MANUFACTURING SCIENCE AND TECHNOLOGY ELECTRO-OPTICS PLAN

NAVY MS&T
January 1995

Executive Summary Electro-Optics Manufacturing Thrust Background Study Methodology Findings Laser and Laser Devices Fiber Optic Devices Infrared Focal Plane Array (IRFPAs) Flat Panel Displays Proposed Strategy Recommendations Attachment 1: Summary of DOC, ARPA and OIDA Reports on ElectroOptics Technology Attachment 2: JDL MS&T Electronics Subpanel Roadmap for IRFPA Assembly Technology Attachment 3: Overview of S&T Efforts in Electro-Optics Attachment 4: JDL MS&T Planning Process Attachment 5: Notification of Electro-Optics Workshop

Executive Summary In accordance with Congressional direction this U.S. Navy Manufacturing Science and Technology Program (MS&T) report identifies potential opportunities in electro-optics manufacturing. The report has drawn on a survey conducted for the Navy by the Pennsylvania State University. Additional information was gathered by the Joint Directors of Laboratories (JDL) MS&T Electronics Subpanel including: 1) A review of the FY 1995 Technology Area Plan for Electronics published by the Director, Defense Research and Engineering. A review of the FY 1995 Joint Service Program Plan (JSPP) for Electronic Devices Electro-Optics Subsection. Ongoing planning activity charted by the JDL MS&T Panel on manufacturing technology requirements.

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This review determined that electro-optics is not Navy unique, nor necessarily Navy driven. While electro-optics plays a major role in Navy programs, Army and Air Force efforts in electro-optics are heavily used by the Navy. As such Navy becomes a leveraged participant rather than the lead. The electro-optics industry is characterized as a diverse set of businesses with different expertise that provide products to the electro-optics market place. The electro-optics industry therefore encompasses a broad technology base, not conducive to a single source for process technology advances. The four information sources identify inter-Service participation and those technology areas with potential for some Department of Defense infusion to stimulate commercial investment to meet critical electro-optics needs. Consequently, the plan addresses three critical areas, in descending order of investment opportunity, where Department of Defense involvement will help to ensure affordable weapons systems: 1) 2) Affordable manufacture of Laser and Laser Devices such as laser diode pump arrays. Producible and Affordable Fiber Optic Devices including fiber optic sensors. Increased affordability involvement in and support for ARPA efforts in Infrared Focal Plane Arrays.

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Given the broad and diverse spectrum of requirements and the integration with the other Services, no single entity can be

expected to provide significant expertise in the manufacturing issues necessary to meet the objectives of this report. Accordingly, the Navy proposes to solicit, through an open Broad Agency Announcement, specific industry/academic solutions to the disparate requirements in major areas of electro-optics technology. This BM will assess industry/academia commitment through cost sharing and provide the flexibility to address the most promising manufacturing process technologies in electro-optics. This report provides the following recommendations: 1) Continue the ongoing roadmap/planning effort by the JDL MS&T Electronics Subpanel which will provide a detailed technical program plan in the April 1995 time frame. Publish a BM in early 1995, calling for industry and academia to propose execution methods for the technical developments required. Award a contract or contracts for execution of the thrust by October 1995. Whenever possible leverage MS&T investment with ongoing activities within the government and private sector.

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Electro-Optics Manufacturing Thrust Tasking: The Navy Manufacturing Technology (MANTECH) Program was directed in the Report of the House Committee on Appropriations on the Defense Appropriations Act for Fiscal Year 1994 to prepare a strategy for developing and executing a thrust in the area of electro-optics. The tasking language of HR103-254 is: "Concerning electro-optics manufacturing, the Committee is aware of requirements within the Navy in the area of electrooptics manufacturing. A new generation of displays, targeting devices, FLIR detectors, and fiber optics is scheduled for insertion in weapon systems over the next five to ten years. Many of these technologies will provide valuable benefits to commercial industry in the areas of computers, consumer electronics, and transportation. Accordingly, the Navy Manufacturing Technology Program is directed to develop a technology thrust in electro-optics manufacturing, with emphasis on dual use technology deployment. The Committee directs the Secretary of the Navy to submit a strategic plan for execution of this thrust to the Appropriations Committees of Congress by February 1, 1994 which details execution methods, technical plans, schedules, and budget requirements. The Committee has provided an additional $750,000 for the purpose of developing the plan and for fiscal year 1994 effort."

Background Background: A viable U.S. electro-optics industry is an essential requirement for national defense and will assure the nations competitive participation in one of the fastest growing sectors of the global economy. The extended utility of electro-optic technology is derived from merging the power of microelectronics with the capabilities of optical light sources (e.g., lasers), sensors, waveguides (e.g., fiber optics), and displays. The integration of these technologies has created a plethora of products for both military and civilian applications. Military applications include target acquisition/fire control systems, night vision equipment, missile seekers, guidance and controls, underwater acoustic sensors, electronic warfare signal processors, and communication networks. A more complete list of electro-optic items of military importance and the systems in which they can be employed is summarized in Table 1. Important civil sector applications include not only communications networks, but also medical imaging systems, environmental monitoring and pollution control, and checkout line automation. Electro-optics will be a key component in the information age, providing for significant advances in the collection, processing, transport, storage, and display of information in both civil and defense applications of the 21st Century. This diversity of applications has created a growing market, estimated to be $31B in 1993, and forecasted to more than $100B by 2003, primarily driven by the communications and video segments in the commercial market. Today, the U.S. electro-optic industry is judged to be competitive in the global market but losing ground. The reason for this is that U.S. public and private sector investment in electro-optic manufacturing science and technology is substantially smaller in aggregate than our foreign competitors. It has also been established through various agency assessments that if the U. S. is to remain competitive in this market and fulfill the specialized needs of Department of Defense (DoD), it must invest in the development and facilitation of advanced electro-optic manufacturing technology. In the case of the defense industrial needs, the primary concern is to maintain and develop improved critical manufacturing capabilities in a period of declining DoD budgets. The emerging approach to this problem is to support a more integrated defense/commercial industrial base wherein investments and improvements in one sector benefit the other, so-called dual-use technology. In this way, decreases in the defense acquisition budget will be compensated for, in part, by greater competitiveness and market share in the global market, thereby maintaining defense essential manufacturing capabilities. Important to this paradigm is the judicious investment by DoD to affect this synergism and thereby realize both the economic and technological benefits of industry, government, and academia working collaboratively on related military and civil sector topics. To this end, the DoD must provide U.S. industry the incentive and risk mitigation for

maintaining and developing electro-optic manufacturing capabilities which address the DoDs unique requirements and at the same time make their own products more competitive. Such an integrated approach to retaining the defense/commercial industrial base must guard against the export of critical military technology. Conversely, it is equally important to preclude the sole dependence on foreign supplies for critical materials and components needed for defense systems. Indeed, the integrated paradigm not only presupposes continued export/import controls, but also improved dialogue between the DoD and industry and improved transfer mechanisms of government-sponsored research to industry. Improved technology transfer mechanisms include the level field participation of and equal benefit to relevant defense companies as well as enhanced communications between government and industry. The challenges and benefits of an integrated technology base are manifested preeminently in the electro-optics industry.

Study Methodology Study Methodology: Although the Navy has been tasked with the development of a strategic thrust in Electro-Optics, the scope of this effort includes technology requirements from all Services. It is anticipated that the resulting thrust will incorporate on-going Defense efforts and will leverage both other department and industry investments as applicable. Accordingly, the various sources utilized to identify both requirements and current activity extend beyond the boundaries of Navy unique interest. This report is an amalgam of information from four sources. 1) A study commissioned by the Navy MS&T Office and executed by the Applied Research Laboratory of Penn State University. This study included a review of previous reports published by the Department of Commerce (DOC), Advanced Research Projects Agency (ARPA), and the OptoElectronics Industry Development Association (OIDA), as well as ongoing initiatives with the DoD. Summaries of these reports are provided as Attachment 1. A review of the FY 1995 Technology Area Plan for Electronics Electro-Optics subsection published by the Director, Defense Research and Engineering (DDR&E) which provides a compendium of Science and Technology requirements across the Services based upon projected weapon system developments. A review of the FY 1995 Joint Service Program Plan (JSPP) for Electronic Devices Electro Optics subsection developed under the Joint Directors of Laboratories (JDL) Reliance Panel. This plan identifies both continuing and projected developments within the Exploratory and Advanced Development programs. An ongoing planning activity chartered by the JDL MS&T Panel to identify, specifically, manufacturing technology requirements based upon weapon system procurement and Defense essential needs.

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The analysis of input from all of these sources was intended to provide an overview of Defense essential technology needs, as well as work either on-going or planned which addresses these needs. The needs which are not being addressed constitute gaps in capability which are candidates for MS&T funding attention within the proposed thrust. The scope of this study did not include project level analysis. The intention was to identify general areas of focus which should be examined and analyzed further. A discussion of how this should be accomplished is addressed later in this report.

Findings Findings: No single, generic MS&T breakthrough will achieve the performance enhancements and cost reductions across the broad spectrum of Electro-Optic components and systems needed in both the military and civilian sectors. Rather, there are several generic manufacturing method and infrastructure enhancements which together contribute to these goals. Included are enhanced methods for fabrication technology for packaging high speed optical detectors and transmitters, automated fabrication of fiber grating and wavelength division multiples couplers, cost reduction manufacturing technology for high power diode laser arrays and for thermal electric coolers for IR focal plane arrays. The development of robust packaging methodologies is needed as well. The integration of simulation-based design and process planning with Flexible Computer Integrated Manufacturing (FCIM) methodologies needs to be developed for a broad range of electro-optic system components to permit cost-effective customization of individual units and small and mixed lot manufacturing. Such a custom or small-lot manufacturing capability is clearly important to make military electro-optic systems affordable, and once developed will be applicable to the production of both high end military and civil sector systems (e.g., for medical purposes) as well. Both the Army and Air Force have extensive efforts to develop electro-optic technologies and the manufacturing technologies necessary to carry them out. The Navys approach is one of mutual collaboration with the other Services and providing impetus in those areas either Navy unique or where the Navy would find the best payoff. Given the broad and diverse spectrum of requirements and the integration with the other Services, no single entity can be expected to provide significant expertise in the manufacturing issues necessary to meet the objectives of this report. Accordingly, the Navy expects to solicit, through an open Broad Agency Announcement, specific industry/academic solutions to the disparate requirements in major areas of electro-optics technology. An examination of the various information sources noted above led to a consensus in four major areas of technology. In all instances, there is a compelling Defense requirement not adequately addressed by the commercial market. Additionally, in each case, the technological bottleneck is the ability to manufacture affordable as compared to a performance of design technology limitation. The four general areas of Electro-optics which are primary candidates for manufacturing technology projects are: General Electro-optics Areas 1) Laser and Laser Devices such as laser diode pump arrays. The Department of Defense is presently developing a broad range of high peak power and high average power solidstate lasers. If the systems using these lasers go to

full military production, the cost of the laser diode pump arrays will approach $1B over the life-cycle of the weapons systems. These systems include IR and optical counter measures, ranging and designation, ASW, and mine detection. Current costs of these arrays is in the $10/peak Watt range, and it needs to be reduced by an order of magnitude to be comparable to flash lamp pumped devices. A Balanced Technology Initiative during 1989-1991 reduced costs from $300/peak watt to the current levels, and a MS&T initiative could achieve the additional manufacturing cost reduction required. The Army has proposed such a program for a FY 1995 start focusing on devices to pump Neodymium lasers. An additional investment in developing reduced cost manufacturing methodologies for pump four-level rare earth lasers (e.g., Thulium, Holmium, and Erbium) would address other DoD needs in which long pump pulses and broad spectral line width are required. As with investments in generic manufacturing methods, support of manufacturing cost reduction initiatives related to specific subsystems such as laser diode pump arrays have dual-use implications including wind shear detection and medical/surgical applications. 2) Fiber Optic Devices for optical fiber sensor, electronic warfare and data transfer systems. Fiber optical sensors are superior to conventional sensors for the detection of a wide range of field types (e.g. acoustics, magnetic, gyroscopic, etc.) in important DoD applications such as Naval towed and hull mounted arrays and for smart structures used for monitoring self noise or controlling structural deflections. Further work is needed to facilitate the inexpensive manufacture of these sensors to permit cost effective utilization in military and commercial applications. Three fiber optical devices which will benefit from improved manufacturing technologies include; high frequency (>10 Ghz) analog source and detection modules, in-line fiber Bragg gratings and wavelength division multiplex (WDM) couplers for IR surveillance and targeting subsystems. Inexpensive packaging and device fabrication will be the specific aim of the high speed source and receiver module work. These high speed devices are used in electronic warfare and radar systems as well as cable TV products. The goal of the in-line fiber Bragg grating manufacturing task will be to facilitate production of these gratings from the current 10 gratings per day that the commercial sector produces to over 5,000 gratings per day. This advance is made possible through a Navy patented process and will result in a cost reduction of at least a factor of 10. The WDM coupler manufacturing task will be aimed at commercializing a proven device design with superior performance to any currently available device.

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Infrared Focal Plane Array (IRFPAs) are among the most widely fielded electro-optic systems. They are critical to night operation and strategic surveillance on a wide variety of systems and platforms. Nevertheless, current manufacturing yield affects their availability; and enhanced performance is needed as well. Attachment 2 provides a JDL proposed roadmap for the improvement of assembly technology for IRFPAs, and is typical of ongoing activity and planning within the JDL MS&T Panels. Specific areas such as the utilization of HgCdTe have been well addressed by ARPA among others, but other elements of IRFPA technology, such as cooler production remain major cost obstacles particularly in low rate environments. The Navy MS&T effort will coordinate with the extensive ongoing ARPA, Army and Air Force efforts in this area and will defer all focal plane array work to the other Services and ARPA. However, the Navy will continue to ensure its requirements are addressed in these other programs. The one area that the Navy anticipates MS&T work is in the area of thermal electric cooler manufacturing. This includes the fabrication of high quality bismuth/antimony/telluride/selenide crystals as well as the manufacture of the complete cooler assembly. Possible joint funding with the Army will be pursued given the multi-service requirements for these devices. The goal here will be to develop moderate capacity thermal electric coolers capable of 1500K operation at a competitive cost and to solve the manufacturing yield issues.

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Flat Panel Displays are utilized in a variety of equipment including cockpits, helmet-mounted displays, test equipment and embedded computer/sensor readouts. Major efforts both at ARPA and within the Title III (Defense Production Act) program have targeted the affordable production of Flat Panel Displays for many of the Defense applications. Although some efforts may still require attention, MS&T investment should be used judiciously in specific instances

The generic and subsystem specific manufacturing initiatives noted above are representative of steps that should be taken to ensure the viability of the U.S. electro-optics enterprise for military purposes. Prioritization of unmet electro-optics manufacturing needs requires a combined effort by industry, academia, and the three Services, taking into account both emerging war fighting capabilities and the most promising advances in electro-optics in the emerging science and technology base. Attachment 3 provides an overview of on-going or planned S&T investments by the Services which need to be continued or built upon. These actions would provide an initial core of a major thrust

in Defense essential Electro-Optics and coincide well with the overall findings of this report. Such an effort is in keeping with the Navys commitment to focus on MS&T early in technology base development for affordable weapons systems.

Proposed Strategy Strategy to Develop and Execute the Opportunities: The strategy proposed consists of two simultaneous activities. The first is the technical analysis of specific, weapon system related Electro-Optic requirements, i.e., the development of a project level program plan or roadmap including funding schedules and implementation targets. The results of this study will serve as both guidance and a point of departure for this program roadmap. Attachment 2, referenced earlier provides an example of one such roadmap for IRFPA assembly. Based on judiciously applied limited funds, the envisioned electrooptics manufacturing program plan would consist of some number of these project level roadmaps. The mechanism which will be used to develop the specific technical agenda is the JDL MS&T Subpanel on Electronics. This body consists of Service and defense agency representatives who are experts in the various electronic areas, including Electro-Optics. This Subpanel has been tasked to develop appropriate Electro-Optic roadmaps by the JDL MS&T Panel, primarily within the technical areas identified by this study, i.e., Lasers, Fiber Optics, IRFPAs, and as necessary, Displays. It is anticipated that these roadmaps will be available by April 1995. As background, a synopsis of the JDL MS&T planning process which this body will follow is provided as Attachment 4. Attachment 5 provides notification of a workshop to be held in response to the subpanel tasking. Concurrent with this effort, the Navy MS&T office is developing an appropriate execution method for the thrust. In developing this execution strategy the Navy is required by Section 256 of the FY 1995 Defense Authorization Act to compete this program and to require cost share on any project which has dual use potential. Section 2525, subsection (d) of Title 10, U.S.C. was amended to read as follows: " (1) Competitive procedures shall be used for awarding all grants and entering into all contracts, cooperative agreements, and other transactions under the program." " (2) A grant may not be awarded under the program, and a contract, cooperative agreement, or other transaction may not be entered into under the program, on any basis other than a cost-sharing basis unless the Secretary of Defense determines that the grant, contract, cooperative agreement, or other transaction, as the case may be, is for a program that "(A) is not likely to have any immediate and direct commercial application; or "(B) is of sufficient high risk to discourage cost sharing by non-Federal Government sources." The Secretary of Defense may obligate fiscal year 1994 defense appropriations under the Manufacturing Technology Development program which remain available for obligation on the date of the enactment of this Act in accordance with the competition

and cost-sharing requirements of subsection (d) of section 2525 of title 10, United States Code, as amended by section 256 of this Act, notwithstanding any other provision of law that specifies (or has the effect of requiring) that a contract be entered into with, or a grant be made to, a particular institution or entity." In satisfying this language the Navy is planning to issue a Broad Agency Announcement (BAA) that will allow for organizations to propose an appropriate execution method for projects within the thrust. The Navy considers industry share as a crucial element of any execution strategy. The funding provided by the government through the execution of this thrust is viewed as seed funding for leveraging industry investment through cost sharing. Furthermore, any funded efforts of significant duration will require a transition to overall industry support within a reasonable time. Current funding for initiation of the thrust consists of approximately $1.5M in FY 1994 and FY 1995 funds. The Navy has prepared a BAA to be advertised in early 1995. This BAA will solicit private sector proposals for execution of the broad and diverse spectrum of MS&T requirements addressing affordability/producibility for electro-optics. The BAA will call for abstracts that: (1) Enhance the critical defense manufacturing capabilities and the development of integrated defense/commercial industrial base; (2) Develop advanced manufacturing technologies and their transfer to U.S. industry; (3) Identify opportunities in electro-optic science and technology for public and private investments; (4) Promote opportunities in dual-use applications and defense conversion opportunities. The criteria for selection include: (1) Soundness of technical approach; (2) A strong emphasis on cost sharing; and (3) Realistic costs. It is felt that these actions will provide for meaningful technical projects in Electro-Optics executed in a timely and logical manner.

Recommendations The following actions are recommended: 1) Continue the ongoing roadmap/planning effort by the JDL MS&T Electronics Subpanel which will provide a detailed technical program plan in the April 1995 time frame. 2) Publish a BAA in early 1995, calling for industry and academia to propose execution methods for the technical developments required. 3) Award a contract or contracts for execution of the projects by October 1995. 4) Whenever possible leverage MS&T investment with ongoing activities, such as IRFPA with the Advanced Research Projects Agency, within the government and private sector.

Attachment 1 Summary of DOC, ARPA and OIDA Reports on Electro-Optics Technology Understandably, much data and analysis regarding the economic competition of the electro-optics industry has been published over the past several years. Two broad-based studies of competitiveness needs have recently been completed - the first by the OIDA and the second by the DOC. In addition, ARPA hosted an Opto-electronic Module Technology and Manufacturing Workshop from which recommendations for future manufacturing initiatives emerged. In support of the current study, a survey was conducted to determine the manufacturing technology needs as perceived by a representative segment of the U.S. electro-optics industry and research community. These results, as well as the previous studies cited, are reviewed in the remainder of this section. OIDA Opto-electronic Technology Road Map: This road map was developed over a two year period. A total of over 500 industry representatives participated in the 11 workshops and two national forums were held to access future commercial market opportunities and to develop technology road maps to position U.S. industry to take advantage of these opportunities. Final recommendations were divided into the following four categories: (i) displays; (ii) optical communications (including optics for switching and computing); (iii) optical storage; and (iv) hard copy. The OIDA recommends an increased effort in manufacturing technology in all areas except hard copy as well as continued R&D at current or increased levels in all four categories. The study concludes, for example, that top priority in the display area is the establishment of domestic, high volume, flat panel display manufacturing capabilities. Manufacturing technology initiatives as well as R&D are required to develop such capabilities. In the optical communications area, OIDA predicts that much of the future market growth will be in short distance, high bandwidth communications systems (e.g., within building, factories, and other similar domains). They support steps to reduce the manufacturing costs of optical fibers, switches, and other integrated opticalelectronic components for such systems. (This emphasis on developing lower cost manufacturing methodologies for optoelectronic devices and components is important as well in the further development of optical signal processing and sensing for both military and civilian sectors). The U.S. is currently in an unfavorable competitive position in the optical storage area. The recommendation of this report is that the U.S. emphasize the development of higher density storage devices based on shorter wavelength light (green, blue). R&D in support of cost-effective manufacturing of lasers and of substrates, media, and recording systems is essential to carry out this strategy for storage devices. DoC Measurements for Competitiveness in Electronics: This DOC study focuses on the electro-optic areas of lasers, optical fiber communications, optical fiber sensors, and video. The report notes that in 1992 materials processing, medicine, and communication were the three commercial applications for which the

highest dollar volume of lasers were sold. Materials processing and medical surgery are associated in this study with higher power energy producing lasers (e.g., CO2) and medical imaging and communications systems with solid-state diode lasers. The reduction of the semiconductor diode laser to a reasonably priced commodity is the most important laser development of the past decade; this market is now dominated by Japan. Moreover, this type of laser is replacing conventional lasers in a variety of application domains as higher power and broader wavelength outputs become available. (It seems clear from these facts that manufacturing technology steps to regain a portion of this market are critical to both global competitiveness in electro-optics and having a domestic source for specialized semiconductor diode lasers for military applications.) The rate of progress of optical fiber communications has been very rapid, but even the most modern systems exploit only about one one-thousandth of the information capacity of optical fibers. The limitation is in the electro-optic components (switches, couplers, multiplexer, and demultiplexers) which are an integral part of such a communication system. Research, development, and manufacturing technology initiatives are required that provide low- cost, high performance, and high-reliability components to serve as the basis for the next generation optical communication system. Many of the issues identified in the video area by this study are similar to that in the display component of the OIDA report. An important additional requirement addressed in this report is the need for advanced data compression methods and hardware for video systems. The data compression requirements for such systems will be one to two orders of magnitude more stringent than for current networking systems used with computers. Given the enormous market potential for high-resolution video systems as well as their potential importance in military systems, the unique manufacturing technology requirements for components of very high performance data compression systems may be a fruitful area of investment. ARPA Workshop on Electro-Optics Module Technology and Manufacturing: This workshop, held in May 1993, featured presentations by 28 U.S. companies developing and marketing products in this area. Among the critical manufacturing technology shortfalls identified by the participants were packaging of electro-optic components (including alignment, interconnects, and surface-emitting lasers), scale-up to volume manufacturing, process flexibility to handle complex modules, and improved methods for integrating optical and electronic components. Manufacturing technology advances to address these needs were associated with a wide range of military and civil sector benefits, including improved local area communications networks, imaging systems, optical sensors, and phased arrays.

Attachment 2 JDL MS&T Electronics Subpanel Roadmap for IRFPA Assembly Technology

Attachment 3 Overview of S&T Efforts in Electro-Optics Each of the Services has on-going technology base and/or Manufacturing Science and Technology programs to address their present and future needs for electro-optics components and systems These programs are motivated by a broad range of electro-optics system, subsystem, and component needs. The Services electrooptics program activities, encompassing such areas as photonics, fiber optics, lasers, displays, and focal plane arrays are being worked in conjunction with other agencies, such as ARPA, NASA and NIST, to effectively leverage government investment Specifichigh return" EO technologies (having a wide range of military and commercial applications), listed below are being pursued. The ability to cost-effectively produce these technologies has become the focus of many joint Service efforts. Monolithic integrated functions (MIFs) combining conventional IC technologies with high-speed digital, opto-electronic and microwave functions on the same chip. MIFs may include compound (GaAs, etc) or Group IV - such as germanium (Ge) materials deposited on a silicon substrate. High power, diode-pumped, solid-state lasers for use in military applications such as Infrared countermeasures, satellite to ground or satellite communications and light detection and ranging (LIDAR). High speed optical devices for radar electronic warfare deception devices. remoting and

High speed optical processors for high-throughput, realtime signal processing three-dimensional IC technology. High definition displays (flat panel - AMLCDs, etc.) for rapid and effective access to information resources on/over the battlefield. Laser diode arrays for efficient, low-weight, lower-power sources for laser-directed energy applications. Infrared (IR) imaging sensor (improved focal plane arrays) - image sensors providing increased capabilities for missile seekers, surveillance and reconnaissance cameras. Fiber optical sensors for anti-submarine warfare (ASW), chemical/biological warfare (CBW) detection systems,tactical grade fiber optic gyroscopes, and smart structures. Material manufacturing programs required to produce the technologies above specifically tailored rugate filters

for missile domes, FLIR windows, and laser protection coatings. Fabrication equipment - process equipment and associated automation and sensor technologies for low defect densities and tight process control over the full range of fabrication steps. CAD for electro-optic domain - software tools, interface and integration standards, models and data structures for accurate simulation of microwave/mm-wave and EO hardware and systems.

Grouping the above technology listing into four main categories: Photonic/Fiber Optic devices, Lasers, Display Technology, and Infrared Sensor Technology, we will provide a summary of ongoing Service work. Photonic/Fiber Optic Devices Photonics/fiber optics technology can support a number of applications that were the sole purpose of electronic and microelectronic devices. By combining fast, massively parallel techniques, devices possessing high spatial resolution (used in optical data storage), photonics can produce order-of-magnitude improvements over todays conventional electronic devices. The high power semiconductor diode laser is emerging as the device that will satisfy many of the energy generating needs of photonics. Semiconductor devices such as the master oscillator power amplifier (MOPA), using a single mode distributed feedback (DFB) laser combined with a waveguide all deposited on a GaAs wafer for on chip power amplification, have proven extremely effective rivalling that of gas, ion, and solid state lasers. The high power and high brightness output of the MOPA device can be frequency doubled to the blue wavelengths with an efficiency as high as 26%, promising a significant impact on the development of advanced optical memories for photonic systems. Additionally, diode laser arrays have proven to be superior pump sources for laser range finders, designators and counter measure sources. New designs are being sought for photonic detectors in high speed fiber optic microwave systems. In a recent development, a photoconductive detector was developed based on a low-temperature grown GaAs buffer layer to provide the required characteristics of subpicosecond response, high carrier mobility and high breakdown voltage. High sensitivity, comparable to that of a photo diode, was achieved by reducing the carrier transit time across the electrode gap to match the carrier lifetime in order to approach the condition of unity photo current gain. Other detectors have been developed in packaged devices which operate up to 20 Ghz and 40Ghz packaging has been demonstrated in laboratory environments. In a parallel photonic detector effort, state-of-the-art nanofabrication techniques were used to fabricate the worlds fastest metal-

semiconductor-metal (MSM) photo diodes. It is expected that these photo diodes will find important use in numerous advanced signal processing and control systems and optically controlled phased array radars. Further advances were made in wideband photonic networks to provide image and sensor data, super computer interconnection, and high speed access to electronic databases and libraries. Significant achievements were made in four-wave mixing in semiconductors as the possible mechanism for low power frequency shifting in wideband optical networks. These developments are important because an alloptical wideband communications network will most likely use frequency division multiplexing. If the interconnects are optical, means must be developed for shifting a signal from a frequency channel in one LAN to a different frequency channel in another LAN. Four-wave mixing in semiconductors has the potential for satisfying these requirements. Recent advances in micro-optic fabrication methods have significantly added to photonic capabilities for advanced components serving a wide range of applications. Binary micro-optic fabrication of photonic components has been carried out for many years. However, the problem of holding mechanical tolerances has severely limited the optical performance of binary optics in the visible spectrum. To overcome that problem, analog micro-optic fabrication must be continued wherein optical surfaces fully correspond to bulk physical optics are produced on a very small scale. Surface electrical passivation is a major problem for m-v semiconductor photonic devices, and significant work is being completed to find a solution that will have a large impact on producing high speed electronic and optical components for sensing and signal processing. Whereas an effective native oxide, SiO2, is available for silicon very large scale integration, none exists for GaAs microelectronics. In one government program it was shown that oxidized aluminum gallium arsenide layers can provide effective space passivation. Such layers are compatible with modern lithographic and processing techniques. A manufacturing research team demonstrated the excellent performance of various opto electronic devices fabricated using this method. The base technologies in fiber optics include delay lines and communication links, computer applications, generic fiber optic sensor technology, coherent communications, and fiber optic sensor survivability and reliability. Various types of fiber optic sensors have been developed by the Services that perform the function of hydrophone, magnetometer, accelerometer, thermometer and gyroscope. One program is the tactical grade fiber optic gyroscope manufacturing program focused on meeting a one degree per hour drift rate. The government effort in this area has been led primarily by the Navy and Air Force. The Navy is also conducting a MS&T program with Litton to

manufacture optical fiber acoustic sensors for hull mounted and bottom mounted surveillance arrays. This MS&T program promises to significantly reduce the cost for fiber optic acoustic sensors. The government optical signal processing (optical interconnects, opto electronic integrated circuits, optical memory and image processing) effort is dominated by the Air Force and ARPA, especially in the device manufacturing development area. The Navy is coordinating on several projects and has intentions to use the technology for sensing and communications. A summary of program goals and delivery of project work is as follows: Optical Signal Processing - Development and improvement for manufacturing integrated optics, fiber optics and hybrid optical devices for high speed, high bandwidth signal/data/image processing; transition to monolithic technology; and investigate advanced EO and NLO materials (organics, InP, etc.) Delivery Dates: advanced spatial light modulator/rebroadcaster phase only correlator proof of concept organic integrated optical waveguides and NLO device 2D OEIC smart pixel arrays high speed FM transceiver Continuing FY-94 Continuing FY-95 Continuing

Fiber Sensors - To produce sensors with better performance, lower cost, and greater reliability using fiber optic interferometric sensors and develop core technology for low noise optical sources and fibers with specific polarization capabilities to support sensor development. Delivery Dates: magnetic array system all optical towed array and lightwave planar array stress/strain sensors for composite structures fiber hydrophones for Arctic applications 3-axis gyroscopes for navigational control FY-94 FY-93-94 FY-96 FY-94 Continuing

RF/Microwave Communications - Develop methods and improve technology for optically controlled microwave delay line, phased array/beam forming components through advancements in high speed lasers, modulators and detectors, and eventual integration of optical and microwave devices on the same chip. In addition, improve electro-optic to opto-electronic conversion efficiency. Delivery Dates: high speed detector, monolithic receiver optically controlled array (amplifiers, shifters,switches) Continuing FY-94

MESFET optical detector 2-8 GHZ wide dynamic range fiber link Lasers

FY-96 Continuing

The military Services and NASA continue to seek low-cost compact laser transmitters (semiconductor diode lasers) for space communications. Particularly sought are better reliability and efficiency compared to the Nd:YAG solid state laser. One successful approach has been with the MOPA semiconductor discussed earlier. MOPA structures continue to require improvements in manufacturing to fabricate monolithic devices on a single chip. In general, tri-service technology consists of three dominant thrust: (1) laser diode arrays, (2) the diode pumped 1 micrometer laser, and (3) mid-IR laser sources. The diode array thrust seeks to reduce the cost and increase the performance and availability of a pump for solid state lasers. The objective of the diode pumped 1 micrometer laser effort is a compact, high efficiency laser source that uses the diode pumped neodymium-doped solid state laser material. The objective of the mid-IR technology is to develop militarized lasers that use diode pumped solid state lasers and nonlinear optics to produce radiation in the 1.5 to 5.0 micrometer region. Tri-service participation is as follows: The Army is responsible for manufacturing technology in the NIR laser diode arrays, EO countermeasures and managing the diode array pumped kilowatt lasers, the Air Force is responsible for high power coherent laser diodes, those diodes operating in the W spectrum, and high power laser radar sources, and the Navy is responsible for temperatureinsensitive laser technology and wavelength conversion to the bluegreen region, quasi-phase-matched nonlinear technology in the midIR, development of long wavelength diode arrays for mid-IR laser pump, and in-house programs on specific mid-IR applications. A summary of program goals and delivery of project work is as follows: Laser Diode Arrays - Produce high power, efficient, incoherent laser diode arrays and coherent laser diode arrays for pumping solid state lasers and for direct sources. High power density (1500 W/cm2), low cost, quasi-CW, laser diode arrays at 807 nm with greater than 40% efficiency for pumping Nd:Host solid state lasers. Diode array structures with efficient heat transfer; improved optical coatings and passivation techniques; and operation over wide temperature range are needed. Delivery Dates: coherent diode arrays (greater than 5 watts CW at 91lnm) FY-94 coherent arrays (greater than 5 watts CW at 970-980nm) FY-95 surface emitting array Continuing coherent arrays (greater than 5 watts at 1.9-2.5 um) FY-95

Diode Pumped 1 um Laser - Produce compact, moderate power (10-100 watts), high efficiency (min 10% to 1 um) 1 urn laser sources and compatible technology for wavelength conversion into the visible spectrum. Produce large rods/slabs of high quality; efficient optical coupling of laser material; techniques for efficient heat extraction; techniques for low-tolerance optical alignment; high quality nonlinear crystals for frequency doubling; robust optical coatings for diodes, solid state lasers, and nonlinear crystals; and laser operation over military temperature range. Delivery Dates: temperature-insensitive diode pumped oscillator prototype 10 lb., 3 J. laser for EOCM prototype lKW laser FY-94 FY-95 FY-95

MID-IR Sources - Fabricate high efficiency lasers emitting in the 1-5 um wavelength region; high efficiency lasers with a minimum of 3% total efficiency in 2-5 um region for IRCM, and 1.5-2 um region for laser radar and obstacle avoidance; efficient high rep rate 2 um laser source; optimized nonlinear subsystems for OPO wavelength conversion to 3-5 um. Delivery Dates: 50 watt flyable 2 um laser for BTIIRCM demo Brassboard laser operating with 2 watts at 2-5 um Display Technology Display technologies under development include: flat panel, light valves, and high-performance CRTs. Particularly needed are highinformation-content displays that range from miniature, helmetmounted devices, through potable and vehicular systems, and finally on to large screen displays for command post and shipboard applications. In addition, 3D and stereoscopic displays are needed for robotics applications, while tele-operated and situation displays will be further developed using laser technology, miniature devices, polarizers and special optics. Leapfrogging current technology, a U.S. company commercialized a display manufacturing process, developed by a U.S. university (in conjunction with ARPA), which deposits an array of thin-film silicon transistors on a wafer for the subsequent lift-off to the final stage of liquid crystal display assembly This approach is unique because it allows flat panel display manufacture to be carried out by the activity of separate companies, each contributing its own specialties in conventional IC foundry services, lift-off and transfer processing, and LCD encapsulation. This achievement bodes well for the U.S. participation in producing both projection and virtual-reality display systems. Progress also continues in the U.S. in the areas of thin-film electro luminescent and plasma full color display technologies. In both cases, VGA-resolution displays have been demonstrated. In a FY-94 FY-95

recent development, research on a producible, high-quality, Simirror, full-color, video image projection display technology was transitioned to limited production. This technology will require additional work to realize a full production effort. Another recent manufacturing achievement in the area of FPDs was the use of lift-off technology to produce a high performance, 1000 lines-per-inch head-mounted FPD. Two approaches were investigated: active matrix electro luminescence and active matrix liquid crystal using single crystal silicon circuit for high performance transistors in an active matrix. Further manufacturing development must occur in this area to allow the production of a helmet-mounted display for the Combat Command and Control system being procured by the Army. Tri-service participation is as follows: The Army will possess overall technology cognizance for electro luminescent and plasma displays, the Air Force will concentrate on liquid crystals and stereoscopic displays, and the Navy will serve as lead in the area of volumetric and helmet applications A summary of program goals and delivery of project work is as follows: Flat Panel Displays - Develop new capabilities in high resolution color, flat panel display technology and apply them in the operator interface segments of military aircraft, shipboard, submarine, vehicle and ground systems. Delivery Dates: full color TFEL and plasma prototypes 76 cm SVGA plasma panel in full color 25 cm full color VGA TFEL in production FY-94 FY-94 FY-95

Large Screen Displays - High-resolution, large-screen displays for command post, shipboard and command centers. Delivery Dates: digital micromirror display prototype 76 cm plasma flat panel display FY-94 FY-94

Helmet Mounted and other Miniature Displays - High performance, small display devices, optics and interactive devices for helmet mounted displays; development of miniature flat panel technology is expected to provide performance and efficiency. Delivery Dates: AMEL/LCD miniature flat panels 12 micron pixel flat panel devices 3D/Stereoscopic Displays Develop rugged, fieldable, FY-94 FY-94 3D and

stereoscopic display systems for applications perception is critical to mission performance. Delivery Dates: micropol stereo projection and flat panel displays 3D volumetric display Infrared Sensor Technology

where

depth

FY-94 FY-95

The central issue affecting the availability of the HgCdTe IRFPA for military system development is the improvement of product yield. This is being addressed in manufacturing and producibility programs. In the Phase I ARPA IRFPA Program, for example, significantly better manufacturing yield has resulted. End-item product cost has dropped from approximately $60,000 for the 480 x 4 array and $190,000 for the 960 x 4 array in 1990 to about $30,000 in 1993 for the 960 x 4 array (data was not available for the 480 x 4 array). In addition to improving the manufacturing yield of the HgCdTe IRFPA, the stability of the readout attachment is another area of concern. Bump bonding between the individual detectors and the associated readout elements has always presented technical problems because of the difference in thermal expansion of the detector and readout subsystems. A significant achievement in 1993 was the improved assembly and thinning of the layers of the array to allow release of stress in expansion or compression by slight mechanism deformation. This has enabled the manufacture of arrays with improved temperature cycling performance. Intrinsic material instabilities remain for HgCdTe IR detectors and array systems, and superlattice/quantum well infrared absorbing materials are being designed to replace HgCdTe for IR detectors and arrays. The possibility for tuning the superlattice wavelength suggests a wide range of applications in imaging and detection, surveillance, robotics, etc. In addition to superlattice structures, quantum well infrared photo detectors (QWIPs) have been demonstrated. These detectors were limited in the past by the requirement of non-normal incidence of the incoming radiation, with an associated loss in detection of the infrared signal. Using theoretical analysis and novel semiconductor growth techniques, researchers have succeeded in demonstrating normal and non-normal incidence detection in the same silicon-germanium multilayer structure. This advance should also be possible in QWIPs fabricated in III-V compound semiconductors and accelerate their incorporation into night vision devices and systems. There have been other recent advances in focal plane array systems, including successful transition of platinum silicide (PtSi) infrared detector technology from the laboratory to an Air Force platform. Much work is still needed to improve the yield rate of PtSi detector manufacturing. Another area seeing revitalized interest is the use of Schottky diode arrays for infrared imaging

(originally proposed by the Air Force in the 1970s). the Air Force continued a low-level development effort of this technology and current infrared focal plane arrays are available which have more than 300,000 separate elements in staring 480 x 640 format. Because of the use of silicon technology, which has exceptional support from the semiconductor industry, these arrays turned out to be remarkably defect-free. Many military focal plane array applications require thermoelectric coolers that operate at cryogenic temperatures - the range below 120K. Currently, thermoelectric coolers operate at 1800K, and research is being carried out to reduce the thermoelectric operating temperature to the cryogenic range. The dominant advantages of improving the cooler for military and commercial applications are increased efficiency, low weight, increased reliability, reduced size, and elimination of the CFC coolant. The three Services along with ARPA and BMDO have established joint federated programs developing a broad spectrum of infrared focal plane arrays. Devices under development in this joint effort include two-dimensional arrays of detectors fabricated in HgCdTe, InSb, uncooled silicon and ferro-electric, and photoemissive materials. IRFPAs are fabricated under contracts to industry and the deliverables and underlying technology are evaluated in government laboratories. A summary of program goals and delivery of project work is as follows: IR Focal Plane Arrays (HgCdTe. Uncooled. Photoemissive) - Develop the technology and demonstrate the feasibility of focal plane array concepts for DoD infrared sensor systems; Develop two dimensional arrays of detectors and the associated readout electronics using detector materials which include HgCdTe, InSb, extrinsic silicon, and uncooled silicon and ferroelectrics. Delivery Dates: PtSi camera systems NEdeltaT < 0.01K monolithic HgCdTe MWIR FPA of 1 X 1 multicolor staring FPA uncooled FPA with NEdeltaT smart FPA with advanced on-chip processing FY-94 FY-95 FY-96 FY-96 FY-98

IRFPAs: Alterative Approaches - Develop the technology and demonstrate the feasibility of focal plane array concepts for DoD application; develop 2-D arrays of detectors and the associated readout electronics using alternate detector materials, including GaAs. InGaAs, GaXxSb, high temperature superconductors and Si/Ge. Delivery Dates: InXxSb detector demo GaAs multicolor detector FY-94 FY-96

GaAs IRPM (3-5 um) III-V monolithic quantum well detector/mux

FY-97 FY-97

Attachment 4 JDL MS&T Planning Process The affordable production, upgrading and sustainment of technologically superior weapon systems relies on a capable, competitive and responsive, private and organic, industrial base. The US industrial base must respond to sharply curtailed defense production with defense-specific and integrated commercial-military products which are world class in cost, quality and meet customer needs. Realizing these changes require development of new business practices implementing lean manufacturing concepts, a focus on total quality and variability reduction, full implementation of integrated product and process development, and a broadly capable manufacturing and support infrastructure facilitating change and enabling implementation. The JDL MS&T Panel, composed of the Manufacturing Technology (MANTECH) Directors of the DoD Components - Army, Navy, Air Force and Defense Logistics Agency (DLA) - has developed a unified investment strategy that, when funded and executed, will provide the solutions necessary to implement the changes needed to respond to todays shifting force structure requirements, industrial base restructuring, and technology advances. The investment strategy was jointly developed by the DoD components and is based upon identification and prioritization of weapon system requirements and pervasive industrial base requirements. As shown in Figure 1, each DoD Component first identifies its major systems currently in acquisition or sustainment. These systems comprise the central target for MANTECH investment. They are analyzed to identify outstanding manufacturing requirements, e.g., fabrication processes which historically provide low quality or yield, or new material where forming parameters are not well developed. The industrial base sectors that produce the systems and the sustainment mechanisms that will maintain and repair the systems are assessed for current and expected process technology developments and shortfalls. This analysis provides the linkage between manufacturing and sustainment technology requirements of the industrial base and the defense system or systems which drive it. This strategy, based on system requirements, is a key element of MANTECH which distinguishes it from other manufacturing programs. Finally, the technology base efforts are analyzed to identify technological opportunities with direct application to Service needs. These inputs are analyzed by each Service to develop its own set of manufacturing technology requirements, each DoD component prioritizing their needs based upon similar criteria that now includes: availability of a technically feasible solution, potential benefit to be derived, probability of implementation (including management support and system stability) and urgency of the requirement. These requirements, together with an estimated cost profile, comprise the DoD component investment plan.

Next, the DoD components investment plans are reviewed by the JDL Reliance Subpanels. These subpanels are comprised of technical experts in specific categories, e.g., electronics, composites, metals processing, industrial base pilots and manufacturing systems. Each panel reviews the proposed investments and provides a reprioritization based upon a DoD-wide perspective. At this point, ongoing efforts outside MANTECH are reviewed for relevancy and potential for coordination, as well as multi-service requirements which dictate joint development programs. Based upon this analysis, the unified DoD MANTECH program for each technical category is repriced and a budget request is prepared. These category programs are combined and refined by the overall JDL Panel to produce the unified DoD components program plan for MANTECH.

Attachment 5 Notification of Electro-Optics Workshop AMSEL-RD-NV-TTPD-MANTECH MEMORANDUM FOR INFORMATION 15 NOVEMBER 94

SUBJECT: Workshop For Electro-Optics Manufacturing Science and Technology SPONSORING AGENCIES: US Army Communications and Electronics Command, Night Vision Directorate, Thermal Technology & Producibility Division, MANTECH Team US Army Missile Command, MANTECH Division US Air Force, Wright Laboratory, Electronics Division US Navy, Office of Naval Research, Production Assessment Division, Naval Manufacturing Technology Program Advanced Research Project Agency Defense Sciences, Material Science Microelectronics Technology Advanced Systems Technology ENDORSED BY: Joint Directors of Laboratories Manufacturing Science & Technology Reliance Panel, Electronics Manufacturing & Processes Sub-Panel 1. The Night Vision and Electronics Sensors Directorate (NVESD), Fort Belvoir, Virginia, will be hosting a workshop on ElectroOptics Manufacturing Science & Technology (E-O MS&T) on 2-4 May 1995. The purpose of the workshop is to allow industry, academia and federal agencies to: Identify critical areas in E-O Manufacturing that require development in order to support future defense requirements Discuss technical approaches to develop these critical EO Manufacturing areas. 2. This memorandum solicits technical abstracts for presentations during the E-O MS&T workshop. The one page technical abstracts should focus on E-O Manufacturing issues and proposed development approaches. Abstracts must include a listing of the family, type, or class of weapons system which the new manufacturing effort would support. In addition, please briefly describe any new E-O technology if applicable. The abstracts must be received NLT 23 January 95. The list below contains technical areas where E-O Manufacturing may need development. Other applicable topics may be addressed and submitted for consideration.

Focal Plane Arrays: Cooled, Uncooled, Monolithics/Smart Dewars

FPAs,

Coolers,

Lasers: Laser Diodes, Diode Arrays, Diode Pumped Sources, Mid IR Sources, Optical Coatings, Laser Materials, Non-linear Optics Materials Optics: Conventional Optics, Advanced Optics (aspheric lenses, non-axisymmetric optics, conformal, non-linear, binary, holographic, & micro-optics), Advanced materials/ processing (solgel, Gradient index, Coatings) Display components: Flat Panel (miniature, helmet mounted) Fiber Optics: Dynamic Guidance Links, FO Harnesses, FO Sensors, FO Inverters, Commo Links, IFOGS Opto Electronics: Optical Interconnects, Integrated Optics, Spatial Light Modulators, Optical Correlators, Ring Laser Gyros Advanced Image Intensifiers: Micro-channel Plates, Photo-anode, Photo-cathode 3. A panel consisting of staff from the sponsoring agencies will review the responses solicited by this memorandum and select the abstracts for presentation during the workshop. The three days may be organized into sessions, grouped by sub-technologies, to provide a forum for the presentation of selected abstracts. Each session will conclude with a discussion period which has been set aside to express comments, ideas, and alternative concepts. A copy of all presentation materials will be made available to workshop attendees. 4. The workshop will be controlled unclassified. Only US citizens without direct foreign interests may attend. Interested participants or attendees should send responses or questions via EMail, fax, or mail to the addresses listed below. A minimal registration fee will be charged to cover lunches and refreshments. Abstracts should be sent to the address below NLT 23 January 1995. Registration material and more details will follow in March 95. ADMINISTRATIVE CHAIR: Amy M. Ryan Night Vision and Electronic Sensors Directorate AMSEL-RD-NV-TTP-MANTECH ATTN: Amy M. Ryan 10221 Burbeck Road, Suite 430 Fort Belvoir, VA 22060-5806 E-MAIL: ARYAN@NVL.ARMY.MIL

Fax:

(703) 704-1705 Sincerely,

WILLIAM E. SALAZAR A/TmChfMANTECH, TTPD

39