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Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 Contents 1. System Overview 1 1-2 1.1. Positioning of the Modular

Contents

1. System Overview

1

1-2

1.1.

Positioning of the Modular S7 Controllers

1-3

1.1.1.

Positioning of the S7-1500

1-4

1.1.2.

Highlights of the SIMATIC S7-1500 System

1-4

1.1.3.

Overview of

Available Central Modules

1-5

1.1.4.

Overview of Available Signal Modules (Central)

1-5

1.2.

SIMATIC S7-1500: Modular Controller for the Mid to Upper Performance Range

1-6

1.2.1.

SIMATIC S7-1500:

Modules

1-7

1.2.1.1.

SIMATIC S7-1500: Installation and Mounting Positions

1-9

1.2.1.2.

SIMATIC

S7-1500:

Module Assembly

1-10

1.2.1.3.

SIMATIC

S7-1500:

Connection Technology/Front Connector

1-10

1.2.2.

SIMATIC S7-1500: CPU Display Overview

1-12

1.2.2.1.

SIMATIC S7-1500: CPU Display Menu and Colors

1-13

1.2.2.2.

SIMATIC S7-1500: CPU Display Operations

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1.2.2.3.

SIMATIC S7-1500: CPU-Display Access and Anti-theft Protection

1-14

1.3.

SIMATIC

S7-1200/1500:

Technology Functions

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1.4.

SIMATIC S7-1200/1500: Memory Card(s) Overview

1-16

1.4.1.

SIMATIC S7-1200/1500: Memory Card Properties

1-17

1.4.2.

SIMATIC S7-1200/1500: Memory Model

1-18

1.4.3.

SIMATIC S7-1200/1500: Memory Concept with CPU Memory Reset

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1.4.4.

SIMATIC S7-1200/1500: Memory Concept with CPU Reset to Factory Settings

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1.5.

Distributed I/O

1-21

1.5.1.

Positioning of the Distributed Signal Modules

1-21

1.5.2.

Overview of Available Signal Modules (Distributed)

1-21

1.5.3.

ET 200SP: Size-optimized Modular Distributed I/O System

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1.5.4.

ET 200SP: Configuration and Maximum Number of Modules

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1.5.5.

ET 200MP: Modular Distributed I/O System

1-24

1.5.6.

ET 200MP: Configuration and Maximum Number of Modules

1-25

1.6.

Tips and Tricks

1-26

1.6.1.

Power Budgeting for System Power Supply of S7-1500 and ET200MP

1-26

1.7.

Exercises: Preparing the Training Area for HW Commissioning

1-27

1.7.1.

Exercise 1: Resetting the CPU to Factory Settings using the Display

1-27

1.7.2.

Exercise 2: Determining the Modules of the Training Area

1-28

1.8.

Additional Information

1-29

1.9.

Firmware

Update

1-30

1.9.1.

Firmware Update Offline using SIMATIC Memory Card with the Windows Explorer

1-30

1.9.2.

Firmware Update: Offline using STEP7 by means of Card Creation in the TIA Portal

1-31

1.9.3.

Firmware Update: Online using STEP 7 in the TIA Portal

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1.9.4.

Firmware

Update Important Facts

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

1-1

Solution Partner Certification Workshop S7-1500 1. System Overview 1-2 This chapter provides an overview of

Solution Partner Certification Workshop S7-1500

1. System Overview

Partner Certification Workshop S7-1500 1. System Overview 1-2 This chapter provides an overview of the S7
Partner Certification Workshop S7-1500 1. System Overview 1-2 This chapter provides an overview of the S7

1-2

This chapter provides an overview of the S7 system family.

Participants will become familiar with the new Controller S7-1500. They will gain an overview of modules and submodules.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.1. Positioning of the Modular S7 Controllers SIMATIC S7 The programmable

1.1. Positioning of the Modular S7 Controllers

S7-1500 1.1. Positioning of the Modular S7 Controllers SIMATIC S7 The programmable logic controllers can be

SIMATIC S7

The programmable logic controllers can be divided into the micro PLC (S7-1200) and the mid/upper (S7-1500) performance ranges.

The existing lower/mid performance range (S7-300) and the mid/upper performance range (S7- 400) will be covered in future by an S7-1500 system.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.1.1. Positioning of the S7-1500 At the start of the

Solution Partner Certification Workshop S7-1500

1.1.1. Positioning of the S7-1500

Workshop S7-1500 1.1.1. Positioning of the S7-1500 At the start of the introduction of the new

At the start of the introduction of the new S7-1500 CPU system, modular CPUs are only available up to the mid performance range.

1.1.2. Highlights of the SIMATIC S7-1500 System

range. 1.1.2. Highlights of the SIMATIC S7-1500 System 1-4 Solution Partner Certification Workshop S7-1500 Training

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.1.3. Overview of Available Central Modules The S7-1200 and S7-1500

1.1.3. Overview of Available Central Modules

S7-1500 1.1.3. Overview of Available Central Modules The S7-1200 and S7-1500 product range will be expanded

The S7-1200 and S7-1500 product range will be expanded in the next years such that the S7-300 and even the S7-400 can be completely replaced.

1.1.4. Overview of Available Signal Modules (Central)

1.1.4. Overview of Available Signal Modules (Central) The S7-1200 and S7-1500 signal module product range will

The S7-1200 and S7-1500 signal module product range will be expanded in the next years such that the S7-300 and even the S7-400.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.2. SIMATIC S7-1500: Modular Controller for the Mid to Upper

Solution Partner Certification Workshop S7-1500

1.2. SIMATIC S7-1500: Modular Controller for the Mid to Upper Performance Range

Modular Controller for the Mid to Upper Performance Range Features Modular control system for the mid

Features

Modular control system for the mid to upper performance range

 

Scaled CPU range

 

Display for basic CPU settings (system time, interfaces

)

and for calling diagnostic and

status information (diagnostic buffer, message display, CPU state

)

Extensive range of modules

 

High performance I/O bus for efficient process interfacing via central I/O

Can be expanded up to 32 modules in one tier Currently only single-tier assembly possible. Multi-tier assembly using distributed

expanded up to 32 modules in one tier Currently only single-tier assembly possible. Multi-tier assembly using
 

ET200MP.

Can be networked with PROFIBUS or PROFINET

 

Slot rules

left of the CPU:

 

1x power supply (PM or PS)

right of the CPU:

signal modules (digital, analog), technology modules, communication modules and further power supplies

No slot rules for modules to the right of the CPU

 

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.2.1. SIMATIC S7-1500: Modules Slot Rules 1x PS/PM Slot 0 1x

1.2.1. SIMATIC S7-1500: Modules

Workshop S7-1500 1.2.1. SIMATIC S7-1500: Modules Slot Rules 1x PS/PM Slot 0 1x CPU in Slot

Slot Rules

1x PS/PM Slot 0

1x CPU in Slot 1

As of Slot 2 any

Signal Modules

Digital input modules:

24VDC,

230VAC

Digital output modules:

24VDC, 230VAC

Analog input modules:

voltage, current, resistance, thermocouple

Analog output modules:

voltage, current

Communication Modules (CP - Communication Processor, CM - Communication Module)

Point-to-point connection

PROFIBUS

PROFINET

PROFINET

CPs and CMs are both communication modules. CPs have, as a rule, somewhat more functionality than CMs (e.g. own web server, firewall, or the like).

Technology Modules (TM - Technology Module)

Counting

Position sensing

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 Power Supply I/O modules in the central rack of the

Solution Partner Certification Workshop S7-1500

Power Supply

I/O modules in the central rack of the S7-1500 require a system power supply via the backplane bus (communication connection to the CPU) and a load power supply (input or output circuits for sensors/encoders and actuators).

PM - Power Module Load Power Supply supplies modules with 24VDC for input and output circuits as well as sensors/encoders and actuators

the CPU is supplied 24V via a load power supply (PM), it supplies the system

the CPU is supplied 24V via a load power supply (PM), it supplies the system power supply of 12W for the first inserted I/O modules.

If

PS - Power System System Power Supply supplies S7-1500 modules in the central rack via the backplane bus Each CPU offers a system power supply of 12W for the first inserted I/O modules. Depending on the I/O modules used, further power segments have to be set up, as required.

the first inserted I/O modules. Depending on the I/O modules used, further power segments have to
used, further power segments have to be set up, as required. A system power supply (PS)

A system power supply (PS) can also supply the load circuit for 24VDC modules in

addition to the CPU.

Power Supply and Power Segments of the I/O Modules

It is necessary to set up power segments in the central rack for larger configurations or

configurations with greater I/O module power requirements (as a rule, when using CP, CM, TM).

A

maximum of 3 power segments can be set up per rack (1xCPU segment plus 2 more).

If

the configuration includes additional power segments, additional system power supply modules

(PS) are inserted to the right next to the CPU. The CPU continues to control all modules of the rack. Only the system power supply of the I/O modules is subdivided here.

Example of a Small S7-1500 Configuration

is subdivided here. Example of a Small S7-1500 Configuration Example of an S7-1500 Configuration with a
is subdivided here. Example of a Small S7-1500 Configuration Example of an S7-1500 Configuration with a

Example of an S7-1500 Configuration with a 2nd Power Segment

Example of an S7-1500 Configuration with a 2nd Power Segment Interface Modules for Expansion Rack A

Interface Modules for Expansion Rack

A central multi-tier assembly is not planned. An expansion can be realized using the distributed

ET200MP I/O system.

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.2.1.1. SIMATIC S7-1500: Installation and Mounting Positions Installation

1.2.1.1. SIMATIC S7-1500: Installation and Mounting Positions

SIMATIC S7-1500: Installation and Mounting Positions Installation The modules are mounted on an S7-1500 profile

Installation

The modules are mounted on an S7-1500 profile rail.

Bus Connector

If the installation is made on the profile rail, the modules are then connected with the U- connector.

The U-connector establishes the mechanical and electrical connection between the modules and

is included with every I/O module.

Mounting Positions

horizontal or vertical mounting is possible. Caution! With a vertical mounting, the maximum allowed ambient temperature is 20 °C lower (ambient temperature 0 to 40 °C).

A

is 20 °C lower (ambient temperature 0 to 40 °C). A Integrated Mounting Rail For the

Integrated Mounting Rail

For the S7-1500 CPU, there is a profile rail on which components can also be mounted according

to EN 60715. With that, even terminals, miniature circuit breakers, small contactors or similar

components can be mounted in addition to the S7-1500.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.2.1.2. SIMATIC S7-1500: Module Assembly The module assembly is similar

Solution Partner Certification Workshop S7-1500

1.2.1.2. SIMATIC S7-1500: Module Assembly

Workshop S7-1500 1.2.1.2. SIMATIC S7-1500: Module Assembly The module assembly is similar to that of the

The module assembly is similar to that of the S7-300.

Click-In Assembly

Optionally, you can order an insert-able square profile that enables a click-in assembly of modules instead of screws.

1.2.1.3. SIMATIC S7-1500: Connection Technology/Front Connector

SIMATIC S7-1500: Connection Technology/Front Connector By swinging up the release latch, you can pull the front

By swinging up the release latch, you can pull the front connector and remove it from the module.

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Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 Properties of the Front Connector In each case 40 terminals Clamping
Solution Partner Certification Workshop S7-1500 Properties of the Front Connector In each case 40 terminals Clamping

Properties of the Front Connector

In each case 40 terminals

Clamping techniques:

Screw-type terminal

SIMATIC TOP connect System wiring for the connection of sensors/encoders and actuators S7-1500 front connector wired with 20 or 40 single conductors (prefabricated)

Prewiring Position

The front connector latches up in the front cover. In this position, the front connector still juts out of the module, but the front connector and the module are not yet electrically connected.

Jumper Links

The jumper links can be inserted in the front connector in four places for easier set up of load groups. That is, looping the supply voltage to several potential groups. Only one connection from left to right exists!

Automatic Coding of the I/O Modules

This enables a faster and safer exchange of the front connector.

enables a faster and safer exchange of the front connector. Shield Connection (Analog Signals, Signals to

Shield Connection (Analog Signals, Signals to Technology Modules)

The cable clamp is a pluggable mounting support for modules with EMC-critical signals (e.g. analog modules, TMs) and enables the low impedance connection of cable shielding and minimum installation times.

Cable clamp and shielding terminal are included with analog modules and TMs.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 Two Front Door Latching Positions At the bottom of the

Solution Partner Certification Workshop S7-1500

Two Front Door Latching Positions

At the bottom of the front cover there are 2 different latching positions for different space requirements of the conductor bundle.

Cable storage space that grows with the need (AWG cabling) American Wire Gauge (AWG) is an American standard measure for copper wires which defines the wire strength and the allowed damping, whereby a lower AWG value represents a thicker wire.

1.2.2. SIMATIC S7-1500: CPU Display Overview

wire. 1.2.2. SIMATIC S7-1500: CPU Display Overview 1-12 Solution Partner Certification Workshop S7-1500

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.2.2.1. SIMATIC S7-1500: CPU Display Menu and Colors Depending on the

1.2.2.1. SIMATIC S7-1500: CPU Display Menu and Colors

1.2.2.1. SIMATIC S7-1500: CPU Display Menu and Colors Depending on the current CPU state, the color

Depending on the current CPU state, the color on the Display varies. Available languages are the available user interface languages of STEP7.

Additional Symbols in the Status Information

Password is configured but not enteredof STEP7. Additional Symbols in the Status Information Password is configured and entered An Alarm exists

Password is configured and enteredStatus Information Password is configured but not entered An Alarm exists A Force job is active

An Alarm existsbut not entered Password is configured and entered A Force job is active on the CPU

A Force job is active on the CPUentered Password is configured and entered An Alarm exists Solution Partner Certification Workshop S7-1500 Training

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.2.2.2. SIMATIC S7-1500: CPU Display Operations In the bottom Display

Solution Partner Certification Workshop S7-1500

1.2.2.2. SIMATIC S7-1500: CPU Display Operations

S7-1500 1.2.2.2. SIMATIC S7-1500: CPU Display Operations In the bottom Display line, "ESC" appears on the

In the bottom Display line, "ESC" appears on the left or "OK" on the right when one or both buttons can be operated to execute a function.

1.2.2.3. SIMATIC S7-1500: CPU-Display Access and Anti-theft Protection

S7-1500: CPU-Display Access and Anti-theft Protection The settings for Standby mode and Energy-saving mode can be

The settings for Standby mode and Energy-saving mode can be defined via the Display as well as via the device configuration of the CPU.

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.3. SIMATIC S7-1200/1500: Technology Functions High-speed Counters Up to

1.3. SIMATIC S7-1200/1500: Technology Functions

S7-1500 1.3. SIMATIC S7-1200/1500: Technology Functions High-speed Counters Up to 6 high-speed counters, 3 at 100

High-speed Counters

Up to 6 high-speed counters, 3 at 100 kHz and 3 at 30 kHz are available for precise monitoring of incremental encoders, frequency counting or counting of highly frequent process events.

Motion

 

To control rotary speed, position or pulse duty factor, a total of 2 PWM outputs (pulse width modulation) are available. Application examples are, for example, controlling the speed of a motor, position of a valve, or the mark-to-space ratio for a heating element. For rotary speed and position controls, a total of 2 PTO outputs at 100 kHz (pulse train output) are available.

It supplies a pulse train for controlling speed and position of stepper or servo motors.

PID

For simple closed-loop control tasks, up to 16 PID control circuits with automatic PID adjustment and tuning control panel are available.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.4. SIMATIC S7-1200/1500: Memory Card(s) Overview Memory Card Binding –

Solution Partner Certification Workshop S7-1500

1.4. SIMATIC S7-1200/1500: Memory Card(s) Overview

S7-1500 1.4. SIMATIC S7-1200/1500: Memory Card(s) Overview Memory Card Binding – Copy Protection The executability of

Memory Card Binding – Copy Protection

The executability of the program can be bound to the serial number of the card.

Load Memory

S7-1500

This has no integrated load memory and therefore it is imperative that a card is inserted.

S7-1200

This has an integrated load memory. Here, an inserted memory card can replace (expand) the integrated load memory or the card can be used for program updates (distribution of programs).

Distribution of Programs only S7-1200

The use as Transfer card (card mode = "Transfer") is only supported by the S7-1200. Here, a program can be downloaded into the CPU without a PG if a card is inserted.

Archiving of Data only S7-1500

It is possible to archive process values on the card. The use of this functionality influences the operating life of the Memory Card

influences the operating life of the Memory Card 1-16 Solution Partner Certification Workshop S7-1500

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.4.1. SIMATIC S7-1200/1500: Memory Card Properties Insertion of SD Cards

1.4.1. SIMATIC S7-1200/1500: Memory Card Properties

S7-1500 1.4.1. SIMATIC S7-1200/1500: Memory Card Properties Insertion of SD Cards or MMC Cards Contacts must

Insertion of SD Cards or MMC Cards

Contacts must face upwards!

Number of Delete/Write Operations

With an ambient temperature of up to 60 °C, at least 500,000 delete/write operations are possible on the SIMATIC Memory Card.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.4.2. SIMATIC S7-1200/1500: Memory Model 1.4.3. SIMATIC S7-1200/1500:

Solution Partner Certification Workshop S7-1500

1.4.2. SIMATIC S7-1200/1500: Memory Model

Workshop S7-1500 1.4.2. SIMATIC S7-1200/1500: Memory Model 1.4.3. SIMATIC S7-1200/1500: Memory Concept with CPU Memory

1.4.3. SIMATIC S7-1200/1500: Memory Concept with CPU Memory Reset

SIMATIC S7-1200/1500: Memory Concept with CPU Memory Reset Initiation of Functions STEP7 online function Memory

Initiation of Functions

STEP7 online function Memory Reset in Task Card "Test" Display (only S7-1500) Main menu "Settings", submenu "Reset"

Function Execution with Inserted SIMATIC Card CPU is reset to the loading state of the user program.

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 Function Execution without or with Deleted SIMATIC Card CPU has no

Function Execution without or with Deleted SIMATIC Card

CPU has no user program

1st. interface (X1) has retained parameters (e.g. X1=PN has retained its IP address)

All other interfaces are deactivated, that is, without parameters

1.4.4. SIMATIC S7-1200/1500: Memory Concept with CPU Reset to Factory Settings

Memory Concept with CPU Reset to Factory Settings Initiation of Functions STEP7 online function Reset to

Initiation of Functions

STEP7 online function Reset to factory settings in "Online & diagnostics"

Display (only S7-1500) Main menu "Settings", submenu "Reset"

Function Execution with Inserted SIMATIC Card

CPU is reset to the loading state of the user program

Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted

Function Execution without or with Deleted SIMATIC Card

Factory reset using STEP7 online function CPU has no user program

reset using STEP7 online function CPU has no user program Selection for X1 interface All other

Selection for X1 interface All other interfaces are deactivated, that is, without parameters Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted

Factory reset using Display (only S7-1500) CPU has no user program All interfaces are deactivated, that is, without parameters Diagnostic buffer, Operating hours counter and CPU Time-of-day are deleted

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Solution Partner Certification Workshop S7-1500 1-20 Solution Partner Certification Workshop S7-1500 Training Document V13

Solution Partner Certification Workshop S7-1500

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.5. Distributed I/O 1.5.1. Positioning of the Distributed Signal Modules

1.5. Distributed I/O

1.5.1. Positioning of the Distributed Signal Modules

I/O 1.5.1. Positioning of the Distributed Signal Modules 1.5.2. Overview of Available Signal Modules (Distributed)

1.5.2. Overview of Available Signal Modules (Distributed)

1.5.2. Overview of Available Signal Modules (Distributed) The ET200SP and ET200MP product range will be expanded

The ET200SP and ET200MP product range will be expanded in the next years such that these two product lines completely cover the applications of the ET200S and ET200M.

The ET200pro (interface modules for connection to PROFINET or PROFIBUS) in the degree of protection IP65/67for use directly at the machine will continue to be offered.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.5.3. ET 200SP: Size-optimized Modular Distributed I/O System For STEP7

Solution Partner Certification Workshop S7-1500

1.5.3. ET 200SP: Size-optimized Modular Distributed I/O System

ET 200SP: Size-optimized Modular Distributed I/O System For STEP7 V11 there is an HSP and for

For STEP7 V11 there is an HSP and for STEP7 V5.5 or third-party systems there is a GSDML file.

To expand the module spectrum, CMs (AS-i master, AS-i F-modules, IO-link master), a TM (1 POS input) and a motor starter are in the planning stage.

2d Matrix Code

This code is used for identifying modules and can be photographed or decoded by SmartPhones, PDAs, iPhones and the like.

With the ET200SP modules, the code contains an Internet link to the product page of the associated module.

Internet link to the product page of the associated module. Color Coding of the Module Class
Internet link to the product page of the associated module. Color Coding of the Module Class
Internet link to the product page of the associated module. Color Coding of the Module Class

Color Coding of the Module Class

Each module class is marked with a colored square to make it easier to recognize the module functionality.

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Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.5.4. ET 200SP: Configuration and Maximum Number of Modules Solution

1.5.4. ET 200SP: Configuration and Maximum Number of Modules

1.5.4. ET 200SP: Configuration and Maximum Number of Modules Solution Partner Certification Workshop S7-1500 Training

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

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Solution Partner Certification Workshop S7-1500 1.5.5. ET 200MP: Modular Distributed I/O System The ET200MP enables

Solution Partner Certification Workshop S7-1500

1.5.5. ET 200MP: Modular Distributed I/O System

S7-1500 1.5.5. ET 200MP: Modular Distributed I/O System The ET200MP enables the distributed connection of S7-1500

The ET200MP enables the distributed connection of S7-1500 series central I/O modules.

Connection is made using an interface module. In the first delivery stage, only one PROFINET interface module is offered.

stage, only one PROFINET interface module is offered. For STEP7 V11, STEP7 V5.5 or third-party systems

For STEP7 V11, STEP7 V5.5 or third-party systems there is a GSDML file.

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Solution Partner Certification Workshop S7-1500 1.5.6. ET 200MP: Configuration and Maximum Number of Modules If a

1.5.6. ET 200MP: Configuration and Maximum Number of Modules

1.5.6. ET 200MP: Configuration and Maximum Number of Modules If a suitable 24VDC supply is available,

If a suitable 24VDC supply is available, it can supply the IM from the front even without a PS module in the 1st. slot.

If only a few I/O modules or low-performance I/O modules are used on the IM155, they are "supplied by the system" by the IM155 through the backplane bus.

Otherwise, power segments are also to be set up just like the configuration of a central S7-1500 rack.

up just like the configuration of a central S7-1500 rack. PS module and front-side 24VDC supply

PS module and front-side 24VDC supply to IM155:

System power supply of PS + System power supply of integrated PS of IM155

= Feed-in power of system power supply in Power Segment 1

_

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Solution Partner Certification Workshop S7-1500 1.6. Tips and Tricks 1.6.1. Power Budgeting for System Power

Solution Partner Certification Workshop S7-1500

1.6. Tips and Tricks

1.6.1. Power Budgeting for System Power Supply of S7-1500 and ET200MP

Budgeting for System Power Supply of S7-1500 and ET200MP If only a few I/O modules or

If

only a few I/O modules or low-performance I/O modules are used in the central rack of the CPU

or

on the IM155, they are "supplied by the system" by the CPU or IM through the backplane bus.

It is necessary to set up power segments for larger configurations or configurations with greater I/O module power requirements (as a rule, when using CP, CM, TM).

A maximum of 3 power segments can be set up per rack

central CPU rack: 1xCPU segment plus 2 more segments ET200MP rack: 1x IM155 segment plus 2 more segments

If the configuration includes additional power segments, additional system power supply modules

(PS) are inserted to the right next to the CPU or IM155. The CPU or the IM155 continues to control all modules of the rack. Only the system power supply of the I/O modules is subdivided here.

Power Budget

The power requirement of each module is specified in the technical data. From it, the power budget can be calculated and the need for further system power supplies can be determined.

Once the hardware is configured, a power budget of the device configuration can be taken from the properties of the CPU or the ET200MP interface module (IM155).

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Solution Partner Certification Workshop S7-1500 1.7. Exercises: Preparing the Training Area for HW Commissioning 1.7.1.

1.7. Exercises: Preparing the Training Area for HW Commissioning

1.7.1. Exercise 1: Resetting the CPU to Factory Settings using the Display

1: Resetting the CPU to Factory Settings using the Display Task The training area is to

Task

The training area is to be prepared for the next exercises.

What to Do

1. Remove the SIMATIC Memory Card from the CPU

Lift up the CPU Display and remove the card from the CPU pressing the centre of the card releases the card

2. Carry out a Reset to Factory Settings using the CPU Display

Using the cursor keys, select the menu item

3. Checking the function execution

Using the cursor keys, select the menu item successful.

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

and choose the relevant function.Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01 or and check that the

orWorkshop S7-1500 Training Document V13 - Chapter 01 and choose the relevant function. and check that

Workshop S7-1500 Training Document V13 - Chapter 01 and choose the relevant function. or and check

and check that the reset was

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Solution Partner Certification Workshop S7-1500 1.7.2. Exercise 2: Determining the Modules of the Training Area

Solution Partner Certification Workshop S7-1500

1.7.2. Exercise 2: Determining the Modules of the Training Area

Exercise 2: Determining the Modules of the Training Area Task You will make some notes and

Task

You will make some notes and get an overview of the components of the training area. In the next exercises, it is necessary to know detailed information about the modules.

Type designation and order number can be found on the module housing. The CPU device version can be accessed using the Display. Device versions (firmware, operating system) of the other modules are determined later using online functions. Addresses are given later.

Enter the type designation and order number for the above-mentioned modules in the overview on the next page.

Device type You will find the type designation on the module nameplate or imprinted at the top of the housing front.

CPU device version The CPU version can be accessed using the Display.

Order Number You will find this on the module nameplate or imprinted at the top or bottom of the housing front.

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or imprinted at the top or bottom of the housing front. 1-28 Solution Partner Certification Workshop

Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 1.8. Additional Information Solution Partner Certification Workshop

1.8. Additional Information

Certification Workshop S7-1500 1.8. Additional Information Solution Partner Certification Workshop S7-1500 Training

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Solution Partner Certification Workshop S7-1500 1.9. Firmware Update Procuring the new firmware is always the

Solution Partner Certification Workshop S7-1500

1.9. Firmware Update

Partner Certification Workshop S7-1500 1.9. Firmware Update Procuring the new firmware is always the first step.

Procuring the new firmware is always the first step. The next steps depend on the selected update possibility.

1.9.1. Firmware Update Offline using SIMATIC Memory Card with the Windows Explorer

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Solution Partner Certification Workshop S7-1500 Training Document V13 - Chapter 01

Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 7 When the CPU or the Display is updated, Step also
7
7

When the CPU or the Display is updated, Step

also recommended at the end of every module update.

is necessary in any case. However, this is

Status of the Update in the Display (only S7-1500)

Only the S7-1500 has a Display.

Status of the Update with LEDs

If the middle LED (red, error) lights up, the update was not successfully completed or it could not be carried out.

Necessary Firmware Update Files

it could not be carried out. Necessary Firmware Update Files Directory with FW files (FWUPDATE.S7S) and

Directory with FW files (FWUPDATE.S7S) and data ID file (S7_JOB.S7S)

Empty Card (Windows Explorer)

and data ID file (S7_JOB.S7S) Empty Card (Windows Explorer) Do NOT delete hidden files!!! 1.9.2. Firmware

Do NOT delete hidden files!!!

1.9.2. Firmware Update: Offline using STEP7 by means of Card Creation in the TIA Portal

using STEP7 by means of Card Creation in the TIA Portal Solution Partner Certification Workshop S7-1500

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Solution Partner Certification Workshop S7-1500 Necessary Firmware Update File e.g. FW file (MLFB_ausgabe.upd) Card

Solution Partner Certification Workshop S7-1500

Necessary Firmware Update File e.g.

Workshop S7-1500 Necessary Firmware Update File e.g. FW file (MLFB_ausgabe.upd) Card Contents The SD card for

FW file (MLFB_ausgabe.upd)

Card Contents

The SD card for the update does not necessarily have to be deleted first. During creation you are prompted:

have to be deleted first. During creation you are prompted: Yes Card is deleted and update

Yes Card is deleted and update card is created

No The update is only added to the card contents and the card type is set to "Update firmware". This can only be done for updating the Display since the program is active and CPU + I/O modules cannot be updated in this state. For updating the CPU or the Display, an empty card is necessary in order to conclude

cannot be updated in this state. For updating the CPU or the Display, an empty card
 

the update (see Step

7
7

).

For that reason, it is generally recommended to delete the "Program" card or to use a separate card for updates.

1.9.3. Firmware Update: Online using STEP 7 in the TIA Portal

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Solution Partner Certification Workshop S7-1500

Solution Partner Certification Workshop S7-1500 Before running the update, the appropriate *.upd must be selected. Before

Before running the update, the appropriate *.upd must be selected.

running the update, the appropriate *.upd must be selected. Before running an update of I/O modules,
running the update, the appropriate *.upd must be selected. Before running an update of I/O modules,

Before running an update of I/O modules, the CPU should be switched to STOP, if the active user program uses this module.

Wait until update is completed

program uses this module. Wait until update is completed CPU Update Advantage: The current "Program" card

CPU Update

Advantage: The current "Program" card is not changed. Attention ! The retentiveness is however deleted, that is, the program is then reset to the loading state.

that is, the program is then reset to the loading state. 1.9.4. Firmware Update Important Facts

1.9.4. Firmware Update Important Facts

During an update, the supply voltage must not fail or be removed.

Distributed I/O without memory card is exclusively update-able online using STEP7.

After updating the CPU or the Display (only S7-1500), the CPU should be switched off, an empty memory card inserted in the CPU and the CPU switched back on.

It is possible to do a simultaneous update of several modules offline using the memory card. Respective firmware update files are stored in the folder for Firmware update

The Sequence is Relevant if Several Module Types are Updated

1.

Update of the Display firmware (only S7-1500)

2.

Update of the central I/O modules

3.

Update of the distributed I/O modules

4.

Update of the Boot loader of the CPU

5.

Update of the CPU

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