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Information

SURPASS hiT 7550 2.05 Technical Description (TED)


A42022-L5936-C51-1-7618

Technical Description (TED)

Information SURPASS hiT 7550 2.05

Important Notice on Product Safety


Elevated voltages are inevitably present at specific points in this electrical equipment. Some of the circuit parts may also have elevated operating temperatures. Systems with forced ventilation have rotating items. Non-observance of these conditions and the safety instructions can result in personal injury or in property damage. The system complies with the standard EN 60950 / IEC 60950. All equipment connected has to comply with the applicable safety standards. Mount the systems in areas with restricted access only. Only trained and qualified personnel may install, operate, and maintain the systems.

The same text in German: Wichtiger Hinweis zur Produktsicherheit In elektrischen Anlagen stehen zwangslufig bestimmte Schaltungsteile der Gerte unter Spannung. Einige Teile knnen auch eine hohe Betriebstemperatur aufweisen. Anlagen mit Zwangsbelftung haben drehende Teile. Eine Nichtbeachtung dieser Situation und der Warnungshinweise kann zu Krperverletzungen und Sachschden fhren. Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Angeschlossene Gerte mssen die zutreffenden Sicherheitsbestimmungen erfllen. Die Anlagen drfen nur in Betriebssttten mit beschrnktem Zutritt aufgebaut werden. Die Anlagen drfen nur durch geschultes und qualifiziertes Personal installiert, betrieben und gewartet werden.

Trademarks: All designations used in this document can be trademarks, the use of which by third parties for their own purposes could violate the rights of their owners.

Copyright (C) Siemens AG 2003


Issued by the Information and Communication Networks Group Hofmannstrae 51 D-81359 Mnchen Technical modifications possible. Technical specifications and features are binding only insofar as they are specifically and expressly agreed upon in a written contract.

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Technical Description (TED)

This document consists of a total of 178 pages. All pages are issue 1.

Contents
1 1.1 1.2 1.3 1.4 1.4.1 1.4.2 1.4.3 1.4.4 1.5 1.6 2 2.1 2.2 2.2.1 2.2.2 2.3 2.3.1 2.3.2 2.3.3 2.3.3.1 2.3.3.2 2.3.3.3 2.3.4 2.3.4.1 2.3.4.2 2.3.4.3 2.3.4.4 2.3.4.5 2.3.4.6 2.3.4.7 2.3.4.8 2.3.4.9 2.3.4.10 2.3.4.11 2.3.4.12 2.3.4.13 2.3.5 2.3.5.1 2.3.5.2 2.3.6 2.3.7 2.3.7.1 Notes on the SURPASS hiT 7550 2.05 Documentation . . . . . . . . . . . . . . . Preliminary Remarks concerning this Release . . . . . . . . . . . . . . . . . . . . . . Customer Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Complementary Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Symbols Used in the Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Symbol for Warnings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Symbols for Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Symbols for Menu Displays and Text Inputs. . . . . . . . . . . . . . . . . . . . . . . . Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Notes on Licensed Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Form for your Ideas, Proposals and Corrections . . . . . . . . . . . . . . . . . . . . System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Network Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Compatibility with Existing Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SURPASS hiT 7550 2.05 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Transmission Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Safety Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Automatic Power Shutdown Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . Automatic Power Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Additional APSD/APR Safety Mechanisms. . . . . . . . . . . . . . . . . . . . . . . . . Optical Performance Monitoring & Control . . . . . . . . . . . . . . . . . . . . . . . . . Optimal EDFA Gain Setting and Fast Gain Control . . . . . . . . . . . . . . . . . . EDFA Output Power Control (Slow Gain Control) . . . . . . . . . . . . . . . . . . . Power Equalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAM4 Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Client Signal Ageing, Drop Control, Add Channel . . . . . . . . . . . . . . . . . . . Constant Pump Current Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tilt Analyzer and Adjustable Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ASE Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Channel Up- and Downgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Layer Provisioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Layer Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Performance Analyzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Optical Network Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The Telecommunication Network Management System . . . . . . . . . . . . . . Integrated Domain management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Element Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connection to Network Management Systems. . . . . . . . . . . . . . . . . . . . . . Information Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 11 12 13 13 13 13 13 13 14 17 17 18 18 18 20 20 21 23 23 25 26 27 27 27 28 28 28 29 29 30 30 33 33 33 34 38 38 39 40 42 42

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2.3.7.2 2.3.7.3 2.3.8 2.3.9 2.3.10 2.3.11 3 3.1 3.1.1 3.1.1.1 3.1.1.2 3.1.1.3 3.1.1.4 3.1.2 3.2 3.2.1 3.2.1.1 3.2.1.2 3.2.1.3 3.2.1.4 3.2.2 3.2.2.1 3.2.2.2 3.2.2.3 3.2.2.4 3.2.2.5 3.2.2.6 3.2.3 3.2.3.1 3.2.3.2 3.2.3.3 3.2.3.4 3.2.3.5 3.2.4 3.2.5 3.2.6 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.9 3.3.10

Communication Stacks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Communication Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 EOW Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 User Data Channels (sV.11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Telemetry Interface (TIF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Overview of System Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Frequency/Wavelength Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 C and L Wavelength Bands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6) . . . . . . 54 40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8) . . . . . . 55 40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6) . . . . . . . 55 40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8) . . . . . . . . 57 Interleaver Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Functional Overview of the NE Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 OTT(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Four Stage Design from 1 to 160 Channels. . . . . . . . . . . . . . . . . . . . . . . . . 62 Multiplexer Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Multiplexer Equipping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 OLRU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Scalability of DWDM Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Amplifier Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Multi-Stage Amplifier Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Amplifier Pump Modularity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Raman Amplification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 OADM(U) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Remotely Configurable 20% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Back-to-Back 100% OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Connectivity Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 OADM Cascadability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 CCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 OADM Ring Closure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Networking with OADMU/OTTU. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Functional Overview of the Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Modules used for NEs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 SAB Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 OSCT Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 SMU2 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 OLI PUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

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3.3.11 3.3.12 3.3.13 3.3.14 3.3.15 3.3.16 3.3.17 3.4 3.5 3.5.1 3.5.2 3.6 4 4.1 4.1.1 4.1.2 4.1.3 4.2 4.2.1 4.2.2 4.3 4.4 4.4.1 4.4.2 4.4.3 4.4.4 4.5 4.5.1 4.5.2 4.5.3 5 5.1 5.2 5.3 6 6.1 6.2 6.2.1 6.2.2 6.3 7 7.1 7.2 7.2.1 7.2.2

RPUMP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 OMD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 OM/OD Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 EAM4C or EAM4L Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 OCA / OCAS / OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 UDCM Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Control and Monitoring via the Element Manager. . . . . . . . . . . . . . . . . . . 108 Access Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Control and Monitoring via Network Management System . . . . . . . . . . . . 110 Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Racks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Mechanical Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rack and Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connector Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Subracks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Subrack Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DCM Trays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OTT Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OLR Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OADM Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CCU Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Display and Operating Elements on Equipment . . . . . . . . . . . . . . . . . . . . NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SAB Boards and Subrack Address Setting. . . . . . . . . . . . . . . . . . . . . . . . Module Front Panel Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Fault Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Management PC Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Commissioning, Operation and Maintenance . . . . . . . . . . . . . . . . . . . . . . Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Display Elements of the Modules . . . . . . . . . . . . . . . . . . . Operation with an Operating Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rack/Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Rack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Subrack Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 111 111 111 115 116 116 120 121 121 122 123 124 125 126 126 126 127 129 129 132 133 135 135 135 135 135 136 137 138 139 139 140

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7.3 7.3.1 7.3.2 7.3.3 7.3.4 7.3.5 7.3.6 7.3.7 7.3.8 7.3.9 7.3.10 7.3.11 7.3.12 7.3.13 7.3.14 7.3.15 7.4 7.5 7.6 7.7 7.8 7.9 8 9 10

Technical Characteristics of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 OSCTUT and OSCTUI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 OLI Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 PUMPA, PUMPB, and PUMPC Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 147 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL) . . . . . . . . . 148 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 CAD2 Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 EAM4 Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Rack/Subrack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Electrical Power Consumption of Modules. . . . . . . . . . . . . . . . . . . . . . . . . 156 Electrical Power Consumption of Racks . . . . . . . . . . . . . . . . . . . . . . . . . . 157 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 System Requirements for the Element Manager . . . . . . . . . . . . . . . . . . . . 160 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

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Illustrations
Fig. 2.1 Fig. 2.2 Fig. 2.3 Fig. 2.4 Fig. Fig. Fig. Fig. 2.5 2.6 2.7 2.8 Basic Structure of the SUPRASS hiT 7550 2.05 Optical Network System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 The Optical Supervisory Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Typical C Band SURPASS hiT 7550 2.05 DWDM Link with No Fibre Break . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Typical C Band SURPASS hiT 7550 2.05 DWDM Link with a Single Fibre Break between OLR and OADM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points . 35 Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points 36 Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points . 37 Element Manager Main Window (Example: OTTU Network Element, Subrack 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 TNMS CT Graphical User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Communication Interfaces and Controller Architecture of SURPASS hiT 7550 2.05. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Synopsis of Applications, Communication Stacks and Interfaces . . . . . 45 Information Model of the Physical Interfaces . . . . . . . . . . . . . . . . . . . . . 46 SURPASS hiT 7550 2.05 Wavelength Plan. . . . . . . . . . . . . . . . . . . . . . 53 SURPASS hiT 7550 2.05 Wavelength Bands and Sub-Bands . . . . . . 59 OTTU, Optical Path Structure for C Band (Upgradable to C+L Band). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Block Diagram of C Band SURPASS hiT 7550 2.05 Multiplexer Architecture Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 OLRU, Optical Path Structure for C Band . . . . . . . . . . . . . . . . . . . . . . . 65 Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration 66 Two Fibre SURPASS hiT 7550 2.05 Standalone L Band Amplifier Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Stage EDFA Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Two Fibre SURPASS hiT 7550 2.05 C+L Band, Raman Amplifier Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 OADMU with CAD2x Modules, Optical Path for C Band Standalone . . 72 Remotely Configurable CAD2 Optical Switch Modules . . . . . . . . . . . . . 73 Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz) . 75 Symmetrical and Asymmetrical OADM Architectures . . . . . . . . . . . . . . 76 CCU: Principal System Environment of OCA and OC(A)S Modules . . . 77 OADM Ring with two Back to Back Terminals (2xOTTU) . . . . . . . . . . . 78 Network Configurations with Combinations of Network Elements . . . . . 79 MCU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 SAB and SABM Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 OSCTU Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 SMU2 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 OPA Module, Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 System Environment of OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Fig. 2.9 Fig. 2.10 Fig. 2.11 Fig. 2.12 Fig. 3.1 Fig. 3.2 Fig. 3.3 Fig. 3.4 Fig. 3.5 Fig. 3.6 Fig. 3.7 Fig. 3.8 Fig. 3.9 Fig. 3.10 Fig. 3.11 Fig. 3.12 Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. 3.13 3.14 3.15 3.16 3.17 3.18 3.19 3.20 3.21 3.22

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Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig.

3.23 3.24 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 3.35 3.36 3.37 3.38 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 4.11 4.12 4.13

OLI Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 OLI PUMP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 OMDFIC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 OMDFIL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 OMDFC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 OMDFL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 OMD2IC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 OMD2IL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 OM20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 OD20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 ODA20 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 CAD2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 EAM4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 OCA and OCAS Modules, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . 104 OCS Module, Optical Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Timer Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Power Distribution within the Rack (Single Row Subrack) . . . . . . . . . . 112 Power Distribution within the Rack (Double Row Subrack) . . . . . . . . . 113 Power Distribution within the Subrack . . . . . . . . . . . . . . . . . . . . . . . . . 114 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access . . . 115 COPA Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 ANSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 116 ANSI Double-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . 117 ETSI Single-Row Subrack (Front Access) . . . . . . . . . . . . . . . . . . . . . . 118 ETSI Double-Row Subrack (Front Access). . . . . . . . . . . . . . . . . . . . . . 119 DCM Tray . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 OTTU, C+L Bands, 160 Channels (Equipping Example) . . . . . . . . . . . 122 OLRU, C+L Bands (Equipping Example) . . . . . . . . . . . . . . . . . . . . . . . 123 OADMU, C+L Bands, 160 Channels, with Maximum Configurable Add/Drop Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM). 125 NE Alarm Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Subrack Address Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Current Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 History Alarm List (Example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 NE Software Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

Fig. 4.14 Fig. Fig. Fig. Fig. Fig. 4.15 4.16 5.1 5.2 5.3

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Tables
Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. Tab. 2.1 2.2 3.1 3.2 3.3 3.4 3.5 3.6 3.7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 7.19 7.20 7.21 7.22 7.23 7.24 7.25 7.26 OSC Byte Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Link Control Actions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 40 Blue Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 54 40 Red Wavelengths in the "C" (Conventional) Band . . . . . . . . . . . . . . 55 40 Blue Wavelengths in the "L" (Long) Band. . . . . . . . . . . . . . . . . . . . . 55 40 Red Wavelengths in the "L" (Long) Band . . . . . . . . . . . . . . . . . . . . . 57 List of SURPASS hiT 7550 2.05 Multiplexer Modules . . . . . . . . . . . . . . 64 Output Power for OLI Module with/without Pumps . . . . . . . . . . . . . . . . 69 Plug-in Units for the SURPASS hiT 7550 System . . . . . . . . . . . . . . . . . 80 Physical Layer Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 ETSI Rack Dimensions According to ETS 300 . . . . . . . . . . . . . . . . . . 139 ANSI Rack Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 Subrack Dimensions and Weight (Single Row Subrack) . . . . . . . . . . . 140 Subrack Dimensions and Weight (Double Row Subrack) . . . . . . . . . . 140 Mechanical Specifications for DCM Shelf . . . . . . . . . . . . . . . . . . . . . . 140 MCU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 MIBS Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 SAB/SABM Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 SMU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 OSCT Module Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 OLI Module Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 Specifications for OLI Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144 PUMPA, PUMPB, and PUMPC Modules. . . . . . . . . . . . . . . . . . . . . . . 147 Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL). . . . . . 148 OMDFxx and OMD2xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 OM20xx and OD20xx Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 CAD2 Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 EAM4 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 OPA Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 OCA, OCAS, and OCS Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 UDCM Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153 Electrical Power Consumption of Modules . . . . . . . . . . . . . . . . . . . . . 156 External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 System Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 160 EM System Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

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1 Notes on the SURPASS hiT 7550 2.05 Documentation


The documentation of the Network Element SURPASS hiT 7550 2.05 comprises customer documentation (see 1.2) and complementary documentation (see 1.3). The documentation is available in binders as well as on CD-ROM. For system requirements to install the CD-ROMs on your computer (under Windows or UNIX) see the file README.TXT in the root directory of the CD ROMs.

1.1
!

Preliminary Remarks concerning this Release


You should not use the L-Band in the current release! Please also NOTE carefully: Although sometimes mentioned in this documentation, the following features are not supported/tested with the current release: Web based control of the network element SURPASS hiT 7550 2.05 TL1 control of the network elements SURPASS hiT 7550 2.05 OADM with 80 % or 50 % static/congurable add/drop capacity TCP/IP and Dynamic routing (OSPF)

1.2

Customer Documentation
The customer documentation is split into manuals and Online Help: Technical Description (TED) The Technical Description TED provides an overview of the application, performance features, interfaces and functions of the equipment. It also contains the most important technical data. Installation and Test Manual (ITMN) The Installation and Test Manual ITMN contains instructions on how to install and test the SURPASS hiT 7550 2.05 components. This includes mounting the subracks in the equipment racks, connecting and testing power cables, electrical cabling and plug-in card installation. The optical cabling and rack arrangement are described in a complementary document (see Cabling Plan, Chapter 1.3). The ITMN also deals with commissioning the operating terminal and the software and describes standard turn-up procedures. Operator Guidelines (OGL) The Operator Guidelines OGL provide information on how to operate, monitor and maintain the SURPASS hiT 7550 2.05 via use of the Q3-based Element Manager software. The Element Manager (EM) is an easy-to-use Graphical User Interface (GUI) with extensive Online Help built in.


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For detailed information on the Element Manager (EM) Graphical User Interface (GUI) the Operator Guidelines OGL comprise an Appendix "Printed Help" containing the complete Online Help texts converted into printed documentation.

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Online Help The Online Help (Java based) provides information about the Element Manager windows used for the SURPASS hiT 7550 2.05. Complex procedures are explained as step-by-step instructions, especially alarm signaling, evaluation of the alarm messages, and performance management. There are several ways for obtaining help: => Press F1 for getting help information related to the currently active window. => Select Help > Contents from the main menu to open the main help window. Via this window you can display the helps table of contents and you can search for special topics using the Find or the Index tab.

1.3

Complementary Documentation
In addition to the customer documentation given above further complementary documentation set will be available partially on customers demand: Release Note This document identies the specic version of the SURPASS hiT 7550 2.05 product and provides information on HW, SW, LCT/NCT components and the limitations of the release as well as important notes concerning the customer documentation. Cabling Plan This document deals with the electrical and optical cabling of the subracks and racks, it illustrates the rack equipment of the several variants and contains block diagrams and cabling lists. It may be obtained from the sales departments. Ordering number: S42022-L5020-A100-*-7633. DCN Rules for OSI/IP (on customers demand) This document describes the IP conguration for the SURPASS hiT 7550 2.05. It may be obtained from the sales departments. The IP feature is currently not released. User Manual TNMS CT: The TNMS CT user manual describes the application, the installation, and the use of the TNMS Craft Terminal (CT), which offers integrated management for DWDM and SDH network elements together with central monitoring and conguration of an entire (small) network. The TNMS CT also contains the Element Manager software of the SURPASS hiT 7550 2.05, operated via a graphical user interface (GUI). The connection to the managed network element is established either via Ethernet or via RS-232 communication channels (Q3 or QF). The TNMS CT user manual is supplied with the TNMS CT application itself. Ordering number for the CD-ROM: A42022-L5959-A10-*-76K5 Ordering number for the manual (UMN): A42022-L5959-A53-*-7619. Field Test Protocols Field Test Protocols specify the required values for system measurements and provide space to enter the actual measured value to conrm successful installation. The current Field Test Protocols can be obtained from the sales departments.

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1.4
1.4.1 !

Symbols Used in the Documentation


Symbol for Warnings
This symbol identifies notes which, if ignored, can result in personal injury or in permanent damage to the equipment.

1.4.2

Symbols for Notes


This symbol identified notes providing information which extends beyond the immediate context. Denotes a point in the text which contains specific handling notes.

 Cross reference to other chapters in this manual or cross reference to other manuals.
Help Note on the online help system of the relevant application software concerned.

1.4.3

Symbols for Menu Displays and Text Inputs


Menu options from pop-up menus or inputs to be made by the user (texts, commands) are displayed consecutively in their hierarchical sequence in pointed brackets: <Menu> <Menu Item> <Submenu Item> <...> <GUI Window...> etc. In the Online Help menu options to be made by the user are displayed consecutively in their hierarchical sequence by arrows: Menu Menu Item Submenu Item ... GUI Window... etc.

1.4.4

Terms
The modules of the network element are also referred to as cards, plug-in units or slidein units; in the English screen text, the designation Card is used in addition to the designation Module. In this manual, the designation Module is used for the most part. There are also different namings as shelves and racks, subracks and subshelves, etc.

1.5

Notes on Licensed Software


This documentation refers to software products which were taken over from other companies as licenses. Should problems arise, you should contact Siemens AG as the licensee and not the relevant licenser. In this documentation, the following designations of licensed products are mentioned: UNIX (registered trademark of UNIX System Laboratories Inc.) MS-Windows (identication of the Microsoft Corporation)

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1.6

Form for your Ideas, Proposals and Corrections


We aim to provide clear, user-friendly documentation. To achieve this objective, your practical experience is very important. We appreciate your suggestions. To offer you, the user, a cost-effective opportunity to identify weak points or requests for documentation, we have compiled a form for you on the next page. You can use it as a master or as a printout in electronic documentation. Please enter your ideas, proposals and corrections on the copy (enclose further pages, if required). The following points are of particular importance to us: Where are we offering too much or too little detail? Where should more explanatory graphics be used? Where is the description difcult to understand? How can the basic structure of the description or the manual be improved? Please forward your feedback as a letter, fax or E-Mail to our address given overleaf. If you want a reply or need to discuss anything with us, please complete the Sender field in full. Many thanks for your feedback!

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To SIEMENS AKTIENGESELLSCHAFT Information and Communication Networks Group ICN CP STS PD 22 Hofmannstrasse 51 D-81359 Munich, Germany Fax +49 89 722 57315 E-Mail: Georg.Hohmann@siemens.com

Sender Name: ....................................................................................... Address: ....................................................................................... ....................................................................................... Department: Tel./Fax: E-Mail: ................................ ..................................................... Date: Signed: ................................. .....................................................

I use this manual as (...) Service documentation (...) Commissioning/System startup documentation (...) A general introduction (...) A reference work (...) A text book (...) _______________________________

My functions include (...) System commissioning/Startup (...) Operation (...) Maintenance (...) Sales (...) Teaching activities (...) _______________________________

Page

Comments to the Documents TED, ITMN, OGL, or to the Online Help1)

1)

Please mark the unit concerned.

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2 System Overview
This chapter consists of the following sections: Introduction Applications SURPASS hiT 7550 2.05 Features

2.1

Introduction
Siemens SURPASS hiT 7550 2.05 is the new generation of ultra-high performance DWDM systems extending transport capacity into the Terabit/s region. It's high equipment density, modularity and flexibility make it one of the most compact and powerful DWDM systems for today's and tomorrow's capacity requirements. High equipment density ensures that a minimum of valuable rack space is consumed. Modularity results in simple, low-cost, incremental component additions/exchanges being all that is necessary for the user to upgrade his network to higher and higher capacities. Flexibility is built into the SURPASS hiT 7550 system via many features. For instance, SURPASS hiT 7550 is able to accommodate a wide variety of ITU-compliant wavelength plans. Flexibility ensures successful, cost-efficient deployment in todays typical multi-vendor environment, as well as in future all-optical transport networks that employ protection switching architectures and restoration capability within the photonic layer. Advances in technologies such as narrow-band optics (50 GHz channel spacing), L Band broadband amplifiers, Raman amplification, and Enhanced Forward Error Correction (EFEC) techniques, together with improvements in their economic feasibility provide the foundation for Ultra-High Capacity (UHC) DWDM systems. Implementing them represents the logical evolution of the SURPASS hiT 7550 platform. SURPASS hiT 7550 2.05 offers a scalable capacity of up to 160 channels at 10 Gbit/s on a single fibre pair. Each fibre carries a maximum of 160 wavelengths, 80 in the C Band and another 80 in the L Band, that means 1.6 Tbit/s capacity per fibre and 3.2 Tbit/s capacity per fibre pair. Further capacity enhancements can be provided by a system upgrade to higher bit rates. Operation in either the C Band or in the L Band is also available. A smooth upgrade path exists from an 80 channel system, requiring only C Band components, to a 160 channel system, requiring the addition of the L Band wavelength spectrum. Standalone L band systems are particularly interesting for Dispersion Shifted Fibre (DSF) applications due to the higher chromatic dispersion in the L band. Fully integrated DWDM interworking with Siemens 10 Gbit/s SDH line systems is offered to reduce the number of costly network components. Alternatively, in combination with the SURPASS hiT 7540 (OCU), highly sophisticated transponder and consolidating multiplexer solutions are provided to accommodate many different vendor and service types, i. e. 2.5 Gbit/s/10 Gbit/s services, Internet Protocol (IP) services and Asynchronous Transfer Mode (ATM) services. The SURPASS hiT 7540 (OCU) can deliver up to 32 bi-directional 10 Gbit/s or 64 bi-directional 2.5 Gbit/s channels per 7-foot rack (and double that amount assuming back-to-back racks in one rack) for efficient integration onto the SURPASS hiT 7550 2.05 DWDM backbone network. Thus SURPASS hiT 7550 2.05 delivers substantial savings in floor space, operational costs (power consumption) and equipment procurement costs. The powerful combination of SURPASS hiT 7550 2.05 and the SURPASS hiT 7540 (OCU) provide the required optical networking building blocks for all applications.

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2.2
2.2.1

Applications
Network Applications
The following four NE types are used in the SURPASS hiT 7550 2.05 transport platform: SURPASS hiT 7550 Optical Transport Terminal (OTT) for 160 channel DWDM capability SURPASS hiT 7550 Optical inLine Repeater (OLR), providing powerful inline amplication of 160 channels - up to 160 wavelengths per bre in a unidirectional, twobre conguration (3.2 Tbit/s total bandwidth) SURPASS hiT 7550 Optical Add/Drop Multiplexer (OADM) which permits the extraction and insertion of channels at intermediate line amplier sites SURPASS hiT 7550 Channel Connection Unit (CCU) to built static or dynamic pass through or add/drop channel connections and thus to connect several OTTs and OADMs together. Depending on the wavelength band(s) used for transmission, there are three possible configurations for each NE type: C band C+L band L band standalone Possible NE configurations are shown in Fig. 4.11 through Fig. 4.14. For further details, refer also to Chapter "3.2 Functional Overview of the NE Types". Fig. 2.1 shows the basic structure of the SURPASS hiT 7550 2.05 optical network system.
100% OADM

OTT

ORL

OADM

OTT

CCU

OTT

OTT

up to 20% configurable add/drop

up to 100% add/drop or express channels

Terminal equipment OCR10G or SIEMENS SDH

Fig. 2.1

Basic Structure of the SUPRASS hiT 7550 2.05 Optical Network System

2.2.2

Compatibility with Existing Systems


The SURPASS hiT 7550 2.05 transport platform presents wide channel passbands for compatibility with multiple vendors 10 Gbit/s terminal equipment. In addition, it is compatible with the following Siemens solutions: Siemens 2.5 Gbit/s line systems (SL16, SLR16, WTTR) Siemens 10 Gbit/s SDH line systems (SL64)

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SURPASS hiT 7540 (OCU) with the following modules: - 10 Gbit/s TDM multiplexing transponder (TEX) combining 4 x 2.5 Gbit/s signals into one 10 Gbit/s signal - OCR 10 Gbit/s transponder SURPASS hiT 7540 c1.5 (former OCU c1.5): 2.5 Gbit/s transponder

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2.3

SURPASS hiT 7550 2.05 Features


This section consists of the following subsections: Transmission Functions Optical Supervisory Channel Optical Safety Mechanisms Optical Performance Monitoring & Control Optical Network Management Element Manager Connection to Network Management Systems EOW Interface User Data Channels (sV.11) Telemetry Interface (TIF) Overview of System Benets The following explanations to short terms would be useful for the understanding of some feature descriptions: ASE stands for (undesired) Amplified Spontaneous Emissions, they are generated in laser light sources and laser pump modules. OSAR is the abbreviation of the Optical Signal-to-accumulated-ASE Ratio. It can be seen as the optical signal power at the output of a particular NE (OTT Tx or OLRU or OTTU Rx) related to the "optical noise power" which has been accumulated up to this output. OSAR is an absolute value and is measured e. g. by means of the OPA module. OSAAR is the abbreviation of the Optical Signal-to-added-ASE Ratio. This calculated, relative value describes the degradation of OSAR along the optical link (between OTTU Tx and OTTU Rx). Preemphasis alignment is applied to equalize the OSAAR ratio of all express channels.

2.3.1

Transmission Functions
The SURPASS hiT 7550 system provides powerful and comprehensive control capabilities for all optical elements, ensuring optimized configuration at system start-up as well as superior stability and transmission quality when the network reaches its full running state with live traffic. Some control decisions depend only on local conditions (within the same NE), while others are based on extensive information exchanged among NEs. Information needed to control the optical path is communicated between NEs via the Optical Supervisory Channel (described below). Control capabilities include: Control of NEs during initial system start-up; pump lasers off-state for safety, upload and download of module information, initial equalization of transmit channel signal power, stabilization of line and module parameters (e. g., EDFA gain and output power), and correction of transmit input powers to achieve optimum OSNR and power distribution (pre-emphasis). After the network becomes fully operational, the system performs ongoing monitor duties for any required adjustments of the EDFAs (pump lasers, wavelength stability, output power, VOA and power tilt control, and automatic power shutdown).

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Technical Description (TED)

2.3.2

Optical Supervisory Channel


The Siemens SURPASS hiT 7550 2.05 offers a 2 Mbit/s optical service channel to provide communications between all SURPASS hiT 7550 NEs. This optical supervisory channel supports all network management communication for the configuration, fault management, performance monitoring, and software maintenance required to set up and maintain a DWDM system. The OSC provides both a 576 kbit/s DCCOo (OTS DCC Optical Transmission Section Data Communication Channel) and a 576 kbit/s DCCMo (OMS DCC Optical Multiplex Section Data Communication Channel). The DCCOo is terminated in every NE type, whereas the DCCMo only by the OTT and the OADM, much like the DCCm and DCCr in the SDH overhead. The OSC is a bi-directional channel whereby the same wavelength of 1625 nm is used for both transmission directions, each on a separate fibre as shown in Fig. 2.2. The OSC wavelength lies just outside the C Band of wavelengths, and is terminated at each SURPASS hiT 7550 NE. Therefore, even in the rare occurrence of an amplier failure, the OSC and hence all management communications remain intact.

Customers OSS Network Craft Terminal (NCT)

Local Craft Terminal (LCT)

Ethernet (Q3) OSS (Q) interface MCU


OSCTUT

Local (F) interface OSC (1625 nm) with DCCOo and DCCMo OSC (1625 nm) with DCCOo and DCCMo MCU
OSCTUI

OSC (1625 nm) with DCCOo and DCCMo OSC (1625 nm) with DCCOo and DCCMo

MCU
OSCTUI

OSC (1625 nm) with DCCOo and DCCMo OSC (1625 nm) with DCCOo and DCCMo

MCU
OSCTUT

OTTU

OLRU

OADMU

OTTU

Note: DCCOo is terminated at every NE. DCCMo is also terminated at every NE except OLRU. DCCMo is passed through each OLRU.

Fig. 2.2

The Optical Supervisory Channel The OSC channel is terminated on the Optical Supervisory Channel Termination Card Unidirectional (OSCTU). A major function of the OSCTU module is the digital processing of the bytes of the OSC (see also Tab. 2.1). The OSC is optically inserted into and extracted from the main DWDM traffic signal by a filter module on the Optical Line Interface (OLI) module, and then is sent optically to the OSCTU module where it is electrically terminated for digital processing. There are two variants of the OSCTU module, one for the terminal sites OTT called the OSCTUT, and one for the intermediate nodes OLR and OADM called the OSCTUI, which require two OSC terminations, one each for the line side 1 and the line side 2. The OSCTU has other important functions other than just OSC byte processing (see also Chapter 3.3.6).

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OSC bytes 0 to 31 0 G.704 basic frame CRC- 4 multiframe Sa4 bit used for timing marker CRC- 4 checksum used for EXC, SD A bit: optical link RDI bit Sa7 bit used for APSD signaling Sa8 bit used for direction Id

Contents

1 to 9 10 to 18 19

DCCOo: data communication channel of the optical transport section layer, 576 kbit/s DCCMo: data communication channel of the optical multiplex section layer, 576 kbit/s E0: engineering order-wire channel, 64 kbit/s In OTT: EOW channel (E0 or F0) is permanently connected to the EOW conference. If E0 is connected to the EOW conference, F0 can be used as data channel. In OLR, OADM: EOW channels (E0 or F0) of both OSC (A and B) are permanently connected to the EOW conference. If E0 of OSCA and OSCB are connected to the EOW conference, F0 of OSCA and OSCB can be applied as user data channel (passed through or connected to sV.11 interfaces). Configurable 64 kbit/s OSC user data channel connection to one out of two sV.11 interfaces F0: engineering order-wire channel and sV.11 channels; NU1, NU2: user data channel OTS trace identifier OSC channel status information Optical link control CRC check for link control information

20/21/22

23 24 to 26 27 to 30 31

Tab. 2.1

OSC Byte Mapping

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2.3.3

Optical Safety Mechanisms


With the high powers being emitted by today's optical amplifiers and pump light sources Siemens recognizes that safety to all users of DWDM equipment from harmful light emission is an important issue. The SURPASS hiT 7550 2.05 Erbium Doped Fibre Amplifiers (EDFA) produce power outputs of up to +23 dBm, which means they fit into Laser Class 3B (< +27 dBm or 500 mW) according to relevant ETSI standards. The Raman pump output power also has a maximum of +27 dBm which means it is also placed into Laser Class 3B. For this Laser Class there must be controlled access to rooms containing this equipment, and a mechanism to reduce the output power to Class 1 levels (< +10 dBm or 10 mW) at all open optical connectors. Due to the implementation of reliable Automatic Power Shutdown (APSD) and Automatic Power Reduction (APR) algorithms, Siemens ensures that during normal equipment operation Laser Class 1 is achieved. This applies for normal running traffic, link set-up, fibre break or amplifier/laser defects. During fibre breaks, the shutdown of all high power outputs must be achieved within 3 s. With subrack covers equipped, as is standard equipment practice, Laser Class 1 is satisfied, as no light is expected to be emitted from within the subrack. It also is not possible for the customer to disable the Automatic Power Shutdown functionality for obvious safety reasons.

2.3.3.1

Automatic Power Shutdown Procedure


There are several situations in which the amplifier pump lasers and the Raman pump lasers are shut down, the main being due to fibre breaks in the line between any two SURPASS hiT 7550 2.05 NEs, be they OTTU, OLRU, or OADMU. Each SURPASS hiT 7550 2.05 optical amplifier is equipped with the Automatic Power Shutdown (APSD) and automatic restart capability. If the input power of an amplifier drops under a predefined power threshold, the pump lasers in one amplifier section are switched off. They are restarted again if the input power reaches a certain minimum power threshold for a certain time. Fig. 2.3 shows a C Band SURPASS hiT 7550 2.05 DWDM link with Siemens 10 Gbit/s transponders providing the individual channel traffic signals. In this scenario the line fibers are intact and a special bit in the OSC, the APSD bit is set to 0, or o.k., in each direction of each link.

Normal Operation
OCR10G OTT OLR
APSD bit = 0

OADM

OTT

OCR10G

APSD bit = 0

Fig. 2.3

Typical C Band SURPASS hiT 7550 2.05 DWDM Link with No Fibre Break If at any site with an OTT/OLR/OADM, there is a fibre break on the fibre carrying the incoming signal, then this line input will detect a loss of signal (LOS) of both the DWDM traffic signal AND the Optical Supervisory Channel (OSC). In this case the fibre break

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triggers the shutdown of the pump lasers of the inline amplifier (or preamplifier) in the same direction AND of the inline amplifier (or booster amplifier) in the counter direction. Hence the traffic signal in this counter direction is shut down and at the same time, the APSD bit in the OSC in this direction is set to 1 to indicate an active APSD which is then received by the next neighbouring NE, as can be seen in Fig. 2.4 below as an example. A loss of the OSC may mean one of the following: actual loss of OSC signal power, loss of the OSC clock or the APSD bit in the OSC overhead is active. The APSD bit is used to indicate to the neighboring NE in the counter direction that an APSD has occurred in this NE. The use of the APSD bit is also shown in Fig. 2.4. The OSC is never switched off as it is only Laser Class 1 which has no special safety requirements.

Single Fiber Break


OCR10G OTT OLR
2

OADM
APSD bit = 1

APSD bit = 0

OTT

OCR10G

APSD bit = 0
4 ALS 1 APSD

APSD bit = 0
3 APSD 5 ALS

Fig. 2.4

Typical C Band SURPASS hiT 7550 2.05 DWDM Link with a Single Fibre Break between OLR and OADM To complete the full shutdown process of this optical section, the other connected NE in the faulty section detects a loss of signal of the DWDM traffic and an active APSD bit which in turn triggers an APSD of it's inline amplifier in this signal direction, and in the counter direction. Hence it is no longer possible that high power laser light is active anywhere in this section. As the APSD shutdown of one amplifier in a link leads to the successive loss of input signal (LOS) detection of all other amplifiers in the forward signal direction, the end terminal equipment at each end will eventually detect a LOS for it's individual channel signal and perform an Automatic Laser Shutdown (ALS) in the reverse direction. Hence the shutdown of all individual channel transmitters is complete. Note, that due to the individual implementation of APSD and ALS mechanisms in SURPASS hiT 7550, the Line Terminal Equipment is not required to have it's own ALS mechanism to ensure safe optical levels in the SURPASS hiT 7550 domain. However, at the SURPASS hiT 7550 tributary interfaces, where optical channel power levels are Class 1 only, individual channel ALS is still the responsibility of the end terminals. Once the fibre break is repaired, and the OSC is detected again (with APSD bit set to 0 as can be seen in Fig. 2.4), all of the amplifier pumps are able to be switched on. The synchronized Automatic Laser Restart (approx. 9 s laser on) at the 10 Gbit/s terminal equipment provides an input signal to the first booster amplifier in the OTT which is now ready for service, enabling all amplifiers in succession to begin carrying traffic again.

The fact that both the loss of the main traffic signal and the OSC signal is used to trigger the automatic power shutdown of the signal in the opposite direction ensures that in the case of a faulty OSC connection, there is no shutdown of a live and running main traffic signal.

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2.3.3.2

Automatic Power Reduction


Demux surveillance takes place in OTT and OADM network elements. It includes the supervision of all internal connections between the OLI preamplifier output and OD(A) resp. EAM4 module inputs. In case of fault, the automatic power reduction (APR) will act in order to keep the system running with limited power. APR in the OTT The APR becomes active if at least one subband connection between OLITP and OD(A) modules fails. If an OD(A) module receives no signal from the OLITP module, the OLITP module reduces the power to class 1M (APR). If a signal is detected again at each OD(A) module, the OLITP module releases this power reduction. APR in the OADM The EAM4 module supervises all subbands, including the subbands which are dropped via OD(A) modules. Every active OD(A) module sends an APR-telegram to its related EAM4 module in case a subband loss is raised or cleared. The EAM4 module collects the information from the OD(A) modules and decides (based on the currently configured channel status) if APR has to be set or cleared. On EAM4 modules, signals from monitor diodes for all four subbands are used to compare the power level of the relevant input with the channel status of the corresponding channel group, as they are periodically reported by the OSCT module. If the measured power level for at least one channel group does not indicate light, where light is expected according to the channel status (i.e. at least one of the 20 channels of one group has the channel state OK), then an APR command is sent from the EAM4 module to force power reduction at the corresponding OLI preamplifier module. APR is released, if the measured input power corresponds to the expected channels again.

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2.3.3.3

Additional APSD/APR Safety Mechanisms


It is not only breaks in the line fibre which result in the automatic power shutdown of the OLI pumps. Additional safety mechanisms are implemented in SURPASS hiT 7550 2.05 to ensure that there is no way a user can become exposed to high power light energy. These extra APSD mechanisms are detailed in the list below. OLI interstage APSD Each of the three amplifier stages sensing a LOS at it's input will go into APSD state and shutdown it's pump lasers independently. This results in the shutdown of the optical signal in the forward signal direction. If the input power level at the input of the 3rd EDFA stage of an OLI module, where the DCM interstage device resides, decreased below a certain threshold, then the output power of the 2nd stage EDFA is reduced. The Raman pump will be switched off if no OSC is received (i. e. in case of LOS, LOF, EXC, APSD bit = 1 or OSC LOS). The Raman pump is switched on again, if it receives the 2 MHz spectral line from OSC and if the APSD signal from the OLI module is cleared. OTTU: In the L band a missing signal at line preamplifier OLITPUL triggers APSD at the booster amplifier OLITBUL. OADMU: Like for OTTU but APSD is triggered for the OLITBUL at the same NE side / other direction. OLRU: In the L band a missing signal at port 1 of the line amplifier OLIIUL triggers APSD at the line amplifier OLIIUL. at the same side / other direction. The output cable of the L-band optical line amplifier is also optically monitored via a duplex cable. If connection is lost the corresponding L-band amplifier is shut down. Similarly the connection between the OLI Pump modules and the OLI modules is monitored electrically by an electrical cable within the optical cable, and the Pump A, B or C module is shut down if the connection is open. See Chapter 2.3.3.2.

OLI interstage device surveillance

Raman Pump surveillance

L Band amplifier surveillance

OLI Pump surveillance

Demultiplexer surveillance OLI module Equipment An equipment failure of the OLI module results in an APSD of Defect the pump lasers on this module. In this case, no automatic restart of the amplifiers is allowed and therefore not performed. After fault rectification a new link startup via software must be performed.

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2.3.4

Optical Performance Monitoring & Control


SURPASS hiT 7550 2.05 guarantees an exceptional level of signal performance, an End of Life (EOL) Bit Error Rate (BER) of 10-13 (default) or better for all optical channels per optical link. To achieve this level of quality a certain Optical Signal to Noise Ratio (OSNR) must be met, which depends on whether Forward Error Correction (FEC/EFEC) techniques are required or not. SURPASS hiT 7550 2.05 implements numerous optical configuration, control and maintenance tools to facilitate the bring up of an optical link, and the continued smooth operation of the link during it's life-cycle. How exactly SURPASS hiT 7550 2.05 does this is described in the following sections: Optimal EDFA Gain Setting and Fast Gain Control EDFA Output Power Control (Slow Gain Control) Power Equalization EAM4 Adjustment Client Signal Ageing, Drop Control, Add Channel Constant Pump Current Control Tilt Analyzer and Adjustable Filter ASE Correction Link Control Actions Channel Up- and Downgrade Optical Layer Provisioning Optical Layer Supervision Optical Performance Analyzer

2.3.4.1

Optimal EDFA Gain Setting and Fast Gain Control


Each amplifier (OLI) is designed to have an optimum gain flatness over the entire wavelength spectrum for a particular value of total amplifier gain. Note that the gain of an amplifier (in dB) is just the difference between the total output power and the total input power of the amplifier. In order to keep the EDFAs operating at a particular optimum gain point, but meanwhile still being able to allow a wide range of span losses (up to 32 dB without Raman amplification, and up to 40 dB with Raman amplification), a Variable Optical Attenuator (VOA) between the first and second EDFA stage is used. By adjusting this VOA, the overall optimum gain of the three EDFA stages can be set during link provisioning. Adjusting the VOA also effects the tilt setting (see Chapter 2.3.4.7). A fast digital control loop is implemented to keep this gain value constant during any type of overall system transient behavior. This ensures that even abrupt changes in input signal power, such as caused by channel losses or return of one of the signal lasers, will not cause optical surges in individual channels, on the contrary, the output power of each channel remains constant.

2.3.4.2

EDFA Output Power Control (Slow Gain Control)


Based on the number of channels equipped in the DWDM system and the required EDFA output power per channel, the total output power of an EDFA can be determined. This total EDFA output power is kept constant via a slow output power control loop, to compensate for degradations or fluctuations in the fibre attenuation and for ageing of laser sources (e. g. on the OCU equipment). Hence, the physical changes in fibre properties over the years will have no influence on ongoing system performance. If a change of the total EDFA input power is due to the addition or loss of channels, then the value change of for the number of equipped channels causes a re-calculation of the

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expected total output power of the EDFA. The slow output power control loop will then start regulating the EDFA output power based on this new, calculated value.

2.3.4.3

Power Equalization
The output power of the single channel signal transmitters is expected to vary from channel to channel by several dB, depending on manufacturer and individual variations. Signal power equalization (PEQ) is used to achieve nearly equal power values for all channels at the beginning of the link (at the booster input of the OTT-Tx) for a defined power distribution at link startup. This is initialized by an element manager command (power equalization) for the OTT-Tx. The OSCT module requests the mean per channel output power from the OLITB module the mean insertion loss (depends on the use of interleavers in the optical path) of all 8 subbands together with the OM module of one band all channel input powers from the OM modules of the respective band (C or L). Then the OSCT calculates the optimum VOA values for all present channels to get a spectrum as flat as possible. The maximum allowed channel power deviation (gain tolerance) is configurable by the operator.

2.3.4.4

EAM4 Adjustment
Power levels of subbands which are connected through the EAM4 modules are adjusted via VOAs for equal power distribution. Subbands which are terminated on OD(A) modules are not connected through the EAM4 (their EMA4 VOAs are set to minimum attenuation). This link control in the OADMU is done separately for C and L band and for each direction and is started at the element manager either as EAM4 automatic adjustment (measured by OPA and handed over to OSCT) or as EAM4 manual adjustment (each four power measurements have to be done). EAM4 adjustment can be started in linkstate running: the EAM4 module selects one subband as reference and adjusts the EAM4 VOAs of the other subbands with respect to the value of the reference. The adjustment can be performed for still empty subbands, but it has to be repeated every time a subband is populated with the first channel. Every time an EAM4 adjustment was performed, a tilt correction cycle for this band and direction must be started at OTT-Tx.

2.3.4.5

Client Signal Ageing, Drop Control, Add Channel


To counteract the effect of ageing client transmitters so as to have no impact on the total DWDM link performance, SURPASS hiT 7550 2.05 continuously monitors and adjusts the input power of each individual channel at the SURPASS hiT 7550 2.05 multiplexers. The allowable customer input signal range is a reference value adjustable between +2 dBm and -8 dBm (defined by the Siemens planning tool) with a tolerance window of +/-4 dB (EOL). SURPASS hiT 7550 2.05 adjusts this value per channel by means of Variable Optical Attenuators (VOAs) to get the optimum channel input power. Fluctuations in client signal input power are regulated via decreasing or increasing the VOA setting.

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If the client signal does not meet the input range requirement this channel is excluded from transmission and an alarm is raised at the network management system. Likewise, if the VOA cannot be adjusted correctly to meet the optimum input channel power calculated by the system. Client signal ageing is not only controlled at the OTTU terminal sites, but also at the OADMU add/drop interfaces. The VOAs at the Add Channel and Drop Channel interfaces (CAD2) also perform signal ageing/drop control to reach a particular input power (see above) and output power (-8.8 dBm +/- 2.0 dB) window. Appropriate alarms are activated when the client signal powers do not meet the specified ranges. Aging and drop control is performed every two minutes in the condition linkstate running. During all channel affecting link control actions (i.e. preemphasis, add channel adjust) the aging and drop control is stopped.

2.3.4.6

Constant Pump Current Control


The output power of all laser pump sources is controlled by adjusting the respective bias current of each laser. All on board OLI pumps, and external OLI pumps (i. e. PUMPA/B/C), as well as Raman pumps have a constant pump current control circuit to maintain the correct pump output power. Alarms are raised if these pump currents reach certain dangerous thresholds, ensuring the safety of the system, and the early detection of faulty hardware. The OLI pump currents are adjusted by the slow Output Power Control loop in order to slightly change the actual amplifier gain values due to slight fluctuations in span losses. The Raman pump currents however are always set to a fixed optimum value, hence a constant output power of the Raman pumps is maintained.

2.3.4.7

Tilt Analyzer and Adjustable Filter


The OLI module includes an adjustable tilt filter (in the standard and extended module versions) which is used to compensate for tilts in channel powers caused by the Stimulated Raman Scattering (SRS) non-linear fibre effect, fibre spectral attenuation, DCF SRS tilt or DCF spectral attenuation. The tilt effect in the optical signal can be viewed with an optical spectrum analyzer as a decreasing power tilt from channels of higher frequency (lower wavelength) to those of lower frequency (higher wavelength). The tilt filter controls the optical tilt locally (Gain Tilt Control, GTC), based on measurements of the channel powers and channel distribution at the output of the OLI. For all OLI module types a GTC pretilt may be entered, defined by the Siemens planning tool. In the extended type OLI module, output parameter readings are done by a Gain Tilt Monitor (GTM) on the module itself. The GTM continuously monitors the current optical spectrum at the output of the extended type OLI modules. Changes in channel numbers or mean channel powers detected by the GTM require adjustments of the tilt filter. Another way in which SURPASS hiT 7550 2.05 guarantees a flat output spectrum at the end of each optical link. In basic type OLI modules tilt settings are performed via the VOA element, because there is no tilt filter control and no gain tilt monitor.

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2.3.4.8

ASE Correction
The correction of the Amplified Spontaneous Emission (ASE) is the enhancement of the required linear total output power. It is done by any OLI module in the optical path. However, a reduction of the ASE correction is required, if the ASE accumulation in the optical path is interrupted (e.g. due to automatic power shutdown in the optical line preamplifier of the OADM). The reduction of the ASE correction is processed for each EDFA band separately (band specific updates). The accumulated ASE power is calculated by the Siemens tool and must be configured for each OLI module in the link. The correction value or the default value is transmitted downstream via OSC.

2.3.4.9

Link Control Actions


The Link Control of SURPASS hiT 7550 2.05 is a high sophisticated state machine. From each particular state the system may be switched in order to perform special tasks within the link. For example when the link is in state "running" all amplifiers are working and the link is carrying traffic. The user only via a link control action can initiate link state changes. The possible link control action depends on the current link state. Some state changes are temporarily (transition link state) and other states are statically (final link state). This chapter describes all link control actions that can be initiated via the Network Management System (NMS). It also describes the link state transitions, which belong to the several actions. For detailed description of how - and when to use the several link control actions refer the chapter "standard commissioning procedures" of the ITMN.

Action Forced prestart

Initial link state

Transition link state --

Final link state

Running or prestart
Description

Prestart

SW and HW is initiated and checked by self-tests. All lasers (excepted the OSC lasers) are switched off. CAUTION: This action will shut down any running link!

Action Power equalization

Initial link state

Transition link state

Final link state

Prestart
Description

Power equalization

Prestart

Input signal from all client lasers are equalized in terms of power. Each particular channel power is adjusted by VOA on the multiplex side in order to achieve optimum input power on the first amplifier input of the link.

Tab. 2.2

Link Control Actions

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Technical Description (TED)

Action Link startup

Initial link state

Transition link state

Final link state

Prestart
Description

Startup

Running

It sequentially sets up all SURPASS hiT 7550 2.05 NEs in transmit direction. All pump lasers are switched on and the EDFA target output power is set. 20% OADM: While the link state "startup" the basic sub bands C3C4 are adjusted in terms of power to reach optimum input power on the booster of the OADM. Attenuation of all other sub bands is calculated relatively to these basic bands and adjusted accordingly. This procedure is only performed during the very first link startup. It is required to run always a further "EAM4 Adjust" in order to re-adjust the sub bands between each other with high accuracy. NOTE: Once the sub bands on the OADM are being adjusted this particular procedure for the 20% OADM is skipped automatically.

Action Preemphasis (manual / automatic)

Initial link state

Transition link state

Final link state

Running

Preemphasis

Running

Description The individual channel power is adjusted in order to achieve an optimum and balanced spectrum. The process involves measuring power and OSAR at the begin and at the end of the optical link (Tx and Rx side) with an Optical Spectrum Analyzer (OSA) or the optional integrated Optical Performance Analyzer (OPA) of the SURPASS hiT 7550 2.05 system. INFO: SURPASS hiT 7550 2.05 performs preemphasis adjustments only on "express" channels. Manual preemphasis adjust: Supported by manual measurements with OSA, OSAR and power measurement have to be performed for each channel at the begin and at the end of the link. The results have manually to be entered into the system via TMN/LCT. Automatic preemphasis adjust: The automatic adjust requires OPA modules at both sides of the link. Measurements and the following adjustments are automatically performed by the system itself. Depending on the measurement values the system automatically decides between different adjustment algorithms:

Tab. 2.2

Link Control Actions (Cont.)

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Information SURPASS hiT 7550 2.05

Preemphasis (continued)

OSAAR Balance is performed if only the 100 GHz grid is populated with channels and the measured OSAR values of all express channels are 26 dB or less. In this case each particular channel is being adjusted in order to suffer the same amount of OSAR within the link. However the Tx Power Balance is performed if only the 100 GHz grid is populated with channels and the measured OSAR values of all express channels are greater than 26 dB. In this case the transmit spectrum is being adjusted to equal power within all channels. As soon as at least one channel is present within the 50 GHz grid only the Power Interpolation is performed. All power values of the express channels within the 50 GHz grid are adjusted by interpolating the channel power between their next adjacent 100 GHz express neighbours.

Action Add channel adjust (manual / auto)

Initial link state

Transition link state

Final link state

Running

Add channel adjust

Running

Description Channels which are added/dropped at an OTT or at an intermediate 20% OADM are locally treated with the add channel adjust procedure at that NE where the channel is being added. The adjustment procedure is based on the measured power spectrum at the transmitting amplifier. Manual add channel adjust: All channel powers of the transmit spectrum have to be measured with an external OSA and the results have to be entered into the system via NMS/LCT. Automatic add channel adjust: All channel powers of the transmit spectrum are queried via the integrated Gain Tilt Monitor (GTM) of the amplifier module and all add channels are automatically being adjusted. This procedure requires an extended type OLI module at the transmit side since only the extended type OLI module is equipped with GTM.

Action Tilt adjust

Initial link state

Transition link state

Final link state

Running
Description

Preemphasis

Running

Gain and tilt values of each amplifier module will be measured and corrected to achieve a correct and flat power spectrum at the input of the next following amplifier within the link. At the extended type OLI module the GTM provides power tilt data from the output of the amplifier and sets the Gain Tilt Control (GTC) respectively the inline VOA between the first two EDFA stages.

Tab. 2.2

Link Control Actions (Cont.)

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Tilt adjust (continued)

At the standard and the basic type OLI modules, the module itself calculates the tilt settings from the RAMAN coefficient, from the fiber tilt parameters, and from the current gain. It accordingly sets GTC (only standard type OLI module) and inline VOA. NOTE: There is no continuous tilt adjust within the amplifier modules. Tilt adjust must always be initiated by user.

Tab. 2.2

Link Control Actions (Cont.)

2.3.4.10

Channel Up- and Downgrade


In the linkstate running single channels can be added to or removed from transmission. The channels can be added at OTT-Tx or OADM. In OTT-Tx, the attribute channel usage must be different from 'unused' as precondition for channel upgrade. Channels which are routed directly from OTT-Tx to OTT-Rx must be configured with channel usage express at OTT-Tx. These channels are controlled from OTT-Tx via preemphasis. Channels which can be added and / or dropped at an OADM are signalled as addDrop channels to OTT-Tx. These channels are controlled at their local add NE via add channel adjustment.

2.3.4.11

Optical Layer Provisioning


A high degree of flexibility in the provisioning of optical parameters enables SURPASS hiT 7550 2.05 to deliver the promised optical system performance and control in all customer network applications. The following parameters are user provisionable via the network management system: Required EDFA channel output power, depending on network dimensions, maximum number of channels, bre type, use of FEC/EFEC, and use of Raman ampliers Optical OMS path and optical channel OCh inventory information Enabling and disabling of all pump lasers Conguration of client Tx input channel powers via VOA adjustment Conguration of Raman coefcient Fibre attenuation spectral tilt and ASE power Congurable alarm thresholds for signal degraded SD (at OLIP and OLII inputs), input power too high PHF or too low PLF alarms (in receive direction for OM20 and CAD2 add-port, in transmit direction for ODA20 and CAD2 drop-port), OSC signal degrade Optical link management via commands such as: power equalization, optical link startup, preemphasis.

2.3.4.12

Optical Layer Supervision


SURPASS hiT 7550 2.05 also offers the possibility of requesting all the important optical system parameters from the Network Management System at any time. With the inclusion of the Optical Performance Analyzer (OPA, see Chapter 2.3.4.13), full optical performance monitoring and recording of the DWDM signal parameters is offered.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

Without the OPA the following optical parameters are supervised: Input power of each individual client channel Current insertion loss of each channel input VOA Output power of each individual client channel Total input and output powers of each preamplier, booster amplier or inline amplier Pump currents for all OLI pump sources (on board and external) and Raman pumps OSC laser current for the OSC channel Current number of actually equipped channels in each OLR/OTT/OADM, in each direction Current state of each amplier's pump lasers, i. e. enabled/disabled Optical OMS path and optical channel Och inventory information Current value of tilt lter in each amplier Current actual signal tilt in each amplier

2.3.4.13

Optical Performance Analyzer


See Chapter 3.3.8 also. The Optical Performance Analyzer (OPA) module is an integrated Optical Spectrum Analyzer (OSA) card which can be slotted into the SURPASS hiT 7550 2.05 subrack like any other module. The OPA offers full optical performance monitoring features, and is comparable to SDH/SONET performance monitoring in terms of record handling. It enables the carrier to monitor the optical link to the highest level of detail and accuracy, to help in system maintenance and fault analysis. As well as the performance monitoring capability, the OPA may be used for optimizing the transmission of optical signals. It is used to automate the preemphasis procedure; for this OPA modules are required at both, the link start and the link end. OPA is also applied to control the addition of channels at terminal and OADM sites. When live traffic is running, the OPA samples several optical inputs and collects performance measurement data. The number of optical input scans depends on the NE type: At a SURPASS hiT 7550 2.05 terminal site (OTTU), the preamplier output and the booster amplifier output are measured (a total of 4 interfaces when both C and L band amplifiers are considered).

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Technical Description (TED)

OTTU

OLITBUL

OLITBC

LINE

OPA

MonL2 MonC2 MonC1 MonL1

OLITPC LINE OLITPUL

Fig. 2.5

Optical Performance Analyzer (OPA) in the OTTU, Monitoring Points

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

At an Optical Add/Drop Multiplexer site (OADMU), the preamplier outputs and the booster amplifier outputs are measured (a total of 8 interfaces when both C and L band amplifiers, in both directions are considered). See Fig. 2.6.

OADMU

OLITBUL

OLITPUL

LINE

OLITBC

LINE OLITPC

Side 2

MonL1 MonC1 MonC4 MonL4

OPA

MonL3 MonC3 MonC2 MonL2

Side 1

OLITPC LINE OLITPUL

OLITBC LINE

OLITBUL

Fig. 2.6

Optical Performance Analyzer (OPA) in the OADMU, Monitoring Points

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Technical Description (TED)

Four inputs are monitored in the OPA module at an Optical Line Repeater site (OLRU): the C band and the L band in both transmission directions (corresponds to a maximum of 320 channels) are monitored at the output of the optical inline ampliers. OPA module and Raman amplifier use the same slot. Therefore only one of these may be equipped.

OLRU
OLIIUL

LINE

OLIIC

LINE

MonC1

MonL2

Side 1
MonL1

OPA
MonC2

Side 2

OLIIC LINE LINE

OLIIUL

Fig. 2.7

Optical Performance Analyzer (OPA) in the OLRU, Monitoring Points

OPA is used to get optical performance information on a per channel basis. Every 15 minutes (beginning on the hour) and every 24 hours, the following optical performance data is measured and recorded: Minimum, average and maximum carrier power (dBm) Minimum, average and maximum carrier OSNR Minimum, average and maximum measured carrier frequency (GHz) Measurement sample size: The number of samples used to compute each minimum, average and maximum value Loss of Light (LOL) count: The number of times a LOL is detected for this carrier It is possible to request the following accumulated records: The current and previous 15 minute performance management records The current 24 hour summary as well as summaries for each of the 7 most recent days The most recent eight hours, where the values are specied in 15 minute interval records, i. e. 32 x 15 minute records Actual snapshots of measurement data, described above.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

2.3.5

Optical Network Management


The Siemens Optical Telecommunication Network Management System which serves it's complete Optical Telecommunication Product Portfolio, today and well into the future, is called TNMS (Telecommunication Network Management System). Being a truly recent development, the TNMS is able to offer state-of-the-art computer architecture and graphical user interface innovations.

2.3.5.1

The Telecommunication Network Management System


The Telecommunication Network Management System (TNMS) composed of TNMS Core and TNMS CDM (Cross Domain Manager) is the Siemens Management Solution designed for the needs of metropolitan and regional transport networks as well as for long distances within national or international networks. TNMS Core/CDM supports PDH, SDH and DWDM NEs in core and backbone application scenarios as service layer, network layer, and element layer management with the TMN (Telecommunications Management Network) Model. This system can be scaled within a wide range to give customized network management solutions. Special end-to-end connection management procedures with automatic and manual routing over the entire network allow quick service provisioning and monitoring in a user-friendly way. TNMS Core can be combined optionally with TNMS CDM to manage extremely large Siemens networks. TNMS CDM is related to the Network Layer and Service Layer, whereas TNMS Core additionally supports the Element Layer. Each TNMS Core can support several network servers with a maximum of about 1400 SMA 1 equivalents and more. (SMA 1 equivalent means the performance of an SDH STM-1 add/drop multiplexer.) A TNMS CDM can support up to 20 TNMS Core Servers. This hierarchical architecture leads to a flexible and scalable management system. The TNMS Core/CDM supports the management of a large variety of Siemens DWDM, PDH and SDH equipment such as: TransXpress Innity MTS 1.1E and MTS-R2.03 SURPASS hiT 7550 2.05 SURPASS hiT 7540 (OCU) with TEX, and OCR Siemens PDH Access equipment (e. g. FMX / CMX V2, SRA L) Siemens SDH equipment; cross-connects (SXA/SXD), synchronous multiplexers (SMA, SMA 1K, SMA 16), synchronous line equipment (SLT/D 16, SLR 16, SL64) Siemens Radio NEs The TNMS-Core/CDM system is designed to run on IBM compatible PCs on Windows 2000 Operating Systems (Microsoft Corporation).

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Technical Description (TED)

2.3.5.2

Integrated Domain management


Siemens is an active member of the Telemanagement Forum (TMF), which consists of a growing number of Telecommunication industry leaders who have defined a standard multi-vendor NML/EML management interface, which is CORBA based. The work of the TMF is currently being integrated into ITU standardization activities in the area of optical telecommunication network management. The TNMS-Multi-Vendor Management Platform (TNMS-MVM) extends the capability of TNMS-Core/CDM to allow true Multi-Vendor interworking for Optical Telecommunication Networks, by providing a standardized CORBA Interface. This enables the operator to manage optical telecommunication network products from several suppliers, from the same network management platform.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

2.3.6

Element Manager
As is standard for all Siemens Optical Networking Products, SURPASS hiT 7550 2.05 comes with an Element Manager (EM). The EM as an application program is part of the software packet for the TNMS Craft Terminal, designed to run on IBM compatible PCs on Windows 2000 Operating Systems (Microsoft Corporation) which can either be used for local commissioning or maintenance operations just for one NE, or can be used for remote commissioning or maintenance operations of a relatively small DWDM network (approx. 50 NEs). A sample window of the SURPASS hiT 7550 2.05 Optical Terminal OTTU is shown in Fig. 2.8.

Title bar Menu bar Tool bar

Module View

Message Area Status bar Fig. 2.8 Element Manager Main Window (Example: OTTU Network Element, Subrack 1)

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Technical Description (TED)

TNMS Craft Terminal Using the EM application program for SURPASS hiT 7550 2.05 requires the TNMS Craft Terminal (TNMS CT). It is a transparent software platform for SDH and WDM network elements and provides access to network elements via a network interface: Q interface via 10BaseT Ethernet, supports the OSI protocol (in a later release also the TCP/IP protocol) or via a serial line interface: Q-F interface (RS232), supporting the TCP/IP protocol (see Fig. 2.10 also). TNMS CT offers two operation modes: the Network Craft Terminal (NCT) mode: can be used for remote login, displays a network view of all NEs, SDH and DWDM, and their current alarm status as shown in Fig. 2.9. Double-clicking on an NE item will open the EM application for the particular NE (i. e. a window as shown in Fig. 2.8), and thus permits the network element to be operated and alarm lists to be displayed. the Local Craft Terminal (LCT) mode: serial line or Ethernet connection to NE(s). Up to three NE windows may be displayed at a time. To show alarms of an NE, an element manager session with this NE has to be started, selecting the option for serial connection from the menu. With Ethernet connection the LCT or NCT may display up to 150 NE icons. The NCT mode offers several additional functions to the LCT mode (e. g. fault management). NCT and LCT modes need separate licenses and installations.

Menu bar Tool bar Network View

Working Area Minimized Windows

Status bar Fig. 2.9 TNMS CT Graphical User Interface

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

2.3.7

Connection to Network Management Systems


SURPASS hiT 7550 2.05 provides control via Q3 interface. It supports the Q3 information model, which describes the behavior between interface partners like OSS and an NE. The Q3 information model uses specific management application protocols, namely CMISE/CMIP (OSI protocols), which allow communication between the Network Management System (NMS) and an NE, via the implemented communication stacks. This is explained more detailed in the following subsections: Information Models Communication Stacks Communication Interfaces See also Chapter 3.6.

2.3.7.1

Information Models
The information model is the behavior description of a system. It shows the existing entities, how they interact and how to control them. Information models are described in formal languages. Between interface partners (like OSS and NE) they can be regarded as communication treaty. The information models use specific management application protocols which have to be bidirectionally transported via communication stacks from a OSS to the NE and back. There exist several application protocols: Q3-CMIP The Q3 information model is based on ITU recommendations X.721 and M.3100. The corresponding service and application protocol is CMISE/CMIP (ITU X.710/X.711). It allows connection of the NE to an OSI Q3-CMISE compliant Telecommunication Management System (OSS). The OSS may be provided by the customer. Also the Network Control Terminal (NCT) can manage the NE via Q3-CMIP. The NCT is a Windows PC running an application program which can be used for commissioning and maintenance operations.The NCT PC can act as a simple Element Manager for small clusters of NE units. The Q3-CMIP implementation of the NE operates on top of an OSI upper-layer stack (Marben stack) providing e. g. association/presentation and session services. Alternative lower transport layers are possible. TL1

TL1 application is not supported in the current release.

Web Terminal

The Web terminal is not supported in the current release.

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Technical Description (TED)

2.3.7.2

Communication Stacks
IP stack and dynamic routing in IP (OSPF) are not supported in the current release.

OSI Stack (Marben OSIAM Stack) The Marben OSIAM stack provides the OSI/ISO upper layers (session, presentation, ACSE) and access to/from the application (CMIP agent). The upper OSI layers can either use transport class 4 (TP4) services based on CLNP with ES-IS and IS-IS as the routing protocols or transport class 0 (TP0) services based on the TCP/IP stack (with IP to NSAP address mapping). For routing purposes of CLNP packets the ES-IS (for end system and router detection) and IS-IS (for dynamic route detection and update) are used. Routing takes place over the Ethernet and DCC interfaces, if so configured. TCP/IP Stack The TCP/IP stack for the NE is delivered with a real time operating system of the NE and can be used directly by telnet and http or indirectly by the OSI stack by means of RFC1006. For routing purposes either static route configuration or dynamic routing are possible. End system (host) detection is accomplished by the ARP protocol for Ethernet. For dynamic routing, route detection and the update of the OSPF (continuous evaluation of route parameters) is used. Routing takes place over the Ethernet and DCC interfaces, if so configured. Stack Management (MCF) The communication stacks of the NE are called message communication function (MCF) in ITU terminology. Certain configuration and performance parameters of the communication stacks are modeled in Q3 and can thus be managed. For the OSI part these are parameters concerning the layers 2 (DCC, MAC), 3 (NSAP, ES-IS, IS-IS) and 4 (TP4), for the TCP/IP part they are concerning IP (address, routing tables), TCP (connection table) and OSPF (basic parameter set). The Q3 information model of the TCP/IP stack parameters is aligned to the corresponding SNMP specifications as far as possible.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

2.3.7.3

Communication Interfaces

OSS Q3 on COPA

NCT/LCT Q3 Q-F RS 232 on NEAP Ethernet Rack Alarms

PCB_2

AUI/10baseT 10baseT High Level System Controller DCC PCB_1 CAN-bus

SPI power LCC LCC card SMU LCC card LCC supervisor/ DCC EEPROM passive cards LCC

SPI

LCC card

SMU

extension subrack

EOW, sV.11 dry loop contacts

main subrack

Fig. 2.10

Communication Interfaces and Controller Architecture of SURPASS hiT 7550 2.05

SURPASS hiT 7550 2.05 uses a two-level control hierarchy (see Fig. 2.10): A high level system controller, which serves as gateway for the system, implements the MCF function, the Q3 stacks and the Q3 agent. It performs the complete processing of the Q3 object model and supports the central system functions. A low-level card controller (LCC) on each active card which performs the necessary on-card functions. In extension subracks, a shelf management unit (SMU) as a simple LCC provides limited supervision for the subrack. Passive cards (e. g. OMDxx, SAB(M), MIBS, UDCM modules) do not have an LCC, they are equipped with an EEPROM with inventory data stored on it. TMN Control Synopsis Fig. 2.11 shows a condensed view of the supported stack profiles. In the following subsections an overview of the communication stack profiles supported at the communication interfaces is given. In Fig. 2.11 a complete overview of the stack profiles is given. In Fig. 2.12 an overview is given, which information models (interface dialects) are supported at which physical interface. The complete stack profiles for the interfaces are shown in the following subsections describing the physical interfaces.

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Technical Description (TED)

Other IP applic. debug SMTP

Web/ Java agent

TL1 agent

CMIP agent (DSET) application

ACSE Presentation Session

Transport TP0 http TCP telnet TCP RFC1006 access TCP

Transport TP4

UDP

TCP/IP socket interface IP Static and/or OSPF routing

CLNP ES-IS IS-IS routing

PPP NI

DCC Network Interface (NI) with PPP framing

Ethernet NI

Ethernet access

LAPD access LAPD streams driver

IP mode asynchronous PPP RS-232 driver

dual mode ETHERNET driver

dual mode (streams multiplex) DCC (HDLC) driver

Fig. 2.11

Synopsis of Applications, Communication Stacks and Interfaces

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

TNMS or NCT
B3 (10BaseT, Ethernet)

Q3, CMIP (CLNP, OSI) Q3, CMIP (TCP/IP) TL1 (TCP/IP)

NE
SURPASS hiT 7550 2.05
DCC (OSC)

NE

SURPASS hiT 7550 2.05


F (RS-232 / V.24) Q3, CMIP (TCP/IP over PPP) TL1 (TCP/IP)

Q3, CMIP (CLNP, OSI) Q3, CMIP (TCP/IP) TL1 (TCP/IP)

LCT

Fig. 2.12

Information Model of the Physical Interfaces

That because of compatibility to existing OSI networks a switch in DCC exists to decide whether only OSI, OSI and TCP/IP or only TCP/IP packages are transported. Depending on that switch the according packages can be transported and routed in the DCC.

Ethernet (B3) Interface See Fig. 2.10 and Fig. 2.12. The Ethernet interface provides for management purposes control of the NE by multiple Q3 managers (e. g. an OSS and an NCT) and the above mentioned application protocols. The Ethernet interface is provided via 10BaseT. The 10BaseT interface provides a point-to-point connection usually to a hub/switch, which in turn realizes the logical broadcast network topology. OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP packets can be distinguished by the use of different frame types with a dual mode driver. Extension Ethernet Interface An additional Ethernet interface is provided (10BaseT or 100BaseT; the HW supports both). It is located at the Network Element Alarm Panel (NEAP).

For the current release the extension ethernet interface is not activated.

RS-232/V.24 (F) Interface See Fig. 2.10 and Fig. 2.12. The F-interface provides for management control of the NE from a PC-based Local Craft Terminal (LCT) using a simple point to point (PPP) RS-232/V.24 interface. PPP serves as the data link (layer 2) protocol and is directly being used by the TCP/IP stack. Besides

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Technical Description (TED)

the IP based applications (TL1, Web Terminal) Q3-CMIP management is possible via RFC1006. Control of remote NEs however is not possible, as data packets from this interface are not routed. DCC Interfaces See Fig. 2.10 and Fig. 2.12. The data communication channels (DCC) are HDLC type serial channels embedded in the fiber optical signal(s) used for TMN purposes and separate from the payload. The supervisory channel SC provides a number of independent serial interfaces for the transmission of DCC bytes. Four DCC channels are supported by the NE: 2 DCCRo and 2 DCCMo. The data link protocol (layer 2) is LAPD (in unacknowledged mode) for OSI layer 3 protocols (CLNP, ES-IS and IS-IS). IP packets are framed according to PPP. No other features of PPP are used. With a dual mode driver the packets can be distinguished and handed over to the corresponding stack. The mode of operation (inactive, OSI only, IP only, OSI and IP combined) can be specified by management and should be in accordance with the mode of the NE at the remote end of the DCC line. Routing In a communication network an NE does not only has to care for the information addressed to himself but also has to forward information. For this so called Routing two protocols are supported depending on the transport protocol that is supported in the used stack profile. For OSI-stack the ES-IS, IS-IS protocol is used. For TCP/IP stack the OSPF protocol is used, see Fig. 2.11. It is not possible to route packages between these 2 protocols, i. e. not gateway functionality is provided. E. g. it is not possible to receive IP packages on Ethernet and route them as OSI packages to 7 layer OSI DCC. However it is possible to route OSI packages via ES-IS, IS-IS from Ethernet to DCC and vice versa as well as it is possible to route IP packages via OSPF from Ethernet to DCC and vice versa. Of course it is possible to terminate routing by providing packages to upper-layers of Network Element itself (OSI or IP packages).

i
2.3.8

The current release supports OSI stack routing.

EOW Interface
The engineering orderwire (EOW) interface can be used to make a telephone connection or conference from one NE to other NEs via handset. The realized interfaces on the OSCTU module are: two external 4-wire-interfaces or one external 4-wire-interface and one 4-wire-interface for the handset with selective call The first external 4-wire-interface resp. the 4-wire-interface for the handset can only be used alternatively and not at the same time (4-wire interface #1 is permanently used for the handset). 4- wire interconnection is possible via a distance of up to 10 m to other NEs. So it is possible to use only one handset in a location with more than one NE and to have telephone connections between these systems.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

The EOW channel is mapped to the frame of the optical supervisory channel via the E0or F0-byte (selected via SW). Coding/decoding the EOW channel is configurable for Alaw (ETSI) or -law (ANSI).

The complete EOW-IF is enabled or disabled by configuration. Disabled means all E0/F0 bytes are passed through, no access is possible. Normally OLR and OADM pass through the E0/F0 bytes and OTT terminates them. When the handset is "off hook" or the speech control detects an incoming speech signal on the 4-wire-interface, the E0/F0 bytes are connected to the EOW interface inside the OSCTU module. A 400 Hz ring tone generator and a dual tone multi frequency (DTMF) dialling receiver are permanently connected to the EOW conference. The DTMF receiver is always reading both direction lines and the handset interface for a DTMF-signal. The DTMF generator is part of the handset. A whistler is applied to indicate the conference status. Support is provided for collective call group call selective call via a congurable 3-digit (each digit = 0 to 9) telephone number; only selective calls activate an audible tone generator. In protection DWDM links, a ring manager in one of the OTTs is used to prevent EOW loops. It will only become active for a protection event. See also technical data in the Chapter "7.7 External Interfaces".

2.3.9

User Data Channels (sV.11)


These channels are used for bidirectional sV.11 (s= similar) connections between NEs up to a distance of about 1000 meters. There are two sV.11 interfaces with a data rate of 64 kbit/s on each OSCTU module (per network element). Each interface can be configured to access one of the optical service channel (OSC) bytes F0 or NU1 or NU2. In the OTT these bytes are terminated, in the OLR and OADM they are terminated or passed through (from OSC B to OSC A, meaning from side 1 to side 2). In OTT a user data channel of OSC A can be connected to sV.11 #1 or sV.11#2. In OLR and OADM a user data channel of OSC A and/or OSC B can be connected to sV.11 #1 or sV.11#2 or can be passed through. Codirectional Tx timing (data out, clock out) and contra directional Rx timing (data in, clock out) is applied, both derived from Tx of the optical service channel clock A. See also technical data in the Chapter "7.7 External Interfaces".

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Technical Description (TED)

2.3.10

Telemetry Interface (TIF)


TIF input monitors and output relay contacts are intended to be used for traditional userdefined housekeeping purposes. For example, the inputs (sensors) are usually configured to activate upon the occurrence of particular events at the site (fire alarm, over-temperature alarm, door-open alarm, etc.). A TIF input supervises the (negative) input voltage against ground. Activation of an input is reported by the NE as an alarm. Similarly, the outputs (actors) are normally employed to provide remote control of various devices at the site. A TIF output is realized with a relay contact switching between TIF output and TIF common. Such an (intentional) issued open/close command to an output is not considered an alarm. An inactive TIF output is open (high impedance state), an active output is shorted to TIF common (low impedance state). TIF circuits must be powered by circuits that meet SELV (Safety Extra Low Voltage) limits according to Standards UL 1950, VDE 0100-410, and DIN EN 60950. See also technical data in the Chapter "7.7 External Interfaces".

 For further information, see the Operator Guidelines (OGL) and the Online Help.

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2.3.11

Overview of System Benefits


The SURPASS hiT 7550 2.05 system provides the following benefits: Maximum Fibre Utilization Transport capacities of up to 1.6 Tbit/s (160 x 10 Gbit/s) per fibre, upgradeable in a further release to higher bit rates, make SURPASS hiT 7550 2.05 a leader in ultra high capacity systems. Extended Reach Ultra-high performance optical amplifiers, optional Raman amplification and Forward Error Correction (FEC) as well as Enhanced Forward Error Correction (EFEC) for highest available span performance values. Future releases moving into Ultra Long Haul (ULH) dimensions of thousands of kilometers of pure optical transmission. From 1 (2 for light EDFA) to 80 channels for C band (and in a later release: additionally from 2 to 80 channels for L band), in 20 channel increments, minimizes initial investment costs. High system performance reduces the number of costly electrical regenerator sites and optical amplifier sites. Everything in SURPASS hiT 7550 is scalable, from the optical amplifier performance (via external pump modules), scalable multiplexer/demultiplexer concept, to the required number of terminal or add/drop channels. High equipment density results in the most compact DWDM solution including all interfaces. Up to 640 Gbit/s in a single 7-foot bay (assuming each 16 transponders 10 Gbit/s in 2+2 subracks of back-to-back racks) using space-efficient wavelength transponders.

Modularity

Lower Network Costs

Scalability

Compactness

Simplified Network Design Reduced amount of equipment and module variants required reduces support and maintenance costs. Sophisticated Optical Control SURPASS hiT 7550 2.05 employs numerous techniques to ensure the quality of the end signal; dynamic gain and output power control to adjust for gain and power fluctuations, spectral gain control to adjust for gain tilt variations (particularly Raman Gain Tilt variations), end-to-end preemphasis for fine tuning of channel OSNR and power variations, integrated ASE filter, gain flattening filter and tiltable filter, to name but just a few. Suitable for operation with all major fibre types, i. e. SSMF, NZDSF and DSF. Integrated dispersion compensation tailored for each fibre's requirements. On special request: Standalone L Band application designed specifically for DSF networks.

Fibre Type Flexibility

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OADM Flexibility

Sophisticated SURPASS hiT 7550 2.05 OADM solutions with remote add/drop configurability up to 100%. Solutions are tailored according to customers current and foreseeable traffic requirements at a particular site and are scalable from 1 to 32 add/drop channels (in the 20% OADM) or from 1 to 160 add/drop channels (in the 100% OADM for C+L band). Almost all services are supported by SURPASS hiT 7550 2.05 and the SURPASS hiT 7540 (OCU) due to the inherent transparency of the DWDM system and the transparency built-in to the transponders. Therefore a carrier is flexible to meet all customer requirements, be it SDH/SONET or IP/ATM based services. Fully integrated DWDM solutions in conjunction with: Siemens 2.5 Gbit/s SDH line systems (SL16, SLR16, WTTR) Siemens 10 Gbit/s SDH line systems (SL64), 10 Gbit/s TDM 'thin' multiplexing transponder (TEX) cards, which combine 4 x 2.5 Gbit/s signals into one 10 Gbit/s signal, thereby increasing fibre optimization. The TEX module is housed and managed within the subrack of SURPASS hiT 7540 (OCU) - Sycamore OEM Cross Connect SN16000 Via the SURPASS hiT 7540 (OCU) 10 Gbit/s transponder, your legacy 10 Gbit/s terminal equipment can be interfaced to SURPASS hiT 7550 2.05. The 10 Gbit/s transponder transmitting lasers are wavelength tunable for reduced spare log. Built-in enhanced optical monitoring capability.

Service Flexibility

Integrated Solutions

Multi-vendor Solutions

Optical Performance Analyzer Survivability

Against fibre or equipment outages is possible with the OSN Optical Channel Protection Unit (OCP) which provides 1+1 optical protection switching per channel. As with all Siemens optical networking products, SURPASS hiT 7550 2.05 is managed via the Transport Network Management System (TNMS), using the latest in architecture technology for the most advanced network management solution. For maintenance and small to medium network purposes each product may also be managed via Element Manager (EM). The SURPASS hiT 7550 2.05 platform is already 'future proof' for next generation ultra-high capacity networks, and is set to expand with Ultra Long Haul (ULH) capability.

Network Management

Evolution

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3 Functionality
This chapter describes the SURPASS hiT 7550 2.05 functionality. The chapter consists of the following sections: Frequency/Wavelength Bands Functional Overview of the NE Types Functional Overview of the Modules Synchronization Control and Monitoring via the Element Manager Control and Monitoring via Network Management System

3.1 i
3.1.1

Frequency/Wavelength Bands
Remember: although described below the current release makes no use of the L band!

C and L Wavelength Bands


The SURPASS hiT 7550 2.05 system uses a maximum of 160 wavelengths, divided into groups (see Fig. 3.1 and Fig. 3.2). Half of the wavelengths (i. e., 80 of them) are in the "C" (Conventional) band. The other 80 are in the "L" (Long) band.

196.1 THz 1528.77 nm

191.7 THz 1563.86 nm

190.9 THz 1570.41 nm

186.5 THz 1607.46 nm

C12 C56

C34 C78

L12 L56

L34 L78

C band

L band

C1 C5

C2 C6

C3 C7

C4 C8

L1 L5

L2 L6

L3 L7

L4 L8

Fig. 3.1

SURPASS hiT 7550 2.05 Wavelength Plan As shown in Tab. 3.1 and Tab. 3.2, the "C" band consists of: 40 "Blue" (shorter) wavelengths, spaced at 50 GHz an unused gap of approximately 4 nm 40 "Red" (longer) wavelengths, also spaced at 50 GHz. Similarly (see Tab. 3.3 and Tab. 3.4), the "L" band consists of: 40 "Blue" (shorter) wavelengths, spaced at 50 GHz an unused gap of approximately 4 nm 40 "Red" (longer) wavelengths, also spaced at 50 GHz. Note: The last column in Tab. 3.1 to Tab. 3.4 shows the wavelength upgrade order. This is the order to be considered if new channels are to be added to the C band (or L band) in

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case no 100% OADMs are used. Else the upgrade sequence also depends on the traffic matrix including add/drop channels.

3.1.1.1

40 Blue Wavelengths in the C Band (Subbands C1/C2 and C5/C6)


Frequency (THz) 196.10 196.05 196.00 195.95 195.90 195.85 195.80 195.75 195.70 195.65 195.60 195.55 195.50 195.45 195.40 195.35 195.30 195.25 195.20 195.15 195.10 195.05 195.00 194.95 194.90 194.85 194.80 194.75 194.70 194.65 194.60 194.55 194.50 194.45 194.40 194.35 194.30 194.25 194.20 194.15 194.10 194.05 194.00 193.95 193.90 193.85 193.80 193.75 193.70 Wavelength (nm) 1528.77 1529.16 1529.55 1529.94 1530.33 1530.72 1531.11 1531.50 1531.89 1532.29 1532.68 1533.07 1533.46 1533.85 1534.25 1534.64 1535.03 1535.43 1535.82 1536.21 1536.61 1537.00 1537.39 1537.79 1538.18 1538.58 1538.97 1539.37 1539.76 1540.16 1540.55 1540.95 1541.35 1541.74 1542.14 1542.54 1542.93 1543.33 1543.73 1544.12 1544.52 1544.92 1545.32 1545.72 1546.12 1546.51 1546.91 1547.31 1547.71 Sub-band C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C1 C5 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 C2 C6 sub-band limit not used not used not used not used not used not used not used sub-band limit Channel Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Add/Drop Channel Upgrade Order in C band 40 80 39 79 38 78 37 77 36 76 35 75 34 74 33 73 32 72 31 71 30 70 29 69 28 68 27 67 23 66 25 65 22 62 24 64 26 63 21 61

CAD2C1C1 CAD2C5C5

CAD2C1C1 CAD2C5C5

CAD2C1C2 CAD2C5C6 CAD2BC2C2 CAD2BC6C6 CAD2BC2C2 CAD2BC6C6 CAD2C1C2 CAD2C5C6

CAD2C2C2 CAD2C6C6

CAD2C2C2 CAD2C6C6

Tab. 3.1

40 Blue Wavelengths in the "C" (Conventional) Band

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3.1.1.2

40 Red Wavelengths in the C Band (Subbands C3/C4 and C7/C8)


Frequency (THz) 193.65 193.60 193.55 193.50 193.45 193.40 193.35 193.30 193.25 193.20 193.15 193.10 193.05 193.00 192.95 192.90 192.85 192.80 192.75 192.70 192.65 192.60 192.55 192.50 192.45 192.40 192.35 192.30 192.25 192.20 192.15 192.10 192.05 192.00 191.95 191.90 191.85 191.80 191.75 191.70 Wavelength (nm) 1548.11 1548.51 1548.91 1549.31 1549.71 1550.11 1550.51 1550.91 1551.32 1551.72 1552.12 1552.52 1552.92 1553.33 1553.73 1554.13 1554.53 1554.94 1555.34 1555.74 1556.15 1556.55 1556.96 1557.36 1557.76 1558.17 1558.57 1558.98 1559.39 1559.79 1560.20 1560.60 1561.01 1561.42 1561.82 1562.23 1562.64 1563.04 1563.45 1563.86 Sub-band C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C7 C3 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 C8 C4 Channel Number 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Add/Drop Channel Upgrade Order in C band 41 1 44 4 45 5 43 3 46 6 47 7 48 8 49 9 50 10 51 11 52 12 53 13 54 14 55 15 56 16 57 17 58 18 59 19 42 2 60 20

CAD2C7C7 CAD2C3C3

CAD2C7C7 CAD2C3C3

CAD2C7C8 CAD2C3C4 CAD2BC7C7 CAD2BC3C3 CAD2BC7C7 CAD2BC3C3 CAD2C7C8 CAD2C3C4

CAD2C8C8 CAD2C4C4

CAD2C8C8 CAD2C4C4

Tab. 3.2

40 Red Wavelengths in the "C" (Conventional) Band

3.1.1.3

40 Blue Wavelengths in the L Band (Subbands L1/L2 and L5/L6)


Frequency (THz) 190.90 190.85 190.80 190.75 Wavelength (nm) 1570.41 1570.82 1571.24 1571.65 Sub-band L1 L5 L1 L5 Channel Number 81 82 83 84 Add/Drop Channel Upgrade Order in L band 20 60 2 42

Tab. 3.3

40 Blue Wavelengths in the "L" (Long) Band

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Frequency (THz) 190.70 190.65 190.60 190.55 190.50 190.45 190.40 190.35 190.30 190.25 190.20 190.15 190.10 190.05 190.00 189.95 189.90 189.85 189.80 189.75 189.70 189.65 189.60 189.55 189.50 189.45 189.40 189.35 189.30 189.25 189.20 189.15 189.10 189.05 189.00 188.95 188.90 188.85 188.80 188.75 188.70 188.65 188.60 188.55 188.50

Wavelength (nm) 1572.06 1572.47 1572.88 1573.30 1573.71 1574.12 1574.54 1574.95 1575.36 1575.78 1576.19 1576.61 1577.02 1577.44 1577.85 1578.27 1578.68 1579.10 1579.51 1579.93 1580.35 1580.76 1581.18 1581.60 1582.01 1582.43 1582.85 1583.27 1583.69 1584.10 1584.52 1584.94 1585.36 1585.78 1586.20 1586.62 1587.04 1587.46 1587.88 1588.30 1588.72 1589.14 1589.56 1589.99 1590.41

Sub-band L1 L5 L1 L5 L1 L5 L1 L5 L1 L5 L1 L5 L1 L5 L1 L5 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 L2 L6 sub-band limit not used not used not used not used not used not used not used sub-band limit

Channel Number 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120

Add/Drop

Channel Upgrade Order in L band 19 59 18 58 17 57 16 56 15 55 14 54 13 53 12 52 11 51 10 50 9 49 8 48 7 47 6 46 3 43 5 45 4 44 1 41

CAD2L1L1 CAD2L5L5

CAD2L1L1 CAD2L5L5

CAD2L1L2 CAD2L5L6 CAD2BL2L2 CAD2BL6L6 CAD2BL2L2 CAD2BL6L6 CAD2L1L2 CAD2L5L6

CAD2L2L2 CAD2L6L6

CAD2L2L2 CAD2L6L6

Tab. 3.3

40 Blue Wavelengths in the "L" (Long) Band (Cont.)

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3.1.1.4

40 Red Wavelengths in the L Band (Subbands L3/L4 and L7/L8)


Frequency (THz) 188.45 188.40 188.35 188.30 188.25 188.20 188.15 188.10 188.05 188.00 187.95 187.90 187.85 187.80 187.75 187.70 187.65 187.60 187.55 187.50 187.45 187.40 187.35 187.30 187.25 187.20 187.15 187.10 187.05 187.00 186.95 186.90 186.85 186.80 186.75 186.70 186.65 186.60 186.55 186.50 Wavelength (nm) 1590.83 1591.25 1591.67 1592.10 1592.52 1592.94 1593.37 1593.79 1594.21 1594.64 1595.06 1595.49 1595.91 1596.34 1596.76 1597.19 1597.61 1598.04 1598.46 1598.89 1599.32 1599.74 1600.17 1600.60 1601.02 1601.45 1601.88 1602.31 1602.74 1603.16 1603.59 1604.02 1604.45 1604.88 1605.31 1605.74 1606.17 1606.60 1607.03 1607.46 Sub-band L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L7 L3 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 L8 L4 Channel Number 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 Add/Drop Channel Upgrade Order in L band 61 21 63 26 64 24 62 22 65 25 66 23 67 27 68 28 69 29 70 30 71 31 72 32 73 33 74 34 75 35 76 36 77 37 78 38 79 39 80 40

CAD2L7L7 CAD2L3L3

CAD2L7L7 CAD2L3L3

CAD2L7L8 CAD2L3L4 CAD2BL7L7 CAD2BL3L3 CAD2BL7L7 CAD2BL3L3 CAD2L7L8 CAD2L3L4

CAD2L8L8 CAD2L4L4

CAD2L8L8 CAD2L4L4

Tab. 3.4

40 Red Wavelengths in the "L" (Long) Band

3.1.2

Interleaver Devices
Each wavelength band (Blue C band, Red C band, Blue L band and Red L band) consists of 40 channels spaced at 50 GHz. In the demux direction, an interleaver separates a 40-channel band into two 20-channel bands, each with 100 GHz spacing (see Fig. 3.2). In other words, the interleaver separates all the "even numbered" channels and places them on one fiber and all the "odd numbered" channels and places them on another fiber. Now, the wavelengths are far enough apart (100 GHz) to use thin-film filter devices to completely demultiplex these 20-channel sub-bands into the individual

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wavelengths. This is achieved by the various "OD20" plug-in cards (OD20C1C2, OD20C3C4, OD20L1L2, etc.) Everything operates in reverse for the mux direction. Individual wavelengths spaced at 100 GHz are input to the proper OM20 plug-in cards, each of which mux together up to 20 wavelengths, and places them all on one fiber. Two such fibers (each carrying 20 wavelengths at 100 GHz spacing) are routed to an interleaver. The interleaver "weaves together" these wavelengths, placing all 40 wavelengths (with 50 GHz spacing) onto one fiber. The interleavers make use of Mach-Zehnder interferometer technology. In this design, an unequal fiber path length between two 3 dB couplers creates the interference. By carefully controlling the path length difference, the channel spacing can be set to the desired value. Because of the all-fiber design, this technology has very low loss, low dispersion, and small polarization-dependent effects.

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"C" (Conventional) Band


1528.77 nm to 1563.86 nm 196.10 THz to 191.70 THz

"L" (Long) Band


1570.41 nm to 1607.46 nm 190.90 THz to 186.50 THz

The 80 C band wavelengths are in two groups of 40: the "Blue" C band and the "Red" C band, both spaced at 50 GHz.
40 Blue C band wavelengths spaced at 50 GHz
1 52 8.77 n m

The 80 L band wavelengths are in two groups of 40: the "Blue" L band and the "Red" L band, both spaced at 50 GHz.
40 Blue L band wavelengths spaced at 50 GHz gap gap 40 Red L band wavelengths spaced at 50 GHz

40 Red C band wavelengths spaced at 50 GHz gap

1 54 4.13 n m

1 54 8.11 nm

1 57 0.41 n m

1 58 6.62 n m

1 59 0.83 n m

15 63 .8 6 n m

16 07 .4 6 n m

C 1, C 2, C 5, and C 6 C5 / C6

C 3, C 4, C 7, and C 8

L1, L2, L5, and L6

L3, L4, L7, and L8

50/100 GHz Interleaver C1 / C2 C1 C5

The 40 Blue C band wavelengths consist of 4 sub-bands, each at 100 GHz spacing.

The transition from 100-GHz spaced sub-bands to 50-GHz spaced sub-bands (and vice-versa) is accomplished via Interleaver devices.

su b -b a n d s

50/100 GHz Interleaver C3 / C4 C7 / C8

The 40 Red C band wavelengths consist of 4 sub-bands, each at 100 GHz spacing.

su b -b a n d s

50/100 GHz Interleaver L1 / L2 L5 / L6

The 40 Blue L band wavelengths consist of 4 sub-bands, each at 100 GHz spacing.

su b -b a n d s

50/100 GHz Interleaver L3 / L4 L7 / L8

The 40 Red L band wavelengths consist of 4 sub-bands, each at 100 GHz spacing.

su b -b a n d s

C2

C3

C4

L1

L2

L3

L4

C6

C7

C8

L5

L6

L7

L8

Fig. 3.2

SURPASS hiT 7550 2.05 Wavelength Bands and Sub-Bands

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3.2

Functional Overview of the NE Types


There are four SURPASS hiT 7550 2.05 NE types: SURPASS hiT 7550 2.05 Optical Transport Terminal Unidirectional (OTTU) for 160 channel DWDM capability; all channels are multiplexed or demultiplexed and preemphasis is terminated at OTTU SURPASS hiT 7550 2.05 Optical inLine Repeater Unidirectional (OLRU), providing powerful inline amplication of 160 channels - up to 160 per wavelength per bre in a unidirectional, two-bre conguration (3.2 Tbit/s total bandwidth) SURPASS hiT 7550 2.05 Optical Add/Drop Multiplexer Unidirectional (OADMU) which permits the extraction and insertion of channels at intermediate line amplier sites. SURPASS hiT 7550 2.05 Channel Connection Unit (CCU), an NE with amplier/switch modules OCA/OCAS (C band only), and pure switch modules OCS for interconnection (express channel or add/drop of trafc)

Unidirectional in the NE type description, e. g. OLRU, refers to the fact that two fibres are used for the optical transmission between SURPASS hiT 7550 2.05 NEs. One fibre carries the signals of one direction, and the other fibre carries the signals for the counter direction, hence allowing the transmission of several (up to 160) bi-directional channels over two fibres. This nomenclature is used to distinguish the system from other DWDM systems which transmit both signal directions on one optical fibre.

3.2.1

OTT(U)
The choice and structure of the optical multiplexing technology for the SURPASS hiT 7550 2.05 Optical Transport Terminal Unidirectional (OTTU) takes several factors into consideration, such as the channel granularity requirements, the reliability of the technology, modularity and subsequent upgradability, and the ability of supporting the use of subband dispersion compensation schemes. SURPASS hiT 7550 2.05 supports 160 wavelengths of the 50 GHz ITU-T G.692 wavelength grid.

3.2.1.1

Optical Path
As an example Fig. 3.3 shows the optical path through the OTTU (C band, upgradable to C+L band). The OTTU uses OM / OD20 modules, subband filters and interleavers. For standalone C band OTTU simply replace OLITBC by OLITBNC, OLITPC by OLITPNC modules. For standalone L band OTTU replace all C band modules by respective L band types and omit upgrade section. The preamplifier OLITP may be supported by Pump A/B/C modules or alternatively by RPUMP modules. If an Optical Performance Analyzer module OPA (not shown in Fig. 3.3) is applied (only one of these, OPA or RPUMP module may be equipped), up to four monitoring inputs are used: in transmit direction (after the booster), 80 channels in C band (and 80 channels in L band) are connected to a 3 dB coupler input into the OPA. In receive direction also 80 channels in C Band (and 80 channels in L band) after the preamplifier are connected to a 3 dB coupler input into the OPA. One OPA monitors 320 channels, to get optical performance information on a per channel basis. An OSCTUT module terminates and processes the OSC.

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Configurable channel input power ranges enable the interconnection of OTTUs from demux (ODA) to mux via OCA or OCAS modules in between (see also 3.2.3.3).

Fig. 3.3

OTTU, Optical Path Structure for C Band (Upgradable to C+L Band)

Optical line amplifier modules OLITPC + OLITBC, with several pump modules, dispersion compensation modules UDCM and opt. service channel module OSCTUT

C band red/blue filter OMDFIC

Interleaver OMD2IC

Mux/Demux OM20x/OD20x

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3.2.1.2

Four Stage Design from 1 to 160 Channels


The multiplexing architecture supported by SURPASS hiT 7550 2.05 is based on band separation filters, frequency interleavers, and dielectric multiplexer/demultiplexer filters. The four stages of demultiplexing a 160 channel DWDM signal into 160 individual client signals are described as follows and represented graphically in Fig. 3.4. 1. A C/L Band separation lter is used to split the co-directional C and L Band wavelengths into two separate C and L wavelength bands. Each of these bands consists of 80 channels with 50 GHz spacing. 2. Red/Blue band separation lters are used to split the C Band in half (for simplication only the C Band is looked at). For example, the 80 Channel C Band wavelengths are split into the C-Red Band and C-Blue Band, each with 40 wavelengths. 3. A 50 GHz period device called an interleaver is required per Red/Blue C Band. The interleaver has two sub-band outputs, and every second wavelength is ltered to the rst sub-band output, the remaining wavelengths to the second sub-band output. This has the effect of doubling the wavelength frequency, so all wavelengths are now spaced at 100 GHz. Each sub-band consists of 20 wavelengths with 100 GHz spacing, and the pair of sub-bands is frequency shifted by 50 GHz. Note that in the C Band this results in 4 sub-bands of 20 channels, two blue and two red bands. 4. Finally, a 100 GHz dielectric lter separates the 20 channel sub-band into the individual 20 channels. This stable technology was chosen to provide the lowest cost per channel.

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Stage 1 C band / L band Filter

Stage 2 Blue / Red Filter

Stage 3 Interleavers

Stage 4 100 GHz Dielectric Mux/Demux


Mux/Demux

40 Blue C band channels spaced at 50 GHz C-band red / blue filter

interleaver

20 Blue C-band channels spaced at 100 GHz

Ch 1 - 20

spaced at 100 GHz

Mux/Demux

20 Blue C-band channels

Ch 21 - 40

80 channels C-band spaced at 50 GHz

Mux/Demux

40 Red C-band channels spaced at 50 GHz

interleaver

20 Red C-band channels spaced at 100 GHz

Ch 41 - 60

C+L bands at 50 GHz

C L
80 channels L-band spaced at 50 GHz

spaced at 100 GHz

Mux/Demux

20 Red C-band channels

Ch 61 - 80

Same 4-stage structure for L-band mux/demux. L-band channels are numbered 81 - 160.

Fig. 3.4

Block Diagram of C Band SURPASS hiT 7550 2.05 Multiplexer Architecture Scheme The same concept applies in the reverse direction when multiplexing one channel into a 160 channel DWDM signal. If only either the C Band or the L Band have been implemented, there is a maximum capacity of 80 channels, and the C/L Band filter stage can be bypassed. It is also possible to eliminate the need for the third multiplexing stage, the interleaver devices, if only 100 GHz spacing is required, a substantial cost saving.

3.2.1.3

Multiplexer Modularity
The multiplexing architecture described above and the hardware components which implement this architecture lend itself to modularity benefits, which allow the customer to optimize his equipping requirements. In summary: The decision for a maximum number of 40 or 80 channels per C or L Band. For 40 channels only, the optical interleaver devices are not necessary, reducing equipment costs and enabling longer optical transmission distances. The decision for a maximum number of 80 or 160 channels for combined C & L Band applications. For 80 channels only (40 + 40, C & L combined applications), the opti-

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cal interleaver devices are not necessary, reducing equipment costs and enabling longer optical transmission distances. For every 20 channels, a new 20 channel multiplexer/demultiplexer pair is required. The access points between the red/blue lters and the interleaver devices allow a sophisticated dispersion compensation concept, including sub-band lters and slope varying lters, to improve system performance.

3.2.1.4

Multiplexer Equipping
The following modules are required to implement the multiplexer architecture described in the previous sub-sections. The first stage of demultiplexing (last stage of multiplexing), the C/L Band separation filters, are found on the optical amplifier modules (OLI) and are hence not represented in Tab. 3.5 below.
Module Name Stage 2 C/L Band Filters Stage 3 Red/Blue Band Interleavers 2 x C-Red interleavers Stage 4 20 channel Sub-Band Dielectric Filters -

OMDFIC

1 x C-Blue/Red, red reflecting type, & 1 x C-Blue/Red, blue reflecting type 1 x L-Blue/Red, red reflecting type, & 1 x L-Blue/Red, blue reflecting type 1 x C-Blue/Red, red reflecting type, & 1 x C-Blue/Red, blue reflecting type 1 x L-Blue/Red, red reflecting type, & 1 x L-Blue/Red, blue reflecting type -

OMDFIL

2 x L-Blue interleavers

OMDFC

OMDFL

OMD2IC OMD2IL OM20 OD20 ODA20

2 x C-Blue interleavers 2 x L-Red interleavers -

20 channel Multiplexer 20 channel Demultiplexer 20 channel Demultiplexer with VOAs at each output

Tab. 3.5

List of SURPASS hiT 7550 2.05 Multiplexer Modules

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Technical Description (TED)

3.2.2

OLRU
The Siemens Optical inLine Repeater Unidirectional (OLRU) allows extended reach DWDM solutions on 10 Gbit/s transmission systems, removing the need for costly multiple signal electrical regenerator sites. The optical amplification is provided via Erbium Doped Fibre Amplifier (EDFA) technology. SURPASS hiT 7550 2.05 utilizes broadband EDFAs in the C (Conventional) and L (Long) Band of wavelengths, whereby 160 channels are simultaneously, optically amplified, pushing optical transmission distances up to 1000 km and allowing higher bit rates of individual wavelengths. OLRU boosts the channel power, adjusts the power tilt and compensates for dispersion.

3.2.2.1

Optical Path
As an example Fig. 3.5 shows the C band version (upgradable to C+L band) of the OLRU. Each of the two directions has an optical line amplifier (OLI module) for the C Band. The OLI modules may have pump A/B/C modules. Raman pump modules may be used in front of the OLI inputs to extend transmission distances. If an Optical Performance Analyzer module OPA (not shown in Fig. 3.5) is applied, up to four monitoring inputs are used in the OPA module: the C Band (and the L Band) in both transmission directions (corresponds to a total of 320 channels) are monitored at the output of the optical line amplifier. OPA is used to get optical performance information on a per channel basis.

OPA module and Raman amplifier module RPUMP use the same slot. Therefore only one of these may be equipped.

Optical line amplifier modules OLITIC, with several pump modules, dispersion compensation modules UDCM and opt. service channel module OSCTUI

Fig. 3.5

OLRU, Optical Path Structure for C Band

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

An OSCTUI module terminates and processes the OSC on line side 1 and line side 2 of the OLRU. The C Band standalone OLRU originates from this figure by replacing OLIIC modules by OLIINC modules and omitting the L Band upgrade section. The L Band standalone OLRU originates from this figure by replacing all C Band modules by the respective L Band modules and omitting the upgrade section.

3.2.2.2

Scalability of DWDM Capacity


SURPASS hiT 7550 2.05 transmits from 1 up to 160 wavelengths over a single physical fibre, using a 50 GHz frequency spacing between the individual 'colored' carriers. Both the C Band (1528 to 1564 nm) and the L Band (1570 to 1607nm) wavelengths are used in both transmission directions, combining their capacity of 80 channels per band. Hence the total capacity is up to 160 bi-directional channels over 1 fibre pair, or 2 x 1.6 TBit/s. The C and L Band wavelengths are optically amplified by separate C and L Band EDFAs.

OTT

PUMPS
A B C

OLR

PUMPS
A B C

PUMP
A

OADM
DEMUX C

fixed add/drop

PUMPS
A B C

PUMP
A

OTT

DCM

DCM

DCM

DCM

DCM

DCM MUX L

DCM

DCM DEMUX L MUX L

DCM

DCM DEMUX L

OLITBUL A B C

OLIIUL A B C

OLITPUL A

CAD2

OLITBUL A B C

OLITPUL A

PUMPS one direction other direction PUMP


A

PUMPS

PUMP

Configurable add/drop

PUMPS

PUMP

PUMPS
A B C

PUMPS
A B C

fixed add/drop

PUMP
A

PUMPS
A B C

DEMUX C

DEMUX C

OLITPC

OLIIC

OLITBC MUX C

OLITPC

OLITBC MUX C

DCM

DCM

DCM

DCM

DCM

DCM DEMUX L

DCM

DCM DEMUX L MUX L

DCM

DCM MUX L

OLITPUL A A B

OLIIUL C A

OLITBUL B C

CAD2

OLITPUL A A

OLITBUL B C

PUMP

PUMPS

PUMPS

Configurable add/drop

PUMP

PUMPS

Fig. 3.6

Two Fibre, SURPASS hiT 7550 2.05 C+L Band Amplifier Configuration Operation in either the C or in the L Band only is also possible, in which case only the EDFAs required for the particular Band of operation are necessary. A smooth upgrade from an 80 Channel C Band only DWDM system to a 160 Channel C+L Band system is enabled via the addition of the Upgrade L Band EDFA modules to the existing C Band EDFA modules, as can be seen in Fig. 3.6. This upgrade strategy allows a minimum initial investment in infrastructure, by allowing the carrier to begin with an 80 Channel C Band only DWDM system, with the assurance of a non-traffic interrupting upgrade to 160 Channels with the addition of the L Band amplifier modules.

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DEMUX C

MUX C

MUX C

OLITBC

OLIIC

OLITPC

OLITBC

OLITPC

Information SURPASS hiT 7550 2.05

Technical Description (TED)

A Standalone L Band DWDM system, as shown in Fig. 3.7, is scalable up to 80 Channels and is recommended for networks with a Dispersion Shifted Fibre (ITU-T Recommendation. G.653) base already implemented.
OTT OLR OADM OTT

PUMPS A B C OLITBL MUX L

PUMPS A B C OLIIL

PUMP A OLITPL

fixed add/drop
DEMUX L MUX L

PUMPS A B C OLITBL

PUMP A OLITPL

DCM

DCM

DCM

DCM

DCM

one direction other direction


PUMP A OLITPL PUMPS A B C OLIIL PUMPS A B C OLITBL MUX L CAD2 PUMP A OLITPL PUMPS A B C OLITBL MUX L

DEMUX L

DCM

DCM

DCM

DEMUX L

DCM

DCM

Configurable add/drop

Fig. 3.7

Two Fibre SURPASS hiT 7550 2.05 Standalone L Band Amplifier Configuration

3.2.2.3

Amplifier Variants
All EDFAs are located on the Optical Line Interface (OLI) module. Whereby several variants of the OLI module exist to satisfy the different requirements for booster amplification, inline amplification and preamplification, the basic OLI module design for all variants uses two different EDFAs (see Chapter 3.3.9). The main differentiators of the OLI card variants are: Whether they amplify the optical C Band (C), the optical L Band only (L), or the optical L Band as an upgrade in combination with a C Band system (UL) Whether they are optimized for operation as either a Terminal Booster (TB), Terminal Preamplier (TP) or Inline amplier (I). Such optimization factors include the power ranges of the optical interfaces and the Automatic Power Shutdown (APSD) threshold levels and behavior. Depending on the given span lengths and tilt correction requirements there are three different OLI categories: basic, standard, and extended (see Chapter 3.3.9 also). For illustration, an OLIIC module is the inline amplifier module for the C Band which is normally equipped in an OLR NE, and an OLITBUL is the booster amplifier module for the L Band which is found in the OTTU of a C+L Band system. Fig. 3.6 and Fig. 3.7 show the usage of the different OLI modules.

3.2.2.4

Multi-Stage Amplifier Design


The EDFA optical module itself is a three-stage optical amplifier. The mid-stage access points between each EDFA section, as illustrated in Fig. 3.8, allow the addition of inline optical components to enhance the performance of the amplification process as well as the overall network performance. As the attenuation incurred by these mid-stage optical components is already calculated in the optical link budget, the SURPASS hiT 7550 2.05 is ready to handle today's and tomorrow's optical networking requirements.

DEMUX L

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

The first EDFA stage is optimized for amplification of a low power signal and therefore for low noise amplification. A flat spectral gain is ensured via a gain flattening filter which is integrated in this first EDFA stage. Between the first and the second EDFA stages, the first mid-stage access point, devices for spectral control of the system are included, such as a Variable Optical Attenuator (VOA) for setting the optimum EDFA gain operating point and a Pre-Tilt compensation filter to reduce Raman Tilt. The second EDFA stage provides moderate optical amplification so that the output signal level is appropriate for interconnection to a dispersion compensating module (DCM) situated in the second mid-stage access point. The third and final EDFA stage is optimized to maximize the amplification of the signal to be sent out on the line.
Interstage Device External PUMPA card External PUMPB card

variable optical attenuator

Gain Tilt Control (GTC) dynamic tilt adjustment 1)

External PUMPC card

DCF

1)

1)

1)

Stage 1

Stage 2

Stage 3

OLI

Gain Tilt Monitor (GTM)

2)

Input
Connector

1) ... not applicable for basic type OLI modules 2) ... only applicable for extended type OLI modules

Output

Fig. 3.8

Stage EDFA Design

3.2.2.5

Amplifier Pump Modularity


To account for the wide variety of optical conditions in backbone networks, such as varied span lengths, fibre types, fibre attenuations, chromatic dispersion coefficients, and non-linear effects, SURPASS hiT 7550 2.05 offers a modular amplifier pump implementation. By varying the number of pump modules equipped, the total output power of the OLI modules can be adjusted to suit the exact network requirements. Each amplifier pumps' current and output power is precisely regulated via hardware and software control loops implemented on the OLI module, which determine the total output power of the optical amplifier. Several pump modules are equipped on the OLI module itself, whereas extra pump modules (external pumps are not applicable on basic type OLI modules), providing much higher total amplifier output powers, may be added via additional plug-in PUMP modules.

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Technical Description (TED)

The following maximum total output power is available at the OLI module: Conguration: OLI module without pump modules PumpA added PumpA+PumpB added PumpA+PumpB+PumpC added Tab. 3.6 Max. total output power of the OLI module (approx.) + 17 dBm + 20 dBm + 22 dBm + 23 dBm

Output Power for OLI Module with/without Pumps

The maximum total output power of the OLI module alone is +17 dBm. With the addition of the plug-in unit PumpA, this can be increased to +20 dBm. By adding two extra units PumpB and PumpC, a maximum total amplifier output power of +23 dBm can be reached. This means, that with 80 channels maximum per EDFA (remember the C Band and L Band EDFAs are separate), we can achieve a maximum channel output power of approximately +4 dBm per channel. If only 40 channels maximum are equipped per EDFA (i. e. for only 100 GHz channel spacing), then the maximum channel output power can be increased to +7 dBm, which means even longer optical DWDM links are possible. The pump modules are suitable for both C Band or L Band optical amplifiers, as well as for booster amplifiers, preamplifiers or inline amplifiers.

3.2.2.6

Raman Amplification
In order to extend the distances between inline amplifier sites and the total optical transmission reach, SURPASS hiT 7550 2.05 employs one of the sophisticated technologies available for optical amplification, namely Raman amplification. Optical amplifier spacings of up to 40 dB are possible with Raman amplification. The basis of Raman amplification is the energy scattering effect called Stimulated Raman Scattering (SRS), a non-linear effect inherent to the fibre itself. SRS involves a transfer of power from a signal at a higher frequency (lower wavelength) to one at a lower frequency (higher wavelength), due to inelastic collisions in the fibre medium. It can be used for optical amplification, in which the higher frequency light serves as a pump source, amplifying the lower frequency wave carrying the actual traffic signal to be amplified. Although this is a very broadband process, the approximate required separation between the signal wavelength and the Raman pump wavelength for optimal Raman amplification can be calculated, hence the required pump wavelengths can be determined. The Raman amplification process occurs at the end of an optical span in SURPASS hiT 7550 2.05. When the signal is at it's weakest, it is given renewed energy via the pump light being inserted at the end of the hop in the reverse direction. Hence only in the last few kilometers of a span does the real Raman amplification take place. This is known as contra-directional Raman pumping, as the Raman pump light is travelling in the opposite direction to the actual traffic signal. SURPASS hiT 7550 2.05 employs three different Raman pump modules. There is one module for the C Band (RPUMPC), one for the L Band in case of a C+L Band system

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

(RPUMPUL) and one for a Standalone L Band system (RPUMPL). Just as it is possible to upgrade a C Band only system with the L Band amplifiers, it is also possible to upgrade a C Band only with Raman system with the L Band amplifiers and L Band Raman pumps. This is a non-service interrupting upgrade. However, upgrading a C or L Band system to include Raman pumps is traffic interrupting, and therefore when required, Raman pumps must be inserted at the receiving line interface from the beginning. The exact placement of the Raman pumps is shown in the C+L Band system in Fig. 3.9. An additional Raman pump module can be inserted at the input of each inline preamplifier (and in case of OTTU network elements terminal preamplifier) to realize a Raman amplification.

OTT

PUMPS A B C OLITBC MUX C

OLR
RPUMPC

PUMPS A B C OLIIC RPUMPC

PUMP A OLITPC

OADM
DEMUX C

fixed add/drop
MUX C

PUMPS A B C OLITBC RPUMPC

PUMP A OLITPC

OTT
DEMUX C DEMUX L

DCM DCM MUX L RPUMPUL OLITBUL A B C PUMPS OLIIUL

DCM DCM RPUMPUL

DCM DCM DEMUX L MUX L

DCM DCM RPUMPUL OLITBUL A B C PUMPS

DCM DCM

OLITPUL A PUMP

CAD2

OLITPUL A PUMP

A B C PUMPS

one direction other direction


PUMP A OLITPC RPUMPC PUMPS A B C OLIIC RPUMPC PUMPS A B C OLITBC

Configurable add/drop fixed add/drop


DEMUX C MUX C

PUMP A OLITPC RPUMPC

PUMPS A B C OLITBC MUX C

DEMUX C

DCM DCM DEMUX L RPUMPUL OLITPUL A PUMP

DCM DCM RPUMPUL OLIIUL A B C PUMPS

DCM DCM DEMUX L MUX L

DCM DCM RPUMPUL OLITPUL A PUMP

DCM DCM MUX L OLITBUL A B C PUMPS

OLITBUL A B C PUMPS

CAD2

Configurable add/drop

Fig. 3.9

Two Fibre SURPASS hiT 7550 2.05 C+L Band, Raman Amplifier Configuration Raman amplification has several significant implications for DWDM systems. It allows the spacing between optical amplifiers to be increased, or alternatively allows the same amplifier spacing to be achieved with lower per channel EDFA output powers. Reducing the per channel EDFA output powers allows an increase in the total number of optical spans. Raman amplifiers are preferable applied to bridge single extra long spans. Note: Raman pump modules are not applicable with basic type OLI modules.

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Technical Description (TED)

3.2.3

OADM(U)
Siemens has developed a unique solution for its Optical Add/Drop Multiplexer Unidirectional (OADMU), for the addition and termination of optical signals at intermediate optical amplifier sites, by providing several implementation options. Therefore carriers have the flexibility to choose the option which best suits their network requirements. The options are scalable to allow the adding/dropping of one to n number of channels, where n depends on the option chosen and can be as much as 100% of the total line capacity. For an 80 channel C system this translates to 80 channels which can be optically and cost-effectively terminated at intermediate sites. All channels which are not added/dropped at an OADM site are passed through unaffected. OADM may statically or dynamically add/drop channels, can through connect or terminate subbands, and compensates dispersion. In case that preemphasis termination is needed for performance reasons, it is recommended to use a back-to-back OTT configuration with single channel through connection. There are two different types of OADM network elements in the current release: Remotely Congurable 20% OADM (see Chapter 3.2.3.2): realized with CAD2 modules, 20% of the channels can be added/dropped and they are congurable, the others are express channels (details are dened during system planning) Back-to-Back 100% OADM (see Chapter 3.2.3.3): all channels can be added or dropped via two OTTs with a channel connection unit CCU in between

Additional OADM configurations with static add/drop channels or a mixture of dynamically configurable and static add/drop channels would be deliverable on customers request only.

3.2.3.1

Optical Path
Fig. 3.10 gives one example of an OADM configuration. It shows the optical path of the configurable OADM with CAD switchable add/drop modules, a configuration for C band standalone operation at 50 GHz channel spacing. Side 1 is equipped with a raman pump module in front of the line preamplifier module OLITPNC, side 2 is equipped with pump A, B, and C modules for the booster amplifier modules OLITBNC. The Optical Multiplexer/Demultiplexer modules OMDFIC and OMD2IC contain the band filters for separation of the blue and red sub-bands (within the C band) and the interleavers to get a 100 GHz grid (required for the subsequent channel add/drop) from the given 50 GHz channel spacing. Modules EAM4 are used for power equalizing of the four subbands. An OSCTUI module terminates and processes the OSC on each side of the OADM. With the OPA module the C band is monitored on line sides (two line sides for intermediate NEs like OLR and OADM) in both transmission directions, to get optical performance information on a per channel basis for the incoming and outgoing channels (4 measuring ports).

Figures on a greater variety of OADM configurations are given in the Installation and Test Manual ITMN.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

Fig. 3.10

OADMU with CAD2x Modules, Optical Path for C Band Standalone

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Technical Description (TED)

3.2.3.2

Remotely Configurable 20% OADM


(See Fig. 3.10 also). It is possible in each of the 20 channel sub-bands to drop up to 20% of the maximum traffic capacity, i. e. up to 4 channels via two serially cascaded optical switch modules named CAD2. Each of these 4 channels may be remotely configured as an add/drop channel or to a through state via the network management system. The CAD2 module is responsible for the extraction of two wavelengths and insertion of the same two wavelengths being transmitted in one direction, as seen in Fig. 3.11. Therefore two CAD2 modules are required for bidirectional channel operation, and it is assumed that all channels are bidirectional. Two wavelengths must be chosen during the network planning and design stage from a total of 8 wavelengths (actually four pre-assigned wavelength pairs) per sub-band, which means a total of 32 CAD2 modules in total (four CAD2 variants per sub-band x 8 sub-bands). It is also possible that only one wavelength of the two is actually equipped, and the second wavelength can be equipped later. For a detailed description of these modules, refer to Chapter "3.3 Functional Overview of the Modules".

CAD2

1 2

1 2

from EAM4 module

1 - 20

1 - 20

CAD2

Fig. 3.11

Remotely Configurable CAD2 Optical Switch Modules

Configuration changes such as the remote re-configuration of individual channels from through state to add/drop or vice versa, are non-traffic interrupting. This means a network operator can already prepare for a change in traffic topology by passing through a wavelength originally, and later configuring the same wavelength to be added/dropped at this OADM site. An upgrade port on the CAD2 module also allows a plug and play upgrade from 2 to 4 channel add/drop per sub-band, with the addition of a second CAD2 module in series with the first. E. g. un upgrading CAD2 module could be plugged into a neighbouring slot. As traffic requirements grow, it is possible to add remotely configurable add/drop channels to a currently unequipped sub-band without disturbing the traffic in the other sub-bands. In terms of total configurable add/drop capacity, it is possible to drop 16 wavelengths from the C Band (i. e. 16 from 80) and 16 wavelengths from the L Band, which makes a total of 32 wavelengths from 160. Only two single row subracks are required to house

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

the CAD2 modules required for 16 bi-directional add/drop channels in either the C or the L wavelength band. Power adjustment in the relevant subband is done automatically with the VOAs in the EAM4 module. Sub-band channels, where CAD2 modules are equipped, but whose wavelengths do not correspond to those of the particular CAD2 modules, i. e. the add/drop channel wavelengths, are referred to as express channels. Sub-bands where no add/drop requirements currently exist, and where no CAD2 modules are equipped, are directly connected from east to west and vice versa. Remark: for 20% OADM operation of RPUMP and PUMPA,B,C modules is not possible in both directions, only RPUMP+PUMPA modules in one direction and RPUMP + PUMPA,B,C modules in the opposite direction.

3.2.3.3

Back-to-Back 100% OADM


(see Fig. 3.12) Back-to-back 100% OADM is applied for add/drop nodes with high required flexibility and add/drop capacity. It is also called optical network node ONN and offers 100% access to all used channels with absolutely free selection between path-through and add/drop, where full remote control is possible and no manual work has to be done locally. This type of OADM consists of three network elements: It is realized as two back-to-back terminals (2 network elements OTT) with full demultiplexing and multiplexing and a channel connection unit (network element CCU, see Chapter 3.2.4 also) with single channel EDFAs in between. The OTTs contain the OLI amplifier modules and the demultiplexer/multiplexer units, the network element CCU with single channel amplifier modules OCA without switches or OCAS with remotely configurable switches. In the back-to-back 100% OADM demultiplexer modules from the ODA (with VOAs) type are required. The add/drop function is remotely configurable on these channel amplifier/switch modules OCAS/OCS of the CCU. Use of single channel amplifier in CCU is provided for 50 GHz systems. Instead of these OCA(S) modules in the CCU, also OCR transponders in a network element SURPASS hiT 7540 could be connected to the OM20/OD20 modules of the OTTs. Due to the 8 subracks limit for CCU, a maximum of 7 x 9 + 8 = 71 OCAS modules can be equipped in one CCU network element, each module connecting 2 channels per direction. Thus a maximum of 71 x 2 = 142 bidirectional channels can remotely be configured in one CCU. For a larger number of remotely configurable channels an additional network element CCU is required. As an example, Fig. 3.12 shows a back-to-back 100% configurable OADM for C band standalone operation with 50 GHz channel spacing. Combinations of demultiplexer/multiplexer modules ODA20/OM20 and filter/interleaver modules are needed in the OTTs. Equipping with demultiplexer/multiplexer modules is mandatory for all used subbands.

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Technical Description (TED)

Note 1): As shown for subbands C3C4, the remaining subbands are also fed via OCA(S) modules.

Fig. 3.12

Back-to-Back 100% Configurable OADM (C Band Standalone, 50 GHz)

Note 1)

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

Between demultiplexer and multiplexer modules of both OTTs, channels may be treated as required: connected via CCU, using amplier/switching modules OCAS (for congurable add/drop channels, as shown in Fig. 3.12) or OCA (amplifier modules) or used as xed add/drop channels (via interfaces of the modules ODA20/OM20 in the OTTs). Regardless of their designation as add/drop or express, all channels have to be multiplexed/demultiplexed. Every OTT terminates the respective link of the SURPASS hiT 7550 2.05 and thus preemphasis is terminated in this type of OADM. Single channel amplifiers (OCA/OCAS modules) cope with polarization dependent loss (PDL) and enable intermediate preemphasis in a ultra-long-haul path.

3.2.3.4

Connectivity Options
Although the optical Add/Drop hardware modules, whether fixed or remotely configurable are symmetrical in nature, there is no requirement for symmetrical add/drop traffic connectivity. Asymmetrical architectures are also supported. For example, the following OADM topologies are supported (see Fig. 3.13).

Symmetric OADM Add/Drop

# of added/dropped wavelengths

# of added/dropped wavelengths

number of wavelengths = X

through channels

number of wavelengths = X

OLRU OADMU

Asymmetric OADM Add/Drop

# of added/dropped wavelengths

# of added/dropped wavelengths

number of wavelengths = X

through channels

OLRU OADMU

number of wavelengths is <X or >X

Fig. 3.13

Symmetrical and Asymmetrical OADM Architectures

3.2.3.5

OADM Cascadability
The limit to the number of OADMs which can be cascaded in a SURPASS hiT 7550 2.05 DWDM network depends on the following factors: the applied FEC code, the wavelength spacing, the required total EOL capacity and the number of the same wavelength CAD2 modules in series (details are defined during system planning).

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Technical Description (TED)

3.2.4

CCU
The channel connection unit (CCU) network element is applied to amplify single channels and/or to switch them between 2 locations (add/drop or pass through with 2x 1:2 switches). It houses the amplifier modules OCAC, the amplifier/switch modules OCASC and the switch modules OCS, controlled by one MCU module in the main subrack and by an SMU module in any additional CCU subrack. Each CCU subrack also contains an SAB module with bus termination resistors. CCU can support OCAC, OCAL, OCASC, OCASL and OCS modules in any mix.

L-Band amplifiers OCAL and OCASL are not available in the current release. The switch module OSC is not tested for this release. The OSCTUT module in the CCU main subrack provides shelf management (like the SMU module) and TIF functions. It also supports (reduced) alarming (e. g. module problem and TIF alarms). TIF interfaces are specified like those of the remaining NE (OTT, OLR, OADM). The CCU also uses the same connector panel COPA. With CCU network elements, several OTTs and OADMs can be connected together. Either static connections can be built with OCA (optical channel amplifier) or dynamic add/drop connections can remotely be built with OCAS (optical channel amplifier with integrated switch) or OCS (optical channel switch). With CCU this tasks can be used in back-to-back 100% OADM also (see Fig. 3.14).

Optical line interface

Optical line interface

Dispersion compensation

Attenuator/ Dispersion compensation

DeMux

Mux

OCA
in out

drop

in
50/ 50 C

OC(A)S

out

add

CCU
drop add

Fig. 3.14

CCU: Principal System Environment of OCA and OC(A)S Modules OTTU and OADMU can be combined optionally with CCU network elements for transparent through connection of optical channels. In the CCU single channel amplifiers OCA or OCAS are required for this.

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

A maximum of eight subracks with up to 71 OC(A) (S) modules may be controlled by one MCU module. This results in 142 possible bidirectional channels. Single row subracks are used for better cooling of the uncooled pump lasers of OCA(S).

3.2.5

OADM Ring Closure


(see Fig. 3.15) OADM rings are attractive for medium distance Core and regional applications. In OADM ring configurations (without 3R regeneration at a terminal) you must avoid it to connect lasers in a loop. There has to be at least one discontinuity/interruption in the optical path for every wavelength. The ring closure without 3 R regeneration of express channels at a point is achieved as follows: The signals must be demultiplexed and re multiplexed at one point in the ring with two OTTs: The interconnection of express channels is done via OCA modules (equipped in a CCU network element) . The two OTTs are set back to back against each other. The interconnection between the two OTTs may also be established via OCAS amplifier/switch modules for remotely configurable OADM function. No optical-electrical-optical (oeo) conversion is needed for this. The terminal preamplifier OLITP gets 3 PUMP modules to achieve high channel powers at the output of the demultiplexer. The OTT at the Tx side is configured via the element manager for a lower input power threshold. In case of ring closure the OTT accepts input powers at the OM20 module down to -10 dBm. In this way signals can be directly interconnected between demux output of one OTT and mux input of the second OTT.
Only one band and one direction shown OTTU
OLITP

OTTU
OLITB

12

3
OMDF OMDF OM20 OM20 PUMP A ODA20 ODA20 PUMP B PUMP C

12

3
PUMP A PUMP B PUMP C

UDCM

attenuator / UDCM

patch cord connections

(in the current release: connections only via OCA or OCAS modules)
20 % add/drop OADMU 20 % add/drop OADMU

Fig. 3.15

OADM Ring with two Back to Back Terminals (2xOTTU)

The maximum ring circumference depends on the channel count due to the optical performance penalty at the two back to back OTTs. In case of larger ring diameter, a ring can be built with two times two back to back OTTs placed at different locations. In this case the ring consists of 2 links and in each link 2

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Technical Description (TED)

express channels have to be present for link startup and preemphasis. No end to end express traffic is going around the complete ring and the performance will increase, due to distributed preemphasis.

3.2.6

Networking with OADMU/OTTU


(see Fig. 3.16) Due to the flexible network element architecture of OADMU/OTTU and CCU it is possible to generate meshed network architectures without the need of optical-electrical-optical (oeo) conversion.

20 % add/drop line1 OADMU line1 local fix/ flexible add/drop OTTU line3 line1

20 % add/drop OADMU CCU (OCAS)

line1 local fix/


flexible add/drop

CCU (OCAS)

OTTU

20 % add/drop

line2
line2

OADMU

line2

Note: only unidirectional traffic configuration shown! Fig. 3.16 Network Configurations with Combinations of Network Elements

By combining the network elements, a static network node of grade n can be built without restrictions. As the OCAS module integrates only 2:1 switches, a service can be dynamically switched only between 2 ports, e.g. line1/local add/drop or line1/line2 or line1/line3. SURPASS hiT 7550 2.05 planning SW and control SW supports a quasi-static mesh optical network consisting of defined links, which are limited by OTTUs for optical link control. The optical wavelength path can continue at the OTTU, so the OTTU does not terminate the optical channel.

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Information SURPASS hiT 7550 2.05

3.3
3.3.1

Functional Overview of the Modules


Modules used for NEs
The next table lists features and functions of the various SURPASS hiT 7550 modules.
Module Name MCU NE Type Features/Remarks

All NE Types

The Main Control Unit is the central control element of the SURPASS hiT 7550 system which provides interfaces to the Local/Network Craft Terminal and a Q3 interface to the customers network management system. The MCU is responsible for fault, configuration, performance, and security management. The MCU requires 1 slot. The Management Information Base (Small) module stores all persistent management data handled by the MCU. The MIBS requires 1 slot in combination with the SAB. The Subrack Address Board only consists of bus termination resistors. The SAB requires 1 slot in combination with the MIBS. The SABM includes a CAN bus repeater. It is only used in OADM NEs. At an OADM, the SABM replaces the SAB in the Subrack that contains the MCU. The SABM requires 1 slot in combination with the MIBS. Optical Supervisory Channel Termination module Terminal, is required in each OTTU to terminate and process the OSC. The OSCTUT modules require 2 slots. Optical Supervisory Channel Termination module Inline, is required in each OLRU and OADMU to terminate and process the OSC on each side of the NE. The OSCTUI modules require 2 slots. The Supervisory Management Unit is equipped in all subracks without an OSCTU and performs a subset of OSCTU functions such as card present management. The SMU2 modules require 1 slot. Optical Performance Analyzer is used to provide detailed optical performance information on a per channel basis, i. e. channel power, OSNR and wavelength can be measured and recorded. The OPA module requires 3 slots. Optical Line Interface Terminal Preamplifier. TP type OLIs are equipped in the terminal sites (OTTU and OADMU). They contain a preamplifier for one band in one direction. Type C/L refers to the wavelength band used, where: - OLITPL is used in standalone L band systems, - OLIPTNC is used in standalone C band systems, - OLITPUL (together with OLITPC) is used in C+L band systems and - OLISTPNC is used for short span standalone C band systems (with basic version of amplifier). The output power of the OLITPC/L/UL and OLISTPNC is normally +19 dBm (+19.5 dBm for OLITPNC), but can be increased via the OLI pump modules described below. All OLI modules require 3 slots.

MIBS

All NE Types

SAB

All NE Types

SABM

All NE Types

OSCTUT

OTTU

OSCTUI

OLRU & OADMU All NE Types

SMU2

OPA

OTTU & OADMU & OLRU

Preamplifier: OLITPC OLITPL OLITPUL OLITPNC (standard or extended version) Preamplifier: OLISTPNC (basic version)

OTTU Rx & OADMU

OTTU Rx

Tab. 3.7

Plug-in Units for the SURPASS hiT 7550 System

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Booster amplifier: OLITBC OLITBL OLITBUL OLITBNC (standard or extended version) Booster amplifier: OLISTBNC (basic version) Inline amplifier: OLIIC OLIIL OLIIUL OLIINC (standard or extended version) Inline amplifier: OLISINC (basic version) PUMPA

OTTU Tx & OADMU

OTTU Tx & OADMU Tx

Optical Line Interface Terminal Booster. TB type OLIs are equipped in the terminal sites (OTTU and OADMU). They contain a booster amplifier for one band in one direction. Type C/L refers to the wavelength band used, where: - OLITBL is used in standalone L band systems, - OLITBNC is used in standalone C band systems, - OLITBUL (together with OLITBC) is used in C+L band systems and - OLISTBNC is used for short span standalone C band systems (with basic version of amplifier). The output power of the OLITBC/L/UL is normally +17 dBm (+18 dBm for OLITBNC and OLISTBNC), but can be increased via the OLI pump modules described below. All OLI modules require 3 slots.

OLRU & OADMU

OLRU & OADMU Tx

Optical Line Interface Inline. I type OLIs are equipped in the inline amplifier sites (OLRU). They contain an inline amplifier for one band in one direction. Type C/L refers to the wavelength band used, where: - OLIIL is used in standalone L band systems, - OLIINC is used in standalone C band systems, - OLIIUL (together with OLIIC) is used in C+L band system and - OLISINC is used for short span standalone C band systems (with basic version of amplifier). The output power of the OLIIC/L/UL is normally +17 dBm (+18 dBm for OLIINC and OLISINC), but can be increased via the OLI pump modules described below. All OLI modules require 3 slots.

All NE Types

The PUMPA module is an OLI pump module which is used to increase the optical output power of an OLI amplifier to +20dBm. The PumpA requires 1 slot. The PUMPA/PUMPB/PUMPC consists of 3 OLI pump modules which are used to increase the optical output power of an OLI amplifier: to +20 dBm for PUMPA, to +22 dBm for PUMPA+PUMPB, to +23 dBm for PUMPA+PUMPB+PUMPC. The PUMPA/PUMPB/PUMPC modules require 3 slots. Raman pump for C/L/UL band. Optional Raman pump modules can be installed to provide Raman amplification. C/L refers to the wavelength band used, where RPUMPL is used in standalone L band systems and RPUMPUL is used in C+L band systems. All Raman pump modules require 2 slots. The Optical Multiplexer/Demultiplexer units perform the optical multiplexing/ demultiplexing of 20 channels according to the C and L subband based scheme. The optical power levels of all inputs and outputs are monitored. The OM20 also contains a VOA at each individual channel input. All OM/OD20 modules require 4 slots.

PUMPA PUMPB PUMPC

All NE Types

R-PUMPC R_PUMPL R-PUMPUL

All NE Types

OM20/ OD20

OTTU & OADMU

Tab. 3.7

Plug-in Units for the SURPASS hiT 7550 System (Cont.)

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

ODA20

OTTU & OADMU

The Optical Demultiplexer (with VOA) units perform the optical demultiplexing of 20 channels according to the C and L sub-band based scheme. The optical power levels of all inputs and outputs are monitored. The ODA20 also contains a VOA at each individual channel output. All ODA20 modules require 4 slots. The OMDFIX modules contain the band filters for the separation of the blue and red subbands within the C and L band. They also include the C-red and L-blue band frequency interleavers to achieve a 100 GHz frequency separation among the carriers from the incoming 50 GHz signal, and vice-versa. The OMDFIX modules require 2 slots. The OMDFX modules contain only the band filters for the separation of the blue and red subbands within the C and L band. Hence, only 100GHz spacing of wavelengths is supported. The OMFX modules require 2 slots. The OMD2IX modules contain additional frequency interleavers in the Cblue and L-red bands to achieve a 100 GHz frequency separation among the carriers from the incoming 50 GHz signal, and vice-versa. Together with the OMDFIC & OMDFIL the entire C & L band is supported for 50 GHz wavelength spacing. The OMD2IX modules require 2 slots. The CAD2 module is used to drop/insert wavelengths from/into the aggregate signals in one direction. It is possible to remotely configure the 2 wavelengths as either add/drop or through channels. Up to two modules can be used per OADMU subband in each direction. The CAD2xxxx(B) modules require 2 slots. The power equalizing module contains 4 VOAs, one for each of the 4 subbands. The EAM4x modules require 2 slots. The OCxx Optical Channel Amplifier Module is used to configure single express or add/drop channels in a channel connection unit CCU. OCAC: four amplifiers (C band) enable four express channels. OCASC: four amplifiers (C band) with each an optical switch at their inputs and outputs allow either express or add/drop channel configuration. OCS: like OCASC but without amplifiers and for both bands (C, L) Unidirectional Dispersion Compensation Modules with slope compensating DCFs for the C or L band for SSMF. Unidirectional Dispersion Compensation Modules with normal compensating DCFs for the C band. Unidirectional Dispersion Compensation Modules with slope compensating DCFs for the C or L band for NZDSF(+) fibre and TWRS slope compensation. Unidirectional Dispersion Compensation Modules with slope compensating DCFs for the C band for NZDSF(-) or DSF fibre. Unidirectional Dispersion Compensation Modules with slope compensating DCFs for the C or L band for NZDSF(+) fibre and LEAF slope compensation.

OMDFIC / OMDFIL

OTTU & OADMU

OMDFC/ OMDFL

OTTU & OADMU

OMD2IC/ OMD2IL

OTTU & OADMU

CAD2xxxx(B)

OADMU

EAM4C EAM4L OCAC/ OCASC/ OCS

OADMU

CCU

UDCMC/Lxxx

All NE Types

UDCMCxxxA

All NE Types

UDCMC/L xxxN

All NE Types

UDCMC xxxP UDCMC xxxH

All NE Types

All NE Types

Tab. 3.7

Plug-in Units for the SURPASS hiT 7550 System (Cont.)

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3.3.2

MCU Module
The Main Control Unit (MCU) provides the central monitoring and control functions for the system (SEMF function). It also performs the Management Communication Function (MCF), i. e. handling the information for the F, Q and ECC communication interfaces. Internal control is performed via the PCB (Peripheral Control Bus) which consists of two asynchronous serial busses connecting the MCU to all modules which have their own Local Card Controller (LCC). A second bus system called the CAN Bus (a common serial bus communication protocol) is an asynchronous serial bus used for very fast intercard communications for time-critical operations such as optical link control. Using these interfaces, the MCU performs the following functions: Fault Management Monitors all system alarms and extends their states to the network management system and the rack alarm bus. It also extends the information to the Local/Network Craft Terminal. Performance Management On request, it sends all optical performance management information to the network management system and the Local/Network Craft Terminal. Conguration Management Congures the system to either default settings or to settings passed to it from the network management system or the Local/Network Craft Terminal. Security Management Controls the individual access via the network management system or the Local/Network Craft Terminal to particular NE functions via a hierarchical security management user ID and password concept. Equipment Management Monitors the actual and required subrack equipping. Communication Management Implements the Management Communication Function (MCF) so that communication to all NEs from the Network Management system is possible. Software Management Responsible for all software downloads, uploads, and software integrity. Real Time Management Controls the real time clock Providing Bw7R or NEALI shelf and rack alarm outputs NE alarms LEDs control (major/minor, for communication and equipment alarms) The MCU requires the space of one slot in the SURPASS hiT 7550 2.05 subrack, and is also responsible for detecting the presence of the MIBS and SAB in the same subrack. Fig. 3.17 shows the MCU block diagram.

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Information SURPASS hiT 7550 2.05

NUBAT1 NUBAT2 NUBAT3 NUBAT4

Onboard Power Supply


NUBAT1,2,3,4 Supervision

Ethernet2 Terminal1 (Modem) Terminal2 Serial 1 Serial 2

Backside Cache
1 MByte
ICE connectors for debug purpose 200 MHz

MPC755

PLD
HW Config

UART (SCC2) UART (SMC1) HDLC (SCC3) HDLC (SCC4)

MICTOR

1 Bank

SDRAM
128 MByte

PowerPC 60x Bus


64 66 MHz Latch_Mux /Data_Mux

SPI

Port Pins

Flash EPROM
2 Banks 32 MByte each bank

internal signals and MIBS 64

TDMB1 (MCC1) TDMC2 (MCC2)

TDM2 TDM3 TDM4 MII reserved Comm Debug /JTAG RESET

Supervision
FPRE_L

NUBAT 4

FPGA Adaption

16 IDMA1/2

TDMD2 (MCC2) MII (FCC2)

MIBS Card up to 32 MByte

16

EDI
CLK driver 8 32 MHz 20ppm 2 66 MHz to 8260,755,SDRAM .. 32 MHz to FPGAs

Fig. 3.17

MCU Block Diagram

3.3.3

MIBS Module
The Management Information Base Small (MIBS) module accommodates up to 32 Mbyte of FEPROM required for the persistent storage of all configurable parameters handled by the MCU. The MIBS itself contains all data visible and changeable via a Q3 interface. A subset of the MIBS, the NE-VCDB (Variable Configurable Database) contains the total variable configuration parameters of an NE. Only the NE-VCDB is persistently stored on the MIBS module, as a backup version of the master stored on the MCU in external SRAM. Hence, if an MCU happens to fail, a replacement can be made without losing the entire contents of the MIBS. The contents of the MIBS also survive a power failure or 'coldstart' of the NE.

Port Pin

COP

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Core Communication Structure

RTC 35ppm 32 kByte NVRAM

SPI TDM1

17

TDMA1 (MCC1)

STD Communication

P3V3 P1V8FP P2V5FP P2V0PC P2V5PQ P12V0 P5V0 ULED

MPC8260
MII (FCC1) MII (FCC3)

Ethernet1

Information SURPASS hiT 7550 2.05

Technical Description (TED)

One MIBS module is required per NE, and is fitted into the extreme bottom right slot of the subrack equipped with the MCU. These are implemented as replaceable units to ease their repair in case of malfunction. Replacement of the MIBS does not cause any interruption to the traffic being carried over this particular NE. The MCU is responsible for the module detection of the passive MIBS module. The MIBS does not contain an EEPROM for Card Inventory Management information.

3.3.4

SAB Module
The Subrack Address (SAB) Module is named so because it previously held the subrack address information for each subrack so that it could be uniquely identified for inter-subrack data communications between the many subracks of an NE. This function has moved to the NE Alarm Panel (NEAP), however the SAB is still required as it contains several bus termination resistors required for inter-subrack data communications. One SAB module is required per single row subrack, and one per double row subrack, and is fitted into the extreme bottom right slot of each row of each subrack. The SAB modules are implemented as replaceable units to ease their repair in case of malfunction. The OSCTU or SMU2 modules, via the Serial Peripheral Interface (SPI) Bus, are responsible for the module detection of the passive SAB module. The SAB does not contain an EEPROM for Card Inventory Management information. Fig. 3.18 shows the SAB/SABM block diagram.

PCB1

PCB2

PCB THROUGHCONNECTION OR TERMINATION

MPUPROUT

CONTROL

CAN1

CAN TERMINATION and REPETITION *) * SABM only

CAN2

PWR_BUS ULED PWR

Fig. 3.18

SAB and SABM Block Diagram

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3.3.5

SABM Module
The SABM (see Fig. 3.18) includes an additional CAN bus repeater/amplifier. It is only used in the main subrack (the subrack that contains the MCU) of the OADM NEs. Here, the SABM replaces the SAB. The SABM requires one slot in combination with the MIBS.

3.3.6

OSCT Module
The Optical Supervisory Channel Termination (OSCT) module is an active module (i. e. it has it's own local module controller) and is mainly responsible for the optical and electrical termination of the 2 Mbit/s Optical Supervisory Channel (OSC) which is transmitted on a separate wavelength to the main payload traffic. Other than OSC byte processing the OSCTU is responsible for providing the electrical interfaces for the V.11 user channels, the EOW 4-wire interfaces, TIF alarm contacts, T3in clock input, SPI bus connection to passive modules, LED control, FAN control and supervision, inventory management and clock synchronization. The electrical interfaces are found either on the connector panel (COPA), the NE alarm panel (NEAP), or on the OSCTU module itself (i. e. for module LEDs), all accessible via the front of the NE. Fig. 3.19 shows the OSCT block diagram.

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Technical Description (TED)

NUBAT1 NUBAT2 NUBAT3 NUBAT4


SLOOP1 SLOOP2

PUBAT

LAMPTEST

SLOTADR#1-5

SUBRADR#1-3

PCB CAN

ALCOM PWFNC

OMD-AS#1-4
FAN-LAMP#1-2 FAN-AS#1-2 FAN-PR#1-2

ULED PWR-BUS

CA-PR

PSU
TX-I-out_
D
_A

LCC
A
_B

SPI-DI SPI-DO SPI-CO SPI-ADR#1-5

SPI

SDI AUX MPUFAIL

+3,4/+1,8

TEC_A TEC_B

+12 -12

+5

-5

SMA _BUS

Status

Fail

APSD_B

APSD_B

TXPoti

FE CPS

24
TIFCOM_o

RX
Tosc _B
1625 1625

B_RX

F
Iout Poti

4
TIF-IN

4 16
TIFCOM_i
DCC1DO DCC1DI DCC12CO DCC2DI DCC2DO DCC3DO DCC3DI DCC34CO DCC4DI DCC4DO

TIF DCCO

TX

B_TX

PLL _B

SURPASS hiT 7550

DCCM

T2

OSCC2

T3IN
Z

T3
PLL _A

T15 MIN

T0 V11-1

SYNC

V11-1DO V11-1CO V11-1CO V11-1DI V11-2DO V11-2CO V11-2CO V11-2DI

OUT

RX
Tosc _A
1625 1625

IN

A_RX

F
Iout Poti

OUT

V11-2

IN

A_TX
APSD_A

HS
OW1 OW2 OW_LP

TX
APSD_A

SICOFI

EOW

OSCTU
Fig. 3.19 OSCTU Block Diagram

DTMF

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A comprehensive list of OSCTU functions including those just stated is given in the following: Provides a T3in clock input interface for incoming 2048 kHz for OSC synchronization and real-time clock synchronization. Note that no 1.5 Mbit/s or 2 Mbit/s clocks are implemented because no complete SSM is required for OSC synchronization Provides all cross connections from terminated OSC bytes to the electrical interfaces, or cross connections for bytes which are to be passed through the NE unterminated User congurable clock priorities via software for T3in & the T2 internal clock Implements a timing marker byte to prevent OSC timing loops User congurable EOW 4-wire electrical interface properties via software for ETSI or ANSI customer requirements User-congurable EOW channel encoding/decoding law of the 4-wire interfaces via software to A-law (ETSI) or -law (ANSI) The EOW supports 3-digit selective calling, group or collective calling EOW Ring Manager function: enables selection of one OTT as a ring manager to allow ring EOW congurations for protection purposes User-congurable Telemetry Interfaces (TIF) providing 4 outputs (actors) and 16 inputs (sensors) per OSCTU module Supervision of FAN units, i. e. activation of FAN alarms Controlling the LED display on the Network Element Alarm Panel (NEAP) for the FAN and EOW functions Controlling the LED display on the OSCTU module itself, red (alarm) and green (active) LEDs Detection and reporting of all OSC alarms, such as LOS/LOF, SD, RDI, & EXC Module present monitoring of the FANs, UDCMs and SAB modules. The module present monitoring of all other modules is performed by the SMU2 or the MCU, whichever is present in each subrack Providing an SPI (Synchronous Peripheral Interface) for communication to passive modules in the same subrack (i. e. OMDFx, OMDFIx, OMD2Ix) and UDCMs Storage and retrieval of module inventory data management on EEPROMs in OSCTU and in other passive modules in the same subrack, and to UDCMs Power feeding to other passive modules in the same subrack, and to UDCMs.

3.3.7

SMU2 Module
The Subrack Management Unit (SMU2) is an active module (i. e. it has it's own local module controller) and is equipped in all subracks except for the main subrack containing the OSCTU, and performs a subset of the OSCTU functions. These include FAN control and supervision, module present monitoring of modules within the subrack, SMU2 LED control, user-configurable TIF providing 4 outputs and 16 inputs, and NE alarms LED control (minor/major equipment alarms). The SMU2 implements an SPI Bus connection to the passive modules in the same subrack which feeds a power supply to these passive modules and enables the retrieval of inventory data stored on EEPROMs in these modules. Fig. 3.20 shows the SMU2 block diagram.

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Technical Description (TED)

NUBAT1 NUBAT2 NUBAT3 NUBAT4


SLOOP1 SLOOP2

PUBAT

LAMPTEST

SLOTADR#1-5

SUBRADR#1-3

PCB CAN

ALCOM PWFNC

OMD-AS#1-4
FAN-LAMP#1-2 FAN-AS#1-2 FAN-PR#1-2

ULED PWR-BUS

CA-PR

PSU
+3,4/+1,8 TEC_A TEC_B +12 -12 +5 -5

LCC
SMA _BUS

SPI-DI SPI-DO SPI-CO SPI-ADR#1-5

SPI Status

SDI AUX

Fail

FE CPS TIF

24
TIFCOM_o

4
TIF-IN

4 16
TIFCOM_i

SMU2
Fig. 3.20 SMU2 Block Diagram

OSCC2

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3.3.8

OPA Module
(see Fig. 3.21) The Optical Performance Analyzer module (OPA) is used for optimizing the transmission of optical signals and for monitoring the performance of the optical signals in a DWDM environment. Main functions of the OPA module: Measures the optical signal power, wavelength and OSAR of carriers Manages the measurement of the correct optical input signal for the respective optical link state and network element type Participates in preemphasis setting and power optimization Allows to display a scan spectrum, i. e. for each of up to eight scan ports (at OLI module outputs) and for a selectable frequency range, the laser power values are presented in regular steps over the frequency at the element manager screen (OPA module serves as spectrum analyzer) Monitores internal power and OSA failures and reports them Runs automatic performance measurements of supervised optical carriers Generates channel and carrier alarms for all supervised optical carriers Calibrates (in a special factory mode) optical power loss through optical switches and couplers and stores calibrated data on the module EEPROM The OPA module consists of a module mounted Optical Spectrum Analyzer (OSA) with additional logic added to control and support the OSA within the SURPASS hiT 7550 2.05 system.
C/L splitter MonC1 4/8 optical inputs 2:1 Optical switch 2:1 Optical switch 4 channel version 2:1 Optical switch

OSA (Optical Spectrum Analyzer) SIPAC connector

MonL4 red LED green

RS232 115.200 bps TTL optical switch control

Slot address bus LCC (Local module controller) Lamp test PCB bus CAN bus ULED

SDI port Debug

OPA

18.432 MHz clock, for RS232 rates

Power supply (OSA) 12 V

Fig. 3.21

OPA Module, Block Diagram

OPA is available either as four or eight channel version: so it has up to eight external optical inputs, MonC1 to MonC4 for the C band and MonL1 to MonL4 for the L band.

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Technical Description (TED)

Pairs of inputs e.g. MonC1 and MonL1 are coupled via a C&L band filter into one optical switch input (pair 1 to input 1 and so on). In case of the 4 channel version only the inputs MonC1, MonC2, MonL1 and MonL2 are valid. A 4:1 switch at the optical inputs is implemented as cascaded three times 2:1 switches and four C/L splitters. The OPA behavior is controlled by message transfer via PCB bus and CAN bus. The messages on the PCB bus generally control configuration and management, whereas the messages over the CAN bus control the operation, especially during optical link startup. The OPA also sends asynchronous notification messages containing performance data and alarms to the master controller of the PCB bus (MCU module). Behaviour of the OPA module at several optical link states: During Pre-start state (the startup), the OPA does not monitor optical links. When preemphasis is adjusted, the OPA performs continuous high resolution measurements of OSAR and power values for the link. When the data is requested, the OPA hands over the measured optical parameters (power and OSAR) to the OSCT module via CAN bus. During preemphasis setting phase, no alarming and no performance monitoring takes place for the inputs. In the running state (and enabled supervision for carriers on an input), which is the normal operational state of optical links, OPA actively monitors the power levels and signal-to-noise ratios of the supervised carriers. It also reports alarms if any of the measured values is outside specied thresholds, and sends performance reports to the MCU module every 15 minutes.

3.3.9

OLI Modules
The Optical Line Interface (OLI) modules are active modules (i. e. they have their own local module controller) whose primary function is the optical amplification and control of the main DWDM traffic signal. Fig. 3.22 shows the system environment of OLI modules.

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Information SURPASS hiT 7550 2.05

ext. Pump(s)

OLIx(U)L
Standalone L-Band or booster only

OLI-L Band EDFA Subsystem

Standalone L-Band or preamp. only

ext. Pump(s)
From line or MUX

OLIxC
C/L-Split OSC-Split

OLI-C Band EDFA Subsystem

C/L-Comb. OSC-Comb.

To line or DEMUX

Raman Pump

Raman Pump

OSCT Card

Fig. 3.22

System Environment of OLI Modules

An unidirectional C- or L-band EDFA amplifier is the central element of every OLI module. OLI module variants can provide additionally C- and L-band splitters to combine a C-band OLI module with an upgrade L-band amplifier. In every configuration the OSC channels are tapped off by the main module and are connected to the associated OSCT/SMU2 module. There are three general types of OLI modules: a cost optimized basic type (in standalone C Band systems only) for short spans up to 90 km and transmission lengths of up to 800 km (for regional and long-haul applications); no external pumps and no Raman pump can be used with a basic type OLI, i. e. the output power is restricted to about +18 dBm a standard type for medium span lengths an extended type for longer spans A mix of basic, standard, and extended type OLI modules is possible on transmission links. Different OLI module types are available (see Tab. 3.7) according to the application in the network element: for C or L or L+C band either as preamplier (at the receive side of the optical path) or booster (at the transmit side of the optical path) or inline (in regenerators along the route) amplifier type as basic or standard or extended type Fig. 3.23 shows the OLI module basic block diagram.

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Technical Description (TED)

PD

GTM

PUMPA

PUMPB

EDFA 6

EDFA 5

DCM

GTC

PD P-LD

EDFA3

P-LD PD

EDFA 4

PD

PD

P-LD

P-LD

VOA

P-LD PD

EDFA2

DSP

EDFA1

P-LD

LCC

PUMPC

P-LD

P-LD

EDFA

Fig. 3.23

OLI Block Diagram The EDFA gain block provides the basic optical function. It is a scalable broadband optical amplifier.

PD

OLI

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

Each standard or extended type OLI module has the identical high-performance 3-stage EDFA for C band or L band with gain control and output power control for any of the 3 stages. A basic type OLI module has a cost-effective 3-stage C-band EDFA with gain control and output power control. The EDFA control is provided by the control of pump power and the current of the different amplifier sections. The signal and pump powers of the different stages can be monitored by internal photodiodes. The OLI module is equipped with six on-board pump lasers (only two in the basic type OLI) which enables a maximum total optical output power of approximately +17 dBm to + 19 dBm. For higher output powers, external OLI PUMP modules (Pump A, B, and C) are required (not applicable for the basic type OLI), getting a maximum output power of + 24.5 dBm. A variable optical attenuator (VOA) allows the operation of the EDFA at different gains respectively gain tilts with optimum noise figure. With the extended type OLI module, a gain tilt monitor (GTM) measures the actual gain tilt at the output of the OLI. A gain tilt control (GTC) compensates the spectral tilt induced by the EDFA itself, by the Raman pumps, or by Raman crosstalk. For this no continuous pretilt control applies, the tilt data (generated by the Transplan tool) are to be entered manually into the element manager. In the standard type OLI module, the GTC is used again to set predefined (fixed) tilt values, but there is no GTM circuitry. The basic type OLI has no GTM and no GTC; there a pretilt correction is done via VOA. The basic OLI type is used in the C band only as inline, terminal booster amplifier, and terminal preamplifier. It will preferably be found in shorter spans. The standard and extended type OLI are applied in the C and/or L band as inline, terminal booster amplifier, and terminal preamplifier. All this three OLI types are applied in the OTT, OLR, and OADM network elements. The extended type OLI module with its GTM facility allows to display an OLI scan spectrum; i. e. for a selectable frequency range, the laser power values (gain tilt) behind the third OLI amplier stage may be presented in regular steps over the frequency at the element manger screen (spectrum analyzer functionality). Each OLI module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system.

3.3.10

OLI PUMP Modules


The OLI PUMP modules are used to increase the output power of the preamplifier, booster amplifier and inline amplifiers on the various OLI modules. This modularity is necessary to support the large span loss range available with SURPASS hiT 7550 2.05, the different fibre types, and the large range of channel numbers supported. The OLI PUMP modules are active modules, which means they are equipped with their own local module controller (LCC). Fig. 3.24 shows the OLI PUMP modules block diagram.

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Temp. Reg. and Supervision

Power Supervision

Temp. Reg. and Supervision

PSU

Pump Laser 1 l1,2,3

Polarisation Combiner

PUMP_OUT l1,2,3

Pump Laser 2 l1,2,3

PUMP A PUMP B PUMP C

LCC

Fig. 3.24

OLI PUMP Block Diagram There are three OLI PUMP modules which each require one slot, namely PUMPA, PUMPB and PUMPC. Three configurations are supported, the PUMPA module alone, a combination of PUMPA and PUMPB as well as a combination of PUMPA, PUMPB and PUMPC. For typical OLI output power values see Tab. 3.6. In order to provide this, each PUMP module is equipped with two laser diodes where the pump signal wavelengths for PUMPA, PUMPB and PUMPC are 1480 nm, 1495 nm and 1465 nm respectively. The signals from the two laser diodes on each PUMP module are combined together into one pump laser signal via a polarization beam combiner. Then one signal is sent to the OLI via an optical/electrical cable. On the OLI module itself, which can receive inputs from up to three PUMP modules, the signals are combined via a WDM multiplexer. The electrical connection is important as it is used to determine whether the high optical power connection from the PUMP module to the OLI is closed. If not, the PUMP module power is automatically shut down. The PUMP modules contain Peltier controlling elements and temperature sensors, which trigger an appropriate alarm if the temperature exceeds the programmed thresholds. Each OLI PUMP module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system. For C and L wavelength bands, the same PUMP modules are used.

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3.3.11

RPUMP Modules
The Raman PUMP (RPUMP) modules are utilized to increase the number of spans, or to increase the length of the spans, or to improve the performance of a particular network. The Raman PUMP modules are active modules, which means they contain a local module controller. They require two slots in the SURPASS hiT 7550 2.05 subrack. The RPUMPC for the C Band contains 4 or 5 laser diodes with various wavelengths between 1409 nm and 1466 nm. Each of these laser diode signals is combined together before one signal is sent to the OLI via an optical/electrical cable. Likewise, the L Band RPUMP required for C+L Band systems, RPUMPUL, contains 3 or 4 laser diodes with the following wavelengths; 1482 nm, 1497 nm and 1513 nm. The output of the RPUMPUL is sent to the RPUMPC module via an optical twin cable. This is then combined with the pump laser signals generated on the RPUMPC module. For a Standalone L Band system the RPUMPL module utilizes two extra laser diodes with wavelengths 1452 nm and 1466 nm. This connection is important as it is used to determine whether the high optical power connection from the RPUMPUL module to the RPUMPC module, or the RPUMPC/L module to the OLI is closed. If not, the Raman Pump module power is automatically shut down. Each Raman PUMP module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system.

3.3.12

OMD Modules
The Optical Multiplexer/Demultiplexer (OMD) modules consist of the OMDFIC, OMDFIL, OMDFC, OMDFL, OMD2IC and OMD2IL. All these modules have no separate, local module controller. They are managed via the OSCTU or SMU2 modules via the SPI Bus, which means Card present information and Card Inventory Management information (stored on an EEPROM on each module) can be requested at all times. The OMD modules contain the subband filter and interleaver optical components necessary for the 160 channel multiplexing/demultiplexing structure. The C and L filters are used to separate the wavelengths into C-red/C-blue and L-red/Lblue subbands using standard optical reflecting filter technology. The C and L subband interleavers are used to convert a set of wavelengths with 50 GHz spacing to two sets of wavelengths with 100 GHz spacing and vice versa, so that final individual channel demultiplexing/multiplexing can be performed with a 100 GHz wavelength grid. The interleavers make use of Mach-Zehnder interferometer technology. In this design, an unequal fiber path length between two 3 dB couplers creates the interference. By carefully controlling the path length difference, the channel spacing can be set to the desired value. Because of the all-fiber design, this technology has very low loss, low dispersion, and small polarization-dependent effects. The temperature and power alarms for the OMD are supervised by the OSCTU or SMU2 equipped in the same subrack. Fig. 3.25 to Fig. 3.30 show the block diagrams of the particular modules. The abbreviations used in the figures have the following meaning:

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1C/1L 2C/2L 1C3478 2C1256f 1C1256i 2C1256i C12

1st C band terminal/L band terminal on board (MUX) 2nd C band terminal/L band terminal on board (DEMUX) 1st C band terminal on board for groups C3, C4, C7, C8 2nd C band terminal (filter side) on board for groups C1, C2, C5, C6 1st C band terminal (interleaver side) on board for groups C1, C2, C5, C6 2nd C band terminal (interleaver side) on board for groups C1, C2, C5, C6 terminal for C band groups C1 and C2

MUX
1C

C band filter red/blue red reflecting

1C1256

1C3478f 1C3478i

C band interleaver

1C34 1C78 2C1256

2C 2C3478f 2C3478i

C band filter red/blue blue reflecting

C band interleaver

2C34 2C78

DEMUX
OMDFIC Fig. 3.25 OMDFIC Block Diagram

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1L

L band filter red/blue red reflecting

MUX

1L3478

1L1256f 1L1256i

L band interleaver

1L12 1L56 2L3478

2L

L band filter red/blue blue reflecting

2L1256f 2L1256i

L band interleaver

2L12 2L56

DEMUX
OMDFIL Fig. 3.26 OMDFIL Block Diagram

1C

C band filter red/blue red reflecting

MUX

1C3478

1C1256

2C

DEMUX

C band filter red/blue red reflecting

2C3478

2C1256

OMDFC Fig. 3.27 OMDFC Block Diagram

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1L

L band filter red/blue red reflecting

MUX

1L3478

1L1256

2L

DEMUX

L band filter red/blue red reflecting

2L3478

2L1256

OMDFL Fig. 3.28 OMDFL Block Diagram

1C1256

C band interleaver

MUX

1C12

1C56 2C12

2C1256

C band interleaver

DEMUX

2C56

OMD2IC Fig. 3.29 OMD2IC Block Diagram

1L3478

L band interleaver

MUX

1L34

1L78 2L34

2L3478

DEMUX

L band interleaver

2L78

OMD2IL Fig. 3.30 OMD2IL Block Diagram

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3.3.13

OM/OD Modules
The Optical Multiplexer/Optical Demultiplexer (OM20/OD20) modules are active modules (i. e. they have their own local module controller) and are equipped in the OTTU and OADMU NEs to perform fixed 20 channel optical multiplexing and demultiplexing. The ODA20 is a variant of the OD20 with optical outputs adjustable in power. There are 8 OM20 modules (4 per C and L Band), 8 OD20 modules and 8 ODA20 modules, which vary only in the wavelengths supported by the 100 GHz dielectric filters implemented in each module. Each OM20 module has 2 dielectric filters, which multiplex 10 channels separately and then two groups of 10 channels together to form one 20 channel DWDM signal. Each OM20 channel input has a VOA implemented to control the power of this client input channel. The stepper motor controlled VOA wiper settings may be software controlled via the network management system. Each ODA20 channel output has a VOA implemented to control the power of this client output channel. The stepper motor controlled VOA wiper settings may be software controlled via the network management system. A sophisticated calibration procedure for the VOA elements is implemented in SURPASS hiT 7550 2.05 to ensure the accuracy of network setup. For optical power monitoring, monitor diodes are placed at each OM20 channel input, at the OD(A)20 input and at each OD(A)20 channel output so that channel powers can be monitored at the DWDM boundary inputs and outputs of the SURPASS hiT 7550 2.05 DWDM system via the network management system, as well as the total DWDM input power before the final demultiplexing stage. The input channel ageing/drop control is implemented in the OM20 and ODA20 modules. For each input channel of an OM20 the actual power after the VOA is compared with the required value, and if a given tolerance level is exceeded for more than a predefined integration time (2 min.) then the attenuation is adjusted back to the requested value. If it cannot be reached, because the VOA has to regulate beyond its lowest or highest possible attenuation, then the Power Low Failure (PLF) or the Power High Failure (PHF) communication alarm for that channel will be raised. The VOA at each output of the ODA20 is monitored similarly. The OD(A)20 also plays a role in Optical Laser Safety. The input power of the OD(A)20 is measured and if it is < -15 dBm it activates an APSD which shuts down the preceding OLI preamplifier pump lasers. Each OM20 and OD(A)20 module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system. Fig. 3.31 to Fig. 3.33 show the block diagrams of the module groups OM20, OD20 and ODA20.

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MxIn 1 MxIn 2 MxIn 3 MxIn 4 MxIn 5 MxIn 6 MxIn 7 MxIn 8 MxIn 9 MxIn 10

1 2 3 4 5 6 7 8 9 10

5:95

1 2

VOA MD in

3 4

8 9 10

MxIn 11 MxIn 12 MxIn 13 MxIn 14 MxIn 15 MxIn 16 MxIn 17 MxIn 18 MxIn 19 MxIn 20

11 12 13 14 15 16 17 18 19 20

5:95

1 2

VOA MD in

3 4

Mux

5 6 7 8 9 10

Mux

5 6 7

MxOut

Fig. 3.31

OM20 Block Diagram

1 2

5:95
P1 P2

1 2 3 4 5 6

DxOut 1 DxOut 2 DxOut 3 DxOut 4 DxOut 5 DxOut 6 DxOut 7 DxOut 8 DxOut 9 DxOut 10

5:95
DxIn

Demux

3 4 5 6 7 8 9 10

P3

P1

P2

P3

MD out

7 8 9 10

MD APSD

1 2 3 4 5 6 7 8 9 10

5:95
P1 P2 P3

11 12 13 14 15 16 17 18 19 20

DxOut 11 DxOut 12 DxOut 13 DxOut 14 DxOut 15 DxOut 16 DxOut 17 DxOut 18 DxOut 19 DxOut 20

Demux

MD out

Fig. 3.32

OD20 Block Diagram

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1 2

5:95 VOA MD in

1 2 3 4 5 6 7 8 9 10

DxOut 1 DxOut 2 DxOut 3 DxOut 4 DxOut 5 DxOut 6 DxOut 7 DxOut 8 DxOut 9 DxOut 10

5:95
DxIn
P1 P2

Demux

3 4 5 6 7 8 9 10

P3

MD APSD

1 2 3 4 5 6 7 8 9 10

5:95 VOA MD in

11 12 13 14 15 16 17 18 19 20

DxOut 11 DxOut 12 DxOut 13 DxOut 14 DxOut 15 DxOut 16 DxOut 17 DxOut 18 DxOut 19 DxOut 20

Fig. 3.33

ODA20 Block Diagram

3.3.14

CAD2 Modules
The Channel Add/Drop (CAD2) module is an active module (i. e. it has it's own local module controller) and is equipped in OADMU NEs to perform remotely configurable channel add/drop functions. The CAD2 module consists of a set of add/drop WDM filters to either add/drop a wavelength into/from an optical 16nm band with 20 optical wavelengths and 100 GHz. Two wavelengths can be added and dropped per CAD2 module in one direction. Each Add channel input has a VOA implemented to control the power of this Add channel. The required input power of the Add channel is calculated with the help of the OPA, or interpolated from the other channel power values if no OPA is equipped. Each Drop channel output has a VOA implemented to control the output power so that it is within the allowable range of the client's receiver. The stepper motor controlled VOA wiper settings may be software controlled via the network management system. Add channel and drop channel ageing control is implemented in the CAD2 modules. For each input and output channel the actual power after the VOA is compared with the required value, and if certain tolerance level is exceeded for more than a predefined integration time (2 min.) then the attenuation is adjusted back to the requested value. If it cannot be reached, because the VOA has to regulate beyond its lowest or highest possible attenuation, then the Power Low Failure (PLF) or the Power High Failure (PHF) communication alarm for that channel will be raised.

Demux

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The wavelengths used for channel selection take into account the following optical properties, the nearest neighbour of an add/drop channel is always a through channel to facilitate add channel power adjustment, and there is a spacing of 2 channels between every 2 add/drop channels (i. e. 300 GHz) to minimize the impact of imperfect through channel filter shapes. There is one group of CAD2s and one additional group of CAD2B. Each CAD2 module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system. Fig. 3.34 shows the CAD2 block diagram.
Drop f1 Drop f2 Add f1 Add f2

VOA

VOA

In

filter

VOA 2x2 VOA Out

2x2 through channel f2

notchfilter

1x2

fixed attenuator

1x2

synchronized

express channels

upgrade port for next A/D-card


UpOut UpIn

Fig. 3.34

CAD2 Block Diagram

3.3.15

EAM4C or EAM4L Modules


The EAM4x basically is a smaller subset of the CAD2 module and is therefore also an active module with it's own local module controller. It is equipped only in OADMU NEs and is required to equalize the sum channel powers of the four interleaved 20 channel sub-bands of the C or L band. The EAM4x consists only of four Variable Optical Attenuators (VOAs), one for each subband. Hence two EAM4x modules are required per band (C or L), for each direction, making a total of 4 EAM4x modules for a C+L OADMU. In the EAM4 module the input power of each of the four channel groups is measured and checked against the expected value. If there is no correspondency, an automatic power reduction command is sent to the relevant OLI preamplifier module. Each EAM4x module also contains an on-board EEPROM to store module inventory data which can be requested by the network management system. Fig. 3.35 shows the EAM4 block diagram.

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In x1x2

VOA 1
(20 ch.)

Out x1x2

In x3x4

VOA 2 VOA 4

Out x3x4

f1,3,..39
In x5x6

f51,53,..89
VOA 3
Out x5x6

In x7x8

Out x7x8

f 2,4,..40

f50,52,..88

Fig. 3.35

EAM4 Block Diagram

3.3.16

OCA / OCAS / OCS Modules


(See Fig. 3.36 and Fig. 3.37) Optical Channel Amplifier modules allow to configure either express channel connections or single add/drop channels in channel connection unit (CCU) network elements. They can be applied together with OADMs and back-to-back OTTs. There are the following basic variants: Modules with four single (C band) channel ampliers only (OCAC) Modules with four single (C band) channel ampliers and additional optical switches (OCASC) Modules with optical switches only (OCS, for C and L band) Switch in Express position

OCAS OCA
Fwd1 IN Fwd1 OUT Back1 IN Back1 IN Back1 OUT Back1 Drop Back1 OUT Back1 Add Fwd1 IN Fwd1 Drop Fwd1 OUT Fwd1 Add

Fwd2 IN Fwd2 IN Fwd2 OUT Fwd2 Drop

Fwd2 OUT Fwd2 Add

Back2 IN

Back2 OUT

Back2 IN Back2 Drop

Back2 OUT Back2 Add

Switch in Add-Drop position Fig. 3.36 OCA and OCAS Modules, Optical Path

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Switch in Express position

OCS
Fwd1 IN Fwd1 Drop Fwd1 OUT Fwd1 Add

Back1 IN Back1 Drop Fwd2 IN Fwd2 Drop

Back1 OUT Back1 Add

Fwd2 OUT Fwd2 Add

Back2 IN Back2 Drop

Back2 OUT Back2 Add

Switch in Add-Drop position Fig. 3.37 OCS Module, Optical Path

OCAx modules (x= C stands for C band and, for later releases, x= L for L band) are channelized amplifiers without switching function. The basic optical function is provided by an EDFA module consisting of 4 internal gain blocks. Ampliers for 2 channels in direction 1 -> 2 are denominated Fwd1 and Fwd2, amplifiers for 2 channels in direction 2 -> 1 are denominated Back1 and Back2. The EDFAs are controlled individually by the pump current control for the 4 different single channel ampliers. The optical input and output power of each single channel amplier are monitored and automatic output power control is done. An automatic overtemperature shutdown is provided for each pump laser. The output power of each amplier is individually controllable via the element manager and may be calibrated to the according connector. OCASx modules contain channelized amplifiers (like the OCA modules) with switching function. The modules provide amplifiers for 2 channels per direction: for channels in direction 1 -> 2 they are denominated Fwd1 and Fwd2, for channels in direction 2 -> 1 they are denominated Back1 and Back2. There is also one dual 2 x 1 optical switch (a drop switch at the input and an add switch at the output) for configurable add/drop traffic in each channel. Both optical switches within the dual switch operate simultaneously, i. e. switches for the add/drop functionality always operate synchronously. Power monitoring of the amplifier is only reporting power information in case of the switch being configured for express channel. Otherwise the amplifier is shut down. For the current release no L band OCA/OCAS module is available.

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For OCS modules, only switches and no EDFAs are present. An OCS module has only 4x 2x 1:2 switches and offers cheap dynamic add/drop. For each channel there is a drop switch at the input and an add switch at the output. Channels in direction 1 -> 2 are denominated Fwd1 and Fwd2, channels in direction 2 -> 1 are denominated Back1 and Back2. The same HW/optics can be used in C- and L-band. OCA, OCAS, and OCS modules are equipped in the CCU subrack.

3.3.17

UDCM Modules
Unidirectional Dispersion Compensation Modules (UDCMs) are an important part of the SURPASS hiT 7550 2.05 system, without these it would be impossible to transmit a DWDM signal many hundreds of kilometers. UDCMs are primarily used to counteract the chromatic dispersion which a signal undergoes as it travels through a section of optical fibre. This chromatic dispersion has the effect of 'spreading' the signal spectrum so much that the inter-symbol interference no longer allows an accurate determination of a single 'one' bit or a single 'zero' bit. The UDCMs contain Dispersion Compensating Fibre (DCF), which are just spools of fibre which contain the opposite dispersion characteristics of the fibre used for signal transmission, hence compressing the signal for better optical performance. Naturally, the type of DCF depends on which wavelength band and type of fibre is being used for transmission, which is why several types of UDCMs are required for accurate DCM management. UDCMs for SSMF C band & L band, NZDSF(+) C band & L band, NZDSF(-) and DSF are defined. The strategy for choosing UDCMs, or DCM strategy, is highly system dependent and is influenced by the optical performance limiting effect. For lower channel DWDM systems, with larger channel spacings, i. e. a system with 100 GHz channel spacing, this limiting effect was SPM (Self Phase Modulation), which lead to a DCM strategy where all of the dispersion along the link was compensated with DCMs (full inline compensation) leaving a high residual dispersion at the end of the link for SPM optimization. For extensive channel systems with smaller channel spacings such as SURPASS hiT 7550 2.05, the 160 channel system with 50 GHz spacing, SPM is no longer the limiting effect, rather Cross Phase Modulation (XPM) and Raman crosstalk, therefore the calculation of the residual dispersion is different. UDCMs are passive modules placed in all NE types (excepted CCU), i. e. OTTU, OLRU and OADMU. They are normally located in the optical path between the 2nd and 3rd stages of each optical amplifier, as here the insertion loss of the UDCM can be compensated for by the amplifier design. However, it is also possible to perform subband dispersion compensation, for example, using different UDCMs for the C-red and C-blue bands in each NE type. The UDCMs are physically stored in their own UDCM trays at the bottom of the rack, and are visible via the network management system. As passive modules they are managed via the OSCTU or SMU2 modules via the SPI Bus, which means module present information and module Inventory Management information (stored on an EEPROM on each UDCM) can be requested at all times. Up to a maximum of 4 UDCMs fit into one UDCM tray, each in their own slot.

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3.4

Synchronization
In all NEs, the OSCT module provides the master system clock (T0), which is used to synchronize the real-time clock on the MCU module for greater accuracy. The accuracy of the clock is 4.6 ppm. The OSCT sends clock data to the MCU every 15 minutes. All clocks in a SURPASS hiT 7550 system are synchronized via the Supervisory Channel. The MCU's clock is equipped with a battery back-up in case of power failure or temporary MCU module removal. Additionally, an external clock can be used to get a maximum of accuracy. The clock signal (T3) is fed in via the EOW1/T3in pin connector on the Connector Panel (COPA) of the subrack. If this external signal fails, a T3LOS alarm is propagated.

OTT (Master)

OLR/OADM

counter direction

OTT

same direction

If the T3 signal fails, the internal clock (T2) will be used instead. A priority list is used to control the switchover. T3 Input

Fig. 3.38

Timer Configuration

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3.5

Control and Monitoring via the Element Manager


The Element Manager (EM) enables the user to perform a wide variety of OAM&P (Operation, Administration, Maintenance, and Provisioning) tasks. These include: Equipment Management Fault Management Conguration Management Performance Management Security Management This chapter consists of the following sections: Access Check User Interface

The system requirements for the element manager are described in chapter 7.9.

3.5.1

Access Check
Whenever you start the TNMS CT application, a login dialog appears requiring: User name: You are assigned a user name by your administrator Password: Use your personal password. When you log on for the rst time, you do not need a password. The access to TNMS CT is regulated by five user classes. Users can be assigned to the user classes. The set of functionality available to a given user class is fixed an cannot be changed. The following five user classes for TNMS CT are defined having different privileges: 0: Supervision 1: Maintenance 2: Operation 3: Conguration 4: Administrator Furthermore the element manager uses the following security levels to control the access rights for the different LCT functions: Normal user administration: user classes 0 to 10. Via the user administration the customer can congure the different access levels. Some functions are restricted in this security level and can only be accessed via an additional login. Service staff: this highest security class can only be reached via a key combination and an additional password. This class is used by Siemens personnel only.

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3.5.2

User Interface
Detailed information on the user interface can be found in the Operator Guidelines OGL and in the Online Help. If youre familiar with Microsoft Windows, you can use the Element Manager EM. Common tasks such as moving, re-sizing, minimizing, and closing windows, manipulating pull-down menus and dialog boxes, as well as the use of the primary and secondary mouse buttons all work exactly as in Microsoft Windows. EM Screen The EM screen structure consists of the following basic levels: Network Element (Main) Window When you establish a session with a particular SURPASS hiT 7550 NE, you will be presented with its Network Element Window, which functions as the root screen from which all other EM windows for that NE are accessible. Several listings (e.g. alarm listings) are obtainable directly from this window; they reflect the NE as a whole. From the Network Element Window, you must navigate to the Module View to subsequently configure various parameters or to request detailed information on the NE and modules. The Module View represents the subracks and all modules in their assigned slots. OR From the Network Element Window, you may also navigate to the traffic view, which gives an overview of the network element's general optical path structure and of the involved modules. Additionally, the traffic view displays information concerning the modules. A large amount of information is obtainable by navigating to the various EM detail screens. Information pertaining to the NE as a whole or individual modules can be requested. This includes comprehensive Configuration, Security, Alarm, Software, and Database details, as well as Traffic Performance measurements (both in numeric and graphical form).

Module View

Traffic View

NE, Subrack, and Module Details

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3.6

Control and Monitoring via Network Management System


(See also Chapter 2.3.7) SURPASS hiT features advanced network management capabilities. Each network element in a SURPASS hiT network contains one Main Control Unit (MCU) module. MCUs are the major control element in the system. At the local level, each MCU communicates with the other modules in its network element and supports the gathering and reporting of traditional local telemetry (major and minor audible/visual alarms, 60 Vdc power fail, Alarm Cut-off, Lamp Test, etc.). It also provides an interface for connecting the TNMS CT element manager (Local Craft Terminal, LCT). At the system-wide level, the MCU provides a full Q3 interface to connect the SURPASS hiT system to the customers Q3-CMISE compliant TMN system. Access can be through the TNMS CT element manager (Network Control Terminal, NCT) or direct from the customers OSS. The MCU serves as the gateway between the SURPASS hiT system and the Network Management System. The MCU provides a full Q3-CMISE interface for connection of the SURPASS hiT system to the customers Operational Support System (OSS) and the QF interface for connection of PC-based local element managers (Local Craft Terminals). MCU software implements all activities related to: Equipment Management Software Management Fault Management Configuration Management Performance Management Real Time Management Security Management Message Control Function

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4 Hardware
This chapter describes the SURPASS hiT 7550 2.05 hardware. It consists of the following sections: Racks Subracks Modules System Equipment Display and Operating Elements on Equipment

4.1

Racks
The SURPASS hiT 7550 2.05 is a highly modular system in which easy to install modules are housed in single-row or double-row equipment subracks that mount in common ANSI racks or ETSI racks optimized for optical and electrical cabling. Beside the power distribution panel (PDP) on top of the rack, up to three single row subracks or one single row subrack and one double row subrack can be mounted in one rack. The PDP contains at least six fuses/power breakers (15/16 A and 20 A, see Chapter 4.1.2) for working and the same for spare power supply.

4.1.1

Mechanical Layout
Examples of the mechanical equipment layout for OTT, OLR, OADM, and CCU are shown in Fig. 4.11 through Fig. 4.14. For further details concerning the rack dimensions, refer to Chapter "7.2 Rack/Subrack Mechanical Data".

4.1.2

Rack and Subrack Power Supply


The rack is operated by a AC/DC station converter and a battery 48/60V, positive grounded. Voltage range is between -40.5 Vdc to -75 Vdc (nominal voltage -48/-60 Vdc). At the rack power distribution panel PDP, each power line input is distributed over two circuit breakers (20 A fuse for an OADM double row subrack equipped with OLI modules, 15/16 A fuse for all other subracks) to the input connectors and terminal blocks of the subrack. All power lines have an input noise filter before the distribution on the backplane in the subrack. The noise filters are for an extra low level of re-injected noise on the DC power distribution in accordance with the relevant standards ETS 300 132-2 [ETS-60], EN 55022 [ETS-154] and ETS 300386-1. Rack, subrack and modules are grounded by multiple mechanical and electrical connections to the planar shelf (protection earth). Fig. 4.1 shows the power supply within the rack with single row subracks. Fig. 4.2 shows the power supply within the rack with double row subracks. Fig. 4.3 represents the power supply within the subrack.

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Station Power Supply AC/DC and Batteries positive grounded

INPUT A Rack Top Distribution Panel Circuit Breakers / Fuses

INPUT B

UBAT1

UBAT2 Connector

UBAT3

UBAT4

LF Filter

Subrack Distribution

FAN1

PUBAT1/3

NUBAT1

NUBAT3

FAN2

slots

slots

slots

PUBAT2/4

NUBAT2

NUBAT4

slot 1 ... 10

slot 11 ... 19

Subrack Backplane Rack Planar shelf / Protection Earth

Fig. 4.1

Power Distribution within the Rack (Single Row Subrack)

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Station Power Supply AC/DC and Batteries positive grounded

INPUT A Rack Top Distribution Panel Circuit Breakers / Fuses

INPUT B

UBAT1

UBAT2 Connector

UBAT3

UBAT4

LF Filter

Subrack Distribution

FAN1
PUBAT1/3 PUBAT2/4 NUBAT1 NUBAT3 NUBAT2 slots slots
upper row slot 1 ... 10 upper row slot 11 ... 19

slots

NUBAT4

FAN2
PUBAT1/3 NUBAT1 NUBAT3 PUBAT2/4 NUBAT2 NUBAT4

slots

slots

slots

Subrack Backplane Rack Planar shelf / Protection Earth

Fig. 4.2

Power Distribution within the Rack (Double Row Subrack)

slots

lower row slot 1 ... 10

lower row slot 11 ... 19

slots

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Subrack

UBAT1

UBAT2

UBAT3

UBAT4 NEAP +S

LF-Filter
NUBAT1 NUBAT3 PUBAT NUBAT4 NUBAT2 PUBAT

Shelf Alarm Fan unit 1

+S

-S

Fan unit 2

Card in slot 19

MCU
UBAT UC +12V +3,3V +5V

SU
ULED +4,7V Fault LED SLOOP 1

MCU SU

NUBAT4 NUBAT2 PUBAT

SU
SLOOP 2

Card in slot 11 ... 18


UBAT

1)
UC n UC *) UC 2 UC 1

ULED +4,7V

LCC SU

Power Bus +5V

Fault LED

SU
SLOOP 1 SLOOP 2

Card in slot 1 ... 10


UBAT

1)
UC n UC *) UC 2 UC 1

1) CAD2, EAM4, OM/OD, OPA, OSCT, PUMP, RPUMP, OLI, OCA/OCAS//OCS, PQM
LCC

NUBAT1 NUBAT3 PUBAT

ULED-BUS

Power Bus +5V

ULED +4,7V

SU

SAB(M)
*) also slot 19

Fault LED SLOOP 1

SU
SLOOP 2

SU = Supervision UC = Operating voltage

+S/-S = Signaling voltage LT = Lamp test

UBAT = Battery voltage (supply voltage)

Fig. 4.3

Power Distribution within the Subrack

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4.1.3

Connector Panel
All connections like the power supply, signaling data and so on from the subrack to the rack, to other subracks or to further equipment are terminated on the connector panel COPA (see Fig. 4.4). The panel is placed on the subrack lower front side.

... The connectors 10BT_0, 10BT_M2, and 10BT/100BT are currently not in use! Fig. 4.4 SURPASS hiT 7550 2.05 Connector Panel (COPA), Front Access There is a variety of connectors on the COPA. Most of them are used only on the subrack that contains the OSCT module in each NE. COPA Power Connectors ANSI subracks with front access COPA and all ETSI subracks have four 3W3 type power connectors labeled as UBAT1, UBAT2, UBAT3 and UBAT4.

-48/-60 Vdc

Fig. 4.5

COPA Power Connectors

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4.2

Subracks
This section consists of the following subsections: Subrack Mounting DCM Trays

4.2.1

Subrack Mounting
The SURPASS hiT 7550 2.05 uses single-row and double-row equipment subracks. Both subrack types used in ANSI and ETSI markets are shown in Fig. 4.6 to Fig. 4.9. For further details concerning the rack dimensions, refer to Chapter "7.2 Rack/Subrack Mechanical Data".

Fig. 4.6

ANSI Single-Row Subrack (Front Access)

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Fig. 4.7

ANSI Double-Row Subrack (Front Access)

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Fig. 4.8

ETSI Single-Row Subrack (Front Access)

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Fig. 4.9

ETSI Double-Row Subrack (Front Access)

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4.2.2

DCM Trays
In order to fit the UDCMs within the rack, DCM shelves are installed in the bottom or the top of the rack. In a 2 HU shelf four UDCMs can be mounted. Fig. 4.10 shows the DCM tray.

Fig. 4.10

DCM Tray

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4.3

Modules
Modules are described in detail in the following sections: "3.3 Functional Overview of the Modules" describes the module functionality. "4.4 System Equipment" describes the arrangement of modules in the rack/subrack.

4.4

System Equipment
For the example configurations as shown in Fig. 4.11 through Fig. 4.14, the maximum number of OLI pump cards (PUMPA, PUMPB, PUMPC) was assumed for the equipping. For some configurations Raman pumps and the OPA card were included to demonstrate the possible equipping options. Actual configurations may of course require fewer OLI pump cards, Raman pump cards and OPA cards. of the to Chapter "3.2 Functional Over For description Types".NE functionality, referrefer to Chapter "3.3 Functional view of the NE For description of the module functionality, Overview of the Modules". This section consists of the following subsections: OTT Equipment OLR Equipment OADM Equipment CCU Equipment Chapters 4.4.1 to 4.4.3 each represent only one example for NE equipping.

For equipping details see Installation and Test Manual ITMN. The listed power consumption values in Fig. 4.11, Fig. 4.12, and Fig. 4.13 are total maximum power values. In a completely equipped subrack/rack you will get the total maximum power as 90 percent from the maximum value (because not all modules consume the maximum power at the same time).

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4.4.1

OTT Equipment
Rack power panel

Double-row subrack for C-band mux/demux

Double-row subrack for L-band mux/demux

Electrical connector panel (on each subrack)

Single-row subrack for C-band amplifiers and network element controller

Single-row subrack for L-band amplifiers

Tray for passive dispersion compensators

Shown:ETSI2200mmx600mmx300mmracks Total Power Consumption: 1564 W Rack 1: 828 W Rack 2: 736 W Fig. 4.11 OTTU, C+L Bands, 160 Channels (Equipping Example)

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4.4.2

OLR Equipment

Single-row subrack (address "2") for L-band amplifiers

Single-row subrack (address "1") for C-band amplifiers and network element controller

Tray for passive dispersion compensators

Shown: ETSI 2200mm x 600mm x 300mm rack


Total Power Consumption: 1545 W

Fig. 4.12

OLRU, C+L Bands (Equipping Example)

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124
OMDFIL EAM4L OLITPUL
PUMPA

Fig. 4.13
OMD2IL

4.4.3

PUMPA

OLITPUL

Technical Description (TED)

Rack 1: 1103 W

5 4
OLITBUL EAM4L OMDFIL
PUMPA PUMPB PUMPC SMU
SAB

PUMPC PUMPB PUMPA

OLITBUL
SMU SAB

CAD2L1L1 CAD2L2L2 CAD2L3L3 CAD2L4L4 CAD2L1L1 CAD2L2L2 CAD2L3L3 CAD2L4L4 OMD2IL

OADM Equipment

SMU SAB

3
SMU
SAB

7
SMU
SAB

Total Power Consumption: 2542 W Rack 2: 300 W


CAD2L5L5 CAD2L6L6 CAD2L7L7 CAD2L8L8 CAD2L5L5 CAD2L6L6 CAD2L7L7 CAD2L8L8 CAD2C5C5 CAD2C6C6 CAD2C7C7 CAD2C8C8 CAD2C5C5 CAD2C6C6 CAD2C7C7 CAD2C8C8 OMDFIC OLITPC
PUMPA

OPA
PUMPA

OLITPC

1 0
OLITBC
PUMPA PUMPB PUMPC PUMPC PUMPB PUMPA

Rack 3: 1139 W
OMD2IC EAM4C EAM4C OMDFIC

OADMU, C+L Bands, 160 Channels, with Maximum Configurable Add/Drop Capacity
OSCTUI
MIB

OLITBC
SMU SAB

CAD2C1C1 CAD2C2C2 CAD2C3C3 CAD2C4C4 CAD2C1C1 CAD2C2C2 CAD2C3C3 CAD2C4C4 OMD2IC

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Information SURPASS hiT 7550 2.05

Technical Description (TED)

4.4.4

CCU Equipment
Network element OTT #1
subrack 3
OM20C5C6 OM20C3C4 OM20C7C8 OD20C5C6 OD20C7C8

Network element OTT #2


OM20C5C6 OM20C7C8 OD20C5C6 OD20C7C8 OMD2IC

OMD2IC

13

18

S M U S A B

OD20C1C2

OM20C1C2

OD20C3C4

subrack 2

13

S M U S A B 18

OM20C1C2

OM20C3C4

OD20C1C2

OD20C3C4

13

18

S M U S A B

13

cable compartment 4x UDCM OPA * PUMP C * PUMP B PUMP A

cable compartment 4x UDCM

OPA * PUMP C * PUMP B PUMP A

subrack 1

PDP PUMP A PUMP B PUMP C


M I MB C S US A B

OLI TPC

OLI TBC

RPumpC

OSCTUT

PUMP A PUMP B PUMP C

5 6 7

10

13 14 15 16

18

5 6 7

10

13 14 15 16

18

M I MB C S U S A B

cable compartment

RPumpC

cable compartment

Network element CCU


PDP

S M U S
A B

10

12

14

16

18

cable compartment PDP PDP

subrack 4

S M U S
A B

S M U S
A B

10

10

12

14

16

18

cable compartment PDP

cable compartment PDP

subrack 3

S M U S
A B

M B C S U S
A B

10

12

14

16

18

10

12

14

16

18

cable compartment

cable compartment

Fig. 4.14

CCU Equipping (Example: CCU Applied in a back-to-back 100% OADM)

Fig. 4.14 shows the CCU network element in a typical application, combined with two back-to-back OTT network elements.

subrack 0

OSCTUT

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

M I

subrack 1

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

subrack 2

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OCAS

OSCTUT

OLI TPC

OLI TBC

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PDP

OMDFIC

S M U S A B 18

subrack 2

OMDFIC

subrack 3

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The subrack of the CCU network element may be equipped with the following modules: MCU/SMU SAB OCA/OCAS/OCS

4.5

Display and Operating Elements on Equipment


This section consists of the following subsections: NE Alarm Panel SAB Boards and Subrack Address Setting Module Front Panel Features

4.5.1

NE Alarm Panel
Alarms of the subrack are indicated on the NE Alarm Panel (NEAP, see Fig. 4.15). The NEAP contains a small board and is installed above the fan unit slots of the subrack. It contains the indication LEDs as Power On (4x green), major equipment alarm (red), minor equipment alarm (yellow), major communication alarm (red), minor communication alarm (yellow) and ACO (Alarm Cut-Off) (blue). In addition for control, one button (black) for lamp test (to switch on all LEDs via cards) and one (blue) for ACO (to acknowledge indicated alarms) are fitted. The LEDs on it are visible and connectors are contactable even if the subrack front cover is mounted. All rack alarms are derived from the supervision unit MCU of the subrack. The signals effect visible and audible alarms on top of the rack. All subrack alarms are connected by cable to the power distribution and alarm panel PDP or other equipment on the top of the rack. At the NEAP front side, there also is a rotary switch for setting the subrack addresses (see Fig. 4.16). On the right half of the NEAP there are located three connectors: Ethernet interface 10/100BT Serial interface F-IF Handset connector

Fig. 4.15

NE Alarm Panel

4.5.2

SAB Boards and Subrack Address Setting


The following applies for the Subrack Address Board (SAB) and the subrack address setting: Every subrack (single-row subrack and double-row subrack) is equipped with one SAB. The SAB provides necessary information for the PCB/CAN bus. At OADM NEs, the SABM board is needed because of the potentially large number of subracks required. At an OADM, the SABM replaces the SAB in the subrack that contains the MCU. This subrack should always be placed in the middle of the subrack chain. All subracks in an OTT or OLR are always equipped with an SAB.

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Subrack addresses are set via a small rotary switch that is placed at the NEAP (see Fig. 4.16). This switch has 8 positions (switch is marked by the numbers 0 to 7). In a double-row subrack, the address of the lower row is always an even number. The address of the upper row is equal to the lower row address increased by 1. So, it always is an odd number.

 For details on how to perform the subrack addressing, refer to the ITMN.

Fig. 4.16

Subrack Address Setting

4.5.3

Module Front Panel Features


Each module includes the following features: Large top and bottom insertion/extraction aids that allow the module to be easily installed and removed from the SURPASS hiT 7550 subrack. A latching mechanism ensures a positive lock. Green OK LED and red Fault LED. Debug port (for use by authorized personnel only). This port is used at active modules only. The front panel on OM/OD, OLI, PUMP, RPUMP, OCA, and OCAS modules also shows the warning symbols for laser radiation (for examples, refer to the Chapter "Protective Measures" of the Installation and Test Manual ITMN).

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5 Software
This chapter consists of the following sections: Fault Management NE Software Management Management PC Software

5.1

Fault Management
Current Alarm List Fig. 5.1 shows an example of a Current Alarm List. This window displays all alarms that are currently active in the NE. Alarms that have cleared are automatically purged from this list. The Current Alarm List features the following: Checkboxes to select which alarm severities are listed. You may choose to list any or all of the following: Critical alarms, Major alarms, Minor alarms or Warnings. You may also choose to list Acknowledged alarms, Unacknowledged alarms, or both. To acknowledge an alarm, right-click on it and choose Acknowledge or use the Fault pull-down menu to acknowledge all listed alarms at once. that display the current number of each type of alarm (Critical, Major, Minor, and Warning). These are read-only fields. This is the actual listing of details for each Current Alarm. For each alarm, the following is listed (from left to right): Severity Icon This is a colored circle that allows you to quickly identify the severity of listed alarms. Red = Critical, Orange = Major, Yellow = Minor and Blue = Warning. A blue box surrounding any colored circle indicates that the alarm is unacknowledged Object The name of the SURPASS hiT 7550 2.05 component reporting the alarm. This can be the name of a module, or a system entity such as Monitoring Point or External Alarm. Location The location of the Object reporting the alarm, i.e. the module name, slot number, and/or port number. Alarm The actual alarm event. Since there is limited space on the Alarm List, abbreviations are used for the alarm events. Severity The severity level associated with the event (Critical, Major, Minor, or Warning). State Acknowledged or Unacknowledged. To acknowledge an alarm, select it and right-click the mouse. Or use the Fault pull-down menu to Acknowledge all alarms at once.

Counters

Alarm List

Also, note that by clicking the mouse on any of the column headings, it is possible to change the order in which the alarms are listed. For example, click on the Severity header to toggle between listing the alarms in most-to-least severe order and vice versa.

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Checkboxes
Select which alarms you want to display. Select any or all of the following: Critical Major Minor Warning Acknowledged Unacknowledged

Counters
These show the total number of each type of alarm appearing in the Current Alarm List. These are read-only fields.

Severity Icons
Red = Critical Orange = Major Yellow = Minor Blue = Warning A blue box around the icon indicates that the alarm is unacknowledged.

Alarm List area

Click on any of the column headings to change the order in which alarms are listed.

Details Listed for Each Alarm


Name of the component reporting the alarm. This can Object be the name of a module or an entity such as a transmit or receive interface. Location Location of the Object reporting the alarm; module name, slot number, port number.

The actual alarm event. They are highly abbreviated in this window. Alarm For detailed explanation of all alarms, refer to the OnlineHelp.

Severity Critical, Major, Minor, or Warning. Acknowledged or Unacknowledged. To acknowledge an State alarm, right-click on it, or use the Fault pull-down menu to acknowledge all alarms at once.

Fig. 5.1

Current Alarm List (Example)

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History Alarm List Fig. 5.2 shows an example of a History Alarm List. This window displays a history log of all alarms that have been reported by this NE since the EM session was established. The History Alarm List is basically the same as the Current Alarm List described above with the following exceptions: Cleared Alarms are listed in the History List, but not in the Current List. Date and time stamps are listed for each alarm in the History List. You may specify the maximum number of entries in this list via the Option Settings dialog box.

Checkboxes
Select which alarms you want to display. Choices are the same as for the "Current Alarm" listings. Click this button to clear the contents of the History TCA List.

Details Listed for Each Alarm


Click on any column heading to change the order in which alarms are listed. The details listed for each alarm are the same as those for the "Current Alarm" listings (see previous Figure) with the following differences: Alarms that have cleared are listed. Time and date the alarm was reported are listed. You may specify the maximum number of Alarms listed in this window via the Option Settings dialog box.

Fig. 5.2

History Alarm List (Example)

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5.2

NE Software Management
The MCU holds two complete versions of the APS (Application Program System) software for all modules in its NE, the Active APS and the Inactive APS. If a new APS version needs to be downloaded to the MCU, it is first stored as the Inactive version, then swapped to become the Active. This way, the original APS is recoverable if the new APS proves unstable. The APS contains one software image of each module. Software version numbers for all modules are obtainable from the Active APS.

Fig. 5.3

NE Software Management The Software Management window provides a means to check the compatibility of the Active APS (Application Program System) with installed modules and to download a new APS if desired.

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5.3

Management PC Software
SURPASS hiT 7550 local craft terminal: the network management software for Windows 2000 platforms is supplied on one compact disk. SURPASS hiT 7550 network craft terminal: the network management software for Windows 2000 platforms is supplied on a separate compact disk. Each CD includes the following components: SURPASS hiT 7550 2.x Element Manager software Siemens TNMS CT Local Craft Terminal (LCT) / Network Craft Terminal (NCT) software TMN-DCP OSI Stacks.

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6 Commissioning, Operation and Maintenance


This chapter consists of the following sections: Commissioning Operation Maintenance

6.1

Commissioning
The SURPASS hiT 7550 2.05 has to be configured on initial commissioning. For this purpose, a Local Craft Terminal (LCT) has to be connected to the LCT interface at the COPA front side. The craft terminal offers a graphical, menu-driven Element Manager (EM) user interface.

i 6.2 i
6.2.1

Detailed information for commissioning of equipment and the operating terminals can be found in the Installation and Test Manual ITMN.

Operation
Operation of SURPASS hiT 7550 2.05 equipment is explained in detail in the Operator Guidelines OGL and in the Online Help.

Operating and Display Elements of the Modules


LED Displays of the Modules For assistance in maintenance work, there are a red fault LED and a green service status LED on the front of every module. For some modules the red LED has some special meanings (see Online Help). Operating Elements of the Modules No hardware settings have to be made on the printed circuit boards of the modules. The modules are configured by software commands of the EM user interface (or from a network management system) when commissioning or in case of later changes.

i
6.2.2

Module configuration by software is explained in the Operator Guidelines OGL.

Operation with an Operating Terminal


For local or remote control and monitoring of the SURPASS hiT 7550 2.05 by means of the EM user interface, the TNMS CT LCT/NCT software also must be installed and connected on the PC. The EM application communicates with the MCU module of the SURPASS hiT 7550 2.05 equipment using the gateways provided by the TNMS CT software.

For local control/monitoring a PC only with TNMS CT LCT software installed must permanently be allocated to the local NE.

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6.3 i

Maintenance
Maintenance of SURPASS hiT 7550 2.05 equipment is described in the Operator Guidelines OGL and in the Online Help. The alarm and maintenance concept of the system provides sufficient alarm information to localize and clear the fault at module level. The equipment has been designed in such a way that no regular settings are required. Maintenance measures (e. g. fault localizing) can be carried out locally or under remote control using the EM user interface and the TNMS CT LCT/NCT software.

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7 Technical Data
This chapter describes the most important SURPASS hiT 7550 2.05 technical parameters. The chapter consists of the following sections: Physical Layer Parameters Rack/Subrack Mechanical Data Technical Characteristics of Modules Rack/Subrack Power Supply Electrical Power Consumption of Modules Electrical Power Consumption of Racks External Interfaces System Environmental Specications System Requirements for the Element Manager

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7.1

Physical Layer Parameters


General information Maximum number of channels Bit rate/line coding of optical tributary signals Maximum bit error ratio Supported fibre types 160 10 Gbit/s NRZ user configurable 10-12 to 10-16 ; typ. 10-13 SSMF, DSF, NZDSF according to G.652, G.653 and G.655 DMC (Dispersion Managed Cable) compliant to ITU-T G.692

Wavelength Grid Interface at point MPI-SM Maximum mean channel output power Minimum mean channel output power

11.0 dBm (depending on channel count) -5.0 dBm (depending on channel count)

Maximum mean total output power of each wave- depends on the type of optical line amplifier used; refer length band (C or L) to the technical characteristics of the OLI modules in Tab. 7.13 Central frequency Channel spacing compliant to ITU-T G.692 50 GHz for 80 channels per C or L band 100 GHz for 40 channels per C or L band 2.5 GHz for 50 GHz channel spacing 10 GHz for 100 GHz channel spacing 10 dB

Maximum central frequency deviation

Minimum channel extinction ratio

Optical path (single span) from point MPI-SM to MPI-RM Maximum attenuation Minimum attenuation Minimum optical return loss 40 dB using Raman pumps 15 dB for 1 span: 17 dB w/o Raman, 20 dB with Raman for 10 spans: 25 dB w/o Raman, 26 dB with Raman for 30 spans: 29.7 dB w/o Raman, 30.7 dB with Raman for 1 span: 20 dB w/o Raman, 23 dB with Raman for 10 spans: 27 dB w/o Raman, 29 dB with Raman for 30 spans: 31.7 dB w/o Raman, 33.7 dB with Raman 40 ps for 1 dB OSAR penalty

Maximum discrete reflectance

Maximum differential group delay Interface at point MPI-RM Maximum mean channel input power Minimum mean channel input power Maximum mean total input power Maximum channel power difference Maximum optical path penalty for n spans Maximum receiver reflectance

-15 dBm (depending on channel count) -26 dBm (depending on channel count) +2.0 dBm 12 dB 1.8 dB + n 0.5 dB 27 dB

Tab. 7.1

Physical Layer Parameters

138

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Technical Description (TED)

Meaning of the above mentioned reference points: MPI-SM: a multichannel reference point on the optical fibre just after the output optical connector of the NE transport interface MPI-RM: a multichannel reference point on the optical fibre just after the input optical connector of the NE transport interface

7.2
7.2.1

Rack/Subrack Mechanical Data


Rack Mechanical Data
Infinity MTS uses standard ANSI racks or ETSI racks (see Tab. 7.2 and Tab. 7.3) optimized for electrical and optical cabling.
Parameter Height Height (usable) Width Usable width between rack uprights Depth Depth (usable) Weight of the unequipped ETSI subrack Dimension 2200 mm 2050 mm 600 mm 500 mm 300 mm 280 mm about 59 kg

Tab. 7.2

ETSI Rack Dimensions According to ETS 300

Parameter Height

Dimension (mm) 2134 2286 2438 1867 2045 2178 660 546 305

Dimension (ft/HU) 7 ft 7 1/2 ft1) 8 ft1) 42 HU2) (7 ft rack) 46 HU (7 1/2 ft rack) 49 HU (8 ft rack) 2 ft, 2 inch 21.5 inch 12 inch

Height (usable)

Width Usable width between rack uprights Depth

1) In some customer applications 7 1/2 ft and 8 ft high racks are used 2) 1 HU = 1 3/4 inch = 44.45 mm

Tab. 7.3

ANSI Rack Dimensions

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Information SURPASS hiT 7550 2.05

7.2.2

Subrack Mechanical Data


Parameter Overall height (including cable compartment) Overall width with flanges Overall width without flanges Mounting center distance Mounting depth (front) Rack spacing Weight of the unequipped single-row subrack ETSI 578 mm 533 mm 500 mm 515 mm 125 mm 600 mm 19 kg ANSI 578 mm 583 mm 500 mm 566.7 mm 125 mm 578 mm

Tab. 7.4

Subrack Dimensions and Weight (Single Row Subrack)

Parameter Overall height (including cable compartment) Overall width with flanges Overall width without flanges Mounting center distance Mounting depth (front) Rack spacing

ETSI 968 mm 533 mm 500 mm 515 mm 125 mm 975 mm

ANSI 968 mm 583 mm 500 mm 566.7 mm 125 mm 978 mm

Weight of the unequipped double-row subrack about 26 kg

Tab. 7.5

Subrack Dimensions and Weight (Double Row Subrack)

Parameter Height (rack spacing) Height Width (overall) Width between mounting holes Depth (max.) Weight of the empty DCM shelf

ETSI 100 mm 88 mm 533 mm 515 mm 280 mm about 5 kg

ANSI 88.9 mm 88 mm 583 mm 567 mm 280 mm

Tab. 7.6

Mechanical Specications for DCM Shelf

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Technical Description (TED)

7.3

Technical Characteristics of Modules


The following modules are described in this section: MCU Module MIBS Module SAB/SABM Module SMU Module OSCTUT and OSCTUI Modules OLI Modules PUMPA, PUMPB, and PUMPC Modules Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL) OMDFxx and OMD2xx Modules OM20xx and OD20xx Modules CAD2 Modules EAM4 Module OPA Module OCA, OCAS, and OCS Modules UDCM Modules

7.3.1

MCU Module
Used at: Module dimensions One MCU in main shelf of each SURPASS hiT 7550 2.05 NE 25 mm wide x 265 mm high x 235 mm deep (0.98 inch wide x 10.43 inch high x 9.25 inch deep) 1 2.0 kg (see Chapter 7.5) None OK (green) and FAULT (red) Q3 over TCP/IP (RFC1006) / 7-layer OSI Stack / Q-F Stack Major audible/visual and Minor audible/visual Form C relays. Power Fail Form B relay. All relays are 100 mA maximum. In addition, each shelf features an Alarm Cut-off (ACO) button, Lamp Test button, and Fan Unit Failure LEDs.

Slots used Weight Power consumption Front panel fibre connectors Front panel LEDs OSS interfaces Office alarm outputs

Tab. 7.7

MCU Module

7.3.2

MIBS Module
Used at: Module dimensions One MIB in main shelf of each SURPASS hiT 7550 2.05 NE 7.5 mm wide x 50 mm high x 235 mm deep (0.30 inch wide x 1.97 inch high x 9.25 inch deep) 1 (in combination with one SAB or SAB-M module) 0.05 kg

Slots used Weight

Tab. 7.8

MIBS Module

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Information SURPASS hiT 7550 2.05

FEPROM storage capacity Power consumption

32 MByte (see Chapter 7.5)

Tab. 7.8

MIBS Module (Cont.)

7.3.3

SAB/SABM Module
Used at: Module dimensions One SAB in each subrack 7.5 mm wide x 90 mm high x 235 mm deep (0.30 inch wide x 3.94 inch high x 9.25 inch deep) 1 (may be combined with one MIB module) SAB: 0.03 kg, SAB-M: 0.06 kg (see Chapter 7.5)

Slots used Weight Power consumption SAB/SABM

SABM: this module hosts an additional CAN bus amplifier/repeater and replaces the SAB module in the main controller (MCU) subrack in OADM NEs.

Tab. 7.9

SAB/SABM Module

7.3.4

SMU Module
Used at: One in each subrack row of all SURPASS hiT 7550 2.05 NEs except for main subracks containing the OSCTU 25 mm wide x 265 mm high x 235 mm deep (0.98 inch wide x 10.43 inch high x 9.25 inch deep) 1 0.8 kg (see Chapter 7.5)

Module dimensions

Slots used Weight Power consumption

Tab. 7.10

SMU Module

7.3.5

OSCTUT and OSCTUI Modules


OSCT Module Types OSCTUT OSCTUI Specifications Used at: Module Dimensions all SURPASS hiT 7550 2.05 NEs (exact type as appropriate) 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 1.7 kg (see Chapter 7.5) OSCT, Unidirectional, for use at Terminal NEs (OTT) OSCT, Unidirectional, for use at In-line NEs (OLR, OADM)

Slots used Weight Power consumption

Tab. 7.11

OSCT Module Types

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Technical Description (TED)

Front panel fibre connectors

2 LC/PC for OSCTUT modules 4 LC/PC for OSCTUI modules OK (green) and Fault (red) 2 V.11 for customer 64 kbit/s channels 2 4-wire Voice Engineering Orderwire (EOW) 16 housekeeping inputs and 4 outputs 2x4-wire interfaces (#1 and #2, 64 kbit/s PCM with A or law) with access via connector panel, 4-wire interface #1 can also be used for the DTMF handset; 4-wire interface #2 is used for an EOW connection to another NE at the same site. Class 1 2 Mbit/s

Front panel LEDs External interfaces

EOW implementation

Laser Class OSC Capacity

OSCT Module Optical Characteristics OSC Wavelength Tx Output Power Range Rx Input Power Range EOL Span Loss Range Line Coding 1625 8 nm 0.0 dBm .. -3.0 dBm (typical: -1.0 dBm) -15 dBm .. -50 dBm 15.0 dB .. 40.0 dB at 1550 nm (47 dB at 1625 nm) CMI

Tab. 7.11

OSCT Module Types (Cont.)

7.3.6

OLI Modules
OLI Module Classification According to the Special Tasks Basic type amplifier OLIS TP/ I /TB A cost-effective amplifier type with reduced tilt setting facilities. Used in short links (lengths of 500 to 800 km) with only a low number of spans or in longer links combined together with extended or standard type OLIs. A high performance amplifier with gain tilt control facility.

Standard type amplifier OLI TP/ I /TB Extended type amplifier OLI TP/ I /TB with GTM

A high performance amplifier with extended gain tilt monitoring (GTM) and controlling facilities. Used for bridging a larger number of spans in a link.

According to the Application OLI (S)TP Terminal Preamplifier. Used at terminal sites for amplifying the incoming line signal before it is fed into the demultiplexing stage. Inline Amplifier. Used at in-line sites for optical regeneration of the signal. Terminal Booster. Used at terminal sites for amplifying the outgoing line signal.

OLI (S)I

OLI (S)TB

According to the Used Wavelength Band

Tab. 7.12

OLI Module Classication

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Information SURPASS hiT 7550 2.05

OLITPC OLIIC OLITBC OLITPUL OLIIUL OLITBUL OLITPL OLIIL OLITBL OLITPNC OLITBNC OLIINC

C band. This amplifier module operates in the C band and can be upgraded with an OLI-UL module for additional support of the L band. Available in versions with and w/o GTM. Upgrade L band. This amplifier module operates in the L band. This upgrade module is used for combined C+L-band applications. Available in versions with and w/o GTM. L band. This amplifier module operates in the L band. It is specifically designed for standalone L-band applications where C band operation is not required. Available in versions with and w/o GTM. C band. This amplifier module operates in the C band. It is specifically designed for standalone C-band applications where L-band operation is not required. It offers higher span performance due to the removal of the C/L band splitters, which results in lower insertion loss. Available in versions with and w/o GTM.

OLISTPNC OLISTBNC OLISINC

C band, using basic type OLI module. This amplifier module operates in the C band and cannot be upgraded to C+L band operation. It consists of performance optimized amplifiers.

Tab. 7.12

OLI Module Classication (Cont.)

Specifications for All Types of OLI Modules Used at: All NEs (exact type as applicable). Basic type OLI currently only available in OTTU and OLRU. 75 mm wide x 265 mm high x 235 mm deep (2.95 inch wide x 10.43 inch high x 9.25 inch deep) 3 4.0 kg (3.8 kg for basic type OLI) (see Chapter 7.5) 3 pigtails with E2000/HRL for connection of pump modules 2 duplex LC/PC for L-C-Band amplifier interconnection 2 LC/PC for optical signal monitoring 2 LC/PC for line-in and line-out fibre connections 1 LC/PC for the OSC at OLII (inline amplifier) stations one additional LC/PC connector for the OSC is provided OK (green) and FAULT (red) 24 dBm per C/L band (depends on OLI type) Class 1 with APSD 28.0 +/ 2.0 dB

Overall dimensions

Slots used Weight Electrical power consumption Front panel fibre connectors

Front panel LEDs Maximum output power Laser class Automatic power shut-down (APSD) level Maximum return loss at LC connectors Pump leakage Multichannel gain variation/difference

30 dB for booster input 35 dB for line input and output <0 dBm (<1.0 mW) 1.0 dB (C band) 1.0 dB (L band) 1.6 dB (C band only) with basic type OLI module

Tab. 7.13

Specications for OLI Modules

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Technical Description (TED)

Multichannel gain tilt

0.7 dB/dB (C band) (this tilt is compensated with internal tilt filters) 1.0 dB/dB (L band) (this tilt is compensated with internal tilt filters) 0.7 dB/dB (C band only) with basic type OLI module (this is compensated by EDFA pretilt + GTC pretilt)

Specifications for Specific Types of OLI Modules OLITBC / OLIIC Maximum total mean output power 17.5 dBm in standard configuration 20.5 dBm with optional PUMPA module 22.3 dBm with optional PUMPA and PUMPB module 23.5 dBm with optional PUMPA, PUMPB and PUMPC module -5.0 dBm <= Pout <= +11.0 dBm (depending on channel count) -2.0 dBm <= Pout <= +7.0 dBm

Per channel mean output power range

Required per channel mean output power range (40 channels) Per channel mean input power range

-26.0 dBm <= Popt <= -14.0 dBm for OLITBC (depending on channel count) -26.0 dBm <= Popt <= -15.0 dBm for OLIIC (depending on channel count)

OLITPC / OLITPL / OLITPUL / OLITPNC Maximum total mean output power 19.0 dBm in standard configuration 22.0 dBm with optional PUMPA module at OTTU Rx or 21.3 dBm with optional PUMPA module at OADMU -5.0 dBm <= Pout <= +11.0 dBm (depending on channel count) -1.0 dBm <= Pout <= +3.0 dBm

Per channel mean output power range

Required per channel mean output power range (40 channels) Per channel mean input power range

-26.0 dBm <= Popt <= -15.0 dBm (depending on channel count)

OLITBL / OLIIL / OLITBNC / OLIINC Maximum total mean output power 18.0 dBm in standard configuration 21.0 dBm with optional PUMPA module 22.8 dBm with optional PUMPA and PUMPB module 24.0 dBm with optional PUMPA, PUMPB and PUMPC module -5.0 dBm <= Pout <= +11.0 dBm (depending on channel count) -2.0 dBm <= Pout <= +7.0 dBm

Per channel mean output power range

Required per channel mean output power range (40 channels) Per channel mean input power range

-26.0 dBm <= Popt <= -14.0 dBm for OLITBL/ OLITBNC (depending on channel count) -26.0 dBm <= Popt <= -15.0 dBm for OLIIL/OLIINC (depending on channel count)

Tab. 7.13

Specications for OLI Modules (Cont.)

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OLITBUL / OLIIUL Maximum total mean output power 19.0 dBm in standard configuration 22.0 dBm with optional PUMPA module 23.8 dBm with optional PUMPA and PUMPB module 24.0 dBm with optional PUMPA, PUMPB and PUMPC module -5.0 dBm <= Pout <= +11.0 dBm at C-band line output (depending on channel count) -2.0 dBm <= Pout <= +7.0 dBm

Per channel mean output power range

Required per channel mean output power range (40 channels) Per channel mean input power range

-27.0 dBm <= Popt <= -14.0 dBm (depending on channel count)

OLISTBNC / OLISINC Maximum total mean output power Per channel mean output power range 18.0 dBm -5.0 dBm <= Pout <= +5.0 dBm (at OLI line output, depending on channel count) -2.0 dBm <= Pout <= +2.0 dBm

Required per channel mean output power range (40 channels) Per channel mean input power range

-26.0 dBm <= Popt <= -14.0 dBm for OLISTBNC (depending on channel count) -26.0 dBm <= Popt <= -15.0 dBm for OLISINC (depending on channel count)

OLISTPNC Maximum total mean output power Per channel mean output power range 18.5 dBm -5.0 dBm <= Pout <= +5.5 dBm (at OLI line output, depending on channel count) -2.0 dBm <= Pout <= +2.5 dBm

Required per channel mean output power range (40 channels) Per channel mean input power range

-26.0 dBm <= Popt <= -15.0 dBm (depending on channel count)

Tab. 7.13

Specications for OLI Modules (Cont.)

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Technical Description (TED)

7.3.7

PUMPA, PUMPB, and PUMPC Modules


Specifications Used at: Module dimensions optional at any SURPASS hiT 7550 2.05 NE 25 mm wide x 265 mm high x 235 mm deep (0.98 inch wide x 10.43 inch high x 9.25 inch deep) 1 1.15 kg (see Chapter 7.5) E2000 angled. Connector is located inside the module (behind front panel) OK (green) and FAULT (red) PUMPA: two 1480 nm laser diodes PUMPB: two 1495 nm laser diodes PUMPC: two 1465 nm laser diodes 450 mWatt (26.5 dBm) Class 1 with APSD

Slots used Weight Power consumption Optical connector type

Front panel LEDs On-board laser diodes

Maximum optical output power Laser class

Tab. 7.14

PUMPA, PUMPB, and PUMPC Modules

For use of pump modules with different OLI module variants and the corresponding total output power of the OLI modules refer to Chapter 7.3.6.

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Information SURPASS hiT 7550 2.05

7.3.8

Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)


Specifications Used at: Module dimensions optional at any SURPASS hiT 7550 2.05 NE 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 2 kg (see Chapter 7.5) RPumpC: 2 LC/PC and 1 Duplex LC/PC RPumpL: 2 LC/PC RPumpUL: 1 Duplex LC/PC Front panel LEDs Maximum optical output power Laser class Raman Pump Module Types RPUMPC RPUMPUL "Raman Pump, C band". Raman pump for C-band wavelengths. "Raman Pump, Upgrade L band". Raman pump that can be used only in combination with the RPUMPC module for a system that uses both the C band and L band. "Raman Pump, L band". Raman pump to be used with systems that will be L band only. OK (green) and FAULT (red) < 27 dBm (< 500 mW) Class 1 with APSD

Slots used Weight Power consumption Front panel fibre connectors

RPUMPL

Tab. 7.15

Raman Pump Modules (RPUMPC, RPUMPL and RPUMPUL)

148

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Technical Description (TED)

7.3.9

OMDFxx and OMD2xx Modules


Used at: Module dimensions OTTU (100% OADM) and OADMU NEs 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 OMDFI C/L: 1.8 kg OMD2I C/L: 1.8 kg OMDF C/L: 1.5 kg (see Chapter 7.5) OMDFIC: 12 LC/PC OMDFIL: 12 LC/PC OMDFC: 6 LC/PC OMDFL: 6 LC/PC OMD2IC: 6 LC/PC OMD2IL: 6 LC/PC Front panel LEDs none

Slots used Weight

Power consumption Front panel fibre connectors

Maximum return loss with LC connec- 35 dB tors Bandwidth (1 dB) Even-odd channel isolation Active temperature controlled over 16 GHz 25 dB -5C .. +65C (not for OMDFC/L)

Tab. 7.16

OMDFxx and OMD2xx Modules

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

7.3.10

OM20xx and OD20xx Modules


Used at: Module dimensions OTTU (100% OADM) and OADMU NEs 100 mm wide x 265 mm high x 235mm deep (3.92 inch wide x 10.43 inch high x 9.25 inch deep) 4 3.1 kg 4.1 kg (see Chapter 7.5) 24 LC PC none adjustable between: - 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm) - 14 dBm to - 2.0 dBm per channel 35 dB 27 GHz 22 dB 40 dB -5C .. +65C via passive compensation

Slots used Weight OD20xx Weight OM/ODA20xx Power consumption Front panel fibre connectors Front panel LEDs Input power range for OM20xx

Output power range for OD/ODA20xx Maximum return loss at LC connector Bandwidth (1 dB) Adjacent channel isolation Non-adjacent channel isolation Temperature stability range

Tab. 7.17

OM20xx and OD20xx Modules

7.3.11

CAD2 Modules
Used at: Module dimensions OADMU NEs 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 1.5 kg (see Chapter 7.5) 8 LC/PC OK (green) and FAULT (red) 0 dBm +/ - 4.5 dB - 12.0 dBm to - 6.0 dBm 29 GHz 22 dB 36 dB < 15 ms 41.0 dB The given parameters are valid for the whole operating temperature range of 0C ... 65 C

Slots used Weight Power consumption Front panel fibre connectors Front panel LEDs Add-channel input power range Drop-channel output power range Bandwidth (1 dB) Adjacent channel isolation Non-adjacent channel isolation Switching time Maximum return loss at LC connector Temperature stability

Tab. 7.18

CAD2 Modules

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Technical Description (TED)

7.3.12

EAM4 Module
Used at: Module dimensions OADMU NEs 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 1.0 kg (see Chapter 7.5) 8 LC/PC OK (green) and FAULT (red) 0 C to 65 C 55.0 dB

Slots used Weight Power consumption Front panel fibre connectors Front panel LEDs Temperature stability range Maximum return loss at LC connector

Tab. 7.19

EAM4 Module

7.3.13

OPA Module
Used at: Module dimensions optional at OTTU (100% OADM), OADMU and OLRU NEs 75 mm wide x 265 mm high x 235 mm deep (2.94 inch wide x 10.43 inch high x 9.25 inch deep) 3 3 kg (see Chapter 7.5) 4 LC/PC - 5C to +70 C 8 dB to 28 dB 0.1 nm 100 GHz

Slots used Weight Power consumption Front panel fibre connectors Temperature stability range OSNR measurement range Resolution bandwidth Measurement grid

Tab. 7.20

OPA Module

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

7.3.14

OCA, OCAS, and OCS Modules


Used at: Module types CCU NEs together with OTTU (100% OADM) and OADMU OCAC, OCAL: module with four single channel amplifiers for C/L band OCASC, OCASL: module with four single channel amplifiers and with optical switches for C/L band OCS: module with optical switches only (for C and L band) L band modules are not available in the current release. 50 mm wide x 265 mm high x 235 mm deep (1.96 inch wide x 10.43 inch high x 9.25 inch deep) 2 OCA, OCAS: 3.0 kg OCS: 1.7 kg (see Chapter 7.5) LC/APC connectors OK (green) and FAULT/LOS alarm (red) OCAC/OCAL/OCASC/OCASL: four single channel amplifiers adjustable between: - 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm) - 12.0 dBm to - 6.0 dBm < 15 ms 35.0 dB 15.0 to 3.0 dBm (OCA, OCAS) OCA: +3 to +8 dBm, typical +7.5 dBm OCAS: -3 to + 2 dBm Class 1 with APSD OCS/OCASC/OCASL: two 2:1 switches per channel (four channels) for add/drop or express traffic OCS: - 5C to +70 C OCA, OCAS: 0C to +50C

Module dimensions

Slots used Weight

Power consumption Front panel fibre connectors Front panel LEDs Amplifiers (EDFAs) Add-channel input power range

Drop-channel output power range Switching time Maximum return loss at LC connector Mean input power range Mean output power range

Laser class Optical switches

Temperature stability

Tab. 7.21

OCA, OCAS, and OCS Modules

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Technical Description (TED)

7.3.15

UDCM Modules
Specifications Shelf size (UDCM tray) 583 mm wide x 88.2 mm high x 300.3 mm deep (23 inches wide x 3.5 inches high x 11.8 inches deep) 268 mm wide x 40.8 mm high x 294 mm deep 10.5 inches wide x 1.6 inches high x 11.6 inches deep UDCM, depending on type: 10 km to 80 km: 3.15 kg + n x 0.12 kg (n for each 10 km = 1 ... 8); 90 km to 120 km: 3.7 kg + n x 0.12 kg (n for each 10 km = 9 ... 12) UDCM tray: 5.0 kg (see Chapter 7.5) 27 dB

UDCM dimensions (up to 4 fit into a UDCM Tray) Weight

Power consumption Maximum return loss without LC connector (Rayleigh backscatter)

UDCMC (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for SSMF Type UDCMC-10 UDCMC-20 UDCMC-30 UDCMC-40 UDCMC-50 UDCMC-60 UDCMC-70 UDCMC-80 UDCMC-90 UDCMC-100 UDCMC-110 UDCMC-120 Average Dispersion at 1550 nm -170 ps/nm -340 ps/nm -510 ps/nm -680 ps/nm -850 ps/nm -1020 ps/nm -1190 ps/nm -1360 ps/nm -1530 ps/nm -1700 ps/nm -1870 ps/nm -2040 ps/nm

Relative dispersion slope RDS = 0.0035 / nm UDCMCA (C band) Unidirectional Dispersion Compensation Modules for SSMF Type UDCMC-10A UDCMC-20A UDCMC-30A UDCMC-40A UDCMC-50A UDCMC-60A UDCMC-70A UDCMC-80A UDCMC-90A Average Dispersion at 1550 nm -170 ps/nm -340 ps/nm -510 ps/nm -680 ps/nm -850 ps/nm -1020 ps/nm -1190 ps/nm -1360 ps/nm -1530 ps/nm

Tab. 7.22

UDCM Modules

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

UDCMC-100A UDCMC-110A

-1700 ps/nm -1870 ps/nm

Relative dispersion slope RDS = 0.0023 / nm UDCML (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for SSMF Type UDCML-10 UDCML-20 UDCML-30 UDCML-40 UDCML-50 UDCML-60 UDCML-70 UDCML-80 UDCML-90 UDCML-100 UDCML-110 UDCML-120 Average Dispersion at 1590 nm -187 ps/nm -374 ps/nm -561ps/nm -748 ps/nm -935 ps/nm -1122 ps/nm -1309 ps/nm -1496 ps/nm -1683 ps/nm -1870 ps/nm -2057 ps/nm -2244 ps/nm

Relative dispersion slope RDS = 0.0032 / nm UDCMCP (C band) Unidirectional Dispersion Compensation Modules for NZDSF and DSF with Positive Slope Compensation Type UDCMC-48P UDCMC-80P UDCMC-128P UDCMC-177P UDCMC-240P Average Dispersion at 1550 nm 48 ps/nm 80 ps/nm 128 ps/nm 177 ps/nm 240 ps/nm

Relative dispersion slope RDS = 0.0035 / nm UDCMCN (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for NZDSF+ (Truewave RS) Type UDCMC-170N UDCMC-255N UDCMC-340N UDCMC-425N UDCMC-510N UDCMC-680N UDCMC-850N UDCMC-1020N Average Dispersion at 1550 nm -170 ps/nm -255 ps/nm -340 ps/nm -425 ps/nm -510 ps/nm -680 ps/nm -850 ps/nm -1020 ps/nm

Relative dispersion slope RDS = 0.01 / nm

Tab. 7.22

UDCM Modules (Cont.)

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Technical Description (TED)

UDCMLN (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for NZDSF+ (Truewave RS) and DSF Type UDCML-170N UDCML-255N UDCML-340N UDCML-510N UDCML-680N UDCML-850N UDCML-1020N UDCML-1190N UDCML-1360N UDCML-1530N UDCML-1700N Average Dispersion at 1590 nm -170 ps/nm -255 ps/nm -340 ps/nm -510 ps/nm -680 ps/nm -850 ps/nm -1020 ps/nm -1190 ps/nm -1360 ps/nm -1530 ps/nm -1700 ps/nm

Relative dispersion slope RDS = 0.0085 / nm UDCMCH (C band) Unidirectional Dispersion Compensation Modules with Slope Compensation for NZDSF+ (LEAF & Freelight) Type UDCMC170H UDCMC255H UDCMC340H UDCMC425H UDCMC510H UDCMC680H Average Dispersion at 1550 nm -170 ps/nm -255 ps/nm -340 ps/nm -425 ps/nm -510 ps/nm -680 ps/nm

Relative dispersion slope RDS = 0.0021 / nm UDCMLH (L band) Unidirectional Dispersion Compensation Modules with Slope Compensation for NZDSF+ (LEAF & Freelight) and DSF Type UDCML170H UDCML255H UDCML340H UDCML510H UDCML680H UDCML850H UDCML1020H UDCML1190H UDCML1360H UDCML1530H UDCML1700H Average Dispersion at 1590 nm -170 ps/nm -255 ps/nm -340 ps/nm -510 ps/nm -680 ps/nm -850 ps/nm -1020 ps/nm -1190 ps/nm -1360 ps/nm -1530 ps/nm -1700 ps/nm

Relative dispersion slope RDS = 0.0011 / nm

Tab. 7.22

UDCM Modules (Cont.)

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Technical Description (TED)

Information SURPASS hiT 7550 2.05

7.4

Rack/Subrack Power Supply


Nominal supply voltage 48/60 Vdc positive grounded 40.5 Vdc to 75 Vdc

Supply voltage range Each two circuit breakers/fuses (at PDP) for: OADM double-row subrack equipped with OLI modules all other subracks

20 A 15/16 A

7.5

Electrical Power Consumption of Modules


Module typical CAD2 EAM4 Fan Box MCUB MIBS OD20 OM20 OLI Modules 3.6 W 3.6 W 25 W 15 W 1W 3.6 W 3.6 W 65 W (40 W for basic type OLI) 10.6 W 10.6 W 0.2 W 25 W 10 W 25 W 25 W 25 W 85 W 85 W 55 W 21 W Electrical power consumption maximum 5.3 W 5.3 W 50 W 25 W 1W 5.3 W 5.3 W 120 W (75 W for basic type OLI) 24 W 24 W 0.2 W 31 W 18 W 45 W 45 W 45 W 110 W 110 W 70 W 26 W (C band) 35 W (L band) 18 W 0.5 W 1W 12 W 0.2 W

OMDFI C/L OMDI C/L OMDF C/L OPA OSCTUI/OSCTUT PUMPA PUMPB PUMPC RPUMPC RPUMPL RPUMPUL OCA, OCAS

OCS SAB SABM SMU2 UDCM

16 W 0.5 W 1W 7W 0.2 W

Tab. 7.23

Electrical Power Consumption of Modules

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7.6

Electrical Power Consumption of Racks


For details on the electrical power consumption of fully-populated racks, refer to Fig. 4.11 to Fig. 4.13.

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7.7

External Interfaces
Optical Line Interface Connector Mean channel output power Mean channel input power OSC output power range OSC input power range Optical Tributary Interface Connector Input power LC/PC adjustable between: - 8 dBm (+/ - 4.5 dBm) to +2 dBm (+/ - 4.5 dBm) 2.5 GHz for 50 GHz channel spacing 10 GHz for 100 GHz channel spacing 10 dB - 14 dBm .. 2dBm LC/PC - 5 dBm .. +11 dBm - 26 dBm .. - 15 dBm - 2.0 dBm .. - 5.0 dBm - 15 dBm .. - 50.0 dBm

Wavelength stabilization for 10 Gbit/s

Required extinction ratio Required receiver dynamic range T3 Clock Interface Connector Compliant to Frequency Impedance

D-SUB 9 G.703 (10.98) 2048 kHz 4.6 ppm 75 Ohms coaxial pair 120 Ohms symmetrical pair 0.75 to 1.5 Vop at 75 Ohms 1.0 to 1.9 Vop at 120 Ohms

Peak voltage

User Data Channels (sV.11) Data channel Number of available bi-directional channels Connector Bit rate Input impedance Max.imum load resstance Output voltage (line a to b) Input voltage (line a to b) Used overhead bytes Engineering Orderwire Realization Transmission range Dialing: method transmit level receive level 4-wire interface and handset 300 to 3400 Hz similar to ITU-T V.11 2

2 D-SUB 9 pin connectors 64 kbit/s 150 Ohms +/ 10% balanced 150 Ohms balanced 2 to 5 V (at Ri = 150 Ohms) 0.3 to 6 V F0, NU1, NU2

DTMF 14 to 9 dBm0 30 to 0 dBm0

Tab. 7.24

External Interfaces

158

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Technical Description (TED)

Modulation method Bit rate Input/output impedance handset 4-wire interface Input level Output level Connector Used overhead bytes Telemetry Interface (TIF) Telemetry inputs (sensors) Number of inputs available per subrack Input voltage range Voltage range for active state Voltage range for inactive state Input current (input connected to ground) Telemetry outputs (actors) Number of outputs available per subrack Output voltage range Maximum current (active) Maximum impedance active state Maximum impedance inactive state Connector NEAP User Interface

PCM, A / -law 64 kbit/s

600 / 150 Ohms balanced 600 / 600 Ohms balanced 4/ 10/ 0 dBr (settable via SW) 4/ + 7/ 12 dBr (settable via SW) Western plug (handset) and D-SUB 9 pin (4-wire interface) E0, F0

16

75 V to 0 Vdc (SELV) / central office battery supply (TNV-2) 3 V .. 0 V 75 V .. 10 V 1 to 3 mA

0 V to +/ 75 Vdc (SELV) / central office battery supply (TNV-2) 200 mA 16 Ohms 100 kOhms D-SUB 25

2 2 1 1 1 4 1

Major alarm LEDs (Communication and Equipment) Minor alarm LEDs (Communication and Equipment) Acknowledge LED Acknowledge button Lamp test button Power on LEDs EOW conference LED

Connector LCT Interface Connector

Handset connector

1 10 BaseT connector (Q interface) 1 RS-232 9 pin D-SUB connector (F interface)

Tab. 7.24

External Interfaces (Cont.)

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7.8

System Environmental Specications


Operating range: according to ETSI standard 300 019 class 3.1E according to Bellcore GR 63

5 to +45 C (temperature of air flowing into the subracks) +5 to +40 C; short term: +5 to +50 C

exceptions for the OCA/OCAS mod- 5 to +48 C at an air flow of >1m/s ules in the CCU network element (5 to +55 C for a maximum of 96 contiguous hours during a maximum of 15 days a year and at an air flow of >1m/s) Storage range: according to ETSI standard 300 019 class 1.2 according to Bellcore GR 63 Humidity Altitude Environmental standards EMC standards Safety standard

25 to +55 C 40 to +70 C during a maximum of 72 hours 5% to 90% -100 m to 4000 m ETS 300 019 and Bellcore GR63 EN 300 386-2 - V1.1.3 (1997-12) EN 60950 (according to most actual and valid issue) FCC Part 15, Subpart J, Class A per GR-1089

ESD

Tab. 7.25

System Environmental Specications

7.9

System Requirements for the Element Manager


The computer onto which this software is installed must have the following attributes. As always, PCs operating at faster speeds are recommended for better performance.
CPU Memory Hard Disk Drive Monitor LAN Operating System Pentium IV 1.8 GHz 1 GB 30 GB Color monitor 21 recommended Ethernet card, 2x 3COM (3C982-TXM) Windows 2000

Tab. 7.26

EM System Requirements

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8 Product Overview
An overview of the main components used for SURPASS hiT 7550 2.05 is provided in the ITMN.

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9
AC/DC ACO ACSE ALS ANSI APR APR APS APSD ASCII ASE ATM AUX BSD Bw7R CAD2 CAN CCU CDM CLK CLNP CMI CMIP CMISE CMX COPA

Abbreviations
Q3/Ethernet Interface Converter Alarm Cut-Off Application Control Service Element Automatic Laser Shutdown American National Standard Automatic Power Reduction Automatic power reduction Application Program System Automatic Power Shutdown American Standard Code for Information Interchange Amplified Spontaneous Emission Asynchronous Transfer Mode Auxiliary Channel Berkely Software/Standard Distribution Narrow-Rack Style 7R Channel Add/Drop module 2 wavelengths Controller Area Network Channel Connection Unit Cross Domain Manager Clock Connectionless Network Layer Protocol (G.784) Code Mark Inversion Common Management Information Protocol Common Management Information Service Element Cross Multiplexer Connector Panel (rear or front access) Common Object Request Brocker Architecture Card-Present-Sense Central Processing Unit Data Communication Channel Data Multiplex Channel-Multiplex Section Data Communication Channel Multiplex (OMS DCC) Data Communication Channel Optical (OTS DCC)

10BaseT

CORBA CPS CPU DCC DCC-M DCCMo DCCOo

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Information SURPASS hiT 7550 2.05

DCC-R DCF DCM DCN DEMUX DSF DSP D-SUB DTMF DWDM EAM4 ECC EDFA EDI EEPROM EFEC EM EMC EML EN EOW ESD ES-IS ETS ETSI EXC Ext F FAN FCC FE FEC FEPROM FMX FPGA GTC

Data Multiplex Channel-Regenerator Section Dispersion Compensating Fibre Dispersion Compensation Module Data Communication Network Demultiplexer Dispersion Shifted Fibre Digital Signal Processor Sub-Miniature Connector Dual Tone Multi Frequency Dense Wavelength Division Multiplex Equalizing Module Embedded Communication Channel Erbium Doped Fiber Amplifier Electronic Data Interface Electrical Erasable Programmable ReadOnly Memory Enhanced Forward Error Correction Element Manager Electromagnetic Compatibility Element Management Layer Enable European Standard Engineering Order Wire Electrostatic Discharge Enhanced Signaling and Interworking Subsystem European Telecommunication Standard European Telecommunication Standards Institute Excessive Bit Error Ratio External Alarm Standardized Interface for Connection of the Operating Terminal Fiber Access Network Federal Communications Commission (USA) Functional Unit Forward Error Correction Flash Erasable Programmable Read-Only Memory Flexible Multiplexer Field Programmable Gate Array Gain Tilt Control

164

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GTM GUI HDLC HRL HU HW I IP IS-IS ISO ITMN ITU ITU-T LAPD LCC LCT LDAP LEAF LED LF LOF LOL LOS MAC MCF MCU MD MIBS MPI-RM MPI-SM MTS MUX MVM NCT NE NEALI NEAP NI NML

Gain Tilt Monitor Graphical User Interface High-Level Data Link Control/Procedure High Return Loss (Connector Type) Height Unit Hardware Inline amplifier Internet Protocol Integrated system for fulfilling the infrastructure requirements of fiber optics systems International Standards Organization Installation and Test Manual International Telecommunication Union Telecommunication Standardization Sector of ITU Link Access Point Discriminator Local Card Controller Local Craft Terminal Lightweight Directory Access Protocol Large Effective Area Fiber Light Emitting Diode Loop Filter Loss Of Frame (G.783) Loss Of Light Loss Of Signal Media Access Control Message Communication Function Main Control Unit Monitor Diode Management Information Base (Small) Multi-Point-Interface-Receiver Module Multi-Point-Interface-Synchronous Multiplexer Multiwavelength Transport System Multiplexer Multi-Vendor Management Network Craft Terminal Network Element Network Element Alarm Interface Network Element Alarm Panel Network Interface Network Management Layer

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Information SURPASS hiT 7550 2.05

NRZ NSAP NUBAT NZDSF Och OCP OCR OCR10G OCU OD OD20 OGL OLI OM20 OMD OMS OSC OSCT OSI OSIAM OSIAM OSN OSNR OSPF OSS OTS PCB PD PDH PDP PHF P-LD PLF PLL Pout PPP pSOS PSU PUBAT PWR

Non Return to Zero Network Service Access Point Battery Voltage (negative) Non Zero Dispersion Shifted Fibre Optical channel Optical Channel Protection Optical Channel Repeater Optical Channel Repeater 10 Gbit/s Optical Channel Unit Optical Demultiplexer Optical Demultiplexer 20 channels Operator Guidelines Optical Line Interface Optical Multiplexer 20 channels Optical Multiplexer/Demultiplexer Optical Multiplex Section Optical Supervisory Channel Optical Supervisory Channel Termination Card Open System Interconnection (G.784) Open System Interconnection Access Manager OSI Protocol Stack API Message Optical Service Node Optical Signal/Noise Ratio Open Shortest Path First Operational Support System (e. g. TNMS) Optical Transmission Section Peripheral Control Bus Photo Diode Plesiochronous Digital Hierarchy (G.783) Power Distribution Panel Power High Failure Photo-Laser Diode Power Low Failure Phase Locked Loop Output Power

,,,,,

Point-to-Point Protocol provably Secure Operating System Power Supply Unit Battery Voltage (positive) Power

166

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Q Q3 RAM RDI RDS RFC RPUMP RS Rx RX SAB SABM SC SD SDH SDRAM SEMF SIPAC SL16 SL64 SLR SLR16 SLT SMA SMTP SMU SNMP SONET SPI SPM SRA SRAM SRS SSM SSMF STM-1

Interface to a Telecommunication Management Network Q-Interface acc. to Info-Model Random-Access Memory Remote Defect Indicator Relative Dispersion Slope Request For Commands Raman PUMP Regenerator Section Receive Data Receiver Subrack Address Board Subrack Address Board Modificated Supervisory Channel Signal Degrade (G.782) Synchronous Digital Hierarchy Synchronous Dynamic Random Access Memory Synchronous Equipment Management Function Siemens Packaging System Synchronous Fiber-Optic System for STM16 Signals Synchronous Fiber-Optic System for STM64 Signals Synchronous Line Regenerator Synchronous Line Regenerator STM-16 Synchronous Line Terminal Synchronous Multiplexer Access Simple Mail Transfer Protocol Supervisory Management Unit Simple Network Management Protocol CMIP Synchronous Optical Network (uses American Standard) Serial Peripheral Interface Self Phase Modulation Synchronous Radio Access Static RAM Stimulated Raman Scattering Synchronization Status Message Standard Single Mode Fibre Synchronous Transport Module Level 1

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Information SURPASS hiT 7550 2.05

SURPASS hiT 7540Optical Channel Unit (OCU) SURPASS hiT 7550 2.05Long Haul / SURPASS hiT 7550Long Haul / SURPASS hiTSiemens Next Generation Network Solution for Optics SURPASS SW SXA SXD t.b.d. T0 T2 T3 TB TCP/IP TDM TED TempP TEX TIF TMF TMN TMN-DCP TMNS TNMS CT TP TP TP0 Tx TX UBAT UDCM UDP UHC UL Brandname for the Siemens Next Generation carrier networking solutions Software Siemens SDH Synchronous Cross Connect - VC-12 Siemens SDH Synchronous Cross Connect - VC-4 to be defined System Clock Internal Clock Reference Signal Input for External Clock Reference Signal Terminal Booster Transmission Control Protocol/Internet Protocol Terminal Digital Multiplexer Technical Description Temperature Problem Ten Gigabit Multiplexer Telemetry Interface Telemanagement Forum Telecommunications Management Network Telecommunications Management Network-Data Communication Protocol Transport Network Management System TNMS Craft Terminal Terminal Preamplifier Termination Point Transport class 0 Transmit Data Transmitter Battery Voltage Unidirectional Dispersion Compensation Module User Datagram Protocol Ultra-High Capacity Underwrites Laboratory

TMNS-MVM TMNS-Multi-Vendor Management

168

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ULED ULH UNIX VCDB VOA WDM WTTR XPM

Feeding Bus for Card LEDs Ultra Long Haul Trademark of UNIX System Laboratories Incorporated Variable Configurable Data Block Variable Optical Attenuator Wavelength Division Multiplexing Regenerative Transponder Cross Phase Modulation

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10 Index
Symbols
"C" (Conventional) band 53 "even numbered" channels 57 "L" (Long) band 53 (APSD) threshold levels and behavior 67 Active APS 132 Inactive APS 132 Inactive version 132 Unidirectional 60 TNMS CT LCT/NCT software 136 TNMS CT Local Craft Terminal (LCT) 133 allowable customer input signal range 28 amplification process 67 ANSI 88, 116 ANSI racks 111, 139 ANSI subracks 115 APS (Application Program System) software 132 APSD bit 24 ARP protocol for Ethernet 43 Asymmetrical architectures 76 asynchronous serial busses 83 Asynchronous Transfer Mode (ATM) services 17 attributes 160 automatic and manual routing 38 Automatic Laser Restart 24 Automatic Laser Shutdown (ALS) 24 Automatic Power Reduction (APR) 23 Automatic Power Shutdown (APSD) 23, 67

Numerics
100 GHz spacing 58 100BaseT 46 10BaseT 46 16 bi-directional add/drop channels 74 16 wavelengths from the C Band 73 16 wavelengths from the L Band 73 160 channel DWDM signal 62, 63 2 Mbit/s Optical Supervisory Channel (OSC) 86 20 optical wavelengths 102 3 dB coupler 60 3 dB couplers 58, 96 3W3 115 4 sub-bands 62 48/60V 111 50 GHz spacing 58

B
backbone networks 68 basic OLI module design 67 battery 48/60V 111 bi-directional channel operation 73 Bit Error Rate (BER) of 10-13 27 Blue C band 57 booster amplification 67 booster amplifier output 34, 36 broadband EDFAs 65 Bw7R 83

A
abbreviations used in the figures 96 AC/DC station converter 111 access to/from the application 43 according to PPP 47 accuracy of the clock 107 ACO (Alarm Cut-Off) (blue) 126 ACSE 43 active modules 100 Add Channel 29 Add channel and drop channel ageing control 102 add/drop 73 add/drop WDM filters 102 addition and termination of optical signals 71 additional Ethernet interface 46 Additional safety mechanisms 26 adjustable tilt filter 29 ageing control 100 alarm and maintenance concept 136 alarm information 136 alarm panel PDP 126 Alarms 129 Alarms of the subrack 126

C
C (Conventional) 65 C and L Band amplifiers 34, 36 C and L Band EDFAs 66 C Band 53 C Band and L Band EDFAs 69 C/L Band separation filter 62 CAD2 73, 102 CAD2 block diagram 103 CAN Bus 83 CAN bus repeater/amplifier 86 card detection 85 Card Inventory Management information 85 Card present information 96 carrier OSNR 37 carrier power 37 cascaded 76 CD 133 central monitoring 83 change in traffic topology 73 Channel Add/Drop (CAD2) module 102 channel distribution 29

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channel powers 29 channel spacing 58 chromatic dispersion 106 chromatic dispersion coefficients 68 Class 1 levels 23 Cleared Alarms 131 Client signal ageing 29 client signals 62 clients receiver 102 CLNP 43 clock signal (T3) 107 clock synchronization 86 CMIP agent 43 CMISE/CMIP (ITU X.710/X.711) 42 commissioning 135 commissioning and maintenance operations 42 communication interfaces 44 communication network 47 communication stack profiles supported 44 communication stacks 43 Compact Disk 133 compatibility to existing OSI networks 46 compensate for tilts 29 complementary documentation 11 configuration and performance parameters 43 Configuration Management 108 connector panel COPA 115 constant pump current control 29 control element 110 control functions 83 COPA 86, 107 COPA front side 135 CORBA based 39 CORBA Interface 39 craft terminal 135 Cross Phase Modulation (XPM) 106 Current Alarm List 129 currently unequipped sub-band 73 customer documentation 11

double-row 111, 116 Drop Channel 29 DSF 106 DWDM link performance 28 DWDM signal parameters 33 DWDM solutions on 10 Gbit/s transmission systems 65 DWDM system 27 dynamic routing 43

E
EAM4x 103 ECC communication interfaces 83 EDFA 27 EEPROMs 88 effect of ageing client transmitters 28 electrical and optical cabling 139 electrical interfaces 86 electrical power consumption 157 element layer management 38 Element Manager (EM) 40, 108 Element Manager (EM) user interface 135 Element Manager software 133 EM 109 EM application program 41 EM Screen Tree 109 EM session 131 EM user interface 135, 136 End of Life (EOL) 27 end system 43 end terminal equipment 24 energy scattering effect 69 EOL capacity 76 EOW 88 EOW 4-wire interfaces 86 Equipment Management 108 Erbium Doped Fibre Amplifier (EDFA) technology 65 ES-IS 43 Ethernet and DCC interfaces 43 Ethernet interface 46 ETS 300386-1 111 EN 55022 111 ETS 300 132-2 111 ETSI 88, 116 ETSI rack 139 express 73 external clock 107 external OLI pumps 29 extra APSD mechanisms 26 extra pump modules 68 extreme bottom right slot 85

D
Data Communication Channel 21 data link (layer 2) protocol 46 Date and time stamps 131 DC power distribution 111 DCC interfaces 43 DCF spectral attenuation 29 DCF SRS tilt 29 DCM management 106 DCM shelves 120 Debug port 127 demultiplexing 64 dielectric multiplexer/demultiplexer filters 62 Dispersion Compensating Fibre (DCF) 106 Dispersion Shifted Fibre 67

F
FAN alarms 88

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FAN control and supervision 86 FAN units 88 Fault LED 127 Fault Management 108 fibre attenuations 68 fibre break 23 fibre spectral attenuation 29 fibre types 68 F-interface 46 first booster amplifier 24 first EDFA stage 68 first sub-band output 62 flat output spectrum 29 Forward Error Correction (FEC) 27 frequency interleavers 62 front panel on OM/OD, OLI, PUMP and RPUMP modules 127 fully-populated racks 157 functionality 53

IP (address, routing tables) 43 IP based applications (TL1, Web Terminal) 47 IP packages on Ethernet 47 IP packets 47 IP to NSAP address mapping 43 IS-IS 43 ITU terminology 43 ITU-T G.692 wavelength grid 60 ITU-T Recommendation. G.653 67

L
L (Long) Band 65 L Band 53 L Band (1570 to 1607nm) 66 lamp test 126 LAPD (in unacknowledged mode) 47 large span loss range 94 Laser Class 3B 23 latching mechanism 127 layers 2 (DCC, MAC) 43 LCT 133, 135 LCT interface 135 LCT Network Management software 133 LED control 86 LEDs 86 list of OSCTU functions 88 live traffic 34 local card controller 86 Local Card Controller (LCC) 83 local commissioning 40 local or remote control and monitoring 135 logical broadcast network topology 46 loss of input signal (LOS) 24 Loss of Light (LOL) count 37 loss of the OSC 24 low dispersion 58 low loss 58 low noise 68 low power 68 lower frequency (higher wavelength) 69 lowest cost per channel 62

G
Gain Tilt Monitor (GTM) 29 gateway functionality 47

H
higher frequency (lower wavelength) 69 History Alarm List 131 history log 131 http 43 hub/switch 46

I
indication LEDs 126 individual wavelengths 57 inelastic collisions 69 information addressed 47 information model 42 information models (interface dialects) 44 infrastructure 66 initial commissioning 135 inline amplification 67 input noise filter 111 insertion/extraction aids 127 integration time (15 min.) 100 inter-card communications 83 interference 58 interferometer technology 58 interleaver 57, 62 interleavers 58 intermediate optical amplifier sites 71 Internet Protocol (IP) services 17 inter-subrack data communications 85 inter-symbol interference 106 inventory management 86

M
Mach-Zehnder 58 Main Control Unit (MCU) 83 main DWDM traffic signal 91 main subrack 86 main traffic signal 24 Maintenance measures 136 maintenance operations 40 major communication alarm (red) 126 major equipment alarm (red) 126 Management Communication Function (MCF) 83 Marben 43

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Information SURPASS hiT 7550 2.05

master system clock (T0) 107 MCU 132 MCU module 135 MCUs clock 107 measured carrier frequency (GHz) 37 mechanical equipment layout 111 menu-driven 135 message communication function (MCF) 43 MIBS 83 mid-stage access points 67 minor communication alarm (yellow) 126 minor equipment alarm (yellow) 126 mode of operation (inactive, OSI only, IP only, OSI and IP combined) 47 module 127 Modules 121 monitor diodes 100 multiple Q3 managers 46 multiplexing architecture 63, 64

N
NCT 133 NCT Network Management software 133 NCT PC 42 NE Alarm Panel 126 NE Alarm Panel (NEAP) 85 NE alarms LED control (minor/major equipment alarms) 88 NEALI 83 NEAP 86, 126 NEAP front side 126 Network Control Terminal (NCT) 42 Network Craft Terminal (NCT) 133 Network Element Alarm Panel (NEAP) 46 network layer 38 network management capabilities 110 Network Management System (NMS) 42 network planning 73 new APS 132 noise filters 111 nominal voltage 111 non-linear effects 68 non-linear fibre effect 29 non-traffic interrupting 73 non-traffic interrupting upgrade 66 NZDSF(-) 106

O
OADM double row subrack 111 OADMU add/drop interfaces 29 OADMU NEs 102 OAM&P 108 OD20 58 ODA20 100

OK LED 127 OLI 91 OLI card 92 OLI interstage APSD 26 OLI interstage device surveillance 26 OLI module 92 OLI module basic block diagram 92 OLI modules 91, 111 OLI preamplifier pump lasers 100 OLI pump cards (PUMPA, PUMPB, PUMPC) 121 OLI pump currents 29 OLI PUMP modules 94 OLIIC module 67 OLITBUL 67 OLR 126 OLR NE 67 OM20 58 OM20/OD20 100 OMD 96 OMD2IC 96 OMD2IL 96 OMDFC 96 OMDFIC 96 OMDFIL 96 OMDFL 96 on board OLI pumps 29 on-board EEPROM 94, 100 OPA 37, 65 OPA card 121 Optical Add/Drop Multiplexer (OADM) 18, 71 Optical Add/Drop Multiplexer site (OADMU) 36 Optical Add/Drop Multiplexer Unidirectional (OADMU) 60 optical amplifier modules (OLI) 64 Optical inLine Repeater (OLR) 18, 65 Optical inLine Repeater Unidirectional (OLRU) 60 Optical Laser Safety 100 Optical Line Interface (OLI) module 21 Optical Line Interface (OLI) modules 91 optical link budget 67 optical link control 83 Optical Multiplexer/Demultiplexer (OMD) modules 96 Optical Multiplexer/Optical Demultiplexer (OM20/OD20) modules 100 optical parameters 33 optical path 60 optical path through the OADM 71 Optical Performance Analyzer 33 Optical Performance Analyzer (OPA) 34 optical power monitoring 100 Optical Signal to Noise Ratio (OSNR) 27 optical spectrum analyzer 29 Optical Spectrum Analyzer (OSA) 34 Optical Supervisory Channel 20 optical supervisory channel 21

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Optical Supervisory Channel Termination (OSCT) module 86 Optical Supervisory Channel Termination Card Unidirectional (OSCTU) 21 optical system performance and control 33 Optical Terminal OTT 40 optical transmission 60 optical transmission distances 65 Optical Transport Terminal (OTT) 18, 60 optical/electrical cable 95 optimum gain flatness 27 optimum gain point 27 Option Settings dialog box 131 OSC 86 OSC byte 86 OSC clock 24 OSC signal power 24 OSCT 86 OSCT block diagram 86 OSCT module 107, 115 OSCTU 85, 86, 96 OSI layer 3 protocol (CLNP, ES-IS and IS-IS) and IP packets 46 OSI layer 3 protocols (CLNP, ES-IS and IS-IS) 47 OSI or IP packages 47 OSI packages to 7 layer OSI DCC 47 OSI packages via ES-IS 47 OSI part 43 OSI Q3-CMISE 42 OSI stack by means of RFC1006 43 OSI/ISO upper layers 43 OSIAM stack 43 OSPF 43 OSPF (basic parameter set) 43 OSPF from Ethernet to DCC 47 OSPF protocol 47 OSS 42 OTT 60, 126 OTT of a C+L Band system 67 overall network performance 67

power distribution 126 power line input 111 power lines 111 Power Low Failure (PLF) 100, 102 Power On (4x green) 126 power outputs 23 power supply 111, 115 PPP 46 preamplification 67 preamplifier output 34, 36 Presentation 43 Pre-Tilt compensation filter 68 protection earth 111 pull-down menus 109 PUMP 95 pump modules 68 PUMPA 95 PumpB 69 PumpC 69

Q
Q3 information model 42 Q3 information model of the TCP/IP stack parameters 43 Q3-CMIP 42 Q3-CMIP management 47 Q3-CMISE interface 110

R
Rack 111 rack alarms 126 rack dimensions 116 rack power distribution panel PDP 111 rack with double row subracks 111 rack with single row subracks 111 Raman amplification 27, 69 Raman crosstalk 106 Raman PUMP (RPUMP) modules 96 Raman pump currents 29 Raman pump output power 23 Raman pump wavelength 69 Raman pumps 29, 121 Raman Tilt 68 real time operating system 43 real-time clock 107 Red C band 57 Red/Blue band separation filters 62 Red/Blue C Band 62 relevant standards 111 remote commissioning or maintenance operations 40 remote control 136 remote end of the DCC line 47 remote NEs 47 remotely configurable add/drop channels 73

P
path length difference 58 PCB (Peripheral Control Bus) 83 PCB/CAN bus 126 PC-based Local Craft Terminal (LCT) 46 PDP 111, 126 Peltier controlling elements 95 Performance Management 108 physical interface 44 planar shelf 111 plug-in cards 58 polarization-dependent effects 58 possible equipping options 121 power connectors 115

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Information SURPASS hiT 7550 2.05

remotely configured as an add/drop 73 replaceable units 85 required EDFA output power 27 required total EOL capacity 76 requirements for the element manager 108 respective bias current of each laser 29 reverse direction 63 RFC1006 47 rotary switch 126 route packages 47 router detection 43 Routing 43, 47 routing protocols 43 Routing two protocols 47 RPUMP 96 RS-232/V.24 interface 46

S
SAB 83, 85, 126 SABM 86, 126 SDH/SONET performance monitoring 34 second EDFA stage 68 Security Management 108 SELVSafety Extra Low Voltage 159 SEMF function 83 separation filters 62 Serial Peripheral Interface (SPI) Bus 85 service and application protocol 42 service layer 38 service provisioning and monitoring 38 Session 43 shelf and rack alarm outputs 83 Shutdown functionality 23 Siemens TNMS CT 133 Siemens 10 Gbit/s SDH line systems 17 Siemens Management Solution 38 signal performance 27 signaling data 115 simple point to point RS-232/V.24 interface 46 single-row 111, 116 site OTT/OLR/OADM 23 SMU2 85, 88, 96 SMU2 block diagram 88 SNMP specifications 43 software 160 software commands 135 software image 132 span losses 27 spectral control 68 SPI (Synchronous Peripheral Interface) 88 SPI bus connection 86 SPM (Self Phase Modulation) 106 SPM optimization 106 SRS 69 SSMF 106

stable technology 62 stack profiles 44 Standalone L Band DWDM system 67 Standalone L Band system (RPUMPL) 70 standard multi-vendor NML/EML management interface 39 standards 111 static route configuration 43 Stimulated Raman Scattering (SRS) 29, 69 sub-bands 57 subrack 111, 127 Subrack Address (SAB) Module 85 Subrack Address Board (SAB) 126 subrack address information 85 subrack address setting 126 subrack addresses 126 subrack alarms 126 subrack front cover 126 Subrack Management Unit (SMU2) 88 subrack types 116 subracks 111 supervision unit MCU 126 Supervisory Channel 107 support several network servers 38 supported stack profiles 44 SURPASS hiT 7550 2.05 17 SURPASS hiT 7550 functionality 53 SURPASS hiT 7550 modules 80 SURPASS hiT 7550 NE types 60 SURPASS hiT 7550 technical parameters 137 symmetrical add/drop 76 system environment of OLI modules 91

T
T3in clock input 86 T3LOS alarm 107 TCP (connection table) 43 TCP/IP part 43 TCP/IP stack 47 TCP/IP stack for the NE 43 Telecommunication Management System (OSS) 42 Telemanagement Forum (TMF) 39 telnet 43 temperature sensors 95 Terminal Booster (TB) 67 Terminal Preamplifier (TP) 67 thin-film filter devices 57 third and final EDFA stage 68 three different Raman pump modules 69 three-stage optical amplifier 67 TIF alarm contacts 86 tilt effect 29 tilt filter 29 tiltl 29 time-critical operations 83

176

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Technical Description (TED)

TMN-DCP OSI Stacks 133 TNMS (Transport Network Management System) 38 TNMS-CDM (Cross Domain Manager) 38 TNMS-Core 38 TNMS-Core/CDM support 38 TNMS-Multi-Vendor Management Platform 39 total amplifier gain 27 total capacity 66 total DWDM link performance 28 total EDFA output power 27 total input power 27 total number of optical spans 70 total output power 27 transmission directions 66 transport class 0 (TP0) services 43 transport class 4 (TP4) services 43 transport protocol 47 transported and routed in the DCC 46 two protocols 47 two sub-band outputs 62

Windows PC 42

U
UBAT1 115 UBAT2 115 UBAT3 115 UBAT4 115 UDCM tray 106 UDCMs 88, 106 UDCMs within the rack 120 Unidirectional Dispersion Compensation Modules (UDCMs) 106 upgrade from an 80 Channel C Band 66 Upgrade L Band EDFA 66 upgrade path 17 upgrade strategy 66 upper OSI layers 43 upper-layers of Network Element 47 used stack profile 47 User name 108

V
V.11 86 V.24 interface 46 Variable Optical Attenuator (VOA) 27, 68 variants of the OLI module 67 varied span lengths 68 visible and audible alarms 126 VOA 100, 102 Voltage range 111

W
wavelengths 53 WDM multiplexer 95 Windows NT platforms 133

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