects an edge of the CFG signal. the latched counter provides 16 bits of speed error data for the digital filter to operate on. The digital filter adds the speed error data to phase error data from the capstan phase control system,then sends the result to the pulse-width modulator as capstan error data.
(3) Capstain Phase Error Detector

The capstan phase error detector consists of a 16-bit counter, a capstan phase preset data register pair, a latch signal circuit driven by a feedback signal, and a captain phase error data register pair. The capstan phase control in rec mode is executed by comparing HD S/W, which is synchronized with V-sync, with devided CFG signal. And than it does in playback mode by comparing HD S/W, which is synchronized with DFG and DPG, with PB CTL signal. The latch signal for the phase error data in record mode is the devied CFG signal, which is devided from the CFG signal in the CFG frequency devider to a frequency of 30HZ. In playback, the latch signal is the devied CFG signal obtained by frequency division from the rising edge of PBCTL signal (playback control pulse signal). The error data is a signed binary value centered on a phase error of zero (corresponding to the correct rotational phase). If the phase legs the correct phase ,the error is positive (+). If the phase leads the correct phase, the error is negative (-).
(4) Drum Speed Error Detector

Drum speed control operates so as to hold the drum at a constant rotational speed, by measuring the period of the DFG signal. A digital counter detects the speed deviation from a preset value. The speed error data is added to phase error data in a digital filter. The filter controls a pulsewidth modulated (PWM) output,which controls the rotational speed and phase of the drum. The DFG input signal from the drum motor is a square wave. The DFG input signal is compared by a comparator and than sent to the speed error detector as the DFG signal. The speed error detector uses the system clock to measure the period of the DFG signal, and detects the deviation from a preset data value. The preset data is the value that would result from measuring the DFG signal period with the clock signal if the drum motor were running at the correct speed. The error detector operates by latching a counter value when it detects an edge of the DFG signal. The latched count provides 16 bits of speed error data for the digital to operate on. The digital filter adds the speed error data to phase error data from the drum phase control system, then sends the result to the pulse-width modulator as drum error data.
13-22
Samsung Electronics
(5) Drum Phase Error Detector

Drum phase control must start operating after the drum motor is brought to the correct rotational speed by the speed control system . Drum speed control works as follows in record and playback. - Record : Phase is controlled so that the vertical blanking intervals of the recorded video signal will line up along the edge of the tape. - Playback : Phase is controlled so as to trace the recorded tracks accurately. A digital counter detects the phase deviation from a preset value. The phase error data is added to speed error data in a digital filter. this filter controls a pulse-width modulated (PWM) output, which controls the rotation phase and speed of the drum.When the error is zero, the PWM circuit outputs a waveform with a 50% duty cycle. The phase counter error detector compares the phase of the DPG pulse (tach pulse),which contains video head phase information, with a reference signal. In the actual circuit , the comparison is carried out by comparing the head-switching (HSW) signal,which is delayed by a counter that is reseted by DPG, with a reference signal. The reference signal is the REF 30Hz signal,which differs between record and playback as follows. - Record : V sync signal extracted from the video signal to be recorded (frame rate signal, actually 1/2V sync). - Playback : 30Hz signal divided from the system clock.
Samsung Electronics
13-23
13-4 VCR Video

(1) Luminance Signal Recording System
39 LINE1-1N LINE2-1N 30 RF V-1N 28 32
34
AGC DET VIDEO AGC 6dB AMP F. B CLAMP QV/QH INSERT
CCD
LPF
YNR Y/C COMB
3 MHz LPF
VIDEO OUT 26
AMP NL EMPH DETAIL ENH
21
clock data
FM MOD 53 54 REC FM EQ FM AGC +
MAIN EMPH W/D CLIP
CLAMP
22
chip select 55
REC COLOR
REC CURRENT AMP 69 70
73
SP H'D
66
SLP H'D
IC301
LA71207M
Fig. 13-21 Luminance Record Process 1) Outline Fig. 13-21 shows the video signal recording system. Line input signal or tuner input signal is selected by Micom. Input selection is done with the INPUT SELECT button on the remote. The input select control signal is supplied to the pin 53(clock),54(data),55(chip select) of video IC from Micom IC. The selected video input signal goes to pin 28(TUNER),30(LINE 2),32(LINE 1) of Luma/Chroma processor IC (IC301). And then it enters VIDEO AGC circuit. The gain of AGC circuit is controlled by AGC detector so that the output is constant (approx. 2Vp-p). The output signal of AGC is clamped by the FBC(Feed Back Clamp) circuit. This signal appears at pin 26, after being amplified at the internal video amp and driver. The output signal from the clamp circuit enter the detail enhancer circuit. In the detail enhancer circuit, the low level high frequency video signal is emphasized to improve the original signals frequency characteristics. onlinear emphasis circuit is employed to improve S/N and frequency response characteristics together with the following main emphasis. Noise effects the FM wave at a higher frequency, so the S/N can be improved by emphasizing the higher frequency before recording and by suppressing the play signal during demodulation. The difference of non linear emphasis from main emphasis is that the emphasis characteristics change is depending on the input level. The gain of the emphasis circuit is inversely proportional to the level of the high frequency component of the signal. That is, if the high frequency portion of the signal is low the main emphasis circuit will amplify the signal.
13-24
Samsung Electronics
2) Main Emphasis Circuit The dynamically emphasized luminance signal is now supplied to the main emphasis circuit where all the high frequency components of the signal are boosted more than the low frequency components. The boosting action is required for the high frequency components because in the FM recording method, the noise of the playback signal increases in proportion to the modulated signal frequency or low level signal. By using the nonlinear emphasis and main emphasis system, the total S/N ratio is increased. The output of the main emphasis circuit is then supplied to the white and dark clip circuit. 3) White and Dark Clip Circuit After emphasis is performed, large overshoots and undershoots in the luminance signal are limited to a specified level. This is done to avoid FM over modulation. The output of the main emphasis circuit is then supplied to the FM modulator circuit. 4) FM Modulator A. The amplitude of the FM signal is limited, so the signal is recorded on tape near the maximum record level which increases the S/N ratio. B. The FM carrier is se to 3.4MHz (at the Sync tips) and the deviation to 4.4MHz by inside IC circuit (for the white peak). The actual device which constitutes the FM modulator is a stable multivibrator. This multivibrator generates a sine wave output of variable frequency. The frequency of sine wave is governed by the level of the processed video signal at any given point. Therefore, the processed video signal varies the frequency of the sine wave which is frequency modulation (FM). During playback in SLP mode, the crosstalk of the adjacent track is more apparent than is standard mode. It appears as jitter and noise on the monitor. To reduce this noise from the screen, the FM carrier frequency has to be 1/2fh shifted up during recording. This is done by applying the head switching pulse to the FM modulator control pin57 during SLP recording. The FM modulated luminance signal goes to record equalizer circuit and it is mixed with chrominance signal at the record Amp circuit inside video IC. 5) Record Amp The frequency modulated luminance signal and chroma signal are mixed in the record amp of pre-amp block inside video IC. Then this mixed signal is amplified and supplied to the video heads via the rotary transformer and recorded on the magnetic tape. Tape speed selection determines which video heads will be used. That is, signal output from pin 66 (SLP) and 73 (SP) of pre-amp block are supplied to video heads. Control signal of speed mode is applied to pin 53(clock), 54(data), 55(chip select) of video IC from Micom IC.
Samsung Electronics
13-25
(2) Luminance Signal Playback System
PB EQ PHASE CH1 SP H'D CH2 74 91 73 91 72 91

AMP AMP
DOUBLE LIMIT
FM DEMOD SUB LPF 3MHZ LPF MA2N DE-EMPHA
PB FM-EQ
21 91
FM AGC CH2 SLP H'D CH1 67 91 66 65

AMP AMP
CLAMP
22 91
NL DEEMPHA
YNR Y/C COMB
34 91
H'D S/W 57 H'D AMP S/W 58 26 VIDEO OUT 6dB AMP QV/QH F.B CLAMP NOISE CANCELL Y/C MIX PICTURE CTL CCD 39 91
IC301
LA71207M
Fig. 13-22 Luminance Playback Process 1) Outline The video signal recorded on the tape is picked up by CH1,CH2 head and is supplied to pre-amp block via rotary trans. During playback, as per the speed, SP and SLP head is determined by Pin60 of respectively. CH1 signal inputs to Pins 65 and 74 while CH2 signal inputs to Pins 67 and 72 of video IC. The pick up operation is controlled by the head switching pulse inputted to pin 57. During the high portion of the switching pulse, CH2 is picked-up and just the opposite is true for CH1. In the pre amp IC, the FM signal is amplified 60dB and this signal is applied to FM AGC. 2) FM AGC AMP At the FM AGC Amp (FM), signals are automatically balanced. One of the AGC circuit outputs is fed to AGC detector circuit which detects signal level fluctuations. The detector output signal is applied to the FM AGC Amp to keep the output constant.This output is applied to the PB FM EQ block. FM EQ is correct the phase distortion and level. The signal through PB EQ circuit is applied to the double limiter. 3) Double Limiter Circuit A FM signal on the tape which contains AM components will be read during playback. If there is a severe AM component, a drastic drop in FM carrier can occur. This lack of FM carrier can be called a noise region. Double limiting is used for improving the S/N ratio and carrier loss. The playback FM signal is split into two paths, one goes to high pass filler and sub-limiter. The other goes to the main-limiter after passing through a LPF. ONE path of the FM signal goes to the high pass filter, so that the low frequency(AM) component can be removed, and the other carrier is supplied to the sub-limiter. The output signal of sub-limiter is mixed with the signal from the low-pass filter and sent to the FM demodulation circuit.
13-26
Samsung Electronics
4) FM DEMODULATOR The FM demodulator consists of a stable mono multivibrator balanced modulator (BM) and a LPF. The FM demodulator circuit first converts the FM signal to a pulse width modulator signal. Then the circuit smoothes the PWM signal to demodulate the video signal. This demodulated signal is fed to the LPF to remove its FM carrier component and any other harmonics. The demodulated luminance signal outputs from Pin 21 and is applied to the 3MHz LPF through main deemphasis circuit. To reduce demodulation noise, the output of the 3MHz LPF is applied to a non-linear deemphasis circuit through YNR circuit. 5) Main De-emphasis Circuit Before modulation, main emphasis was performed. Because the high frequency components of video signal were boosted more than the low frequency components in the recording mode, main deemphasis must be performed to obtain a normal video signal. That is this circuit returns the emphasized high frequency component to the original value. 6) Non Linear De-Emphasis Circuit This circuit is the counter part of the dynamic pre-emphasis circuit during recording. The characteristics are also the opposite of those in recording. 7) Drop Out Compensator/YNR Circuit This circuit compensated for missing parts of the FM signal due to dust, dirt on the tape or irregular tape coating, etc. The clamped video signal is supplied to the CCD 1H circuit. The 1H delayed video signal from CCD block is also supplied to the 6MHz LPF to reject the sampling noise of CCD IC. Then, the output of LPF is applied to Pin 34 of video IC. When the DOC detector detects the FM loss, a 1H delayed video signal is added in place of the missing signal. 8) Noise Canceller Circuit The noise canceller circuit removes the high frequency noise contained in the video signal which has the reverse characteristics of the detail enhance in the recording mode. The output of the noise canceller circuit is supplied to the Luminance and Chrominance mixer circuit. The mixed chroma and luminance signal are then output at Pin 26.
Samsung Electronics
13-27
(3) Chroma Signal Recording System

39 32 CCD 30 RF V-1N 28 VIDEO AGC LPF YNR Y/C COMB 3.58 BPF 34
LINE1-1N LINE2-1N
1MHz LPF
MAIN CONVERTER
BURST EMPHA
ACC AMP
+ REC LUMINANCE 69 70
REC CURRENT AMP
73
SP H'D
66
SLP H'D
IC301
LA71207M
Fig. 13-23 Chrominance Record Process 1) Outline Fig. 13-23 shows the chroma signal recording system. The chroma signal recording process is performed by video IC. The input video signal is fed to Pin 28 of IC and supplied to Y/C COMB circuit through AGC AMP. The output signal of Y/C COMB circuit is applied to ACC amplifier. The ACC amplifier is used for both burst ACC which keeps the burst level at a constant value in recording and the color ACC which controls the reference level of the burst ACC with the color signal level. The color ACC works to maintain a relatively high output level by boosting low level input signals to improve color S/N ratio. The signal is then applied to the burst emphasis circuit. Burst emphasis emphasizes the burst signal by +6dB during recording and feeds it to the main converter. The 3.58MHz signal are mixed in the main converter to perform frequency conversion. The main converter is a mixer having the two types of output components which are the added frequency of 4.21+3.58=7.8MHz and the difference frequency component 629KHz. Added frequency is rejected by the 1MHz LPF and the 629KHz down converted chroma signal is supplied to the luma/chroma mixer of pre-amp block and then recorded on the tape via the record amp and heads. AFC detection is performed with the head switching pulse and the fh signal generated from 321fh VOC output. The detector output controls the VCO frequency which will be locked precisely at 320fh (5.035MHz). he 320fh signal is counted down to 1/8 and the resultant 40fh (=629KHz)carrier signal is phase shifted triggered by each horizontal sync signal which is wave shaped as a 50% duty pulse by the pulse generator. The direction of the rotational phase shift depends on the levels of the rotary head switching signal from pin 57 and when the switching signal is "H" level, the phase is retarded by 90 degrees for every 1H, and when is is at a "L" level it will advance by 90 for every 1H this 40fh phase shifted sub-carrier (PSSC) signal enters the sub-converter and the 3.58MHz carrier signal is locked at the color burst frequency by the record APC. The PSSC signal is frequency converted into 3.58MHz +/-629KHz. Then 4.21MHz component (=3.58MHz+/629KHz)is extracted through a 4.2MHz BPF. The 4.21MHz signal is used as a carrier signal for down conversion of the color signal as described previously.
13-28
Samsung Electronics
2) ACC (Automatic Color Gain Control) Circuit The ACC is used as burst ACC in the LP mode, however it is also used for peak ACC in the SP/SLP mode. The purpose of using two different ACC operations is to improve the overall Chroma S/N ratio during playback. In SP and SLP, there is H-sync alignment. This indicates that there is bust alignment as well. Whenever two video tracks overlap or a video head picks up crosstalk from an adjacent track, beats are produced during playback. Perhaps the most noticeable beats are produced by H-sync and burst. But in SP and SLP, these beats occur right at H-sync and burst and are out of the picture. In LP, however, there is no H-sync alignment and these beats can be seen in the picture. To keep the beats at a minimum in LP, we keep the burst level constant so that the beat intensity is constant. We know that ACC acts to improve the color S/N,and in LP, the ACC detector locks at the burst level,and keeps it constant. Thus we have ACC operation with the least beats. In SP and SLP, the beats caused by burst overlap are out of picture, so we don't really mind if the burst level changes or not. To improve the color S/N ratio even more,we use peak ACC in SP and SLP.That is,if the chroma level is too low to record, the amplification degree is increased by 3dB. However, the chroma level is sufficient for recording, this peak ACC is changed to burst ACC to avoid over amplification. By changing the ACC according to picture color content, the burst level may vary. The color ratio improvement is based on the color content itself during SP and SLP provides a somewhat better S/N ratio. 3) Four (4) Phase Rotation CH1 is advanced 90 every channel, while CH2 is delayed 90. When the frequency is set to 629KHz, if phase is shifted by +/-90 it becomes 629KHz +/-90. The 40fh+/-90 (=629KHz +/-90)is balanced modulated via fsc (3.58MHz) depending on which side band is detected. That is, the fs +40fh+/-90 (4.2MHz +/-90) of total frequency is supplied to the main converter. In record mode, the signal operates same as in play back mode. During playback, the phase is returned to original state. 4) AFC (Automatic Frequency Control) Circuit Luminance signal is input to H-sync separator. The H-sync is separated and supplied to phase comparator. This signal can be described as fh (Horizontal Sync frequency of input video signal). However, VCO oscillates at 320fh (5.035MHz). This 321fh is counted down by 1/8 and 1/40 and resultant fh is supplied to phase comparator. fh and fh are supplied to the phase comparator for comparison of their phases. After comparison, the phase differences is output to VCO (320fh) in terms of error voltage. Therefore, the oscillation frequency of VCO is controlled by this error voltage. That is, if the fh phase is changed by H-sync signal fh, error voltage is changed accordingly and if the phases of fh and fh are met due to change of VCO oscillation frequency, error voltage does not feedback. 320fh VCO is oscillated in accordance with phase sync at fh. Therefore, 40fh input to sub converter by phase shift is always sync horized with phase. The AFC loop performs the same operation during record and playback. In recording, phase of VCO is in accordance with H-sync signal of current video signal. Which in playback, the phase sync of VCO is consistent with H-sync signal which is separated from the video signal.
Samsung Electronics
13-29
(4) Chroma Signal Playback System
CH1 SP H'D CH2
74 91 73 91 72 91
AMP
AMP
1.3 MHz LPF

AMP
ACC AMP
MAIN CONV
CH2 SLP H'D CH1
67 91 66 65
BURST DE-EMPHA
AMP
3.58MHz BPF 1
YNR Y/C COMB
3.58MHz BPF 2 39 34 26 91 VIDEO OUT
H'D S/W 57 H'D AMP S/W 58 COLOR N.C
CCD
PB AMP
Y/C MIX
IC301
LA71207M
Fig. 13-24 Chrominance Playback Process 1) Outline Fig. 13-24 shows the chroma signal playback system. The FM signals picked up by the CH-1 and CH-2 video heads are supplied to the pre-amp block. The FM signal from CH-1 and CH-2 are alternately selected by the switch and output signal as a continuous signal. Goes to the ACC amp through the 1.3MHz LPF. The 1.3MHz LPF is used for passing only down converted 629KHz chroma signal in the playback mode. The ACC amp stabilizes the 629KHz color signal level. The output color signal from amp then enters the main converter circuit. In the main converter circuit this signal is mixed with the 4.21MHz phase shifted carrier signal and converted into 4.21MHz + 629KHz signals. 2) Main Converter Inside of IC, the main converter converts the 629KHz rotational chroma signal to a 3.58MHz non-rotational signal. The two inputs of this main converter are the 629KHz signal, which comes from the output of the ACC, and a 4.21MHz which has the same rotational phase as the 629KHz signal. It is important that the rotational phase of the 4.21MHz signal is the same direction as the 629KHz playback chroma signal. To obtain the 3.58MHz non-rotational stable signal, the same direction rotational signal should be mixed with the rotational chroma signal. During the conversion process, the phase is also mixed by the frequency. Therefore, when 629KHz is subtraced from 4.21MHz,the result is the non-rotational 3.58MHz stable signal. The output signal of the main converter goes to the 3.58MHz BPF. In the 3.58MHz BPF,the conversion noise(4.21MHz+629KHz=4.8MHz) is rejected and the 3.58MHz color signal goes to the comb filter. In the comb filter, the crosstalk components due to the adjacent track are eliminated and the color signal is applied to PB-AMP, BURST De-Emphasis, Killer and are applied to LUMA and CHROMA mixer input through the CNC block.
13-30
Samsung Electronics
VIDEO IN BPF fs = 3.58MHz
REC OUT MAIN CONV ( - ) 40th = 629KHz LPF
BPF fh fs + 40th = 3.58MHz + 0.62MHz = 4.2MHz fs VC0 320fh 320fh = 5.03MHz fh = 15.734 KHz 1/8 D/C 40th = 629KHz SUB CONV ( + ) fs = 3.579545MHz XTAL OSC
Fig. 13-25 Block Diagram of Color REC mode by the method of a Down Converter
PB COLOR IN LPF 40th = 629KHz
PB OUT MAIN CONV ( - ) BPF fs = 3.58MHz
BPF fh fs + 40th = 3.58MHz + 0.62MHz = 4.2MHz fs VC0 320fh 320fh = 5.03MHz fh = 15.734 KHz 1/8 D/C 40th = 629KHz SUB CONV ( + ) fs = 3.579545MHz XTAL OSC
Fig. 13-26 Block Diagram of Color PB mode by the method of a Down Converter
Samsung Electronics
13-31
13-5 Hi-Fi Audio

(1) Outline
Hi-Fi circuit consists of HiFi audio LPF,VCO,BPF,FM detect circuit and switching noise compensator, PRE-AMP etc. Linear audio consists of an ALC circuit,REC EQ circuit and a PB EQ circuit. Hi-Fi and Linear audio share the same input selector,output selector and mute circuit. 1) REC Mode (L-CH Only)
LINEAR OUT 6
LINEAR IN 4 OUT SEL CONV. & LINE AMP 80 LINE OUT
INPUT
IN SEL
ALC
LPF
PNR
MOD
REC AMP
26
REC FM
Fig. 13-27 REC Mode (L-CH Only) 2) PB Mode (L-CH Olny)
LINEAR IN 4 CONV. & LINE AMP OUT SEL
LINE 80 OUT
INPUT
PRE AMP
33
34
BPF
DEMOD
LPF
PNR
Fig. 13-28 PB Mode (L-CH Only)
13-32
Samsung Electronics
(2) Block Description

1) Input Selector Input selector outputs 1 signal from 4 different signals received. It outputs 1 selected signal from tuner,rear,front. 2) Normal(Linear) Selector Two signals,L-CH and R-CH are inputed to Hi-Fi IC.But,linear audio is capable of receiving only one signal.Therefore,the 2 input signals must be selected. Usually,the outputs are mixed signals of L-CH and R-CH unlike the input selector,the normal selector does not amplify the selected signal. 3) Output Selector It selects to output Hi-Fi L-CH,Hi-Fi R-CH,LINEAR and MIX(Hi-Fi+LINEAR) signals with the final output IC pin 78 (R-CH) and pin 80 (L-CH). 4) Output ALC(Convertor) ALC is used because when the input level of RF converter gets bigger,it shows up as noise on the screen. But,this block is not used this model(ALC OFF) 5) PNR(Peak Noise Reduction) It is a type of emphasis,de-emphasis function to eliminate noise during modulation /demodulation PNR operates as that of VHS FORMAT to reduce noise. 6) Audio Limiter Before modulating the signals from PNR block,it limits signals exceeding the size limit to max deviation of +/- 150KHz. 7) VCO(Voltage Control Oscillation) It is a modulation functionthat oscillates 1.3MHz (L-CH) and 1.7MHz (R-CH). 8) RF LPF It is a function to eliminate the harmonic components of Hi-Fi carrier formed during VCO,which may affect other block. Its pass-band approximately 2MHz. 9) MIXER It mixes the Hi-Fi carrier formed in L-CH and R-CH. However,due to the frequency difference between L-CH and R-CH,when equal amount of R-CH is recorded to tape,R-CH is must smaiier than L-CH. Therefore,the R-CH output is approximately 10dB bigger than L-CH. 10) Current Amp It is the final amplifier of the mixed Hi-Fi carrier IC pin 28s resistance controls current, which change the size of IC pin 26. 11) AGC(Auto Gain Control) It maintains uniform size of Hi-Fi envelope,which is inputed by pre-amp in play back mode. 12) BPF(Band Pass Filter) L-CH and R-CH each has BPF. The center frequency is same as carrier frequency. It is used to receive only Hi-Fi carrier from all signals inputed to pre-amp.
Samsung Electronics
13-33
13) SW Noise Compensation Unlike the linear audio,insted of using fixed head,drum heads are used,which creates halting points However,in order for the audio to be headed continuously,the damages from halting points are modulated,which creates noise. SW noise compensation is a block to minimize this particular noise. 14) Hold Pulse It makes standard signal(Pulse) to compensate SW noise. 15) DET(Hi-Fi/LINEAR) From the Hi-Fi envelope inputed from pre-amp,it decides whether the signal passing through L-CH BPF is Hi-Fi or LINEAR tape its size(the signal passing through BPF is below 10mVpp, it is not Hi-Fi,therefore,it output linear) 16) DOC(Drop Out Compensation) If demodulation is conducted without properly treating the damage on Hi-Fi envelope caused by scratch on the tape,noise occurs. In order to improve this noise occurrence,DO DET compensate the drop-out using the same methode of compensating the switching noise when the damage on the envelope ranges 10~15mVpp. 17) ENV DET To obtain optimal tracking,envelop must be peak to peak and micom should be in DC. It is a function to convert Hi-Fi envelop to DC. If it is lower than 0.8V at micom,it sends linear mode date to HiFi IC. 18) Serial Data Decoder It receives IIC BUS to enable the operation of inner block and decodes into serial data.
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Samsung Electronics
(3) Pin Port Description (Tuner Mode ; 1KHz, 100% Modulation Input)
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 PIN NAME LINE MUTE Linear out to TM Vcc 9V Linear Input Vcc 5V Linear out ti A/V EXT1-INPUT (L) ALC Detector EXT2-INPUT (L) GND EXT3-INPUT (L) Monitor Input (L) Input changeover switch output (L) ALC Input (L) Vcc 5V 1/2 Vcc Rec Mute Terminal NR Waiting Det NR Waiting Filter NR Waiting Filter CCA Reference NR Empha Tracking DC out Audio Pb FM1 GND REC Current OUT Audio Pb FM2 Crrent adjust Alc detector Hi-Fi detector Monitor Vcc 5V Pb FM Out Pb FM Input GND Vcc 5V Serial data input Serial clock input Audio head s/w Mts Mode out 5V 0/5V 0/5V 0/5V Head s/w 30 hz input 1V : mo / 2V : St / 3V : Bi 2.5 V 5V 2.5 V 350 mVp-p 2V/4V 2.4 V 0~5v 2V/4V DC VOLT. 0/5 4.2 V 9V 2.5 V 5V 2.5 V 0 0 0 2.5 V 2.2 V 2.5 V 5V 2.5 V 0V 2.5 V 2.5 V -21 dBV -21 dBV -28.2 dBV Line Input 3 ( DVD ) DVD Audio (L) Input PB/REC sitch output . Transform R/P signals into DC. ALC Input Terminal Power Supply for in/out Select 1/2 Vcc Terminal GND ( Not in use ) Terminal for waiting dector NR Waiting Filter 1 For L-CH NR Waiting Filter 2 For L-CH CCA Reference for L-CH NR Empahasis for L-CH Hi-Fi Env Det Level Output Audio Playbak FM 1 input ( H ) Hi-Fi PRE-AMP GND Rec current out to Head Audio Playbak FM 2 input ( L ) Rec Current adjust point ALC detection Hi-Fi/ Normal detect FM Monitor Power Supply for Hi-Fi Output of HD Amp in PB Mode Input of FM in PB Mode GND FOR LOGIC Power Supply for LOGIC -28.2 dBV -21.5 dBV -28.2 dBV - 28.2 dBV SIGNAL -17 dbm Reduce the line out noise. Converter Model Only Power Supply for in/out Select Audio from A/V IC Power Supply for in/out Select Audio out to A/V IC Line Input 1 ( FRONT ) ALC Detector for RF converter Line Input 2 ( REAR ) REMARK
Samsung Electronics
13-35
PIN NO. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
PIN NAME CCA Reference NR Empha NR Waiting Filter NR Waiting Filter NR Waiting Det Vcc 5V ALC Input (R) Input changeover switch output (R) Mute Control GND FSC IN DC Reg Stereo PLL filter Vcc 5V Pilot Canceller f FM Filter SIF Input REG Filter Filter Auto Adjust Pilot Det Filter PC_DC_MO PCDOUT PCDIN PCDBXIN Main V/I convert SPE Det V/I convert Spectral DET Wide Band Det EXT1-INPUT (R) GND EXT2-INPUT (R) Wid det V/I convert EXT3-INPUT (R) Monitor Input (R) PCDCOSPE PC_OUT_DBX LINE MUTE ( R ) Line out (R-CH) GND Line out (L-CH)
DC VOLT.
SIGNAL CCA Reference for R-CH NR Empahasis for R-CH
REMARK
2.5 V 2.5 V 5V 2.5 V 2.2 V -21 dBV -21 dBV -
NR Waiting Filter 2 For R-CH NR Waiting Filter 1 For R-CH Terminal for waiting dector Power Supply for in/out Select ALC Input Terminal PB/REC sitch output . Transform R/P signals into DC. GND FOR ANALOGE 200 mVp-p 3.58 Mhz input Bandgap Power supply for MTS LPF for Stereo PLL Power Supply for MTS Select CTL Pin of cancel signal for pilot C. Filter for making stable dc SIF Audio input from TM Block
1.2 V 3.8 V 5V 3.8 V
4.5 V 3.8 V 3.8 V 3.3 V 3.8 V 3.8 V 2.6 V 3.8 V 3.8 V
Filter of reference voltage source. Loof filterof PLL for auto adj Detection for pilot detection circuit Absorbing the DC offset Absorbing the DC offset Absorbing the DC offset Absorbing the DC offset Converting the voltage of signal Connecting pin of smooth capacity of detection circuit. Converting the voltage of signal Connecting pin of smooth capacity of detection circuit.
0 0 3.8 V 0 2.5 V 3.3 V 0/5
-28.2 dBV -28.2 dBV -28.2 dBV
Line Input 1 ( FRONT ) GND FOR MTS Line Input 2 ( REAR ) Converting the voltage of signal Line Input 3 ( DVD ) DVD Audio (R) Input Absorbing the DC offset Absorbing the DC offset
Reduce the line out noise. GND FOR AUDIO
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Samsung Electronics
13-6 Linear Audio

(1) Block Diagram
OUTPUT
LPF 12KHz
OSD
REC AMP LINE AMP
R/P HEAD
BIAS CTL HPF 60KHz
S/W
PB ON
E/E
PB
PB AMP PB ON
REC ON
INPUT
ATT
ALC
(2) Block Description

1) ATT (Attenuation) Line amp is shared between PB mode and E/E mode, which reduces the recorded signal by 20dB and resister. 2) ALC (Auto Level Control) If the signal level is lower than the reference signal (-6dBm) level, the output signal will equal the input signal. However, if the input signal is higher than the reference signal, the output will not equal the input and will gen erate uniform signal. * ALC Application Purpose : Since linear audio is in AM (amplitude modulation) and uses magnetic recording device, it only records limited size and as the size of input signal increases, distortion increases. To prevent this occurance, mark sure the signal does not get bigger even if the level of distortion repodly increases. 3) LINE AMP Line amps gain is approximately 23dB. The purpose of the line amp is to amplify to 68dB in order to obtain the recorded signal on the tape during playback. As the amp gain increases, the passband decreases, which enables the amplification of low frequency. However, it is impossible to amplify frequency of 10KHz to 68dB with just 1 OPAMP. Therefore, to satisfy frequency and gain. Line amp must be constructed into 2 steps of OP AMP. (gain is fixed within IC) 4) 12KHz LPF There are various noises to signal output. The loudest noise is the Video SYNC Frequency of 15.734KHz In order to eliminate the Video SYNC Frequency, LPF and TRAP are combined to LPF.
Samsung Electronics
13-37
5) PB AMP
PB AMP OUTPUT
INPUT
The diagram to the left is the playback amp and the gain input/output are as follows. Av = 1 + Z1 ~ Z1 ~ Z2 Z2
Z1 Z2
The playback characteristic of VHS format can be satisfied by using Z1, Z2 in the above equation. PB amp gain should be designed to be approximately 45dB (1KHz).
Fig. 13-30 PB Amp 6) REC AMP

INPUT PB AMP OUTPUT
The diagram to the left is REC AMP. The amp gain is approximately 14dB. R1 and R2 that determine the gain is located inside the IC. It is uniform and independent to frequency. Frequency characteristics should be considered when designing rec amp. The REC amp should be the opposite to playback characteristics.
R1 R2
Fig. 13-31 REC Amp 7) OSC (Oscillation) Oscillation frequency is 70KHz. Its size is approximately 45Vp-p. it operates on recoed mode. It is supplied to audio erase head and full erase head used to erase already recorded signals. Also, it conducts AM (Amplitude Modulation) using oscillation signals. 8) BIAS Control Oscillation coil is used in oscillation Bias. Coil output changes according to the impedance of F/E, A/E and R/P head connected to the coil. 9) 60KHz HPF There must be standard signal for bias control and that signal uses HPF only to obtain oscillation signal that comes through R/P head. 10) S/W The switch opens when recording, shorts during playback and exterior transister is used.
13-38
Samsung Electronics
(3) Pin Port Description (IC301 ; LA71207M)

PIN NO. 9 75 6 PIN NAME REC OUT GND BIAS DC VOLT. 2.3 0 REC:2.3 PB:0 REC:4.3V PB:5V 2.3 2.3 2.3 2.3 2.3 0 2.3 2.3 2.3 2.3 5.0 2.3 2.3 SIGNAL -2dBm 70KHz+1KHz MIX 3Vp-p -32dBm -32dBm -27dBm -27dBm -27dBm -4dBm -13dBm REMARK REC AMP OUTPUT (GAIN ; 14dB) It is grounded due to the switch inside of IC during playback. During recording, it operates on 60KHz input HPF The BIAS CTL voltage change depends on the external TR. PB EQ AMP INPUT (+) PB EQ AMP INPUT (-) PB EQ AMP SLP SW PB EQ AMP OUTPUT LINE AMP INPUT (PB) Operates at HIGH (5V) AUDIO INPUT : -27dBm AUDIO INPUT : -27dBm AUDIO INPUT : -27dBm AUDIO OUTPUT : -4dBm ALC level selector
11 6 5 7 3 2 58 76 78 1 80 77 10 79
BIAS CTL PB EQ (+) PB EQ (-) PB EQ SW PB EQ OUT LINE PB IN A.MUTE INPUT 1 INPUT 2 Vref Filter Input 3 Vcc Line Out ALC IN
Samsung Electronics
13-39
13-7 TM
(1) Outline
RF and frequency synthesized tuning system General description : The receiving circuit consists of both ANT input and output circuits, channel selection circuit, PIF circuit and SIF circuit. The receiving circuit selects a desired broadcast signal from TV signals induced on an antenna and sends stable video and audio signals to their respective processing circuits.
(2) Tuner modulator block

As explained, this model is designed in one package to contain a RF MODULATOR BLOCK, TUNER BLOCK AND IF DEMODULATOR BLOCK. Its size is greatly reduced and other noise interference can be minimized to make performance high.
(MODULATOR SECTION)
(TUNER SECTION)
(IF SECTION)
VHF RF AMP ANT INPUT UHF RF AMP UHF Mixer
Mixer IC
SAW Filter
IF AMP
Video Detector
Off through SW ANT OUT
VHF OSC
FM Detector
SIF Filter
UHF OSC
AFT PLL IC AGC
TV SET
10
13 AUDIO OUT
11
16
X-TAL SCL SDA IN
VIDEO OUT AFT OUT
Fig. 13-32 Tuner/demodulator Block Diagram
13-40
Samsung Electronics
(3) Tuner Block

A. Low pass filter & high pass filter This consists of IF trap circuit and UHF & VHF separation circuit. If the input signal is IF(45.75MHz), this filter prevents interference. B. Single tune & RF AMP This consists of a filter circuit, RF AMP, impedance conversion circuit, image trap and a single tuning circuit. It prevents noise and other interference signals. RF AMP is controlled by AGC come from IF DEMOD block. C. Double tune It consists of a double tuning circuit to improve rejection characteristic which results in a better band characteristic. D. MOP IC (Mixer, OSC, PLL) It consists a VHS and UHF OSC and mixer circuit. We applied a double balance mixer to have better rejection characteristic, it shows especially various beat characteristic. It serects channels and contains charge pump band driver. The minimum step standard frequency 31.25KHZ.
S.T(VL) H.P.F + IF trap V.RF Amp
D.T(VL)
L.P.F FROM MD SECTION
MOP IC CXA3250AN (SONY) SN761672A (TEXAS Instruments) V.MIX
S.T(VL)
D.T(VH) U.MIX IF S.T
VHF OSD
H.P.F
S.T(U)
U.RF Amp
D.T(U)
UHF OSD OSC AMP IF AMP
Prescaler
IF to IF Section VL VH U
LPF
C.P.
BAND SW
REF
AGC from IF Section MOP IC ! SONY : CSA3250AN @ T I : SN761672A
Tu voltage out
Fsc IN
Tu
Clock
Data
+B
Fig. 13-33 Tuner Section Block Diagram
Samsung Electronics
13-41
(4) IF Block
A. SAW FILTER It passes only needed band of the signal that is converted to IF frequency and decrease other band to minimize the effect of adjacent channel. B. IF AMP IF signal ,which is selected in SAW FILTER, is amplified in IF amp frequency enough to be detected. The IF AMP has parallel inputs & outputs structure and consists of 3 series step AMP.Each step has about 20dB gains.These gains are controlled by AGC voltage has maximum 63dB attenuation range. C. RF AGC CONTROL It is adjusted to determine RF AGC working point in tuner. D. FM DETECTOR After removing AM signal in the limiter AMP ,amplified SIF signal is applied FM detector. This FM detector is PLL detecting type. E. AFT DETECTER AFT automatically controls the OSC frequency in the tuner, so that it retains a constant level. It is a quadrature detection type. The carrier, which is detected from video det is directly input to AFT detector . The 90 degree delayed phase signal is input at the same time to AFT detector and ,the results come out. Detected AFT voltage is amplified by DC AMP and then applied to pin 13.
FROM TUNER SECTION ! SIMENS : M1867M @ SANYO : LA7567BVA TO TUNER RF AGC AFT OUT
AUDIO OUT
SAW FILTER
FM DET
RF AGC
IF AGC
VIF AMP
AGC
1'ST AMP AFT
VIDEO DET HPF AMP HPF MIX HPF VCC EQ AMP
1'ST DET
VCO
4.5MHz BPF
SIF TRAP
VIDEO OUT
VCO TANK
Fig. 13-34 IF Ssection Block Diagram
13-42
Samsung Electronics
13-8 OSD
The on screen display circuit consist of a character generator decoder, video mixer, sync separator and sync generator, sync detector circuit. The data is decoded and generates characters in syncro with composite video signal applied pin 49, 50. Also the sync detector circuit discriminates the presence of a video signal by detecting sync, if no sync is detected, a blue screen is displayed. In other word, the OSD circuit displays character on the video when there is a video signal or on blue screen when there is no video signal. (No sync).
IC601
37 38 4/2 fsc oscilator Sync signal generator CVin 49 Sync-tip clamp H V Background video signal Blue Background Super impose 47 CVout
Dot display control
Character data ROM (128 characters) AFCC 52 57 AFCLPF Control circuits (display position. blinking. etc.) registers On-screen display RAM AFC Display data readout control
H/V seperation
50 C-Sync Slice CVin2
Samsung Electronics
13-43
13-9 Input-Output
The external signals of DVD/VCR combo is inputed to the Video/Hi-Fi IC. VCR Block selects the input signal, and then it can record the selected input signal and output the signal to external port. IC801 is the switch that selects the AV output signal of DVD/VCR combo and finally output the signal to TV.
U11 DVD 2CH AUDIO PCM1753 JK801 REAR INPUT JACK (VIDEO / AUDIO L,R) JK701 FRONT INPUT JACK IC301 A/V (ONE CHIP) LA71207 IC601 VCR u-COM MN101DF10 IC801 VIDEO OUT SW MM1501 VIC1 DVD VIDEO SW LA73054 Fig. 13-36 Block Diagram <Table 13-4 : Output Video Signal Condition> IC801 MM1501 SM CONDITION PIN1 CTL HIGH (5V) LOW (0V) PIN2 OUT SIGNAL VCR VIDEO AT PIN 4 DVD VIDEO AT PIN 6 <Table 13-5 : Output Audio Signal Condition> IC501 HI-FI IC CONDITION CH L-CH INPUT SIGNAL LINE 1 (FRONT INPUT) LINE 2 (REAR INPUT) DVD BLOCK AUDIO LINE 1 (FRONT INPUT) L-CH LINE 2 (REAR INPUT) DVD BLOCK AUDIO INPUT PIN 7 9 12 69 71 74 77 80 Output A-signal is controled by IIC Pulse at 37, 38 pin OUT PIN IC501 HI-FI AUDIO LA72670BM JK801 REAR JACK "A/V OUT"
13-44
Samsung Electronics
13-10 DVD System Control

(1) Outline
The main micom peripheral circuit is composed of 8Mbit Flash Memory (U1) for Microcode and data save, 1Kbit EEPROM(KS24C040 IN VCR BLOCK) for permanent storage of data needed at power off, 64Mbit SDRAM (U4) for temporary data read and write. The Micom (U3, S5L5010X) mounted in main board analizes the key commands of front panel or instructions of remote control through communication with Micom (IC601 ; MN101DF10) of front and controls the devices on board to execute the corresponding commands after initializing the devices connected with micom on board at power on.
(2) Block Diagram
U5 Motor Driver (FAN8026)
IC601 VCR MICOM (MN101DF06)
U7 LEVEL SHIFTER (TC74VHCT125)
U3 MPEG DECODER CPU (S5L5010X) DATA BUS
IC603 EEPROM (KS24C040)
U1 1MB FLASH MEMORY (SST39VF080) 8Mbit = 1Mbyte
ADDRESS
Fig. 13-37
Samsung Electronics
13-45
13-11 RF
13-11-1 U3 (S5L5010X)
S5L5010X is combined with RF Block developed for DVD SERVO system. Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beam tracking error signal generation, DPD 1-beam tracking error, defect, MIRR output, Laser Power Control, etc.
13-11-1 (a) Basic Potentiometer

S5L5010X Uses 4.5V to 5.5V, 3.0V ~ 3.6V and reference voltage is 1.65V.
13-11-1(b) RF signal
Fig. 13-38 shows the flow of signal generated by the pick-up. RF signal detected from pick-up is converted into RF signal via RF interface and attenuators. A, B, C, D signals detected from pick-up are converted into FE, TE, DEFECT, ENV signals.
AGCP AGCB AGCC
144 RFSUM
GAIN_RFSUM -2 ~ 20 dB (2dB Step)
AGCACN AGCACP ABCD AGC AGCOP AGCON

AGC_ctrl
Anti_Peak AGC_LVL
Abcd_sel
M U X
RFAGCO EFMI
EFM silcer
EFM
Vref
AGCOP AGCON
RF EQ
EQF EQG
RFEQO
Vref
GCA
146 147 148
EQ VCPS EQ
Phase DETECTOR
LPF
GCA
MUX
GCA
+ +
EQ VCPS EQ
SPEED_SEL Vref
M U X
RFPEN-Sel
SBAD
149 GCA
GAIN_TE1
Phase DETECTOR
PD_LIMIT
LPF
E F
TBAL
154 155
TBAL GAIN_TE3
+ -
TE_OFST
MUX_TE
GAIN
170
TE
TZCI
150 151 152 153
GAIN_GCA
GCA GCA GCA GCA + + + +
TZCO
128
A1+C1
+ +
GAIN
TE
GAIN_FE
ABCDO
Gain & Current Control
PREF VREF RBIAS
167 169 168
Bias & 1/2 VCC
RFPEN
BandGap Reference
A1 B1 C1 D1
Gain & Offset

Offset Gain
ABCD
DEFECT
FCB
Mirr_sel Gain & Current Control

M U X
PDDVD 159 PDCD 158 LDODVD 156 LDOCD 157 ALC PreAmp PDADC SDAC TEO FEO
MIRRI MCP MCB
RF Peak, Bottom
163 165
MPE MPEO MPEI MBE
Fig. 13-38
13-46
Samsung Electronics
13-12 Servo
13-12-1 Outline
SERVO system of DVD is Composed of Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV SERVO (DISC Motor Control SERVO). 1) Focusing SERVO : Focuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance between object lens of Pick-up and disc (for surface vibration of disc). 2) Tracking SERVO : Make the object lens follow the disc track in use of tracking error signal (created from Pick-up). 3) SLED Linked SERVO : When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor moves slightly (and counteracts the incline). 4) CLV SERVO (DISC Motor Control SERVO) : Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).
13-12-2 Block Diagram

U3 S5L5010X
146 147 148 149 154 155 176 175 173 SPD-PWM SLD-PWM TRD
150 151 152 153
172
FOD
144 156 159 157 158
CN2 17 16 21 3 9 10 14 13 12 11 3 4 2 15 18 CN3 1 2 5 6 7 4 3 10 11 8 9
LED POWER GND S5L5000 S5L5000 TM+ TM1 SP+ SP-
26 25 27 28
13 14
U5 (FAN8026)
11 21 7
S5L5010X
OPEN CLOSE TM1 TM+ SP+ SP-
18 17 16 15
5 10
Fig. 13-39 Samsung Electronics 13-47
13-12-3 Operation
1) FOCUSING SERVO
(1) FOCUS INPUT The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up and down (at pin 172 of U3 during Focus SERVO ON.) At that time, S curve is output to pin 128 of U3. ABCDSUM (pin 164 of U3) signal, summing signal of A, B, C, D, is generated, and zero cross(1.65V) point occurs when S curve is focused and ABCD signal exceeds a preset,constant value. The focus loop is changed to closed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc. (these operations are same in CD and DVD).
Pin 172 of U3 (FOD)
Vref
Pin 128 of U3 (FE)
Vref
Pin 164 of U3 (RFO)
1.5V
Fig. 13-40 (2) PLAY When focus loop closes the loop during focus servo on, pin169 is controlled by VREF Voltage (Approx 1.65V).
2) TRACKING SERVO
(1) NORMAL PLAY MODE For DVD Composite : The signal output from A, B, C, D of Pick-up, the tracking error signal (pin170 of U3) uses the phase difference of A+C and B+D in U3. Then, it is output to U3 pin 173 via digital equalizer, and applied to the tracking actuator through U5. Pin 170 of U3 is controlled by VREF(approx. 1.65V) during normal play. Meanwhile, DVD repeats the track jump from 1 track to 4 track in inner direction at normal play (because dataread speed from disc is faster than data output speed on screen). For CD, VCD Receive the signal output through E, F of Pick-up, from pick up. The tracking error signal is similar to DVD.
13-48
Samsung Electronics
(2) SEARCH Mode : Search mode : Fine seek,(Moving the tracking actuator slightly little below 50 track) and coarse search, moving much in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is explained shortly. If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired count to move the tracking actuator via U3 pin 173 terminal(TRD).
3) SLED LINKED SERVO

Normal play mode Move SLED motor slightly by means of PWM signal in U3 pin 175, as the tracking actuator moves along with track during play. Control to move the entire Pick-up as the tracking actuator moves. Coarse serach mode In case of long-distance search (such as chapter serach), U3 uses MIRR and Global sense signal. Then, read ID and compute the existing track count after input of next track. If the existing track count is within fine seek range, tracking begins using fine seek.
4) CLV SERVO(DISC MOTOR CONTROL SERVO)

Input RF signal (from Pick-up) to U3 pin 144. Detect SYNC signal from RF in U3, and output PWM signal to U3 pin 176 for constant linear velocity.
Samsung Electronics
13-49
13-13 DVD Data Processor

13-13-1 Outline
The S5L5010X (highly-integrated device) includes the full front-end disc controller, back-end decoder functions as well as the host control CPU. The principal off-chip components include the disc drive with its optical pickup, tray, sled and spindle drivers and motors, 8Mbits of flash EPROM, 64Mbits of SDRAM, and the audio Digital-to-Analog converters some applications. In case of general disc play, the memory is almost filled up periodically. It is because Write rate to memory after disc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is reported by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after memorizing the last data read from disc until now. It takes some times to jump to the previous track and return to the original(jump location) again. The memory will have an empty space because A/V decoder reads out data of memory. When the memory has an empty space, where data can be processed and written and the pick-up correctly gets to the original location(before kick back location) again, it reads data again avoids the interrupt of data read previously. The basic operation repeats to perform as described above.
13-13-2 Block Diagram
CN2 (PICK UP)
U4
LDODVD
RF
U5 (FAN8026)
U3 S5L5010X SAMSUNG
SRQ SCLK RXD TXD RRQ
U7 Level Shifter
SRQ SCLK RXD TXD RRQ
IC601 MN101D10F VCR MAIN u-COM

SCL SDA
IC603 4Kbit EEPROM
54MHz
U1
Fig. 13-41 13-50 Samsung Electronics
13-14 Video
13-14-1 Outline
U3(A/V decoder) diverges from the 54MHz crystal, then generates VSYNC and HSYNC. Video signal converted into analog signal is outputted via amplifier of analog part.
Video data
CVBS CVBS Y C
CVBS
A/V Decoder S5L5010X U3
Y/R/V C/B/U CVBS/G/Y
LOW PASS FILTER (6MHz)
6dB AMP & 75ohm Drive
Y C Y Pb
VCR MAIN u-COM IC601
Pb Pr
LA73054 (VIC1)
Pr
Fig. 13-42 Video Output Block Diagram
13-14-2 Amplifier (VIC1: LA73054)

VIC1 is 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resitance. When mute of pin 5 is high active, if the pin is floating and connecte to power, the output signal is never ouputted. The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance (VR11~VR16).
Samsung Electronics
13-51
13-15 Audio
13-15-1 Outline
A/V decoder (U3 ; S5L5010X) is supply to DATA 0 for 2-channel mixed audio output. The audio data transmitted from A/V decoder (U3 ; S5L5010X) are converted into analog signal via audio D/A converter and outputted via post filter and amplifier. CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0. If DVD of multichannel Source disc, if is downmixed and transmit them to Data0. If you want to listen to the multichannel output, you have to connect digital output with AC-3 amp or MPEG/DTS amp.
Mixed Audio Output (2-Channel) U3 S5L5010X A/V Decoder DATA0 LRCK BCK U8 PCM1753 D/A CONVERTER POST FILTER POST FILTER AMP AMP L R
Fig. 13-43 Audio Output Block Diagram
13-52
Samsung Electronics
13-15-2 DVD Audio Output

Source Data Types : MPEG-1,-2, Dolby Digital, CD-DA, LPCM, WMA U4 (LOCAL DRAM) HOST or DVD/CD INTERFACE U3 (S5L5010X ; A/V DECODER)
AUDIO INPUT BUFFER Compressed Data WMA (MPEG, Dolby Digital), CD-DA, LPCM AUDIO DECODER (MPEG, DOLBY DIGITAL, CD-DA, LPCM, WMA
IEC-958/1937 OUTPUT PROCESS
IEC-958/1937 INTERFACE
RECEIVER or DECODER (IEC-958/1937)
2-Channel LPCM, Decoded Dolby Digital, Decoded MPEG, WMA
Uncompressed 16- or 24-bit LPCM samples at fs=44.1,48,96KHz 2-, 4, or 6CHANNEL OUTPUT PROCESS DIGITAL AUDIO INTERFACE AUDIO DAC
AUDIO OUTPUT BUFFER
Fig. 13-44 Audio Decoder and Output Interface Datapath
1) Compressed Data
The audio data inputted to U3 (S5L5010X) A/V decoder is divided into compressed data and uncompressed data. It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, WMA,etc. The compressed data inputted to U3 (S5L5010X) is converted into the uncompressed data of 2, 4, and 6 channels through U3 built-in audio decoder and is outputted to Data 0 through digital audio interface. The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 transmission data format compressed by U3 built-in IEC-958 output process.
2) Uncompressed Data
The uncompressed data is that data that isnt compressed, so it is called CD-DA, LPCM data. The 2 channels data is converted through audio decoder 2-channel data and Data 0 and are outputted in digital audio interface.Via IEC-958 output process, they are transmitted to digital amplifier or AC-3/MPEG/DTS amplifier built in the external digital input source with IEC-958/1937 transmission format.
Samsung Electronics
13-53
MEMO
13-54
Samsung Electronics
14. Reference Information

14-1 VCR Deck Operating Description
14-1-1 Features of Mechanism
The following items describe features of the mechanism in VCR. (1) This VCR uses 3-motor system consisted of a cylinder motor, capstan motor, and loading motor. A capstan motor is used to drive the reel and the driving force is transmitted throuch the belt capstan. The cassette loading, tape loading, and mode shift operation are performed by the loading motor. (2) The time duration from cassette-in to picture appearance is shortened by employing the loading drive mechanism (automatic transferring operation from the cassette loading to the tape loading by rotating the loading motor continuously), and by increasing the speed of the tape loading, etc (3) Employment of the full loading system shortens time required to shift the mode such as STOP to PLAY-BACK picture display.
14-2 Basic Configuration of Mechanism

As shown in Fig. 14-1, the mechanism of VCR is configured with five main blocks, and each operation is precisely controlled by the microcomputer built in the system control section. First, load a video cassette tape in VCR : (1) The cassette is automatically set on the reel disc. (2) The tape is pulled out from the cassette, and wrapped around the cylinder. (3) The cylinder turns in a constant speed rate synchronizing with the vertical Sync. signal of video signal. (4) The tape runs in synchronization with cylinder rotation and traces the video tracks precisely. (5) The running tape is taken up by the reel, the tape feeding side is given with a proper tension so that tape is not slacked. The above series of operations are performed under control of the system control section. The system control section also sends commands to each mechanism according to the operation buttons, thus the VCR is designed so that various operations such as recording, playback, special playback, FPS/RPS, and FF/REW, etc. are correctly performed. (Cylinder section) PG FG Cylinder servo Cylinder (Capstan drive section) Capstan Control head Cylinder servo Capstan servo FG
System control Switch-Detect Cam slider Tape loading Pinch lever Cassette holder (Front loading setion) FL cam gear Loading motor Reel sensor (Front loading setion) Tension post Reel brake Idle gear Tape sensor REC-inhibiting SW
(Loading motor drive section)
Fig. 14-1 Basic Configuration of Mechanism Samsung Electronics 14-1
Reference Information
14-3 Main Mechanism and Functions

14-3-1 Tape Path System
The tape come out from the supply reel (S) of the video cassette runs through paths shown in Figs. 14-2 and 14-3, and is taken up by the take-up (T) reel. (S stands for the supply reel, and T for the take-up reel, hereafter.) At S reel side (tape enterance side of the cylinder) against the cylinder, a tension post to allow the tape surface to contact with each head with a proper tension which assures stable running, an FE head which erases entire data of the tape, and an S guide roller which restricts tape motion in upward/downward direction are provided. In the same way, a T guide roller, audio head to record audio signals at upper side of the tape, control head to record and reproduce a control signal at lower side of the tape, and an audio erase head to erase only the audio signals and perform after-recording in parallel with the audio head are provided at T reel side. (tape exit side of the cylinder). The guide parts marked with asterisks (*) are equipped with the adjusting mechanism to stabilize the tape running or to record and reproduce the signals precisely.
S guide roller S slant guide T slant guide
T guide roller
ACE head base ACE head position adjusting screw Pinch roller Tension lever & tension post RPS (released by FF/REW mode) No.9 guide (pulled out at RPS model) Capstan motor No.8 guide ACE adjusting screw Tilt Azimuth Height ACE head position adjusting slite
FE head
Cylinder
Fig. 14-2 Tape Path System

Cylinder S slant guide Tension post * T slant guide ACE head Capstan No.9 guide
Pinch roller FE head * S guide roller * * No.8 guide T guide roller
show the locations to be adjusted.
Fig. 14-3 Guide Path System 14-2 Samsung Electronics
14-3-2 Reel Drive System

The reel drive system consists of a capstan motor as a drive power source, belt as a power transmission mechanism, clutch mechanism, idle gears, and a reel disc. Selecting of forward rotation or reverse rotation is carried out by an idle gear which changes its rotating direction according to rotating direction of the clutch holder. Reel take-up torque is selected according to an operation mode. In the record, playback, fps, rps modes, the reel take-up torque is controlled by the clutch mechanism, thereby the tape fed by the capstan is taken up with a proper torque. In the FF and REW modes, the clutch enters a direct connecting status in which the clutch mechanism does not operate and the capstan drive torque is transmitted without reduction, so a high speed taking-up is enabled.
S slant guide S guide roller T guide roller T slant guide Video tape (Magneticside) ACE head No. 8 guide Cylinder Pinch roller Capstan No. 9 guide Tape guide
FE head
Tension post
Tape guide
S (Supply) reel disc Idle gear Capstan belt Clutch gear (Clutch mechanism)
T (Tape-up) reel disc
Fig. 14-4 Reel Drive System
Samsung Electronics
14-3
14-4 Basis of the Mechanism

14-4-1 Front Loading
Cassette IN
(1) When a video cassette is inserted into the cassette holder and pushed furthermore, FL arm lever is rotated by motion of the cassette holder. The rotation of FL arm lever makes the horizontal moving of FL drive slider. (2) When the information of Switch Detect is transmitted to the microcomputer, the loading motor starts to rotate. (3) The rotation is transmitted in a sequence shown below : Loading motor - worm gear - worm wheel FL Cam Gear - FL Drive Slider - Arm Lever Cassette Holder (4) The video cassette is horizontally moved. (5) The cassette tape is vertically moved. In this case, the cassette lid is opened. (6) The cassette tape is set on the reel disc, and loading operation completes. (7) The cassette tape is loaded. (8) The status becomes full loading. (9) When the cassette is out, the reverse steps of the above procedure are carried out.
Switch Detect ON Microcomputer Loading Motor ON Loading Motor Worm Gear Worm Wheel FL Cam Gear FL Drive Slider Arm Lever Cassette Holder Cassette Horizontal Motion Cassette Vertical Motion Cassette Door Open Microcomputer Cassette Loading Complete Tape Loading Full Loading Mode
Fig. 14-5 Arm lever
Loading motor
F L drive slider
F L camgear Fig. 14-6 Drive Transmission Path
Worm wheel
14-4
Samsung Electronics
14-4-2 Cassette loading/unloading Modes

When a cassette is entered in the VCR, the cassette is set on the reel disc by the front loading mechanism. In this case, the tension post, loading tape guide, capstan motor, and the No.9 guide are positioned inside of the tape in the cassette case.
Tension post T guide roller ACE head T slant guide No. 8 guide Cylinder Pinch roller Capstan No. 9 guide Tape guide S guide roller
S slant guide FE head
Tape guide
S (Supply) reel disc Idle gear
Capstan belt Clutch gear (Clutch mechanism)
Fig. 14-7 Cassette IN/OUT Mode
Samsung Electronics
14-5
14-4-3 Tape Loading

A full loading system is employed. In the full loading system, the tape loading starts at the same time when the cassette loading operation has completed and cassette has been mounted, and the tape is pulled out, wrapped around the cylinder and the mechanism enters the stop status under this condition.
Cylinder Guide post FE head Guide post
S guide roller
T guide roller ACE head No. 8 guide Pinch roller Capstan
Tension post No. 9 guide Tape guide
Tape guide
Fig. 14-8 Tape Loading
14-4-4 Playback Standby Mode

In the full loading system, the tape loading starts at the same time when the cassette mounting has completed, the mechanism shifts to the playback position, and enters the standby status with keeping tape wrapped around the cylinder. In this case, tape tension applied to the cylinder is decreased to protect the tape and to prevent the tape from scratches.
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Samsung Electronics
14-4-5 FF/REW Modes

The reels enter a free status by rotating the loading motor to go to FF/REW position. In this case, the capstan motor rotates in colck-wise direction in the REW mode. The idle gear is swung rightward or leftward according to the rotating direction of the capstan motor. As a result, the T reel rotates in the FF mode or the S reel rotates in the REW mode, thus taking up the tape to the rotating reel.
S slant guide T guide roller T slant guide Video tape (Magneticside) ACE head No. 8 guide Cylinder Pinch roller Capstan No. 9 guide Tape guide
S guide roller
FE head
Tension post
Tape guide
S (Supply) reel disc Idle gear
Capstan belt Clutch gear (Clutch mechanism)
Fig. 14-9 FF/REW Mode
Samsung Electronics
14-7
14-4-6 Record/Playback Modes

When the record or playback button is pressed, the tape is fed by the rotation of the capstan motor. In this case, a tension post touches the tape and braking froces created by the band brake linked with the tension post is applied to the S reel, thereby stabilizing the tape tension. The tape fed by the capstan is taken up around the T reel. The T reel is driven with a constant torque generated by transmitting rotation of the capstan motor to the clutch mechanism.
S guide roller S slant guide T guide roller T slant guide Video tape (Magneticside) ACE head No. 8 guide Cylinder Pinch roller Capstan No. 9 guide Tape guide
FE head
Tension post
Tape guide S (Supply) reel disc Clutch gear (Clutch mechanism) Capstan belt T (Tape-up) reel disc
Idle gear
Fig. 14-10 Record/Playback Mode
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Samsung Electronics
14-5 System Control

In the VCR, complex mechanism, video, audio, servo circuits, etc. must be operated in specified timings matched each other. The system control circuit performs entire controls for the VCR. An automatic stop function is also provided to protect important tape if a trouble occurs on the complex mechanism and the electrical circuits. For this purpose, status of each part of the mechanism is always monitored with various sensor switches, and the microcomputer controls collectively the unit so that the best condition is kept. Moreover, the microcomputer controls signal switchings for each circuit according to the mechanism status.
Main microcomputer Loading motor control (Voltage, direction)
Remote control
Remote
Loading motor drive
M Loading motor
broken safety tab REC-inhibition Mode sensor (Detecting of mechanical mode position) (Detection of cassette-in/cassette-out) Cassette Tape in Switch-Detect Mode SW
reel retation Take up Abnormal FF/REW speed control Supply Key matrix Front button Input Abnormal reel retation FF/REW speed control
T reel sensor S reel sensor
Current control Capstan motor control (Speed direction) Capstan motor drive
M Capstan motor
FG pulse CTL pulse (Linear time counter) REC control Cylinder motor control POWER ON/OFF REC mute TV/VCR FG/PG pulse Cylinder motor drive
FG
AUDIO VIDEO TUNER
IIC BUS
Control
M Cylinder motor PG FG
Fig. 14-11 System Control Block Diagram
Samsung Electronics
14-9
14-6 System Control and Mechanical Operations

14-6-1 Mechanical Operation
The operation of mechanism is performed by rotation of the loading motor, and the transmission path of the operation is as shown in Fig. 14-12. Loading Motor
FL cam gear
FL drive slider
FL arm lever
Cassette holder
Cam slider
Mode SW No.9 guide Loading drive gear Pinch drive lever Tension drive lever S brake T brake Up/Down lever Fig. 14-12 Transmission Path of Operation S, T slider Pinch lever Tension lever
Fig. 14-14 shows each mode and mechanism status in each mode concerned with the rotation of the FL cam gear or cam slider shift. The mechanism operates as shown in Fig. 14-13 according to the timing chart in Fig. 14-14. Note : The Switch Detect is actuated by the rotational moving of Lever FL Arm-R and Switch on or off by insertion or ejection of a cassette.
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Samsung Electronics
<Top View>
T slider assembly Pinch assembly
Loading motor
S slider assembly
F L cam gear No. 9 guide lever
Tension lever
Joint lever
S brake (off)
T brake (soft) Idle lever assembly
(4) To simplify wiring and others, the electrical components relating to operation of the mechanical deck, such as sensors, mode switch, servo microcomputer, etc. are mounted on the PCB arranged all over the bottom side of the mechanical deck. Fig. 14-13 Mechanical Operation <Bottom View> T loading lever assembly
Tension drive lever
Loading motor
Loading drive gear F L cam gear Joint gear 1
Cam slider
T brake Pinch drive lever Joint gear 2
S brake
Tension drive lever
Fig. 14-14 Mechanical Operation Samsung Electronics 14-11
Fig. 14-15 Mecha Timing Chart (Kaiser-II)
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Samsung Electronics
(1) There are two STOP modes and two FF/REW modes. 1) STOP 1 This mode is performed when PB and FF/REW is not done for 5 miniute at power on. The small load is given to S REEL DISC and T REEL DISC. And the cylinder motor is stopped. 2) STOP 2 This mode is performed when you press the stop button as performing FF/REW. The large load is given to S REEL DISC and T REEL DISC. 3) FF/REW 1 This mode is performed when The tape load is small during performing FF and reducing speed. The tape load is large during performing REW. The small load is given to S REEL DISK and no load is given to T REEL DISC. 4) FF/REW 2 This mode is performed when The tape load is large during performing FF. The tape load is small during performing REW and reducing speed No load is given to S REEL DISK and the small load is given to T REEL DISK. (Cf) According to acceleration, deceleration, and the location of tape, tension control which is caused by converting FF/REW 1 and FF/REW 2 each other is performed during FF or REW. (2) The condition of S Brake and T Brake at each mode. < S BRAKE> 1) OFF BRAKE (Unloading completion, RPS, PLAY, FF/REW 2) - S BRAKE is detached from S REEL DISC completely. So S REEL DISC is free.
Fig. 14-16 2) SOFT BRAKE(during LOADING, STOP 1, FF/REW 1) - The small load is given to S REEL DISC.
Fig. 14-17 Samsung Electronics 14-13
3) MAIN BRAKE (STOP 2) - The large load is given to S REEL DISC.
Fig. 14-18 < T BRAKE> 1) OFF BRAKE (PLAY, FF/REW 1) - T BRAKE is detached from T REEL DISC completely. So T REEL DISC is free.
Fig. 14-19 2) SOFT BRAKE (UNLOADING Completion ,STOP 1, FF/REW 2 ) - The small load is given to T REEL DISC.
Fig. 14-20
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Samsung Electronics
3) REVERSE SEARCH BRAKE (RPS) - The medium load is given to T REEL DISC.
Fig. 14-21 4) MAIN BRAKE (on the loading, STOP 2) - The large load is given to T REEL
Fig. 14-22
Samsung Electronics
14-15
14-6-2 Mode Sensor Drive

The mode sensor converts each mode of the mechanism into an electrical signal and transmits it to the microcomputer. The FL cam gear is rotated by the loading motor, and the cam slider slides after operation of the cassette holder. Then the mode switch also rotates synchronized with the cam slider and outputs a signal corresponding to each mode. This signal is transmitted to the microcomputer and the microcomputer stops the cam slider at a specified angle, thus establishing each mode. The IC601 controls Capstan Motor Drive IC for each mode to make the loading motor rotate in forward or reverse direction, thereby setting the mechanism at a specified position. The mode switch develops three outputs A, B and C. The circuit configuration of the mode sensor drive is shown in Fig. 14-23. CN604 1 L.M B+ L,M CTL 58 AL 5V LM F/R 59 AL 5V 8 9 10 CAPSTAN MOTOR DRIVE IC ~ ~ 1 2
Load (+)
IC601
M
Load (-)
Loading motor
SW603 Mode SW A 64 B 63 C 62 A B C
Fig. 14-23 Mode Sensor Drive
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Samsung Electronics
14-6-3 Operations in Each Mode

[1] Cassette loading & Tape loading mode <Cassette loading> (1) The FL cam gear is in the Cassette unloading (position I)position, and the cassette holder is in the out status (Switch Detect OFF). Under this condition, each motor is stopped. (2) Status of the mechanism is as follows. 1) S.T guide rollers, tension post, No.9 guide are in unloading status and housed in the reel disc side. 2) S brake is released and T brake is in soft brake status. 3) The clutch holder assembly is in clutched status and idle lever assembly is enabled to be engaged with both S and T reel discs. (3) When a cassette is inserted, the lock lever of cassette holder is released from the stopper, the cassette holder moves, the FL arm lever rotates, and the FL Drive Slider slides, thereby Switch Detect OF => ON. (4) IC601 controls Capstan Motor Drive IC to rotate the loading motor in forward direction, and move the cassette holder. At the same time, the capstan motor rotates in the reverse direction and moves the cassette down (vertical motion) while rotating the S reel disc. (5) The cassette lid opens when the vertical motion starts. (6) When the vertical motion has completed and the cassette is mounted, the capstan motor rotates in the reverse direction. At that time the position a is detected with the cam slider shifted and the loading/capstan motors are stopped. After 300msec the loading motor rotates in the forward direction and enters the tape loading operation. T slider assembly
S slider assembly
Tension lever
No. 9 guide lever
S brake (o ff)
T brake (soft) Idle lever assembly
Fig. 14-24 Cassette-Loading Mode (Position I)
Samsung Electronics
14-17
<Tape loading> (1) After slot-in operation (cassette loading), FL cam gear rotates and the cam slider starts shifting, and a loading gear is ready to start. Under this condition, the mechanism status is as follows : 1) The T main brake actuates so that tape does not com out from the T reel during the loading operation. (2) The cylinder starts to rotates after the loading motor is rotated. (3) When the cam slider reaches the position II (loading/unloading modes), the mechanism enters the loading status and operates as described below. 1) S,T sliders are moved through the loading drive gear and trun on the tension post. 2) The No. 9 guide is loaded. 3) The pinch roller is loaded up to front of the capstan. 4) The head cleaner is actuated during loading operation. 5) The S soft brake is actuated. (4) When the cam slider passes through the position III, and detects the position IV (playback standby mode), the loading motor stops. Under this condition, the mechanism status is described as below : The pinch roller is pressed to the capstan. The No.9 guide is stored in the cassette. The tension post touches the tape, band brake force is applied, and the tension servo brake mechanism actuates. Brakes for the reel discs are all off.
T slider assembly
S slider assembly
Tension lever
No. 9 guide lever
S brake (off)
T brake (soft)
Fig. 14-25 Tape Loading Operation (Position II)
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Samsung Electronics
<Playback Stand-by (Stop) mode> (1) The tape loading operation completes and the loading motor stops. (2) In the same way as in the playback mode, the capstan motor rotates in forward direction and the T reel disc takes up the tape. (For more details, refer to the playback mode.) (3) After running the tape for 0.6s, the mechanism rotates the capstan in the reverse direction for 0.3s to slack the tape properly with pinch roller pressed. (4) If nothing is operated for about 5 minutes, the loading motor rotates in the forward direction and the cam position reaches the position V, and both the loading motor and the cylinder motor stop. (5) During this period, the video and audio systems are in the same status as in the stop mode. [2] Tape unloading & Cassette unloading <Tape Unloading> (1) When the [EJECT] button is pressed in the stop mode, the mechanism enters the eject mode. (2) IC601 controls cylinder motor drive IC to make the cylinder motor rotates. (3) IC601 makes the loading motor rotate in the reverse direction, and shifts the cam slider. 1) The mechanism components move in the reverse direction against the loading operation. (4) When the cam slider reaches the position II, IC601 makes the capstan motor rotate in the reverse direction (LP X11) and takes up the tape at a specified torque using the clutch mechanism. (5) When the cam slider reaches the position I, it brakes the capstan motor to stop, and then stops the loading motor after 230ms passed. <Cassette unloading> (1) Furthermore, IC601 makes the loading motor rotate in the reverse direction and also the capstan motor in reverse direction, applies braking force to the capstan motor by detecting the Switch-Detect ON --> OFF, and the capstan motor stops. (2) IC601 makes the loading motor stop after 200ms passed from sensing OFF. (3) Also IC601 makes the loading motor rotate in the forward direction after 120ms passed. (4) IC601 makes the loading motor stop after 100ms passed from loading motor rotating in the forward direction.
Samsung Electronics
14-19
[3] Stop mode (1) The cam slider is in the stop mode (position V) and each motor stops. (2) The mechanism status is as follows : 1) The S, T guide rollers are in the loading status. 2) The pinch roller is kept away from the capstan. 3) The tension post is shifted to the reel disc side. That is, the band brake is released from the ON status and the back tension is also released. 4) The S, T soft brakes are being applied. T slider assembly Pinch assembly (off)
S slider assembly
Tension lever (off)
No. 9 guide lever (off)
S brake (off)
T brake (soft)
Fig. 14-26 Stop Mode (Position V)
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Samsung Electronics
[4] FF/REW mode (1) When the [REW] button is pressed in playback standby mode, the mode enters the FF/REW mode. (2) IC601 controls Capstan Motor Drive IC and makes the loading motor rotate in the forward direction. The loading motor stops when the cam position reaches the position VI, VII (FF/REW mode). The mechanism status is as follows : 1) The pinch roller is OFF. 2) The No. 9 guide is once loaded but immediately returned. 3) The tension post is moved to the reel disc side. That is, the band brake is released from the ON status and the back tension is released. 4) The clutch holder assembly is in the direct status and the capstan driving force is directly transmitted to the reel disc. 5) Brakes for the reel discs are as follows : VI position FF/REW 1 mode (S Brake : soft brake, T Brake : off) VII position FF/REW 2 mode (S Brake : off, T Brake : soft brake) (3) IC601 makes the capstan motor rotate in the forward direction and the idle gear transmits the rotation to the S/T reel discs to take up the tape. [5] FF/REW to STOP mode (1) When the [STOP] button is pressed in the REW mode, the mechanism enters the playback standby mode. (2) IC601 makes the loading motor rotate in the reverse direction and stops at the position V. With this mode shift, the mechanism actuates S, T main brakes to stop the tape. Then, the capstan motor also stops by braking force 70ms after detecting e position. (3) IC601 makes the loading motor rotate in the reverse direction again and stops the loading motor when the cam slider reaches the position IV (playback mode), thus setting the playback standby mode.
T slider assembly Pinch assembly (off)
Tension lever (off)
S brake (off)
T brake (soft brake)
Fig. 14-27 FF/REW 2 Mode (Position VII)
Samsung Electronics
14-21
[Playback mode] (1) When the [PLAY] button is pressed in the stop mode, the mechanism enters the playback mode. (2) IC601 controls cylinder motor drive IC and rotates the cylinder motor. (3) IC601 controls Capstan Motor Drive IC to rotate the loading motor in the reverse direction and stops the motor when the cam slider reaches the position IV (playback mode). (When operating from the playback standby mode, the cam slider has been already on the position IV.) The mechanism works as follows : 1) The pinch roller moves toward the capstan side and press fits the capstan. 2) The No.9 guide is loaded once and then returned immediately. 3) The tension post touches the tape, the band braking force is applied, and the tension servo mechanism works. 4) The clutch holder assembly enters clutched condition. 5) S,T brakes are released. (4) IC601 makes the capstan rotate in the forward direction and feeds the tape. The idle gear transmits the rotation to the T reel disc and the reel disc takes up the tape at a constant torque by the clutch mechanism. (5) IC601 controls the video circuit and switches the playback screen. (6) The recording speed data identified by IC601 is displayed in the Led module.
Pinch assembly (on)
Tension lever (on)
S brake (off)
T brake (off)
Fig. 14-28 Playback Mode (Position IV)
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Samsung Electronics
<Still mode> (1) When the [PAUSE] button is pressed in the playback mode, the mechanism enters the still mode. The cam slider is in the position IV (playback mode), the cylinder motor is rotating, and the capstan motor is rotating in the forward direction. (2) IC 601 controls the audio circuit and actuates the audio mute function. (3) The capstan motor enters the intermittent operation mode and then stops. (4) IC 601 maintains the recording speed data just before the still operation. (5) In the slow mode, the capstan motor rotates continuously in the intermittent driving. <FPS mode> (1) When the [FF] button is pressed in the playback mode, the mechanism enters the FPS mode (forward picture search). The cam slider is in the position IV (playback mode), the cylinder motor is rotating, and the capstan motor is rotating in the forward direction. (2) IC 601 controls the audio circuit to actuate the audio mute operation. (3) IC601 makes the capstan rotate at 7 times for SP, 21 times for SLP to feed the tape, respectively. The tape is taken up at a constant torque by the clutch mechanism. (The mechanical operation is the same as that in the playback mode.) (4) The recording speed data identified by IC601 is displayed on the Led module.
Samsung Electronics
14-23
<RPS mode> (1) When the [REW] button is pressed in the playback mode, the mechanism enters the RPS mode. The cam slider is in the position IV (playback mode), the cylinder motor is rotating, and the capstan motor is rotating in the forward direction. (2) IC601 controls the audio circuit to actuate the audio mute operation. (3) IC601 controls Capstan Motor Drive IC to make the loading motor rotate in the reverse direction. After 180ms the loading motor stops for 250ms. During the mode shift operation, the mechanism rotates the capstan motor in the forward direction for a constant time so that the tape is not slackened. (4) When the cam slider reaches the position c (loading motor stoped for 250ms), the capstan motor is rotated in the reverse direction for a constant time, and the idle gear is swung toward the S reel disc side. Then, the loading motor rotates in reverse direction and shifts to the position III (RPS mode). When the cam slider reaches the position III (RPS mode), the loading motor stops. The mechanism status is as follows : 1) The No.9 guide is loaded. 2) The tension post is separated from the tape. 3) The T soft brake is turned on. The cpastan motor rotates in the reverse direction at 7 times for SP, 21 times for SLP to feed the tape in the REW direction, respectively. At the same time, the idle gear transmits the rotation to the S reel disc and the S reel disc takes up the tape by the clutch mechanism. (5) The recording speed data identified by IC601 is displayed on the Led module.
Pinch assembly (on)
Tension lever (off)
No. 9 guide lever (on)
S brake (off)
T brake (RPS brake)
Fig. 14-29 RPS Mode (Position III)
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Samsung Electronics
[7] REC mode <REC mode> (1) When the [REC] button is pressed in the stop mode, the mechanism enters the REC mode. (2) The cylinder motor starts and then the loading motor rotates in reverse direction. The cam slider reaches the position IV (playback mode). The tape is taken up at a constant torque. The mechanism operations are the same as those in the playback. (3) IC601 controls the audio circuit and video circuit to set the record enable mode. (4) Recording mute is released, thus setting the recording status. The CTL signal is output for recording. <REC PAUSE mode> (1) When [PAUSE] button is pressed in the REC mode, the mechanism enters the REC pause mode. (2) IC601 controls the audio circuit and the video circuit, and releases the record enable mode and performs the rewinding for synchronous editing. (3) After completion of the rewinding for synchronous editing, the cam slider is in the position IV (playback mode), the cylinder motor is rotating, and the capstan motor and the loading motor stop.
Samsung Electronics
14-25
14-7 Introduction to DVD

14-7-1 The Definition of DVD
DVD is the next generation medium and is the acronym of the Digital Versatile Disc or thr Digital Video Disc, which maximizes the saving density of the disk surface using the MPEG-2 compression technology to enable the storage of 17G bytes of data on the same size CD. 1) 7 times the storage capacity of the conventional CD - Minimized the track pitch and pit size to 1/2 of conventional CD. - Uses red laser with short-wavelenght of 650nm (635nm). DVD Vs. CD-ROM CD-ROM Disc Thickness Lens NA Laser wavelenght Track pitch Capacity Track structure 1.2mm 0.45 780um 1.6pm 0.65GB Pit train CD-R/RW 1.2mm 0.45(0.5) 780um 1.6pm 0.65GB Groove DVD-ROM 0.6*2mm 0.6 650um 0.74pm 4.7GB Pit train DVD-R/RW 0.6*2mm 0.6 650um 0.74pm 4.7GB Groove DVD-RAM 0.6*2mm 0.6 650um 0.615pm 4.7GB Land/Groove
2) Disc Formats DVD consists of two 0.6mm discs attached together, enabling access to the upper and lower side of the disk, and 4 sides could be used at maximum.
Single Layer : 4.7GByte Label Polycarbonate Bonding layer Reflective layer Polycarbonate
Dual Layer : 8.5GByte Label Polycarbonate Reflective layer Bonding layer Semi-reflective layer Polycarbonate Dual Side Dual Layer : 17GByte Polycarbonate Semi-reflective layer Reflective layer Bonding layer Reflective layer Semi-reflective layer Polycarbonate
Dual Side Single Layer : 9.5GByte Polycarbonate Reflective layer Bonding layer Reflective layer Polycarbonate
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Samsung Electronics
14-7-2 DVD Types

FORMAT DVD-Video DVD-ROM DVD-Audio DVD-R TYPE Playback Only Read Only Playback Only 1 Time Recording Rewritable DVD-RAM (more than 100,000times) Rewritable DVD-RW (About 1000times) a separated read-write access more like phonograph than a hard disk. read-write access Similar to DVD-RAM except than its technology features APPLICATIONS High quality image and sound for movies and other video media. Multi-functional, multi-media software that requires large storage capacity. High quality sound that exceeds the CD, multi-channel Audio. As with CD-R, write only once This can be virtually used as hard-disk, with a random
Samsung Electronics
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14-8 DVD-Video Fromat

14-8-1 Main Features
1) Able to store up to 160 minutes of Movie by utilizing the MPEG-2 compression technology. ( Aver. 133min.) 2) Enables more than 500 lines of horizontal resolution. (Class corresponding to the Master Tapes used in broadcasting stations) 3) Provides Dolby Digital 5.1ch Surround 3D sound, which enables theater quality sound (NTSC area). For PAL areas, 1 of either MPEG-2 Audio or Dolby Digital must be selected. 4) Multi-Language Able to store up to 8 languages of dubbing. Able to store up to 32 subtitle languages. 5) Multi-Aspect Ratio 3TV Mode alternatives ; 16:9 Wide Screen (DVD Basic)/4:3 Pan & Scan/Letter Box. 6) Multi-Story Possible to implement Interactive Viewing which enables the user to select the scenario. 7) Multi-Angle Able to view the camera angle you selected among the scenes recorded with multiple camera angles. Note ; The above media features must have the DVD Title that contains the appropriate contents to function properly.
15-8-2 Audio & Video Specifications

Classification Compression Pixel VIDEO Horizontal resolution Compression rate Transmission speed TV aspect Audio Recording type AUDIO Transmission rate Channel Sampling frequency DVD-Video MPEG-2 720 x 480 Max. 500 Lines 1/40 Max. 9.8Mbps (variable) 16:9 / 4:3 Max. 8 streams Dolby Digital 448Kbps/stream 5.1CH/stream 48KHz Linear PCM 6.144Mbps/stream 8CH/stream 16, 20, 24Bit/48, 96KHz Video-CD MPEG-1 352 x 240 Max. 250 Lines 1/140 1.15Mbps (fixed) 4:3 2CH stereo MPEG-1 Layer 2 224Kbps 2CH 16Bit/44.1KHz 4:3
2 Analog CH. 2 Digital CH. (16Bit/44.1KHz)
LD Analog Max.420 Lines Analog
or
1 Analog CH. 1 Stream of Dolby Digital 2 Digital CH. (16Bit/44.1KHz)
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14-8-3 Detailed Feature

DVD-Video Feature 1 When Developing the DVD Software, various addition and modification is possible.
As the storage capacity increases, the DVD-Video separates the main data and the additional data such as the Multi-Function into different data areas, enabling the control of time-data ratio to provide the format that enables the flexible Software development 1 Movie (3.5Mbps) + Subtitle (1 Language) + Surround Audio (1 Language) = 160min storage (4.673Gbytes) 1 Movie (3.5Mbps) + Subtitle (4 Language) + Surround Audio (4 Language) = 160min storage (4.680Gbytes) 1 Music Video (4Mbps) + 2ch High quality Audio (96kHz/24bit) = 72min storage (4.648Gbytes)
DVD-Video Feature 2
Application of the MPEG-2 compression technology.
DVD-Video uses the variable compresion technology, the MPEG-2 to compress the moving image optimally, minimizing the Data loss to Provide a clear, natural screen while increasing the storage time.
DVD-Video
MPEG-2 (Variable compression : Max. 1/40) - Field unit compression. - Compression rate change according to the amount of Data. - Differentiates the still image and the moving image compression rate, reducing Data loss and enables efficient compression.
Amount of data
Time
Amount of data Loss area
Video-CD
MPEG-1 (Fixed compression : Max. 1/140) - Frame unit compression. - Compresses all data using the same ratio. Fast movements are jagged, and unnatural
Time
Samsung Electronics
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DVD-Video Feature 3
High quality surround audio.
DVD-Video can store the audio using the 5.1ch Dolby Digital compression or the advanced Liner PCM method, providing the better-than-CD quality and theater like audio quality. DTS (Digital Theater System) Home theatre and music playback in the home, DTS provides high quality 5.1-channel surround sound with many extras not offered by other consumer formats. As well as handling DTS-branded releases from a growing number of music labels and consumer software producers, DTS provides enhanced 6.1 matrix and DTS 6.1 discrete decoding that envelopes the listener in sound. DTS technology is featured in a wide cross section of receiver/pre-amplifiers, DVD players and and add-on components from leading consumer audio vendors Dolby Digital (AC-3) - Unlike the traditional Dolby pro-Logic method, the Dolby Digital method separates all 5 main channels (Front L/R, Center, Surround (Rear) L/R)and the Sub woofer to provide live surround audio. - Using the Down Mix method, the conventional Dolby Pro-Logic and Stereo are all compatible. - Each separated channels are played back at CD quality sound. (Frequency band: 20Hz ~ 20KHz) Linear PCM (Pulse Code Modulation) - Provides the high quality Digital sound without the audio data compression. - Various Digital Recordings are possible as shown in the table to the right. Sampling Frequency Bit Rate 16bit 48KHz 20bit 24bit 16bit 96KHz 20bit 24bit Dolby Digital compatible Audio Mode Channel Format Audio Coding Mode 1/0 2/0 3/0 2/1 3/1 2/2 3/2 O O O O O O O O O L Front C O O O O O O O O O Mono Mono O O Surround R Surround (Rear) L R Mono Stereo Remark
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Samsung Electronics
DVD-Video Feature 4
Multi-Language
Audio Dubbing - Max. 8 Languages Subtitle - Max. 32 Languages. Capable of storing, and selectiong. Linear PCM (Pulse Code Modulation)
DVD-Video Feature 5
Multi-Aspect
Unlike the conventional VCD or LD, DVD-Video has the default of 16:9 Wide, and can be viewed using the conventional 4:3 TV, enabling the expansion of viewer selection capabilities. - 16 : 9 TV : Wide Mode (16:9 Wide Full Screen) - 4 : 3 TV : Letter Box Mode, Pan & Scan Mode
16:9 Wide
4:3 Pan & Scan
4:3 Letter Box
Note ; This function is disc-dependent, may not work on all DVDs.
DVD-Video Feature 6
Multi-Angle
Up to 9 angles of view may be stored, enabling the viewer to select a specific viewpoint at a given time. --> Especially, for the Music Video and Sports Title, this provides a more lively image of the scene.
Note ; This function is disc-dependent, may not work on all DVDs.
Samsung Electronics
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DVD-Video Feature 7
Multi-Story
DVD-Video provides the enviroment suitable for the bi-directional Software develoment, providing multiple scenarios. This feature enables the Multi-Story function.
OPTION
Parental Lock
For the titles that are not suitable for children viewing, Parental Locks are set, requesting user defined passwords for viewing Parential Locks may be set on specific frames of the Title, enabling the player to skip those frames during playback.
COPYRIGHT
Regional Code & Macrovision
Classify the world into 6 regions, and if the DVD Title and the Players Reginal Code do not agree, playback is prohibited. Regionnal Coding is optional for the Soft developers (Region 0 All Code), but the Hardware developers must adopt the appropriate regionnal code for sale. - Region 1 : The United States and its territories, Canada. - Region 2 : Europe, Japan, Greenland, Egypt, South Africa, the Middle East. - Region 3 : Taiwan, Hongkong, Korea, South East Asia. - Region 4 : Mexico, South America, Australia, New Zealand. - Region 5 : Russia, Eastern Europe, India, Africa. - Region 6 : China. - Region 0 : Worldwide (All Code)
Adoptation of the Macrovision System disables the copying on to other media.
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Remark
DVD-Video Authoring Process
The image quality of the DVD-Video may vary accoring to the quality of the Master and the Authoring Process - The image quality of the DVD-Video varies according to the Digital Mastering Source such as the conventional LD, VCD, or Original Film. - Different Authoring Process are used accoring to the Software developers, and this may affect the DVD image quality. Authoring Process bit stream
Video/Audio Master
MPEG-2 Encoding
Disc Production
bit stream
Surround Audio Master
AC-3/MPEG Audio Encoding
Video/Audio Subtitle Multiplexing
Cutting Master
Subtitle Master
Subtitle Encoding
bit stream
Authoring Process
Samsung Electronics
14-33
MEMO
14-34
Samsung Electronics

Samsung DVD v5600 v6600 SM

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DVD-VCR COMBINATION

SERVICE MANUAL DVD-V5600 / V6600

Samsung Electronics Co., Ltd. MAR. 2006 Printed in Korea AK82-01065A

3. Alignment and Adjustments

4. Disassembly and Reassembly

5. Trouble Shooting 6. Exploded View and Parts List

5-1 ~ 5-34 6-1 ~ 6-12

7-1 ~ 7-10 8-1 ~ 8-6

9. Wiring Diagram 10. PCB Diagrams

9-1 ~ 9-2 10-1 ~ 10-8

11. Schematic Diagrams

12-1 ~ 12-12 13-1 ~ 13-54

14. Reference Information

IMPORTANT SERVICE GUIDE

VCR MAIN PCB Fig. 1

Fig. 1-1 AC Leakage Test

Exposed Metal Part

Fig. 1-2 Insulation Resistance Test

1-2 Servicing Precautions

1-2-1 General Servicing Precautions

1-2-2 Insulation Checking Procedure

1-3 ESD Precautions

1-4 Handling the optical pick-up

1-5 Pick-up disassembly and reassembly

SOLDER LAND 2 POINTS SHORT

2-2 Chassis Product Specification

VR7147(47key-Mullti) VR7147(47key-Mullti) VR6144(44key-Multi) VR6144(44key-Multi)

2-3 Option Product Specification

Model Standard of DVD-V5600/XAX

Batteries for Remote Control

Model Standard of AC43-12002H DVD-V5600/XAX S.N.A

Model Standard of DVD-V5600/XAX

Model Standard of DVD-V5600/XAX

Model Standard of DVD-V5600/XAX

3. Alignment and Adjustments

Alignment and Adjustments

3-1-1(b) TEST location for adjustment mode setting

Short-Circuit for few seconds and release. (Just one time)

Fig. 3-2 VCR Main PCB (Top View)

Alignment and Adjustments

3-1-2 Head Switching Point Adjustment

3-1-3 NVRAM Option Setting

<Table 3-1 NVRAM Option Table>

Alignment and Adjustments

3-2 DVD Adjustment

Alignment and Adjustments

3-2-2 Skew Adjustment

Fig.3-6 Assy Deck (Top Side)

Alignment and Adjustments

Typical Waveform before Adjustment

Waveform after Correct Adjustment

Fig. 3-7 Envelope Waveform

3-2-3 Firmware Upgrade with CD

Alignment and Adjustments

3-3 VCR Mechanical Adjustment

CYLINDER ASS' Y GUIDE ROLLER "S" GUIDE ROLLER "T"

HIGH T SCREW PINCH ROLLER #9 GUIDE POST CAPSTAN #8 GUIDE POST

SUPPLY REEL DISK

TAKE UP REEL DISK

AC HEAD CAPSTAN SHAFT Fig. 3-9 Tape Travel Diagram

Alignment and Adjustments

3-3-2 Tape Transport System Adjustment

SCREW (C) HIGHT SCREW SCREW (D) X-POSITION LOCKING