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DATA SHEET
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The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications The IC06 74HC/HCT/HCU/HCMOS Logic Package Information The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
Philips Semiconductors
Product specication
74HC7014
TYPICAL
UNIT V V pF pF
3.0
mA
Notes to the quick reference data 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz. fo = output frequency in MHz. CL = output load capacitance in pF. VCC = supply voltage in V. (CL VCC2 fo) = sum of outputs. 2. For HC the condition is VI = GND to VCC. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS 14 14 PIN POSITION DIP SO MATERIAL plastic plastic CODE SOT27-1 SOT108-1
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
TEST CONDITIONS VCC (V) 3.00 4.75 5.00 5.25 6.00 3.00 4.75 5.00 5.25 6.00 3.00 4.75 5.00 5.25 6.00 6.0 3.0 to 6.0 3.00 5.25 6.00 VCC or GND 16 V or GND VI (V) OTHER
MIN. TYP. MAX. MIN. MAX. MIN. 1.86 2.94 3.10 3.25 3.72 1.74 2.76 2.90 3.05 3.48 120 180 200 210 240 1.95 3.08 3.25 3.41 3.90 1.95 3.08 3.25 3.41 3.90
VT+
positive-going threshold
Figs.6 and 7
VT
negative-going threshold
Figs.6 and 7
VH
mV
Figs.6 and 7
ICC
mA
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
TEST CONDITIONS VCC (V) 3.00 4.75 6.00 3.00 4.75 6.00 3.00 4.75 6.00 WAVEFORMS
Fig.8
tPLH
ns
Fig.8
tTHL/tTLH
ns
Fig.8
Fig.7
AC WAVEFORMS
(1)
Fig.8 Waveforms showing the input (nA) to output (nY) propagation delay and the output transition times.
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
SOT27-1
D seating plane
ME
A2
A1
c Z e b1 b 14 8 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001AA EIAJ EUROPEAN PROJECTION
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
SOT108-1
A X
c y HE v M A
Z 14 8
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
8 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06S JEDEC MS-012AB EIAJ EUROPEAN PROJECTION
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Jul 08
Philips Semiconductors
Product specication
74HC7014
This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Jul 08