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DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Ericsson W-CDMA Power Amplifier


Model KRB 1011048/60
March 2008

Entire contents 2008 EJL Wireless Research LLC. All Rights Reserved. Reproduction of this publication in any form without prior
written permission is strictly forbidden and will be prosecuted to the fully extent of US and International laws. The transfer of this
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change without notice.

2008 EJL Wireless Research LLC. All Rights Reserved


www.ejlwireless.com

TABLE OF CONTENTS
EXECUTIVE SUMMARY ....................................................................... 4

Active/Passive Component Summary ................................................................ 4


Important Note: ............................................................................................ 4

CHAPTER 1 ERICSSON W-CDMA RBS TECHNOLOGY................................... 5

1.1 Overview of Ericsson W-CDMA RBS Technology............................................. 5

CHAPTER 2 W-CDMA POWER AMPLIFIER PRODUCT .................................... 6

2.1
2.2
2.3
2.4
2.5
2.6
2.7

Mechanical Analysis .................................................................................. 6


System Architecture Analysis ....................................................................11
Digital Control Section..............................................................................12
DC/DC Power Supply Module Section ..........................................................15
RF Cavity Filter Section ............................................................................24
Small Signal RF Section ............................................................................27
High Power RF Section .............................................................................33

APPENDIX A - PASSIVE CASE SIZE ANALYSIS.......................................... 44


APPENDIX B - ACTIVE COMPONENT MARKET SHARE .................................. 46

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Digital/RF Cable Bill of Materials ........................................................................................ 10


2: Digital Processing Section Bill of Materials .......................................................................... 14
3: Main PCB Emerson Part Number ROA 119 0696/1 R1B Bill of Materials................................... 20
4: Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B Bill of Materials ........................... 22
5: Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A Bill of Materials .......................... 23
6: RF Cavity Filter Bill of Materials ......................................................................................... 26
7: High Power RF Driver Pallet Bill of Materials ........................................................................ 38
8: High Power RF Output Pallet Bill of Materials ....................................................................... 40
9: High Power RF Error Amplifier Pallet Bill of Materials ............................................................ 43
10: Active/Passive Component Distribution by System Subsection ............................................. 45

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: Ericsson RBS 3202........................................................................................................... 5


2: Power Amplifier System Case Dimensions........................................................................... 6
3: Power Amplifier Case Top Cover Top View Dimensions ......................................................... 7
4: Power Amplifier Case Top Cover Bottom View Dimensions .................................................... 8
5: Digital/RF Cables Component Diagram ............................................................................... 9
6: Power Amplifier Sub-System Diagram .............................................................................. 11
7: Basic Feed Forward Amplifier Block Diagram ..................................................................... 12
8: Digital Processing PCB Dimensions .................................................................................. 12
9: Digital Processing Section Component Diagram ................................................................. 13
10: Power Supply Module, Top View .................................................................................... 16
11: Power Supply Module, Bottom View ............................................................................... 17
12: DC-DC Converter PCB Dimensions ................................................................................. 18
13:DC-DC Converter Component Diagram, Top ..................................................................... 18
14: DC-DC Converter Component Diagram, Bottom ............................................................... 19
15: Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B ............................................. 21
16: Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A ............................................ 21
17: RF Cavity Filter, Top..................................................................................................... 24
18: RF Cavity Filter, Bottom................................................................................................ 24
19: RF Cavity Filter Transmit Diagram.................................................................................. 25
20: RF Cavity Filter Component Diagram .............................................................................. 25
21: Small Signal RF Section ................................................................................................ 27
22: Small Signal RF Section w/ Standoff Shield ..................................................................... 28
23: Small Signal RF Cover Shield Top View ........................................................................... 29
24: Small Signal RF Cover Shield Bottom View ...................................................................... 29
25: Small Signal RF Transmit PCB Dimensions ...................................................................... 30
26: Small Signal RF PCB Bottom View .................................................................................. 30
27: Small Signal RF Transmit Chain ..................................................................................... 31
28: Small Signal RF Transmit Component Diagram ................................................................ 31
29: Small Signal RF Section Bill of Materials.......................................................................... 32
30: High Power RF Section Diagram..................................................................................... 33
31: High Power RF Transmit PCB Dimensions ........................................................................ 34
32: High Power RF Heat Sink Dimensions ............................................................................. 35
33: RF Main Amplifier Transmit Diagram .............................................................................. 36
34: Merrimac Industries Multi-Mix Splitter/Combiner.............................................................. 36
35: High Power RF Driver Pallet Component Diagram............................................................. 37
36: High Power RF Output Pallet Component Diagram............................................................ 39
37: High Power RF Error Amplifier Transmit Diagram ............................................................. 41
38: High Power RF Error Amplifier Pallet Component Diagram ................................................. 42
39: Component Distribution Analysis ................................................................................... 44
40: Passive Component Distribution Analysis ........................................................................ 45
41: Active Component Analysis by Pin Count ........................................................................ 46
42: Active Semiconductor Component Market Share .............................................................. 47

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com