ALIGNER WAFER BONDERS

AN INDUSTRY FIRST

ACTIVATE, ALIGN & BOND IN ONE MACHINE

New AML in-situ, ‘RAD’ technology for Low Temperature Bonding

Better than a plasma

· More stable, reliable, better bond & bond uniformity

· Larger more useful process window after activation & subsequent
bonding
· Activation without surface roughening! No change in AFM
topographical roughness after activation
· Reduced handling – higher yields
· No exposure to energetic ions or electric fields reducing the risk of
surface damage
· In-situ promotes higher yields due to reduced risk of
hydrocarbon contamination

Only AML can:

Align, Activate and Bond in One chamber, in One machine!

APPLIED MICROENGINEERING LTD. (AML)

It’s Radical Unit 8, Library Avenue, Didcot, Oxon, OX11 0SG, UK

Tel: +44 (0) 1235 833934 Fax: +44 (0) 1235 833935
e-mail: bonds@aml.co.uk http://www.aml.co.uk