UM10xxx: CFL Smart Lighting Dummy Lamp

UM10xxx
CFL Smart Lighting dummy lamp

Rev. 0.0 2 april 2011 User manual
Document information Info Keywords Abstract Content UBA2027, TEA1520, CFL, dimmable, buck converter, user manual This is the user manual for adapting the LSB to a custom lamp
NXP Semiconductors
UM10xxx
CFL SL dummy lamp
Revision history Rev <MM+1> <MM> Date <yyyymmdd> <yyyymmdd> Description <Revision description (delete row if not required)> <Revision description>
Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
<DOC_ID> NXP B.V. 2011. All rights reserved.
User manual
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NXP Semiconductors
UM10xxx
CFL SL dummy lamp
1. Introduction
This document describes how to adapt the smart lighting dummy lamp to a custom burner. The PCB structure contains two PCBs 1. Large Signal Board (LSB) 2. Small Signal Board (SSB)
Fig 1. PCB structure
The SSB is mounted in a slot that is made in the LSB. The RF antenna that is routed on the part of the SSB that sticks out at the solder side of the LSB. The LSB contains the resonant tank, input filter and some leaded components that could not be placed on the SSB. The SSB contains the half bridge driver (UBA20270) and the power supply (TEA1520). The RF chip and surrounding components are not placed so that customers can adapt the circuitry on the large LSB without needing a remote control.
2. Mechanical outline
The PCB structure is designed to fit in the casing that is depicted below:
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UM10xxx
CFL SL dummy lamp
Fig 2. Profile of the PCBs: 1 square = 5mm x 5 mm
The diameter of the LSB is 50 mm. The thickness of the LSB is 1.8 mm. The dimensions of the SSB are 35.7mm x 23.7mm. The thickness of the SSB is 1.2 mm. Max. height of the components on the front of the SSB is 2mm. Max. height of the components on the back of the SSB is 3mm. See Fig 10 to figure out what is the front of the SSB and what is the back of the SSB.
3. Safety warning
The PCB has no galvanic isolation between the mains and the PCB with burner. Therefore the PCB must be connected to the mains supply via a galvanic isolated (variable) transformer. These devices can be recognized by the symbols shown in Fig 3. Touching the PCB during operation must be avoided at all times. Placing the board in an isolated housing is obligatory when used in uncontrolled, nonlaboratory environments.
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UM10xxx
CFL SL dummy lamp
Fig 3. Variac isolation symbols
Note that this board is for 120V only, so do not connect it to 230V mains. There is a voltage doubler, so the bus voltage can be up to 400V.
4. Specifications
The following specifications were measured using a burner with the following voltage current graph:
250
200
150
100
50
0 0 0.05 0.1 0.15 0.2 0.25
Fig 4. VI curve of the CFL burner
The resistance of the cold filament was 4.5 ohms.
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UM10xxx
CFL SL dummy lamp
Table 1. Specifications Measured at 120V/50Hz mains Parameter AC line input voltage Power factor Maximum input power Nominal input power Lamp current (during boost state) Lamp current (normal operation) Minimum lamp current Value 120V (AC) +/-10V 0.6 22W 17W 200 mA 135 mA 3 mA This is the input power during the boost state Comment
Preheat time Preheat current Preheat frequency
800msec 340mA 75kHz
Minimum half bridge switching freq Maximum half bridge switching freq
40kHz 100 kHz
Standby power
200mW
This is measured with the RF chip mounted.
5. Functional description
The PCB structure as depicted in Fig 1 contains two printed circuit boards: 1. Large Signal Board (LSB) 2. Small Signal Board (SSB) The LSB contains the resonant tank, input filter and some leaded components that could not be placed on the SSB. The SSB contains the half bridge driver (UBA20270) and the power supply (TEA1520). The RF chip and surrounding components are not placed so that customers can adapt the circuitry on the large LSB without needing a remote control.
The SSB contains the RF transceiver, power supply and CFL driver.
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UM10xxx
CFL SL dummy lamp
The LSB contains the resonant tank, input filter and some leaded components that could not be placed on the SSB.
Fig 5. Board schematic diagram
Fig 5 shows the board schematic. The block in the middle is the small signal board that is mounted on the large signal board. The mains voltage is rectified and doubled in the input stage. The lamp is supplied via the half bridge and resonant tank. The lamp current is sensed with R4 and supplied to the CSI pin. R3 senses the half bridge current and this is used for setting the preheat current and over current protections.
Fig 6. Large signal board + small signal board

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UM10xxx
CFL SL dummy lamp
Note that VBUS of the small signal board is half the voltage that is across the half bridge. The (half bridge) bus voltage is monitored via the resistive divider R6, R5 and R9. The lamp current is sensed with R4 and the preheat current is set with R3.
5.1 Large signal board
LSB: diameter: 50mm

Fig 7. Large Signal Board (LSB)
Table 2. Ref. Des. F1 R1 Cable
LSB component values Value Remark Type Manuf. Farnell no. 2A / 250V 4R7 Flat cable Mounted in fitting Mounted in fitting AC05000004708JAC00 98267-0233 Vishay Molex 1735128 1079968
C1,C4 C2,C3,C5
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22u / 250V 47n / 630V
10mm x 20mm Class X2
EEUED2E220 BFC233820473
Panasonic Vishay
9696334 1215464
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CFL SL dummy lamp
Ref. Des. C6,C8 C7 C10
Value
Remark
Type
Manuf.
Farnell no.
100n / 250V 3.3n / 1000V 680p / 2000V
B32520C3104J F332K69Y5RN63K7R F681K39Y5RP6UK5R
Epcos Vishay Vishay
1712360 1141795 1141802
C11,C12 C13 C14 L1 L2 R3 R4 R5,R6
100n / 63V 33u / 16V 330p / 1000V 1.5 mH 1.5mH 1R5 / 1W 6.8R / 0.6W 1MEG / 0.25W 1.7 ohm / 0.43A Low ESR
B32529C104K 16SP33M FKP2O103301D00JSSD ELC11D152F 22R155C AC01000001508JA100 MRS25000C6808FCT00 MCF 0.25W 1M
Epcos Sanyo Wima Panasonic Murata Vishay Vishay Multicomp
9750878 1217613 1519286 1308469 1077037 1735029 9469885 9339086
R9 R10 R11
10k / 0.25W 4.7MEG / 0.25W 470k / 0.5W
MCF 0.25W 10K MCRE000081 SFR16S0004703JA500
Multicomp Multicomp Vishay
9339060 1700286 9476040
D1,D2,D3,D4 M1,M2
1N4937 2SK4003
Fast recovery diode 1N4937 Rdson=2R2 Vds=600V 2SK4003(Q)
Fairchild Semi Toshiba
1077037 1714346
T1
2.3mH / 2.1uH
See spec
TRANSFORMER DATA
Parameter Value Pins No. of turns Wire diameter (copper + isolation) Ls1 Lp Ls2
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2.1 uH 2.3 mH 2.1 uH
2-1 5-6 10 - 9
5 194 5
0.2 mm 5 x 0.15mm 0.2 mm

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CFL SL dummy lamp
Parameter
Value
Pins
No. of turns
Wire diameter (copper + isolation)
The saturation current of Lp is 1.2A.
5mm
2.65mm
6.8mm
9.8mm
9.8mm
20.9mm
Fig 8. Core geometry
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CFL SL dummy lamp
Dpin +/ 0.8mm Topview

10 2.4uH 2.3mH 2.4uH 1 Marking point on topside. 4 mm 16mm 22mm 5 11mm 6 17.5mm
Fig 9. Pinout of transformer (top & side view)
5.2 Small Signal Board

The RF chip is mimicked by a voltage source that is connected to the two wires coming from the SSB.
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CFL SL dummy lamp
Front of the SSB:
Pinout: HBO GHS CSI GNDA VCC LbuckH LbuckL
Back of the SSB:
Pinout: VBUS PSNS GNDP AUX ADC SLS GLS
Fig 10. Small Signal Board (SSB)
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CFL SL dummy lamp
6. Adapting the LSB to the burner

A burner with a power between 17W and 23W can directly be connected between the pins CFL1,2,3 and 4. A variable DC voltage of 2.8 Volts must be supplied to the wires on the SSB. One filament must be connected between CFL1 and CFL2, the other filament must be connected between CFL3 and CFL4.
Fig 11. CFL demonstrator LSB + SSB
Probably the lamp current and preheat current do not have the right value and must be adapted. This can be done by modifying the value of some components on the large signal board.
The nominal lamp current is set with the value of R4 according to the following equation: ILlamp(rms) = 0.92 / R4 This also fixes the value of the lamp current during the boost state at 1.5*(0.92 / R4) so the ratio between the current during the boost state and the burn (nominal) state is fixed at 1.5.
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CFL SL dummy lamp
At start up, the frequency sweeps down from 100kHz to 40kHz and the sweep stops as soon as the peak value of the voltage across R3 reaches 0.6V. Then the sweep stops (ie. the frequency is kept constant) for 800 milliseconds (preheat time). If the value of R3 is decreased, then the current at which the sweep stops becomes larger and the preheat current through the filaments becomes also larger while the preheat frequency reduces.
Note that the saturation protection (during ignition) and the overcurrent protection (active during nominal operation) are also set with R3. The saturation protection becomes active when the peak voltage across R3 becomes larger than 2.5V during the ignition state. The over current protection becomes active when the peak voltage across R3 becomes larger than 2.5V during the burn state (nominal operation)
During dimming, the filaments must be kept at a certain temperature. This is done by an additional current through the filaments that is provided by the two windings on the transformer. The filament current can be adapted with capacitor C11 and C12.
7. Debugging the system

Prior to do any debugging verify that the lamp is supplied via a via a galvanic isolated (variable) transformer.
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CFL SL dummy lamp
8. Legal information
8.1 Definitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
8.3 Licenses
Purchase of NXP <xxx> components <License statement text>
8.2 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customers own risk.
8.4 Patents
Notice is herewith given that the subject device uses one or more of the following patents and that each of these patents may have corresponding patents in other jurisdictions. <Patent ID> owned by <Company name>
8.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. <Name> is a trademark of NXP B.V.
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CFL SL dummy lamp
9. Index
D
Dummy index entry ............................................................ 3
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CFL SL dummy lamp
10. Contents
Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'.

For more information, please visit: http://www.nxp.com For sales office addresses, email to: salesaddresses@nxp.com Date of release: 2 april 2011 Document identifier: <DOC_ID>
NXP Semiconductors
UM10xxx
CFL SL dummy lamp
1. 2. 3. 4. 5. 5.1 5.2 6. 7. 8. 8.1 8.2 8.3 8.4 8.5 9. 10.
Introduction .........................................................3 Mechanical outline ..............................................3 Safety warning.....................................................4 Specifications ......................................................5 Functional description ........................................6 Large signal board .............................................8 Small Signal Board...........................................11 Adapting the LSB to the burner .......................13 Debugging the system ......................................14 Legal information ..............................................15 Definitions ........................................................15 Disclaimers.......................................................15 Licenses ...........................................................15 Patents .............................................................15 Trademarks ......................................................15 Index...................................................................16 Contents.............................................................17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'.

For more information, please visit: http://www.nxp.com For sales office addresses, email to: salesaddresses@nxp.com Date of release: 2 april 2011 Document identifier: <DOC_ID>

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UM10xxx

CFL Smart Lighting dummy lamp

Rev. 0.0 2 april 2011

Fig 1. PCB structure

NXP B.V. 2011. All rights reserved.

Rev. 0.0 2 april 2011

Fig 2. Profile of the PCBs: 1 square = 5mm x 5 mm

NXP B.V. 2011. All rights reserved.

Rev. 0.0 2 april 2011

Fig 3. Variac isolation symbols

0 0 0.05 0.1 0.15 0.2 0.25

Fig 4. VI curve of the CFL burner

The resistance of the cold filament was 4.5 ohms.

NXP B.V. 2011. All rights reserved.

Rev. 0.0 2 april 2011

Preheat time Preheat current Preheat frequency

800msec 340mA 75kHz

40kHz 100 kHz

This is measured with the RF chip mounted.

Rev. 0.0 2 april 2011

Fig 5. Board schematic diagram

Fig 6. Large signal board + small signal board

Rev. 0.0 2 april 2011

5.1 Large signal board

LSB: diameter: 50mm

Table 2. Ref. Des. F1 R1 Cable

22u / 250V 47n / 630V

10mm x 20mm Class X2

Rev. 0.0 2 april 2011

Ref. Des. C6,C8 C7 C10

100n / 250V 3.3n / 1000V 680p / 2000V

B32520C3104J F332K69Y5RN63K7R F681K39Y5RP6UK5R

Epcos Vishay Vishay

1712360 1141795 1141802

C11,C12 C13 C14 L1 L2 R3 R4 R5,R6

B32529C104K 16SP33M FKP2O103301D00JSSD ELC11D152F 22R155C AC01000001508JA100 MRS25000C6808FCT00 MCF 0.25W 1M

Epcos Sanyo Wima Panasonic Murata Vishay Vishay Multicomp

9750878 1217613 1519286 1308469 1077037 1735029 9469885 9339086

10k / 0.25W 4.7MEG / 0.25W 470k / 0.5W

MCF 0.25W 10K MCRE000081 SFR16S0004703JA500

Multicomp Multicomp Vishay

9339060 1700286 9476040

Fast recovery diode 1N4937 Rdson=2R2 Vds=600V 2SK4003(Q)

Fairchild Semi Toshiba

2.1 uH 2.3 mH 2.1 uH

0.2 mm 5 x 0.15mm 0.2 mm

Rev. 0.0 2 april 2011

Wire diameter (copper + isolation)

The saturation current of Lp is 1.2A.

NXP B.V. 2011. All rights reserved.

Rev. 0.0 2 april 2011

Dpin +/ 0.8mm Topview

Fig 9. Pinout of transformer (top & side view)

5.2 Small Signal Board

NXP B.V. 2011. All rights reserved.

Rev. 0.0 2 april 2011

Front of the SSB:

Pinout: HBO GHS CSI GNDA VCC LbuckH LbuckL

Back of the SSB:

Pinout: VBUS PSNS GNDP AUX ADC SLS GLS

Fig 10. Small Signal Board (SSB)

NXP B.V. 2011. All rights reserved.