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2.5V - 2.6V PHASE LOCKED LOOP DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER
FEATURES:
1 to 10 differential clock distribution Optimized for clock distribution in DDR (Double Data Rate) SDRAM applications Operating frequency: 60MHz to 220MHz Very low skew: <100ps for PC1600 - PC2700 <75ps for PC3200 Very low jitter: <75ps for PC1600 - PC2700 <50ps for PC3200 2.5V AVDD and 2.5V VDDQ for PC1600-PC2700 2.6V AVDD and 2.6V VDDQ for PC3200 CMOS control signal input Test mode enables buffers while disabling PLL Low current power-down mode Tolerant of Spread Spectrum input clock Available in 48-pin TSSOP, 40-pin VFQFPN, and 56-pin VFBGA packages
IDTCSPT857C
DESCRIPTION:
The CSPT857C is a PLL based clock driver that acts as a zero delay buffer to distribute one differential clock input pair(CLK, CLK ) to 10 differential output pairs (Y [0:9], Y [0:9]) and one differential pair of feedback clock output (FBOUT, FBOUT). External feedback pins (FBIN, FBIN) for synchronization of the outputs to the input reference is provided. A CMOS Enable/Disable pin is available for low power disable. When the input frequency falls below approximately 20MHz, the device will enter power down mode. In this mode, the receivers are disabled, the PLL is turned off, and the output clock drivers are tristated, resulting in a current consumption of less than 200A. The CSPT857C requires no external components and has been optimised for very low I/O phase error, skew, and jitter, while maintaining frequency and duty cycle over the operating voltage and temperature range. The CSPT857C, designed for use in both module assemblies and system motherboard based solutions, provides an optimum high-performance clock source. The CSPT857C is available in Commercial Temperature Range (0C to +70C) and Industrial Temperature Range (-40C to +85C). See Ordering Information for details.
APPLICATIONS:
Meets or exceeds JEDEC standard JESD 82-1A for registered DDR clock driver Meets proposed DDR1-400 specification For all DDR1 speeds: PC1600 (DDR200), PC2100 (DDR266), PC2700 (DDR333), PC3200 (DDR400) Along with SSTV16857, SSTVF16857, SSTV16859, SSTVM16859, SSTVF16859, DDR1 register, provides complete solution for DDR1 DIMMs
NOVEMBER 2008
DSC-6201/1 7
1
Integrated Device Technology, Inc.
PWRDWN TEST MODE LOGIC Y0 Y0 Y1 Y1 Y2 Y2 Y3 Y3 Y4 Y4 CLK CLK FBIN FBIN PLL Y5 Y5 Y6 Y6 Y7 Y7 Y8 Y8 Y9 Y9 FBOUT FBOUT
AVDD
PIN CONFIGURATIONS
PWR DWN
Y5 Y5
Y6 Y6
Y7 Y7 NC NC Y2 Y2
D
FBIN
VDDQ FBOUT
Y8 Y8
Y9 Y9
NC NC
Y1 Y1
B
CLK CLK
F
Y4 Y4
K
0.65mm
5 4 3 2 1 A B C D E F G H J K
TOP VIEW
A 1 2 3 4 5 6
PIN CONFIGURATIONS
VDDQ VDDQ
GND
Y6 Y6
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
GND Y5 Y5 VDDQ Y6 Y6 GND GND Y7 Y7 VDDQ PWRDWN FBIN FBIN VDDQ FBOUT FBOUT GND Y8 Y8 VDDQ Y9 Y9 GND
Y1
Y1
Y0
Y0
Y5
Y5
Y0 Y0
30 29 28 27 26 25 24 23 22 21 Y7 Y7 VDDQ PWRDWN FBIN FBIN VDDQ
39
38
37
36
35
34
33
32
31
GND
12
13
14
15
16
17
18
19
20
VDDQ
VDDQ
Y3
Y3
Y4
Y4
Y9
Y9
Y8
Y8
GND Y3 Y3
Unit V V V mA mA
VDDQ Y4 Y4 GND
50 100 65 to +150
mA mA C
CAPACITANCE(1)
Parameter CIN CI() CL Description Input Capacitance VI = VDDQ or GND Delta Input Capacitance VI = VDDQ or GND Load Capacitance 14 pF
NOTE: 1. Unused inputs must be held high or low to prevent them from floating.
Typ.
Unit pF pF
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils.
FUNCTION TABLE(1)
INPUTS AVDD GND GND X X Nominal(2) Nominal(2) Nominal(2,3) PWRDWN H H L L H H X CLK L H L H L H <20MHz CLK H L H L H L <20MHz Y L H Z Z L H Z Y H L Z Z H L Z OUTPUTS FBOUT L H Z Z L H Z FBOUT H L Z Z H L Z PLL Bypassed/OFF Bypassed/OFF OFF OFF ON ON OFF
NOTES: 1. H = HIGH Voltage Level L = LOW Voltage Level Z = High-Impedance OFF-State X = Don't Care 2. AVDD nominal is 2.5V for PC1600, PC2100, and PC2700. AVDD nominal is 2.6V for PC3200. 3. Additional feature that senses when the clock input is less than approximately 20MHz and places the part in sleep mode. Reciever inputs and PLL are turned off and outputs = tristate.
Conditions VDDQ = 2.3V, II = -18mA PWRDWN PWRDWN CLK, CLK, FBIN, FBIN CLK, CLK, FBIN, FBIN AVDD/VDDQ = Min., IOL = 100A AVDD/VDDQ = Min., IOL = 12mA AVDD/VDDQ = Min., IOH = -100A AVDD/VDDQ = Min., IOH = -12mA
Min. 0.3 1.7 1.7 VDDQ 0.1 1.7 VDDQ/2 0.2 0.36 0.7
Typ.
Unit V V V V V
VDDQ/2 + 0.2 VDDQ + 0.6 VDDQ + 0.6 10 100 320 250 200 360 300 12
V V V A A mA mA
Conditions VDDQ = 2.5V, II = -18mA PWRDWN PWRDWN CLK, CLK, FBIN, FBIN CLK, CLK, FBIN, FBIN AVDD/VDDQ = Min., IOL = 100A AVDD/VDDQ = Min., IOL = 12mA AVDD/VDDQ = Min., IOH = -100A AVDD/VDDQ = Min., IOH = -12mA
Min. 0.3 1.7 1.7 VDDQ 0.1 1.7 VDDQ/2 0.2 0.36 0.7
Typ.
Unit V V V V V
VDDQ/2 + 0.2 VDDQ + 0.6 VDDQ + 0.6 10 100 320 250 200 360 300 12
V V V A A mA mA
NOTES: 1. The PLL will track a spread spectrum clock input. 2. Operating clock frequency is the range over which the PLL will lock, but may not meet all timing specifications. 3. Application clock frequency is the range over which timing specifications apply. 4. Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal after power up.
NOTES: 1. The PLL will track a spread spectrum clock input. 2. Operating clock frequency is the range over which the PLL will lock, but may not meet all timing specifications. 3. Application clock frequency is the range over which timing specifications apply. 4. Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal after power up.
The PLL on the CSPT857 will meet all the above test parameters while supporting SSC synthesizers(4) with the following parameters:
NOTES: 1. Refers to transition of non-inverting output. 2. Static phase offset does not include jitter. 3. t() is measured with input clock slew rate tSLR(I) = 2V/ns and an input differential voltage VID of 1.75V. 4. The SSC requirements meet the Intel PC100 SDRAM Registered DIMM specification. 5. VOX is specified at the SDRAM clock input or test load.
The PLL on the CSPT857 will meet all the above test parameters while supporting SSC synthesizers(4) with the following parameters:
NOTES: 1. Refers to transition of non-inverting output. 2. Static phase offset does not include jitter. 3. t() is measured with input clock slew rate tSLR(I) = 2V/ns and an input differential voltage VID of 1.75V. 4. The SSC requirements meet the Intel PC100 SDRAM Registered DIMM specification. 5. VOX is specified at the SDRAM clock input or test load.
VDD
VDDQ/2
R = 10
Z = 50 R = 50 0V
R = 10
Z = 50 R = 50 0V SCOPE
10
CLK CLK
FBIN FBIN
t()n
t()n + 1
t()
=
n=N 1 N
t()n
Yx Yx
tsk(o)
Figure 5. Output Skew 11
tcycle n
Yx, FBOUT Yx, FBOUT 1 fo 1 fo
tjit(per)
tcycle n
thalf period n
Yx, FBOUT Yx, FBOUT 1 fo
1 2*f o
12
tR
Figure 8. Input and Output Slew Rates
tF
APPLICATION INFORMATION
Clock Loading on the PLL outputs (pF) Clock Structure #1 #2 # of SDRAM Loads per Clock 2 4 Min. 4 8 Max. 7 14
13
APPLICATION INFORMATION
~2.5" ~0.6" (split to terminator)
FBIN C = 14pF
(1)
8 more ~0.3"
SDRAM
R = 120 FBIN
Feedback path
~2.5"
SDRAM SDRAM CSPT857C Z = 60 CLK C = 14pF CLK SDRAM ~0.3" FBIN SDRAM R = 120 Z = 60
Stacked
R = 120
FBIN C = 14pF
(1)
8 more
Stacked
R = 120
Feedback path
14
ORDERING INFORMATION
CSPT XXXXX Device Type X XX Package Process Blank I 0C to +70C (Commercial) -40C to +85C (Industrial)
Thin Shrink Small Outline Package TSSOP - Green Very Fine Pitch Ball Grid Array VFBGA - Green Thermally-Enhanced Plastic Very Fine Pitch Flat No Lead Package VFQFPN - Green
857C
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