Beruflich Dokumente
Kultur Dokumente
DIR A1 A2 A3 A4 A5 A6 A7 A8 GND
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
VCC OE B1 B2 B3 B4 B5 B6 B7 B8
A2 A1 DIR VCC OE A3 A4 A5 A6 A7
4 5 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13
B1 B2 B3 B4 B5
description/ordering information
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. ORDERING INFORMATION
TA PDIP N SOIC DW 40C to 85C 40 SOP NS SSOP DB PACKAGE Tube of 20 Tube of 25 Reel of 2000 Reel of 2000 Reel of 2000 Tube of 70 TSSOP PW CDIP J 55C to 125C
ORDERABLE PART NUMBER SN74HC245N SN74HC245DW SN74HC245DWR SN74HC245NSR SN74HC245DBR SN74HC245PW SN74HC245PWR SN74HC245PWT SNJ54HC245J SNJ54HC245W SNJ54HC245FK
CFP W LCCC FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
A8 GND B8 B7 B6
TOP-SIDE MARKING SN74HC245N HC245 HC245 HC245 HC245 SNJ54HC245J SNJ54HC245W SNJ54HC245FK
FUNCTION TABLE INPUTS OE L L H DIR L H X OPERATION B data to A bus A data to B bus Isolation
OE
A1
18
B1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC 2V IOH = 20 20 A VOH VI = VIH or VIL IOH = 6 mA IOH = 7.8 mA IOL = 20 A VOL VI = VIH or VIL IOL = 6 mA IOL = 7.8 mA II IOZ ICC Ci DIR or OE DIR or OE A or B VI = VCC or 0 VO = VCC or 0 VI = VCC or 0, IO = 0 4.5 V 6V 4.5 V 6V 2V 4.5 V 6V 4.5 V 6V 6V 6V 6V 2 V to 6 V 3 TA = 25C MIN 1.9 4.4 5.9 3.98 5.48 TYP 1.998 4.499 5.999 4.3 5.8 0.002 0.001 0.001 0.17 0.15 0.1 0.01 0.1 0.1 0.1 0.26 0.26 100 0.5 8 10 MAX SN54HC245 MIN 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 1000 10 160 10 MAX SN74HC245 MIN 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 1000 5 80 10 nA A A pF V V MAX UNIT
switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V tpd A or B B or A 4.5 V 6V 2V ten OE A or B 4.5 V 6V 2V tdis OE A or B 4.5 V 6V 2V tt A or B 4.5 V 6V TA = 25C MIN TYP 40 15 12 125 23 20 74 25 21 20 8 6 MAX 105 21 18 230 46 39 200 40 34 60 12 10 SN54HC245 MIN MAX 160 32 27 340 68 58 300 60 51 90 18 15 SN74HC245 MIN MAX 130 26 22 290 58 49 250 50 43 75 15 13 ns ns ns ns UNIT
switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1)
PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V tpd A or B B or A 4.5 V 6V 2V ten OE A or B 4.5 V 6V 2V tt A or B 4.5 V 6V TA = 25C MIN TYP 54 18 15 150 31 25 45 17 13 MAX 135 27 23 270 54 46 210 42 36 SN54HC245 MIN MAX 200 40 34 405 81 69 315 63 53 SN74HC245 MIN MAX 170 34 29 335 67 56 265 53 45 ns ns ns UNIT
S2
tdis
1 k
tpd or tt LOAD CIRCUIT VCC Input 50% tPLH In-Phase Output 50% 10% tPHL Out-of-Phase Output 90% 50% 10% tf 90% tr tPLH 50% 10% 90% tr VOH VOL Output Waveform 1 (See Note B) tPZH Input 50% 10% 90% 90% VCC 50% 10% 0 V tf Output Waveform 2 (See Note B) 50% 0V tPHL 90% VOH 50% 10% V OL tf
VCC 50% 50% 0V tPLZ VCC 50% 10% tPHZ 50% 90% VOH 0 V VCC VOL
NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd.
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device 5962-8408501VRA Status
(1)
Eco Plan
(2)
Top-Side Markings
(4)
Samples
ACTIVE
TBD
5962-8408501VR A SNV54HC245J 5962-8408501VS A SNV54HC245W 84085012A SNJ54HC 245FK 8408501RA SNJ54HC245J 8408501SA SNJ54HC245W JM38510/ 65503BRA JM38510/ 65503BSA JM38510/ 65503BRA JM38510/ 65503BSA SN54HC245J
5962-8408501VSA
ACTIVE
CFP
20
TBD
Call TI
-55 to 125
84085012A
ACTIVE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
8408501RA 8408501SA JM38510/65503BRA JM38510/65503BSA M38510/65503BRA M38510/65503BSA SN54HC245J SN74HC245DBLE SN74HC245DBR SN74HC245DBRE4 SN74HC245DBRG4 SN74HC245DW SN74HC245DWE4
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
CDIP CFP CDIP CFP CDIP CFP CDIP SSOP SSOP SSOP SSOP SOIC SOIC
J W J W J W J DB DB DB DB DW DW
20 20 20 20 20 20 20 20 20 20 20 20 20
1 1 1 1 1 1 1
Call TI Call TI A42 Call TI A42 Call TI A42 Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
Call TI Call TI N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
-55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Addendum-Page 1
www.ti.com
11-Apr-2013
Orderable Device SN74HC245DWG4 SN74HC245DWR SN74HC245DWRE4 SN74HC245DWRG4 SN74HC245N SN74HC245N3 SN74HC245NE4 SN74HC245NSR SN74HC245NSRE4 SN74HC245NSRG4 SN74HC245PW SN74HC245PWE4 SN74HC245PWG4 SN74HC245PWLE SN74HC245PWR SN74HC245PWRE4 SN74HC245PWRG3 SN74HC245PWRG4 SN74HC245PWT
Status
(1)
Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC SOIC PDIP PDIP PDIP SO SO SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP DW DW DW DW N N N NS NS NS PW PW PW PW PW PW PW PW PW 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 2000 2000 2000 2000 250 20 2000 2000 2000 70 70 70 25 2000 2000 2000 20
Eco Plan
(2)
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU
Op Temp (C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85
Top-Side Markings
(4)
Samples
ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE PREVIEW ACTIVE ACTIVE
Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) TBD Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type Call TI N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM
HC245 HC245
HC245 HC245
Addendum-Page 2
www.ti.com
11-Apr-2013
Status
(1)
Package Type Package Pins Package Drawing Qty TSSOP TSSOP LCCC PW PW FK 20 20 20 250 250 1
Eco Plan
(2)
Top-Side Markings
(4)
Samples
SNJ54HC245J SNJ54HC245W
ACTIVE ACTIVE
CDIP CFP
J W
20 20
1 1
TBD TBD
A42 Call TI
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
www.ti.com
11-Apr-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC245, SN54HC245-SP, SN74HC245 :
Catalog - TI's standard catalog product Military - QML certified for Military and Defense Applications Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
Device
Package Package Pins Type Drawing SSOP SOIC SO TSSOP TSSOP TSSOP DB DW NS PW PW PW 20 20 20 20 20 20
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 16.4 24.4 24.4 16.4 16.4 16.4 8.2 10.8 8.2 6.95 6.95 6.95
Pack Materials-Page 1
Package Drawing DB DW NS PW PW PW
Pins 20 20 20 20 20 20
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
DB (R-PDSO-G**)
28 PINS SHOWN 0,65 28 0,38 0,22 15 0,15 M
PLASTIC SMALL-OUTLINE
14
16
20
24
28
30
38
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
NOTES: A. B. C. D.
All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150
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