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Grinding and Finishing

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ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Overview
Processes
Analysis

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Horizontal Grinding

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Horizontal grinding

Vertical grinding

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Centered grinding

Centerless grinding

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Creep Feed Grinding

Full depth and stock is removed with


one or two passes at low work speed
Very high forces are generated
High rigidity and power
Advantages
Increased accuracy
Efficiency
Improved surface finish
Burr reduction
Reduced stress and fatigue
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

10

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

11

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

12

Grinding Wheels

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

13

Grinding Wheels

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

14

Grinding Wheel Information

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

15

Correctly Mounted Wheel

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

16

Grinding Wheel Surface

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

17

Grind Wheel Dressing

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

18

Grinding Wheel Dressing

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

19

Grinding Chips

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

20

Chip formation geometry


w

D
q
t

l
v

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

21

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Chip geometry
As with rolling contact length, the chip length,
l
D = wheel diameter, d = depth of cut

l Dd
Material removal rate, MRR
v = workpiece velocity, d = depth of cut, b = width
of cut

MRR v d b

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

23

Material removal rate


The chips have a triangular cross-section,
and ratio (r) of chip thickness (t) to chip width
w
(w)

w
r 10 to 20
t

So, the average volume per chip

1 1
1
Volchip w t l wtl
2 2
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

24

Chips
The number of chips removed per unit time
(n), where c = number of cutting edges
(grains) per unit area (typ. 0.1 to 10 per mm2,
and V = peripheral wheel velocity

n V bc
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

25

Combining

MRR v d b n Volchip
1
v d b Vbc wtl
4
w r t
l Dd
1
vd b V cb r t t Dd
4
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

26

Chip thickness

4v d
t
V cr Dd
2

or

4v
t
V cr

d
D

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

27

Specific grinding energy, u

Consist of chip formation, plowing, and sliding

u uchip u plowing usliding

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

28

Total grinding force


Get force from power

Power u MRR

Fgrinding V u v d b
v d b
Fgrinding u
V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

29

Total grinding force


From empirical results, as t decreases, the
friction component of u increases

1
u
t

or

1
u K1
t

substituting

1 v d b
Fgrinding K1
t V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

30

Total grinding force


Substituting for t

v d b
Fgrinding K1

V
4v
d

V cr D
1

rearranging

d cr v
Fgrinding K1 b
Dd
4V
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
31
ME 6222: Manufacturing Processes and
Singh/Melkote/Colton
Systems Prof. J.S. Colton GIT 2006

Force on a grain
The force per grain can be calculated

Fgrain u Area
1
Fgrain u wt
2

w rt
and

1
u K1
t

1 1
Fgrain K1 r t t
t 2
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

32

Force on a grain
substituting for t, and rearranging

K1
4v
Fgrain r
2
V cr

d
D

vr d
Fgrain K1
V c D

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
33
ME 6222: Manufacturing Processes and
Singh/Melkote/Colton
Systems Prof. J.S. Colton GIT 2006

Grinding temperature
Temperature rise goes with energy delivered
per unit area
Energy input
T K2
area

u bl d
1
T K2
K2 K1 d
bl
t
T K1 K2 d

1
4v d
Vcr D

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

34

Grinding temperature
Rearranging
=

3
1 2 4

Temperatures can be up to 1600oC, but for a


short time.

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

35

Grinding Ex. 1-1


You are grinding a steel, which has a specific
grinding energy (u) of 35 W-s/mm3.
The grinding wheel rotates at 3600 rpm, has a
diameter (D) of 150 mm, thickness (b) of 25 mm, and
(c) 5 grains per mm2. The motor has a power of 2
kW.
The work piece moves (v) at 1.5 m/min. The chip
thickness ratio (r) is 10.
Determine the grinding force and force per grain.
Determine the temperature (K2 is 0.2oK-mm/N).
Room temperature is 20oC.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

36

Grinding Ex. 1-2


First we need to calculate the depth of cut.
We can do this from the power.

Power u MRR u v d b
2
W s
m
min
6 mm
2000 W 35
1.5
d 25 mm 10

3
2
min
60 sec
mm
m

d 91.4 106 m
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

37

Grinding Ex. 1-3


Now for the total grinding force
v d b
Fgrinding u
V
mm
3
1500

91
.
4

10
mm 25 mm
W s
min
Fgrinding 35

m
mm3 3600 rev 150 mm
min
rev 1000 mm
Fgrinding 70.7 N
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

38

Grinding Ex. 1-4


Next, the force per grain

1
Fgrain u wt
2

and

w rt

1
Fgrain u r t t
2

we need t
t

4v
V cr

mm
d
91.4 103 mm
min

mm grains
D
150 mm
3600 150
5

10
min
mm2
4 1500

t 1.32 103 mm

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

39

Grinding Ex. 1-5


Substituting

1
1
3 2
Fgrain u r t t 35 10 1.32 10
2
2
4

Fgrain 3.05 10 J / mm

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

40

Grinding Ex. 1-6


For the temperature, we need K1 and K2. K2 is
given, so we need to calculate K1.

1
1 1
1
Fgrain u r t t K1 r t t K1 r t
2
t 2
2

1
3.0510 N K1 10 1.32106 m
2
3 N
K1 46.2 10
m
1

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

41

Grinding Ex. 1-7


substituting
1
T K2 K1 d
t
T 0.2

K m
N
1
6
46.2

91
.
4

10
m 640K

6
N
m 1.32 10 m

T Tinitial T 20 640 660C


ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

42

Honing and Superfinishing


Honing tool used to improve
the surface finish of bored or
ground holes.

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Schematic
illustrations of the
superfinishing
process for a
cylindrical part.
(a) Cylindrical
mircohoning, (b)
Centerless
microhoning.

Lapping
(a) Schematic illustration of the lapping process. (b)
Production lapping on flat surfaces. (c) Production lapping
on cylindrical surfaces.

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Polishing Using Magnetic


Fields

Schematic illustration of polishing of balls and rollers


using magnetic fields. (a) Magnetic float polishing of
ceramic balls. (b) Magnetic-field-assisted polishing of
rollers. Source: R. Komanduri, M. Doc, and M. Fox.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Abrasive-Flow Machining
Schematic illustration of
abrasive flow machining to
deburr a turbine impeller.
The arrows indicate
movement of the abrasive
media. Note the special
fixture, which is usually
different for each part
design. Source: Extrude
Hone Corp.

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Robotic Deburring
A deburring operation on a robot-held die-cast
part for an outboard motor housing, using a
grinding wheel. Abrasive belts or flexible
abrasive radial-wheel brushes can also be used
for such operations. Source: Courtesy of
Acme Manufacturing Company and
Manufacturing Engineering Magazine,
Society of Manufacturing Engineers.

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Conformal Hydrodynamic Nanopolishing:


Case-study
Applications

Challenges

Most processes can polish only flat


surfaces; concave/profiled surfaces
Defence & Nuclear
are difficult to superfinish
Concave surface on hard brittle
Electronics
materials, such as single crystal
Industrial
sapphire can not be finished via form
Existing Methods
grinding due to process-induced
cracks
Diamond Turning
Diamond turning center can be used
Precision Grinding
for non ferrous materials but it is a
Lapping
super-precision machine-tool (The
equipment cost is ~ 20 crores besides
Ion Beam Polishing
Spot Hydrodynamic Polishing the expensive operational cost)

Optics

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Conformal Hydrodynamic
Nanopolishing Process and Machine
Process Description

Improvement over existing


spot hydrodynamic polishing
methods
Superfinish hard and brittle
concave surfaces, specially,
sapphire and hardened steels
Mitigates
existing surface
microcracks
Polishing action due to
elastohydrodynamic film in
the slurry
submerged
rotating conformal contact
(silicone ball in the cavitynd
being
polished)
12st Generation Conformal Hydrodynamic Nanopolishing Machin
Delivered to Precison Engineering Division BARC
Generation
(designed and fabricated in the Machine Tools Lab
at IIT Bombay)

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Novelty and Technology Breakthrough


Existing hydrodynamic polishing employs spot polishing unable to
polish small cavities (< 6mm in dia)
More than 3 degrees of freedom required to polish the entire cavity
effectively
Small actuation system and polishing tool is required

Conformal contact has a rotating soft tool which conforms to the shape
of the cavity
Axis of this tool is inclined at 45 and the workpiece is rotated inside a
slurry filled tank which ensures non-zero relative motion between tool
and workpiece at every location in the cavity
The entire cavity can be polished at once which will be much cheaper
and faster than programming the tool path
Alternative to expensive Diamond Turning
Can finish wide range of materials ceramics (sapphire, glass) and
hardened steels
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Technology Outcomes

Superfinished surfaces in
steels (< 3nm 3D surface
roughness)
Crack-free surface of < 100
nm 3D surface roughness in
single
crystal
sapphire
cavity
Process
knowhow
and
machine
transferred
to
Precision
Engineering
Division, BARC for strategic
applications in a nuclear
device
The superfinished obtained
at a fraction of cost of
Diamond turning
It can also be used by gem
polishers
which
could
reduce the health hazard by
reducing the dust inhalation
and automation is possible

Nanometric finish on hardened steel

Crack-free superfinished surface on single


crystal sapphire cavity

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Economics of Grinding and Finishing


Operations
Increase in the cost of
machining and finishing a
part as a function of the
surface finish required.
This is the main reason
that the surface finish
specified on parts should
not be any finer than
necessary for the part to
function properly.
ME 338: Manufacturing Processes II
Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

Summary
Overview of processes
Analysis of process
Example problem

ME 338: Manufacturing Processes II


Instructor: Ramesh Singh; Notes: Profs.
Singh/Melkote/Colton

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