Design For Test by Alfred L Crouch

Figures to Accompany
Design-for-Test for Digital ICs and Embedded Core Systems
Alfred L. Crouch
1999 Prentice Hall, All Rights Reserved
Contents
ii
Chapter 1 Test and Design-for-Test Fundamentals Figure 1-1 Cost of Product Figure 1-2 Concurrent Test Engineering Figure 1-3 Why Test? Figure 1-4 Definition of Testing Figure 1-5 Measurement Criteria Figure 1-6 Fault Modeling Figure 1-7 Types of Testing Figure 1-8 Manufacturing Test Load Board Figure 1-9 Using ATE Figure 1-10 Pin Timing Figure 1-11 Test Program Components Chapter 2 Automatic Test Pattern Generation Fundamentals Figure 2-1 The Overall Pattern Generation Process Figure 2-2 Why ATPG? Figure 2-3 The ATPG Process Figure 2-4 Combinational Stuck-At Fault Figure 2-5 The Delay Fault Figure 2-6 The Current Fault Figure 2-7 Stuck-At Fault Effective Circuit Figure 2-8 Fault Masking Figure 2-9 Fault Equivalence Example Figure 2-10 Stuck-At Fault ATPG Figure 2-11 Transition Delay Fault ATPG Figure 2-12 Path Delay Fault ATPG Figure 2-13 Current Fault ATPG Figure 2-14 Two-Time-Frame ATPG Figure 2-15 Fault Simulation example Figure 2-16 Vector Compression and Compaction Figure 2-17 Some Example Design Rules for ATPG Support Figure 2-18 ATPG Measurables Chapter 3 Scan Architectures and Techniques Figure 3-1 Introduction to Scan-based Testing Figure 3-2 An Example Non-Scan Circuit
Design-for-Test for Digital ICs and Embedded Core Systems 1999 Prentice Hall, All Rights Reserved
Alfred L. Crouch
Contents
iii
Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Figure 3-8 Figure 3-9 Figure 3-10 Figure 3-11 Figure 3-12 Figure 3-13 Figure 3-14 Figure 3-15 Figure 3-16 Figure 3-17 Figure 3-18 Figure 3-19 Figure 3-20 Figure 3-21 Figure 3-22 Figure 3-23 Figure 3-24 Figure 3-25 Figure 3-26 Figure 3-27 Figure 3-28
Scan Effective Circuit Flip-Flop versus Scan Flip-Flop Example Set-Scan Flip-Flops An Example Scan Circuit with a Scan Chain Scan Element Operations Example Scan Test Sequencing Example Scan Testing Timing Safe Scan Shifting Safe Scan Vectors Partial Scan Multiple Scan Chains The Borrowed Scan Interface Clocking and Scan Scan-Based Design Rules DC Scan Insertion Stuck-At Scan Diagnostics At-Speed Scan Goals At-Speed Scan Testing At-Speed Scan Architecture At-Speed Scan Interface Multiple Scan and Timing Domains Clock Skew and Scan Insertion Scan Insertion for At-Speed Scan Critical Paths for At-Speed Testing Logic BIST Scan Test Fundamentals Summary
Chapter 4 Memory Test Architectures and Techniques Figure 4-1 Introduction to Memory Testing Figure 4-2 Memory Types Figure 4-3 Simple Memory Organization Figure 4-4 Memory Design Concerns Figure 4-5 Memory Integration Concerns Figure 4-6 Embedded Memory Test Methods Figure 4-7 Simple Memory Model Figure 4-8 Bit-Cell and Array Stuck-At Faults
Alfred L. Crouch
Contents
iv
Figure 4-9 Figure 4-10 Figure 4-11 Figure 4-12 Figure 4-13 Figure 4-14 Figure 4-15 Figure 4-16 Figure 4-17 Figure 4-18 Figure 4-19 Figure 4-20 Figure 4-21 Figure 4-22 Figure 4-23 Figure 4-24 Figure 4-25 Figure 4-26 Figure 4-27 Figure 4-28
Array Bridging Faults Decode Faults Data Retention Faults Memory Bit Mapping Algorithmic Test Generation Scan Boundaries Memory Modeling Black Box Boundaries Memory Transparency The Fake Word Technique Memory Test Needs Memory BIST Requirements An Example Memory BIST MBIST Integration Issues MBIST Default Values Banked Operation LFSR-Based Memory BIST Shift-Based Memory BIST ROM BIST Memory Test Summary
Chapter 5 Embedded Core Test Fundamentals Figure 5-1 Introduction to Embedded Core Test and Test Integration Figure 5-2 What is a CORE? Figure 5-3 Chip Designed with Core Figure 5-4 Reuse Core Deliverables Figure 5-5 Core DFT Issues Figure 5-6 Core Development DFT Considerations Figure 5-7 DFT Core Interface Considerations Figure 5-8 DFT Core Interface Concerns Figure 5-9 DFT Core Interface Considerations Figure 5-10 Registered Isolation Test Wrapper Figure 5-11 Slice Isolation Test Wrapper Figure 5-12 Slice Isolation Test Wrapper Cell Figure 5-13 Core DFT Connections through the Test Wrapper Figure 5-14 Core DFT Connections with Test Mode Gating
Alfred L. Crouch
Contents
Figure 5-15 Figure 5-16 Figure 5-17 Figure 5-18 Figure 5-19 Figure 5-20 Figure 5-21 Figure 5-22 Figure 5-23 Figure 5-24 Figure 5-25 Figure 5-26 Figure 5-27
Other Core Interface Signal Concerns DFT Core Interface Frequency Considerations A Reuse Embedded Cores DFT Features Core Test Economics Chip with Core Test Architecture Isolated Scan-Based Core-Testing Scan Testing the Non-Core Logic Scan Testing the Non-Core Logic Memory Testing the Device DFT Integration Architecture Test Program Components Selecting or Receiving a Core Embedded Core DFT Summary
Alfred L. Crouch
Chapter 1 Test and Design-for-Test Fundamentals Chapter 1 Test and Design-for-Test Fundamentals
Total Cost Testing Cost Packaging Cost Silicon Cost Initial Product
Increasing Time Final Product
The goal over time is to reduce the cost of manufacturing the product by reducing the per-part recurring costs: - reduction of silicon cost by increasing volume and yield, and by die size reduction (process shrinks or more efficient layout) - reduction of packaging cost by increasing volume, shifting to lower cost packages if possible (e.g., from ceramic to plastic), or reduction in package pin count - reduction in cost of test by: - reducing the vector data size - reducing the tester sequencing complexity - reducing the cost of the tester - reducing test time - simplifying the test program
Figure 1-1 Cost of Product
Alfred L. Crouch
Chapter 1 Test and Design-for-Test Fundamentals
Behavioral Specification and Model Test Architecture Development Test Control Test Interface BIST HDL JTAG HDL Functional Architecture Development
Hardware Description Language Register Transfer Level Timing Constraints
Gate-Level Library Mapping Scan Insertion Insert Scan Cells Scan Signals Scan Ports Test Timing Physical Process Mapping Scan Optimization FloorPlanning and Place&Route Macrocell FloorPlanning Timing Driven Cell Placement Timing Driven Routing Clock Tree Synthesis Gate-Level Synthesis
Gate-Level Netlist Static Timing Assessment
Algorithmic Scan Signal ReOrdering
Figure 1-2 Concurrent Test Engineering
Alfred L. Crouch
WHY TEST?
Reasons Measurement of Defects & Quality Level Perceived Product Quality by Customer Pro & Con Perceptions of DFT Eases Generation of Vectors Eases Diagnosis & Debugging Provides a Deterministic Quality Metric Reduces the Cost of Test
Figure 1-3 Why Test?
Incoming Inspection Contractual Reliability Requirement Contractual
Adds Complexity to Design Methodology Impacts Design Power & Package Pins Impacts Design Speed or Performance Adds to Silicon Area
Alfred L. Crouch
DEFINITION of TESTING
Device or Circuit under test
A KNOWN STIMULUS
DEVICE IN A KNOWN STATE
A KNOWN EXPECTED RESPONSE
EXAMPLE
IN_A IN_B IN_C IN_D D Q Broadside Parallel Vector CLK a b a b D Q CLK 0 1 S OUT_1
OUT_2
with an unknown state
1 1 ^ 1
1 ^ X ^
1 X 1 X 1
? ?
Figure 1-4 Definition of Testing
Alfred L. Crouch
Vdd S G D S G D Vss
source-to-drain short
D is always at a logic 1
physical defects opens shorts metal bridges process errors transistor faults S2 D G2 D S2 G G2 SB S 2 SB D2 SB gate faults a@ 0 a@ 1 b@ 0 b@ 1 c@ 0 c@ 1
+ A
C
observed truth table A B C failures 0 0 1 0 0 1 1 0 1 1 0 1 1 0 1 0
Transistor and Gate Representation of Defects, Faults, and Failures Figure 1-5 Measurement Criteria
Alfred L. Crouch
defects open/short bridge mask process
transistor faults s2 d g2 d s2 g g 2 sb s 2 sb d 2 sb
stuck faults a@ 0 a@ 1 b@ 0 b@ 1 c@ 0 c@ 1 6 gate faults transition delay faults a 1- 0 a 0- 1 b1- 0 b0- 1 c 1- 0 c 0- 1
+ a
g s d
c b
6 transitions Truth Table with fail modes nand ab a b c ab c 0 1 1 0 00 1 1 1 1 0 01 1 1 0 1 0 10 1 1 1 0 0 11 0 1 0 0 0
a e f r t c
1 BIT ADDER with CARRY
b C
Figure 1-6 Fault Modeling
path delay faults A R A F 2S 2S A R A F 2C 2C B2SR B2SF B2CR B2CF path R=Slow-to-Rise F=Slow-to-Fall
Alfred L. Crouch
Functional
3 a
4
A D D E R
3+5=8
Structural
A
a e f r s t S
b c
faultlist a@ 0 a@ b@ 0 b@ e@ 0 e@ f@ 0 f@ r@ 0 r@ t@ 0 t@ s@ 0 s@ c@ 0 c@ 16 faults
1 1 1 1 1 1 1 1
Figure 1-7 Types of Testing
Alfred L. Crouch
Chip under Test
The chip will be accessed by the tester at its pins only A custom (load) board will be made for this purpose Each pin has a limited number of bits available (e.g., 2 MB) The test program (set of vectors and tester control) will be applied at tester speed (may be less than actual chip speed) The primary goal of manufacturing test is structural verification
Figure 1-8 Manufacturing Test Load Board
Alfred L. Crouch
2 Meg Memory Depth 192 Channels
Clock Gen 1 Clock Gen 2 Clock Gen 3
Loadboard
Power Supply 1 Power Supply 2 Power Supply 3
Figure 1-9 Using ATE
hi
pS o
ck et
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10
Chip Point of View
1 2
DV 4
1. Input Setup Time:
time the signal must arrive and be stable before the clock edge to ensure capture time the signal must remain stable after the clock edge to ensure that capture is stable time the signal takes to be valid (or tristated) and stable on the output after the clock edge time that the signal remains available after output valid so that it can be used
2. Input Hold Time:
3. Output Valid Time:
4. Output Hold Time:
Tester Point of View CLK
NRZ
RZ
SBC
Figure 1-10 Pin Timing
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11
DC Pin Parametrics Test Logic Verification DC Logic Stuck-At DC Logic Retention AC Logic Delay AC Frequency Assessment AC Pin Specification Memory Testing Memory Retention Idd and Iddq Specialty Vectors Analog Functions Test Escapes
Scan Path Delay Scan Sequential
The Venn circles are examples of DC fault coverages of some of the vector classifications in the test program Some of the fault coverages overlap Vector reduction can be accomplished by removing overlap or by combining vector sets
Scan Transition Delay
Scan Stuck-At Functional Test Escapes
Parametric
Figure 1-11 Test Program Components
Alfred L. Crouch
Chapter 2 Automatic Test Pattern Generation Fundamentals Chapter 2 Automatic Test Pattern Generation Fundamentals
Library Support
Netlist Conditioning
Observe Point Assessment
Vector Generation/Simulation
Vector Compression
Vector Writing
Figure 2-1 The Overall Pattern Generation Process
Alfred L. Crouch
Chapter 2 Automatic Test Pattern Generation Fundamentals
Reasons Greater Measurement Ability Perceived Competitive Methodology
WHY ATPG?
Reduction in Cycle Time More Efficient Vectors
Pro & Con Perceptions of ATPG Good Eases Generation of Vectors Eases Diagnosis & Debugging Provides a Deterministic Quality Metric Reduces the Cost of Test
Figure 2-2 Why ATPG?
Bad Adds Complexity to Design Methodology Requires Design-for-Test Analysis Requires Library Support Requires Tool Support
Alfred L. Crouch
Fault Selection
Fault Observe Point Assessment
Fault Excitation
Vector Generation
Fault Simulation
Fault Dropping
Figure 2-3 The ATPG Process
Alfred L. Crouch
a
X
b
stuck-at-0 force to a 1
e
detected good = faulty
d
1 0 0 0 1 1 0 0 0 0 1
D I F F E R E N T
GOOD CIRCUIT
1 0 0 0
1 0 0 0 1 0
FAULTY CIRCUIT
Figure 2-4 Combinational Stuck-At Fault
Alfred L. Crouch
Delay from Strong Driver Insufficient Transistor Doping
A B
Resistive Bridge
Delay Model Element
C D E F
The Delay Fault Model is an added delay to net, nodes, wires, gates and other circuit elements Effect of Delay Fault Delay of Transition Occurrence Changing of Edge-Rate Edge-Rate Layover Ideal Signal 1 0 0 Delay from Extra Load Slow Gate Output Slow Gate Input
Capacitive or Resistive Wire Delay from Opens and Metal Defects
Added Rise Delay
Added Fall Delay
Figure 2-5 The Delay Fault
Alfred L. Crouch
Leakage from Bridge Leakage from Metastability
A B
Resistive Bridge
Leakage Fault Model
C D E F
Leakage from Bridge
Internal Gate Leakage
Capacitive or Resistive Delay Extends Current Flow Time
The Current Fault Model is an added Leakage to net, nodes, wires, gates and other circuit elements
Effect of a Current Fault is to add extra current flow or to extend flow time
I(t)
t
Figure 2-6 The Current Fault
Alfred L. Crouch
a b c d
evaluate fault against the gates truth table R E M A P
X
nand ab z 00 1 01 1 10 1 11 0
1 c
e d
evaluate change against the gates truth table R E M A P
nor ab z 00 1 01 0 10 0 11 0
e
evaluate final result against the circuits whole truth table
Detectable
Figure 2-7 Stuck-At Fault Effective Circuit
Alfred L. Crouch
b e
not detected good = faulty
c
1 0 X 1 1 0 X 0 1 0
GOOD CIRCUIT
S A M E
1 0 X
0 1 1 X 1 1 0
FAULTY CIRCUIT
Figure 2-8 Fault Masking
Alfred L. Crouch
a e f r r t t s S
b a e
1 1 1 1 1 1 1 1
GOOD - 1 BIT ADDER with CARRY
a b a a b
z z z
1. Any fault that requires a logic 1 on the output of an AND-gate will also place 1s on inputs 2. Similar analysis exists for all other gate-level elements 3. If one fault is detected, all equivalent faults are detected 4. Fault selection only needs to target one of the equivalent faults
Fault Equivalence Table
AND INV OR
a@0 = b@0 = z@0 a@1 = z@0 : a@0 = z@1 a@1 = b@1 = z@1
Figure 2-9 Fault Equivalence Example
Alfred L. Crouch
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A 1
eX f B b
0
r
1 0 1
1 1 1 1 1 1 1 1
1 BIT ADDER with CARRY Set Up the Detect and Propagation Path
1. Set up the path to pass the opposite of e S @ 0, which is e = 1 2. Exercise by setting e equal to1
a e f
1
r s t S
3. Detect by observing S for wrong value during fault simulation
B 0
b c C
1 BIT ADDER with CARRY Exercise the Fault Figure 2-10 Stuck-At Fault ATPG
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A 1
a 1 eX f 0
r t
1 1 0
b c
Set Up the Detect Path to Pass a 1
1 1 1 1 1 1 1 1
a e 0 f
0
r t
1. Set up the path to pass the opposite of e S=0 S @ 0, which is e = 1 2. Pre-fail by setting e equal to 0
S@Time 1 c
B 1
b C

Pre-Fail the Fault by Passing a 0
3. Exercise by setting e equal to 1 some time period later 4. Detect by observing S for wrong value during timing simulation
a e 1 f
1
r
1
S=1
The Transition Delay Faultlist is identical to the Stuck-At Faultlist but the goal is to detect a Logic Transition within C a given time period
S@Time 2
B 0
b c
Exercise the Fault to Pass a 1
Figure 2-11 Transition Delay Fault
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1->1
1->1
eX f
0 0
r t
X
0->0
x->x b
16.0 pt
1 1 1 1 1 1 1 1
1 BIT ADDER with CARRY Set Up the Off-Path
1. Set up the path to pass a transition on B-to-S through e, r, and s by setting the off-path values to be stable for 2 time periods 2. Exercise by rst setting B equal to 1 and then to 0. This is known as a vector-pair
A
1->0
a e f
0->1
r
0->1
s
0->1
S@Time1 -> S@Time2

1. Detect by observing S for wrong value during fault simulation with respect to a time C standard
B
1->0
b c
1 BIT ADDER with CARRY Exercise the Fault (Path) Figure 2-12 Path Delay Fault
Alfred L. Crouch
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1 1 1 1 1 1 1 1
a e f
1
1. Exercise by rst setting e equal to1
r s t S
2. Detect by measuring current and accept vector by quietness
B 0
b c
1 BIT ADDER with CARRY Exercise the Fault
Figure 2-13 Current Fault
Alfred L. Crouch
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Transition bit
End of Path bit
1 0 0 1
preset next-state
1->0 second-order cone of logic establishes transition and off-path values establishes the legal next-state 1->1 0->0 1->1
establish first state
Defined Critical Path
Gate Elements
D Expect
Value
first-order combinational cone of logic contains path and off-path logic

legal next-next-state
legal next-state
Solve This Combinational Cone of Logic As Second Step after Middle Register Values Are Established by First Cone
Solve This Combinational Cone of Logic As the First Step to Combinational Multiple Time Frame Analysis
Slack Time Propagation Delay Time Register Setup Time
1 1. Launch 1st Value: 2. Launch Transition: 3. Capture Transition:
establish path fail value at clock edge provide pass value at next clock edge observe transition value at this clock edge
Figure 2-14 Two-Time-Frame ATPG
Alfred L. Crouch
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a e f r t c
GOOD - 1 BIT ADDER with CARRY
b C
1 1 1 1 1 1 1 1
a e f r t
GND
1. Create multiple copies of the netlist for each fault. 2. Apply same vectors to each copy.
c
t S@0 - 1 BIT ADDER with CARRY
3. Compare each copy to good simulation (expected response). 4. Fault is detected if bad circuit and good circuit differ at a detect point. 5. Measurement is faults detected divided by total number of faults (8/16 = 50%).
a e f r t
+ VDD
t S@1 - 1 BIT ADDER with CARRY
Figure 2-15 Fault Simulation example
Alfred L. Crouch
16
Simulation Post Processing Compression Pattern Set 01101110001010 01101110101110 00101110111010 11111110001010 01100000001011 01001011001010 01010101010101 11101100101010 11001110001010 01111000001010 00000000001010 Fault Re-Simulation with Redundant Vector Dropping This Usually Drops Early Vectors That Are Fully Covered by Later Vectors and Eliminates Less Efficient Vectors
X X 1 0 1 0 X X X X X one targeted fault
Dynamic ATPG Compression
During ATPG a Vector Is Not Submitted to Fault Simulation until Multiple Faults have been Targeted Xs Mapped This can Greatly Increase Vector Generation Time But Usually Results in the Most Efficient Vectors
Figure 2-16 Vector Compression and Compaction
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Transistor Structure Equivalent Gate Structure
ATPG May Only Operate on Gate-level Elements
Combinational Feedback Results in Latches, Oscillators, or Endless Loops
Propagation Timing Distance Must Be Less Than One Test Clock Cycle
SET D Q CLK
General Combinational Logic
CLR D Q CLK
Figure 2-17 Some Example Design Rules for ATPG
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Design Description
Sizing
Complexity
ATPG Library Runscripts
Faultlist Management Support Files
ATPG TOOL
algorithms rule checks
Runtime
Vectors Vector Features Compression Vector Translation

Figure 2-18 ATPG Measurables
Detected Faults
Alfred L. Crouch
Chapter 3 Scan Architectures and Techniques Chapter 3 Scan Architectures and Techniques
- >1,000,000 gates - >5,000,000 faults - >10,000 flip-flops - > 1,000 sequential depth - < 500 chip pins * > 2,000 gates/pin * > 2M = 21000 A deep sequential circuit Chip under Test without Scan
- >1,000,000 gates - >5,000,000 faults - > no effective flip-flops - > no sequential depth - < 500 + 10,000 chip pins * > 95.23 gates/pin * > 2M = 20 = 1 A combinational circuit Chip under Test with Full-Scan
Figure 3-1 Introduction to Scan-based Testing
Alfred L. Crouch
Chapter 3 Scan Architectures and Techniques
Combinational & Sequential Logic input1 input2 input3 input4 D Q output1
QN clk input5 D Q
input6
output2
2 Sequential Depth of 4 Combinational Width of 6 26+4 = 1024 Vectors
34
Figure 3-2 An Example Non-Scan Circuit
Alfred L. Crouch
Combinational-Only Logic
input1 input2 input3 input4 D Q QN D Q
output1
input5
input6 TPI1 TPI2 TPI3 TPI4 TPI5
output2
A no-clock, combinational-only circuit with: 6 inputs plus 5 pseudo-inputs and 2 outputs plus 4 pseudo-outputs
TPO1 TPO2 TPO3 TPO4
Figure 3-3 Scan Effective Circuit
Alfred L. Crouch
QN CLK
clk
Regular D Flip-Flop
D
D Q
SDO Q SDO
clk
SDI SE
QN
CLK
Scannable D Flip-Flop
Figure 3-4 Flip-Flop versus Scan Flip-Flop
Alfred L. Crouch
SET D SDI QN SE
clk
SDO
D Q
CLK
Set-Scan D Flip-Flop with Set at Higher Priority
D SET SDI SE CLK
SDO Q QN
clk
Set-Scan D Flip-Flop with Scan-Shift at Higher Priority Figure 3-5 Example Set-Scan Flip-Flops
Alfred L. Crouch
Combinational and Sequential Logic input1 input2 input3 input4 SE scanin clk input5 D SE SDI QN D SE SDI SDO scanout Q Q
output1
SDO
input6
D SE SDI
D SE SDI
output2
SDO
SDO
4-Bit Scan Vector
Figure 3-6 An Example Scan Circuit with a Scan Chain
Alfred L. Crouch
D SDI SE CLK
a D b Q
Q QN
clk
SDO
Scannable D Flip-Flop
The scan cell provides observability and controllability of the signal path by conducting the four transfer functions of a scan element. Operate: D to Q through port a of the input multiplexer: allows normal transparent operation of the element. Scan Sample: D to SDO through port a of the input multiplexer: gives observability of logic that fans into the scan element. Scan Load/Shift: SDI to SDO through the b port of the multiplexer: used to serially load/shift data into the scan chain while simultaneously unloading the last sample. Scan Data Apply: SDI to Q through the b port of the multiplexer: allows the scan element to control the value of the output, thereby controlling the logic driven by Q.
Figure 3-7 Scan Element Operations
Alfred L. Crouch
D
SDI
From normal operation: D Q
Q QN
SDO While the clock is low, apply test data to SDI and Place SE = 1 At the rising edge of the clock, test data will be loaded Apply clocks for scan length
SE=0 CLK
clk
Functional Operation Mode
Q QN
SDI SE=1 CLK

Scan Shift Load/Unload Mode clk
SDO
When chain is loaded, the last shift clock will apply scan data While the clock is low, place SE = 0 Normal circuit response will be applied to D The next rising edge of the clock will sample D Return to Load/Shift mode to unload circuit response sample NOTE: unloading is simultaneous with loading the next test
D SDI
Q QN
SDO
SE=1 CLK
clk
Scan Apply Mode (Last Shift)
D
SDI
Q QN Repeat operations until all vectors have been applied NOTE: the chips primary inputs must be applied during the scan apply mode (after the last shift)
SE=0 CLK
clk
SDO
Scan Sample Mode
Figure 3-8 Example Scan Test Sequencing
Alfred L. Crouch
The Scan Sample The Last Shift In The First Shift Out
CLK
SE
Scan Enable De-assert
Scan Enable Assert
The Output Pin Strobe SHIFT DATA SHIFT DATA FAULT EXERCISE SAMPLE DATA SHIFT DATA SHIFT DATA
Faults Exercised Interval
Figure 3-9 Example Scan Testing Timing
Alfred L. Crouch
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Gated Clock Nets

Provide an Enable Signal f_seB force the clock on
clock tree distribution
Asynchronous or Synchronous Signals with Higher Priority than Scanor Non-Scan Elements D Q HOLD SET CLR f_seB CLK Provide a Blocking Signal D Q HOLD SET CLR CLK
Driven Contention During Scan Shifting
D Q CLK D Q CLK
t_seB Provide a Forced Mutual Exclusivity Figure 3-10 Safe Scan Shifting
Q D CLK Q D CLK
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The Scan Sample The Last Shift In The First Shift Out
CLK
Faults Exercised Interval SE
t_seB
a tristate scan enable may be a separate signal that has slightly different timing than the flip-flop SE
Driven Contention during the Capture Cycle
D Q CLK D Q CLK
t_seB de-asserted
Q D CLK Q D CLK
Figure 3-11 Safe Scan Vectors
Alfred L. Crouch
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Combinational-Only Logic
input1 input2 input3 input4 D Q QN D Q
output1
input5
input6 TPI1 TPI2 TPI3 TPI5
output2
TPO1 TPO3 TPO4
A clocked, sequential circuit with depth=1: 6 inputs plus 4 pseudo-inputs and 2 outputs plus 3 pseudo-outputs
Figure 3-12 Partial Scan
Alfred L. Crouch
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An Example Using a Chip with 1000 Scan Bits and 5 Scan Vectors Red Space Is Wasted Tester Memory
1000 1000
Vector Data
1000
1000
One Channel
One Long Scan Chain
Xs on all Other Channels not actively used for parallel pin data
Each Vector is 1000 Bits Long So 5 Vectors Are 5000 Bits of Tester Memory
Many Variable Length Scan Chains
120 X 80 XXX 100 XX 110 XX 90 XXX 180 X20 XXXX 100 XX 100 XX 100 XX
120 X 80 XXX 100 XX 110 XX 90 XXX 180 X20 XXXX 100 XX 100 XX 100 XX
Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data
120 X 80 XXX 100 XX 110 XX 90 XXX 180 X 20 XXXX 100 XX 100 XX 100 XX
120 X 80 XXX 100 XX 110 XX 90 XXX 180 X 20 XXXX 100 XX 100 XX 100 XX
10 Non-Balanced Channels
Each Vector Is 180 Bits LongSo 900 Bits of Tester Memory Differences from Longest Chain (180) Are Full of XsWasted Memory
Many Balanced Scan Chains
100 100 100 100 100 100 100 100 100 100
100 100 100 100 100 100 100 100 100 100
Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data Vector Data
100 100 100 100 100 100 100 100 100 100
100 100 100 100 100 100 100 100 100 100
10 Balanced Channels
Each Vector Is 100 Bits LongSo 500 Bits of Tester Memory No Wasted Memory Space
Figure 3-13 Multiple Scan Chains
Alfred L. Crouch
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Borrowed DC Scan Input on Bidirectional Pin

Combinational Logic Output Data Path Blocked during Scan Shift
Scan Data Input Any Bidir Functional Pin
Output Enable with bus_se Captures through the or scan_mode Combinational Logic during the Sample Operation Combinational Logic Parallel Scan Input to Chip Normal Input to Logic
D S SE Q Input
Pad
Captures Directly from the Input Pin During the Shift Operation
SE
Input Scan InterfaceMay Resolve to Functional during Sample Interval
Borrowed DC Scan Output on Bidirectional Pin

Last Scan Shift Bit from Scan Chain Q Input Normal Output from Logic D S SE Input Data Path Is a Dont Care during Scan Shift SE on Input Combinational Blocks Data Logic
D S SE Q Output
Combinational Logic
a b s
Scan Data Output Any Bidir Pin
Added Scan Output Mux with bus_se or scan_mode Functional Output Enable with bus_se or scan_mode added
Pad
Output Scan InterfaceMay Resolve to Functional during Sample Interval Figure 3-14 The Borrowed Scan Interface
Alfred L. Crouch
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Scan Bypass Clocks Scan Testing an On-Chip Clock Source
Bypass Clocks
Analog
Digital 1
Digital 2
VCO Raw VCO Clock Counters & Dividers
On-Chip Clock Generation Logic
Figure 3-15 Clocking and Scan
Alfred L. Crouch
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Driven Contention during Scan Shifting
D Q CLK D Q CLK
t_seB Provide a Forced Mutual Exclusivity
Q D CLK Q D CLK
Asynchronous or Synchronous Signals with Higher Priority than Scanor Non-Scan Elements D Q HOLD SET CLR f_seB CLK Provide a Blocking Signal D Q HOLD SET CLR CLK
Gated Clock Nets

Provide a Blocking Signal f_seB
Figure 3-16 Scan-Based Design Rules
Alfred L. Crouch
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Basic Netlist Scan Insertion Element Substitution Ports, Routing & Connection of SE Ports, Routing & Connection of SDI-SDO Extras Tristate Safe Shift Logic Asynchronous Safe Shift Logic Gated-Clock Safe Shift Logic Multiple Scan Chains Scan-Bit Re-Ordering Clock Considerations
All Non-Sampling Clock Domains Inhibit Sample Clock Pulse
Last Shift
All Scan Chains (Clocks) Shift
Only One Clock Domain Conducts a Sample Clock
Figure 3-17 DC Scan Insertion
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1 0 1 1 0 0 0
1 0 0 1 1 0 1
1 0 1 0 0 1 0
1 0 0 0 1 1 1
1 0 1 1 0 0 0
1 0 0 1 1 0 1
1 0 1 0 0 1 0
1 0 0 0 1 1 1
Scan Fail Data Presented at Chip Interface Automatically Implicates the Cone of Logic at One Flip-Flop Multiple Fails under the Single Fault Assumption Implicate Gates Common to Both Cones of Logic
1 0 0 1 0
0 1
Figure 3-18 Stuck-At Scan Diagnostics
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Basic Purpose Frequency Assessment Pin Specifications Delay Fault Content
Cost Drivers No Functional Vectors Fewer Overall Vectors Deterministic Grade
Figure 3-19 At-Speed Scan Goals
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The Transition Launch The Last Shift In The First Shift Out The Transition Capture
CLK
Transition Generation Interval
Faults Exercised Interval
SE
T_SE
F_SE
Bus_SE
Separate Scan Enables for Tristate Drivers, Clock Forcing Functions, Logic Forcing Functions, Scan Interface Forcing Functions, and the Scan Multiplexor Control Because the Different Elements Have Different Timing Requirements
Figure 3-20 At-Speed Scan Testing
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Borrowed Scan Input with Scan Head Register

Output Data Path Blocked during Scan Shift Output Enable with bus_se Any Bidir Pin Combinational Logic D S SE Q Input Parallel Scan Input to Chip Normal Input to Logic
Pad
D Q Input
At-Speed Scan InterfaceResolves to Functional During Sample Interval
Driven Contention During Scan Shifting
CLK D Q
CLK Q D
CLK
t_seB At-Speed Assert and De-Assert
CLK
Asynchronous or Synchronous Signals with Higher Priority than Scan or Non-Scan Sequential Elements
D HOLD SET CLR CLK Q D HOLD SET CLR Q
f_seB At-Speed Assert and De-Assert
CLK
Figure 3-21 At-Speed Scan Architecture
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Borrowed AC Scan Input on Bidirectional Pin

Combinational Logic Output Data Path Blocked during Scan Shift Output Enable with at-speed bus_se Scan Data Input Any Bidir Functional Pin Captures through the Combinational Logic during the Sample Operation Combinational Logic Parallel Scan Input to Chip Normal Input to Logic Captures Directly from the Input Pin During the Shift Operation
D S SE Q Input
Pad
D Q Input Head
Input Scan InterfaceResolves to Functional during Sample Interval
Borrowed AC Scan Output on Bidirectional Pin

Last Scan Shift Bit from Scan Chain Q Input Normal Output from Logic D S SE Input Data Path Is a Dont Care during Scan Shift SE on Input Combinational Blocks Data Logic
D S SE Q Output
Combinational Logic
Scan Data Output Any Bidir Pin
D Q b Output s Tail
Added Scan Output Mux with bus_se Functional Output Enable with bus_se Added
Pad
Output Scan InterfaceResolves to Functional During Sample Interval Figure 3-22 At-Speed Scan Interface
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Fast to Slow Transfers
Slow to Fast Transfers
Fast Logic Fast to Slow Transfers
Slow Logic
Fast Scannable System Registers Clock A Scan Enable A
Slow Scannable System Registers Clock B Scan Enable B
The Clock Domains and Logic Timing should be crafted so that the very next rising edge after the launch or last shift is the legal capture edge
Last Scan Shift Edge Legal ATPG Transfer Illegal ATPG Transfer
Applied Fast Clock
Applied Slow Clock
Only Fast-to-Slow Legal ATPG Transfer
Figure 3-23 Multiple Scan and Timing Domains
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Combinational Logic scanned flip-flop D SDI CLK SE Q D SDI Q
Combinational Logic
Combinational Logic
D SDI 165 ps
120 ps 150 ps
First Clock Domain All Elements on Same Clock Tree

300ps+
Cross Domain Clock Skew
Combinational Logic scanned flip-flop
Combinational Logic
Combinational Logic
D SDI CLK SE
D SDI
D SDI 165 ps
120 ps 150 ps
Second Clock DomainAll Elements on Same Clock Tree

Cross Domain Clock Skew must be managed to less than the fastest flip-flop update time in the launching clock domain If it is not, then the receiving flip-flop may receive new-new scan data before the capture clock arrives To prevent this outcome, constrain the ATPG tool to only sample one clock domain at a time during the sample interval
Figure 3-24 Clock Skew and Scan Insertion
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Specification Development Scan Mode Bus_SE Tristate_SE Logic Force_SE Architecture Development
Model
Simulation Verification
Behavior
Synthesis
Scan Shift SE Clock Force_SE Scan Data Connection Insertion
Timing Analysis
Specification Determination
Scan Chain Bit Re-Ordering
Place and Route
Gates Mask
Mask and Fab
Silicon Test
Silicon
Design Flow Chart Scan Mode: Fixed Safe Logic Force_SE: Logic Forced States Tristate_SE: Internal Tristates Scan Enable (SE): Scan Shift Force_SE: Clock Force States Bus_SE: Scan Interface Control
Figure 3-25 Scan Insertion for At-Speed Scan
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D Q R1 D Q R2 In1 In2
0>1
A U35 B 0
X
Static Timing Analysis Provides Path Description of Identified Critical Path from the Q-Output of R1 to the Device Output PinOut1
0>1
A U36 B A U39 B
A U37 B
1>0
1
Isolated Combinational Logic All Fan-in to Endpoint Is Accounted at this Endpoint Fanout to other Endpoints is Evaluated atThose Endpoints
A U38 B
1>0
Out1
In3 In4
Period = 20ns : Output Strobe @ 15ns Path Element Incremental Cumulative Description Delay Delay
Clk R1.Q U35.A U35.Z U37.A U37.Z U38.A U38.Z Out1
2.2ns 0.0ns 2.1ns 0.1ns 3.2ns 0.2ns 2.2ns 0.1ns Dly=10.1
Skew Amb. 0.0ns 2.1ns 2.2ns 5.4ns 5.6ns 7.8ns 7.9ns Slk=4.9ns
Timing Analysis Report Figure 3-26 Critical Paths for At-Speed Testing
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Polynomial: X3 + X +1 = X3 + X1 + X0 = 23 + 21 + 20 = 11
LFSR - PRPG: pseudo-random pattern generation
X3 Seed CLK
DQ 1
X2
DQ 1
X1
DQ 1
X0
111 011 001 100 010 101 110 111
Chip with Full-Scan and X-Management
DQ CLK
DQ
DQ
LFSR - MISR: multiple input signature register
Figure 3-27 Logic BIST
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Scan Testing Methodology Advantages Direct Observability of Internal Nodes Direct Controllability of Internal Nodes Enables Combinational ATPG More Efficient Vectors Higher Potential Fault Coverage Deterministic Quality Metric Efficient Diagnostic Capability AC and DC Compliance Concerns Safe Shifting Safe Sampling Power Consumption Clock Skew Design Rule Impact on Budgets
Figure 3-28 Scan Test Fundamentals Summary
Alfred L. Crouch
Chapter 4 Memory Test Architectures and Techniques Chapter 4 Memory Test Architectures and Techniques
Chip-Level
Logic
Embedded Memory
Memory Access
PLL
TAP JTAG Boundary Scan
Figure 4-1 Introduction to Memory Testing
Alfred L. Crouch
Chapter 4 Memory Test Architectures and Techniques
Row/Word-Address
Select
Select
Column/Bit-Data
Storage
Column/Bit-Data
6 Transistor SRAM Cell Row/Word-Address
Storage
Select Column/Bit-Data
1 Transistor DRAM Cell Row/Word-Address
Storage
Select
Column/Bit-Data 2 Transistor EEPROM Cell Figure 4-2 Memory Types
Alfred L. Crouch
Data Bus: To Multiple Memory Arrays
Address Bus: To Multiple Memory Arrays
Bus Enable Data In

Memory: Data Width by Address Depth 32 x 512
Data Out
Address In
Read/WriteBar
Memory Array Address Decode to Row Drivers Data Decode to Column Drivers
Output Enable
Control Circuitry to Read, Write, and Data Output Enable
Control Signals: Individual Signals to This Memory Array
Figure 4-3 Simple Memory Organization
Alfred L. Crouch
Chip FloorPlan
Memory 1 M e m o r y 3
Memory 2
- Aspect Ratio - Access Time - Power Dissipation
Memory 4
Figure 4-4 Memory Design Concerns
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Chip FloorPlan
Memory 1 M e m o r y 3
Memory 2
- Routing - Placement & Distribution - Overall Power Dissipation
Processor Local Logic Memory 4
Figure 4-5 Memory Integration Concerns
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32 Embedded Microprocessor Core Data 24 Address 3 Embedded Memory Array
Control Functional Memory Test Data Address Control 32 24 3 Embedded Memory Array
Direct Access Memory Test BIST Controller Done Embedded Memory Array BIST Memory Test Fail
Invoke Reset Hold
Figure 4-6 Embedded Memory Test Methods
Alfred L. Crouch
column # >
row # > 0
row # > 1
data bit cell
row # > 2
Figure 4-7 Simple Memory Model
Alfred L. Crouch
Data in Bit Cells May Be Stuck-At Logic 1 or Logic 0 word stuck-at data value 1110
single bit stuck-at 1
address A031>
address A032>
address A033>
single bit stuck-at 0
Figure 4-8 Bit-Cell and Array Stuck-At Faults
Alfred L. Crouch
Data in Bit Cells May Be Bridged to Other Bit Cells
horizontal (row) bit bridging
1 vertical (column) bit bridging 1
random bit bridging
0 word bridging unidirectional one-way short
word bridging bidirectional two-way short
Figure 4-9 Array Bridging Faults
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Column Decode X C O Select Lines L R O X Row Decode stuck-at faults result in always choosing wrong address R o w D e X c o d e Column Decode bridging faults result in always selecting multiple data bits 0 0 1 1 0 1 1 1 1 1 1 1 1 1 1 1 X 1 0 1 1 W 0 1 1 1 X X
Row Decode bridging faults result in always selecting multiple addresses
Column Decode stuck-at faults result in always choosing wrong data bit
Select Line faults result in similar array fault effects Figure 4-10 Decode Faults
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Data around target cell is written with complement data
Complementary Data around Target Cell
Address 21 = A
Address 22 = 5
Address 23 = A
Address 24 = 5
alternating 5s and As make for a natural checkerboard pattern Figure 4-11 Data Retention Faults
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Blue: Pass Red: Fail
Column Data Fault
Physical Memory Organization Row Address Fault
Logical Memory Organization Stuck-At Bit Faults
Physical Memory Organization Bridged Cell Faults
Physical Memory Organization Figure 4-12 Memory Bit Mapping
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Addr(00) to Addr(Max) Write(5)-Initialize Increment Address
Address 00 > Address 01 > Address 02 >
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 1
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0
Address 03 > Addr(00) to Addr(Max) Read(5)-Write(A)-Read(A) Address 04 > Increment Address Address 05 > Address 06 > Addr(00) to Addr(Max) Read(A)-Write(5)-Read(5) Address 07 > Increment Address Address 08 > Address 09 > Addr(Max) to Addr(00) Read(5)-Write(A)-Read(A) Address 10 > Decrement Address Address 11 > Address 12 > Addr(Max) to Addr(00) Read(A)-Write(5)-Read(5) Address 13 > Decrement Address Address 14 > Addr(Max) to Addr(00) Read(5) Decrement Address Read (A)-------> Write (5) Read (5) Increment Address March C+ Algorithm Address 15 > Address 16 > Address 17 > Address 18 > Address 19 > Address 20 > Address 21 > Address 22 > Address 23 >
Memory Array with 24 Addresses with Algorithm at Read (A) Stage
Figure 4-13 Algorithmic Test Generation
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Boundary at some level of scanned registration or pipelining away from the memory array
Data Detection of incoming signals Address Memory Array
Data Control of outgoing signals
Control
scan-memory boundary Minimum Requirement Detection up to Memory Input and Control of Memory Output Concern: the Logic between the Scan Test Area and the Memory Test Area Is not Adequately Covered
Non-Scanned Registration inside the Boundary but Before the Memory Test Area Results in a Non-Overlap Zone Figure 4-14 Scan Boundaries
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The Memory Array is modeled for the ATPG Engine so the ATPG Tool can use the memory to observe the inputs and control the outputs
Data In
Din Memory Array
Dout
Data Out
Address
Ain
ATPG Model
Control
Read/Write
Scan Architecture
Figure 4-15 Memory Modeling
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Boundary at some level is blocked off as if the memory was cut out of the circuit Scan Mode Control of outgoing signals Gated Data Out Memory Array can be removed from netlist for ATPG purposes Control Multiplexed Data Out All Registers are in the scan chain architecture
Data In Detection of incoming signals Address
scan black-box boundary Observe-only registers used for detection of memory input signals Gate or Multiplexor is used to Blockfix to a known valuethe Memory Output Signals
Figure 4-16 Black Box Boundaries
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Boundary at some level is blocked off as if the memory was cut out of the circuit
Input is passed to output as the form of output control Bypass Data Out Memory array can be removed from netlist for ATPG purposes
Data In Detection of incoming signals Address
Control
scan black-box boundary Observe-only registers used for detection of memory input signals Multiplexor is used to pass the input directly to the output
Figure 4-17 Memory Transparency
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Detection of incoming data signals done here Boundary at some level is blocked off as if the memory was cut out of the circuit Input is passed to output with registration Data In Memory array can be Address removed from netlist for ATPG purposes Control Bypass Data Out In ideal sense, timing should also be matched
scan black-box boundary Observe-only registers not needed on data since register emulates memory Register and multiplexor is used to emulate memory timing and output
Figure 4-18 The Fake Word Technique
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Data Bus: Possibly to Multiple Memory Arrays
Address Bus: Possibly to Multiple Memory Arrays
Data In
Memory: data width by address depth 32 x 512
Data Out
Address
Read/WriteB
Memory Array Address Decode to Row Drivers Data Decode to Column Drivers
Output Enable
Control Circuitry to Read, Write, and Data Output Enable
Control Signals: Individual Signals to This Memory Array Test Must Access the Data, Address, and Control Signals in order to Test This Memory
Figure 4-19 Memory Test Needs
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Chip Level
Invoke Retention Debug
Algorithm Controller Address Generator Data Generator Memory Array(s) Comparator
Done Fail Debug_data
INPUTS Invoke: Start BIST Retention: Pause BIST and Memory Clocking Debug: Enable BIST Bitmap Output OUTPUTS Fail: A Memory Has Failed a BIST Test Done: Operation of BIST Is Complete Debug_data: Debug Data Output OPERATIONS Address: Ability to Apply Address Sequences Data: Ability to Apply Different Data Sequences Algorithm: Ability to Apply Algorithmic Control Sequences Comparator: Ability to Verify Memory Data
Figure 4-20 Memory BIST Requirements
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Invoke Retention Release Bitmap Din Ain Write_en Read_en

Algorithm Controller Address Generator Data Generator
done Fail Hold_out Bitmap_out Dout
Memory DI Array Do A WRB CEB
Comparator
Clk INPUTS Invoke: invoke the BIST (apply muxes and release reset) Retention: enable retention algorithm and pause Release: discontinue and release pause Bitmap: enable bitmap output on fail occurrence OUTPUTS Fail: sticky fail flagdynamic under bitmap Done: operation of BIST is complete Bitmap_out: fail data under bitmap Hold_out: indication of pause
Figure 4-21 An Example Memory BIST
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Chip Level bitmap_out1 Invoke Reset Bitmap Memory Array with BIST done1 fail1 bitmap_out2 Memory Array with BIST done2 fail2 bitmap_out3 Memory Array with BIST done3 fail3 bitmap_out4 Memory Array with BIST done4 fail4 fail 1-4 done 1-4 Invoke: a global signal to invoke all BIST units Reset: a global signal to hold all BIST units in reset done fail diag_out Bitmap: a global signal to put all BIST units in debug mode Hold_#: individual hold signals to place memories in retention or to select which memory is displayed during debug done: all memory BISTs have completed fail: any memory BIST has detected a fault or a failure diag_out: the memory BIST not in hold mode will present debug data Figure 4-22 MBIST Integration Issues so s1
Hold_1 Hold_2 Hold_3 Hold_4
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bitmap_out1
Invoke Reset Bitmap
Memory Array with BIST

done1 fail1
bitmap_out2
Memory Array with BIST

done2 fail2
Hold_1 Memory Array with BIST Hold_2

done3 fail3
bitmap_out3
Hold_3 Hold_4 Memory Array with BIST

done4 fail4
bitmap_out4
so s1
fail 1-4 done 1-4
Invoke: must be a logic 0 when BIST is not enabled Reset: should be a logic 0 when BIST is not enabled Bitmap: should be a logic 0 when BIST is not enabled Hold_#: should be a logic 0 when BIST is not enabled done: should not be connected to package output pin when BIST is not enabled fail: should not be connected to package output pin when BIST is not enabled diag_out: should not be connected to package output pin when BIST is not enabled
done
fail diag_out
Figure 4-23 MBIST Default Values
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n Invoke n Reset n Bitmap
M e m o r y
done A 1-n r r a y s
invoke 1-m
M e m m o r y
done A 1-m r r a y s fail 1-m
Hold_1 Hold_2 Hold_n
with fail 1-n I M n B debug d I e S hold_l1 p T e s hold_l2 n d hold_1m e n t Bank 1 scan_out 1-n n
with m I M n B d I e S p T e s n d e n t Bank 2 n
m diag_out 1-m
so s1 Invoke: global signal invokes bank 1 BIST Reset: global signal holds bank 1 BIST in reset diag_out Bitmap: global signal that enables BIST debug fail done
Hold_#: paired hold signals to place memories in retention or to select which memory is displayed during debug done: bank n memory BISTs have completed fail: any memory BIST has detected a fault or a failure diag_out: the memory BIST not in hold will present debug data Figure 4-24 Banked Operation
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LFSR - PRPG
DQ CLK
DQ
DQ
MBIST Functional 5 A 0 F MBIST Data In Functional Data In Algorithm Sequencer MBIST Functional Functional & MBIST Data Out Control Data Out Address
Memory Array
Data
DQ CLK LFSR - MISR
DQ
DQ
Figure 4-25 LFSR-Based Memory BIST
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The Address sequence can be shifted both forward and backward to provide all addresses The Data sequence can be shifted across the data lines, and can also provide data for a comparator 0 0 1 0 1 1 0 0 1 1 1 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 0
Address
Memory Array
1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Data
0 1 0 0 1 0
Read/Write
The Control sequence can be shifted across the read-write or output enable or other control signals
Figure 4-26 Shift-Based Memory BIST
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MBIST Functional Address
Read-Only Memory Array

MBIST Functional Read Control
Functional Data Out
Data Out
MBIST
DQ CLK LFSR - MISR
DQ
DQ
Figure 4-27 ROM BIST
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Memory Testing Fundamentals Summary

Memory Testing Is Defect-Based Memory Testing Is Algorithmic Different Types of MemoriesDifferent Algorithms A Memory Fault Model Is Wrong Data on Read Memory Testing Relies on Multiple-Clue Analysis A Memory Test Architecture May CoExist with Scan A Memory Can Block Scan Test Goals Modern Embedded Memory Test Is BIST-Based BIST Is the Moving of the Tester into the Chip BIST-Based Testing Allows Parallelism Parallel Testing Impacts Retention Testing Parallel Testing Impacts Power Requirements Parallel Testing Requires Chip-Level Integration
Figure 4-28 Memory Test Summary
Alfred L. Crouch
Chapter 5 Embedded Core Test Fundamentals Chapter 5 Embedded Core Test Fundamentals
Chip-Level TCU Core 4 Core 1 Core 5
Core 2
General Logic
Core 3 Memory Access

Embedded Memory Embedded Memory
PLL
Figure 5-1 Introduction to Embedded Core Test and Test Integration
Alfred L. Crouch
Chapter 5 Embedded Core Test Fundamentals
SOFT
WHAT IS A CORE?
HDL Model with No Test RTL Model with No Test HDL Model with Modeled Test RTL Model with Modeled Test
FIRM Gate-Level Netlist with No Test Gate-Level Netlist with Inserted Test HARD Layout GDSII with No Test Layout with Test from Gate-Level Layout with Test from Synthesis Layout with Test Optimization Gate-Level Netlist with Synthesized Test Gate-Level Netlist with Mixed Test
Figure 5-2 What is a CORE?
Alfred L. Crouch
TMode[3:0]
4
Chip-Level CTCU
3
UDL Core
2
Embedded Memories
1
Embedded Memories Wrapper
PLL
TAP
JTAG Boundary Scan
- A Core-Based Device May Include 1. Core(s) with Test Wrapper + Embedded Memory Arrays 2. Chip-Level User Defined Logic + Embedded Memory Arrays 3. Chip-Level Test Selection and Control Logic 4. Dedicated Chip-Level Test Pins 5. Chip-Level Clock Generation and Clock Control Logic 6. IEEE 1149.1 Controller and Boundary Scan Logic
Figure 5-3 Chip Designed with Core
Alfred L. Crouch
A Reuse Embeddable Core
Business Deliverables 1. The Core 2. The Specification or Data Sheet 3. The Various Models 4. The Integration Guide 5. The Reuse Vectors
Figure 5-4 Reuse Core Deliverables
Alfred L. Crouch
CORE-BASED DESIGN DFT ISSUES

Chip-Level Device A KNOWN STIMULUS ACCESS TO THE EMBEDDED CORE A KNOWN EXPECTED RESPONSE
Other Chip-Level Logic If the Core is HARD DFT must exist before delivery how is access provided at the chip level? If the Core is HARD and delivered with pre-generated vectors how are vectors merged in the whole test program? If the Core is HARD and part of the overall chip test environment how is the core test scheduled? If the Core is HARD and part of the overall chip test environment what defaults are applied when not active? If the Core is HARD what is the most economical and effective test mix Scan? LBIST? MBIST? Functional? If the Core is SOFT is the overall chip test environment developed as a Core and UDL or as a unified design? If the Core operates at a different frequency from the pin I/O or other chip logic how does this affect DFT and Test?
Figure 5-5 Core DFT Issues
Alfred L. Crouch
A Reuse Embeddable Core
DFT Drivers During Core Development Target Market/business Turnkey versus Customer Design Target Cost-Performance Profile Low to High Potential Packages Plastic versus Ceramic Potential Pin Counts Core Test Architectures and Interfaces Direct Access Mux Out Core Terminals Add-On Test Wrapper Virtual Test Socket Interface Share-Wrapper Scanned Registered Core I/O At-Speed Scan Or Logic Built-in Self-test (LBIST) Design For Reuse Considerations Dedicated Core Test Ports Access Via IC Pins Reference Clocks Test and Functional Test Wrapper Signal Reduction/No JTAG/No Bidis Virtual Test Socket Vector Reuse
Figure 5-6 Core Development DFT Considerations
Alfred L. Crouch
A Chip Package with 44 Functional Signals
A ReUse Embeddable Core with 60 Functional Signals
Core DFT Interface Considerations Note none of this is known a priori Access to core test ports via IC pins (integration) I/O port count less restrictive than IC pin count Impact of routing core signals to the chip edge - Dedicated test signals to place in test mode - Number of test signals needed to test core - Frequency requirements of test signals
Figure 5-7 DFT Core Interface Considerations
Alfred L. Crouch
UDL Logic
At the time of Core Development, the UDL logic is not available and is configuration is not known
Embedded Core
DQ For example: - registered inputs or outputs - combinational logic - bidirectional signals or tristate busses
DQ
QD How are vectors generated for a Hard Core before integration? How are vectors delivered that can assess the signal timing or frequency? UDL Domain How is test access planned to be provided through the UDL or directly from the package pins?
QD
CORE Domain
Figure 5-8 DFT Core Interface Concerns
Alfred L. Crouch
A Chip Package with 44 Functional Signals

Test Wrapper with 10 Test Signals
A Reuse Embeddable Core with 60 Functional Signals
Core DFT Interface Considerations Wrapper for interface signal reduction Wrapper for frequency assessment Wrapper as frequency boundary Wrapper as a virtual test socket (for ATPG) Note: bidirectional functional signals cant cross the boundary if wrapper or scan
Figure 5-9 DFT Core Interface Considerations
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UDL Logic
Land between the Lakes The Isolation Test Wrapper D Q
Embedded Hard Core
DQ
DQ
DQ
D Q
QD
QD
QD
D Q UDL Scan Domain Core-Wrapper Scan Domain where the wrapper is the registered core functional I/F that is scan-inserted separately Note: Wrapper and core are on same clock and path delay is used to generate vectors CORE Scan Domain
Figure 5-10 Registered Isolation Test Wrapper
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11
UDL Logic
Land between the Lakes The Isolation Test Wrapper
Embedded Hard Core
DQ DQ D Q
DQ
QD Q D QD
QD
UDL Scan Domain Wrapper Scan Domain where the wrapper is an added slice between the core functional I/F and the UDL functional I/F Wrapper and core are on different clocks and path delay is used to generate vectors
CORE Scan Domain
Figure 5-11 Slice Isolation Test Wrapper
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UDL Logic
Land between the Lakes The Isolation Test Wrapper Core_Test TR_SDO
Embedded Hard Core
DQ DQ D Q
DQ
QD
QD
UDL Scan Domain
TR_SE TR_SDI
TR_CLK TR_Mode
CORE Scan Domain
Wrapper Scan Domain
System Clock the wrapper is an added slice between the core functional I/F and the UDL functional I/F Wrapper and core are on different clocks and path delay is used to generate vectors
Figure 5-12 Slice Isolation Test Wrapper Cell
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Internal BIST In
D Q
Direct Test Signals go to Package Pins
Internal BIST Out
Q D
Internal Scan In
D Q
Internal Scan Out
Q D
QD
QD
QD
Wrapper Scan In D Q UDL Scan Domain UDL Logic Core-Wrapper Scan Domain Land between the Lakes The Isolation Test Wrapper CORE Scan Domain Embedded Hard Core
All Core Test Interface Signals pass through the Test Wrapper without being acted upon All Core I/O are part of the Wrapper Scan Chain So Total Core Test I/F is: Internal Scan Internal MBIST Wrapper Scan
Figure 5-13 Core DFT Connections through the Test Wrapper
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Internal BIST In
D Q
Direct Test Signals Go to Package Pins
Internal Scan In
D Q
Test Mode Control
Core Test Controller
QD
QD
QD
Wrapper Scan In D Q UDL Scan Domain UDL Logic Core-Wrapper Scan Domain Land between the Lakes The Isolation Test Wrapper CORE Scan Domain Embedded Hard Core
All Core Test Interface Signals pass through the Test Wrapper and may be acted upon by a Test Mode All Core I/O are part of the Wrapper Scan Chain So Total Core Test I/F is: Gated Internal Scan Gated Internal MBIST Gated Wrapper Scan
Figure 5-14 Core DFT Connections with Test Mode Gating
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15
Cant Use the Wrapper Cell
Wrapper Cell
UDL
Test Wrapper
Core
PLL Bypass Test Clock Mul/Div Clocks A Reuse Embeddable Hard Core with Pre-Existing Clock Trees
Clock Out Signal(s)
DFT Considerations Cant Support Bidirectional Core Ports Input and Reference Clocks
Figure 5-15 Other Core Interface Signal Concerns
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A Chip Package with a 25 MHz Interface

Test Wrapper with 10 Test Signals
A Reuse Embeddable Core with Fmax = 100MHz Logic
Core DFT Frequency Considerations Wrapper for frequency boundary Test signals designed for low frequency Package interface designed for high frequency Wrapper as a multi-frequency ATPG test socket Note: functional high/low frequency signals can cross the wrapperthe test I/F is the concern
Figure 5-16 DFT Core Interface Frequency Considerations
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The Cores Test Port Internal Scan Data In Internal Scan Enable Wrapper Scan Data In Wrapper Scan Enable Wrapper Test Enable MemBIST Invoke MemBIST Retention MemBIST Bitmap Internal Scan Data Out Wrapper Scan Data Out MemBIST Fail MemBIST Done MemBIST Bitmap Out
A Test Wrapper
A Reuse Embeddable Core with Existing DFT and Test Features
Core DFT Goals and Features Embedded Memory Test by MBIST - Few Signals High Coverage Less Test Time - Bitmap Characterization Support Structure by Stuck-At Scan - High Coverage Fewer Vectors Ease of Application Frequency by At-Speed Scan (Path & Transition Delay) - Deterministic Fewer Vectors Ease of Application Reuse of Core Patterns Independent of Integration Test Insulation from Customer Logic Embedded Core I/O Timing Specifications with Wrapper Minimize Test Logic Area Impact Minimize Test Logic Performance Penalty DFT Scannability Logic Full-Scan Single-Edge Triggered MUX DFF Tristate Busses - Contention/Float Prevention Negedge Inputs and Outputs IddqNo Active Logic and Clock Stop Support
Figure 5-17 A Reuse Embedded Cores DFT Features
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The Cores Test Port Internal Scan Data In Internal Scan Enable Wrapper Scan Data In Wrapper Scan Enable Wrapper Test Enable MemBIST Invoke MemBIST Retention MemBIST Bitmap Internal Scan Data Out Wrapper Scan Data Out MemBIST Fail MemBIST Done MemBIST Bitmap Out
A Test Wrapper
A Reuse Embeddable Core with Existing DFT and Test Features
Core Economic Considerations Test Integration (Time-to-Market) Core Area and Routing Impact (Silicon/Package Cost) Core Power and Frequency Impact (Package/Pin Cost) Core Test Program Time/Size/Complexity (Tester Cost)
Total
Chip Test Program Budget(s) Time and/or Tester Memory
Retention Testing Chip Logic Testing Memory Testing Embedded Core Testing Chip Parametrics
Figure 5-18 Core Test Economics
Alfred L. Crouch
19
TMode[3:0]
Chip-Level CTCU
UDL
Core
Embedded Memories
PLL
TAP
JTAG Boundary Scan
- A Core-Base Device May Include Core(s) with Test Wrapper and Embedded Memory Arrays Chip-Level Non-Core Logic with Embedded Memory Arrays Chip-Level Test Selection and Control Logic Dedicated Chip-Level Test Pins Chip-Level Clock Generation and Control Logic IEEE 1149.1 Controller and Boundary Scan Logic
Figure 5-19 Chip with Core Test Architecture
Alfred L. Crouch
20
Pre-Existing Vectors
Chip-Level CTCU Test Selection
Wrapper and Core Scan Package Pin Connections
UDL
Core
PLL Clock Bypass
Figure 5-20 Isolated Scan-Based Core-Testing
Alfred L. Crouch
21
Development Generated Vectors
Wrapper and UDL Scan Package Pin Connections
UDL
Clock Bypass
PLL
Figure 5-21 Scan Testing the Non-Core Logic
Alfred L. Crouch
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Wrapper and UDL Scan Package Pin Connections
UDL
Clock Bypass
PLL
I/O specification testingbus_SE Tristate busses - contention/float prevention IddqHighZ pin Pin requirements(open drains)
Figure 5-22 Scan Testing the Non-Core Logic
Alfred L. Crouch
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UDL
Core
Embedded Memories
PLL Clock Bypass
Figure 5-23 Memory Testing the Device
Alfred L. Crouch
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Chip-Level CTCU Core 4 Core 1 Core 5
Core 2
General Logic
Core 3 Memory Access

Embedded Memory Embedded Memory
PLL
Chip-level DFT integration considerations each core/vector set must have: 1. Power Rating during Test 2. Frequency/Data Rate of Test Vectors 3. Fault Coverage of the Test Vectors 4. Required Test Architecture to Reuse Vectors 5. ATPG Test Wrapper or Encrypted Sim Model 6. The Vector Sets Format 7. The Vector Set Sizing
Figure 5-24 DFT Integration Architecture
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Chip Parametrics Chip Iddq (Merged) Core 1 Test Components Core 2 Test Components Core 3 Test Components Chip-Level Memory Chip-Level Analog Core 1 Components Core 1 Iddq Core 1 Scan Core 1 Memory Test Core 1 Analog
Test Time in (s)
3 4 # of Cores
Figure 5-25 Test Program Components
Alfred L. Crouch
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Receiving Core DFT Specification Driven by Fab and Integration Requirements Core DFT Specification Items - Test Mix - Style of Test - Maximum Number of Integration Signals - Minimum-Maximum Test Frequency - Maximum Vector Sizing - Minimum Fault Coverage - Clock Source
Figure 5-26 Selecting or Receiving a Core
Alfred L. Crouch
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Core Test Driven by Cost-of-Test and TTM Two Concerns: Reuse and Integration Reuse: Interface, Clocks, Test Features - number of dedicated test signal - size of test integration interface - ability to test interface timing - no functional bidirectional ports - specifications and vectors based on clock-in - specifications and vectors based on clock-out - ability to stop clock for retention or Iddq - number of clock domains - at-speed full scan - at-speed memory BIST - use of a scan test wrapper - self-defaulting safety logic Integration: Core Connections, Chip Test Modes - simple core integration - reuse of pre-existing vectors - application of test signal defaults - shared resources (pins and control logic) - shared testing (parallel scheduling) - chip level test controller
Figure 5-27 Embedded Core DFT Summary
Alfred L. Crouch

Design For Test by Alfred L Crouch

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Design-for-Test for Digital ICs and Embedded Core Systems

1999 Prentice Hall, All Rights Reserved

Increasing Time Final Product

Chapter 1 Test and Design-for-Test Fundamentals

Hardware Description Language Register Transfer Level Timing Constraints

Gate-Level Netlist Static Timing Assessment

Algorithmic Scan Signal ReOrdering

Figure 1-2 Concurrent Test Engineering

Chapter 1 Test and Design-for-Test Fundamentals

Incoming Inspection Contractual Reliability Requirement Contractual

Chapter 1 Test and Design-for-Test Fundamentals

DEVICE IN A KNOWN STATE

A KNOWN EXPECTED RESPONSE

with an unknown state

Figure 1-4 Definition of Testing

Chapter 1 Test and Design-for-Test Fundamentals

Chapter 1 Test and Design-for-Test Fundamentals

defects open/short bridge mask process

stuck faults a@ 0 a@ 1 b@ 0 b@ 1 c@ 0 c@ 1 6 gate faults transition delay faults a 1- 0 a 0- 1 b1- 0 b0- 1 c 1- 0 c 0- 1

6 transitions Truth Table with fail modes nand ab a b c ab c 0 1 1 0 00 1 1 1 1 0 01 1 1 0 1 0 10 1 1 1 0 0 11 0 1 0 0 0

Figure 1-6 Fault Modeling

Chapter 1 Test and Design-for-Test Fundamentals

Figure 1-7 Types of Testing

Chapter 1 Test and Design-for-Test Fundamentals

Chip under Test

Figure 1-8 Manufacturing Test Load Board

Chapter 1 Test and Design-for-Test Fundamentals

2 Meg Memory Depth 192 Channels

Clock Gen 1 Clock Gen 2 Clock Gen 3

Power Supply 1 Power Supply 2 Power Supply 3

Figure 1-9 Using ATE

Chapter 1 Test and Design-for-Test Fundamentals

Chip Point of View

1. Input Setup Time:

2. Input Hold Time:

3. Output Valid Time:

4. Output Hold Time:

Tester Point of View CLK

Figure 1-10 Pin Timing

Chapter 1 Test and Design-for-Test Fundamentals

Scan Transition Delay

Scan Stuck-At Functional Test Escapes

Figure 1-11 Test Program Components

Observe Point Assessment

Figure 2-1 The Overall Pattern Generation Process

Chapter 2 Automatic Test Pattern Generation Fundamentals

Reasons Greater Measurement Ability Perceived Competitive Methodology

Reduction in Cycle Time More Efficient Vectors

Chapter 2 Automatic Test Pattern Generation Fundamentals

Fault Observe Point Assessment

Figure 2-3 The ATPG Process

Chapter 2 Automatic Test Pattern Generation Fundamentals

Chapter 2 Automatic Test Pattern Generation Fundamentals

Delay from Strong Driver Insufficient Transistor Doping

Delay Model Element

Capacitive or Resistive Wire Delay from Opens and Metal Defects

Added Rise Delay

Added Fall Delay

Figure 2-5 The Delay Fault

Chapter 2 Automatic Test Pattern Generation Fundamentals

Leakage from Bridge Leakage from Metastability

Leakage Fault Model