2SK1056, 2SK1057, 2SK1058

Silicon N-Channel MOS FET

Application
Low frequency power amplifier Complementary pair with 2SJ160, 2SJ161 and 2SJ162

Features
Good frequency characteristic High speed switching Wide area of safe operation Enhancement-mode Good complementary characteristics Equipped with gate protection diodes Suitable for audio power amplifier

2SK1056, 2SK1057, 2SK1058

Outline

TO-3P

D G 1 2 3 1. Gate 2. Source (Flange) 3. Drain

Absolute Maximum Ratings (Ta = 25C)

Item Drain to source voltage 2SK1056 2SK1057 2SK1058 Gate to source voltage Drain current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Note: 1. Value at TC = 25C VGSS ID I DR Pch* Tch Tstg
1

Symbol VDSX

Ratings 120 140 160 15 7 7 100 150 55 to +150

Unit V

V A A W C C

2SK1056, 2SK1057, 2SK1058

Electrical Characteristics (Ta = 25C)
Item Drain to source breakdown voltage Symbol Min 2SK1056 V(BR)DSX 2SK1057 2SK1058 Gate to source breakdown voltage Gate to source cutoff voltage Drain to source saturation voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time Note: 1. Pulse test V(BR)GSS VGS(off) VDS(sat) |yfs| Ciss Coss Crss t on t off 120 140 160 15 0.15 0.7 1.0 600 350 10 180 60 1.45 12 1.4 V V V S pF pF pF ns ns VDD = 20 V, ID = 4 A, I G = 100 A, VDS = 0 I D = 100 mA, VDS = 10 V I D = 7 A, VGD = 0 *1 I D = 3 A, VDS = 10 V *1 VGS = 5 V, VDS = 10 V, f = 1 MHz Typ Max Unit V Test conditions I D = 10 mA, VGS = 10 V

2SK1056, 2SK1057, 2SK1058

Power vs. Temperature Derating 150 Channel Dissipation Pch (W) 20 Ta = 25C ID max (Continuous) P PW 5 PW W = = 1 10 0 m = 0 s 1 m 1 s s sh 1 2 1 ot sh sh ot ot 1.0
C D O ra pe tio n (T C = 25 ) C

Maximum Safe Operation Area

10

100

50

Drain Current ID (A)

0.5 2SK1056
0 50 100 Case Temperature TC (C) 150

0.2 5

2SK1057 2SK1058

500 10 20 50 100 200 Drain to Source Voltage VDS (V)

Typical Output Characteristics 10 VGS = 10 V 9 8 7 6 4 5 4 2

Pch =

Typical Transfer Characteristics 1.0

2 5C 25 75

8 Drain Current ID (A)

TC = 25C Drain Current ID (A)

0.8

VDS = 10 V

0.6

0.4

100 W

0.2 2 1 0

10 20 40 50 30 Drain to Source Voltage VDS (V)

0.4 0.8 1.6 2.0 1.2 Gate to Source Voltage VGS (V)

C=

2SK1056, 2SK1057, 2SK1058

Drain to Source Saturation Voltage vs. Drain Current 10 Drain to Source Saturation Voltage VDS (on) (V) 5 VGD = 0 Drain to Source Voltage vs. Gate to Source Voltage 10 Drain to Source Voltage VDS (V) 8 TC = 25C

25

75

TC
2 1.0 0.5

C 25 =

6 5A 4

0.2 0.1 0.1

2A ID = 1 A 6 2 4 8 10 Gate to Source Voltage VGS (V)

0.2

0.5 1.0 2 Drain Current ID (A)

10

Input Capacitance vs. Gate Source Voltage Forward Transfer Admittance yfs (S) 1000 Input Capacitance Ciss (pF) 3.0 1.0 0.3 0.1 0.03 0.01 0.003 10 k

Forward Transfer Admittance vs. Frequency

500

200 VDS = 10 V f = 1 MHz 100 0 2 4 6 8 10 Gate to Source Voltage VGS (V)

TC = 25C VDS = 10 V ID = 2 A

30 k 100 k 300 k 1 M 3 M Frequency f (Hz)

10 M

2SK1056, 2SK1057, 2SK1058

Switching Time vs. Drain Current 500 Switching Time ton,toff (ns) 200 100 50 t off 20 10 5 0.1 t on

0.2

0.5 1.0 2 Drain Current ID (A)

10

Switching Time Test Circuit Output RL= 2 Input

PW = 50s duty ratio =1%

50

20 V

Waveforms 90 % Input 10 % t on t off 10 % Output

90 %

Unit: mm
5.0 0.3 15.6 0.3 1.0
3.2 0.2

4.8 0.2 1.5

0.5

14.9 0.2

19.9 0.2

1.6 1.4 Max 2.0 2.8 18.0 0.5

1.0 0.2

2.0

0.6 0.2

3.6

0.9 1.0

5.45 0.5

5.45 0.5
Hitachi Code JEDEC EIAJ Weight (reference value) TO-3P Conforms 5.0 g

0.3

Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third partys rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachis sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor products.

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URL

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