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Creep
at room temperature, most metals and ceramics : = f() independent of time and Temperature - low temperature behaviour
creep
numerous applications occur at high temperature for which : = f (, t , T)
Definition: Creep
slow continuous deformation of a material with time under stress
High temperature
Crystalline materials creep for: T > 0.3 - 0.4 Tm (K) for metals T > 0.4 - 0.5 Tm (K) for ceramics for amorphous materials (polymers and glasses), reference point not Tm but Tg
Creep test
sample under constant load, constant T Elastic response Primary creep Secondary or Steady State Creep Tertiary Creep
varying , constant T
if d/dt is plotted against on log/log plot d/dt = B n low stress, n = 1 high stress, n = 3-8
effect of temperature
activated rate process d/dt = C e -Q/RT combining d/dt = An e -Q/RT
Creep Mechanisms
(crystalline materials) Dislocation creep - Power Law creep d/dt = B n
dislocation creep
dislocations locked at obstacles unlocking dislocations from obstacles achieved by climb climb of dislocations occurs by diffusion diffusion requires high T
Dislocation climb
Tertiary creep
during steady state creep, damage accumulates as internal voids usually on grain boundaries voids decrease load bearing cross section > stress increases
Tertiary creep since d/dt = B n , d/dt increases rapidly voids will link up and fracture occurs