Beruflich Dokumente
Kultur Dokumente
Datasheet
DS-PKG-16.2
f For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for
Handling J-Lead, QFP, and BGA Devices.
Table 1 lists the Altera devices and the associated table locations.
Arria II GX Devices
Table 2 lists the device name, package type, and number of pins for the Arria II GX
device family.
Arria GX Devices
Table 3 lists the device name, package type, and number of pins for the Arria GX
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Stratix IV Devices
Table 4 lists the device name, package type, and number of pins for the Stratix IV
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Stratix II Devices
Table 6 lists the device name, package type, and number of pins for the Stratix II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Stratix Devices
Table 7 lists the device name, package type, and number of pins for the Stratix device
family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Cyclone IV Devices
Table 8 lists the device name, package type, and number of pins for the Cyclone IV
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Cyclone II Devices
Table 10 lists the device name, package type, and number of pins for the Cyclone II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Cyclone Devices
Table 11 lists the device name, package type, and number of pins for the Cyclone
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Max II Devices
Table 12 lists the device name, package type, and number of pins for the MAX II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
HardCopy IV Devices
Table 15 lists the device name, package type, and number of pins for the HardCopy IV
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
HardCopy II Devices
Table 17 lists the device name, package type, and number of pins for the HardCopy II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
HardCopy Devices
Table 18 lists the device name, package type, and number of pins for the HardCopy
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
APEX II Devices
Table 20 lists the device name, package type, and number of pins for the APEX II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
ACEX 1K Devices
Table 23 lists the device name, package type, and number of pins for the ACES 1K
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Mercury Devices
Table 23 lists the device name, package type, and number of pins for the Mercury
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Excalibur Devices
Table 29 lists the device name, package type, and number of pins for the Excalibur
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Thermal Resistance
Altera follows JEDEC JESD51 series standards to provide thermal resistances. The
purpose of the JESD51 standards is to compare the thermal performance of various
packages under standardized test conditions. While standardized thermal resistances
can help compare the relative thermal performance of different packages, they cannot
apply directly to the many specific applications because JESD51 test conditions may
not match a specific application. Several factors affect the thermal performance of a
device in a user’s application. These include power dissipation in the component;
airflow velocity, direction and turbulence level; power in adjacent components;
two-sided vs. one-sided active component mounting; printed circuit board (PCB)
orientation & construction; and adjacent boards and their power dissipation. It may
be necessary to test or model specific applications. This testing and modeling of a
component user’s specific applications is the user’s responsibility.
Table 32 through Table 58 provide JA (junction-to-ambient thermal resistance) and JC
(junction-to-case thermal resistance) values for the Altera device families. Altera
reserves the right to make changes to thermal resistances in the future.
Table 31 lists the Altera devices and the associated table locations.
This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur
device families. Therefore, two thermal resistance specifications are provided for
devices affected by this change. The older packages are identified as using the
aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as
using the copper (Cu) lid.
Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered
in the newer Altera families, including Stratix and Stratix GX, were introduced using
an industry-standard Cu lid. Therefore, these device specifications include only a
single thermal resistance specification.
1 Contact Altera if you need typical +/– values of A dimensions for thermal analysis.
The max numbers are provided for physical layout.
Arria II GX Devices
Table 32 lists the thermal resistance of Arria II GX devices.
Arria GX Devices
Table 33 lists the thermal resistance of Arria GX Devices.
Stratix IV Devices
Table 34 lists the thermal resistance of Stratix IV devices.
Stratix II Devices
Table 36 lists the thermal resistance of Stratix II devices.
Stratix Devices
Table 37 lists the thermal resistance of Stratix devices.
EP1S25 FBGA,
780 0.3 10.5 8.5 7.1 6.0
Flip Chip
FBGA,
1020 0.3 10.0 8.0 6.6 5.5
Flip Chip
FBGA,
780 0.2 10.4 8.4 7.0 5.9
Flip Chip
BGA,
EP1S30 956 0.2 9.1 7.1 5.8 4.8
Flip Chip
FBGA,
1020 0.2 9.9 7.9 6.5 5.4
Flip Chip
FBGA,
780 0.2 10.4 8.3 6.9 5.8
Flip Chip
BGA,
956 0.2 9.0 7.0 5.7 4.7
Flip Chip
EP1S40
FBGA,
1020 0.2 9.8 7.8 6.4 5.3
Flip Chip
FBGA,
1508 0.2 9.1 7.1 5.8 4.7
Flip Chip
BGA,
956 0.1 8.9 6.9 5.6 4.6
Flip Chip
FBGA,
EP1S60 1020 0.1 9.7 7.7 6.3 5.2
Flip Chip
FBGA,
1508 0.1 8.9 7.0 5.6 4.6
Flip Chip
BGA,
956 0.1 8.8 6.8 5.5 4.5
Flip Chip
FBGA,
EP1S80 1020 0.1 9.6 7.6 6.2 5.1
Flip Chip
FBGA,
1508 0.1 8.8 6.9 5.5 4.5
Flip Chip
Cyclone IV Devices
Table 38 lists the thermal resistance of Cyclone IV devices.
.
Cyclone II Devices
Table 40 lists the thermal resistance of Cyclone II devices.
Cyclone Devices
Table 41 lists the thermal resistance of Cyclone devices.
MAX II Devices
Table 42 lists the thermal resistance of MAX II devices.
HardCopy IV Devices
Table 46 lists the thermal resistance of HardCopy IV devices.
HardCopy II Devices
Table 48 lists the thermal resistance of HardCopy II devices.
HardCopy Devices
Table 49 lists the thermal resistance of HardCopy devices.
APEX II Devices
Table 50 lists the thermal resistance of APEX II devices.
Table 51. Thermal Resistance of APEX 20K and 20KE Devices (Part 1 of 3)
Pin JA (° C/W) JA (° C/W) JA (° C/W) JA (° C/W)
Device Package Count JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
TQFP 144 8.0 29.0 28.0 26.0 25.0
PQFP 208 5.0 30.0 29.0 27.0 22.0
EP20K30E
FBGA 144 14.0 36.0 34.0 32.0 29.0
FBGA 324 9.0 31.0 29.0 28.0 25.0
TQFP 144 7.0 28.0 26.0 25.0 24.0
FBGA 144 11.0 33.0 32.0 30.0 27.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
EP20K60E
PQFP 240 4.0 26.0 24.0 21.0 17.0
FBGA 324 7.0 29.0 28.0 26.0 24.0
BGA 356 1.0 12.0 11.0 10.0 9.0
TQFP 144 7.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
EP20K100 PQFP 240 4.0 25.0 23.0 20.0 17.0
FBGA 324 6.0 28.0 26.0 25.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
TQFP 144 7.0 26.0 25.0 24.0 23.0
FBGA 144 9.0 32.0 30.0 29.0 26.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
EP20K100E
PQFP 240 4.0 25.0 23.0 20.0 17.0
FBGA 324 6.0 28.0 26.0 25.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
TQFP 144 6.0 25.0 24.0 23.0 22.0
PQFP 208 5.0 28.0 26.0 23.0 19.0
EP20K160E PQFP 240 4.0 24.0 21.0 19.0 16.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 24.0 23.0 22.0 21.0
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 21.0 19.0 17.0 15.0
EP20K200
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 22.0 21.0 20.0 19.0
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 22.0 19.0 18.0 16.0
BGA 356 2.0 12.0 11.0 10.0 9.0
EP20K200E
FBGA 484 5.0 23.0 22.0 21.0 20.0
BGA 652 1.0 12.0 11.0 10.0 9.0
FBGA 672 5.0 21.0 20.0 19.0 18.0
Table 51. Thermal Resistance of APEX 20K and 20KE Devices (Part 2 of 3)
Pin JA (° C/W) JA (° C/W) JA (° C/W) JA (° C/W)
Device Package Count JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 22.0 19.0 18.0 16.0
EP20K200C
BGA 356 2.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 23.0 22.0 21.0 20.0
PQFP 240 3.0 19.0 18.0 16.0 15.0
EP20K300E BGA 652 1.0 12.0 11.0 10.0 9.0
FBGA 672 5.0 20.0 19.0 18.0 17.0
BGA 652 0.5 9.0 8.0 7.0 6.0
PGA 655 1.0 8.0 7.0 6.0 4.0
EP20K400
FBGA 672 0.4 11.6 9.6 7.9 6.5
FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6
BGA 652 0.5 9.0 8.0 7.0 6.0
EP20K400E FBGA (Cu lid) 0.3 10.9 8.8 7.4 6.3
672
EP20K400C FBGA (AlSiC lid) 0.4 11.7 9.7 8.0 6.7
FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6
BGA 652 0.5 9.0 8.0 7.0 6.0
FBGA (Cu lid) 0.2 10.8 8.7 7.3 6.1
672
FBGA (AlSiC lid) 0.3 11.6 9.6 7.9 6.5
EP20K600E
FBGA w/ fin (1) 672 0.5 5.0 3.0 3.0 2.0
EP20K600C
FBGA (Cu lid) 0.2 9.9 7.8 6.5 5.4
1,020
FBGA (AlSiC lid) 0.3 10.4 8.4 6.8 5.6
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 3.0 2.0
BGA (Cu lid) 0.1 8.3 7.0 5.6 4.5
652
BGA (AlSiC lid) 0.2 9.3 7.4 6.0 4.9
FBGA w/ fin (1) 652 0.5 4.0 3.0 3.0 2.0
FBGA (Cu lid) 0.1 10.6 8.6 7.2 6.0
EP20K1000E 672
FBGA (AlSiC lid) 0.2 11.4 9.4 7.7 6.3
EP20K1000C
FBGA w/ fin (1) 672 0.5 6.0 4.0 3.0 2.0
FBGA (Cu lid) 0.1 9.7 7.7 6.3 5.2
1,020
FBGA (AlSiC lid) 0.2 10.2 8.2 6.6 5.4
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.0 2.0
Table 51. Thermal Resistance of APEX 20K and 20KE Devices (Part 3 of 3)
Pin JA (° C/W) JA (° C/W) JA (° C/W) JA (° C/W)
Device Package Count JC (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min.
BGA (Cu lid) 0.1 8.2 6.9 5.5 4.4
652
BGA (AlSiC lid) 0.2 9.2 7.3 5.8 4.8
FBGA 652 0.1 9.2 7.3 5.8 4.8
EP20K1500E FBGA w/ fin (1) 652 0.5 4.0 3.0 2.5 2.0
FBGA (Cu lid) 0.1 9.6 7.6 6.2 5.1
1,020
FBGA (AlSiC lid) 0.2 10.1 8.1 6.4 5.3
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.5 2.0
Note to Table 51:
(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera
performed the thermal calculations in Table 51 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base
thickness: 0.5 mm.
Package Outlines
The package outlines on the following pages are listed in order of ascending pin
count. Altera package outlines meet the requirements of JEDEC Publication No. 95.
1 All flip chip packages are vented packages and all wire bond packages are non-vented
packages.
Package Information
Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-001 Variation: BA
Lead Coplanarity NA
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.170
A1 0.015 — —
A2 0.130 TYP
D 0.360 — 0.380
E 0.300 0.310 0.325
E1 0.240 0.250 0.260
L 0.125 — 0.135
b 0.016 0.018 0.020
c 0.008 0.010 0.014
e 0.100 BSC
Package Outline
D
Pin 8
E1
E
Pin 1 ID
Pin 4
Pin 1
c
A2
A
A1
e
L
Package Information
Description Specification
Ordering Code Reference S
Package Acronym SOIC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ)
Pb-free: NiPdAu (Preplated)
JEDEC Outline Reference MS-012 Variation. AA
Lead Coplanarity 0.1 mm
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.35 — 1.75
A1 0.10 — 0.25
A2 1.25 — 1.65
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
L 0.40 — 1.27
L1 1.04 REF
b 0.31 — 0.51
c 0.17 — 0.25
e 1.27 BSC
0° — 8°
Package Outline
D
Pin 8
E1
E
Pin 1 ID
Pin 4
Pin 1
See Detail A
Detail A
A2
e
A1
L1
C
L
0.25mm
Gage
Plane
Package Information
Description Specification
Ordering Code Reference S
Package Acronym SOIC
Leadframe Material Copper
Lead Finish (Plating) Pb-free: NiPdAu (Preplated)
JEDEC Outline Reference MS-013 Var. AA
Lead Coplanarity 0.1 mm
Weight 0.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 — 2.65
A1 0.10 — 0.30
A2 2.05 — 2.55
D 10.30 BSC
E 10.30 BSC
E1 7.50 BSC
L 0.40 — 1.27
L1 1.40 REF
b 0.31 — 0.51
c 0.20 — 0.33
e 1.27 BSC
0° — 8°
Package Outline
Pin 16
D
E1
E
Pin 1 ID
Pin 8
Pin 1
See Detail A
Detail A
A2
b e
A1
L1
C
L
0.25mm
Gage
Plane
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AA
Lead Coplanarity 0.004 inches (0.10mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 0.385 0.390 0.395
D1 0.350 0.353 0.356
D2 0.290 0.310 0.330
E 0.385 0.390 0.395
E1 0.350 0.353 0.356
E2 0.290 0.310 0.330
b 0.013 — 0.021
c 0.010 TYP
e 0.050 TYP
Package Outline
D
D1
Pin 1
Pin 20
Pin 4
Pin 1 ID
E1
E2
E
Pin 8
c
A2
b
A1
D2
Package Information
Description Specification
Ordering Code Reference D
Package Acronym CerDIP
Leadframe Material Alloy 42
Lead Finish Regular: 63Sn:37Pb (Typ.)
JEDEC Outline Reference MS-030 Variation: AF
Lead Coplanarity NA
Weight 4.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.200
A1 0.015 0.028 0.041
D 1.240 1.260 1.280
E 0.290 0.305 0.320
E1 0.280 0.295 0.310
L 0.125 — —
b 0.015 0.018 0.021
e 0.100 BSC
Package Outline
D
Pin 24
E1
E
Pin 1 ID
Pin 12
Pin 1
c
A
A1
e b
L
Package Information
Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-001 Variation: AF
Lead Coplanarity NA
Weight 1.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.170
A1 0.015 — —
A2 0.130 TYP
D 1.245 1.250 1.255
E 0.300 0.310 0.325
E1 0.245 — 0.270
L 0.125 — 0.135
b 0.014 0.018 0.022
c 0.008 0.010 0.014
e 0.100 BSC
Package Outline
D
Pin 24
E1
E
Pin 1 ID
Pin 1
Pin 12
c
A2
A
A1
e b
L
Altera Device Package Information Data Sheet © September 2010 Altera Corporation
Altera Device Package Information Datasheet 73
Package Information
Description Specification
Ordering Code Reference S
Package Acronym SOIC
Leadframe Material Copper
Lead Finish (Plating) Regular 85Sn:15Pb (Typ)
JEDEC Outline Reference MS-013 Variation: AD
Lead Coplanarity 0.1 mm
Weight 0.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 — 2.65
A1 0.10 — 0.30
A2 2.05 — 2.55
D 15.40 BSC
E 10.30 BSC
E1 7.50 BSC
L 0.40 — 1.27
L1 1.40 REF
b 0.31 — 0.51
c 0.20 — 0.33
e 1.27 BSC
0° — 8°
Package Outline
Pin 24 D
E1
E
Pin 1 ID
Pin 1
Pin 12
See Detail A
Detail A
A2
b e A
A1
L1
C
L
0.25mm
Gage
Plane
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AB
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 0.485 0.490 0.495
D1 0.450 0.453 0.456
D2 0.382 0.410 0.438
E 0.485 0.490 0.495
E1 0.450 0.453 0.456
E2 0.382 0.410 0.438
b 0.013 — 0.021
c 0.010 TYP
e 0.050 TYP
Package Outline
D
D1
Pin 1
Pin 28
Pin 5
Pin 1 ID
E2
E1
E
Pin 11
c
A2
b
A1
D2
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ABA
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
D 9.00 BSC
D1 7.00 BSC
E 9.00 BSC
E1 7.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.30 0.37 0.45
c 0.09 — 0.20
e 0.80 BSC
0 3.5 7
Package Outline
D
D1
Pin32
Pin 1
Pin 1 ID
E1
E
Pin 8
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference D
Package Acronym CerDIP
Leadframe Material Alloy 42
Lead Finish Regular: 63Sn:37Pb (Typ.)
JEDEC Outline Reference MS-032 Variation: AD
Lead Coplanarity N/A
Weight 12.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.225
A1 0.015 0.025 0.035
D 2.030 2.050 2.070
E 0.600 0.610 0.620
E1 0.510 0.550 0.590
L 0.125 — —
b 0.016 0.018 0.020
c 0.008 0.010 0.012
e 0.100 BSC
Package Outline
Pin 40
E1
E
Pin 1 ID
Pin 20
Pin 1
c
A
A1
e b
Package Information
Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
JEDEC Outline Reference MS-011 Variation: AC
Lead Coplanarity N/A
Weight 7.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.190
A1 0.015 — —
A2 0.150 BSC
D 2.030 2.050 2.070
E 0.600 — 0.625
E1 0.520 0.540 0.560
L 0.125 — 0.135
b 0.015 0.018 0.022
c 0.008 — 0.012
e 0.100 BSC
Package Outline
Pin 40
E1
E
Pin 1 ID
Pin 20
Pin 1
c
A2
A
A1
e b
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AC
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
—
A1 0.020 —
A2 0.150 TYP
D 0.685 0.690 0.695
D1 0.650 0.653 0.656
D2 0.582 0.610 0.638
E 0.685 0.690 0.695
E1 0.650 0.653 0.656
E2 0.582 0.610 0.638
b 0.013 — 0.021
c 0.010 TYP
e 0.050 TYP
Package Outline
D1
Pin 1
Pin 44
Pin 7
Pin 1 ID
E1
E2
E
Pin 17
c
A2
b
A1
D2
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: AB
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 0.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.45
A1 — — 0.25
A2 1.80 2.00 2.20
D 13.20 BSC
D1 10.00 BSC
E 13.20 BSC
E1 10.00 BSC
L 0.73 0.88 1.03
L1 1.60 REF
S 0.20 — —
b 0.29 — 0.45
c 0.11 — 0.23
e 0.80 BSC
0 — 7
Package Outline
D1
Pin 44
Pin 1
Pin 1 ID
E1
E
Pin 11
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ACB
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 — —
D 12.00 BSC
D1 10.00 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.30 0.37 0.45
c 0.09 — 0.20
e 0.80 BSC
0 3.5 7
Package Outline
D
D1
Pin 44
Pin 1
Pin 1 ID
E1
E
Pin 11
A2
See Detail A
A1
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAB-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.55
A1 0.20 — —
A2 — — 1.35
A3 0.70 TYP
D 7.00 BSC
E 7.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
7 6 5 4 3 2 1
A
Pin A1 ID
B
C
E
D
e
E
F
G
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AB
Lead Coplanarity 0.003 inch (0.08 mm)
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 5.00 BSC
E 5.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-066 Variation: AC
Lead Coplanarity N/A
Weight 10.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.154 0.177 0.200
A1 0.050 TYP
A2 0.114 0.127 0.140
D 1.100 1.120 1.140
E 1.100 1.120 1.140
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
Pin A1
11 10 9 8 7 6 5 4 3 2 1
Corner
A
B
Pin A1 ID C
D
e
E
E
F
G
H
J
K
L
A2
b
A
e
A1
L
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Lead Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AE
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 5.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 0.985 0.990 0.995
D1 0.950 0.954 0.958
D2 0.882 0.910 0.938
E 0.985 0.990 0.995
E1 0.950 0.954 0.958
E2 0.882 0.910 0.938
b 0.013 — 0.021
c 0.008 TYP
e 0.050 TYP
Package Outline
D
D1
Pin 1
Pin 68
Pin 10
Pin 1 ID
E1
E2
E
Pin 26
c
A2
b
A1
D2
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AF
Lead Coplanarity 0.004 inches (0.10mm)
Weight 7.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 1.185 1.190 1.195
D1 1.150 1.154 1.158
D2 1.082 1.110 1.138
E 1.185 1.190 1.195
E1 1.150 1.154 1.158
E2 1.082 1.110 1.138
b 0.013 — 0.021
c 0.008 TYP
e 0.050 TYP
Package Outline
D1
Pin 1
Pin 84
Pin 12
Pin 1 ID
E1
E2
E
Pin 32
c
A2
b
A1
D2
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline MO-219
Lead Coplanarity 0.005 inches (0.12 mm)
Weight 0.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.40
A1 0.25 — —
A2 0.80 — —
A3 0.70 REF
D 11.00 BSC
E 8.00 BSC
b 0.40 0.45 0.50
e 0.80 BSC
Package Outline
D Pin A1
Corner
12 11 10 9 8 7 6 5 4 3 2 1
A
Pin A1 ID B
C
e
D
E
E
F
G
H
A2 b e
A3
A
A1
1 This POD is applicable to F100 packages of all products except MAX II, which is
assembled in Option 2 package outlines.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: AAC-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.70
A1 0.30 — —
A2 0.25 — 1.10
A3 — — 0.80
D 11.00 BSC
E 11.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: DAC-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.25 1.40 1.55
A1 0.30 0.40 0.50
A2 0.75 1.00 1.25
A3 0.65 0.70 0.75
D 11.00 BSC
E 11.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: DAC-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.25 1.40 1.55
A1 0.30 0.40 0.50
A2 0.75 1.00 1.25
A3 0.65 0.70 0.75
D 11.00 BSC
E 11.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AC
Lead Coplanarity 0.003 inch (0.08mm)
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 6.00 BSC
E 6.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: GC-1
Lead Coplanarity 0.004 inches (0.10mm)
Weight 1.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.40
A1 0.25 — 0.50
A2 2.50 2.70 2.90
D 17.20 BSC
D1 14.00 BSC
E 23.20 BSC
E1 20.00 BSC
L 0.73 0.88 1.03
L1 1.60 REF
S 0.20 — —
b 0.22 — 0.40
c 0.11 — 0.23
e 0.65 BSC
0 — 7
Package Outline
D
D1
Pin 100
Pin 1
Pin 1 ID
E1
E
Pin 30
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: AED
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
D 16.00 BSC
D1 14.00 BSC
E 16.00 BSC
E1 14.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1
Pin 100
Pin 1
Pin 1 ID
E1
E
Pin 25
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.60
A1 0.05 — 0.15
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC
D2 4.00 — —
E 22.00 BSC
E1 20.00 BSC
E2 4.00 — —
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1 D2
Pin 144 Pin 144
Pin 1 Pin 1
Pin 1 ID
E1
E2
E
Pin 36 Pin 36
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB-HD
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.45 1.55 1.65
A1 0.05 0.10 0.15
A2 1.30 1.45 1.60
D 22.00 BSC
D1 20.00 BSC
D2 5.25 5.40 5.55
E 22.00 BSC
E1 20.00 BSC
E2 5.25 5.40 5.55
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1 D2
Pin 144 Pin 144
Pin 1 Pin 1
Pin 1 ID
E1
E2
E
Pin 36 Pin 36
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB-HD
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.45 1.55 1.65
A1 0.05 0.10 0.15
A2 1.30 1.45 1.60
D 22.00 BSC
D1 20.00 BSC
D2 6.45 6.60 6.75
E 22.00 BSC
E1 20.00 BSC
E2 6.45 6.60 6.75
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1 D2
Pin 144 Pin 144
Pin 1 Pin 1
Pin 1 ID
E1
E2
E
Pin 36 Pin 36
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB-HD
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.45 1.55 1.65
A1 0.05 0.10 0.15
A2 1.30 1.45 1.60
D 22.00 BSC
D1 20.00 BSC
D2 6.55 6.70 6.85
E 22.00 BSC
E1 20.00 BSC
E2 6.55 6.70 6.85
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1 D2
Pin 144 Pin 144
Pin 1 Pin 1
Pin 1 ID
E1
E2
E
Pin 36 Pin 36
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: AAD-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 0.25 — 1.80
A3 0.70 REF
D 13.00 BSC
E 13.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
e
b
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AD
Lead Coplanarity 0.003 inch (0.08mm)
Weight 0.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 7.00 BSC
E 7.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.60
A1 0.05 — 0.15
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC
E 22.00 BSC
E1 20.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 7
Package Outline
D1
Pin 144
Pin 1
Pin 1 ID
E1
E
Pin 36
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
1 This QFN is designed for use in thin PCB only (0.8mm or 32mils). It is not
recommended for PCB above 0.8-mm or 32-mils thick.
Package Information
Description Specification
Ordering Code Reference N
Package Acronym QFN
Substrate Material Tape
Solder Ball Composition Pb-free: NiAu
JEDEC Outline Reference MO-247 Variation: BWQQB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 0.70 0.75 0.80
A1 0.00 0.01 0.05
D 11.00 BSC
D1 8.35 8.40 8.45
D2 6.85 6.90 6.95
E 11.00 BSC
E1 8.35 8.40 8.45
E2 5.65 5.70 5.75
L 0.25 0.30 0.35
L1 0.05 0.10 0.15
eT 0.50 BSC
eR 0.65 BSC
Package Outline
Pin 1 ID
E2
E1
E
E
See Detail A
A
A1
L
L
eR
eT L1
L1
Detail A
1 The area defined by D2/E2 is a GND Pad and must be connected to PCB GND. The
heavily-hatched lines surrounding the GND pad are VCC Bus. Do not connect the
VCC Bus to PCB.
1 This QFN is designed for use in thin PCB only (0.8mm or 32mils). It is not
recommended for PCB above 0.8-mm or 32-mils thick.
Package Information
Description Specification
Ordering Code Reference N
Package Acronym QFN
Substrate Material Tape
Solder Ball Composition Pb-free: NiAu
JEDEC Outline Reference MO-247 Variation: BWQQB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 0.70 0.75 0.80
A1 0.00 0.01 0.05
D 11.00 BSC
D1 8.35 8.40 8.45
D2 6.85 6.90 6.95
E 11.00 BSC
E1 8.35 8.40 8.45
E2 5.65 5.70 5.75
L 0.25 0.30 0.35
L1 0.05 0.10 0.15
d 0.20 0.25 0.30
eR 0.65 BSC
eT 0.50 BSC
k 0.20 — —
Package Outline
Pin 1 ID
E2
E1
E
E
See Detail A
A
A1
L
GND pad L
k
d
VCC bus k
VCC bus
eR d
k
eT d L1
k
L1
Detail A
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AG
Lead Coplanarity N/A
Weight 19.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.160 0.190 0.220
A1 0.050 TYP
A2 0.120 0.140 0.160
D 1.540 1.560 1.580
E 1.540 1.560 1.580
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
Pin A1
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Corner
A
B
Pin A1 ID C
D
e
E
F
G
E
H
J
K
L
M
N
P
R
b e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: DD-1
Lead Coplanarity 0.004 inches (0.10mm)
Weight 6.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 31.20 BSC
D1 28.00 BSC
E 31.20 BSC
E1 28.00 BSC
L 0.50 — 1.03
L1 1.60 REF
S 0.20 — —
b 0.22 — 0.40
c 0.09 — 0.23
e 0.65 BSC
0 — 7
Package Outline
D1
Pin 160
Pin 1
Pin 1 ID
E1
E
Pin 40
A2
See Detail A
A1
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AE
Lead Coplanarity 0.003 inch (0.08mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 8.00 BSC
E 8.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
D Pin A1
Corner
Pin A1
ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: AE
Lead Coplanarity 0.003 inch (0.08mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 0.90 1.05 1.20
A1 0.15 0.20 0.25
A2 0.65 0.85 1.05
A3 0.55 0.60 0.65
D 8.00 BSC
E 8.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
D Pin A1
Corner
Pin A1
ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: DBE-1
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.25 1.40 1.55
A1 0.30 0.35 0.40
A2 0.85 1.05 1.25
A3 0.60 0.70 0.80
D 14.00 BSC
E 14.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
A2 b e
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAF-1
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.70
A1 0.20 — —
A2 0.65 — —
A3 0.70 TYP
D 11.00 BSC
E 11.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A 1
Corner
13 12 11 10 9 8 7 6 5 4 3 2 1
A
Pin A1 ID B
C
D
e
E
F
E
G
H
J
K
L
M
N
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AJ
Lead Coplanarity N/A
Weight 21.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.167 0.192 0.217
A1 0.050 TYP
A2 0.127 0.142 0.157
D 1.740 1.760 1.780
E 1.740 1.760 1.780
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
Pin A1
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Corner
A
B
Pin A1 ID C
D
e
E
F
G
H
E
J
K
L
M
N
P
R
T
U
b e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Lead Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08 mm)
Weight 6.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.50 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0° 3.5° 8°
Package Outline
D
D1
Pin 208
Pin 1
Pin 1 ID
E1
E
Pin 52
A2
A
See Detail A
A1
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08mm)
Weight 11.0 g (Typ.) or 6.4 g (Typ.) (1)
Moisture Sensitivity Level Printed on moisture barrier bag
Note:
(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized
aluminum). Refer to PCN1002.
Millimeters
Symbol
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 8
Package Outline
D1
Pin 208
Pin 1
Pin 1 ID
E1
E
Pin 52
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AJ
Lead Coplanarity N/A
Weight 25.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.174 0.192 0.210
A1 0.050 TYP
A2 0.134 0.142 0.150
D 1.740 1.760 1.780
E 1.740 1.760 1.780
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
A
B
Pin A1 ID C
D
e
E
F
G
H
E
J
K
L
M
N
P
R
T
U
b e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 8.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 34.60 BSC
D1 32.00 BSC
E 34.60 BSC
E1 32.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 8
Package Outline
D1
Pin 240
Pin 1
Pin 1 ID
E1
E
Pin 60
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 15.4 g (Typ.) or 8.5 g (Typ.) (1)
Moisture Sensitivity Level Printed on moisture barrier bag
Note:
(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized
aluminum). Refer to PCN1002.
Millimeters
Symbol
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 34.60 BSC
D1 32.00 BSC
E 34.60 BSC
E1 32.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 8
Package Outline
D
D1
Pin 240
Pin 1
Pin 1 ID
E1
E
Pin 60
A2
A
A1
See Detail A
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.70
A1 0.35 — —
A2 0.25 — 1.10
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 20 18 16 14 12 10 8 6 4 2 Pin A1
19 17 15 13 11 9 7 5 3 1 Corner
A
B
Pin A1 ID
C
D
E
F
G
e
H
J
K
E
L
M
N
P
R
T
U
V
W
Y
b e
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.35 — —
A2 — — 2.20
A3 — — 1.80
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
Pin A1
D Corner
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
Pin A1 ID F
e
G
H
J
K
E
L
M
N
P
R
T
U
V
W
Y
b e
A3
A2
A
A1
1 This POD is applicable to F256 packages of all products except Cyclone II, Cyclone III,
and Cyclone IV, which are assembled in Option 2 package outlines.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.70 REF
D 17.00 BSC
E 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
1 This POD is applicable to F256 packages of the Cyclone II, Cyclone III, and Cyclone IV
products only.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: DAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.55
A1 0.25 — —
A2 1.05 REF
A3 — — 0.80
D 17.00 BSC
E 17.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference M
Package Acronym MBGA
Substrate Material BT
Solder Ball Composition Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-195 Variation: BH
Lead Coplanarity 0.003 inch (0.08mm)
Weight 0.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.20
A1 0.15 — —
A2 — — 1.00
A3 0.60 REF
D 11.00 BSC
E 11.00 BSC
b 0.25 0.30 0.35
e 0.50 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAJ-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.55
A1 0.20 — —
A2 0.65 — —
A3 0.80 TYP
D 14.00 BSC
E 14.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAJ-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.20 1.35 1.50
A1 0.35 0.40 0.45
A2 0.75 0.95 1.15
A3 0.65 0.70 0.75
D 14.00 BSC
E 14.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAJ-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.20 1.35 1.50
A1 0.35 0.40 0.45
A2 0.75 0.95 1.15
A3 0.65 0.70 0.75
D 14.00 BSC
E 14.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAJ-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.20 1.35 1.50
A1 0.35 0.40 0.45
A2 0.75 0.95 1.15
A3 0.65 0.70 0.75
D 14.00 BSC
E 14.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference M0-192 Variation: DAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.35 1.45 1.55
A1 0.30 0.40 0.50
A2 0.85 1.05 1.25
A3 0.65 0.70 0.75
D 17.00 BSC
E 17.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference M0-192 Variation: DAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.35 1.45 1.55
A1 0.30 0.40 0.50
A2 0.85 1.05 1.25
A3 0.65 0.70 0.75
D 17.00 BSC
E 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference M0-192 Variation: DAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.35 1.45 1.55
A1 0.30 0.40 0.50
A2 0.85 1.05 1.25
A3 0.65 0.70 0.75
D 17.00 BSC
E 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AL
Lead Coplanarity N/A
Weight 29.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.165 0.185 0.205
A1 0.050 TYP
A2 0.125 0.135 0.145
D 1.940 1.960 1.980
E 1.940 1.960 1.980
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
Pin A1
19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Corner
A
B
Pin A1 ID C
D
E
F
e
G
H
J
E
K
L
M
N
P
R
T
U
V
W
b e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: JA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 26.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 4.50
A1 0.25 — 0.50
A2 3.55 3.80 4.05
D 42.60 BSC
D1 40.00 BSC
E 42.60 BSC
E1 40.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0 3.5 8
Package Outline
D1
Pin 304
Pin 1
Pin 1 ID
E1
E
Pin 76
A2
A
See Detail A
A1
Detail A
e
C
Gage
Plane
b
S 0.25mm
L
L1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAG-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 1.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.70 REF
D 19.00 BSC
E 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-192 Variation: DAG-1
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.25 1.40 1.55
A1 0.30 0.35 0.40
A2 0.85 1.05 1.25
A3 0.60 0.70 0.80
D 19.00 BSC
E 19.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAG-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 1.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.60 1.75 1.90
A1 0.40 0.50 0.60
A2 1.00 1.25 1.50
A3 0.65 0.70 0.75
D 19.00 BSC
E 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAG-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 1.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.60 1.75 1.90
A1 0.40 0.50 0.60
A2 1.00 1.25 1.50
A3 0.65 0.70 0.75
D 19.00 BSC
E 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAR-2
Lead Coplanarity 0.008 inches (0.20mm)
Weight 7.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 1.70
A1 0.35 — —
A2 0.25 — 1.10
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
Pin A1 ID C
D
E
F
G
e
H
J
K
L
M
N
E
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b e
A2
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAM-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 1.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A – – 1.70
A1 0.25 – –
A2 0.80 - 1.10
A3 0.80 TYP
D 17.00 BSC
E 17.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAM-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.30 1.55 1.80
A1 0.30 0.35 0.40
A2 0.90 1.20 1.50
A3 0.35 0.55 0.75
D 17.00 BSC
D1 11.10 (Typ.)
E 17.00 BSC
E1 10.50 (Typ.)
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
ID
e
E1
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAM-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.30 1.55 1.80
A1 0.30 0.35 0.40
A2 0.90 1.20 1.50
A3 0.35 0.55 0.75
D 17.00 BSC
D1 11.10 (Typ.)
E 17.00 BSC
E1 10.50 (Typ.)
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
ID
e
E1
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAH-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeteres
Symbol
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.80 REF
D 21.00 BSC
E 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AL
Lead Coplanarity N/A
Weight 47.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A 0.157 0.180 0.203
A1 0.050 TYP
A2 0.117 0.130 0.143
D 1.940 1.960 1.980
E 1.940 1.960 1.980
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
36 34 32 30 28 2 6 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
G
H
J
K
L
M
e
N
P
R
T
U
V
E
W
Y
AA
AB
AC
AD
1
AE
2
AF
e
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
1
b 2 e e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 6.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 23.00 BSC
D1 17.00 BSC
E 23.00 BSC
E1 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D 22 20 18 16 14 12 10 8 6 4 2 Pin A1
Corner
21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
e
H
J
K
L
E
M
N
P
R
T
U
V
W
Y
AA
AB
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.30 2.50
A1 0.40 0.50 0.60
A2 1.70 1.80 1.90
A3 0.75 0.85 0.95
D 23.00 BSC
D1 11.00 (Typ)
E 23.00 BSC
E1 9.60 (Typ)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
D1 Corner
Pin A1
ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.30 1.40 1.50
D 23.00 BSC
D1 17.00 BSC
E 23.00 BSC
E1 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.30 2.50
A1 0.40 0.50 0.60
A2 1.50 1.80 2.10
A3 0.75 0.85 0.95
D 23.00 BSC
D1 11.00 (Typ)
E 23.00 BSC
E1 9.60 (Typ)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
D1 Corner
Pin A1
ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.30 1.40 1.50
D 23.00 BSC
D1 17.00 BSC
E 23.00 BSC
E1 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 11.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.20
A1 0.20 — —
A2 0.65 — —
A3 0.95 TYP
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.75 1.90 2.05
A1 0.30 0.40 0.50
A2 1.25 1.50 1.75
A3 0.90 0.95 1.00
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.75 1.90 2.05
A1 0.30 0.40 0.50
A2 1.25 1.50 1.75
A3 0.90 0.95 1.00
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.75 1.90 2.05
A1 0.30 0.40 0.50
A2 1.25 1.50 1.75
A3 0.90 0.95 1.00
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.75 1.90 2.05
A1 0.30 0.40 0.50
A2 1.25 1.50 1.75
A3 0.90 0.95 1.00
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.75 1.90 2.05
A1 0.30 0.40 0.50
A2 1.25 1.50 1.75
A3 0.90 0.95 1.00
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AN
Lead Coplanarity N/A
Weight 59.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.245 2.260 2.275
E 2.245 2.260 2.275
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
e
N
P
R
T
U
V
W
Y
AA
E
AB
1
AC
2
AD
e
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC
1
b 2 e e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 25.00 BSC
D1 19.00 BSC
E 25.00 BSC
E1 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.30 2.80
A1 0.40 0.50 0.60
A2 1.40 1.80 2.20
A3 0.80 0.90 1.00
D 25.00 BSC
D1 Die Size (Device-Dependant)
E 25.00 BSC
E1 Die Size (Device-Dependant)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
e
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.00 2.20
A1 0.40 0.50 0.60
A2 1.20 1.50 1.80
A3 0.90 0.95 1.00
D 25.00 BSC
D1 11.10 (Typ.)
E 25.00 BSC
E1 10.50 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
e
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.00 2.20
A1 0.40 0.50 0.60
A2 1.20 1.50 1.80
A3 0.90 0.95 1.00
D 25.00 BSC
D1 11.10 (Typ.)
E 25.00 BSC
E1 10.50 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
e
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.00 2.20
A1 0.40 0.50 0.60
A2 1.20 1.50 1.80
A3 0.75 0.85 0.95
D 25.00 BSC
D1 13.40 (Typ.)
E 25.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
e
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAK-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.00 2.20
A1 0.40 0.50 0.60
A2 1.20 1.50 1.80
A3 0.75 0.85 0.95
D 25.00 BSC
D1 13.40 (Typ.)
E 25.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
D1 Corner
Pin A1
e
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AP
Lead Coplanarity N/A
Weight 69.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.445 2.460 2.475
E 2.445 2.460 2.475
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
G
H
J
K
L
M
e
N
P
R
T
U
V
W
Y
AA
AB
AC
E
AD
1
AE
2
AF
e
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC
BD
BE
BF
BG
1
b 2 e e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 12.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.00
A1 0.35 — —
A2 0.25 — 1.10
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
Pin A1 ID D
E
F
G
e
H
J
K
L
M
N
P
R
T
U
E
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
b e
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 23.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
e
G
H
J
K
L
M
N
P
R
T
U
E
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.20
A1 0.35 — —
A2 — — 2.80
A3 — — 2.40
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
E
F
G
H
J
e
Pin A1 ID K
L
M
N
P
R
T
U
E
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.00
A1 0.35 — —
A2 0.25 — 1.10
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
Pin A1 ID D
E
F
e
G
H
J
K
L
M
N
P
R
T
U
E
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
b e
A2
A
A1
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AP
Lead Coplanarity N/A
Weight 74.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Inches
Symbol
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.445 2.460 2.475
E 2.445 2.460 2.475
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
Package Outline
D
46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
G
H
J
K
L
M
e
N
P
R
T
U
V
W
Y
AA
AB
AC
E
AD
1
AE
2
AF
e
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC
BD
BE
BF
BG
1
b 2 e e
A2
A
A1
L
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAR-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.35 — —
A2 — — 2.20
A3 — — 1.80
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
E
F
Pin A1 ID G
H
e
J
K
L
M
N
E
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A2
A3
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
E
F
G
Pin A1 ID H
e
J
K
L
M
N
E
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
D1 20.00 BSC
E 27.00 BSC
E1 20.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
28 26 24 22 20 18 16 14 12 10 8 6 4 2 Corner
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
H
J
e
K
L
M
N
P
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 8.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.30 2.80
A1 0.40 0.50 0.60
A2 1.40 1.80 2.20
A3 0.75 0.85 0.95
D 29.00 BSC
D1 Die Size (Device-Dependant)
E 29.00 BSC
E1 Die Size (Device-Dependant)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.30 2.50 2.70
A1 0.40 0.50 0.60
A2 1.70 2.00 2.30
A3 0.90 0.95 1.00
D 29.00 BSC
D1 11.10 (Typ.)
E 29.00 BSC
E1 10.50 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.30 2.50 2.70
A1 0.40 0.50 0.60
A2 1.70 2.00 2.30
A3 0.80 0.90 1.00
D 29.00 BSC
D1 11.10 (Typ.)
E 29.00 BSC
E1 10.50 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 29.00 BSC
D1 13.40 (Typ.)
E 29.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 29.00 BSC
D1 13.40 (Typ.)
E 29.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 29.00 BSC
D1 17.20 (Typ.)
E 29.00 BSC
E1 16.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 29.00 BSC
D1 17.20 (Typ.)
E 29.00 BSC
E1 16.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.20 3.45
A1 0.40 0.50 0.60
A2 2.30 2.70 3.05
A3 1.45 1.55 1.65
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.00 3.20
A1 0.40 0.50 0.60
A2 2.20 2.50 2.80
A3 1.30 1.40 1.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.20 3.45
A1 0.40 0.50 0.60
A2 2.30 2.70 3.05
A3 1.45 1.55 1.65
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.40 1.50 1.60
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.40 1.50 1.60
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
28 26 24 22 20 18 16 14 12 10 8 6 4 2 Corner
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
H
J
e
K
L
M
N
P
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
28 26 24 22 20 18 16 14 12 10 8 6 4 2 Corner
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
H
J
e
K
L
M
N
P
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
28 26 24 22 20 18 16 14 12 10 8 6 4 2 Corner
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
H
J
e
K
L
M
N
P
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.05 1.15 1.25
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
28 26 24 22 20 18 16 14 12 10 8 6 4 2 Corner
27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
Pin A1 ID G
H
J
e
K
L
M
N
P
E
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.30 2.50 2.70
A1 0.40 0.50 0.60
A2 1.70 2.00 2.30
A3 0.75 0.85 0.95
D 29.00 BSC
D1 11.00 (Typ.)
E 29.00 BSC
E1 9.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.00 3.20
A1 0.40 0.50 0.60
A2 2.20 2.50 2.80
A3 1.30 1.40 1.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.30 2.50 2.70
A1 0.40 0.50 0.60
A2 1.70 2.00 2.30
A3 0.75 0.85 0.95
D 29.00 BSC
D1 11.60 (Typ.)
E 29.00 BSC
E1 9.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.00 3.20
A1 0.40 0.50 0.60
A2 2.20 2.50 2.80
A3 1.30 1.40 1.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.30 2.50 2.70
A1 0.40 0.50 0.60
A2 1.70 2.00 2.30
A3 0.75 0.85 0.95
D 29.00 BSC
D1 16.80 (Typ.)
E 29.00 BSC
E1 9.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.00 3.20
A1 0.40 0.50 0.60
A2 2.20 2.50 2.80
A3 1.30 1.40 1.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.25 2.50 2.75
A1 0.40 0.50 0.60
A2 1.65 2.00 2.35
A3 0.75 0.85 0.95
D 29.00 BSC
D1 11.00 (Typ.)
E 29.00 BSC
E1 9.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 8.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.80 3.05 3.30
A1 0.40 0.50 0.60
A2 2.20 2.55 2.90
A3 1.20 1.40 1.60
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.10 3.30
A1 0.40 0.50 0.60
A2 2.30 2.60 2.90
A3 1.45 1.55 1.65
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 12.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.40 1.50 1.60
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 12.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.60 2.80 3.00
A1 0.40 0.50 0.60
A2 2.00 2.30 2.60
A3 1.40 1.50 1.60
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAN-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 31.00 BSC
E 31.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
E
F
G
H
Pin A1 ID J
e
K
L
M
N
P
R
E
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 19.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
A
B
C
Pin A1 ID D
E
F
e
G
H
J
K
L
M
N
P
R
E
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 17.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
Package Outline
D
D1 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 Pin A1
31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Corner
A
B
C
D
Pin A1 ID E
F
e
G
H
J
K
L
M
N
P
R
E1
E
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 33.00 BSC
D1 26.00 BSC
E 33.00 BSC
E1 26.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
Pin A1
D1 Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 12.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 6.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 1.80 2.30 2.80
A1 0.40 0.50 0.60
A2 1.40 1.80 2.20
A3 0.80 0.90 1.00
D 35.00 BSC
D1 Die Size (Device-Dependant)
E 35.00 BSC
E1 Die Size (Device-Dependant)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 35.00 BSC
D1 13.40 (Typ.)
E 35.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 35.00 BSC
D1 13.40 (Typ.)
E 35.00 BSC
E1 13.10 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 35.00 BSC
D1 17.20 (Typ.)
E 35.00 BSC
E1 16.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.20 2.40 2.60
A1 0.40 0.50 0.60
A2 1.60 1.90 2.20
A3 0.75 0.85 0.95
D 35.00 BSC
D1 17.20 (Typ.)
E 35.00 BSC
E1 16.60 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.15 3.40
A1 0.40 0.50 0.60
A2 2.30 2.65 3.00
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.10 3.30
A1 0.40 0.50 0.60
A2 2.30 2.60 2.90
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 14.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.15 3.45 3.75
A1 0.40 0.50 0.60
A2 2.55 2.95 3.35
A3 1.45 1.55 1.65
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 14.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.15 3.45 3.75
A1 0.40 0.50 0.60
A2 2.55 2.95 3.35
A3 1.45 1.55 1.65
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.10 3.30
A1 0.40 0.50 0.60
A2 2.30 2.60 2.90
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 14.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.40 1.50 1.60
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.10 3.30
A1 0.40 0.50 0.60
A2 2.30 2.60 2.90
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.15 3.35 3.55
A1 0.40 0.50 0.60
A2 2.55 2.85 3.15
A3 1.45 1.55 1.65
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.10 3.30
A1 0.40 0.50 0.60
A2 2.30 2.60 2.90
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 14.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.25 3.50
A1 0.40 0.50 0.60
A2 2.40 2.75 3.10
A3 1.40 1.50 1.60
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.10 3.30 3.50
A1 0.40 0.50 0.60
A2 2.50 2.80 3.10
A3 1.45 1.55 1.65
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.40 1.50 1.60
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 2.60 2.85
A1 0.40 0.50 0.60
A2 1.75 2.10 2.45
A3 0.75 0.85 0.95
D 35.00 BSC
D1 13.50 (Typ.)
E 35.00 BSC
E1 11.90 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.15 3.40
A1 0.40 0.50 0.60
A2 2.30 2.65 3.00
A3 1.20 1.40 1.60
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.50 2.70 2.90
A1 0.40 0.50 0.60
A2 1.90 2.20 2.50
A3 0.75 0.85 0.95
D 35.00 BSC
D1 16.80 (Typ)
E 35.00 BSC
E1 9.60 (Typ)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.50 2.70 2.90
A1 0.40 0.50 0.60
A2 1.90 2.20 2.50
A3 0.75 0.85 0.95
D 35.00 BSC
D1 16.10 (Typ)
E 35.00 BSC
E1 14.70 (Typ)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 2.60 2.85
A1 0.40 0.50 0.60
A2 1.75 2.10 2.45
A3 0.75 0.85 0.95
D 35.00 BSC
D1 13.50 (Typ.)
E 35.00 BSC
E1 11.90 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 11.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.15 3.40
A1 0.40 0.50 0.60
A2 2.30 2.65 3.00
A3 1.20 1.40 1.60
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 18.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 42.50 BSC
D1 36.00 BSC
E 42.50 BSC
E1 36.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.10 3.40 3.70
A1 0.40 0.50 0.60
A2 2.50 2.90 3.30
A3 1.40 1.50 1.60
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 18.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 18.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 16.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 40.00 BSC
D1 34.10 BSC
E 40.00 BSC
E1 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 16.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 40.00 BSC
D1 34.10 BSC
E 40.00 BSC
E1 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 19.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.30 3.50 3.70
A1 0.40 0.50 0.60
A2 2.70 3.00 3.30
A3 1.40 1.50 1.60
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 40.00 BSC
D1 34.10 BSC
E 40.00 BSC
E1 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 19.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.30 3.50 3.70
A1 0.40 0.50 0.60
A2 2.70 3.00 3.30
A3 1.40 1.50 1.60
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 40.00 BSC
D1 34.10 BSC
E 40.00 BSC
E1 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 40.00 BSC
D1 34.10 BSC
E 40.00 BSC
E1 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 7.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 2.60 2.85
A1 0.40 0.50 0.60
A2 1.75 2.10 2.45
A3 0.75 0.85 0.95
D 40.00 BSC
D1 13.50 (Typ.)
E 40.00 BSC
E1 11.90 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.15 3.40
A1 0.40 0.50 0.60
A2 2.30 2.65 3.00
A3 1.20 1.40 1.60
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 7.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.50 2.70 2.90
A1 0.40 0.50 0.60
A2 1.90 2.20 2.50
A3 0.75 0.85 0.95
D 40.00 BSC
D1 16.10 (Typ)
E 40.00 BSC
E1 14.70 (Typ)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 14.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 7.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.35 2.60 2.85
A1 0.40 0.50 0.60
A2 1.75 2.10 2.45
A3 0.75 0.85 0.95
D 40.00 BSC
D1 13.50 (Typ.)
E 40.00 BSC
E1 11.90 (Typ.)
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
e
Pin A1
ID
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 15.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 2.90 3.15 3.40
A1 0.40 0.50 0.60
A2 2.30 2.65 3.00
A3 1.20 1.40 1.60
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 21.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 18.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 42.50 BSC
D1 36.00 BSC
E 42.50 BSC
E1 36.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 18.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 18.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 21.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.10 3.40 3.70
A1 0.40 0.50 0.60
A2 2.50 2.90 3.30
A3 1.40 1.50 1.60
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 21.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.10 3.40 3.70
A1 0.40 0.50 0.60
A2 2.50 2.90 3.30
A3 1.40 1.50 1.60
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 21.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 18.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.50 (1)
A1 0.30 — —
A2 0.25 — 3.00 (2)
A3 — — 2.50
D 42.50 BSC
D1 36.00 BSC
E 42.50 BSC
E1 36.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Notes:
For Stratix IV GX products:
(1) Overall package thickness (Dimension “A”) is 3.90 mm maximum.
(2) Package body thickness (Dimension “A2”) is 3.30 mm maximum.
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.7g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
1760-Pin FineLine Ball-Grid Array (FBGA) — Flip Chip — Single-Piece Lid (EP4SGX360)
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.20 BSC
E 42.50 BSC
E1 36.20 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.10 3.30 3.50
A1 0.40 0.50 0.60
A2 2.50 2.80 3.10
A3 1.40 1.50 1.60
D 42.50 BSC
E 42.50 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D Pin A1
Corner
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAV-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 17.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 42.50 BSC
D1 36.00 BSC
E 42.50 BSC
E1 36.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 24.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.90
A1 0.30 — —
A2 0.25 — 3.30
A3 — — 2.50
D 45.00 BSC
E 45.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A — — 3.90
A1 0.30 — —
A2 0.25 — 3.30
A3 — — 2.50
D 45.00 BSC
D1 39.00 BSC
E 45.00 BSC
E1 39.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 19.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.20 3.40
A1 0.40 0.50 0.60
A2 2.40 2.70 3.00
A3 1.30 1.40 1.50
D 45.00 BSC
D1 38.90 BSC
E 45.00 BSC
E1 38.90 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 24.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.30 3.50 3.70
A1 0.40 0.50 0.60
A2 2.70 3.00 3.30
A3 1.40 1.50 1.60
D 45.00 BSC
E 45.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
Pin A1 ID
e
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.00 3.30 3.60
A1 0.40 0.50 0.60
A2 2.40 2.80 3.20
A3 1.30 1.40 1.50
D 45.00 BSC
D1 38.90 BSC
E 45.00 BSC
E1 38.90 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 45.00 BSC
D1 38.90 BSC
E 45.00 BSC
E1 38.90 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW -1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 45.00 BSC
D1 38.90 BSC
E 45.00 BSC
E1 38.90 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAW-1
Lead Coplanarity 0.010 inches (0.25 mm)
Weight 20.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Millimeters
Symbol
Min. Nom. Max.
A 3.20 3.40 3.60
A1 0.40 0.50 0.60
A2 2.60 2.90 3.20
A3 1.30 1.40 1.50
D 45.00 BSC
D1 38.90 BSC
E 45.00 BSC
E1 38.90 BSC
b 0.50 0.60 0.70
e 1.00 BSC
Package Outline
D
D1 Pin A1
Corner
Pin A1 ID
e
E1
E
b e
A3
A2
A
A1
Additional Information
This section contains revision history and contact information.
Revision History
Table 60 lists the revision history for this document.
■ 1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■ 1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■ "Wire Bond" and "Flip Chip" was added to title of each data sheet, as
appropriate
■ "BGA" was spelled out as "Ball-Grid Array" in all titles
■ Some package outline drawings were reformatted
■ Weights were updated for many packages
Note to Table 60:
(1) Formal revision history for this document began with version 14.5.
Contact
Contact (Note 1) Method Address
Technical support Website www.altera.com/support
Technical training Website www.altera.com/training
Email custrain@altera.com
Altera literature services Email literature@altera.com
Non-technical support (General) Email nacomp@altera.com
(Software Licensing) Email authorization@altera.com
Note:
(1) You can also contact your local Altera sales office or sales representative.
Copyright © September 2010. Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company,
the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks
and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S.
and other countries. All other product or service names are the property of their respective holders. Altera products
101 Innovation Drive are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights.
San Jose, CA 95134 Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's
www.altera.com standard warranty, but reserves the right to make changes to any products and services at any time without notice.
Technical Support Altera assumes no responsibility or liability arising out of the application or use of any information,
www.altera.com/support product, or service described herein except as expressly agreed to in writing by Altera Corporation.
Altera customers are advised to obtain the latest version of device specifications before relying on any
published information and before placing orders for products or services.