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5x
L
cos
0.8x
L
cos
y
W
, (1)
where A is the amplitude, L is the length of the membrane
and W is the width. The average amplitude was found to
be 0.2 m. Measurements on several membranes show sim-
ilar topography with minor variations in the magnitude of
the curvatures. As will be shown later, this initial membrane
shape plays an important role in the proper identication of
membrane mechanical properties.
A focused ion beam (FIB) was employed to characterize
the lm material grain size and membrane thickness. An im-
age taken froma sectioned membrane is shown in Fig. 2. The
Fig. 2Image showing the grains of the aluminum alloy
membrane after removing a top thin oxide layer. The bottom
oxide layer is observed as a thin lighter border along the edge.
The sectioning was performed using a FIB. The average
grain size is about 250 nm and the membrane thickness is
300 nm with only one grain through the thickness.
micrograph shows grain morphology and size immediately
after sectioning and etching of a native oxide layer. A 20 nm
thick native oxide layer can be observed in Fig. 2. A single
grain through the thickness with a columnar morphology is
also clearly observed. The average grain size is about 250 nm.
Note that the sample is tilted 45
i=1
(Z
cal
Z
meas
)
2
]
1/2
/Z
max
. (2)
Here, Z
cal
is the numerically calculated Z coordinate of
the membrane, Z
meas
is the measured one given by eq (1),
Z
max
is the maximum measured Z coordinate and n is the
number of mesh nodes.
Cauchy stress contours of S
xx
and S
yy
resulting from this
analysis are shown in Figs. 8(a) and (b), for the case of an as-
sumed uniforminitial uniaxial stress of
0
= 27 MPa. For this
calculation, an error ||e|| < 3% was used. A large variation
in calculated residual stress is observed as a function of posi-
G
H
S22 (MPa)
>
?
SJJ (MPa)
>
?
Fig. 8(a) Contour plot of Cauchy stress S11 in the local
11 direction for E = 75 GPa and uniform initial stress
0
=
27 MPa. (b) Contour plot of Cauchy stress S22 in the local
22 direction. Due to the symmetry of membrane geometry
and loading, only a quarter of the membrane is shown. Note
that the local 11 direction is the projection of the global
X-axis onto the membrane surface, and the local 22 direction
is at right angles to the local 11 direction. In most of the
membrane except for the edge area, S11 is between 0 and
6 MPa, and S22 is between 3 and 3 MPa.
tion. In the relatively at part of the membrane, the average
residual stress in the X-direction is between 0 and 6 MPa. By
contrast, close to the xed ends, compressive stresses as high
as 24 MPa are observed. The average residual stress in the Y-
direction is between 3 and 3 MPa in the relatively at part.
These ndings are in agreement with the non-uniform stress
distribution reported by Chen et al.
26
for the same MEMS
device.
The membrane shape and state of residual stress computed
inthe rst stepwas usedas initial conditionfor the secondstep
of the FEA simulation. This second step consisted of apply-
ing a prescribed displacement to the nanoindenter tip while
computing the contact force. The loaddeection curves re-
sulting from this second step, for both line and concentrated
loads, are shown in Fig. 9(a). The good correlation between
simulations and experiments proves that the solution set, E =
75 GPa, computed initial shape and associated non-uniform
biaxial stress state, provides an accurate mechanical descrip-
tion of the MEMS device. An important feature to note is that
the same set of parameters precisely captures loaddeection
signatures obtained with two different loading geometries.
This provides condence in the accuracy of the experimental
measurements and identied parameters.
Fig. 9(b) shows the comparison between two simulations
and the four experiments reported in Fig. 3. The simulations
are for line load, with the upper curve for E = 80 GPa and the
lower curve for E = 70 GPa. It is seen that the experimental
314 Vol. 43, No. 3, September 2003 2003 Society for Experimental Mechanics
(a)
(b)
Fig. 9(a) Comparison of numerical simulations with
experiments for both line load and point load for E = 75
GPa and uniform initial stress
0
= 27 MPa. (b) Comparison
of simulations with four experimental results. The upper
solid line was obtained with E = 80 GPa and the lower solid
line was obtained with E = 70 GPa. Both calculations were
performed based on the same membrane shape and residual
stress state.
curves lie between two simulations, which implies that E =
75 5 GPa.
Conclusions
We have developed a procedure for the identication of
the Youngs modulus and residual stress state in thin alu-
minum membranes, employed in the design of MEMS rf
switches. The strong dependence of these quantities on mem-
brane shape, attachment to the substrate and microfabrication
steps, severely restricted the selection of a suitable testing
methodology. Microfabrication of specimens for bulge or mi-
crotension tests was ruled out for these reasons.
It was determined that the loaddeection response of
these membranes is very sensitive to residual stress at small
deections. By contrast, the sensitivity to variations in the
Youngs modulus becomes important at large deections.
These ndings have the implicationthat the effects of Youngs
modulus and residual stress state can be decoupled. Further-
more, it was shown that proper identication of Youngs mod-
ulus and residual stress state requires that the initial shape of
the membrane be taken into account. In our methodology,
this was accomplished by performing membrane metrology
and a two-step FEA analysis.
The MDEtest provedtobe veryreliable evenwhena mem-
brane stiffness of one order of magnitude smaller than the
nanoindenter column stiffness was measured. To the best of
our knowledge, the results reported here are the rst of their
kind. Performing several experiments on the same MEMS
device repeatability of the test was assessed. In all loading
cases, the scatter of the data was small. By performing the
experiment on several switches, in the same wafer, the unifor-
mity of the manufacturing process was identied. This fea-
ture and the fact that the test is performed at the wafer level,
without the need of specially designed specimens and with a
commercially available nanoindenter, are expected to be very
valuable in quality control of MEMS devices in large-scale
manufacturing processes.
A major remaining challenge in the design of MEMS de-
vices is the capability to assess their reliability. For instance,
MEMS rf switches are expected to be actuated by a large
number of cycles in wireless or other applications. Problems
associated to stiction, relaxation of residual stresses that con-
trol the time response of the device, through a spring back ef-
fect, or even material fatigue can be envisioned. The method-
ology presented here can be employed to address some of
these problems. For instance, by electrostatically actuating
the large number of cycles of the switches and by performing
MDE experiments at periodic intervals, a complete evolution
of residual stress state and mechanical properties can be in-
vestigated. Complementary TEM, FIBand scanning electron
microscopy (SEM) studies performed on the tested devices
could provide valuable insight into failure mechanisms at
the microscale and, therefore, increase our ability to design
microdevices.
Acknowledgments
The authors acknowledge the support of Raytheon Sys-
tems Co., through a grant to Northwestern University. HDE
also acknowledges the support from NSF through a Young
Investigator Award, NSF-Career Award No CMS-9624364,
and FAA Award No DTFA03-01-C-00031. This work would
have not been possible without the input and rf switches pro-
vided by T. Baughn, S. Chen, and C. Goldsmith of Raytheon
Systems Co., Dallas, TX 75243. Special thanks are due to
Warren Oliver and Erik Herbert, MTS Systems Nano Instru-
ments Innovation Center, for providing valuable insight on
the experimental process using the Nanoindenter XP.
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