PCB Surface Finish Compare

Nowadays, the normal surface finish of Printed circuit board (PCB)as follows: 1) OSP --- Organic Solderability Preservatives 2) Lead free HASL --- Hot Air Solder Leveling 3) Immersion gold --- Electroless Nickel immersion gold or ENIG 4) Immersion Silver Ag 5) Immersion Tin Sn In 2004 lead free HASL made large improve of equipment and material, thus lead free HASL be the first method of PCB surface finish. At the moment more than 80% PCB use HASL to make the surface finish. Advantage & Disadvantage for each PCB surface finish compare: Surface finish Advantage a) Good at solder is the benchmark of solder. b) It can recoat if the PCB past due c)Very even, suit for SMT d) Can make lead free solder OSP Disadvantage a)After open the packing have to use off the PCB within 24hours. b)When manufacture have to put the antistatic gloves. c)IR Reflow the peak temperature is 220 , for lead free tin cream the peak temperature is 240 d)Can not use ICT test, as it will damage the OSP and make the PAD oxidation. a)When SMT may lead short or tin quantity not sufficient and soldering badness. b)Easy to have solder ball and cause short when SMT

Lead free HASL

a)Same as OSP its good soldering strength is the benchmark of soldering. (b) Good at test because of the lead free HASL can connect with the probe well. c) Will the the fist choice for lead free assembly a) Very even and good for SMT b) It is good choice for the products which need electrical conductivity well or have button such as cell phone (c) Can make lead free solder

Immersion Gold

a)Soldering strength not so good b)The nickle easy to be oxidated and make the handle time very short, besides, the BGA after assembly easy to have crack. a)The soldering strength not

Immersion Silver

a) Very even, good at SMT

b) Suit for lead free Assembly good as OSP or HASL c) Will the the good choice for lead b)Can not backing, if still need free assembly backing the temperature must at 110 and within 1 hour. c) Very easy be oxidated, after open the packing should better use off within 24 hours. d)The packing material can not have acid or sulfide a) Suit for SMT as its even surface b) Can use lead free soldering a)The solder strength less than immersion silver b)Easy to make the badness soldering because of the intermetallic compound thick after soldering. c) Can not backing, if still need backing the temperature must at 110 and within 1 hour. d)Very easy be oxidated, it should use off within 24 hours after open the packing.

Immersion Tin

Sophie Deng _______________________________________

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