PCB - Chip Removal using Hot Plate & Blower

Reference: http://www.zeph.com/BGASMDRemovalvideo.htm
Pre-Heater (@ Bottom)
Set Temperature to 150deg
Allow the board to pre-heat for
4 layer board 1.5 to 2 mins
6 Layer - 2 mins
8 Layer 2 to 2.5 mins
Blower (@Top)
Set Top nozzle temperature to 380 deg (Boards which are already reflowed
will appear little brownish at the solder area)
If it is fresh board it can be set to 400 deg

Apply blower in circular fashion for 2-3 mins

Once the solder starts melting, use tweezer to check whether balls are
melted completely
This can be done by pivoting one end of the tweezer to the board and other
end by delicately shifting the chip.
If the chip moves remove the chip using the tweezer
Use solder-wick to remove the solder residue over the balls
Continue the wicking procedure till all the solder gets removed and the
surface comes out as co-planar
Clean using IP, thinner works better for cleaning
Inspect the pads for co-planarity

The Removed pads are ready for re-soldering with new chip