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DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Ericsson RU22 W-CDMA 850MHz


Model KRC 118 22/1 R1D/B
May 2009

Entire contents 2009 EJL Wireless Research LLC. All Rights Reserved. Reproduction of this publication in any form without prior
written permission is strictly forbidden and will be prosecuted to the fully extent of US and International laws. The transfer of this
publication in either paper or electronic form to unlicensed third parties is strictly forbidden. The information contained herein has
been obtained from sources EJL Wireless Research LLC deems reliable. EJL Wireless Research LLC disclaims all warranties as to
the accuracy, completeness or adequacy of such information. EJL Wireless Research LLC shall have no liability for errors,
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2009 EJL Wireless Research LLC. All Rights Reserved


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TABLE OF CONTENTS
EXECUTIVE SUMMARY ........................................................................5
Active/Passive Component Summary ..................................................................5
Important Note:...............................................................................................5
CHAPTER 1: RBS 3X0X SYSTEM ...........................................................6
1.1 Overview of Ericsson RBS 3000 Platform .......................................................6
CHAPTER 2: MECHANICAL ANALYSIS .......................................................7
2.1 Mechanical Analysis ....................................................................................7
CHAPTER 3: TRANSCEIVER SUBSYSTEM .................................................12
Area A: Transceiver Baseband Digital Processing................................................16
Area B: Transceiver Power Management ...........................................................18
Area C: Transceiver Tx Section ........................................................................20
Area D: Transceiver Rx Section........................................................................22
63 PA7F17 Synthesizer Module ........................................................................25
62 PA7F16 Synthesizer Module ........................................................................26
E268C Synthesizer Module ..............................................................................28
Area E: Master Signal Generation .....................................................................30
Area F: Transmit Sample Path for DPD..............................................................32
Area G: Secondary PLL ...................................................................................34
Area H: Hex Inverter ......................................................................................35
Area I: RF Rx/Serial Connectors.......................................................................36
CHAPTER 4: POWER AMPLIFIER SYSTEM.................................................39
Area J: Power Amplifier Power Management Section ...........................................42
Area K: Driver Amplifier Section.......................................................................45
Area L: High Power Output Amplifier Section .....................................................47
Area M: RF Output Conditioning Section............................................................49
APPENDIX A - PASSIVE CASE SIZE ANALYSIS...........................................51
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS .......................55

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Area A Bill of Materials ..................................................................................................... 17


2: Area B Bill of Materials ..................................................................................................... 19
3: Area C Bill of Materials ..................................................................................................... 21
4: Area D1, D2 Bill of Materials ............................................................................................. 24
5: 63 PA7F17 Bill of Materials ............................................................................................... 27
6: 62 PA7F16 Bill of Materials ............................................................................................... 27
7: E268C Bill of Materials ..................................................................................................... 29
8: Area E Bill of Materials ..................................................................................................... 31
9: Area F Bill of Materials ..................................................................................................... 33
10: Area G Bill of Materials ................................................................................................... 37
11: Area H Bill of Materials ................................................................................................... 37
12: Area I Bill of Materials .................................................................................................... 38
13: Area J Bill of Materials .................................................................................................... 43
14: Area K Bill of Materials ................................................................................................... 46
15: Area L Bill of Materials.................................................................................................... 48
16: Area M Bill of Materials ................................................................................................... 50
17: Passive Component Case Size Distribution by System Subsection ........................................ 52
18: Identified Passive Component Supplier Distribution by System Subsection ............................ 53
19: Active/Passive Component Distribution by System Subsection ............................................. 54
20: Active Semiconductor Vendor Distribution by System Subsection......................................... 56
21: Active Semiconductor Vendor Distribution by System Subsection (cont) .............................. 57

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: Generic First Generation W-CDMA Base Station Diagram ...................................................... 6


2: RU22 Front and Rear View ................................................................................................ 7
3: RU22 RF Shield External View ........................................................................................... 8
4: RU22 RF Shield Internal View............................................................................................ 8
5: RU22 Chassis, Internal View, TRx Side ...............................................................................9
6: RU22 Chassis, Internal View, Power Amplifier Side .............................................................. 9
7: RU22 Heat Sink Mechanical Dimensions, Side View ............................................................ 10
8: RU22 Heat Sink, Top View .............................................................................................. 10
9: RU22 Heat Sink, Bottom View ......................................................................................... 11
10: RU22 Transceiver System Printed Circuit Board (Top View) ............................................... 13
11: RU22 Transceiver System Printed Circuit Board (Bottom View) .......................................... 14
12: RU22 System Level Block Diagram................................................................................. 15
13: Area A Component Diagram .......................................................................................... 16
14: Area B Component Diagram .......................................................................................... 18
15: Area C Component Diagram .......................................................................................... 20
16: Rx Section Block Diagram ............................................................................................. 22
17: Area D2 Component Diagram ........................................................................................ 23
18: 63 PA7F17 Component Diagram .................................................................................... 25
19: 62 PA7F16 Component Diagram .................................................................................... 26
20: E268C Bill of Materials.................................................................................................. 28
21: Area E Component Diagram .......................................................................................... 30
22: Area F Component Diagram .......................................................................................... 32
23: Area G Component Diagram.......................................................................................... 34
24: Area H Component Diagram .......................................................................................... 35
25: Area I Component Diagram........................................................................................... 36
26: RU22 Power Amplifier System Printed Circuit Board (Top View) ......................................... 39
27: RU22 Power Amplifier System Printed Circuit Board (Bottom View) .................................... 40
28: RU22 Tx Chain Block Diagram ....................................................................................... 41
29: Area J Component Diagram........................................................................................... 42
30: Area K Component Diagram .......................................................................................... 45
31: Area L Component Diagram .......................................................................................... 47
32: Area M Component Diagram.......................................................................................... 49
33: Passive Component Case Size Distribution ...................................................................... 51
34: Identified Passive Component Market Share by Vendor..................................................... 54
35: Active Semiconductor Component Share......................................................................... 55
36: Active Semiconductor Market Share by Vendor................................................................ 58
37: High Pin Count (64+) Active Semiconductor Market Share by Vendor................................. 58

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2009 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com