ELEC 6340: RF and Microwave Engineering

Instructor Dr. Ramesh Ramadoss e-mail: ramadra@eng.auburn.edu Office: Broun 402 Telephone: 844-1879 Class Tuesdays & Thursdays: 12:30 pm - 1:45 pm (Broun 235) Office Hours Tuesdays & Thursdays: 1:45 pm - 2:45 pm (Broun 402) Or by appointment (please email)

Purpose To develop a basic understanding of RF and microwave circuit design techniques using computer-aided design (CAD) approach. Prerequisite ELEC 3320: Electromagnetics for Wireless Communications (or) equivalent. ELEC 3700: Analog Electronics (or) equivalent.

Course Materials - Assignments, Solutions, Notes, and Announcements Web page: http://www.eng.auburn.edu/~ramadra/elec6340

Text Book (Please bring the book to the class) David M. Pozar, Microwave Engineering, 3rd Edition, John Wiley, 2005, ISBN 0-471-17096-8.

Topics
Part I: Basic Concepts INTRODUCTION TRANSMISSION LINE ANALYSIS (Review) PLANAR TRANSMISSION LINES - TEM and QUASI TEM MODES MICROWAVE NETWORK ANALYSIS Part II: Passive Circuit Design CIRCUIT ELEMENTS AND DISCONTINUITIES IMPEDANCE MATCHING CIRCUITS POWER DIVIDERS AND DIRECTIONAL COUPLERS Part III: Active Circuit Design DESIGN OF MICROWAVE SWITCHES DESIGN OF PHASE SHIFTERS MICROWAVE TRANSISTOR AMPLIFIER DESIGN MICROWAVE OSCILLATOR DESIGN

Course Evaluation
Assignments 30%, 3 Tests - 15% each, (Total 45%) Term Project 25%. Assignments Homework Assignment (15%) - Problems will be assigned from the text book exercises. - Occasionally, problems will be designed and posted on the web. Lab Assignments (15%) - HP ADS (Advanced Design System) will be used for assignment and term projects. Test Dates Test 1 on Part 1: September 22 Test 2 on Part 2: October 27 Test 3 on Part 3: Final Exam Date

Term Project Choose a topic

When? Middle of semester. If you like, you can choose a topic now and start working on it! Conferences Good Results IEEE MTT-S International Microwave Symposium Or

Design and Simulation

Paper Presentation

IEEE AP-S Antennas and Propagation Symposium

Term Paper Presentation: 15-minute talk, Total 4-5 hours.

When? (TBD)

Microwave Engineering
Microwave engineering: engineering and design of communication/navigation systems in the microwave frequency range. Applications: Microwave oven, Radar, Satellite communication, direct broadcast satellite (DBS) television, personal communication systems (PCSs) etc.

What are Microwaves? (Pozar Sec. 1.1)

frequency f (Hz ) =

velocity of light c 3 108 (m / s ) = (m ) wavelength

Microwaves: 30 cm 1 cm (centimeter waves) = 30 cm: f = 3 x 108/ 30 x 10-2 = 1 GHz = 1 cm: f = 3 x 108/ 1x 10-2 = 30 GHz Millimeter waves: 10 mm 1 mm = 10 mm: f = 3 x 108/ 10 x 10-3 = 30 GHz = 1 mm: f = 3 x 108/ 1x 10-3 = 300 GHz Note: 1 Giga = 109

What are Microwaves?

Resistor (conventional PCB)

1 360 1 cm
Electrical length = Physical length/Wavelength (expressed in ) Phase delay = (2 or 360) x Physical length/Wavelength RF f =10 kHz, = c/f = 3 x 108/ 10 x 103 = 3000 m Electrical length =1 cm/3000 m = 3.3 x 10-6 , Phase delay = 0.0012 Microwave f =10 GHz, = 3 x 108/ 10 x 109 = 3 cm Electrical length = 0.33 , Phase delay = 118.8 !!! Electrically long - The phase of a voltage or current changes significantly over the physical extent of the device

What are Microwaves?

Low Frequency Printed Circuit Trace
Propagation delay negligible

A B A
Microwave

A B

Propagation delay not negligible

???

What are Microwaves?

Low Frequency Printed Circuit Trace
Propagation delay negligible

A B A
Microwave

A B

Transmission line section!

Propagation delay considered

l Zo,

Transmission line

Field theory Solution!

Zo: characteristic impedance (=+j): Propagation constant

What are Microwaves?

RF and Microwave Circuit Design: Network theory (or circuit theory): description in terms of terminal quantities such as power, impedance, voltage, and current. Field theory Solution: description of the electromagnetic field at every point in space (from Maxwells equations) Approximations Fast but approximate Slow but accurate

Network solution Initial design

Field solution Final design

What is CAD?
Circuit Specifications Models Initial Design

Network/EM Analysis

Modifications Fail compare Pass Fabrication

RF and microwave circuit design techniques using CAD approach

Modify

Measurements

Fail

compare Pass

What are Microwave Integrated Circuits? (Pozar Sec. 10.4) Microwave Integrated Circuits (MIC) Traces: transmission lines, Passive components: resistors, capacitors, and inductors Active devices: diodes and transistors. Hybrid MIC: Transmission lines are defined on the metallization layer and the discrete components (passive and active) are bonded to the substrate.

Substrate Metal Process

Teflon fiber, alumina, quartz etc. Copper, Gold etc. Conventional printed circuit (Photolithography and etching)

Components Soldering and wire bonding

Monolithic MIC (MMIC): Mono single, litho - stone Active and passive circuit elements are grown on a single substrate.

Substrate Metal Process Passive Components

GaAs, silicon etc. (semiconductor substrates) Gold Semiconductor Processing techniques (Ion implantation, deposition of thin films) Deposition of metals, dielectric films, and resistive films