Mobile Phone LG C1100 Service Manual

Service Manual
Service Manual C1100
Model : C1100
P/N : MMBD0034301
Date : June, 2004 / Issue 1.0
Table Of Contents
1. INTRODUCTION ................................ 2
1.1 Purpose ............................................... 2 1.2 Regulatory Information ........................ 2 1.3 Abbreviations ....................................... 4
5. DISASSEMBLY INSTRUCTION ... 82

5.1 Disassembly ...................................... 82
6. DOWNLOAD AND CALIBRATION ............................. 90

6.1 Download .......................................... 90 6.2 Calibration ......................................... 97
2. PERFORMANCE ................................. 6
2.1 H/W Features ...................................... 6 2.2 Technical Specification ........................ 7
7. BLOCK DIAGRAM ......................... 100 8. CIRCUIT DIAGRAM ....................... 101 9. PCB LAYOUT ..................................... 95
11.1 TOP ................................................. 95 11.2 BOTTOM ......................................... 96
3. TECHNICAL BRIEF ......................... 11

Transceiver ....................................... 11 Power Amplifier Module .................... 16 13MHz Clock ..................................... 17 Power Supplies for RF Circuits ......... 17 Digital Main Processor ...................... 18 Analog Main & Power Management Processor ........................................... 23 3.7 Memory ............................................. 33 3.8 Display and Interface ......................... 34 3.9 Keypad Switches and Scanning ......... 35 3.10 Microphone........................................ 36 3.11 Main Receiver .................................. 37 3.12 Headset Jack Interface ..................... 38 3.13 Speaker & MIDI IC ........................... 39 3.14 Key Back-light Illumination ............... 40 3.15 LCD Back-light Illumination .............. 41 3.16 MOTOR ............................................ 42 3.1 3.2 3.3 3.4 3.5 3.6
10. ENGINEERING MODE ................ 107

10.1 10.2 10.3 10.4 10.5 10.6 10.7 BB Test .......................................... 107 RF Test .......................................... 108 MF Mode ....................................... 108 Trace optiont ................................. 110 Call timer ....................................... 110 Fact. Reset .................................... 110 S/W version ................................... 110
11. STAND ALONE TEST .................. 111

11.1 Introduction .................................... 111 11.2 Setting Method .............................. 111 11.3 HW Test : Software for Standalone Test Setup ..................................... 112
4. TROUBLE SHOOTING ................... 43

4.1 RX Trouble ........................................ 43 4.2 TX Trouble ......................................... 51 4.3 Power On Trouble ............................. 59 4.4 Charging Trouble ............................... 61 4.5 LCD Trouble. ..................................... 63 4.6 Receiver Trouble ............................... 65 4.7 Speaker Trouble ................................ 67 4.8 Mic Trouble ........................................ 69 4.9 Vibrator Trouble ................................. 71 4.10 Key Backlight LED Trouble .............. 73 4.11 Folder on/off Trouble ........................ 74 4.12 SIM Detect Trouble .......................... 76 4.13 Earphone Trouble ............................. 77 4.14 Indicator LED Trouble ...................... 80 4.15 RTC Trouble ..................................... 81
12. AUTO CALIBRATION .................. 114

12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 Overview ....................................... 114 Requirements ................................ 114 Equipment Setup ............................ 114 AGC ............................................... 116 APC ............................................... 116 ADC ............................................... 116 Setting ........................................... 116 How to do calibration ..................... 116
13. EXPLODED VIEW & REPLACEMENT PART LIST

.............................................................
117
13.1 Exploded View ............................... 117 13.2 Replacement Parts ........................ 119 13.3 Accessory ...................................... 126 -1-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
-2-
1. INTRODUCTION
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.
-3-
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC BB BER CC-CV DAC DCS dBm DSP EEPROM ESD FPCB GMSK GPIB GSM IPUI IF LCD LDO LED OPLL PAM PCB PGA PLL PSTN RF RLR RMS RTC
Automatic Power Control Baseband Bit Error Rate Constant Current Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge Flexible Printed Circuit Board Gaussian Minimum Shift Keying General Purpose Interface Bus Global System for Mobile Communications International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock
-4-
1. INTRODUCTION
SAW SIM SLR SRAM PSRAM STMR TA TDD TDMA UART VCO VCTCXO WAP
Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating Static Random Access Memory Pseudo SRAM Side Tone Masking Rating Travel Adapter Time Division Duplex Time Division Multiple Access Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol
-5-
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item Li-ion, 760 mAh Standard Battery Cell Size: 33.8(W) x 49.7(H) x 4.6(T) [mm] Weight: 30.00g Stand by Current Talk time Stand by time Charging time RX Sensitivity TX output power GPRS compatibility SIM card type Display Under the minimum current consumption environment (such as paging period 9), the level of standby current is below 4mA. Up to 3 hours (GSM TX Level 7) Up to 200 hours (Paging Period: 9, RSSI: -85 dBm) Approx. Under 3 hours GSM, EGSM: 105dBm, DCS: 105dBm GSM, EGSM: 33dBm (Level 5), DCS: 30dBm (Level 0) Class 10 3V only Main LCD: 128 x 128 pixel 65K Color STN Hard icons. Key Pad; 0 ~ 9, #, *, Up/Down/Left/Right Navigation Key, Menu Key, Clear Key, Send Key, END/PWR Key Soft Key (Left/Right) External Yes Yes EFR/FR/HR Yes Yes Yes No Yes Yes Yes 16 Poly Hands-free kit, CLA, Data Kit Feature Comment
Status Indicator
ANT EAR Phone Jack PC Synchronization Speech coding Data and Fax Vibrator Loud Speaker Voice Recording C-Mike Receiver Travel Adapter MIDI Options
-6-
2. PERFORMANCE
2.2 Technical Specification

Item Description GSM TX: 890 + n x 0.2 MHz RX: 935 + n x 0.2 MHz (n=1~124) 1 Frequency Band EGSM TX: 890 + (n-1024) x 0.2 MHz RX: 935 + (n-1024) x 0.2 MHz (n=975~1024) DCS TX: 1710 + (n-512) x 0.2 MHz RX: 1805 + (n-512) x 0.2 MHz (n=512~885) 2 3 Phase Error Frequency Error RMS < 5 degrees Peak < 20 degrees < 0.1 ppm GSM, EGSM Level 5 6 7 8 9 10 11 12 4 Power Level DCS Level 0 1 2 3 4 5 6 7 Power 30 dBm 28 dBm 26 dBm 24 dBm 22 dBm 20 dBm 18 dBm 16 dBm Toler. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 8 9 10 11 12 13 14 15 Power 14 dBm 12 dBm 10 dBm 8 dBm 6 dBm 4 dBm 2 dBm 0 dBm Toler. 3dB 4dB 4dB 4dB 4dB 4dB 5dB 5dB Power 33 dBm 31 dBm 29 dBm 27 dBm 25 dBm 23 dBm 21 dBm 19 dBm Toler. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 13 14 15 16 17 18 19 Power 17 dBm 15 dBm 13 dBm 11 dBm 9 dBm 7 dBm 5 dBm Toler. 3dB 3dB 3dB 5dB 5dB 5dB 5dB Specification
-7-
2. PERFORMANCE
Item
Description GSM, EGSM
Specification
Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 5 Output RF Spectrum (due to modulation) DCS Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 GSM, EGSM Offset from Carrier (kHz). 400 600 1,200 6 Output RF Spectrum (due to switching transient) 1,800 DCS Offset from Carrier (kHz). 400 600 1,200 1,800 7 Spurious Emissions Conduction,Emission Status 6,000
Max. dBc +0.5 30 33 60 60 60 63 65 71
Max. dBc +0.5 30 33 60 60 60 65 65 73
Max. dBm 19 21 21 24
Max. dBm 22 24 24 27
-8-
2. PERFORMANCE
Item
Description GSM, EGSM
Specification
Bit Error Rate
BER (Class II) < 2.439% @102 dBm DCS BER (Class II) < 2.439% @100 dBm 3 dB 8 3 dB Frequency (Hz) 100 200 300 Max.(dB) 12 0 0 0 4 4 4 0 Max. (dB) 12 0 2 0 2 2 2 Min.(dB) 12 6 6 6 9 Min. (dB) 7 5 5 5 10
9 10
RX Level Report Accuracy SLR
11
Sending Response
1,000 2,000 3,000 3,400 4,000
12
RLR
2 3 dB Frequency (Hz) 100 200 300 500
13
Receiving Response
1,000 3,000 3,400 4,000
* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. 14 15 STMR Stability Margin 13 5 dB > 6 dB dB to ARL (dB) 35 30 16 Distortion 20 10 0 7 10 17 18 19 Side tone Distortion System frequency (13 MHz) tolerance 32.768KHz tolerance Three stage distortion < 10% 2.5 ppm 30 ppm -9Level Ratio (dB) 17.5 22.5 30.7 33.3 33.7 31.7 25.5
2. PERFORMANCE
Item 20
Description Ringer Volume
Specification At least 80 dB under below conditions: 1. Ringer set as ringer. 2. Test distance set as 50 cm. CC Charge : < 500 mA Trickle Charge : < 60 mA Antenna Bar Number 5 4 Power 85 dBm ~ 90 dBm ~ 86 dBm 95 dBm ~ 91 dBm 100 dBm ~ 96 dBm 105 dBm ~ 101 dBm ~ 105 dBm Voltage ~ 3.62V 3.62 ~ 3.73V 3.73 ~ 3.82V 3.82V ~
21
Charge Current
22
Antenna Display
3 2 1 0 Battery Bar Number 0 1 2 3
23
Battery Indicator
24 25
Low Voltage Warning Forced shut down Voltage
3.5 3.62 3.35
0.03V (Standby) 0.03V (Call) 0.03V
26
Battery Type
27
Travel Charger
1 Li-ion Battery Standard Voltage = 3.7V Battery full charge voltage = 4.2V Capacity : 950mAh Switching-mode charger Input : 100 ~ 240V, 50/60 Hz Output : 5.2V, 600 mA
- 10 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Transceiver (SI4205-BM, U301)
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems. The integrated solution eliminates the IF SAW filter, external low noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator (VCO modules, and other discrete components found in conventional designs.
ANTENNA SWITSH
TCXO
Figure 3-1. RECEIVER FUNCTIONAL BLOCK DIAGRAM
- 11 -
3. TECHNICAL BRIEF
(1) Receiver Part

The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional superheterodyne architectures.
A. RF front end
RF front end consists of Antenna Switch(FL400), two SAW Filters(FL401, FL402) and dual band LNAs integrated in transceiver (U401). The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna or Mobile switch. The Antenna Switch(FL400) is used to control the Rx and Tx paths. And, the input signals VC1 and VC2 of a FL400 are directly connected to baseband controller to switch either Tx or Rx path on. The logic and current is given below Table 3-1. Table 3-1. The Logic and current VC1 DCS TX GSM TX GSM/DCS RX 0V 2.5 ~ 3.0V 0V VC2 2.5 ~ 3.0V 0V 0V Current 10.0 mA max 10.0 mA max < 0.1 mA
Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850 (869-849 MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800 (1805-1880 MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band. The LNA inputs are matched to the 150 balanced output SAW filters through external LC matching networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits in register 05h (Figure 3-2).
- 12 -
3. TECHNICAL BRIEF
Figure 3-2. SI4205 RECEIVER PART
B. Intermediate frequency (IF) and Demodulation

A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer output is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2). The quadrature IF signal is digitized with high resolution A/D converters (ADCs). The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interference signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). The low selectivity filter has a flatter group channelization filter is in the baseband chip. After channel selection, the digital output is scaled with a digital PGA, which is controlled with the DGAIN [5:0] bits in register 05h. The amplified digital output signal go through with DACs that drive a differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC input baseband ICs. No special processing is required in the baseband for offset compensation or extended dynamic range. Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of blockers, and device 1/f noise.
- 13 -
3. TECHNICAL BRIEF
(2) Transmitter Part

The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
PDRB
PDIB
2
REG RFOG REG RFOD 1,2
FIF[3:0]
BBG[1:0] SWAP
TXIP I TXIN TXQP Q
TXBAND[1:0] TXQN
Figure 3-3. SI4205 TRANSMITTER PART
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters. The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO to generate a SSB IF signal that is filtered and used as the reference input to the OPLL. The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 to generate the quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz. For the E-GSM 900 band, two different IFLO frequencies are required for spur management. Therefore, the IF PLL must be programmed per channel in the E-GSM 900 band.
B. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swapped when switching bands. Additionally, the SWAP bit in register 03h can be used to manually exchange the I and Q signals. Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature modulator and feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in register 04h (Figure 3-3), and should be set to the recommended settings detailed in the register description.
- 14 -
3. TECHNICAL BRIEF
(3) Frequency Synthesizer
Figure 3-4. SI4205 FREQUENCY SYNTHESIZER PART The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode. All VCO tuning inductors are also integrated. The IF and RF output frequencies are set by programming the N-Divider registers, N RF1, N RF2 and NIF. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper VCO. The output frequency of each PLL is as follows:
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26 MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate ( ) should be programmed = 100 kHz for DCS 1800 or PCS 1900 bands, and = 200 kHz for GSM 850 and E-GSM 900 bands. For transmit mode, the RF2 and IF PLL phase detector update rates are always =200 kHz.
- 15 -
3. TECHNICAL BRIEF
3.2 Power Amplifier Module (RF3133, U302)

The RF3133 is a high-power, high-efficiency power amplifier module with integrated power control. The device is self-contained with 50 input and output terminals. The power control function is also incorporated, eliminating the need for directional couplers, detector diodes, power control ASICs and other power control circuitry; this allows the module to be driven directly from the DAC output. The device is designed for use as the final RF amplifier in GSM 850, E-GSM 900, DCS and PCS handheld digital cellular equipment and other applications in the 824-849 MHz, 880-915 MHz, 1710-1785 MHz, and 1850-1910 MHz bands. On-board power control provides over 37 dB of control range with an analog voltage input (TX_RAMP); and, power down with a logic low for standby operation (TX_ENABLE). External control (BAND_SELECT) is used to select the GSM or DCS band with a logic high or low. A logic low enables the GSM band whereas a logic high enables the DCS band.
VCC2 12 DSC/PCS IN 1 BAND SELECT 2 TX ENABLE 3 VBATT 4 VREG 5 VRAMP 6 GSM IN 7 8 VCC2 9 GSM OUT 10 VCC OUT 11 DSC/PCS OUT
Figure 3-5. FUNCTIONAL BLOCK DIAGRAM OF RF3133
- 16 -
3. TECHNICAL BRIEF
3.3 13MHz Clock (VCTCXO, X301)

The 13 MHz clock(X301) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U102, AD6537B), digital base band chipset (U101, AD6525), and MIDI (U401) chipset.
VVCXO X301 3 4 C371 2.2u 1608 OUT VCC GND 13MHz 2 C372 1000p 15K R317 AFC AD6535_AFCDAC
Figure 3-6. VCTCXO CIRCUIT DIAGRAM
3.4 Power Supplies for RF Circuits (RF LDO, U303)

Two regulators are used for RF circuits. One is MIC5255 (U303), and the other is one port of AD6537B (U102). MIC5255 (U303) supplies power to transceiver (SI4205, U301). One port of AD6537B supplies power to VCTCXO (X301). Main power (VBAT) from battery is used for PAM (RF3133, U302) because PAM requires high power. Table 3-2. RF POWER SUPPLIERS Supplier U303 (VRF) U102 (VVCX0) Battery (VBAT) Voltage 2.85V 2.75V 3.4~4.2V Powers U301, U302 X301 U302,U303 Enabled signal CLKON
VRF MIC5255-2.85BM5 U303 5 1 OUT IN 2 C363 GND 4 3 BYP EN 0.01u
VBAT
C362 10u
R317
CLKON
C361
10u
Figure 3-7. RF LDO CIRCUIT DIAGRAM
- 17 -
3. TECHNICAL BRIEF
3.5 Digital Main Processor (AD6525, U101)

AD6525 GSM-PROCESSOR
KEYPAD Matrix KEYPADCOL[4:0] KEYPADROW[4:0] JTAGEN TCK, TMS TDI, TDO
JTAG
Backlight Service light
FLASH 16 bit
SRAM 8 or 16 bit (optional)
BACKLIGHT0 JTAGE, HSL, GPIO BACKLIGHT1 USCTX/RX/CLK U Generic Serial port A S Generic Serial port B C Generic Serial port D ROMCS ADD[23:0] PWRON DATA[15:0] VDDRTC RESET ROMCS RD WR HWR/UBS LWR/LBS DISPLAYCS LCDCTL Generic Serial Port C OSCIN 32kHz OSCOUT
Universal System Connector (USC)
Power Sub-system
DISPLAY (parallel or serial)
VDDIO VDDCORE GNDIO GNDCORE ASDO ASFS ASDI
AD6537B
Accessory Devices GPCS0 GPCS1 Generic Serial Port D-A Generic Serial Port D-B GPIO[ ] / IR Q
ASDI ASDFS ASDO
Control Serial Port
e.g.BATTERY
BSDO BSOFS BSDI BSIFS SIM SIM Serial Interface VSDO VSDI VSFS CLKIN CLKON Micro SM RF Interface CLKOUT_GATE CLKOUT VBCRESET Generic Serial Port E
BSDI BSIFS BSDO BSOFS
RX/TX I/Q Serial Port
VSDI VSDO VSFS MCLK oe MCLK RESET
VOICE DATA Serial Port
RAMP RF Timing I/Q Interince VOICE 1/F & Buzzer DRV-OUT LAN-IN PA Supply Enable RADIO (AD6523/AD6524) 13MHz VCO AFC MODE JTAG AGC Synthesizer
Figure 3-8. SYSTEM INTERCONECTION OF AD6525 EXTERNAL INTERFACE
- 18 -
3. TECHNICAL BRIEF
AD6525 is an ADI designed processor. AD6525 consists of 1. BUS arbitration Subsystem

EBUS, RBUS, PBUS, SBUS, DMABUS, IOBUS
2. DSP Subsystem
ADI DSP, Viterbi coprocessor, Ciphering unit, Cache memory/controller system
3. MCU Subsystem
ARM7TDMI, boot ROM, Clock generation and access control module
4. Peripheral Subsystem
MMI group Keyboard, Display, Backlight, RTC, GPIO interface House Keeping group Watchdog Timer, Interrupt controller, General Timer GSM system group Direct Memory Access group Between PBUS,RBUS, and EBUS
- 19 -
3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices

A. RTC Block Interface
Countered by external X-TAL The X-TAL oscillates 32.768KHz
B. LCD module interface

The LCD module is controlled by DBB chipset, AD6525. When LCD operate, the AD6525 controls the LCD module through LCD_CS, LCD_RESET, ADD01, WR, DATA[00-15]. LCD_ID, LCD_RESET Table 3-3. LCD module interface Signals LCD_CS LCD_RESET ADD1(RS) WR DATA 2V8_VMEM LCD_BACKLIGHT DATA[00-15] Description MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin This pin resets LCD module. This pin determines whether the data to LCD module are display data or control data. ADD1 can select 16 bit parallel bus. ADD1 is also used to address flash memory. Write control. The phone do not read data from LCD chip. Parallel data lines. Color LCD driver chip uses the 16-bit data interface. 3V voltage is supplied to white colored LED driver for backlighting. Control signal of white LED driver IC. Parallel data lines, Sub LCD driver chip uses the 8-bit data in reface.
C. RF Interface
The AD6525 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON , PA_EN, S_EN, S_DATA, S_CLK, RF_PWR_DWN Table 3-4. RF CONTROL SIGNALS DISCRIPTION GPO 17 9 11 16 19 20 21 4 Signal Name PA_BAND ANT_SW1 ANT_SW2 CLKON PA_EN S_EN S_DATA S_CLK RF_PWER_DWN Description PAM Band Select Antenna Switch Band Select Antenna Switch Band Select RF LDO Enable/Disable PAM Enable/Disable PLL Enable/Disable Serial Data to PLL Clock to PLL Powerdown Input
- 20 -
3. TECHNICAL BRIEF
D. SIM Interface
The AD6525 check status periodically in call mode if SIM card is inserted or not, but the AD6525 don't check in deep sleep mode. Interface by SIM_DATA, SIMCLK, SIM_RST(GPIO_23) Table 3-5. SIM CONTROL SIGNALS DISCRIPTION Description SIM_DATA SIMCLK SIM_RST(GPIO_23) This pin receives and sends data to SIM card. This model support only 3.0 volt interface SIM card. Clock 3.25MHz frequency. Reset SIM block
AD6525
VSIM
VSIM J101 4 5 6 10 9 GND1 VCC VPP RST IO CLK GND5 GND2 GND4 GND3 GCA261-6S 1 2 3 7 8
C117 0.1u C115 220n
SIM_DATA VA165 AVL14K02200
C116 1000p
Figure 3-9. SIM CIRCUIT
E. Key Interface
Include 5 column and 5 row. The AD6525 detect key press by interrupt.
F. ADP3537B Interrupt
There are two interrupts, EOC and CHRDET EOC: End of Charge. AD6525 makes charging operation stop when high signal is inputted. CHRDET: This pin is activated when the charger is inserted.
- 21 -
3. TECHNICAL BRIEF
3.5.2 AD6525 Architecture

AD6525
DSP Subsystem
Serial Link AD6537B
DSP BUS EBUS PBUS DMA and BUS ARBITRARION RBUS
SBUS
Peripheral Subsystem
MUC Subsystem (ARM7TDMI)
SRAM
FLASH
RF-Control MMI USC
Figure 3-10. AD6525 INTERNAL ARCHITECTURE The internal architecture of AD6525 is shown in Figure 3-10. AD6525 regroups three main subsystems connected together through a dynamic and flexible communication bys network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC). The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing, channel equalization and channel codec functions. The code used to implement such functions can be stored in external Flash Memory and dynamically downloaded on demand into the DSPs program RAM and Instruction Cache. The microcontroller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3 of the GSM protocol stack, the MMI, and applications software such as data services, test and maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM memory with a small dedicated routine to facilitate the initialization of the external Flash Memory via code download using the on-chip serial interface to the external Flash Memory interface. The peripheral subsystem is composed of system peripherals such as interrupt controller, real time clock, watch dog timer, power management and a timing and control module. It also includes peripheral interfaces to the terminal functions: keyboard, battery supervision, radio and display. Both the DSP and the MCU can access the peripheral subsystem via the peripheral bus (PBUS). For program and data storage, both the MCU subsystem and the DSP subsystem can access the on chip system SRAM and external memory such Flash Memory. The access to the SRAM module is made through the RAM Bus (RBUS) under the control of the bus arbitration logic. Similarly, access to the Flash Memory is through the parallel External Bus (EBUS).
- 22 -
3. TECHNICAL BRIEF
3.6 Analog Main & Power Management Processor (AD6537B, U102)
AD6525 or AD6526
Figure 3-11. AD6537B FUNCTIONAL BLOCK DIAGRAM
- 23 -
3. TECHNICAL BRIEF
AD6537B is an ADI designed processor. AD6537B consists of 1. BB Transmit section

This section generates in-phase and quadrature BB modulated GMSK signals. Digital GMSK modulator, 10-bit DACs, Reconstruction Filter
2. BB Receive section
2 identical ADC channels that process BB in-phase and quadrature input signals.
3. Auxiliary section
2 auxiliary DASs AFC DAC, IDAC, AUX ADC AUX ADC : 6 channels 10 bits AFC DAC : 13 bits IDAC : 10 bits
4. Voiceband section
Receive audio signal from MIC. Send audio signal to Speaker It interconnect with external device like main microphone, main receiver, earmicrophone and Hands-free kit.
5. Power Management section

8 LDOs Block in the AD6537B. VCORE, VMEM, VEXT, VSIM, VRTC, VABB, VMIC, VVCXO Battery Charging Block
- 24 -
3. TECHNICAL BRIEF
3.6.1 Baseband transmit section

1. The AD6537B Baseband Transmit Section is designed to support GMSK for both singleslot and multi-slot application. 2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter
Figure 3-12. AD6537B BASEBAND TRANSMIT SECTION
3.6.2 Baseband receive section

1. This section consists of two identical ADC channels that process baseband in-phase(I) and quadrature(Q) input signals. 2. Each channel consists of a coarse switched capacitor Anti-Alias filter, followed by a lowpass digital filter
Figure 3-13. AD6537B BASEBAND RECEIVE SECTION
- 25 -
3. TECHNICAL BRIEF
3.6.3 Auxiliary Section

1. This section includes an Automatic Frequency Control (AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. 2. This section also contains AUX ADC and Voltage Reference AFC DAC: 13 bits IDAC: 10 bits The Auxiliary ADC provides : Two differential inputs for temperature sensing. - A differential input for the battery charger current sensor - A single-ended input for battery voltage measurement - A single-ended input for battery type identification - Two single-ended inputs for microphone and hookswitch detection, one for each of two analog Audio input channels - Two general purpose external inputs - REF, REFOUT, REFCHG - REFADC and REFADC/2, and AGND1 inputs for offset and gain measurement
AD6537B CSFS CSDI CSDO Control Serial Port AFC DAC REFTXCM REFBB REFOUT Voltage Reference REFCHG REF AFCDAC
TEMP1 TEMP2 AUXADC1 AUXADC2 AIN1P Aux ADC AIN2P BATTYPE ISENSE VBATSENSE LIGHT1 Light Controllers LIGHT2 LIGHT3
Figure 3-14. AD6537B AUXILIARY SECTION
- 26 -
3. TECHNICAL BRIEF
3.6.4 Audio Section

1. Receive audio signal from microphone. C1100 use differential configuration. 2. Send audio signal to speaker. C1100 use differential configuration. 3. This section provides an audio codec with a digital-to-analog converter and an analog-todigital converter, a ring tone volume controller, a microphone interface, and multiple analog input and output channels. 4. It interconnect with external device like main microphone, main receiver, and headset jack through the AIN1N, AIN1P, AIN2N, AIN2P, AIN3N, AIN3P, AOUT1P, AOUT1N, AOUT2P, AOUT2N, AOUT3P, and AOUT3N port. AIN1P, AIN1N : Main microphone positive/negative terminal AOUT2P, AOUT2N : Main Speaker positive/negative terminal AIN2P, AIN2N : Ear-Mic microphone positive/negative terminal AOUT1P, AOUT1N : Ear-Mic speaker positive/negative terminal
AD6537B
AIN3P AIN3N
GPI CSFS CSDI CSDO Control Serial Port Ring Tone Volume Controller
Analog Switch
SPWR AOUT2P 8
PGA Analog Switch
AOUT2N SGND
ASFS ASDI ASDO
AOUT1P 32 AOUT1N
Audio Serial Port PGA Filter/ SRC DAC Analog Adder Microphone Interface
AOUT3P 32 AOUT3N
AIN1P PGA Filter/ SRC ADC AIN1N Gain Pre-Amp AIN2P
AIN2N
Figure 3-15. AD6537B AUDIO SECTION
- 27 -
3. TECHNICAL BRIEF
3.6.5 Power Management
Figure 3-16. AD6537B POWER MANAGEMENT SECTION
1. Power up sequence logic

1. The AD6537B controls power on sequence 2. Power on sequencez - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on. - REFOUT is also enabled - Reset is generated and send to the AD6525
- 28 -
3. TECHNICAL BRIEF
AD6537B
Enable Thermal Shutdown THERM Mode DDLO UVLO CHGDET VBAT KEYON VSMEn Control Bit Digital core LDO Regulator VCORE
Mode
Enable Memory Interface LDO Regulator
VMEM
Mode
Enable External Interface LDO Regulator
VEXT
Enable Mode
VRTC DBBON
SIM Interface LDO Regulator
VSM
POWERMODE
Enable
VCXO LDO Regulator
VVCXO
VEXT VCXDEN VCORECP low: VCORE < 1.5V high: VCORE > 1.5V VMEM Comparator VMEMCP low: VMEM < 2.5V or 1.5V high: VMEM > 2.5V or 1.5V VEXT Comparator VEXTCP low: VEXT < 2.5V high: VEXT > 2.5V VEXT VMEM VCORE Comparator VCORE
Figure 3-17. AD6537B POWER MODE LOGIC
2. LDO Block
1. There are 8LDOs in the AD6537B. - VCORE - VMEM - VEXT - VSIM - VRTC - VABB - VMIC - VVCXO : supplies Digital Baseband Processor core and AD6537 digital core (1.8V, 80mA) : supplies external memory and the interface to the external memory on the digital baseband processor (1.8V or 2.8V, 150mA) : supplies Radio digital interface and high voltage interface (2.8V, 170mA) : supplies the SIM interface circuitry on the digital processor and SIM card (1.8V or 2.85V, 20mA) : supplies the Real-Time Clock module (1.8 V, 200 A) : supplies the analog portions of the AD6537 : supplies the microphone interface circuitry (2.5 V, 1 mA) : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
- 29 -
3. TECHNICAL BRIEF
Table 3-6. AD6537B LDO DESCRIPTION Description VSIM VCORE VRTC VMIC VTCXO VMEM VEXT 2.85V(is provided to SIM card) 1.8V(is provided to the AD6525 & AD6537Bs digital core) 1.8V(is provided to the RTC and Backup Battery) 2.55V(is provided to the AD6525 I/O and used as microphone bias) 2.75V(is provided to VCTCXO) 2.8V(is provided to Flash) 2.8V(is provided to LCD)
3. Battery Charging Block

1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6537B detects that Charger is inserted, the CC-CV charging starts. - Exception: When battery voltage is lower than 3.2V, the precharge(low current charge mode) starts firstly. - And the battery voltage reach to 3.2V the CC-CV charging starts. 3. Pins used for charging - CHG_DET: Interrupt to AD6525 when charger is plugged. - CHG_EN: Control signal from AD6525 to charge Li+ battery - EOC: Interrupt to AD6525 when battery is fully charged - GATEIN: Control signal from AD6525 to charge NiMH battery. But, not used. - MVBAT: Battery voltage divider. Divide ratio is 1:2.3 and it is sensed in AD6521 AUX_ADC 4. TA (Travel Adaptor) - Input voltage: AC 85V ~ 260V, 50~60Hz - Output voltage: DC 5.2V ( 0.2 V ) - Output current: Max 850mA ( 50mA ) 5. Battery - Li-polymer & Li-ion battery (Max 4.2V, Nom 4.0V) - Standard battery: Capacity - 770mAh, Advanced Li-ion
- 30 -
3. TECHNICAL BRIEF
VCHARGER
AD6537B CSFS CSDI CSDO Control Serial Port Charge Timer Chg. DAC GATEDRIVE Trouble Charge VCHG
RGATE
ISENSE VBATSENSE VBATx
RSENSE
Aux ADC
BATTYPE REFOHG RTRIF
3-Terminal Battery Pack
INT
Interrupt Logic
AGND1
RTEMP thermistor
Figure 3-18. AD6537B BATTERY CHARGING BLOCK
VMIC
B10 AUXADC1 A9 AUXADC2
R126 1K TC151 2.2K
HOOK_DET AIN2P AIN2N AIN1P AIN1N AIN3L AIN3R P15 R15 P16 R16 R13 R14 C178 NC_R12 39p R12 VBAT LIGHT1 LIGHT2 LIGHT3 SPWR1 SPWR2 AOUT2N1 AOUT2N2 AOUT2P1 AOUT2P2 AOUT3N AOUT3P AOUT1P AOUT1N L16 M15 M16 R10 T10 T9 R9 R11 T11 K16 J16 J15 K15 RLED R149 GLED NA C157 1u SPKN SPKP C151 0.1u C154 C177 39p C152 C153 39p 39p C156 39p 39p
R127
CLOSE TO AD6537
R124 0 C155 39p R130 4.7K R132 100 C160 0.1u R134 R128 100 C163 C161 39p 2.2K C162 39p AVL5M02-200 AVL5M02-200 39p VA151 VA152
10u
C193 39p
MIC101
CLOSE TO MIC
2 1 OB4-15L42-C33L
R148 100
VMEM
VMIC
VMEM
NO 6
NC 4
VMEM
U105
GND 3 IN
R156 100K VMIC_ON R158 NA R153 R154 NA 2 J102 4 3 1 5 HEADSET JACK SP115 AVL5M02-200 R159 HOOK_DET 1K C124 0.1u
2 C123 39p
VCC COM
RECP RECN C188
C139 4.7u
5 R137 VEXT VEXT C196 39p 2.2K R138
MAX4599EXT-T 1K 39K
AGND1 SGND1 SGND2 DGND LGND
0.1u
CLOSE TO EARJACK
R181 4.7 VA153 AVL5M02-200 R141 4.7 C165 TC153 10u C179 39p 39p C167 C168 VA154
T8 R8 M2 N15
5
VCC GND
R150 JACK_DET C170 100 100p C171
4 3
VIN-
1
OUT
VIN+
R145 1M R144 1M
100p
U104 R147 330K
MAX9075EXK-T
39p 18p SP114
Figure 3-19. C1100 AUDIO CIRCUIT
- 31 -
3. TECHNICAL BRIEF
VMEM
C409
39p
R405 SPKN NA R406 SPKP NA R407 0 R409 0 C406 C407 Closed to Analog SW 47p 47p
1 V+ 2 NO1 3 COM1 4 IN1 5 NC1 GND NC2 6 IN2 7 COM2 8 NO2 9
U402 MAX4684EUB
10
SPK_REC_N
C410
47p
SPK_REC_P R414 RECP 4.7 R416 RECN 4.7 C411 C412 47p 47p R415 100K SPK_RCV_SEL
Figure 3-20. MAIN RECEIVER CIRCUIT
VCHARGE
VBAT
C140 0.1u
R162 49.9 R163
R155 NA
3
R164 1K UMX1NTN
4
R157 PRE_CHARGE VCHARGE VBAT 1.5K R165 100K

2 5
RED_LED
Q104 C187 10u D101 R108 330 Q103

4 3 2 1 G D3 D2 D1 S D4 D5 D6 5 6 7 8
CUS02 Current Sense R107 0.2 1% CLOSE TO BATTERY PACK
TPCF8102
Figure 3-21. CHARGING CIRCUIT In order to reduce time for trickle charging, additional circuit (Pre-charge circuit) was included. This circuit has supplied a 50mA current into the battery additionally. So call it, it reduce trickle charging time
- 32 -
3. TECHNICAL BRIEF
3.7 Memory (TH50VPF5783AASB, U201)

Block Diagram
Vccf A-1 A0~A21 A-1 A0~A21 WP/ACC RESET CEf1 CEf2 128 Mbits FLASH Memory DQ0~DQ15 (DQ0~DQ7) Vss
RY/BYf BYTE Vccps A0~A20 Vss DQ0~DQ15
WE OE CE1ps CE2ps UB LB
328 Mbits PSEUDO SRAM DQ0~DQ15
Figure 3-22. MEMORY BLOCK DIAGRAM 128Mbit flash memory + 32Mbit PSRAM 16 bit parallel data bus ADD01 ~ ADD22. 2 Chip enables for Flash memory select. RF Calibration data, Audio parameters and battery calibration data etc are stored in Flash memory area.
- 33 -
3. TECHNICAL BRIEF
3.8 Display and Interface

Table 3-7. LCD module discription Main LCD Display Format Main LCD Backlight 128 X RGB X 128 dots White LED Backlight
C1100 Main LCD supports one 65,536 color LCD module. There are the control signals : LCD_CS (This acts as the chip select enable for the LCD Driver), WR, ADD01(RS) and LCD_RESET. DATA[00:15] pins to send data for displaying graphical text onto the LCD.
VBAT VRTC VEXT CN201 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 C219 C220 C221 C222 C223 C224 C225 C226 C256 C277 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p C227 C255 C257 22p 22p 22p 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 SPK_REC_N SPK_REC_P R202 R204 R206 R208 R210 R212 R214 R216 820 820 820 820 820 820 820 820 DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA09 DATA08
LCD_RESET DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07
R201 R203 R205 R207 R209 R211 R213 R215
820 820 820 820 820 820 820 820
MOTOR ADD01 R219 C276 C275 C254 C211 C212 C213 C214 C215 C216 C217 C218 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 330
R218
330
WR LCD_CS LCD_ID C240 C241 C242 C243 C244 C245 C246 C247 C248 C274 C278 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p
C231 C232 C233 C234 C235 C236 C237 C238 C239 22p 22p 22p 22p 22p 22p 22p 22p 22p
VBAT U203 10 C271 C258 18p 1uF 1uF C259 LCD_DIM 9 EN_SET C2D1 D2 D3 D4 2 OUT C1C2+ IN C1+ 4 C260 3 1 C261 1uF AVL14K02200 12 8 7 6 5 FB1 VA207 C262 39p C272 18p 1uF
LCD BACKLIGHT LED
11
GND
AAT3123ITP-20-T1
Figure 3-23. LCD INTERFACE CIRCUIT
- 34 -
3. TECHNICAL BRIEF
3.9 Keypad Switches and Scanning

The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 24 switches (SW1-SW2,KB2~KB22), connected in a matrix of 5 rows by 5 columns, as shown in Figure, except for the power switch (KB101), which is connected independently. Functions, the row and column lines of the keypad are connected to ports of AD6525. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6525 to identify the pressed key.
KEYON (AD6537B) R161 C144 SW1 UP 4 5 3 2 AVL5M02-200 VA201 VA202 R242 680 AVL5M02-200 1 4 1 5 3 2 SW2 DOWN 1K 0.01u
PWR KEY KB101
R243 680
KB22
CLR
KEY_ROW0 SP201 KB4 1 KEY_ROW1 SP204 KB5 4 KEY_ROW2 SP211 KB6 7 KEY_ROW3 SP227 KB7 SP228 KB3 0 SP229 KB19 # DOWN CONFIRM SP230 KB12 SP226 KB15 SP212 KB2 8 SP209 KB18 9 RIGHT SEND SP210 KB11 SP213 KB14 SP205 KB21 5 SP206 KB17 6 UP SELECT SP207 KB10 SP208 KB13 KB20 2 KB16 3 LEFT MENU KB9 KB8
*
KEY_ROW4 SP231 SP232
SP233
SP234
SP235
KEY_COL0 KEY_COL1 KEY_COL2 KEY_COL3 KEY_COL4
Figure 3-24. C1100 KEYPAD CIRCUIT
- 35 -
3. TECHNICAL BRIEF
3.10 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P and AIN1N pins of AD6537B. The voltage supply VMIC is output from AD6537B, and is a bias voltage for the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the Voiceband ADC part of AD6537B. The digitized speech is then passed to the DSP section of AD6525 for processing (coding, interleaving etc.).
VMIC
1k
AD6537B
2.2k 39p 10u
Main Mic AIN1P

100 39p 39p 39p
AIN1N
100 39p 2.2k 0.1u 39p 39p
Figure 3-25. MICROPHONE
- 36 -
3. TECHNICAL BRIEF
3.11 Main Receiver

The Receiver is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6537B. The Receiver is placed in the folder cover and contacted to LCD MODULE
Figure 3-26. MAIN RECEIVER
- 37 -
3. TECHNICAL BRIEF
3.12 Headset Jack Interface

This phone chooses a 3-pole type ear-mic jack which has three electrodes such as Receiver +, Mic+, and GND. This type usually supports only single-ended configuration in the audio path. But most of phones use the common interface.
AD6537B
AIN2P AIN2N C151 0.1u
AIN3L AIN3R
R130 C177 C178 39p 39p C152 C153 39p 39p 4.7K
R148 100
VMEM
VMIC
VMEM
NO 6
NC 4
VMEM
U105
GND 3 IN
2 C123 39p
VCC COM
5 R137 VEXT VEXT C196 39p R150 JACK_DET 100 C170 100p C171 1
OUT
MAX4599EXT-T 1K 39K
R138 2.2K
CLOSE TO EARJACK
5
VCC GND
4 3
VIN-
VIN+
R145 1M R144 1M
100p
U104 R147 330K
MAX9075EXK-T
39p 18p SP114
Figure 3-27. HANDS-FREE & HEADSET JACK INTERFACE
- 38 -
3. TECHNICAL BRIEF
3.13 Speaker & MIDI IC

C1100 dont use buzzer. but uses the loud speaker and Melody IC which makes the robust joyful melody sounds.
Melody IC control 2GPIO are assigned to control melody IC. Melody data is transferred to melody IC.
VMEM
YMU759B
R401 13MHZ_MIDI MIDI_RESET ADD00 RD MIDI_CS 0 CLK1 _RST 30 A0 31 _RD 29 5 _CS IFSEL 28 3 27 26 25 24 23 22 21 20 R408 3.3K 6 1000p C402 0.1u 9 R412 10K 32 R413 0 C403 0.1u 8 7 VDD VSS SDOUT VREF PLLC _WR _IRQ D0 D1 D2 D3 D4 D5 D6 D7 1 4
U401
11 10 C404 12 0.01u EQ2 13 C405 100p EQ3 EXT1 EXT2 14 2 19 R417 R402 39K C409 R404 0 150K SPKN NA R406 SPKP NA SPOUT1 17 VBAT SPOUT2 R407 0 R409 18 R410 0 SPVDD 15 C408 0.1u RECP 4.7 R416 RECN 4.7 C411 C412 47p 47p R415 100K 0 C406 C407 Closed to Analog SW 47p 47p
HPOUT_R HPOUT_L EQ1
VMEM
R403 10K
39p
WR MIDI_INT DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 C401
R405 U402 MAX4684EUB

10
SPK_REC_N
C410
47p
SPK_REC_P 16 R414 SPK_RCV_SEL
SPVSS
(16 Poly MIDI)
Figure 3-28. SPEAKER & MIDI IC This phone have a melody IC of Yamaha, YMU759B is a synthesis LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decoder. This chipset is equipped with Yamaha's original FM synthesizer, with which the device is capable of simultaneously generating up to 16 voices with different tones, that is 16 polys. YMU759B includes a speaker amplifier low ripple whose maximum output is 550mW at SPVDD = 3.6V.
- 39 -
3. TECHNICAL BRIEF
3.14 Key Back-light Illumination

In key back-light illumination, there are 10 blue LEDs on main PCB keypad side , which are driven by LIGHT3 line from AD6537B.
R261 RLED 0 R263
GREEN LED
0 R264 NA Q201 6 1 2 3 UMX1NTN
R262 GLED 0
RED LED
R225 IND_LEDG 10K R229 47K
5 4
R226 47K RED_LED R227 47K
AD6537B
VBAT
LIGHT1 LIGHT2 LIGHT3
RLE D GLED
R111 47 LD111
R112 47
R113 47
R114 47
R115 47
R116 47
R117 47
R118 47
R119 47
R120 47 LD120
LD112 LD113 LD114 LD115 LD116
LD117 LD118 LD119
SP102 SP103 SP104 SP105 SP106 SP107 SP108 SP109 SP110 SP111
Figure 3-29. KEY BACK-LIGHT ILLUMINTION
- 40 -
3. TECHNICAL BRIEF
3.15 LCD Back-light Illumination

In LCD Back-light illumination, there is an charge pump driver in main PCB, which is controlled by LCD_DIM line from AD6525.
LCD MODULE
VBAT U203 10 C271 C258 18p 1uF 1uF C259 LCD_DIM 9 EN_SET C2D1 D2 D3 D4 2 OUT C1C2+ IN C1+ 4 C260 3 1 C261 1uF 12 8 7 6 5 FB1 VA207 C262 39p C272 18p AVL14K02200 IND_LEDG 1uF
LCD BACKLIGHT LED
11
GND
AAT3123ITP-20-T1
Figure 3-30. MAIN LCD BACKLIGHT ILLUMINATION
- 41 -
3. TECHNICAL BRIEF
3.16 MOTOR
The Vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from VIBRATOR (GPIO_0) of AD6525.
VBAT VBAT
R223 20 R224 47K
R230 220 Q202 R233 1.5K R234 100K

3 4 2 5
VIBRATOR
EMZ2 D201 1SS352
MOTOR C273 VA204 AVL14K02200 4.7u
Figure 3-31. MOTOR
- 42 -
4. Trouble Shooting
4. TROUBLE SHOOTING
4.1 RX Trouble
Test Point
1 5 2
RX Check Area
Checking Flow
START
Figure 4-1.
HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting
1.Check Regulator Circuit
4.Check Ant SW & Mobile SW
2.Check VCTCXO Circuit
5. Check Saw Filter Circuit
3.Check Control Signal 6. Check RX IQ
Redownload SW, CAL
- 43 -
4. Trouble Shooting
(1) Checking Regulator Circuit

Test Points
U303. 3
U303. 5
Figure 4-2.
Circuit Diagram
VRF MIC5255-2.85BM5 U303 5 1 OUT IN 2 C363 GND 3 4 BYP EN 0.01u
VBAT
C362 10u
R317
CLKON
C361
10u
Checking Flow
Check Pin 5.
RF 2.85V O.K? Yes
No
Pin 3. High ? Yes
No
Changing the Board
Regulator Circuit is OK See next Page to check VCTCXO
Replace U303
- 44 -
4. Trouble Shooting
(2) Checking VCTCXO Circuit

Test Points Checking Flow
Check Pin 3. Refer to Graph 2-1
Yes 13 MHzO.K? No
VCTCXO Circuit is OK See next Page to check ANT SW & Mobile SW Changing X301
2.75V OK? No Check U101, PMIC
Yes
X301. 4
X301. 3
Figure 4-3.
Circuit Diagram
C373 100p VVCXO R314 100 4 C371 2.2u (1608) VCC GND 13MHz 2 X301 3 OUT C372 1000p 15K R315 AFC AD6535_AFCDAC
Waveform
- 45 -
4. Trouble Shooting
(3) Checking PLL Control Signal

Test Points
S_DATA
S_CLK S_EN RF_PWR_DWN
Figure 4-4.
Checking Flow
Check RF_PWR_DWN. Level is High? Yes Check TP Check if there is Any Major Difference Refer to Graph 3-1 3-2 No Download the SW
Similar? Yes
No
Download the SW
Control Signal is OK See next Page to check ANT SW & Mobile SW
Waveform
- 46 -
4. Trouble Shooting
(4) Checking Ant SW & Mobile SW

Test Points
SW301. ANT
SW301. RF
L305 (VC2) L306 (VC1) FL301. 1
FL301. 10
Figure 4-5.
Circuit Diagram
Waveform
KMS-507
ANT G2 RF G1
SW301
C321
22p C322 0.5p
8 ANT 4 6 7 9 12 13 14 GND1 GND2 GND3 GND4 GND5 GND6 GND7
FL301
5 EGSM_TX 3 DCS_TX 10 EGSM_RX 1 DCS_RX
C325 NA
11 2 SHS-C090DR
VC1 VC2
C387 27p
L305 33nH C382 10p C383 27p ANT_SW2 GPO_11
L306 C384 33nH C385 3.3p ANT_SW1 10p GPO_9
- 47 -
4. Trouble Shooting
Checking Flow
For these 2 test case, No Call connection is needed
Check SW301 Pin ANT,RF with RF Cable connected.
Open Yes
No
Changing SW301
Check SW301 Pin ANT,RF with No RF Cable Connected
Short Yes
No
Changing SW301
Check L305, L306 Check whether Ant SW Set as RX mode Refer to Table 4-1
VC1 : Low VC2 : Low
No
Changing the Board.
Yes
Check RF Level of FL301.2 (for GSM) & FL301.11(for DCS)
Pin10 : ~ -62dBm Pin 1 : ~ -63dBm
No
Changing FL301
Yes Ant SW & Mobile SW is OK See next Page to check Rx IQ Signal
For this RF Level test case, RX Stand alone Mode is needed refer to chapter 11
Table 4-1.
ANT SW DCS TX EGSM TX EGSM,DCS RX VC1 0 1 0 VC2 1 0 0
- 48 -
4. Trouble Shooting
(5) Checking SAW Filter Circuit

Test Points Circuit Diagram
FL302
FL303
C351 2 3 FL302 C387 27p 1

G1 O1 IN G2 O2
1p L303 C352 1p C353 27nH
B7820 5 4
2 3 FL303 1
G1 O1 IN G2 O2
1p L304 C354 1p 7.5nH
B7821 5 4
Figure 4-6.
Checking Flow
Check RF Level of Saw Filter Input For GSM : FL302.1
FL303.1 : ~ -61dBm
No Check the parts are well Soldered For GSM : C387
Changing C387for GSM
Yes
Check RF Level of Saw Filter Output For GSM : FL302.3 For DCS : FL303.3
FL302.3 : ~ -64dBm FL303.3 : ~ -65dBm
No Check the parts are well Soldered For GSM : L303,C351 For DCS : L304, C353
Changing C387for GSM
No
Changing FL302 for GSM FL303 for DCS
Yes
Yes
Saw Filter is OK See next Page to check Rx IQ Signal For the test, RX Stand alone Mode is needed. Refer to chapter 11
Changing L303, C351 for GSM L304, C353 for DCS
- 49 -
4. Trouble Shooting
(6) Checking RX IQ
QP C342 39p QN IP C343 39p IN

C343 C342
Figure 4-7.
Waveform
Graph 4-4.
Checking Flow
Check C342, C343. Check if there is Any Major Difference Refer to Graph 4-4
Similar? Yes
No
Replace U301
Redownload the Software And calibrate
- 50 -
4. Trouble Shooting
4.2 TX Trouble
Test Points
1 3
Figure 4-8.
Checking Flow
START
HP8922 : Test mode 62 CH, 7 level setting (TCH) 62 CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting
1. Check Regulator Circuit 4. Check TX IQ
2. Check VCTCXO Circuit
5. Check PAM Control Signal
3. Check Control Signal 6. Check Ant SW & Mobile SW
Redownload SW, CAL
- 51 -
4. Trouble Shooting
(1) Checking Regulator Circuit

Test Points
U303. 3 U303. 5
Figure 4-9.
Circuit Diagram
VRF MIC5255-2.85BM5 U303 5 1 OUT IN 2 C363 GND 3 4 BYP EN 0.01u C361 10u VBAT
C362 10u
R317
CLKON
Checking Flow
Check Pin 5 .
RF 2.85VO.K? Yes
No
Pin 3. High ? Yes
No
Changing the Board
Regulator Circuit is OK. See next Page to check VCTCXO
Replace U303
- 52 -
4. Trouble Shooting
(2) Checking VCTCXO Circuit

Test Points Checking Flow
13 MHzO.K? No 2.75V OK? No Check U101,PMIC
Yes
VCTCXO Circuit is OK See next Page to check ANT SW & Mobile SW
Yes
Changing X301
X301. 4
X301. 3
Figure 4-10.
Waveform
Circuit Diagram
C373 100p VVCXO R314 100 4 C371 2.2u (1608) VCC GND 13MHz 2 X301 3 OUT C372 1000p 15K R315 AFC AD6535_AFCDAC
- 53 -
4. Trouble Shooting
(3) Checking PLL Control Signal

Test Points
S_DATA
S_CLK S_EN RF_PWR_DWN
Figure 4-11.
Checking Flow
Check RF_PWR_DWN. Level is High? Yes No Download the SW
Similar? Yes
No
Download the SW
Control Signal is OK. See next Page to check ANT SW & Mobile SW
Waveform
- 54 -
4. Trouble Shooting

Test Points
KMS-507
ANT G2 RF G1
Circuit Diagram
SW301
SW301. ANT
SW301. RF
C321
22p C322 0.5p
8 ANT 4 6 7 9 12 13 14 GND1 GND2 GND3 GND4 GND5 GND6 GND7
FL301
5 EGSM_TX 3 DCS_TX 10 EGSM_RX 1 DCS_RX
C325 NA
L305 (VC2) L306 (VC1) FL301. 1
11 2 SHS-C090DR
VC1 VC2
FL301. 10
C387 27p
Figure 4-12.
L305 33nH C382 10p C383 27p ANT_SW2 GPO_11
L306 C384 33nH C385 3.3p ANT_SW1 10p GPO_9
Waveform
Graph 4-7.(a)
Graph 4-7.(b)
- 55 -
4. Trouble Shooting

Checking Flow
For the test, TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS)
Check L305, L306 Check whether Ant SW Set as TX mode Refer to Graph 4-7(a),4-7(b) Refer to Table 4-2
Check VC1, VC2 Yes
No
Changing board
Check RF Level of FL301 Pin 5 (for GSM) & Pin 3 (for DCS)
Pin5 : ~29.5dBm Pin 3 : ~26.5dBm
No
Go to 4.3.5 Checking PAM control signal
Yes Check SW301.ANT, RF with RF Cable connected. No
Open Yes
Changing SW301
Check SW301.ANT,RF with RF Cable disconnected
Short Yes END
No
Changing SW301
Table 4-2.
ANT SW DCS TX EGSM TX EGSM,DCS RX VC1 0 1 0 VC2 1 0 0
- 56 -
4. Trouble Shooting
(6) Checking PAM Control Signal

Test Points
TX_RAMP (R301)
PA_EN (R302)
Figure 4-13.
Waveform
Graph 4-8.
Checking Flow
Check TX_RAMP and PA_EN Check if there is Any Major Difference or not Refer to Graph 5-11
No Similar? Yes Download S/W
Go to Next Step
- 57 -
4. Trouble Shooting
(7) Checking TX IQ
Test Points
C343
C342
Figure 4-14.
Waveform
Graph 4-9.
Circuit Diagram
QP C342 C399 22n 31 GND4 32 VDD2 C386 22p IP C343 39p IN 39p QN
RXQN RXIP RXIN TXIP TXIN TXQP TXQN
1 2 3 4 5 6 7
- 58 -
4. Trouble Shooting
4.3 Power On Trouble

Circuit Diagram & Test Points
VSIM VVCXO VMIC VCORE C131 VBAT 10u 47n C146 10u C147 22p C148 47n R101 NA For AD6535 & 6537B R6 N2 P2 R2 C15 G15 H15 C132 C133 C149 10u 39p 10u C134 C135 10u C136 10u C137 10u C195 0.1u VMEM VEXT VRTC
A3 VBAT3-1 B3 VBAT3-2 R5 VBAT4 R4 VBAT5
T6 VSIM D16 VVCXO H16 VABB N16 VMIC
P1 VCORE1 N1 VCORE2
VBAT 0 R103
NC_R6 VBAT1 VBAT2 VBAT3 VBAT1-1 VBAT2-1 VBAT2-2
T3 VMEM1 T2 VMEM2
A4 VEXT1 B4 VEXT2
VBAT
T4
VBAT_NET
AD6537B
T7 VRTC B8 VBATSENSE
R104 NA
Figure 4-15. AD6537B POWER MANAGEMENT SECTION
- 59 -
4. Trouble Shooting
Checking Flow
START
Yes No
Check Battery Voltage > 3.35V ?
Charge or Change Battery and try again.
Yes
Push power-on key and check the level change of U102 KEYON
No
Check the contact of power-key or dome switch.
Yes
Check the voltage of the following port at U102 VOORE=1.8V ? VMEM = 1.8 or 2.8V ? VEXT=2.8V ? VRTC=1.8V ? VSIM=2.85V ? VMIC=2.5V ? VVCXO=2.75V ?
No
Replace U102
Yes
Logic level at KEYON of U102 = HIGH?
No
Redownload software & try again.
Yes Yes No
Does it work properly?
No
The power-on procedure is completed. The problem may be elsewhere.
Yes
THE PHONE WILL POWER ON.
Replace the main board.
- 60 -
4. Trouble Shooting
4.4 Charging Trouble

Test Points
R107
D101
Q103
Figure 4-16.
Circuit Diagram
VCHARGE VBAT
C187 10u
CUS02 Current Sense D101 R107 0.2 1% CLOSE TO BATTERY PACK
VCHG ISENSE GATEDRIVE
R108 330 Q103

4 3 2 1 G D3 D2 D1 S D4 D5 D6 5 6 7 8
TPCF8102
- 61 -
4. Trouble Shooting
Checking Flow
SETTING : Connect the battery and the charging adaptor(TA) to the phone
START
Voltage at VCHG of U102 = 5.2V?
No
The charging adaptor(TA) is out of order. Change the charging adaptor.
Yes
R107, Q103, D101 well-soldered?
No
Resolder R102, U102, D101.
Yes
Voltage across D101 = ~0.3V
No
Replace D101.
Yes
Voltage across R107 is ~100mV.
No
Replace R107.
Yes
~0.7< Voltage (Q103) < ~1.3V
No
Replace Q103.
Yes
Is the battery charged ?
No
The battery may have the problem. Change the battery and try again.
Yes
CHARGING WILL OPERATE PROPERLY.
- 62 -
4. Trouble Shooting
4.5 LCD Trouble.

Checking Flow
If the FPCB has a problem, the control signals for LCD cannot be transmitted properly. Connection Check
Figure 4-17.(a)
Figure 4-17.(b)
CN201
Figure 4-17.(c)
- 63 -
4. Trouble Shooting
Checking Flow
START
Is the connection of LCD module with LCD connector on PCB OK? Yes
No
Reassemble LCD module with LCD connector.
Check the soldering of CN201
No Resolder CN201.
Yes
Check the soldering of Connector at LCD module.
No Resolder connector.
Yes Change the FPCB and try again. Yes
At LCD module
FPCB Check Check the soldering of CRC filter No Resolder CRC filter.
Yes
Does LCD work properly?
No
Replace LCD module.
Yes The FPCB which connects the main board and LCD module has a problem. Replace the FPCB.
LCD WILL WORK PROPERLY.
- 64 -
4. Trouble Shooting
4.6 Receiver Trouble

Test Points
Speaker vibrator U401 U402
Receiver
R414 C411
C412 R416
Soldering check
Figure 4-18.
Circuit Diagram
VMEM
C409
39p
R405 SPKN
AD6537B MIDI
NA R406 SPKP NA R407

1 V+ 2 NO1 COM2 8 COM1 IN2 7 IN1 NC2 6 NC1 GND NO2 9
U402 MAX4684EUB
10
SPK_REC_N
SPK path
0 R409
0 C406 C407 Closed to Analog SW 47p 47p
C410
47p
SPK_REC_P
AOUT1P AOUT1N
R414 RECP 4.7 R416 RECN 4.7 C411 C412 47p 47p
SPK_RCV_SEL
Receiver path
R415 100K
- 65 -
4. Trouble Shooting
Checking Flow
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
START
Check the signal level of RCVP & RCVN at R414, R416. Are these voltage is about 1.2V?
No
Check the soldering R414 & R416 Yes
No
Replace the Main board. ABB is out of order.
Yes
Re-soldering R414, R416
Check the signal level at R415. Is it almost 0?
No
Check the soldering of U402 Yes
No
Replace U402
Yes
Re-soldering U402
No Check the contact state of dual mode speaker. Replace the dual mode speaker
The dual mode speaker will work properly.
Waveform
Graph 4-10. - 66 -
4. Trouble Shooting
4.7 Speaker Trouble

Test Points
vibrator CN201 U401
Speaker
C410
C404 R420
R404
C417
C405
Soldering check
Figure 4-19.
Circuit Diagram
These five components make up the amplifier and the filter stage of melody. [C404 R402 C405 R404 R417]
YMU759B
R401 13MHZ_MIDI MIDI_RESET ADD00 RD MIDI_CS 0 CLK1 _RST 30 A0 31 _RD 29 5 _CS IFSEL 28 3 27 26 25 24 23 22 21 20 R408 3.3K 6 1000p C402 0.1u 9 R412 10K 32 R413 0 C403 0.1u 8 7 VDD VSS SPVSS 16 C408 0.1u RECP 4.7 R416 RECN 4.7 C411 C412 47p 47p R414 SPK_RCV_SEL SDOUT SPK_REC_P VREF SPVDD 15 R410 0 PLLC SPOUT2 18 _WR _IRQ D0 D1 D2 D3 D4 D5 D6 D7 EQ3 EXT1 EXT2 14 2 19 1 4
VMEM
U401
11 10 C404 12 0.01u EQ2 13 C405 100p R417 R402 39K C409 R404 0 150K SPKN NA R406 SPKP NA SPOUT1 17 VBAT R407
1 V+ 2 NO1 COM2 8 COM1 IN2 7 IN1 NC2 6 NC1 GND NO2 9
HPOUT_R HPOUT_L EQ1
VMEM
Analog switch for select audio path or midi path.
R403 10K
39p

10
To the speaker at LCD module via CN201.

SPK_REC_N
Speaker path
0 R409 0 C406 C407 Closed to Analog SW 47p 47p
C410
47p
(16 Poly MIDI)
receiver path
R415 100K
- 67 -
4. Trouble Shooting
Checking Flow
SETTING : Connect PIF to the phone, and Power on. Enter the engineering mode, and set "Melody on" at Buzzer of BB test menu.
START
Voltage across C408 = 3.3 V?
No
No Check the soldering of R410 Yes
Replace U102 ( ABB LDO)
Yes
Re-soldering R410
Check the signal level of R407, R409
No
Replace U401
Yes
The voltage of R415 is ~2.8V
No
Check the soldering of U402 Yes
No
Replace U402
Yes Re-soldering U402 Check the state of contact of dual mode speaker Yes Speaker Working!! No Replace speaker
- 68 -
4. Trouble Shooting
4.8 Mic Trouble

Test Points
C160 R132
Soldering check
R128 C193
MIC101
R127 R126
Figure 4-20.
Circuit Diagram
VMIC
R126 1K TC151 2.2K
R127
The signal flow of the microphone to ABB
10u
C193 39p
MIC101
R128 100 C163 R132 100 C160 0.1u R134 C161 39p 2.2K C162 39p 39p
CLOSE TO MIC
AVL5M02-200 VA151 AVL5M02-200 VA152
2 1 OB4-15L42-C33L
- 69 -
4. Trouble Shooting
Checking Flow
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
START
Voltage across C193 = 2.5VDC?
No
Voltage VMIC of U102 = 2.5VDC?
No Replace U102.
MIC Bias Voltage Yes Resolder R126 & R127.
Check the signal level at each side of MIC101. Is it a few tens mVAC? Yes
No
Replace the microphone, MIC101.
Check the soldering of R110,C160, R128, R132. Yes Replace Main board.
No Resolder C160, R128, R132.
MIC WILL WORK.
Figure 4-20.
- 70 -
4. Trouble Shooting
4.9 Vibrator Trouble

Test Points
Q202 Vibrator
Vibrator block
Soldering Check in LCD Module
Figure 4-21.(a)
Figure 4-21.(b)
Circuit Diagram
VBAT VBAT
R223 20 R224 47K
L When the vibrator works, the signal at this point goes H H

VIBRATOR R233 1.5K R234 100K
3
R230 220 Q202

4
From the vibrator at LCD module via CN201.

5
EMZ2
MOTOR C273 VA204 AVL14K02200 4.7u
When the vibrator works, the current flow in this direction.
D201 1SS352
Current path
- 71 -
4. Trouble Shooting
Checking Flow
SETTING : After Initialize Agilent 8960, Test in EGSM, Connect PIF to the phone, and Power on. Enter The engineering mode, and set Vibrator on at Vibration of BB test menu.
START
Is the voltage at pin6 of Q202 near VBAT?
No
Check the soldering of R223. Yes
No Resolder R223.
Yes
Replace Q202.
Check the soldering of R223 Yes Check the soldering of CN301 Yes Check the soldering of vibrator at LCD module Yes Replace Vibrator.
No Resolder R223.
No Resolder CN201.
No Resolder vibrator.
VIBRATOR WILL WORK PROPERLY.
- 72 -
4. Trouble Shooting
4.10 Key Backlight LED Trouble

To LIGHT3 port of ABB
VBAT
R111 47
R112 47
R113 47
R114 47
R115 47
R116 47
R117 47
R118 47
R119 47
R120 47 LD120
LD111 LD112 LD113 LD114 LD115 LD116
LD117 LD118 LD119
SP102 SP103 SP104 SP105 SP106 SP107 SP108 SP109 SP110 SP111
Light3
Figure 4-22.
Checking Flow
START
Is the voltage level VBAT 3.6-4.2V? Yes
No
Check the U102.
Are all LEDs LD111~LD120t working? Yes
No
Check the soldering of each R or replace LEDs not working.
BACKLIGHT WILL WORK PROPERLY.
- 73 -
4. Trouble Shooting
4.11 Folder on/off Trouble

Test Points
U103
C111
R142
C112
Figure 4-23.
Circuit Diagram
VEXT
R142 51K C112 0.1u FOLDER SWITCH GND1 PGND 3 7 GND2 4 NC2 NC1 5 2 VDD OUTPUT 1 6 A3212EEH U103
The voltage at this point goes from 2.8V to 0 V when the folder is closed.
AD6525
C111 10p
This component operate when a magnet get close here.
- 74 -
4. Trouble Shooting
Checking Flow
START
Check the magnet in the folder side. Yes
No Place the magnet properly.
Voltage at Pin 6 of U103 = 2.8V ?
No
Voltage VEXT1 of U102 = 2.8V?
No
Yes
Resolder U103.
Replace U102.
Open Folder. Voltage at Pin 1 of U103 = 2.8V ? Yes
No
Resolder R142 & U103.
Close Folder or get close any magnet to U103. Voltage at Pin 1 of U103 = 0V ?
No
Replace U103.
Yes
No
Redownload software or change the main board.
Yes FOLDER WILL WORK PROPERLY.
- 75 -
4. Trouble Shooting
4.12 SIM Detect Trouble

SETTING : Insert SIM into J101, connect PIF to the Phone, and Power on.
VSIM
DBB
VSIM J101 4 5 6 10 9 GND1 VCC VPP RST CLK IO GND5 GND2 GND4 GND3 GCA261-6S 1 2 3 7 8
C117 0.1u C115 220n
SIM_DATA VA165 AVL14K02200
C116 1000p
PIN1 Figure 4-24.
Checking Flow
START
Does the SIM supports 3V? Yes Voltage at Pin 1 of J101 = 2.85V?
No
Change the SIM. Our Phone supports 3V SIM only.
No
Voltage VSIM of U102. = 2.85V?
No
Yes Resolder J101. Check the soldering condition of J101. Yes Check the contact between J101 and SIM card. Yes Change the SIM and try again. Does it work properly? Yes The SIM is malfunctioned. Change the SIM. SIM will be DETECTED. No Does it work properly after redownloading SW? No No No Replace J101.
Resolder J101.
Replace J101.
Change the main board.
- 76 -
4. Trouble Shooting
4.13 Earphone Trouble

Test Points
J102
C123 Figure 4-25.(a)
R156 R158
R181 C167 R154 R159 R153
Figure 4-25.(b)
Circuit Diagram
AIN2P
The direction of the audio signal from the ear-mic
R148 100 VMEM VMIC
VMEM VMIC SWITCHING When Jack is activated

VMEM
AIN2N
NO 6 NC 4 VMEM U105 R156 100K 3 IN COM 1 R158 MAX4599EXT-T R153 R137 R138 1K 39K NA 2 J102 4 3 1 5 HEADSET JACK SP115 AVL5M02-200 R154 NA VMIC_ON R159 HOOK_DET 1K C124 0.1u
GND
AOUT3P
C123 39p
VCC
JACK_DET (DBB)
2.2K
CLOSE TO EARJACK
R181 R141 4.7 C165 TC153 10u C179 39p 39p 4.7 VA153 AVL5M02-200
The direction of the audio signal to the ear-receiver
C167 C168
VA154
39p 18p SP114
- 77 -
4. Trouble Shooting
Checking Flow
START
Insert the earphone to the phone.
Earphone detect problem Does the audio profile of the phone change to the earphone mode? Yes Set the audio part of the test equipment to echo mode. Set the audio part of the test equipment to PRBS or continuous wave mode. Can you hear your vioce from the earphone? No Change the earphone and try again. Can you hear the sound from No 2 Earphone receiving path problem No 1 Audio path problem
Can you hear your voice from the earphone? Yes
No
Yes
Earphone sending path problem
Change Earphone.
EARPHONE WILL WORK PROPERLY.
Earphone receiving path problem
voltage at C139=~1.2V Yes Check soldering C139,R141,J102 Yes Replace main board No
Download S/W
Re-solder C139,R141,J102
- 78 -
4. Trouble Shooting
Earphone detect problem
Earphone detect problem
Voltage at R150 = 2.8V ?
No
Voltage at Pin1 of U104 = 2.8V ?
No
Yes Yes 5 Resolder R150.
Voltage at Pin 3 of U104> Voltage at Pin 4 of U104? Yes Resolder or replace U104.
No
Resolder R145, R147, R144
Voltage at A point = 1.5~1.9 VDC ? Yes
No
Resolder R153, R159.
Does it work well?
No
Redownload software.
Does it work well? Is the signal level across C166&7a few tens or hundreds VAC ? Yes No Resolder R181. Yes Yes
No
Change the main board.
4
Resolder C166&7. Yes
- 79 -
4. Trouble Shooting
4.14 Indicator LED Trouble

Test Points
R225 R229 Q201 R226 R227 R264 R262
Figure 4-26.
Circuit Diagram
CN201 21 22
R261 RLED 0 R263 GREEN LED 0 R264 Q201 6 5 R223 17K 4 1 2 3 UMX1NTN NA R262 GLED 0
RED LED
R225 G 10K
R226 47K R227 47K
RED_LED
Checking Flow
START
VBAT of U102 is 3.6~4.2V?
No
Check the VBAT of U102.
Yes No Are both LEDs not working? Yes Replace Q201, and try again. Check the soldering or replace LEDs not working.
- 80 -
5. DISASSEMBLY INSTRUCTION
4.15 RTC Trouble

Test Points
X101
R123
Circuit Diagram
Figure 4-27.
X1U1 3 4 DBB R123 10M

OSCOUT OSCIN
2 32.768KHz MC_146
Checking Flow
START
Yes
Is the voltage level at R123 about 1.8V?
No Check the soldering of R123.
Yes
Replace X101 and try again.
- 81 -
5.1 Disassembly
1. Remove the Battery and Screws as shown below.
Figure 5-1.
Figure 5-2.
- 82 -
Figure 5-3.
- 83 -
Figure 5-4.
- 84 -
Figure 5-5.
Figure 5-6.
- 85 -
1 1 2
Figure 5-7.
Figure 5-8.
- 86 -
Figure 5-9.
- 87 -
Figure 5-10.
Figure 5-11.
- 88 -
Figure 5-12.
- 89 -
6. DOWNLOAD AND CALIBRATION

6.1 Download
A. Download Setup
Figure 6-1 describes Download setup.
UART
Figure 6-1. Download Setup
- 90 -
B. Download Procedure
1. Access Flash loader program in PC and select Erase. (Dont check OWCD)
1. Select Erase
2. Check
3. Dont Check OWCD
2. Press Start and Wait until Erase is completed.
1. Press Start and Wait
- 91 -
3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again.
1. Change Address and Size
3. Press Start and Wait
2. Dont Check OWCD
4. Press Write to start Download and press
Key to choose software (AlchemyData.mot)
1. Press
2. Press
- 92 -
5. Choose software
1. Select File
2. Press Open
6. Wait until converting from MOT to BIF is completed (Dont check OWCD)
2. Wait until completion
1. Dont Check OWCD
- 93 -
7. Press Start and Power on the phone using JIG remote Power on (Switch 1)
8. Wait until Sending Block is completed
- 94 -
9. Press Write to start Download and press
Key to choose software (CodeData.mot)
10. Choose software
- 95 -
11. Wait until Sending Block is completed
1. Wait Until Sending Block is completed
- 96 -
6.2 Calibration
A. Equipment List
Table 6-1. Calibration Equipment List Equipment for Calibration Wireless Communication Test Set RS-232 Cable and Test JIG RF Cable Power Supply GPIB interface card Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium II class above 300MHz HP-66311B HP-GPIB Type/Model HP-8960 Brand Agilent LG LG Agilent Agilent LG
B. Equipment Setup
Figure 6-2.
- 97 -
Figure 6-3. The top view of Test JIG
C. Test Jig Operation

Table 6-2. Jig Power Power Source Power Supply Travel Adaptor Description usually 4.0V Use TA, name is TA-20G (24pin) Table 6-3. Jig DIP Switch Switch Number Switch 1 Switch 2 Switch 3 Switch 4 Name ADI-REMOTE TI-REMOTE VBAT PS Description In ON state, phone is awaked. It is used ADI chipset. In ON state, phone is awaked. It is used TI chipset. Power is provided for phone from battery Power is provided for phone from Power supply Table 6-4. LED Description LED Number LED 1 LED 2 LED 3 LED 4 Name Power TA UART MON Description Power is provided for Test Jig. Indicate charging state of the phone battery Indicate data transfer state through the UART port Indicate data transfer state through the MON port
- 98 -
1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3 rd , 4 th of DIP SW ON state always 4. Press the Phone power key, if the Remote ON is used, 1 st ON state
D. Procedure
1. Connect as Fig 6-2 (RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Power ON PC then enter into Windows 98 (Remark : Windows 2000 system could be feasible) 3. Run AUTOCAL.exe, the AUTOCAL application window will be appeared.
- 99 -
7. BLOCK DIAGRAM
7. BLOCK DIAGRAM
Speaker & Receiver Motor
LCD Panel 128X128
Indicate LED (2 Color)
Connector
RTC Backup Battery
Board to Board Connector
RF
LCD Connector
Ear Jack
YNU763 MIDI ABB (AD6537B) Charging (AD6525) SIM Connector DBB
Flash Memory
Battery
IO Connector
- 100 -
8. CIRCUIT DIAGRAM
8. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10
VSIM VVCXO VMIC VCORE VRTC VCORE C131 VBAT 10u C103 C104 C105 1uF 0.1u 22p 0.1u C106 C107 22p 0.1u C108 47n C146 10u C147 22p C148 47n 47n R101 NA For AD6535 & 6537B R6 N2 P2 R2 C15 G15 H15 C132 C133 C149 10u 39p 10u R155 NA R102 100K VBAT R157 VBACKUP_SEL VCHARGE T7 VRTC B8 VBATSENSE B7 NC_B7 B5 NC_B5 T15 NC_T15 VCHG ISENSE GATEDRIVE KEYOUT KEYON A5 A7 A6 T13 T14 R104 NA C199 NA C187 R106 NA 10u D101 R108 KEY_ROW0 C144 C143 1uF T12 NC_T12 R1 NC_R1 A16 NC_A16 C16 NC_C16 REF AFCDAC PA BATTYPE REFOUT REFCHG B15 B14 B12 B6 B11 D15 C138 NA R109 NA VREF C184 1u C183 22p AFC TX_RAMP BAT_TEMP R121 10K RF_TEMP C182 0.1u C185 C186 0.068u 39p R127 TC151 2.2K C193 39p SP102 SP103 SP104 SP105 SP106 SP107 SP108 SP109 SP110 SP111 R126 1K R111 47 R112 47 R113 47 R114 47 R115 47 R116 47 R117 47 R118 47 R119 47 R120 47 LD120 R161 1K 0.01u ABB_INT PWR_ON RESET CLKON D1 R7 T1 A2 C2 G16 A1 C1 B1 B2 K1 K2 F15 L1 J2 M1 J1 T5 H1 H2 L2 F16 G2 F1 E2 G1 D2 E1 F2 E15 E16 B13 E5 E6 E7 E10 E11 E12 F5 F6 F7 F10 F11 F12 G5 G6 G7 INT DBBON RESET VCXOEN GPI NC_G16 TDI TDO TMS TCK RXON TXON GND_NET2 MCLK MCLKEN ABBRESET ASM GND_NET1 CSDO CSDI CSFS NC_F16 BSDI BSIFS BSDO BSOFS ASDO ASDI ASFS NC_E15 NC_E16 AGND01 AGND02 AGND03 AGND04 AGND05 AGND06 AGND07 AGND08 AGND09 AGND010 AGND011 AGND012 AGND013 AGND014 AGND015 AGND016 REFBB A10 PWR KEY KB101
4 3 2 1 3
TP
VMEM
VEXT
VRTC
VCHARGE
VBAT
RAM_CS RD
TP101 TP105
VCORE
VSIM
VMEM VEXT
C134
C135 10u
C136 10u
C137 10u
C195 0.1u VBAT
C140 0.1u
JTAG PORT
C101 JTAG1
_F_WE TDO_0 TCK TMS TDO_1 RPWON VBAT TDI JTAGEN GND
R162 49.9
AA
R163 R164 1K UMX1NTN
4
C102 1uF
TP104 TP106 TP108 TP110 TP112 TP114 TP115 TP116 TP117 TP118
WR TDO_0 TCK TMS TDO_1 PWR_ON VBAT TDI JTAGEN
A3 VBAT3-1 B3 VBAT3-2 R5 VBAT4 R4 VBAT5
T6 VSIM D16 VVCXO H16 VABB N16 VMIC
P1 VCORE1 N1 VCORE2
H1 VCC1 P7 VCC2 K14 VCC3 C8 VCC4
L2 VMEM1 N5 VMEM2 N9 VMEM3 N13 VMEM4
B14 VEXT1 B10 VEXT2 C6 VEXT3 D5 VEXT4
VBAT DATA0 DATA1 DATA2 DATA3 DATA4 DATA5 DATA6 DATA7 DATA8 DATA9 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 N6 P6 M6 N7 M7 L7 P8 N8 M8 P9 M9 P10 N10 M10 P11 N11 DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 0 R103 IP IN QP QN A12 A13 A15 A14 R3 IP IN QP QN
NC_R6 VBAT1 VBAT2 VBAT3 VBAT1-1 VBAT2-1 VBAT2-2
T3 VMEM1 T2 VMEM2
A4 VEXT1 B4 VEXT2
A2
E3
L9
VDDRTC
VSIM
VPEG1
ADD00 ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 ADD22
H4 J3 J2 J4 K3 K2 K4 L4 L1 L3 L5 M1 M2 N1 P1 N2 P2 N3 M3 P4 N4 M4 P5 M14 M13 P14 P13 N12 M11
PRE_CHARGE VBAT 1.5K R165 100K
RED_LED
ADD0 ADD1 ADD2 ADD3 ADD4 ADD5 ADD6 ADD7 ADD8 ADD9 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 ADD22 RAMCS ROMCS WE LWR HWR RD
T4
VBAT_NET
R105
NA
Q104 CUS02 Current Sense R107 0.2 1% CLOSE TO BATTERY PACK 330 Q103
G D3 D2 D1 S D4 D5 D6 5 6 7 8
VMEMSEL
BB
GPIO_32 JTAGEN GPIO_21 GPIO_20 GPIO_19 GPIO_18 GPO_0 GPO_1 CLKOUT CLKOUT_GATE GPO_24 GPO_5 GPO_6 ASDI ASDO ASFS BSDO BSOFS BSDI BSIFS VSDI VSDO VSFS
Data Set Ready L14 DSR K11 TDO_1 J11 J12 H13 H14 B1 C2 D1 D2 E1 A1 C1 E2 F1 F2 F3 G4 G2 G1 G3 H3 H2 JTAGEN
TPCF8102 VBAT
TDI
TDO_0
D104 PWR_ON R122 200K

3
KDS121E
2
RAM_CS ROM_CS1 WR LBS UBS PWR_HOLD RD
TMS
TCK
LD111 LD112 LD113 LD114 LD115 LD116
LD117 LD118 LD119
U102 AD6537B
VMIC
X101 3 2 32.768KHz MC-146 4 1 R123 10M
CLKON 13MHZ
B2 PWRON G14 CLKON L12 CLKIN B3 OSCOUT A3 OSCIN N14 RESET C14 D12 A14 A13 E11 C12 B13 D11 D10 B12 C11 D9 B11 A11 C10 D8 A10 C9 C7 B9 A9 B8 A8 D6 B7 USC0 USC1 USC2 USC3 USC4 USC5 USC6 GPIO_0 GPIO_1 GPIO_2 GPIO_3 GPIO_4 GPIO_5 GPIO_6 GPIO_7 GPIO_8 GPIO_9 GPIO_10 GPIO_11 GPIO_12 GPIO_13 GPIO_14 GPIO_15 GPIO_16 GPIO_17
U101 AD6525ACA-REEL
VBACKUP_SEL
B9 TEMP1 A8 TEMP2 B10 C181 AUXADC1 A9 AUXADC2 1u
HOOK_DET AIN2P AIN2N AIN1P AIN1N AIN3L AIN3R P15 R15 P16 R16 R13 R14 C178 NC_R12 39p R12 VBAT LIGHT1 LIGHT2 LIGHT3 SPWR1 SPWR2 AOUT2N1 AOUT2N2 AOUT2P1 AOUT2P2 AOUT3N AOUT3P AOUT1P AOUT1N L16 M15 M16 R10 T10 T9 R9 R11 T11 K16 J16 J15 K15 RLED R149 GLED NA C157 1u SPKN SPKP C151 0.1u C154 C177 39p C152 C153 39p 39p C156 39p 39p
CLOSE TO AD6537
R124 0 C155 39p R130 4.7K R132 100 C160 0.1u R134 R128 100 C163 C161 39p 2.2K C162 39p AVL5M02-200 AVL5M02-200 39p VA151 VA152
10u
C
RESET C191 100p VEXT R125 100 C192 100p
USC0 USC1 USC2 USC3 USC4 USC5 USC6 VIBRATOR MON_RX MON_TX ABB_INT MIDI_INT C111 10p JACK_DET
MIC101
CLOSE TO MIC
2 1 OB4-15L42-C33L
R142 51K C112 0.1u FOLDER SWITCH GND1 PGND 3 7 GND2 4 NC2 NC1 5 2 VDD OUTPUT 6 1 A3212EEH U103
SPK_RCV_SEL LCD_RESET MIDI_RESET IND_LEDG LCD_DIM MIDI_SEL LCD_ID MIDI_CS ROM_CS2 KEY_ROW0 KEY_ROW1 KEY_ROW2 KEY_ROW3 KEY_ROW4 KEY_COL0 KEY_COL1 KEY_COL2 KEY_COL3 KEY_COL4
GPO_2 GPO_3 GPO_4 GPO_7 GPO_8 GPO_9 GPO_10 GPO_11 GPO_16 GPO_17 GPO_18 GPO_19 GPO_20 GPO_21 DISPLAYCS GPO_22 GPO_23 GPIO_22 GPIO_23 GPIO_24 SIMCLK SIMDATAOP
M5 A7 C5
RECP RECN C188 0.1u C196 39p R150 VEXT
C139 4.7u
C123 39p
COM
G13 G12 H12 F14 F13 H11 F12 E14 E13 G11 E12 D14 D13 F11
PWR_HOLD PRE_CHARGE RF_PWR_DWN VMIC_ON ANT_SW1 ANT_SW2 PA_EN PA_BAND S_EN S_DATA S_CLK LCD_CS
R148 100
VMEM
VMIC
VMEM
NO 6
NC 4
VMEM
U105
GND 3 IN 1
VCC
MAX4599EXT-T 1K 39K
AGND017 AGND018 AGND019 AGND020 AGND021 AGND022 AGND023 AGND024 AGND025 AGND026 AGND027 AGND028 AGND029 AGND030 AGND031 AGND032 AGND033 AGND034 AGND035 AGND036 AGND037 AGND4 AGND3 AGND2 AGND1 SGND1 SGND2 DGND LGND
R137 R138 VEXT 2.2K
L13 GPCS1 M12 GPCS0 A6 F4 D4 B5 A5 C4 E4 B4 A4 C3 KEYPADROW0 KEYPADROW1 KEYPADROW2 KEYPADROW3 KEYPADROW4 KEYPADCOL0 KEYPADCOL1 KEYPADCOL2 KEYPADCOL3 KEYPADCOL4
VSIM J14 L10 K13 K12 J13
CLOSE TO EARJACK
G10 G11 G12 K5 K6 K7 K10 K11 K12 L5 L6 L7 L10 L11 L12 M5 M6 M7 M10 M11 M12 T16 L15 A11 B16 T8 R8 M2 N15
5
VCC GND
20K R146 JACK_DET SIM_DATA C170
4 3
VIN-
1
OUT
GUIDE HOLE
100 100p C171
VIN+
R145 1M R144 1M
100p
U104 R147 330K
MAX9075EXK-T GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 VSSRTC VSIM
39p 18p SP114
VEXT
Section
C117 0.1u J101 C115 220n 4 5 6 10 9 1 GND1 VCC 2 RST VPP 3 CLK IO 7 GND5 GND2 8 GND4 GND3 GCA261-6S
Designer Checked Approved
R151
100K MIDI_SEL
VSIM
Date 02/25 2004 02/25 2004 02/25 2400
Sign & Name MODEL PARK S.J. KIM Y. T. KIM S. K. CHO B.K. DRAWING NAME
J1 K1 P3 L6 L8 P12 L11 C13 A12 D7 B6 D3
C1100 (GB-1E)
Sheet/Sheets 1/4
R152
SIM_DATA NA VA165 AVL14K02200
Athena, Typhoon, Audio
C116 1000p
Iss.
4 5
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
REV. 1.0
LG Electronics Inc.
LGIC(42)-A-5505-10:01
- 101 -
8. CIRCUIT DIAGRAM
10
VMEM
VMEM
VBAT VRTC VEXT CN201
U201
DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 J3 G4 K4 H5 H6 K7 G7 J8 K3 H4 J4 K5 J7 H7 K8 H8 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 G2 F2 E2 D2 F3 E3 D3 C3 C7 E7 F7 C8 D8 E8 F8 D9 G9 F4 E4 D7 E6 E9 R256 VSS0 VSS1 _CEF1 _CEF2 _OE _WE _BYTE 0 ROM_CS2 ROM_CS1 RD WR Type 128/32 64/32 R256 R257 0 NA NA 0 R258 0 NA C271 C258 18p 1uF 1uF C259 RESET VBAT _LB _UB _CE1PS CE2PS DU1 DU2 C4 D4 J2 D6 K6 G8 LBS UBS RAM_CS VBAT 11 R223 20 R224 47K GND LCD_DIM 9 EN_SET C2D1 D2 D3 D4 2 OUT C1C2+ VBAT U203 10 IN C1+ 4 C260 3 1 C261 1uF 12 8 7 6 5 FB1 VA207 C262 39p C272 18p AVL14K02200 IND_LEDG 1uF RLED ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 ADD22
LCD_RESET DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07
R201 R203 R205 R207 R209 R211 R213 R215
820 820 820 820 820 820 820 820
MOTOR ADD01 R219 C276 C275 C254 C211 C212 C213 C214 C215 C216 C217 C218 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 330 C219 C220 C221 C222 C223 C224 C225 C226 C256 C277 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p C227 C255 C257 22p 22p 22p
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18
SPK_REC_N SPK_REC_P R202 R204 R206 R208 R210 R212 R214 R216 820 820 820 820 820 820 820 820
AA
DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA09 DATA08
R218
330
WR LCD_CS LCD_ID C240 C241 C242 C243 C244 C245 C246 C247 C248 C274 C278 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p 22p
J5 G5 J6 C201 22p C202 1uF C203 0.1u J9 G3
VCCF1 VCCF2 VCCPS
C231 C232 C233 C234 C235 C236 C237 C238 C239 22p 22p 22p 22p 22p 22p 22p 22p 22p
R261 0 R263
A1 A10 B1 B10 C1 F1 F6 F9 F10 G1 G6 G10 L1 L10 M1 M10
NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15
H2 R257 NA F5 R258 0 H3 C6 R221 H9 10K
GREEN LED
0 R264 NA Q201 6 1 2 3 UMX1NTN
R262 GLED 0
BB
LCD BACKLIGHT LED RED LED
E5 RY_BY C5 _WP_ACC D5 _RESET
R225 10K R229 47K
5 4
R226 47K RED_LED R227 47K
R232 10K
AAT3123ITP-20-T1
TH50VPF5783AASB (128M / 32M)

VIBRATOR R233 1.5K
3
R230 220 Q202

4
VCHARGE
VBAT
R234 100K
VMEM PWR_ON MOTOR C273 VA204 AVL14K02200 4.7u DSR Data Set Ready R235 100K R240 100K R236 100K R237 100K R239 100K R241 47
5
JIG_PWR_ON
C290 1uF R238 47 C298 1uF CN202 29 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 26 27 C252 39p VA203 SP224 C268 C251 20p AVL14K02200 AVL14K02200 3p VA206 C269 10p 28
C
1
EMZ2 SW1 UP 4 5 3 2 AVL5M02-200 AVL5M02-200 VA201 VA202 R242 680 1 4 1 5 3 2 SW2 DOWN D201 1SS352
R243 680
KB22
CLR
USC1 USC0 USC6 MON_RX USC2 SP201
R244 R245 R247 47 R246 47 R248 R249 R250
NA 47 NA 47 47
KEY_ROW0 R251 R252 47 47 SP203 USC5 R254 47
KB4 1 KEY_ROW1
KB20 2
KB16 3
KB9
KB8
PIN USC0
DAI CLOCK RX TX RESET
UART RXD TXD RTS CTS -
MON_TX USC3
LEFT
MENU USC1 USC2
R253 RI(Ring Indicator)
NA
D
SP204 KB5 4 KEY_ROW2 SP211 KB6 7 KEY_ROW3 SP227 KB7 SP228 KB3 0 SP229 KB19 # DOWN CONFIRM SP230 KB12 SP226 KB15 SP212 KB2 8 SP209 KB18 9 RIGHT SEND SP210 KB11 SP213 KB14 SP205 KB21 5 SP206 KB17 6 UP SELECT SP207 KB10 SP208 KB13 CN203 1
USC4 USC5 USC6
USC4 R265 BAT_TEMP Type UART
R255
47
R244 R246 NA 47 NA 47
R248 NA 47
R249 R250 47 NA 47 NA
R253 NA NA
C299 C267 1uF 39p
AVL5M02-200
1K
VA205
I/O CONNECTOR
Terminal Ground
DAI
*
KEY_ROW4 SP231 SP232
Section Designer
Date
Sign & Name PARK S. J. KIM S. K. KIM Y. T. CHO B.K. MODEL
02/25 2004 02/25 2004 02/25 2004
C1100 (GB-1E)
Sheet/Sheets 2/4
SP233
SP234
SP235
E
KEY_COL0 KEY_COL1 KEY_COL2 KEY_COL3 KEY_COL4
Checked Approved
DRAWING NAME
Memory, Key, I/O, LCD Interface
Iss.
1 2 3 4 5
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
REV. 1.0
LG Electronics Inc.
LGIC(42)-A-5505-10:01
- 102 -
8. CIRCUIT DIAGRAM
10
ANT1
C331 VBAT VRF R301 R302 C344 10p L307 22nH C345 6p C389 47p C302 22p C301 R304 33u C316 27p KMS-507
ANT
0.5p
15K 100 100
AA
TX_RAMP AD6535_PA PA_EN GPO_16
L308
1.2nH
PA_BAND GPO_17
C317 27p
C350 39p
SW301
GND9 GND14 GND13 GND12 GND11 GND10 GND8
G2
G1
R305
7
C311 R307 130 33p
RF
C375 100p VRF R310 0
26
25
24
23
22
21
20 GSM_IN
VCC1
L301 C321 22p C322 0.5p C326 5 EGSM_TX 3 DCS_TX 10 EGSM_RX 1 DCS_RX 8.2nH C323 0.5p
8 VRAMP 6 GSM_OUT 9 VREG 5 VCC_OUT 10
R306 130
47
8 ANT
FL301
RF3133 U302
VBATT
13MHZ_MIDI C355 1000p 13MHZ
4 6 7 9 12 13 14
TX_ENABLE DCS_OUT 11 BAND_SELECT GND7 GND6 GND5 GND4 GND3 GND2
VC1 VC2
GND1 GND2 GND3 GND4 GND5 GND6 GND7
2p C325 NA L302 4.7nH
BB
12 19
GND1
VCC2
R309
DCS_IN 1
C312 R312 150 10p
VRF
R311 150
18
17
16
15
14
13
36
QP C342 39p QN IP 22 23 24 25 26 27 28 29 30 31 32 C343 39p IN
11 2 SHS-C090DR
C399 22n
C386 22p
C351 2 3 FL302 C387 27p 1

G1 O1 IN G2 O2
1p L303 C352 1p 27nH
B7820 5 4
C
2 3 FL303 1
G1 O1 IN G2 O2
1p L304 C354 1p 7.5nH
SDI SCLK _SEN SDO _PDN VDD1 XIN
C353
21 20 19 18 17 16 15 36 35 34 33
RFIGN RFIGP RFIDN RFIDP RFIPN RFIPP GND1 GND8 GND7 GND6 GND5
RFOD RFOG DIAG1 DIAG2 XEN XOUT RXQP GND2 GND3 GND4 VDD2
U301 SI4205
RXQN RXIP RXIN TXIP TXIN TXQP TXQN
1 2 3 4 5 6 7
VRF
B7821 5 4 L305 33nH C382 10p C383 27p ANT_SW2 GPO_11
14 13 12 11 10 9 8
C341 0.022u C373 100p
C356 22p
VVCXO R314 X301 3 4 GSM_TX DCS_TX RX L H L H L L RF_PWR_DWN C371 2.2u (1608) OUT VCC GND 13MHz 2 C372 1000p 15K R315 AFC AD6535_AFCDAC
L306 C384 33nH 3.3p C385 ANT_SW1 10p GPO_9
ANT_SW1
ANT_SW2
100
D
S_EN S_CLK S_DATA
RF_PWR_DWN GPO_4 S_EN S_CLK S_DATA GPO_19 GPO_21 GPO_20
VREF VRF MIC5255-2.85BM5 U303 5 1 OUT IN 2 GND C363 4 3 BYP EN 0.01u C361 10u VBAT
R316 10K C362 10u R319
RF_TEMP
R317
CLKON
Section Designer
RF BOARD TEMPERATURE
Checked Approved
Date 02/25 2004 02/25 2004 02/25 2004
Sign & Name SEO D. H. KIM S. C. CHO B.K. MODEL
C1100 (GB-1E)
Sheet/Sheets 3/4
DRAWING NAME
RF(AERO1)
Iss.
1 2 3 4 5
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
REV. 1.0
LG Electronics Inc.
LGIC(42)-A-5505-10:01
- 103 -
8. CIRCUIT DIAGRAM
10
AA
VMEM
YMU759B
R401 13MHZ_MIDI MIDI_RESET ADD00 RD MIDI_CS 0 CLK1 _RST 30 A0 31 _RD 29 5 _CS IFSEL 28 3 27 26 25 24 23 22 21 20 R408 3.3K 6 1000p Type Part U401 C402 0.1u 9 16Poly YMU759B 10K 10K 40Ploy YMU762 NA 0 C403 R412 10K 32 R413 0 R403 R412 0.1u 8 7 VDD VSS SDOUT VREF PLLC _WR _IRQ D0 D1 D2 D3 D4 D5 D6 D7 1 4
U401
11 10 C404 12 0.01u EQ2 13 C405 100p EQ3 EXT1 EXT2 14 2 19 R417 R402 39K C409 R404 0 150K SPKN NA R406 SPKP NA SPOUT1 17 VBAT SPOUT2 R407 0 R409 18 R410 0 SPVDD 15 C408 0.1u RECP 4.7 R416 RECN 4.7 C411 C412 47p 47p R415 100K 0 C406 C407 Closed to Analog SW 47p 47p
HPOUT_R HPOUT_L EQ1
VMEM
BB
R403 10K
39p

10
SPK_REC_N
C410
47p
SPK_REC_P 16 R414 SPK_RCV_SEL
SPVSS
(16 Poly MIDI)
Section Designer
E
Checked Approved
Date 02/25 2004 02/25 2004 02/25 2004
Sign & Name PARK S.J. KIM Y. T. KIM S.K. CHO B.K. MODEL
C1100 (GB-1E) MIDI
Sheet/Sheets 4/4
DRAWING NAME
Iss.
1 2 3 4 5
Notice No.
Date
Name
LG Electronics Inc.
DRAWING NO.
REV. 1.0
LG Electronics Inc.
LGIC(42)-A-5505-10:01
- 104 -
9. PCB LAYOUT
9. PCB LAYOUT
- 105 -
9. PCB LAYOUT
- 106 -
10. ENGINEERING MODE

A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press select key to progress the test. Pressing back key will switch back to the original test menu.
D. Engineering Mode Menu Tree
Engineering Mode
Trace BB Test RF Test MF Mode option Call Timer
Fact. Reset
S/W Version
LED LCD Backlight Buzzer Vibrator ADC Battery Audio DAI
SAR Test
All Auto Test LED Backlight Buzzer Vibrator LCD Key pad MicSpkTest
UART On UART Off
All Calls Reset
- 107 -
10.1 BB Test [MENU 1]

Baseband Test
10.1.1 LCD
Contrast value : This menu is to test Main LCD contrast. - Contrast Value [10-50] : Change this value by up and down key. Sub LCD Contrast : This menu is to test Sub LCD contrast. - Contrast Value [0-50] : Change this value by up and down key.
10.1.2 Backlight [1-2]

This menu is to test the LCD Backlight and Keypad Backlight. Backlight On Backlight Off Backlight value : LCD Backlight and Keypad Backlight light on at the same time. : LCD Backlight and Keypad Backlight light off at the same time. : This controls brightness of Backlight. When entering into the menu, the present backlight-value in the phone is displayed. Use Left / Right key to adjust the level of brightness. The value of the brightness set at last will be saved in the NVRAM.
10.1.3 Buzzer
This menu is to test the melody sound. Melody on Melody off : Melody sound is played through the speaker. : Melody sound is off.
10.1.4 Vibrator
This menu is to test the vibration mode. Vibrator On Vibrator Off : Vibration mode is on. : Vibration mode is off.
10.1.5 ADC (Analog to Digital Converter)

This displays the value of each ADC. MVBAT ADC (Main Voltage Battery ADC) AUX ADC (Auxiliary ADC) TEMPER ADC (Temperature ADC)
10.1.6 BATTERY
Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order; BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT TEMP Cal : This displays the value of Temperature Calibration. The following menus are displayed in order; TEMP_HIGH_LIMIT, TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
- 108 -
10.1.7 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off and on the phone. VbControl1 VbControl2 VbControl3 VbControl4 VbControl5 VbControl6 : VbControl1 bit Register Value Setting : VbControl2 bit Register Value Setting : VbControl3 bit Register Value Setting : VbControl4 bit Register Value Setting : VbControl5 bit Register Value Setting : VbControl6 bit Register Value Setting
10.1.8 DAI (Digital Audio Interface)

This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. DAI AUDIO DAI UPLINK DAI DOWNLINK DAI OFF : DAI audio mode : Speech encoder test : Speech decoder test : DAI mode off
10.2 RF Test [MENU 2]

Radio Frequency Test
10.2.1 SAR test

This menu is to test the Specific Absorption Rate. SAR Test On SAR Test Off : Phone continuously process TX only. Call-setup equipment is not required. : TX process off
10.3 MF Mode [MENU 3]

This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.
10.3.1 All auto test

LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
10.3.2 LED
LCD Backlight and LED Backlight are on for about 1.5 seconds at the same time, then off.
10.3.3 Backlight
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
10.3.4 Buzzer
Vibrator is on for about 1.5 seconds.
- 109 -
10.3.5 Vibrator
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
10.3.6 LCD
When a pop-up message shows Press Any Key, you may press any keys including side keys, but not [Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be completed in 15 seconds automatically.
10.3.7 Key pad

Sub LCD screen resolution tests horizontally one by one and fills the screen.
10.3.8 MicSpkTest
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically
10.4 Trace option [MENU 4]

This is NOT a necessary menu to be used by neither engineers nor users.
10.5 Call timer [MENU 5]

This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. All calls Reset settings DAI OFF : This displays total conversation time. User cannot reset this value. : This resets total conversation time to this, [00:00:00]. : DAI mode off
DAI DOWNLINK : Speech decoder test
10.6 Fact. Reset [MENU 6]

This Factory Reset menu is to format data block in the flash memory and this procedure set up the default value in data block. Attention - Fact. Reset (i.e. Factory Reset) should be only used during the Manufacturing process. - Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting value, RF Calibration data, etc. cannot be restored again.
10.7 S/W version

This displays software version stored in the phone.
- 110 -
11. STAND ALONE TEST

11.1 Introduction
This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B. Rx Test RX test - this is to see if the receiver of the phones is activating normally.
11.2 Setting Method

A. COM port a. Move your mouse on the Connect button, then click the right button of the mouse and select Com setting. b. In the Dialog Menu, select the values as explained below. - Port : select a correct COM port - Baudrate : 38400 - Leave the rest as default values B. Tx 1. Selecting Channel - Select one of GSM or DCS Band and input appropriate channel. 2. Selecting APC a. Select either Power level or Scaling Factor. b. Power level - Input appropriate value GSM (between 5~19) or DCS (between 0~15) c. Scaling Factor - A Ramp Factor appears on the screen. - You may adjust the shape of the Ramp or directly input the values. C. Rx 1. Selecting Channel - Select one of GSM or DCS Band and input appropriate channel. 2. Gain Control Index (0~ 26) and RSSI level - See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain Control Index. - Normal phone should indicate the value of RSSI close to -16dBm.
- 111 -
11.3 HW Test : Software for Standalone Test Setup

a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button
Figure 11-1. HW test program
- 112 -
Figure 11-1. HW test program
Figure 11-1. HW test program - 113 -
12. AUTO CALIBRATION

12.1 Overview
Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
12.2. Requirements
- PC or Notebook installed with Microsoft Windows 98/ME/2000/XP - Auto Calibration program(Autocal.exe) - GSM Phone - LGE PIF JIG, Serial Cable, Data Cable - Agilent 8960(Call Setting Instrument) - Tektronix PS2521G(Programmable Power Supply)
12.3 Equipment Setup

- File(F) Clear View - File(F) Save View - File(F) Save Setting - File(F) Load Setting - File(F) Make BIN ALL : Clear Calibration Status window texts : Save Calibration Status window texts : Save Current Calibration settings to setting file(*.cal) : Load saved Calibration setting : Make binary file after calibration finished
- File(F) Make BIN BAT.Cal only : Make binary file of battery cal data only after calibration finished - File(F) Make & Write BIN - View(V) Tools - View(V) Status - Connection(C) Connect : Make binary file after calibration finished then download it to the Flash Memory : Enable or disable Tool bar : Enable or disable status bar : Connect the phone with PC. This procedure checks whether the PC is connected ag8960 or not. After that it performs sync. procedure with phone. If the sync. procedure is successful state column on status bar changed to SETUP, else you should disconnect phone and try again from the beginning and also check the whole connection. All measurement is performed at state SETUP. : Show COM port setting dialog and Baudrate you can change,etc. : Connect the Ag8960 GPIB card with PC.
- Connection(C) Port Setting - GPIB(G) Connect
- 114 -
Figure 12-1. Equipment Setup Screen Cable loss Screen GPIB(Primary address) Screen ADC Channel Screen Auto Calibration Item : Enter the RF cable loss GSM and DCS : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address : Default ADC Calibration Channel : Default Calibration Settings about Tx, Rx, ADC and write BIN file
- 115 -
12.4 AGC
This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
12.5 APC
This procedure is for Tx calibration. In this procedure you can get proper scale factor value and measured power level.
12.6 ADC
This procedure is for battery calibration. You can get main Battery Config Table and temperature Config Table
12.7 Setting
Check com port and cable loss. Select automatic calibration item. If you uncheck one item calibration will stop from the unchecked item. This is useful when you want to process only one item.
12.8 How to do calibration

A. Connect cable between phone and serial port of PC. B. Connect Ag8960 equipment and Power Supply and phone. C. Set correct port and baud rate. D. Press Start button. AutoCal process all calibration procedure i. AGC EGSM ii. AGC DCS iii. APC EGSM iv. APC DCS v. ADC E. After finished all measurement. The state is return to SETUP. F. The Cal file will be generated and then the calibration data will be written into phone and then will be reset.
- 116 -

13.1 EXPLODED VIEW
- 117 -
Note.
- 118 -
13.2 Replacement Parts

<Mechanic component>
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level 1 2 3 4 5 5 5 5 5 5 4 5 5 5 5 5 5 5 5 5 5 4 5 5 5 5 5 5 5 5 4 5 5 4 4 4 4 4 4 4 3 4 4 4 4 4 4 4 4 4 4 3 3 3 3 3 Location No. APEY00 ACGG00 ACGH00 MCJH00 MFBC00 MMAA00 MPBF00 MPBG00 MTAD00 ACGJ00 MCJJ00 MDAM00 MGAD00 MGAD01 MICA00 MPBZ00 MSAZ00 MTAA00 MTAB00 MTAE00 ACGK00 MBHY00 MBHY01 MBJL00 MCJK00 MICA00 MPBZ00 MSGY00 MTAZ00 AWAB00 BFAA00 MWAC00 GMZZ00 MCCH00 MHFD00 MIDZ00 MLAC00 MTAB00 MWAD00 ACGM00 MCCC00 MCIA00 MCJN00 MGAD00 MGAD01 MGAD02 MLEA00 MPBH00 MSDC00 SNGF00 ADCA00 AKAZ00 GMZZ00 MCCF00 MLAK00 Description GSM(FOLDER) PHONE COVER ASSY,FOLDER COVER ASSY, FOLDER(LOWER) COVER,FOLDER(LOWER) FILTER,SPEAKER MAGNET,SWITCH PAD,FLEXIBLE PCB PAD,LCD TAPE,WINDOW COVER ASSY, FOLDER(UPPER) COVER,FOLDER(UPPER) DECO,WINDOW(SUB) GASKET,SHIELD FORM GASKET,SHIELD FORM INSERT,FRONT PAD SHEET TAPE,DECO TAPE,PROTECTION TAPE,WINDOW(SUB) COVER ASSY,FRONT BUMPER BUMPER BUTTON,SIDE COVER,FRONT INSERT,FRONT PAD STOPPER TAPE WINDOW ASSY,LCD FILM,INMOLD WINDOW,LCD SCREW MACHINE CAP,SCREW HINGE,FOLDER INSULATOR LABEL,BARCODE TAPE,PROTECTION WINDOW,LED COVER ASSY,REAR CAP,EARPHONE JACK CONTACT,ANTENNA COVER,REAR GASKET,SHIELD FORM GASKET,SHIELD FORM GASKET,SHIELD FORM LOCKER,BATTERY PAD,MIKE SPRING,LOCKER ANTENNA,GSM,FIXED DOME ASSY,METAL KEYPAD ASSY SCREW MACHINE CAP,MOBILE SWITCH LABEL,MODEL Part Number TGFF0033001 APEY0131001 ACGG0037701 ACGH0020701 MCJH0016501 MFBC0008101 MMAA0000601 MPBF0005601 MPBG0021101 MTAD0022201 ACGJ0029801 MCJJ0022501 MDAM0005001 MGAD0049601 MGAD0049901 MICA0001201 MPBZ0042501 MSAZ0013401 MTAA0047201 MTAB0042401 MTAE0014901 ACGK0032501 MBHY0008401 MBHY0008501 MBJL0011601 MCJK0023101 MICA0006001 MPBZ0050701 MSGY0004901 MTAZ0036001 AWAB0009701 BFAA0015901 MWAC0036601 GMZZ0009402 MCCH0021501 MHFD0005901 MIDZ0041401 MLAC0003401 MTAB0042601 MWAD0003501 ACGM0029801 MCCC0013501 MCIA0010901 MCJN0019801 MGAD0045801 MGAD0049001 MGAD0049301 MLEA0015201 MPBH0007501 MSDC0001901 SNGF0003701 ADCA0017101 AKAZ0004502 GMZZ0009402 MCCF0013401 MLAK0006901 Specification C1100 ORUSV C1100 ORUSV C1100 ORUSV Main Window Tape 0.1t C1300 CGRSV C1300 CGRSV ELLIPSE 0.1t LG-G510,511,512 common use, DIA : 3.0mm+1.5t C1300 CGRSV 26 X 5 X 3.5 t C1300 CGRSV 35.6 X 39.3 X 0.7 t C1300 CGRSV 0.1 t C1100 ORUSV C1100 ORUSV C1100 ORUSV 0.2t C1300 CGRSV 4 x 8 x 1.5 t C1300 CGRSV 5.2 X 5.2 X 1.8 t LG-G510,511,512 common use, DIA = 1.7mm+2.3t C1300 CGRSV 1.0 t C1200 TMDBD, Dx=11.3, Dy=7.3, t<0.2mm C1100 ORUSV 0.2t C1300 CGRSV Upper Protection 38 X 68 X 0.07t C1100 ORUSV 0.16t C1100 ORUSV C1300 CGRSV 4.4 X 1.9 C1300 CGRSV 4.4 X 1.9, 5.2 PI for MIKE C1300 CGRSV Chrome Plating C1100 ORUSV G7030,M1.4 x L2.5, Outside Diameter 2.0 C1300 CGRSV 2.0 X 2.0 X 0.5t C1300 CGRSV 8.9 X 2.6 C1300 CGRSV 20 X 4 X 0.05t C1100 ONLY LG LOGO C1100 EUASV Main Window Inmold Film C1100 ORUSV 1.0t C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR C1300 CGRSV 3.1PI Pi5.8, 5Kgf, CAN Type, Prexco(Head R1.0), Click Hinge C1300 CGRSV 9 X 5.5 X 0.05t EZ LOOKS(user for mechanical) C1300 CGRSV Main Window Protection 41 X 65 X 0.15t C1100 ORUSV 0.8t C1100 ORUSV C1300 CGRSV 6.2PI C1300 CGRSV 4.75pi X 3.85h C1100 ORUSV CE0700 carved C1300 CGRSV 11 X 2.8 X 0.4t C1300 CGRSV 6.5 X 2.8 X 0.35t C1100 ORUSV 9 X 2.5 X 0.45t C1300 CGRSV C1300 CGRSV 3.2 PI 1.0t diameter 5X1.6 3.0 ,-2 dBd,SILVER ,GSM+DCN,C1100+C1200 C1300 CGRSV D-Dimple 4.9 or 5.0 PI C1100 ORUSV menu EMI Applied C1300 CGRSV 1.4 mm, 3.0 mm, Head DIA 2.7, 1.2t, STAR C1300 CGRSV 3 PI, 5.2 PI Color Silver Silver Silver Dark Gray Dark Gray Black Silver Black Black Silver Silver Silver Gold Gold Black White Remark
7 6 10 9 8 5 20 24 17 18 19 21 23 26 22 48 47 44 46
Silver Silver Silver Silver Silver Yellow Black Silver Blue Silver Silver Silver Silver Dark Gray Deep Silver Blue
49 4
2 41 15 1 25 32 31 33 35 36 37 30 34 29 28 40 42 3 27
Cyber Mirror Silver Silver Gold Silver Gold Gold Gold Silver Black
White Silver Silver Silver
- 119 -
<Main component>
Level 4 5 6 6 6 6 6 6 6 6 6 6 4 4 4 4 3 4 4 4 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Location No. SACY00 SACA00 C1 C2 CN1 CN2 LD1 R1 R2 R3 R4 SPCY00 SBCL00 SJMY00 SUSY00 SVLY00 SAFY00 MLAB MLAC00 SAFA00 C101 C102 C103 C104 C105 C106 C107 C108 C111 C112 C115 C116 C117 C123 C124 C131 C132 C133 C134 C135 C136 C137 C139 C140 C143 C144 C146 C147 C148 C149 C151 C152 C153 C154 C155 C156 C157 C160 C161 C162 C163 C165 C167 C168 C170 C171 C177 C178 Description PCB ASSY,FLEXIBLE PCB ASSY, FLEXIBLE,AUTO CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD DIODE,LED,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP PCB,FLEXIBLE BATTERY,CELL,LITHIUM VIBRATOR,MOTOR SPEAKER LCD PCB ASSY,MAIN LABEL,A/S LABEL,BARCODE PCB ASSY,MAIN,AUTO CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP Part Number SACY0017002 SACA0000801 ECCH0000117 ECCH0000182 ENBY0013401 ENBY0018701 EDLH0003401 ERHY0000261 ERHY0000172 ERHY0000220 ERHY0000280 SPCY0032001 SBCL0001303 SJMY0002802 SUSY0006207 SVLY0018801 SAFY0097701 MLAB0000601 MLAC0003301 SAFA0034201 ECCH0004903 ECCH0000182 ECCH0004903 ECCH0000182 ECCH0000115 ECCH0000115 ECCH0000182 ECCH0000163 ECCH0000110 ECCH0000182 ECCH0001811 ECCH0000143 ECCH0000182 ECCH0000120 ECCH0000182 ECTH0001901 ECCH0000163 ECTH0001901 ECTH0001901 ECTH0001901 ECTH0001901 ECTH0001901 ECCH0006201 ECCH0000182 ECCH0004904 ECCH0000155 ECTZ0002601 ECCH0000115 ECCH0000163 ECCH0000120 ECCH0000167 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000276 ECCH0000182 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000113 ECCH0000128 ECCH0000128 ECCH0000120 ECCH0000120 Specification Color Remark 14
27 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G5400 41 PIN,0.3 mm,ETC ,AU , RED, GREEN ,ETC ,R/TP ,SIZE 1315 , GSM DUAL LED 10K ohm,1/16W,J,1005,R/TP 68 ohm,1/16W ,F ,1005 ,R/TP 100 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP POLYI ,45 mm,DOUBLE , 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY 3 V,0.08 A,12*15 ,G5300 VIBRATOR (0.5t PAD) ASSY ,8 ohm,92 dB,17 mm,5T C1100 EUASV HUMIDITY STICKER EZ LOOKS(use for PCB ASSY MAIN(hardware)) C1100 ORUSV 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 uF,10V ,M ,STD ,2125 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,6.3V,K,X5R,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP
13 12 11 16 38
- 120 -
Level 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
Location No. C179 C181 C182 C183 C184 C185 C186 C187 C188 C191 C192 C193 C195 C196 C201 C202 C203 C211 C212 C213 C214 C215 C216 C217 C218 C219 C220 C221 C222 C223 C224 C225 C226 C227 C231 C232 C233 C234 C235 C236 C237 C238 C239 C240 C241 C242 C243 C244 C245 C246 C247 C248 C251 C252 C254 C255 C256 C257 C258 C259 C260 C261 C262 C267 C268 C269 C271 C272
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0000120 ECCH0000276 ECCH0000167 ECCH0000115 ECCH0000276 ECCH0000165 ECCH0000120 ECCH0003401 ECCH0000182 ECCH0000128 ECCH0000128 ECCH0000120 ECCH0000168 ECCH0000120 ECCH0000115 ECCH0004903 ECCH0000182 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000104 ECCH0000120 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0004903 ECCH0004903 ECCH0004903 ECCH0004903 ECCH0000120 ECCH0000120 ECCH0000114 ECCH0000110 ECCH0000113 ECCH0000113
Specification 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 0.1 uF,6.3V,K,X5R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 68 nF,6.3V,K,X5R,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,16V,Z,Y5V,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 20 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP
Color Remark
- 121 -
Level 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
Location No. C273 C274 C275 C276 C277 C278 C290 C298 C299 C301 C302 C311 C312 C316 C317 C321 C322 C323 C326 C331 C341 C342 C343 C344 C345 C350 C351 C352 C353 C354 C355 C356 C361 C362 C363 C371 C372 C373 C375 C382 C383 C384 C385 C386 C387 C389 C399 C401 C402 C403 C404 C405 C406 C407 C408 C409 C410 C411 C412 CN201 CN202 D101 D104 D201 FB1 FL301 FL302 FL303
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD CONNECTOR,I/O DIODE,SWITCHING DIODE,SWITCHING DIODE,SWITCHING FILTER,BEAD,CHIP FILTER,SEPERATOR FILTER,SAW FILTER,SAW
Part Number ECCH0006201 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0004903 ECCH0004903 ECCH0004903 ECTZ0000318 ECCH0000115 ECCH0000186 ECCH0000110 ECCH0000117 ECCH0000117 ECCH0000115 ECCH0000101 ECCH0000101 ECCH0000176 ECCH0000101 ECCH0000159 ECCH0000120 ECCH0000120 ECCH0000110 ECCH0000107 ECCH0000120 ECCH0000102 ECCH0000102 ECCH0000102 ECCH0000102 ECCH0000143 ECCH0000115 ECCH0003401 ECCH0003401 ECCH0000155 ECCH0005801 ECCH0000143 ECCH0000128 ECCH0000128 ECCH0000110 ECCH0000117 ECCH0000171 ECCH0000110 ECCH0000115 ECCH0000117 ECCH0000122 ECCH0000179 ECCH0000143 ECCH0000182 ECCH0000182 ECCH0000155 ECCH0000128 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000120 ECCH0000122 ECCH0000122 ECCH0000122 ENBY0013402 ENRY0002202 EDSY0012101 EDSY0005701 EDSY0012301 SFBH0007101 SFAY0003702 SFSY0021301 SFSY0021302
Specification 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,ETC ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.5 pF,50V,C,NP0,TC,1005,R/TP 0.5 pF,50V,C,NP0,TC,1005,R/TP 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.5 pF,50V,C,NP0,TC,1005,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 pF,50V,C,NP0,TC,1005,R/TP 1 pF,50V,C,NP0,TC,1005,R/TP 1 pF,50V,C,NP0,TC,1005,R/TP 1 pF,50V,C,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 3.3 pF,16V ,J ,NP0 ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 34 PIN,0.4 mm,STRAIGHT ,Au ,B to B G5400 24 PIN,0.5 mm,ETC ,AU ,OFFSET TYPE US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) EMT3 ,80 V,4 A,R/TP , 1-1E1A ,85 V,1 A,R/TP ,P=200mW, IFM=200mA 120 ohm,1005 ,Ferrite Bead 900 ,1800 ,1.3 dB,1.5 dB,30 dB,25 dB,4532 ,Antenna switch 942.5 MHz,2.0*1.4*0.68 ,SMD , 1842.5 MHz,2.0*1.4*0.68 ,SMD ,
Color Remark
- 122 -
Level 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
Location No. J101 J102 L301 L302 L303 L304 L305 L306 L307 L308 LD111 LD112 LD113 LD114 LD115 LD116 LD117 LD118 LD119 LD120 MTCA00 Q103 Q104 Q201 Q202 R102 R103 R107 R108 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 R123 R124 R125 R126 R127 R128 R130 R132 R134 R137 R138 R141 R142 R144 R145 R146 R147 R148 R150 R151 R153 R156 R157 R159 R161 R162 R163
Description CONN,SOCKET CONN,JACK/PLUG, EARPHONE INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP TERMINAL,GROUND TR,FET,P-CHANNEL TR,BJT,ARRAY TR,BJT,ARRAY TR,BJT,ARRAY RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
Part Number ENSY0007607 ENJE0002301 ELCH0001004 ELCH0005013 ELCH0002715 ELCH0002714 ELCH0005006 ELCH0005006 ELCH0001413 ELCH0001009 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 MTCA0001501 EQFP0004201 EQBA0000406 EQBA0000406 EQBA0002701 ERHY0000280 ERHY0000201 ERHY0001102 ERHY0000230 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000125 ERHY0000286 ERHY0000512 ERHY0000201 ERHY0000220 ERHY0000241 ERHY0000247 ERHY0000220 ERHY0000254 ERHY0000220 ERHY0000247 ERHY0000241 ERHY0000247 ERHY0000202 ERHY0000274 ERHY0000296 ERHY0000296 ERHY0000265 ERHY0000291 ERHY0000220 ERHY0000220 ERHY0000280 ERHY0000271 ERHY0000280 ERHY0000116 ERHY0000241 ERHY0000241 ERHY0004101 ERHY0000401
Specification Color Remark 6 PIN,ETC ,BRIDGE NON PROTECTOR TYPE ,2.54 mm,3.0T 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD 8.2 nH,J,1005,R/TP 4.7 nH,S ,1005 ,R/TP , 27 nH,G ,1608 ,R/TP ,coil inductor 7.5 nH,G ,1608 ,R/TP ,coil inductor 33 nH,J ,1005 ,R/TP , 33 nH,J ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP ,CDMA 1.2 nH,S ,1005 ,R/TP , BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T C1300 CGRSV 4.7 X 1.8 X 1.3 (0.3t) Sn Plating Silver 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P upgrade(substitution) item SC-70 ,0.2 W,R/TP ,CDMA,Common use SC-70 ,0.2 W,R/TP ,CDMA,Common use EMT6 ,150 mW,R/TP ,NPN, PNP, 150 mA 100K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0.2 ohm,1/4W ,F ,2012 ,R/TP 330 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,F,1005,R/TP 200K ohm,1/16W,J,1005,R/TP 10M ohm,1/16W,J,1608,R/TP 0 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 2.2K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 4.7K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 2.2K ohm,1/16W,J,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 2.2K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP 1M ohm,1/16W,J,1005,R/TP 1M ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 330K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 39K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 1.5K ohm,1/16W,F,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 49.9 ohm,1/10W ,F ,1608 ,R/TP 0 ohm,1/16W,J,1608,R/TP
- 123 -
Level 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
Location No. R164 R165 R181 R201 R202 R203 R204 R205 R206 R207 R208 R209 R210 R211 R212 R213 R214 R215 R216 R218 R219 R221 R223 R224 R225 R226 R227 R229 R230 R232 R233 R234 R235 R236 R237 R238 R239 R240 R241 R242 R243 R245 R246 R247 R249 R250 R251 R252 R254 R255 R256 R258 R261 R262 R263 R265 R301 R302 R304 R305 R306 R307 R309 R310 R311 R312 R314 R315
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
Part Number ERHY0000241 ERHY0000280 ERHY0000202 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000239 ERHY0000230 ERHY0000230 ERHY0000261 ERHY0000207 ERHY0000273 ERHY0000261 ERHY0000273 ERHY0000273 ERHY0000273 ERHY0000226 ERHY0000261 ERHY0000244 ERHY0000280 ERHY0000280 ERHY0000280 ERHY0000280 ERHY0000213 ERHY0000280 ERHY0000280 ERHY0000213 ERHY0000237 ERHY0000237 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000241 ERHY0000263 ERHY0000220 ERHY0000220 ERHY0000213 ERHY0004301 ERHY0004301 ERHY0006603 ERHY0000201 ERHY0000223 ERHY0000223 ERHY0000220 ERHY0000263
Specification 1K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 330 ohm,1/16W,J,1005,R/TP 330 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 20 ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 220 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 1.5K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 15K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 36 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W,J,1005,R/TP 150 ohm,1/16W,J,1005,R/TP 150 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 15K ohm,1/16W,J,1005,R/TP
Color Remark
- 124 -
Level 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 3 2
Location No. R316 R317 R319 R401 R402 R403 R404 R407 R408 R409 R410 R412 R413 R414 R415 R416 R417 SPFY00 SW1 SW2 SW301 TC151 TC153 U101 U102 U103 U104 U105 U201 U203 U301 U302 U303 U401 U402 VA151 VA152 VA153 VA154 VA165 VA201 VA202 VA203 VA204 VA205 VA206 VA207 X101 X301 SUMY00 MHBY00
Description RES,CHIP RES,CHIP THERMISTOR RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP PCB,MAIN SWITCH,TACT SWITCH,TACT CONN,RF SWITCH CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP,MAKER IC IC IC IC IC IC IC IC PAM IC IC IC RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC VARISTOR RES,VARIABLE,ETC RES,VARIABLE,ETC VARISTOR VARISTOR RES,VARIABLE,ETC VARISTOR VARISTOR X-TAL VCTCXO MICROPHONE HANDSTRAP
Part Number ERHY0000125 ERHY0000201 SETY0001201 ERHY0000201 ERHY0000271 ERHY0000261 ERHY0000201 ERHY0000201 ERHY0000250 ERHY0000201 ERHY0000201 ERHY0000261 ERHY0000201 ERHY0000202 ERHY0000280 ERHY0000202 ERHY0000284 SPFY0072101 ESCY0002501 ESCY0002501 ENWY0003001 ECTZ0005201 ECTZ0005201 EUSY0157001 EUSY0169301 EUSY0129502 EUSY0077701 EUSY0077301 EUSY0145401 EUSY0178201 EUSY0161301 SMPY0004001 EUSY0118602 EUSY0098501 EUSY0119001 ERVZ0000101 ERVZ0000101 ERVZ0000101 ERVZ0000101 SEVY0000702 ERVZ0000101 ERVZ0000101 SEVY0000702 SEVY0000702 ERVZ0000101 SEVY0000702 SEVY0000702 EXXY0015601 EXSK0000801 SUMY0003803 MHBY0001101
Specification 10K ohm,1/16W,F,1005,R/TP 0 ohm,1/16W,J,1005,R/TP NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES 0 ohm,1/16W,J,1005,R/TP 39K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 3.3K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 150K ohm,1/16W,J,1005,R/TP FR-4 ,1.00 mm,BUILD-UP 8 , 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP LFBGA ,160 PIN,R/TP ,DIGITAL BASEBAND PROCESSOR 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG BASEBAND / TYPHOON B LEADLESS CHIP ,6 PIN,R/TP ,HALL-EFFECT SWITCH IC / 2.0*3.0*0.8 SC70-5 ,5 PIN,R/TP , SC70-6/SOT23-6 ,6 PIN,R/TP , P-FBGA73 ,73 PIN,R/TP ,128M FLASH 32M PSRAM / BOTTOM BOOT / CE 2 PCS TSOPJW-12 ,12 PIN,R/TP ,CHARGE PUMP FOR WHITE LED / MAX - 6 LEDS 8x8 LGA ,28 PIN,R/TP , 35 dBm,55 %,2 A,-50 dBc,25 dB,10.0 * 7.0 * 1.4 ,SMD , SOT-23-5 ,5 PIN,R/TP ,150mA LOW NOISE uCAP CMOS LDO 32-PIN QFN ,32 PIN,R/TP ,MA-2 / UP TO 16 VOICES / FM SYNTHESIZER 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCHES ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V,10% ,SMD , ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V,10% ,SMD , 14 V,10% ,SMD , ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V,10% ,SMD , 14 V,10% ,SMD , .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 , 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 , PIN ,42 dB,4*1.5 ,FPCB Neck Strap 380mm
Color Remark
39 Gray
- 125 -
13.3 Accessory
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Level 2 2 2 Location No. SBPL00 SGEY00 SSAD00 Description BATTERY PACK,LI-ION EAR PHONE/EAR MIKE SET ADAPTOR,AC-DC Part Number SBPL0072128 SGEY0003203 SSAD0007835 Specification 3.7 V,760 mAh,1 CELL,PRISMATIC ,C1100 BATTERY(SV) G4050 G4010 For USA ,3 POLE Design change FREE ,50 Hz,5.2 V,800 mA,CE,CB ,UK(IO.24P) Color Silver Remark
- 126 -

Mobile Phone LG C1100 Service Manual

Hochgeladen von

Dokumentinformationen

Copyright

Verfügbare Formate

Dieses Dokument teilen

Dokument teilen oder einbetten

Freigabeoptionen

Stufen Sie dieses Dokument als nützlich ein?

Sind diese Inhalte unangemessen?

Copyright:

Verfügbare Formate

Mobile Phone LG C1100 Service Manual

Hochgeladen von

Copyright:

Verfügbare Formate

Service Manual

Service Manual C1100

Date : June, 2004 / Issue 1.0

5. DISASSEMBLY INSTRUCTION ... 82

6. DOWNLOAD AND CALIBRATION ............................. 90

3. TECHNICAL BRIEF ......................... 11

10. ENGINEERING MODE ................ 107

11. STAND ALONE TEST .................. 111

4. TROUBLE SHOOTING ................... 43

12. AUTO CALIBRATION .................. 114

13. EXPLODED VIEW & REPLACEMENT PART LIST

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

2.2 Technical Specification

Description GSM, EGSM

Max. dBc +0.5 30 33 60 60 60 63 65 71

Max. dBc +0.5 30 33 60 60 60 65 65 73

Description GSM, EGSM

Bit Error Rate

RX Level Report Accuracy SLR

1,000 2,000 3,000 3,400 4,000

2 3 dB Frequency (Hz) 100 200 300 500

1,000 3,000 3,400 4,000

Description Ringer Volume

3 2 1 0 Battery Bar Number 0 1 2 3

Low Voltage Warning Forced shut down Voltage

3.5 3.62 3.35

0.03V (Standby) 0.03V (Call) 0.03V

Figure 3-1. RECEIVER FUNCTIONAL BLOCK DIAGRAM

(1) Receiver Part

Figure 3-2. SI4205 RECEIVER PART

B. Intermediate frequency (IF) and Demodulation

(2) Transmitter Part

REG RFOG REG RFOD 1,2

TXIP I TXIN TXQP Q

Figure 3-3. SI4205 TRANSMITTER PART

(3) Frequency Synthesizer

3.2 Power Amplifier Module (RF3133, U302)

Figure 3-5. FUNCTIONAL BLOCK DIAGRAM OF RF3133

3.3 13MHz Clock (VCTCXO, X301)

Figure 3-6. VCTCXO CIRCUIT DIAGRAM

3.4 Power Supplies for RF Circuits (RF LDO, U303)

VRF MIC5255-2.85BM5 U303 5 1 OUT IN 2 C363 GND 4 3 BYP EN 0.01u

Figure 3-7. RF LDO CIRCUIT DIAGRAM

3.5 Digital Main Processor (AD6525, U101)

Backlight Service light

SRAM 8 or 16 bit (optional)

Universal System Connector (USC)

DISPLAY (parallel or serial)

VDDIO VDDCORE GNDIO GNDCORE ASDO ASFS ASDI

ASDI ASDFS ASDO

Control Serial Port

BSDI BSIFS BSDO BSOFS

RX/TX I/Q Serial Port

VSDI VSDO VSFS MCLK oe MCLK RESET

VOICE DATA Serial Port

Figure 3-8. SYSTEM INTERCONECTION OF AD6525 EXTERNAL INTERFACE

AD6525 is an ADI designed processor. AD6525 consists of 1. BUS arbitration Subsystem

3.5.1 Interconnection with external devices

B. LCD module interface

C117 0.1u C115 220n

SIM_DATA VA165 AVL14K02200