IC Logic Families Introduction to IC: - Miniature, low-cost electronics circuits whose components are fabricated on a single, continuous piece

of semiconductor material to perform a high-level function. - Usually referred to as a monolithic IC. - First introduced in 1958 - Categorized as digital or linear ICs or according to the level of complexity of the IC Category Number of Gates: Small scale integration SSI (<12) Medium scale integration MSI (12 to 99) Large scale integration LSI (100 to 9999) Very large scale integration VLSI (10,000 or more) Classifications of IC logic families: Digital ICs are classified not only by their logic operation, but also by the specific logic-circuit family to which they belong. Each logic family has its own basic electronic circuit upon which more complex digital circuits and functions are developed. The main families are: TTL (Transistor-Transistor Logic), made of bipolar transistors. CMOS (Complementary Metal Oxide Semiconductor) made from MOSFETs ECL (Emitter Coupled Logic) for extremely high speeds NMOS, PMOS for VLSI large scale integrated circuits. IIL integrated injection logic.

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Packaging: 1. Protect the chip from mechanical damage and chemical contamination. 2. Provides a completed unit large enough to handle. 3. It is large enough for electrical connections to be made. 4. Material is molded plastic, epoxy, resin, or silicone. Ceramic used if higher thermal dissipation capabilities required. Metal/glass used in special cases. Three most common packages for ICs are: a) dual-in-line (DIPS) (most common) b) flat pack c) axial lead (TO5)

Properties of Digital ICs: 1) Fan-in Fan-in (input load factor) is the number of input signals that can be connected to a gate without causing it to operate outside its intended operating range. It is expressed in terms of standard inputs or units loads (ULs). 2) Fan-out Fan-out (output load factor) is the maximum number of inputs that can be driven by a logic gate and it is expressed by a number. A fan-out of 10 means that 10 unit loads can be driven by the gate while still maintaining the output voltage within specifications for logic levels 0 and 1. 3) Noise Margin Noise margin is the ability of the gate to tolerate fluctuations of the voltage levels. It means that the maximum noise voltage added to the input signal of a digital circuit that does not cause an undesirable change in the circuit output. 4) Power Dissipation Power dissipation is the amount of heat (in milliwatts, mW) that the IC dissipates in the form of heat. 5) Propagation Delays. Propagation delay is the delay before a change in the input is reflected in the output. It is the average transition delay time for a signal to propagate from input to output when the binary signals change in value.

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 tPHL : delay time in going from logic 1 to logic 0 (turn-off delay). tPLH : delay time in going from logic 0 to logic 1(turn-on delay). 6) Speed-Power product (SPP): This parameter of speed-power product can be used as a measure of the performance of a logic circuit. The SPP of a logic circuit is the product of the propagation delay time and the power dissipation and is expressed in joules (J), which is the unit of energy. The formula is SPP = tP PD Clearly a low value of SPP is desirable. Characteristics of TTL: - most popular and widely used IC logic family. - introduced by Texas Instruments in 1964. - operate from a +5V supply. - Standardized labeling system starting with 54 or 74. For example 7400, 7401, 74121 - A HIGH is nominally +5V while a LOW is nominally 0V or GROUND. - to provide greater flexibility with regard to speed and power dissipation considerations, the following sub-families have been developed: 7400 standard series. 74L00 low-power series 74H00 high-speed series 74S00 Schottky series 74LS00 low-power Schottky series.

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Table-1: Typical characteristics of IC logic families: IC logic family Standard TTL Schottky TTL ECL CMOS Fan-out 10 10 25 50 Power Propagation Dissipation(mW) delay(ns) 10 10 22 25 0.1 3 2 25 Noise margin(V) 0.4 0.4 0.2 3

Comparison between CMOS & Bipolar Technology: CMOS Technology 1) Low static power dissipation 2) High input impedance (low drive current) 3) High packing density (require less area) 4) Low output drive current 5) Bidirectional capability (drain and source are interchangeable) 6) A wide range of supply voltages (typically 3 to 18 volts) 7) Not applicable for high-speed operation due to high propagation delay Bipolar Technology 1) High static power dissipation 2) Low input impedance (high drive current) 3) Low packing density 4) High output drive current 5) Essentially unidirectional 6) A small range of supply voltages (+5 volts) 7) Applicable for high-speed operation due to low propagation delay

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