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: 42878 25 5F WEB: http://www.Raystar-Optronics.com 5F, No.25, keya Rd. Daya Township, Taichung E-mail: sales@raystar-optronics.

s.com Tel:886-4-2565-0761 Fax886-4-2565-0760 County, Taiwan

RC2004A-BIW-ESX

SPECIFICATION CUSTOMER :

APPROVED BY:
( FOR CUSTOMER USE ONLY )

PCB VERSION:

DATA:

SALES BY

APPROVED BY

CHECKED BY

PREPARED BY

ISSUED DATE:
Page 1 , Total 27 Pages

RC2004A-BIW-ESX

Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. Specification Revision History General Specification Module Classification Information Interface Pin Function Contour Drawing & Block Diagram Function Description Character Generator ROM Pattern Instruction Table Timing Characteristics Initializing of LCM Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Page 3 Page 4 Page 5 Page 6 Page 7 Page 8 Page 11 Page 12 Page 13 Page 15 Page 17 Page 18 Page 18 Page 19 Page 20 Page 21 Page 25

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1. Specification Revision History


RECORDS OF REVISION
VERSION 1 DATE 2008.03.21 REVISED PAGE NO. Note First issue

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2. General Specification
The Features of the Module is description as follow: Module dimension: 98.0 x 60.0 x 13.6 (max.) mm3 View area: 77.0 x 25.2 mm2 Active area: 70.4 x 20.8 mm2 Number of Characters: 20 characters x 4 Lines Dot size: 0.55 x 0.55 mm2 Dot pitch: 0.60 x 0.60 mm2 Character size: 2.95 x 4.75 mm2 Character pitch: 3.55 x 5.35 mm2 LCD type: STN, Negative, Transmissive, Blue Duty: 1/16 View direction: 6 oclock Backlight Type: LED ,White

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3. Module Classification Information


RC
Item 1 2 3 4

2004

AB I W ESX
Description

BrandRaystar Optronics Inc. CCharacter Type, Display Type GGraphic Type Display FontCharacter 20 words, 4 Lines. Serials Code. PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber RLED, Red WLED, White

LCD Mode

LCD Polarizer Type/ Temperature range/ View direction

Backlight Type

FCCFL, White GLED, Green ES : English and European standard font Special Code X: Without Negative voltage output

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4. Interface Pin Function


Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VSS VDD VO RS R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 A K Level 0V 5.0V H/L H/L H,HL H/L H/L H/L H/L H/L H/L H/L H/L Ground Supply Voltage for logic H: DATA, L: Instruction code H: Read(MPUModule) L: Write(MPUModule) Chip enable signal Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line LED + LED Description

(Variable) Operating voltage for LCD

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5. Contour Drawing &Block Diagram

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6. Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an instruction register (IR) and a data register (DR). The IR stores instruction codes, such as display clear and cursor shift, and address information for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written from the MPU. The DR temporarily stores data to be written or read from DDRAM or CGRAM. When address information is written into the IR, then data is stored into the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected. RS 0 0 1 1 R/W 0 1 0 1 Operation IR write as an internal operation (display clear, etc.) Read busy flag (DB7) and address counter (DB0 to DB7) Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM) Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)

Busy Flag (BF) When the busy flag is 1, the controller LSI is in the internal operation mode, and the next instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7. The next instruction must be written after ensuring that the busy flag is 0. Address Counter (AC) The address counter (AC) assigns addresses to both DDRAM and CGRAM. Display Data RAM (DDRAM) This DDRAM is used to store the display data represented in 8-bit character codes. Its extended capacity is 808 bits or 80 characters. Below figure is the relationships between DDRAM addresses and positions on the liquid crystal display. High bits Low bits Example: DDRAM addresses 4E AC (hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0 1 0 0 1 1 1 0

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Display position DDRAM address 1 00 40 14 54 2 01 41 15 55 3 02 42 16 56 4 03 43 17 57 5 04 44 18 58 6 7 8 9 10 11 12 13 0C 4C 20 60 14 0D 4D 21 61 15 0E 4E 22 62 16 0F 4F 23 63 17 18 19 20

05 06 07 08 09 0A 0B 45 46 47 48 49 4A 4B 19 1A 1B 1C 1D 1E 1F 59 5A 5B 5C 5D 5E 5F 4-Line by 20-Character Display

10 11 12 13 50 51 52 53 24 25 26 27 64 65 66 67

Character Generator ROM (CGROM) The CGROM generate 58 dot or 510 dot character patterns from 8-bit character codes. See Table 2. Character Generator RAM (CGRAM) In CGRAM, the user can rewrite character by program. For 58 dots, eight character patterns can be written, and for 510 dots, four character patterns can be written. Write into DDRAM the character code at the addresses shown as the left column of table 1. To show the character patterns stored in CGRAM.

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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character patterns Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 4 3 2 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * * * * * * 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C h a ra c te r p a tte rn ( 2 ) C u rs o r p a tte rn C h a ra c te r p a tte rn ( 1 ) C u rs o r p a tte rn

H ig h

Low

* 0

* 0

Low 0 0 0 0 0 1 0 1 0 0 0 1 0 1 0 1 1 1 1 0 0 0 0 0 1 0 1 0 0 1 1 0 1 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1

H ig h * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Low

0 0 0 0 0 0

F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s C h a ra c te r C o d e s ( D D R A M d a ta ) 7 6 5 4 3 2 1 0 C G R A M A d d re ss 5 H ig h 0 0 0 0 0 0 0 0 1 1 1 1 4 3 2 0 0 0 0 1 1 1 1 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 C h a ra c te r P a tte rn s ( C G R A M d a ta ) 7 * * * * * * * * * * * * 6 * * * * * * * * * * * * 5 4 3 0 0 0 0 0 0 0 0 0 * 2 Low 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 0 0 0 0 * 0 0 0 0 0 * 0 0 0 1 0

H ig h

Low

Low

H ig h * 0 * 0 * * * * * * * * * 0 * *

* 0

C h a ra c te r p a tte rn C u rs o r p a tte rn

: " H ig h "

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7. Character Generator ROM Pattern


Table 2.
Upper 4 bit Lower 4 bit

LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH

LLLL

CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8) CG RAM (1) CG RAM (2) CG RAM (3) CG RAM (4) CG RAM (5) CG RAM (6) CG RAM (7) CG RAM (8)

LLLH

LLHL

LLHH

LHLL

LHLH

LHHL

LHHH

HLLL

HLLH

HLHL

HLHH

HHLL

HHLH

HHHL

HHHH

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8. Instruction Table
Instruction Code Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Clear Display 0 0 0 0 0 0 0 0 0 1
Write 00H to DDRAM and set DDRAM address to 00H from AC Set DDRAM address to 00H from AC and return cursor to its original position if shifted. The contents of DDRAM are not changed. Assign cursor moving direction and enable the shift of entire display. Set display (D), cursor (C), and blinking of cursor (B) on/off control bit. Set cursor moving and display shift

Description

Execution time (fosc=270Khz)

1.53ms

Return Home Entry Mode Set Display ON/OFF Control Cursor or Display Shift

1.53ms

0 0

0 0

0 0

0 0

0 0

0 0

0 1

1 D

I/D C

SH B

39s 39s

S/C R/L

control bit, and the direction, without


changing of DDRAM data. Set interface data length (DL:8-bit/4-bit), numbers of display line (N:2-line/1-line)and, display font type (F:511 dots/58 dots)

39s

Function Set Set CGRAM Address Set DDRAM Address Read Busy Flag and Address Write Data to RAM Read Data from RAM

DL

39s

0 0

0 0

0 1

AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.

39s 39s

AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
Whether during internal operation or not can be known by reading BF. The contents of address counter can also be read. Write data into internal RAM (DDRAM/CGRAM). Read data from internal RAM (DDRAM/CGRAM).

BF AC6 AC5 AC4 AC3 AC2 AC1 AC0

0s

1 1

0 1

D7 D7

D6 D6

D5 D5

D4 D4

D3 D3

D2 D2

D1 D1

D0 D0

43s 43s

dont care

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9. Timing Characteristics
9.1 Write Operation

Ta=25, VDD=5.0V Item Enable cycle time Enable pulse width Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data set-up time Data hold time Symbol TC TPW TR,TF tAS tAH tDSW tH Min 1200 140 0 10 40 10 Typ Max 25 Unit ns ns ns ns ns ns ns

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9.2

Read Operation

Ta=25, VDD=5V Item Enable cycle time Enable pulse width (high level) Enable rise/fall time Address set-up time (RS, R/W to E) Address hold time Data delay time Data hold time Symbol TC TPW TR,TF tAS tAH tDDR tH Min 1200 140 0 10 10 Typ Max 25 100 Unit ns ns ns ns ns ns ns

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10. Initializing of LCM


Power on Wait for more than 40 ms after VDD rises to 4.5 V
BF can not be checked before this instruction.

RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 1 1 0 * * * * Wait for more than 39us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 0 0 1 0 * * * * 0 0 N F * 0 * * * * * 0 Wait for more than 39 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 * * * Function set 0 1 0 * 0 0 0 * * * 0 0 N F * * * Wait for more than 37us RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control * * * 0 0 * 0 0 0 0 * * * 0 * 1 D C B 0 Wait for more than 37 s RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 * * 0 * 0 0 * 0 0 0 * * * 0 1 0 * 0 Wait for more than 1.53ms RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 * * * 0 0 * 0 * * * 0 1 0 0 I/D SH * Initialization ends
BF can not be checked before this instruction. BF can not be checked before this instruction. Function set

4-Bit Ineterface

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Power on W for more than 40 ms after VDDrises to 4.5 V ait


BF can not be checked before this instruction.

RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 39us ait RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set 0 0 0 0 1 1 N F * * W for more than 37us ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display ON/OFF control 0 0 0 0 0 0 1 B C D W for more than 37 s ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display Clear 0 0 0 0 0 0 0 0 0 1 W for more than 1.53ms ait RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry Mode Set 0 0 0 0 0 0 0 1 I/D S Initialization ends
BF can not be checked before this instruction.

8-Bit Ineterface

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11. Optical Characteristics


Item View Angle Contrast Ratio Response Time Symbol (V) (H) CR T rise T fall Condition CR2 CR2 Min 20 -30 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

Intensity 100

Selected Wave

Non-selected Conition Intensity

Selected Conition

Non-selected Conition

Non-selected Wave

10

Cr Max

Cr = Lon / Loff

100

90

Vop

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias
b f = 180

Definition of viewing angle(CR2)

= 270

= 90

= 0

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12. Absolute Maximum Ratings


Item Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD-VSS VDD-V0 Min -20 -30 VSS -0.3 -0.3 Typ Max +70 +80 VDD 7 13 Unit V V V

13. Electrical Characteristics


Item Supply Voltage For Logic Supply Voltage For LCD Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current Symbol VDD-VSS Condition Ta=-20 VDD-V0 Ta=25 Ta=70 VIH VIL VOH VOL IDD VDD=5.0V Min 4.5 3.8 0.7 VDD VSS 3.9 1.0 Typ 5.0 4.5 1.2 Max 5.5 5.3 VDD 0.6 0.4 1.5 Unit V V V V V V V V mA

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14. Backlight Information


Specification
PARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Life Time Color SYMBOL MIN ILED V VR IV White 43.2 3.4 280 TYP 48 3.5 350 MAX 75 3.6 8 UNIT mA V V TEST V=3.5V CONDITION

CD/M2 ILED=48mA nm ILED=48mA

Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).

2.Drive from pin15,pin16

A K

B/L

LCM
ill never get Vee output from pin15)

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15. Reliability
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle Total fixed amplitude : 15mm Vibration test Endurance test applying the vibration during transportation and using. Vibration 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time Frequency : 3 30min 25 70 -20/70 10 cycles

Content of Test

Test Condition
200hrs 200hrs 200hrs 200hrs 60,90%RH 96hrs 2

Note

Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70 Endurance test applying the electric stress under low temperature -20

1,2 1

1,2

Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.

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16. Inspection specification


NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing =( x + y ) / 2 LCD black spots, white spots, contamination (non-display)

2.5

SIZE 0.10 0.100.20 0.200.25 0.25

03

Acceptable Q TY Accept no dense 2 1 0 Acceptable Q TY Accept no dense 2 As round type

2.5

3.2 Line type : (As following drawing) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W

2.5

04

Polarizer bubbles

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

Acceptable Q TY Accept no dense 3 2 0 3

2.5

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NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

z: Chip thickness Z1/2t

2.5

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.

z: Chip thickness Z1/2t

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NO

Item

Criterion

AQL

Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 zt

06

Glass crack

2.5

y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa

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NO 07

Item Cracked glass

Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X Y

AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5

08

Backlight elements

09

Bezel

10

PCBCOB

X * Y<=2mm2 2.5 2.5 2.5 0.65

11

Soldering

11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.

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NO

Item

Criterion 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.

AQL 2.5 0.65 2.5 2.5 2.5 2.5 2.5 0.65 0.65 0.65 0.65

12

General appearance

17. Precautions in use of LCD Modules


(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Dont make extra holes on the printed circuit board, modify its shape or change the components of LCD module. (3)Dont disassemble the LCM. (4)Dont operate it above the absolute maximum rating. (5)Dont drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment.

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Page: 1

LCM Sample Estimate Feedback Sheet


Module Number

1Panel Specification
1. Panel Type Pass NG , 2. View Direction Pass NG , 3. Numbers of Dots Pass NG , 4. View Area Pass NG , 5. Active Area Pass NG , 6.Operating Temperature Pass NG , 7.Storage Temperature Pass NG , 8.Others 2Mechanical Specification 1. PCB Size Pass NG , 2.Frame Size Pass NG , 3.Materal of Frame Pass NG , 4.Connector Position Pass NG , 5.Fix Hole Position Pass NG , 6.Backlight Position Pass NG , 7. Thickness of PCB Pass NG , 8. Height of Frame to PCB Pass NG , 9.Height of Module Pass NG , 10.Others Pass NG , 3Relative Hole Size 1.Pitch of Connector Pass NG , 2.Hole size of Connector Pass NG , 3.Mounting Hole size Pass NG , 4.Mounting Hole Type Pass NG , 5.Others Pass NG , 4Backlight Specification 1.B/L Type Pass NG , 2.B/L Color Pass NG , 3.B/L Driving Voltage (Reference for LED Type) Pass NG , 4.B/L Driving Current Pass NG , 5.Brightness of B/L Pass NG , 6.B/L Solder Method Pass NG , 7.Others Pass NG ,

Go to page 2
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Page: 2 Module Number 5Electronic Characteristics of Module 1.Input Voltage Pass 2.Supply Current Pass 3.Driving Voltage for LCD Pass 4.Contrast for LCD Pass 5.B/L Driving Method Pass 6.Negative Voltage Output Pass 7.Interface Function Pass 8.LCD Uniformity Pass 9.ESD test Pass 10.Others Pass 6Summary

NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,

Sales signature Customer Signature

Date

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