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Dec.

2012

DDR3 SDRAM Memory

Product Guide

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND


SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.

-1-

Dec. 2012

Product Guide

DDR3 SDRAM Memory

1. DDR3 SDRAM MEMORY ORDERING INFORMATION


1

10

11

12

13

14

15

K 4 B X X X X X X X - X X X X
Speed

SAMSUNG Memory
DRAM

Temp & Power

DRAM Type

Package Type

Density

Revision
Interface (VDD, VDDQ)

Bit Organization

# of Internal Banks

1. SAMSUNG Memory : K

2. DRAM : 4

3. DRAM Type
B : DDR3 SDRAM

10. Revision
M : 1st Gen.
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen.
G : 8th Gen.
H : 9th Gen.

4~5. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
8G :
8Gb
AG : 16Gb

11. "-"
12. Package Type
H
M
B
E
O

6~7. Bit Organization


04 :
08 :
16 :
33 :

x4
x8
x16
x32

9. Interface ( VDD, VDDQ)


6 : SSTL (1.5V, 1.5V)

FBGA (Halogen-free & Lead-free)


FBGA (Halogen-free & Lead-free, DDP)
FBGA (Halogen-free & Lead-free, Flip Chip)
FBGA(Lead-free & Halogen-free, QDP)
FBGA(Lead-free & Halogen-free, QDP for 64GB
LRDIMM)

13. Temp & Power


C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
K : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
& RS( Reduced Standby )

8. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks

:
:
:
:
:

14~15. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA : DDR3-1866

-2-

(400MHz @ CL=6, tRCD=6, tRP=6)


(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)

Dec. 2012

Product Guide

DDR3 SDRAM Memory

2. DDR3 SDRAM Component Product Guide


Density

1Gb G-die

2Gb C-die

2Gb D-die

2Gb E-die

4Gb B-die

4Gb C-die

4Gb D-die

8G B-die

16G B-die

Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

Part Number

Package & Power,


Temp. & Speed

Org.

K4B1G0446G

BCF8/H9/K0/MA

256M x 4

K4B1G0846G

BCF8/H9/K0/MA

128M x 8

K4B1G0446G

BYF8/H9/K0

256M x 4

K4B1G0846G

BYF8/H9/K0

128M x 8

K4B2G0446C

HCF8/H9/K0

512M x 4

K4B2G0846C

HCF8/H9/K0

256M x 8

K4B2G0446C

HYF8/H9

512M x 4

K4B2G0846C

HYF8/H9

256M x 8

K4B2G0446D

HCF8/H9/K0/MA

512M x 4

K4B2G0846D

HCF8/H9/K0/MA

256M x 8

K4B2G0446D

HYF8/H9/K0

512M x 4

K4B2G0846D

HYF8/H9/K0

256M x 8

K4B2G0446E

BCH9/K0/MA

512M x 4

K4B2G0846E

BCH9/K0/MA

256M x 8

K4B2G0446E

BYH9/K0

512M x 4

K4B2G0846E

BYH9/K0

256M x 8

K4B4G0446B

HCF8/H9/K0/MA

1G x 4

K4B4G0846B

HCF8/H9/K0/MA

512M x 8

K4B4G1646B

HCH9/K0

256M x 16

K4B4G0446B

HYF8/H9/K0

VDD Voltage1

Now

78 ball
FBGA

Now

78 ball
FBGA

Now

1.5V

1.35V

1.5V

1.35V

1.5V
78 ball
FBGA

Now

1.35V

1.5V
78 ball
FBGA

K4B4G0846B

HYF8/H9/K0

512M x 8

HYH9/K0

256M x 16

K4B4G0446C

BCH9/K0/MA

1G x 4

K4B4G0846C

BCH9/K0/MA

512M x 8

K4B4G0446C

BYH9/K0

1G x 4

K4B4G0846C

BYH9/K0

512M x 8

K4B4G0446D

BCH9/K0/MA

1G x 4

K4B4G0846D

BCH9/K0/MA

512M x 8

K4B4G0446D

BYH9/K0

1G x 4

K4B4G0846D

BYH9/K0

512M x 8

K4B8G1646B

MCK0

DDP 512M x 16

1.5V

K4B8G1646B

MYH9/K0

DDP 512M x 16

1.35V

K4B8G3346B

MCH9/K0

DDP 256M x 32

1.5V

K4B8G3346B

MYH9/K0

DDP 256M x 32

1.35V

K4BAG0446B

ECH9/K0

QDP 4G x 4

1.5V

K4BAG0446B

EYH9/K0

QDP 4G x 4

1.35V

K4BAG0446B

OCK0

QDP 4G x4

1.5V

K4BAG0446B

OYF8/H9/K0

QDP 4G x4

1.35V

-3-

78 ball
FBGA
1.35V

K4B4G1646B

1. 1.35V product is 1.5V operatable.

Avail.

1.5V

1G x 4

* NOTE

PKG

Now

1.35V

1.5V
78 ball
FBGA

Now

78 ball
FBGA

1Q13

96 ball
FBGA

Now

136 ball
FBGA

Now

78 ball
FBGA

Now

78 ball
FBGA

Now

1.35V

1.5V

1.35V

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

3. DDR3 SDRAM Module Ordering Information


1

10

11

12

13 14

15

16

171

M X X X B X X X X X X X - X X X X
Memory Module
DIMM Type
Data bits

Memory Buffer
Speed

DRAM Component Type

Temp & Power

Depth

PCB Revision
Package

# of Banks in Comp. & Interface

Component Revision

Bit Organization
1. Memory Module : M
2. DIMM Type
3 : DIMM
4 : SODIMM
3~4. Data Bits
71 :
74 :
78 :
86 :
90 :
91 :
92 :
93 :

x64
x72
x64
x72
x72
x72
x72
x72

204pin Unbuffered SODIMM


204pin ECC Unbuffered SODIMM
240pin Unbuffered DIMM
240pin LR DIMM
240pin VLP Unbuffered DIMM
240pin ECC Unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM

5. DRAM Component Type


B : DDR3 SDRAM

33 : 32M (for 128Mb/512Mb)


65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
2K : 2G (for 2Gb)

8. # of Banks in comp. & Interface


7 :

12. PCB Revision


0 : None
2 : 2nd Rev.
4 : 4th Rev.

1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer

13. "_"

6~7. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G: 1G
2G: 2G
4G: 4G
8G: 8G

10. Component Revision


M : 1st Gen.
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen.
G : 8th Gen.
11. Package
Z : FBGA(Lead-free)
H : FBGA(Lead-free & Halogen-free)
J : FBGA(Lead-free, DDP)
M : FBGA(Lead-free & Halogen-free, DDP)
B : FBGA (Halogen-free & Lead-free, Flip Chip)
E : FBGA(Lead-free & Halogen-free, QDP)
O : FBGA(Lead-free & Halogen-free, QDP for 64GB
LRDIMM)

8Banks & SSTL-1.5V

14. Temp & Power


C : Commercial Temp.( 0C ~ 85C) & Normal Power(1.5V)
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)
15~16. Speed2
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA: DDR3-1866

(400MHz @ CL=6, tRCD=6, tRP=6)


(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)

17. Memory Buffer


0
1
2
3
4

9. Bit Organization
0 : x4
3 : x8
4 : x16

:
:
:
:
:

Inphi iMB02-GS02A
IDT A2 (Greendale)
Montage MB C0
Inphi iMB02-GS02B
Montage MB CI

NOTE:
1. Only used for LRDIMM
2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PC3-14900(DDR3-1866)

-4-

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4. DDR3 SDRAM Module Product Guide


4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org.

Density

Part Number

Speed

Raw Card

128Mx 72

1GB

M391B2873GB0

CF8/H9/K0/MA

D(1Rx8)

M378B5773CH0

CF8/H9/K0

256Mx 64

256Mx 72

512Mx 64

512Mx 72

1Gx 64

1Gx 72

2GB

2GB

4GB

4GB

8GB

8GB

M378B5773DH0

CF8/H9/K0/MA

M378B5773EB0

CH9/K0/MA

M391B5673GB0

CF8/H9/K0/MA

M391B5773CH0

CF8/H9/K0

M391B5773DH0

CF8/H9/K0/MA

M391B5773EB0

CH9/K0/MA

M378B5273CH0

CF8/H9/K0

M378B5273DH0

CF8/H9/K0

A(1Rx8)

E(2Rx8)

D(1Rx8)

B(2Rx8)

Composition

Comp.
Version

128M x 8 * 9 pcs

1Gb

G-die

256M x 8 * 8 pcs

2Gb

C-die

PKG

Height

Avail.

78 ball
FBGA

30mm

Now

78 ball
FBGA

2Gb

D-die

2Gb

E-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

256M x 8 * 9 pcs

2Gb

E-die

Now

256M x 8 * 16 pcs

2Gb

C-die

Now

256M x 8 * 16 pcs

2Gb

D-die

CH9/K0/MA

256M x 8 * 16 pcs

2Gb

E-die

CK0

512M x 8 * 8 pcs

4Gb

C-die

M378B5173DB0

CK0/MA

512M x 8 * 8 pcs

4Gb

D-die

M391B5273CH0

CF8/H9/K0

256M x 8 * 18 pcs

2Gb

C-die

30mm

Now
Now

Now
78 ball
FBGA

Now
Now

Now
78 ball
FBGA

30mm

30mm

Now
Now

1Q13
Now

CF8/H9/K0/MA

256M x 8 * 18 pcs

2Gb

D-die

M391B5273EB0

CH9/K0/MA

256M x 8 * 18 pcs

2Gb

E-die

Now

M378B1G73BH0

CF8/H9/K0

512M x 8 * 16 pcs

4Gb

B-die

Now

M378B1G73CB0

CK0

512M x 8 * 16 pcs

4Gb

C-die

M378B5173DB0

CK0/MA

1G x 8 * 8 pcs

4Gb

D-die

M391B1G73BH0 CF8/H9/K0/MA

E(2Rx8)

512M x 8 * 18 pcs

4Gb

B-die

78 ball
FBGA

M391B5273DH0

B(2Rx8)

NOTE

Now

256M x 8 * 8 pcs

M378B5273EB0

E(2Rx8)

Rank

256M x 8 * 8 pcs

M378B5173CB0

D(1Rx8)

Internal
Banks

2
78 ball
FBGA

78 ball
FBGA

30mm

30mm

Now

Now
1Q13

30mm

Now

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)


240Pin DDR3 Unbuffered DIMM
Org.

Density

Part Number

Speed

Raw Card

128Mx 72

1GB

M391B2873GB0

YF8/H9/K0

D(1Rx8)

128M x 8 * 9 pcs

M391B5673GB0

YF8/H9/K0

E(2Rx8)

256Mx 72

2GB

M391B5773CH0

YF8/H9

M391B5773DH0

YF8/H9/K0

M391B5273CH0

YF8/H9

M391B5273DH0

YF8/H9/K0

512Mx 72
1Gx 72

4GB
8GB

M391B1G73BH0

YF8/H9/K0

D(1Rx8)

E(2Rx8)
E(2Rx8)

Composition

Comp.
Version

Internal
Banks

Rank

PKG

Height

Avail.

78 ball
FBGA

30mm

Now

78 ball
FBGA

30mm

Now

1Gb

G-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 8 * 18 pcs

* NOTE : 1.35V product is 1.5V operatable.

-5-

4Gb

B-die

Now

78 ball
FBGA

30mm

78 ball
FBGA

30mm

Now
Now
Now
Now

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.3 240Pin DDR3 VLP Unbuffered DIMM (1.35V Product)


240Pin DDR3 VLP Unbuffered DIMM
Comp.
Version

Internal
Banks

Rank

PKG

Height

Avail.

D-die

78 ball
FBGA

18.75mm

Now

2Gb

D-die

4Gb

B-die

78 ball
FBGA

18.75mm

4Gb

B-die

78 ball
FBGA

18.75mm

Org.

Density

Part Number

Speed

Raw Card

Composition

256Mx 72

2GB

M390B5773DH0

YH9

J(1Rx8)

256M x 8 * 9pcs

2Gb

512Mx 72

4GB

M390B5273DH0

YH9

K(2Rx8)

256M x 8 * 18 pcs

M390B5173BH0

YH9

J(1Rx8)

256M x 8 * 18 pcs

1Gx 72

8GB

M390B1G73BH0

YH9

K(2Rx8)

512M x 8 * 18 pcs

NOTE

Now
Now
Now

* NOTE : 1.35V product is 1.5V operatable.

4.4 204Pin DDR3 SoDIMM (1.5V Product)


204Pin DDR3 SODIMM
Org.

Density

256Mx 64

2GB

512Mx 64

1Gx 64

4GB

8GB

Part Number

Speed

M471B5773CHS

CF8/H9/K0

M471B5773DH0

CF8/H9/K0

M471B5273CH0

CF8/H9/K0

M471B5273DH0

CF8/H9/K0

M471B5273EB0

CH9/K0

M471B5173CB0

CK0

M471B5173DB0

CH9/K0

M471B1G73BH0

CH9/K0

M471B1G73CB0

CK0

M471B1G73DB0

CH9/K0

Raw Card
B(1Rx8)

F(2Rx8)

B(1Rx8)

F(2Rx8)

Comp.
Version

Composition
256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 8 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

E-die

512M x 8 * 8 pcs

4Gb

C-die

512M x 8 * 8 pcs

4Gb

D-die

512M x 8 * 16 pcs

4Gb

B-die

512M x 8 * 16 pcs

4Gb

C-die

512M x 8 * 16 pcs

4Gb

D-die

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

Avail.

NOTE

Now
Now
Now

Now
78 ball
FBGA

30mm

Now
Now
1Q13
Now

78 ball
FBGA

30mm

Now
1Q13

4.5 204Pin DDR3 SoDIMM (1.35V Product)


204Pin DDR3 SODIMM
Org.

Density

256Mx 64

2GB

512Mx 64

1Gx 64

4GB

8GB

Part Number

Speed

M471B5773CHS

YF8/H9

M471B5773DH0

YF8/H9/K0

M471B5273CH0

YF8/H9

M471B5273DH0

YF8/H9/K0

M471B5273EB0

YK0

M471B5173CB0

YH9/K0

M471B5173DB0

YH9/K0

M471B1G73BH0

YF8/H9/K0

M471B1G73CB0

YH9/K0

M471B1G73DB0

YH9/K0

Raw Card
B(1Rx8)

F(2Rx8)

B(1Rx8)

F(2Rx8)

Composition

Comp.
Version

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 8 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

E-die

512M x 8 * 8 pcs

4Gb

C-die

512M x 8 * 8 pcs

4Gb

D-die

512M x 8 * 16 pcs

4Gb

B-die

512M x 8 * 16 pcs

4Gb

C-die

512M x 8 * 16 pcs

4Gb

D-die

* NOTE : 1.35V product is 1.5V operatable.

-6-

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

Avail.
Now
Now
Now
Now

78 ball
FBGA
8

30mm

Now
Now
4Q12
Now

78 ball
FBGA

30mm

Now
4Q12

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.6 204Pin DDR3 ECC SoDIMM (1.35V Product)


204Pin DDR3 SODIMM
Comp.
Version

Internal
Banks

Rank

PKG

Height

Avail.

D-die

78 ball
FBGA

30mm

Now

2Gb

D-die

78 ball
FBGA

30mm

Now

256M x 8 * 18 pcs

2Gb

B-die

78 ball
FBGA

30mm

Now

512M x 8 * 18 pcs

4Gb

B-die

78 ball
FBGA

30mm

Now

Org.

Density

Part Number

Speed

Raw Card

Composition

256Mx 72

2GB

M474B5773DH0

YF8/H9

C(1Rx8)

256M x 8 * 9 pcs

2Gb

M474B5273DH0

YF8/H9

D(2Rx8)

256M x 8 * 18 pcs

512Mx 72

4GB
M474B5173BH0

YF8/H9/K0

C(1Rx8)

M474B1G73BH0

YF8/H9/K0

D(2Rx8)

1Gx 72

8GB

NOTE

NOTE : 1.35V product is 1.5V operatable.

4.7 240Pin DDR3 Registered DIMM (1.5V Product)


240Pin DDR3 Registered DIMM
Comp.
Version

Internal
Banks

Rank

PKG

Height

Avail.

G-die

78 ball
FBGA

30mm

Now

1Gb

G-die

Now

1Gb

G-die

Now

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

H(4Rx8)

128M x 8 * 36 pcs

1Gb

G-die

Now

E(2Rx4)

256M x 4 * 36 pcs

1Gb

G-die

Now

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

Now

Org.

Density

Part Number

Speed

Raw Card

Composition

128Mx 72

1GB

M393B2873GB0

CH9/K0/MA

A(1Rx8)

128M x 8 * 9 pcs

1Gb

M393B5673GB0

CH9/K0/MA

B(2Rx8)

128M x 8 * 18 pcs

M393B5670GB0

CH9/K0/MA

C(1Rx4)

256M x 4 * 18 pcs

M393B5773CH0

CF8/H9/K0

M393B5773DH0

CH9/K0/MA

M393B5173GB0

CH9

M393B5170GB0

CH9/K0/MA

256Mx 72

512Mx 72

1Gx 72

2Gx 72

2GB

4GB

8GB

16GB

A(1Rx8)

M393B5273CH0

CF8/H9/K0

M393B5273DH0

CH9/K0/MA

M393B5273EB0

CMA

256M x 8 * 18 pcs

2Gb

E-die

M393B5270CH0

CH9/K0

512M x 4 * 18 pcs

2Gb

C-die

M393B5270DH0

CH9/K0/MA

M393B5270EB0

CH9/MA

M393B1K73CH0

CF8/H9

M393B1K73DH0

CH9

B(2Rx8)

C(1Rx4)

H(4Rx8)

512M x 4 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

E-die

256M x 8 * 36 pcs

2Gb

C-die

256M x 8 * 36 pcs

2Gb

D-die

M393B1K73EB0

CH9

256M x 8 * 36 pcs

2Gb

E-die

M393B1K70CH0

CF8/H9/K0

512M x 4 * 36 pcs

2Gb

C-die

M393B1K70DH0

CH9/K0/MA

512M x 4 * 36 pcs

2Gb

D-die

M393B1K70EB0

CH9/MA

512M x 4 * 36 pcs

2Gb

E-die

E(2Rx4)

78 ball
FBGA

30mm

Now
Now

Now
78 ball
FBGA

30mm

Now
Now

Now
Now
Now

Now
Now

78 ball
FBGA

30mm

Now
Now
Now

M393B1G73BH0

CH9/K0/MA

B(2Rx8)

512M x 8 * 18 pcs

4Gb

B-die

M393B1G70BH0

CH9/K0/MA

C(1Rx4)

1G x 4 * 18 pcs

4Gb

B-die

Now

M393B2K70DM0

CF8/H9

AB(4Rx4)

1G
x 4 * 36 pcs
DDP

2Gb

D-die

Now

M393B2G70BH0

CF8/H9

1G x 4 * 36 pcs

4Gb

B-die

E(2Rx4)

Now

78 ball
FBGA

Now
30mm

M393B2G70CB0

CK0/MA

1G x 4 * 36 pcs

4Gb

C-die

M393B2G73BH0

CF8/H9

H(4Rx8)

512M x 8 * 36 pcs

4Gb

B-die

Now

M393B2G70DB0

CK0/MA

E(2Rx4)

1G x 4 * 36 pcs

4Gb

D-die

1Q13

-7-

Now

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.8 240Pin DDR3 Registered DIMM (1.35V Product)


240Pin DDR3 Registered DIMM
Internal
Banks

Rank

PKG

Height

Avail.

G-die

78 ball
FBGA

30mm

Now

1Gb

G-die

Now

1Gb

G-die

Now

9 pcs

2Gb

C-die

9 pcs

2Gb

D-die

Density

Part Number

Speed

Raw Card

128Mx 72

1GB

M393B2873GB0

YF8/H9/K0

A(1Rx8)

128M x 8 *

9 pcs

1Gb

M393B5673GB0

YF8/H9/K0

B(2Rx8)

128M x 8 * 18 pcs

M393B5670GB0

YF8/H9/K0

C(1Rx4)

256M x 4 * 18 pcs

M393B5773CH0

YF8/H9

256M x 8 *

M393B5773DH0

YF8/H9/K0

256M x 8 *

256Mx 72

512Mx 72

1Gx 72

2Gx 72

4Gx 72

2GB

4GB

8GB

16GB

32GB

A(1Rx8)

Composition

Comp.
Version

Org.

78 ball
FBGA

30mm

Now
Now

M393B5173GB0

YF8/H9

H(4Rx8)

128M x 8 * 36 pcs

1Gb

G-die

Now

M393B5170GB0

YF8/H9/K0

E(2Rx4)

256M x 4 * 36 pcs

1Gb

G-die

Now

256M x 8 * 18 pcs

2Gb

C-die

B(2Rx8)

256M x 8 * 18 pcs

2Gb

D-die

Now

M393B5273CH0

YF8/H9

M393B5273DH0

YF8/H9/K0

M393B5273EB0

YH9/K0

256M x 8 * 18 pcs

2Gb

E-die

M393B5270CH0

YF8/H9

512M x 4 * 18 pcs

2Gb

C-die

M393B5270DH0

YF8/H9/K0

512M x 4 * 18 pcs

2Gb

D-die

M393B5270EB0

YH9/K0

512M x 4 * 18 pcs

2Gb

E-die

M393B1K73CH0

YF8/H9

256M x 8 * 36 pcs

2Gb

C-die

M393B1K73DH0

YF8/H9

256M x 8 * 36 pcs

2Gb

D-die

M393B1K73EB0

YH9

256M x 8 * 36 pcs

2Gb

E-die

M393B1K70CH0

YF8/H9

512M x 4 * 36 pcs

2Gb

C-die

M393B1K70DH0

YF8/H9/K0

M393B1K70EB0

YH9/K0

M393B1G73BH0

YF8/H9/K0

B(2Rx8)

M393B1G70BH0

YF8/H9/K0

C(1Rx4)

M393B2K70DM0

YF8/H9

M393B2G70BH0

YF8/H9/K0

M393B2G70CB0

YH9/K0

M393B2G70DB0

YH9/K0

M393B2G73BH0

YF8/H9

M393B4G70BM0

YF8/H9

C(1Rx4)

H(4Rx8)

E(2Rx4)

AB(4Rx4)

78 ball
FBGA

30mm

Now
Now

Now
Now
Now

Now
Now
Now

2Gb

D-die

2Gb

E-die

512M x 8 * 18 pcs

4Gb

B-die

Now

1G x 4 * 18 pcs

4Gb

B-die

Now

1G
x 4 * 36 pcs
DDP

2Gb

D-die

Now

4Gb

B-die

4Gb

C-die

1G x 4 * 36 pcs

4Gb

D-die

H(4Rx8)

512M x 8 * 36 pcs

4Gb

B-die

AB(4Rx4)

2G
x 4 * 36 pcs
DDP

* NOTE : 1.35V product is 1.5V operatable.

-8-

4Gb

B-die

30mm

512M x 4 * 36 pcs

1G x 4 * 36 pcs

78 ball
FBGA

512M x 4 * 36 pcs

1G x 4 * 36 pcs
E(2Rx4)

Now

Now
Now

78 ball
FBGA

Now
30mm

Now
1Q13

8
8

4
4

Now
78 ball
FBGA

30mm

Now

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.9 240Pin DDR3 VLP Registered DIMM (1.5V Product)


240Pin DDR3 VLP Registered DIMM
Internal
Banks

Rank

PKG

Height

Avail.

G-die

78 ball
FBGA

18.75mm

Now

1Gb

G-die

1Gb

G-die

9 pcs

2Gb

C-die

9 pcs

2Gb

D-die

Density

Part Number

Speed

Raw Card

128Mx 72

1GB

M392B2873GB0

CF8/H9/K0/MA

K(1Rx8)

128M x 8 *

9 pcs

1Gb

M392B5673GB0

CF8/H9/K0/MA

L(2Rx8)

128M x 8 * 18 pcs

M392B5670GB0

CF8/H9/K0/MA

M(1Rx4)

256M x 4 * 18 pcs

M392B5773CH0

CF8/H9/K0

256M x 8 *

M392B5773DH0

CF8/H9/K0/MA

256M x 8 *

256Mx 72

512Mx 72

2GB

4GB

M392B5273CH0

CF8/H9/K0

M392B5273DH0

CF8/H9/K0/MA

M392B5270CH0

CF8/H9/K0

M392B5270DH0

CF8/H9/K0/MA

M392B1K73CM0

CF8/H9

K(1Rx8)

L(2Rx8)

M(1Rx4)

V(4Rx8)

1Gx 72

8GB

4Gx 72

2Gb

C-die

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

512M
x 8 * 18 pcs
DDP

2Gb

C-die

CF8/H9

512M
x 8 * 18 pcs
DDP

2Gb

D-die

M392B1K70CM0

CF8/H9/K0

1G
x 4 * 18 pcs
DDP

2Gb

C-die

1G
x 4 * 18 pcs
DDP

2Gb

D-die

4Gb

B-die

1G x4 * 18 pcs

4Gb

M392B2G70BM0

CF8/H9/K0/MA

N(2Rx4)

2G
x4 * 18 pcs
DDP

4Gb

18.75mm

Now
Now
Now

M392B2G73BM0

CF8/H9

V(4Rx8)

1G
x8 * 18 pcs
DDP

4Gb

B-die

M392B4G70BE0

CF8/H9

U(4Rx4)

4G
*
x4
18 pcs
QDP

4Gb

B-die

-9-

Now
Now

78 ball
FBGA

B-die

512M x8 * 18 pcs

M(1Rx4)

18.75mm

Now

Now

L(2Rx8)

CF8/H9/K0/MA

Now

Now

CF8/H9/K0/MA

M392B1G70BH0

18.75mm

Now
78 ball
FBGA

B-die

M392B1G73BH0

78 ball
FBGA

CF8/H9/K0/MA

Now
Now

Now

M392B1K70DM0

16GB

32GB

256M x 8 * 18 pcs
256M x 8 * 18 pcs

M392B1K73DM0

N(2Rx4)

2Gx 72

Composition

Comp.
Version

Org.

Now
Now

78 ball
FBGA

18.75mm

78 ball
FBGA

18.75mm

Now
Now

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.10 240Pin DDR3 VLP Registered DIMM (1.35V Product)


240Pin DDR3 VLP Registered DIMM
Internal
Banks

Rank

G-die

1Gb

G-die

1Gb

G-die

512M x 4 * 9 pcs

2Gb

C-die

512M x 4 * 9 pcs

2Gb

D-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

512M
x 8 * 18 pcs
DDP

2Gb

C-die

Density

Part Number

Speed

Raw Card

128Mx 72

1GB

M392B2873GB0

YF8/H9/K0

K(1Rx8)

128M x 8 * 9 pcs

1Gb

M392B5673GB0

YF8/H9/K0

L(2Rx8)

128M x 8 * 18 pcs

M392B5670GB0

YF8/H9/K0

M(1Rx4)

256M x 4 * 18 pcs

M392B5773CH0

YF8/H9

M392B5773DH0

YF8/H9/K0

256Mx 72

512Mx 72

2GB

4GB

M392B5273CH0

YF8/H9

M392B5273DH0

YF8/H9/K0

M392B5270CH0

YF8/H9

M392B5270DH0

YF8/H9/K0

M392B1K73CM0

YF8/H9

K(1Rx8)

L(2Rx8)

M(1Rx4)

V(4Rx8)

1Gx 72

8GB

M392B1K73DM0

YF8/H9

512M
x 8 * 18 pcs
DDP

2Gb

D-die

M392B1K70CM0

YF8/H9

1G
x 4 * 18 pcs
DDP

2Gb

C-die

1G
x 4 * 18 pcs
DDP

2Gb

D-die

N(2Rx4)

2Gx 72

4Gx 72

PKG

Height

78 ball
18.75mm
FBGA

Now
Now

78 ball
18.75mm
FBGA

Now
Now
Now
Now

78 ball
18.75mm
FBGA
8

Avail.

Now
Now
Now
Now
Now

78 ball
18.75mm
FBGA

Now

M392B1K70DM0

YF8/H9/K0

M392B1G73BH0

YF8/H9/K0

L(2Rx8)

512M x 8 * 18 pcs

4Gb

B-die

Now

M392B1G70BH0

YF8/H9/K0

M(1Rx4)

1G x 4 * 18 pcs

4Gb

B-die

Now

Now

4Gb

B-die

M392B2G70BM0

YF8/H9/K0

N(2Rx4)

2G
x4 * 18 pcs
DDP

M392B2G73BM0

YF8/H9

V(4Rx8)

1G
x8 * 18 pcs
DDP

4Gb

B-die

M392B4G70BE0

YF8/H9

U(4Rx4)

4G
x4 * 18 pcs
QDP

4Gb

B-die

16GB

32GB

Composition

Comp.
Version

Org.

* NOTE : 1.35V product is 1.5V operatable.

- 10 -

78 ball
18.75mm
FBGA
78 ball
18.75mm
FBGA

Now
Now
Now

NOTE

Dec. 2012

Product Guide

DDR3 SDRAM Memory

4.11 240Pin DDR3 LRDIMM (1.5V Product)


240Pin DDR3 LDIMM
Org.

4G x 72

8G x 72

Density

Part Number

Speed

M386B4G70BM0

CMA

32GB

64GB

Raw Card

C(4Rx4)
M386B4G70DM0

CMA

M386B8G70BO0

CK0

E(8Rx4)

Composition

Comp.
Version

2G
x 4 * 36 pcs
DDP

4Gb

2G
x 4 * 36 pcs
DDP

4Gb

D-die

4G
x 4 * 36 pcs
QDP

4Gb

B-die

Internal
Banks

Rank

B-die

PKG

Height

78 ball
30.35mm
FBGA
78 ball
30.35mm
FBGA

Internal
Banks

Rank

78 ball
30.35mm
FBGA

78 ball
30.35mm
FBGA

Avail.

NOTE

Now
2Q13

1)

Now

* NOTE
1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.

4.12 240Pin DDR3 LRDIMM (1.35V Product)


240Pin DDR3 LDIMM
Org.

Density

Part Number

Speed

2G x 72

16GB

M386B2G70DM0

YH9/K0

M386B4G70BM0

YH9/K0

4G x 72

8G x 72

Raw Card

C(4Rx4)

32GB

64GB

M386B4G70DM0

YH9/K0

M386B8G70BO0

YF8/H9

E(8Rx4)

Composition

Comp.
Version

1G
x 4 * 36 pcs
DDP

2Gb

D-die

2G
x 4 * 36 pcs
DDP

4Gb

B-die

2G
x 4 * 36 pcs
DDP

4Gb

D-die

4G
x 4 * 36 pcs
QDP

4Gb

B-die

* NOTE
1) LRDIMM Part Number includes memory buffer digit, which is 13th. For more information, please refer to 13page.

- 11 -

PKG

Height

78 ball
30.35mm
FBGA

Avail.

NOTE

Now
Now
1)
2Q13
Now

Dec. 2012

Product Guide

DDR3 SDRAM Memory

5. RDIMM RCD Information


5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example

4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2

Made in Korea

M393B5270DH0-CK0

1102

5.3 RCD Information


- Example
JEDEC Description

PKG

RCD Vendor

RCD Version(Rev.)

1Gb F-die
2Gb C-die
4Gb A-die

IDT

HLB(B0)

D2

Inphi

GS04(1.5V)/LV-GS02(1.35V)

P1

IDT

A1(evergreen)

D3

Inphi

UV-GS02

P2

IDT

B1

D4

Inphi

XV-GS02

P3

1Gb G-die
2Gb D-die
4Gb B-die
2Gb E-die
2Gb E-die
4Gb C-die
4Gb D-die

(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)

* NOTE
1) PC3L is used for 1.35V
2) RCD information is subject to change.

- 12 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

6. LRDIMM Memory Buffer Information


6.1 Label Example

32GB 4Rx4 PC3L - 10600L - 09 - 11 - C0

Made in Korea

M386B4G70BM0-YH90 1102

6.2 Memory Buffer Information


- Example
Voltage

Vendor

Revision

Module P/N

JEDEC Description On Label

Inphi

iMB02-GS02A

M386B4G70BM0-YH901

32GB 4Rx4 PC3L-10600L-09-11-C0

Montage

MB C0

M386B4G70BM0-YH921

32GB 4Rx4 PC3L-10600L-09-11-C0

Inphi

iMB02-GS02A

M386B4G70BM0-CMA31

32GB 4Rx4 PC3-14900L-13-11-C0

IDT

A2

M386B4G70BM0-CMA11

32GB 4Rx4 PC3-14900L-13-11-C0

Montage

MB C1

M386B4G70BM0-CMA41

32GB 4Rx4 PC3-14900L-13-11-C0

1.35V

1.5V

* NOTE
1) The 16th digit refers memory buffer vendor and revision.
0: Inphi iMB02-GS02A
1: IDT A2
2: Montage MB C0
3: Inphi iMB02-GS02B
4: Montage MB C1
2) Memory buffer information is subject to change.

- 13 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

7. Package Dimension

7.50 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

3.20

#A1

11.00 0.10

0.80 x12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

0.50 0.05

0.80 1.60

11.00 0.10

(Datum A)

0.10MAX

78Ball FBGA for 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)

0.35 0.05

(0.95)

78 - 0.45 Solder ball


(Post Reflow 0.05 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

BOTTOM VIEW

TOP VIEW

7.50 0.10

0.80 x 8 6.40

#A1 INDEX MARK

3.20

#A1

0.80 x12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

11.00 0.10

1.60

11.00 0.10

0.80

(Datum A)

0.10MAX

78Ball FBGA Flip chip for 2Gb E-die (x4/x8)

78 - 0.48 Solder ball


(Post Reflow 0.50 0.05)

0.37 0.05

(0.30)
(0.60)

MOLDING AREA

1.10 0.10

0.2 M A B

BOTTOM VIEW

TOP VIEW

- 14 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

8.00 0.10
0.80 x 8 = 6.40
(Datum A)

0.80

1.60

0.10MAX

78Ball DDP for 2Gb C-die (x4/x8)

A
#A1 INDEX MARK

3.20

#A1
9 8 7 6 5 4 3 2 1

11.00 0.10

11.00 0.10

0.80 x12 = 9.60

0.80

0.80

4.80

A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N

8.00 0.10

0.35 0.05
78 - 0.45 Solder ball
(Post Reflow 0.50 0.05)

1.40 0.10

0.2 M A B

TOP VIEW

BOTTOM VIEW

0.80

(Datum A)

1.60

A
#A1 INDEX MARK

3.20

#A1

0.80 x12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

11.00 0.10

0.80 x 8 6.40

11.00 0.10

7.50 0.10

0.10MAX

78Ball DDP for 2Gb D-die (x4/x8)

0.35 0.05
78 - 0.45 Solder ball
(Post Reflow 0.50 0.05)

1.10 0.10

0.2 M A B

TOP VIEW

BOTTOM VIEW

- 15 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

78Ball DDP for 4Gb A-die (x4/x8)


A

0.10MAX

10.50 0.10
0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80 x12 = 9.60

9 8 7 6 5 4 3 2 1

#A1

10.50 0.10

12.00 0.10

0.80

12.00 0.10

(Datum A)

78 - 0.45 0.05Solder ball


(Post Reflow 0.50 0.05)

0.35 0.05
1.10 0.10

0.2 M A B

BOTTOM VIEW

TOP VIEW

78Ball DDP for 4Gb B-die (x4/x8)


A

0.10MAX

11.00 0.10
0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80 x12 = 9.60

9 8 7 6 5 4 3 2 1

#A1

11.00 0.10

11.00 0.10

0.80

11.00 0.10

(Datum A)

78 - 0.45 0.05 Solder ball


(Post Reflow 0.50 0.05)

0.35 0.05
1.10 0.10

0.2 M A B

BOTTOM VIEW

TOP VIEW

- 16 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

78Ball FBGA for 4Gb B-die (x4/x8)


10.00 0.10

0.10MAX

0.80 x 8 = 6.40
3.20
0.80

#A1 INDEX MARK

1.60

0.80 x12 = 9.60

4.80
0.80
0.80

(Datum B)

10.00 0.10

11.00 0.10

9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N

#A1

11.00 0.10

(Datum A)

78 - 0.45 Solder ball


(Post Reflow 0.50 0.05)

0.35 0.05

(0.95)

0.2 M A B

MOLDING AREA
1.10 0.10

(1.90)

BOTTOM VIEW

TOP VIEW

78Ball FBGA for 4Gb C-die (x4/x8)


8.50 0.10

0.10MAX

0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60

78 - 0.48 Solder ball


(Post Reflow 0.50 0.05)

0.80 x12 = 9.60

4.80
0.80
A

8.50 0.10

0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

#A1

9 8 7 6 5 4 3 2 1

11.00 0.10

0.80

11.00 0.10

(Datum A)

(0.30)
(0.60)

0.37 0.05

MOLDING AREA

1.10 0.10

0.20 M A B

BOTTOM VIEW

TOP VIEW

- 17 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

78Ball FBGA for 4Gb D-die (x4/x8)


7.50 0.10

0.10MAX

0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
A

7.50 0.10

0.80

(Datum B)

0.80 x12 = 9.60

9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N

#A1

11.00 0.10

0.80

11.00 0.10

(Datum A)

78 - 0.48 Solder ball


(Post Reflow 0.50 0.05)

(0.30)

0.37 0.05
(0.60)

MOLDING AREA
1.10 0.10

0.20 M A B

TOP VIEW

BOTTOM VIEW

3.20

#A1 INDEX MARK


#A1

(0.30)

78 - 0.48 Solder ball


(Post Reflow 0.05 0.05)
0.2 M A B

0.80 x12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

0.50 0.05

0.80 1.60

11.00 0.10

(Datum A)

11.00 0.10

7.50 0.10
0.80 x 8 = 6.40

0.10MAX

78Ball FBGA Flip chip for 1Gb G-die (x4/x8)

0.35 0.05
MOLDING AREA

1.10 0.10

(0.60)

Top

Bottom

- 18 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

8. Module Dimension
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

128.95

ECC

SPD

17.30

9.50

N/A

(for x64)

2.30

(for x72)

30.00 0.15

(4X)3.00 0.1

133.35 0.15

(2)
2.50
54.675
A

47.00

Max 4.0

71.00

N/A

(for x64)

ECC

(for x72)

2.50 0.20

1.270 0.10

5.00

0.80 0.05

3.80

0.2 0.15

1.500.10

1.00

2.50

Detail A

Detail B

- 19 -

2x 2.10 0.15

Dec. 2012

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM ECC VLP UDIMM

Units : Millimeters

133.35 0.15
Max 4.0

18.75 0.15

128.95

SPD/TS

54.675
1.0 max

47.00

1.27 0.10

71.00
C

2x 2.10 0.15

2.50 0.20

5.00

0.80 0.05

3.80

0.2 0.15

1.500.10
2.50

Detail A

1.00

Detail B

- 20 -

(2)xR0.8

Detail C & D

Dec. 2012

Product Guide

DDR3 SDRAM Memory


Units : Millimeters

x64 204pin DDR3 SDRAM Unbuffered SODIMM


67.60 0.13
63.60

20.00

SPD

30.00 0.13

Max 3.8

1.00 0.10
24.80

A
21.00

B
39.00

2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 0.10
0.10 M C A B

0.60
0.45 0.03

1.65

4.00 0.10

2.55
0.25 MAX

1.00 0.10

Detail A

Detail B

- 21 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory


Units : Millimeters

x72 204 pin DDR3 SDRAM ECC Unbuffered SODIMM


67.60 0.13
63.60

20.00

30.00 0.13

Max 3.8

1.00 0.10
24.80

B
39.00

21.00
SPD

2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 0.10
0.10 M C A B

0.60
0.45 0.03

1.65

4.00 0.10

2.55
0.25 MAX

1.00 0.10

Detail A

Detail B

- 22 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM Registered DIMM


Units : Millimeters
C

128.95
32.40

18.93

9.74

Max 4.0

54.675

2.30

2.50
A

1.0 max

47.00

1.27 0.10

2.50 0.20

71.00

5.00

0.80 0.05

3.80

0.2 0.15

1.00

10.9

1.500.10

Detail A

Detail B

Detail C

2x 2.10 0.15

Register

2.50

17.30

Register

30.00 0.15

18.92

0.
50

10.9

9.50

9.76

(2X)3.00

133.35 0.15

Address, Command and Control lines

- 23 -

0.4

Dec. 2012

Product Guide

DDR3 SDRAM Memory

Registered DIMM Heat Spreader Design


1. FRONT PART
Outside

R0.2

4.65 0.12

2 0.1

2.6 0.2

0.4

Inside
Green Line : TIM Attatch Line

7.45

Reg. pedestal line

80.78
119.29
128.5

2. BACK PART
Outside

Inside

0.15
1.3

Green Line : TIM Attatch Line

- 24 -

1.3

1
0.
R

127 0.12

25.6 0.15

31.4

23.6 0.15

11.9

29.77

25.6 0.15

0.65 0.2

130.45 0.15

9.26

1+0/ -0.3

133.15 0.2

Dec. 2012

Product Guide

DDR3 SDRAM Memory

3. CLIP PART
39.3 0.2
Upper Bending
Tilting Gap

29.77

6.3 0.12

5
1.
R

7.3 0.1

44.4

0.1 ~ 0.3

0.5

4. DDR3 RDIMM ASSY View


Reference thickness total (Maximum) : 7.55mm (With Clip thickness)

3.77

1.27

133.15

7.3 0.1

19 0.12

19 0.12

39.3 0.2

D
text mark D
punch press_stamp

- 25 -

Clip open size


2.6~3.8

Dec. 2012

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM VLP Registered DIMM

Units : Millimeters
133.35 0.15
128.95
C
20.92

32.40

20.93

Max 4.0
9.74

Register

18.75 0.15

9.76

54.675
A

12.60

47.00

1.0 max

71.00

1.27 0.10
SPD/TS

2.50 0.20

18.10

0.80 0.05
9.9

3.80

0.6

5.00

0.2 0.15

Detail B

Detail C

VTT

Register

Detail A

1.00

2.50

VTT

0.
50

1.500.10

VTT

VTT

SPD/TS

Address, Command and Control lines

- 26 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design (DDP)


1. FRONT PART
Outside
130.45
67
20.82

35.98

20.82

8.69

14.3

0.4

8.69

Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

2. BACK PART
Outside

Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

- 27 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

3. CLIP PART

35.82

9.16 0.12

7.2 0.1

9.16

9.16 0.12

7.2 0.1

Clip open size


3.0~4.3

SIDE-L

0.1

FRONT

SIDE-R

4. ASSY VIEW

7.55

Reference thickness total (Maximum) : 7.55 (With Clip thickness)

TIM Thickness 0.25

- 28 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design (QDP)


1. FRONT PART
Outside

127 0.12
51.97
36.56
21.15

9.07

9.07

9.07

9.07

Caution
"Hot surfoce"

11.6

51.95

Inside

2. BACK PART

Outside

Inside

- 29 -

13.60.15

Dec. 2012

Product Guide

DDR3 SDRAM Memory

3. CLIP PART
36.82 0.12

Clip open size


3.85 0.65

SIDE-L

7.40 0.1

9.16

9.16 0.12

9.16

7.40 0.1

QU
0.40 0.05

FRONT

SIDE-R

4. ASSY VIEW

Reference thickness total (Maximum) : 8 (With Clip thickness)

TIM Thickness 0.25

- 30 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory


Units : Millimeters

x72 240pin DDR3 SDRAM LRDIMM

Max 4.8

2.30

2.50

17.30

9.50

30.35 0.15

(2X)3.00

133.35 0.15

54.675
B

A
47.00

2.50 0.20

71.00

0.80 0.05
9.9

3.80

0.6

5.00

0.2 0.15
0.
50

1.500.10

1.00

2.50

Detail C

VTT
VTT

VTT

VTT

VTT

Detail B

VTT

Detail A

1.27

VTT

VTT

MB

Address, Command and Control lines

- 31 -

Dec. 2012

Product Guide

DDR3 SDRAM Memory


Units : Millimeters

x72 244pin DDR3 SDRAM Mini DIMM

82.00 0.15

78.00 0.1

33.60

38.40

1.80 0.075

3.20

75.60

2.55 0.20

6.00

17.90 0.15

SPD

B
Max 4.0

2.55 0.20

1.270 0.10

3.60
2.30 1.30

0.45 0.03

3.800.10

0.25 0.15

1.000.10

Detail A

0.60

Detail B

- 32 -

2x 2.00 0.15