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=Constant depending on the material = 226 A.s 1/2/mm2 = reciprocal of temperature coefficient of resistance = 234.5 = final temperature = 250c = 90c
f i I ADIABATIC
= 226 x 630/ (1) x [ln ( ( 250 + 234.5) / (90 +234.5 ) ) ] = 90.14 kA for 1 sec
ii. Maximum Permissible Adiabatic Short Circuit Current For Lead Sheath
tLEAD = thikness of lead = 2599 mm2 = 8.70 mm ( Nominal )
230 K
-Maximum Permissible Adiabatic short circuit current I ADIABATIC = K. ST / t x [ ln ((f+ c) / (i+ c))] =41 x 2599 / (1) x [ ln ((210 + 230) / (85+ 230))] = 61.61 kA for 1Sec
iii . Maximum Permissible Non-Adiabatic Short Circuit Current For Lead Sheath
-Non-Adiabatic Short Circuit Current For Lead Sheath i = volumetric specific heat of media either side of the sheath 2.4 x 10 6 & 2.4 x 106 (J/K .m3). i = thermal resistivity of media either side of the sheath 2.5K.m/W & 3.5K.m/W i = volumetric specific heat of the sheath = 1.45E + 06 = tLEAD
= 8.70mm
F = Constant = 0.7
M = [(2 / 2) + [(3 / 3)] / (2 1 x 10-3) F = 5.016E-02 = heat loss factor = 1+ 0.61 Mt 0.069 ( Mt )2 +0.0043 ( Mt )3 = 1.030 iV . Maximum Permissible Non-Adiabatic Short Circuit Current
Isc = I ADIABATIC x = 61.61 x 1.030 = 63.48 kA for 1 second
Loss factor for sheath and screen [ cross bonded screen, flat formation 300 mm spacing] 1 1 where: 1 1 screen Lead sheath Alead = area of lead= 1647 mm2 =97.7 +5.1 = 102.8 mm = resistivity of lead at maximum operating temperature
= lead /
= power loss in the sheath or screen, consists of losses : = 1+ 1 =circulating currents = eddy currents = maximum operating temperature of the screen =85 c
= resist.lnce of screen at its maximum operating temperature = screen thickness = diameter over screen = = 2 x f = 2 x 60 = ( / Rs ) x 10-7 = 6 ( m2 / (1+ m2) (d / 2s)2 = (0.86 / m3.08)(d/2s) 1.4m + 0.7 =0 == 5.1 mm
107.9 mm =107.9 =
s 1 gs 1
= resistivity of screen material at maximum operating temperature =( 4 / (107 s))1/2 = 1 +( ts / Ds)1.74 (1 Ds10-3-1.6) = Rs /R [ gs 0 (1+1+2) + (1 ts)4 / (12 x 1012) ]
Total loss factor for sheath and screen For cross bonded system 1 1 = 1+ 1 =
Thermal resistance of the constituent parts of the cable: T 1,T2, T3 Thermal resistance between conductor and sheath T 1 T1 T t1 d1 Tt1 = ( T /2 ) ln (1+ 2 t1/dc ) = thermal resistivity of layer (km/W) = thickness of the layer (mm) = diameter under the layer (mm) = ( T /2 ) ln (1+ 2 t1/dc )
thermal resistance of the insulation Tinsulation = ( T /2 ) ln (1+ 2 t1/dc ) thermal resistance of the insulation screen Tis = ( T /2 ) ln (1+ 2 t1/dc )
T1
= ( T /2 ) ln (1+ 2 t1/dc )
d1
d2
p
bf
= depth from the surface of the ground to the group cent er = = distance between circuits A & B = 1200 mm = distance between circuits B & C = 1200 = thermal resistivity of backfill = 1.2 C.m/W
=thermal resistivity of the soil=
4
1450 mm
pr
2.0
C.m/W
T'4 T'\
= correction factor
2 of 2
= distance
from cable b to a
= =
2915
mm
300
mm 2915 mm
300
mm
=
= = =
3036 mm
3138
mm
3265
mm
3036 mm
2 of 2