Beruflich Dokumente
Kultur Dokumente
Features
a a a a a a a a For surface mounted application Metal to silicon rectifier, majority carrier conduction Low forward voltage drop Easy pick and place High surge current capability Plastic material used carriers Underwriters Laboratory Classification 94V-0 Epitaxial construction High temperature soldering: o 260 C / 10 seconds at terminals
.062(1.58) .050(1.27)
SMA/DO-214AC
.111(2.83) .090(2.29)
.187(4.75) .160(4.06)
Mechanical Data
a a a a a Case: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Packaging: 16mm tape per EIA STD RS-481 Weight: 0.21 gram
.103(2.61) .078(1.99)
.056(1.41) .035(0.90)
33A 30 21 30
34A 40 28 40
35A 50 35 50 3.0
SK 36A 60 42 60
Units
V V V A
20 14 20
A V mA +/W +/W + +
Typical Thermal Resistance ( Note 2 ) Operating Temperature Range Storage Temperature Range
Notes: 1. Pulse Test with PW=300 usec, 1% Duty Cycle 2. Measured onP.C.Board wi th 0.2 x 0.2 (5 x 5mm) Copper Pad Areas.
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RESISTIVE OR INDUCTIVELOAD
SK
120
2.0
35
SK 32 A-S K3 4A
A-S K3 10 A
90
SK 39A
1.0
60
-SK
310
30
PCB MOUNTED ON 0.2X0.2" (5.0X5.0mm)COPPER PAD AREAS 0 50 60 70 80 90 100 110 120 LEAD TEMP ERATURE.( C) 130 140 150 160
SK32A -SK36 A
100
SK
32
10.0
K3
SK
5A
SK
39
K -S
31
0A
A-
SK
36
34
TA=125 C
1.0
1.0
TA=75 C 0.1
0.1
0.01 TA=25 C
0.01 0
JUNCTION CAPACITANCE.(pF)
SK SK 35
32
A-S
10.0
K3
4A
100
SK 39
A-S
K3
6A
A-S
K3
10
10
.1
10
100
0.1 0.01
0.1
10
100
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This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.