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PD60161-R
HALF-BRIDGE DRIVER
Description
Programmable 0.54~5 s The IR2108(4)(S) are high voltage, high speed Internal 540ns IN/SD yes power MOSFET and IGBT drivers with depenProgrammable 0.54~5 s dent high and low side referenced output yes Internal 100ns HIN/LIN COM 2304 channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.
HIN/LIN
no
none
HIN/LIN
yes
Internal 540ns
Typical Connection
up to 600V VCC
VCC
HIN LIN
VB HO VS LO
TO LOAD
up to 600V
IR2108
VCC HIN LIN
IR21084
TO LOAD
(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
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Symbol
VB VS VHO VCC VLO DT VIN VSS dV S/dt PD
Definition
High side floating absolute voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Programmable dead-time pin voltage (IR21084 only) Logic input voltage (HIN & LIN ) Logic ground (IR21084 only) Allowable offset supply voltage transient Package power dissipation @ TA +25C (8 lead PDIP) (8 lead SOIC) (14 lead PDIP) (14 lead SOIC)
Min.
-0.3 VB - 25 VS - 0.3 -0.3 -0.3 VSS - 0.3 VSS - 0.3 VCC - 25 -50
Max.
625 VB + 0.3 VB + 0.3 25 VCC + 0.3 VCC + 0.3 VCC + 0.3 VCC + 0.3 50 1.0 0.625 1.6 1.0 125 200 75 120 150 150 300
Units
V/ns
RthJA
(8 lead PDIP) (8 lead SOIC) (14 lead PDIP) (14 lead SOIC)
C/W
TJ TS TL
Symbol
VB VS VHO VCC VLO VIN DT VSS
Definition
High side floating supply absolute voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Logic input voltage IR2108 IR21084 Programmable dead-time pin voltage (IR21084 only) Logic ground (IR21084 only)
Min.
VS + 10 Note 1 VS 10 0 COM VSS VSS -5
Max.
VS + 20 600 VB 20 VCC VCC VCC VCC 5
Units
C TA Ambient temperature -40 125 Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details).
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Symbol
ton toff MT tr tf DT MDT
Definition
Turn-on propagation delay Turn-off propagation delay Delay matching | ton - toff | Turn-on rise time Turn-off fall time Deadtime: LO turn-off to HO turn-on(DTLO-HO) & HO turn-off to LO turn-on (DTHO-LO) Deadtime matching = | DTLO-HO - DTHO-LO |
Min.
400 4
Typ.
220 200 0 150 50 540 5 0 0
Symbol
VIH VIL VOH VOL ILK IQBS IQCC IIN+ IINVCCUV+ VBSUV+ VCCUVVBSUVVCCUVH VBSUVH IO+ IO-
Definition
Logic 1 input voltage for HIN & logic 0 for LIN Logic 0 input voltage for HIN & logic 1 for LIN High level output voltage, VBIAS - VO Low level output voltage, VO Offset supply leakage current Quiescent V BS supply current Quiescent VCC supply current Logic 1 input bias current Logic 0 input bias current VCC and VBS supply undervoltage positive going threshold VCC and VBS supply undervoltage negative going threshold Hysteresis Output high short circuit pulsed current Output low short circuit pulsed current
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2108
HIN
VSS/COM LEVEL SHIFT HV LEVEL SHIFTER PULSE GENERATOR
HO
VS
DT
VCC
+5V
LO
LIN
DELAY
COM
VSS
VB
21084
HIN
VSS/COM LEVEL SHIFT HV LEVEL SHIFTER PULSE GENERATOR
HO
VS
DT
+5V
VCC
LO
LIN
DELAY
COM
VSS
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LIN
Lead Assignments
1 2 3 4 VCC HIN LIN COM VB HO VS LO
8
7 6 5
1 2 3 4
VB HO VS LO
8
7 6 5
8 Lead PDIP
8 Lead SOIC
IR2108
IR2108S
1 2 3 4 5 6 7
14
13 12 11 10 9 8
1 2 3 4 5 6 7
14
13 12 11 10 9 8
14 Lead PDIP
14 Lead SOIC
IR21084
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IR21084S
5
HIN
LIN
HO
LIN
50% 50%
LO
ton
Figure 1. Input/Output Timing Diagram
tr 90%
toff 90%
tf
LO
10%
10%
50%
50%
HIN
ton tr 90%
HIN LIN
50% 50%
toff 90%
tf
HO
90%
10%
10%
HO LO
DT LO-HO 90%
10% DT HO-LO
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500 400 300 200 100 0 10 12 14 16 18 20 V BIAS Supply Voltage (V) Figure 4B. Turn-on Propagation Delay vs. Supply Voltage
T yp. Max .
Max.
-25
25
50
o
75
100 125
500 400 300 200 100 0 10 12 14 16 18 20 V BIAS Supply Voltage (V) Figure 5B. Turn-off Propagation Delay vs. Supply Voltage
Max . T yp.
T yp.
0 -50
-25
25
50
75
100 125
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T yp.
100 0
0 -50
-25
25
50
75
100 125
10
12
14
16
18
20
V BIAS Supply Voltage (V) Figure 6B. Turn-on Rise Time vs. Supply Voltage
Max.
50
T yp.
T yp.
0 -50
75
100 125
10
12
14
16
18
20
V BIAS Supply Voltage (V) Figure 7B. Turn-off Fall Tim e vs. Supply Voltage
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1000 800
Max.
Deadtime (ns)
Deadtime (ns)
Max. T yp.
600
T yp.
Min.
400
Mi n.
10
12
14
16
18
20
V BIAS Supply Voltage (V) Figure 8B. Deadtime vs. Supply Voltage
7 6 Deadtime ( s) 5 4 3 2 1 0 0 50 100 RDT (K) Figure 8C. Deadtim e vs. RDT (IR21084 Only) 150 200
T yp. Mi n.
Temperature ( oC) Figure 9A. Logic "1" Input Voltage vs. Tem perature
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8 7 Input Voltage (V) 6 5 4 3 2 1 0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 9B. Logic "1" Input Voltage vs. Supply Voltage
Max .
0.0 -50
-25
25
50
75
100 125
Temperature (oC) Figure 10A. Logic "0" Input Voltage vs. Tem perature
3.2 2.4 1.6 0.8 0.0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 10B. Logic "0" Input Voltage vs. Supply Voltage
Min.
4.0
4 3 2 1
Max .
T yp.
0 -50
-25
25
50
o
75
100
125
10
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4 3 2 1 0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 11B. High Level Output vs. Supply Voltage
Max.
Max.
T yp.
0 -50
-25
25
50
o
75
100
125
0.6
T yp.
0.3 0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 12B. Low Level Output vs. Supply Voltage
0 -50
-25
25
50
o
75
100 125
Temperature ( C) Figure 13A. Offset Supply Leakage Current vs. Tem perature
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11
500 400 300 200 100 0 0 100 200 300 400 500 600 V B Boost Voltage (V) Figure 13B. Offset Supply Leakage Current vs. Tem perature V BS Supply Current ( A)
Max .
0 -50
-25
0 25 50 75 Temperature ( oC)
100 125
400
Vcc Supply Current (mA)
V BS Supply Current ( A)
300 200 100 0 10 12 14 16 18 20 V BS Supply Voltage (V) Figure 14B. V BS Supply Current vs. Supply Voltage
Max. T yp. Min.
1.0 0.5
Min.
0.0 -50
-25
25
50
o
75
100 125
12
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3.0 V CC Supply Current (mA) 2.5 2.0 1.5 1.0 0.5 0.0 10 12 14 16 18 V CC Supply Voltage (V) 20
Max . T yp. Min.
0 -50
-25
25
50
75
100
125
Temperature ( oC) Figure 16A. Logic "1" Input Current vs. Tem perature
60 Logic "1" Input Current ( A) 50 40 30 20 10 0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 16B. Logic "1" Input Current vs. Supply Voltage
Max.
2 1 0 -50
T yp.
-25
25
50
75
100
125
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13
5
V CC UVLO Threshold (+) (V)
12 11 10 9 8 7 -50
Max . T yp.
4 3 2 1 0 10 12 14 16 18 20 V CC Supply Voltage (V) Figure 17B. Logic "0" Input Current vs. Supply Voltage
Max.
Mi n.
-25
25
50
75
100
125
Temperature (oC) Figure 18. V CC Undervoltage Threshold (+) vs. Tem perature
T yp.
7 6 -50
Min.
-25
25
50
75
100
125
7 -50
-25
25
50
o
75
100
125
Temperature ( oC) Figure 19. V CC Undervoltage Threshold (-) vs. Tem perature
14
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200
Min.
7 6 -50
100 0 -50
-25
25
50
75
100 125
-25
25
50
o
75
100
125
Temperature (oC) Figure 21. V BS Undervoltage Threshold (-) vs. Tem perature
500 Output Source Current ( A) Output Sink Current (mA) 400 300 200 100 0 10 12 14 16 18 20 V BIAS Supply Voltage (V) Figure 22B. Output Source Current vs. Supply Voltage
T yp.
600 500
T yp.
Min.
-25
25
50
75
100
125
Temperature (oC) Figure 23A. Output Sink Current vs. Tem perature
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15
200 100 0 10 12 14 16 18 20 V BIAS Supply Voltage (V) Figure 23B. Output Sink Current vs. Supply Voltage
Min.
10
12
14
16
18
20
V BS Flouting Supply Voltage (V) Figure 24. Maxim um V s Negative Offset vs. Supply Voltage
140 120 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 25. IR2108 vs. Frequency (IRFBC20), Rgate=33 , V CC=15V
140V 70V 0V
Temprature (oC)
16
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140 120 Temperature (oC) 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 27. IR2108 vs. Frequency (IRFBC40), Rgate=15 , V CC=15V
1 40V 70V
0V
100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 28. IR2108 vs. Frequency (IRFPE50), Rgate=10 , V CC=15V
140 120 Temperature (oC) 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 29. IR21084 vs. Frequency (IRFBC20), Rgate=33 , V CC=15V
140V 70V 0V
140 120 Temperature (oC) 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 30. IR21084 vs. Frequency (IRFBC30), Rgate=22 , V CC=15V
1 40V 70V 0V
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17
100
140V
0V
80 60 40 20 1 10 100
70V 0V
1000
1000
Frequency (KHz) Figure 31. IR21084 vs. Frequency (IRFBC40), Rgate=15 , V CC=15V
Frequency (KHz) Figure 32. IR21084 vs. Frequency (IRFPE50), Rgate=10 , V CC=15V
140 120 Temperature (oC) Temperature (oC) 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 33. IR2108S vs. Frequency (IRFBC20), Rgate=33 , V CC=15V
1 40V 70V 0V
140 120
140V
100 80 60 40 20 1 10 100
70V 0V
1000
Frequency (KHz) Figure 34. IR2108S vs. Frequency (IRFBC30), Rgate=22 , V CC=15V
18
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140V70V
140V 70V 0V
0V
1000
Frequency (KHz) Figure 35. IR2108S vs. Frequency (IRFBC40), Rgate=15 , V CC=15V
Frequency (KHz) Figure 36. IR2108S vs. Frequency (IRFPE50), Rgate=10 , V CC=15V
140 120
Temperature (oC)
100 80 60 40 20 Frequency (KHz) Figure 37. IR21084S vs. Frequency (IRFBC20), Rgate=33 , V CC=15V
140V 70V 0V
10
100
1000
Frequency (KHz)
Figure 38. IR21084S vs. Frequency (IRFBC30), Rgate =22 , VCC =15V
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19
140 Temperature (oC) Temperature (oC) 120 100 80 60 40 20 1 10 100 1000 Frequency (KHz) Figure 39. IR21084S vs. Frequency (IRFBC40), Rgate=15 , V CC=15V
1 40V 70V 0V
140V 70V 0V
1000
Frequency (KHz) Figure 40. IR21084S vs. Frequency (IRFPE50), Rgate=10 , V CC=15V
20
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8-Lead PDIP
DIM
F OOT PRINT 8X 0.72 [.028]
D A 5
INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574
MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00
A b c D
A1 .0040
6 E
5 H 0.25 [.010] A
E
6.46 [.255]
e e1 H K L y
.050 BAS IC .025 BAS IC .2284 .0099 .016 0 .2440 .0196 .050 8
1.27 BAS IC 0.635 BAS IC 5.80 0.25 0.40 0 6.20 0.50 1.27 8
6X
3X 1.27 [.050]
8X 1.78 [.070]
e1
K x 45
C 0.10 [.004]
y 8X c
8X b 0.25 [.010]
NOT ES :
A1 C A B
8X L 7
1. DIMENSIONING & TOLE RANCING PER AS ME Y14.5M-1994. 2. CONT ROLLING DIMENSION: MILLIME TER 3. DIMENSIONS ARE S HOWN IN MILLIMET ERS [INCHE S]. 4. OUTLINE CONFORMS T O JEDEC OUT LINE MS-012AA.
5 DIMENS ION DOES NOT INCLUDE MOLD PROT RUS IONS. MOLD PROTRUSIONS NOT T O E XCEED 0.15 [.006]. 6 DIMENS ION DOES NOT INCLUDE MOLD PROT RUS IONS. MOLD PROTRUSIONS NOT T O E XCEED 0.25 [.010]. 7 DIMENS ION IS T HE LE NGT H OF LEAD FOR SOLDERING T O A SUBS TRAT E.
8-Lead SOIC
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21
14-Lead PDIP
22
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ORDER INFORMATION Basic Part (Non-Lead Free) 8-Lead PDIP IR2108 8-Lead SOIC IR2108S 14-Lead PDIP IR21084 14-Lead SOICIR21084S order order order order IR2108 IR2108S IR21084 IR21084S Lead-Free Part 8-Lead PDIP IR2108 8-Lead SOIC IR2108S 14-Lead PDIP IR21084 14-Lead SOIC IR21084S order order order order IR2108PbF IR2108SPbF IR21084PbF IR21084SPbF
This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IRs Website. Data and specifications subject to change without notice. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.09/08/04 www.irf.com 23