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XDM 300

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What is the XDM-300?

A cost effective, high-capacity MADM-64 and MADM-16,

Multiple Service Provisioning Platform (MSPP)
Provides TDM, Ethernet and MPLS services over
SDH/SONET and CWDM/DWDM
For Metro Access/Core , Cellular and Utelco networks
2. 301.

MADM = Multi Add and Drop Multiplexer

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Access to Metro Core Product Portfolio

Metro

Metro
Access

XDM-300

XDM-50

MultiMulti- ADMADM-16/64

Redundant
MultiMulti-ADMADM-1/4

XDM-100
MultiMulti-ADMADM-4/16

Access
BGBG-20E
NonNon-Redundant
MultiMulti-ADMADM-1/4

STM-1/4
3. 30

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STM-4/16

STM-16/64

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Carrier Class Transport Ethernet Aggregation

Products Overview
End-to-End OAM Management
via LightSoft

ADM/TM-1/4

MADM-1/4

MADM-16/64

MSPP

MSPP

MSPP

MSPP

MSPP

MSPP

MSPP

2.5 GBps
1 service-slots

12.5 GBps
8 service-slots

30 GBps
12 service-slots

60 GBps
30 service-slots

30/60 GBps
10 service-slots

60 GBps
23 service-slots

120 GBps
23 service-slots

Interfaces:
E1,E3/DS3,
FE/GE,STM1/4

Interfaces:
E1,E3/DS3,
FE/GE,STM1/4

Interfaces:
E1,E3/DS3,
FE/GE,STM1/4/16
CWDM

Protocols:
SDH,L1,L2

Protocols:
SDH,L1,L2

Interfaces:
E1,E3/DS3,
FE/GE/10GE,
STM1/4/16/64
C/DWDM

Interfaces:
E1,E3/DS3,
FE/GE/10GE,
STM1/4/16/64
DWDM

Interfaces:
E1,E3/DS3,
FE/GE10GE,
STM1/4/16/64
DWDM

Interfaces:
E1,E3/DS3,
FE/GE/10GE
,STM1/4/16/64
DWDM

Protocols:
SDH,L1,L2,MPLS

Protocols:
SDH,L1,L2,MPLS

Access
Demarcation

Access
Aggregation

Metro Core
Aggregation

Core
Aggregation

BG-20
4. 30

MADM-4/16 MADM-16/64 MADM-16/64 MADM-16/64

XDM-50

CPE/CLE

Protocols:
SDH,L1,L2,MPLS

Protocols:
Protocols:
SDH,L1,L2,MPLS SDH,L1,L2,MPLS

Metro Access
Aggregation

Metro
Aggregation

XDM-100

XDM-300

Access

Metro
Aggregation

XDM-500

Metro

XDM-1000

XDM-1000

Core

1. Commonly agreed, Data is the main driver for B/W growth. However, both Enterprise
users and Mobile operators rely heavily on TDM trunks for carrying most of their traffic.
Enterprises connect their Private Branch exchanges (PBXs) to the WAN, and Mobile
Base T? Station (BTSs) and Base Station Controllers are connected via multiple E1s
trunks. Furthermore, SDH/SONET and DWDM are widely accepted as the most suitable
technologies for reliable, high-capacity transmission. Thus, transmission systems, which
offer multiservice access, namely both TDM and Ethernet, provide an attractive solution to
these customers needs.

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XDM-300
Cost effective Platform
High density very low cost per port
Scalability and flexibility low entry price (CAPEX)
Same I/O cards as XDM100/50 (OPEX)

Optimized for Metro Layer (Metro Access/Core)

Single metro platform for all service types
Single metro platform for all application types
Enhanced Ethernet services (L1,L2 and MPLS)
Provides more efficient scaling in the Metro Access
The Smallest MADM64 only 325mm (7U) high

Hybrid & High Capacity

Powerful 60G central matrix
Non-blocking HO/LO
CWDM support
Seamless network migration from 2.5G to 10G (XDM100 -> XDM300)
5. 30

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XDM-300 Applications

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XDM-300 Applications
Basic MADM-64 and MADM-16
Basic ADM-64 Functionality
Multi ADM-64 - Multi ring closure of up to 3 STM-64 rings
Multi ADM-16 - Multi ring closure of up to 12 STM-16 rings
Combine MADM-64 and MADM-16, Multi STM-16 Ring closure and
Gateway to the Metro Core STM-64 ring

DXC - 60G LO Cross-Connect

Drop shelf E1/E3/DS3 and STM1 Expansion shelf
Up to 24,192 Low order XC

Metro Ethernet services

Metro Access and Metro Core Aggregation
Layer One (EPL) E-Line
Layer Two (EPLAN) E-Line, E-LAN
Carrier Class Ethernet Services
MPLS E-Line, E-LAN and Triple Play

Cellular Backhaul
TDM & MPLS - 2.5G & 3G
7. 30

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Typical Metro Network Aggregation

8. 30

1. Real networks are like onions. They are composed of layers.

2. The CPE layer may be addressed with various platforms such as simple switch for
Ethernet services, Terminal MSPP for combination of Ethernet and traditional TDM and
IP-DSLAM for residential customers and SOHO.
3. CPE are typically connected to the edge layer over dedicated fiber (or co-located
platforms). The edge layer caries both traditional and Ethernet services to the core
network which acts as the gateway to IP-VPN networks, Internet and legacy voice
systems.
4. The data part of the Edge layer may be implemented in one of two ways:
5. Mapping of Ethernet to dedicated SDH containers (VC-12/3/4) with L1 data cards and
grooming (statistically) just before accessing the core layer
1. This type of solution is offered today with BG-40 and will be offered with XDM-50
and XDM-100 in next release of XDM (V6)
6. Using switched Ethernet on the Edge Nes and benefiting from the advantages of
statistical multiplexing much closer to the customer location (at higher cost).
1. This type of solution is offered today by XDM-50 and XDM-100 with EIS cards.
7. The core of the network interconnects edge networks with the gateways to the IP core,
Internet and may at the same time provides SDH transmission for legacy TDM services.

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Cellular Network Architecture

3G (Rel 5) RAN (Radio Access Network) aggregation Solution
MPLS benefits for 3G (Rel 5) based Ethernet/IP Mobile services
MPLS converged mobile network to reduce CapEx/OpEx
MPLS Traffic Engineering assured service quality, such as:
VoIP, HSDPA (HSI), Voice/Video conferencing, MP3 streaming, etc
Preserve current infrastructure and offer smooth migration to 3G, 4G

Smooth migration path for mobile aggregation using MSPP

2G

2.5G

9. 30

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3G(rel4-ATM)

3G(rel5-IP)

4G

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XDM-300 Features and Benefits

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XDM-300 Concept
Cost optimize MADM-16/64
High capacity 60G HO/LO
Ultra-dense I/O cards for higher fan-out
Share the same I/O cards as XDM50/100
Inherent all XDM100 functionalities (TPU, EoS
cards, C/DWDM, OCU etc)

7U
(325mm)
430mm
11. 30

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300mm

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The XDM-300 Layout

I/O Modules:(I1Modules:(I1-I8)
MXCMXC-300A

PIM, SIM, DIOM, EISMB,

MCSM,CCMBR,CTRP

60G Multiplexer
Cross Connect
and
Control

SDH/SONET
Quad I/O
Modules (I17)
(SIM16_1, SIM16_4,
SIM64_XFP)

SDH/SONET
Quad I/O
Modules (I18)
(SIM16_1, SIM16_4,
SIM64_XFP)

MXCMXC-300B
60G Multiplexer
Cross Connect
and
Control

FCU300
Fan Control Unit

I/O Modules (I9(I9-I16):

PIM, SIM, DIOM, EISMB,
MCSM, CCMBR,CTRP
12. 30

1. 18x I/O modules

2. MXC300 Main X-connect Card

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ECU
External Control Unit

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XDM-300 Common Cards

XDM-300 Shelf
z

Basic XDM-300 shelf 7U (subrack)

z Up to 18 I/O slots
z Ready for 3 X external TPU
1 X ECU300F/ECU300 - External Connection Unit
z Management interfaces
z External alarms and monitor points control
XDMXDM-300
Shelf
2 X MXC300 - Main Processor
z Supporting 60G capacity HO/LO
z One INF for -48V DC
1 X FCU300 - Fan Control Unit
z Powerful 8 Fans
MXC300B

MXC300A
Multiplexer
Cross Connect
and Control

Multiplexer
Cross
Connect
and Control

13. 30

Edition : 09.05.2007 09:26

ECU300
External Control
Unit

FCU300
Fan Control Unit

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XDM-300 I/O Cards

Two aggregation SIM options (Quad I/O I17-I18) :
SIM64_XFP
SIM16_4

New I/O cards :

SIM1_8
SIM16_1
SIM4_4
MCSM

SIM16_1
SIM4_4
SIM1_8
MCSM,DIO,EISMB

SIM64_XFP

All of XDM50/100 I/O cards:

PIM2_21, PIM2_63, PIM345_3
SIM1_4, SIM4_2
DIOM,EISMB
SIM16_4

14. 30

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IM1

IM2

IM3

IM4

IM5
I17

IM6

IM7

IM8

SIM64_1XFP

1x48Vin MXC300
A

FCU
300

I/O Modules:
PIM, SIM,DIOM,
EISMB,MCSM

I18 SIM16_4
1x48Vin MXC 300 B
IM9
IM13

IM10
IM14

ECU
IM11
IMI5

Display
IM12
IMI6

I/O Modules:
PIM, SIM,DIOM,
EISMB,MCSM

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XDM-300 Hybrid
C/DWDM Interfaces
Colored SDH Transceivers

STM-16 C/DWDM colored SFP

} STM-64 DWDM colored XFP
}

Optical Cards

2xGBE/FC/FICON Combiner
} CTRP25_2
} CRPT25_2
}

CWDM Components

MUX/DEMUX
} OADM Modules
} Splitter/Coupler Modules
}

TPM

TPM

TPM

IM1

IM2

IM3

IM4

IM5

IM6

IM7

IM8

TCF

TPU/OCU

I/O Modules:
PIM, SIM,DIOM,
EISMB,MCSM
FCU

MXC300 A

300
IM18
MXC 300 B
ECU

Display

IM9

IM10

IM11

IM12

IM13

IM14

IMI5

IMI6

TPM

Edition : 09.05.2007 09:26

OCU

IM17
1x48Vin

1x48Vin

15. 30

TPM

TCF

TPM

TPM

TPM

I/O Modules:
PIM, SIM,DIOM,
EISMB,MCSM
TCF

TPU/OCU

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XDM-300 Port Density

Traffic Type

Ports per
Module

Max. Cards per

Shelf

Max. Ports per

Shelf

E1

63

504

E3,DS3

16

48

STM-1/E (IOP support)

16

64

STM-1O/E (SFP)

16

128

STM-4

16

64

STM-16

1/4

16x1+4x2

24

STM-64

Layer 1 Ethernet (10/100 BT)

16

128

Layer 1 Ethernet (100FX/GBE)

16

64

Layer 2 Ethernet (10/100BT)

32

Layer 2 Ethernet (100FX/GBE)

32

Layer 2 MPLS (10/100BT)

64

Layer 2 MPLS (100FX/GBE)

64

16. 30

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XDM-300 Characteristics

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XDM-300 as Carrier Class Platform

Equipment Protection, Redundancy
1:1 1:2 and 1:3 I/O protection schemes for 2/34/45Mbps
and STM-1 electrical I/O
1+1 matrix protection
Common control redundancy
Tributaries
Protection
Timing unit redundancy
Module (TPM)
Power supply redundancy
E3,DS3,STM1

Traffic Protection
Mechanisms
1+1 Path Protection
SNCP
MSP 1+1
MS-SPRing

18. 30

Edition : 09.05.2007 09:26

Tributaries
Protection
Unit (TPU)
E3,DS3,STM1

Tributaries
Protection
Module (TPM)
E1

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XDM-300 Slot Capacity

IM1 2.5G

IM2

2.5G

IM3

2.5G

IM4

2.5G

IM5 2.5G

IM6

2.5G

IM7

2.5G

IM8

2.5G

IM17
1x48Vin

10G

FCU

MXC300 A

300

10G

IM18
1x48Vin

MXC300 B
ECU

Display

2.5G

IM10 2.5G

IM11 2.5G

IM12 2.5G

IM13 2.5G

IM14 2.5G

IMI5 2.5G

IMI6 2.5G

IM9

I/O Modules:
PIM, SIM, DIOM,
EISMB, MCSM

Full nonblocking low order 60G cross connect

2 Quad I/O slots with 10G
16 I/O slots with 2.5G
19. 30

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I/O Modules:
PIM, SIM, DIOM,
EISMB, MCSM

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XDM-300 Modularity Expansion Options

TCF

TPM

TPM

TPM

TPM

IM1

IM2

IM3

IM4

IM5

IM6

IM7

IM8

TCF

OCU

TPU/OCU
I/O Modules:
PIM, SIM, DIOM,
EISMB, MCSM

IM17
1x48Vin

FCU

MXC300 A

300

IM18
1x48Vin

MXC300 B

IM9

IM10

ECU
IM11

IM13

IM14

IMI5

TPM

TPM

TPM

Display
IM12

I/O Modules:
PIM, SIM, DIOM,
EISMB, MCSM

IMI6
TPM

TCF

TPU/OCU

The basic XDM-300 shelf is designed to accommodate:

Up to 3 X TPU/OCU (Tributary Protection Unit)
20. 30

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The XDM-300 Power Feed

Regular -48 to -60 VDC +/- 20% variation [standard]
Double power feed capability (one in each MXC300)
Protection against:
z Reverse polarity
z Sudden power disconnection and reconnection
z Short-circuit input units
z Lighting strikes
z Abnormal power supply current
Maximum power consumption 1600W
INF Power
Feeding

21. 30

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XDM 300 Modules

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New I/O CARD SIM64_XFP

Accommodate in Quad I/O slot (wide slots)
1 x STM-64 interface per card
XFP colored/non-colored transmitters
Transmitter types I, S, L (10KM,40KM,80KM)
Receiver types PIN & APD
Support OTN G.709 10.7 Gbps line transceiver with
FEC

23. 30

1x STMSTM-64
XFP

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New I/O CARD - SIM16_4

Accommodate in Quad I/O slot (wide slots)
4 X STM-16 interfaces per card
Based on SFP module
Colored C/DWDM and non-colored
transmitters
Transmitter types I, S,V,X, B
Receiver types PIN & APD

24. 30

4 x STMSTM-16
SFP

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New I/O CARD - SIM16_1

1 X STM-16 interface per card
Based on SFP module
Colored C/DWDM and non-colored
transmitters
Transmitter types I, S,V, X, B
Receiver types PIN & APD

25. 30

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New I/O CARD SIM4_4

4 X STM-4 Interfaces per Card
Based on SFP Module
Transmitter Types I, S,L
Receiver Types PIN & APD

26. 30

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New I/O CARD - SIM1_8

8 X STM-1 Interfaces per Card
Electrical and Optical SFP Support
Transmitter Types I, S,L
Receiver Types PIN and APD

27. 30

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XDM-300 Control Interfaces

2 x 10/100 Ethernet for Management and Local Craft
Terminal (LCT)
Serial Port for LCT (RS-232)
2 x External Timing (T3/T4)
External Alarms Port

External Alarms
Serial port
RSRS-232

28. 30

Edition : 09.05.2007 09:26

2 X T3/T4
External
timing ports
2 X 10/100
Ethernet

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The FCU300 (Fan Control Unit)

The XDM-300 has a fan control

unit for convection purposes
The FCU300 includes 8 fan units
with stand alone heat sensor
controller
The FCU300 is replaceable
without interrupting traffic

Controller per
FAN unit

29. 30

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MXC300 60G fully LO

384xVC4 4c/4/3/1 XC fully LO non blocking

48VDC 60VDC
Power Feed

30. 30

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NVM

Debug
Connector

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