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General Note #1 :Different kinds of IC Packages

General Note #1 :Different kinds of IC Packages

Image Name Description & Examples BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.

Ball Grid Array aka BGA

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The Plastic Quad Flat Pack, or PQFP, is an IC package with leads extending from all four sides Plastic Quad of the package body. PQFP's are predominantly Flat Package square in shape, although rectangular variants aka PQFP do exist. The PQFP is just one of the many types of the quad flat pack (QFP) package.

Ceramic Column Grid Array, or CCGA

The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array'. The CCGA is basically just a CBGA package that has solder columns instead of solder balls.

The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. PSOP - Power Small Outline Package

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The Ceramic Dual In-line Package, or CerDIP is CerDIP one of the most mature IC packages still in use Ceremic Dual today. It is a rectangular ceramic package that In-line has leads extending from both of its longer Package sides, thus forming two sets of in-line pins.

The Quad Flat No Leads package, or QFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. It is basically a quad flat package, except for the absence of leads protruding from its sides. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical QFN - Quad connection points to the outside world. Because Flat No Leads the QFN has no leads and has shorter bond wire lengths, it exhibits less inductance than leaded packages and therefore provides a higher electrical performance. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die.

Ceramic Package, or Cerpack

The Ceramic Package, or Cerpack, is a hermetically sealed rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP) like the CerDIP.

The Quarter Size Outline Package, or QSOP, is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides.The QSOP comes in two QSOP standard body widths: the narrow body QSOP Quarter Size which has a nominal body thickness of 150 mils Outline and the wide body QSOP which has a nominal Package body thickness of 300 mils. Typical QSOP lead counts range from 16 to 28 leads for the narrow body and 36 to 44 leads for the wide body. The QSOP lead pitch is typically 25 mils.

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General Note #1 :Different kinds of IC Packages

The Ceramic Leadless Chip Carrier, or CLCC or LCC, is a square or rectangular surface-mount CLCC or LCC ceramic package that has no leads. For Ceramic electrical connection to the outside world, the Leadless Chip LCC instead uses flat metal contacts (or Carrier metallized castellations) known as pads around the four sides of the package bottom.

Sidebraze Package

The Sidebraze Package, is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP). Two other widely used DIP's are the PDIP and the CerDIP.

CPGA Ceramic Pin Grid Array

The Ceramic Pin Grid Array, or CPGA, is a square or rectangular through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body. The CPGA can either have a frit-sealed ceramic lid or a solder-sealed metal lid.The CPGA is just one of several types of the PGA package. The PGA is a popular choice for devices with high I/O counts such as microprocessors because of its high pin density.

Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two Small Outline long sides. Due to their low cost and low profile, Transistor SOT's are widely used in consumer electronics. (SOT) The SOT-23 and the SC-70 packages are two of Package the most widely used SOT packages today. Note that aside from these two, there are many other SOT package types used in the IC industry.

CQFP Ceramic Quad Flat Pack

The Ceramic Quad Flat Pack, or CQFP, is a ceramic IC package with leads extending from all four sides of the package body. CQFP's are predominantly square in shape, although rectangular variants do exist. The CQFP is just one of the many types of the quad flat pack (QFP) package.

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The Single-in-Line Package, or SIP, is an IC package that has a single row of leads protruding from the bottom of its body. It is not Single-in-Line as widely used as dual-in-line packages such as Package (SIP) the PDIP and the CerDIP because of its limited number of pins. SIP's are often used in packaging networks of multiple resistors.

D2PAK or DDPAK Double Decawatt Package

The Double Decawatt Package, or D2PAK or DDPAK is the successor to the DPAK package, which was designed by Motorola to encase discrete high-power devices. The D2PAK is bigger than the DPAK, and comes in several versions with different terminal counts. The D2PAK, which has a flat heat sink at the back, is basically the surface-mount equivalent of the TO-220 through-hole package and is therefore sometimes referred to as 'SMD-220'. The D2PAK is also known as 'TO-263'.

SOIC - Small Outline Integrated Circuit

The 'Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The leads protrude from the longer edge of the package. It is one of the most commonly used surface mount packages today.

D3PAK Decawatt Package 3

The Decawatt Package 3, or D3PAK, is a bigger version of the D2PAK package. Just like the D2PAK (and the DPAK, the D2PAK's predecessor), the D3PAK is a surface-mount plastic-molded package intended for high-power discrete devices. The D3PAK is also known by other names such as 'TO-268' and 'Discrete Package 3'.

SOJ: Small Outline J-Lead Package

The 'Small Outline J-Lead Package', or SOJ, is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. The leads protrude from the longer edge of the package. The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package.

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General Note #1 :Different kinds of IC Packages

The Dual Flat No Leads package, or DFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. Metal pads or lands along two sides of the DFN - Dual bottom of the DFN package serve as electrical Flat No Leads connection points to the outside world. The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN.

DPAK Decawatt Package

The Decawatt Package, or DPAK, is an IC package developed by Motorola to encase discrete high-power devices. The DPAK is also known as the 'TO-252'. The acronym 'DPAK' can also stand for the term 'Discrete Package'.DPAKs can have 3 or 5 terminals.

The Shrink Plastic Dual In-line Package, or SPDIP, is a rectangular plastic package with leads SPDIP extending from both of its long sides, thus Shrink Plastic forming two sets of in-line pins. The SPDIP is Dual-in-Line actually just a 'shrink' version of the PDIP. As Package such, the SPDIP provides a smaller package size compared to a standard PDIP for the same lead count.

FBGA Fine-Pitch Ball Grid Array

The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. However, the FBGA is near-chip-scale in size, with a smaller and thinner body than the standard BGA package. As its name implies, it also features a finer ball pitch (smaller distance between balls).

SSOP Shrink Small Outline Package

The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch.

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The J-Leaded Ceramic Chip Carrier, or JLCC, is a JLCC square or rectangular surface-mount ceramic J-Leaded package that has J-formed leads around its Ceramic Chip periphery. The plastic-molded equivalent of the Carrier JLCC is the PLCC.

TDFN - Thin Dual Flat No Leads

The Thin Dual Flat No Leads package, or TDFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body for electrical connection to the outside world. It is basically a thinner version of the dual flat no leads (DFN) package.

LFBGA - Low Profile Fine-Pitch Ball Grid Array

The Low-Profile Fine Pitch Ball Grid Array, or LFPBGA, is a smaller version of the ball grid array (BGA) package. It is basically an FBGA package that has a package height ranging from 1.2 mm and 1.7 mm. It is therefore thicker than the TFBGA and the VFBGA.

The Thin Profile Fine Pitch Ball Grid Array, or TFBGA, is a thinner version of the FBGA package. TFBGA - Thin Like all BGA packages, TFBGA's use solder balls Profile that are arranged in a grid or array at the Fine-Pitch bottom of the package body for external Ball Grid electrical connection. The TFBGA is Array near-chip-scale in size and features ball pitch values that are even tighter than those of the FBGA. The Thin Quad Flat No Leads package, or TQFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with TQFN - Thin no leads. Instead of leads, it uses metal pads Quad Flat No around the periphery of the bottom of the Leads package body for electrical connection to the outside world. It is basically a thinner version of the quad flat no leads (QFN) package.

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General Note #1 :Different kinds of IC Packages

LGA - Land Grid Array

The Land Grid Array, or LGA, is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array). These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body, hence the name 'land grid array'. The grid arrangement of the lands of the LGA package allows it to have a high land count, making it a popular packaging option for devices with high I/O requirements.

TQFP - Thin Quad Flat Pack

The Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. It is basically a thinner version of the MQFP and LQFP.

LQFP - Low The Low Profile Quad Flat Pack, or LQFP, is a Profile Quad surface-mount IC package with leads extending Flat Pack from all four sides of the package body.

The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 TSOP - Thin mm. There are two types of TSOP's. The Type I Small Outline TSOP has its leads protruding from the shorter Package edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package.

MLP - Micro Leadframe Package

The Micro Leadframe Package, or MLP, is a JEDEC-compliant, very thin, near-CSP square-shaped or rectangular surface-mount plastic package uses metal pads instead of leads for electrical connection to the outside world. The MLP belongs to the same 'no leads' package family as the QFN and the DFN.

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TSSOP - Thin Shrink Small Outline Package

The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.

MQFP Metric Quad Flat Pack

The Metric Quad Flat Pack, or MQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body.

The Ultra Thin Dual Flat No Leads package, or UTDFN, is a very small and thin square-shaped or rectangular surface-mount plastic package UTDFN - Ultra with no leads. Instead of leads, it uses metal Thin Dual pads along two sides of the package body for Flat No Leads electrical connection to the outside world. It is basically a thinner version of the thin dual flat no leads (TDFN) package.

The Micro Small Outline Package, or micro-SOP or MSOP, is a very small rectangular plastic MSOP - Micro package with gull wing leads protruding out of Small Outline its longer sides. The MSOP is a miniaturized Package version of the SSOP package, having a smaller footprint than the latter.

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General Note #1 :Different kinds of IC Packages

The Ultra Thin Quad Flat No Leads package, or UTQFN, is a very small and thin square-shaped UTQFN or rectangular surface-mount plastic package Ultra Thin with no leads. Instead of leads, it uses metal Quad Flat No pads around the periphery of the package body Leads for electrical connection to the outside world. It is basically a thinner version of the thin quad flat no leads (TQFN) package.

he Plastic Dual In-line Package, or PDIP, is one of PDIP - Plastic the most mature plastic IC packages still in use Dual-in-Line today. It is rectangular in shape and has leads Package extending from both sides along its length, thus forming two sets of in-line pins.

The Very Small Outline Package, or VSOP, is one VSOP - Very of several smaller versions of the SOIC package, Small Outline having a compressed body and a tightened Package pitch for its gull wing leads. Another smaller version of the SOIC is the SSOP.

The Plastic Leaded Chip Carrier, or PLCC is a four-sided plastic package that has J leads around its periphery. These J leads occupy PLCC - Plastic less board space than the gull-wing leads that Leaded Chip other packages like the SOIC have. PLCC lead Carrier counts range from 18 to 84. PLCC packages can either be square or rectangular in shape. The ceramic equivalent of the PLCC is the JLCC.

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