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COLOR MONITOR SERVICE MANUAL

CHASSIS NO. : LM76D

MODEL:

L177WSB (L177WSB-*FS.K***AP*)

) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS
SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 DISASSEMBLY ........................................................ 8 BLOCK DIAGRAM...................................................10 DISCRIPTION OF BLOCK DIAGRAM .................. 11 ADJUSTMENT ...................................................... 13 SERVICE OSD ........................................................14 TROUBLESHOOTING GUIDE .............................. 15 WIRING DIAGRAM ............................................... 21 EXPLODED VIEW...................................................22 REPLACEMENT PARTS LIST ...............................24 SCHEMATIC DIAGRAM ......................................... 26

SPECIFICATIONS
1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area Pixel Pitch Color Depth Size : 0.255 (H) x 0.255 (V) : 17 inch 4. Max. Resolution D-sub Analog : 1440 x 900@75Hz

Electrical Interface Operating Mode Backlight Unit

: 8bits, 16.2M colors : 254.5 (H) x 389.2 (W) x 11.5(D) : LVDS : Hard-coating(3H), Anti-Glare

5. POWER SUPPLY 5-1. Power : AC 100~240V, 50/60Hz , 0.8A 5-2. Power Consumption
MODE POWER ON (NORMAL) STAND-BY SUSPEND H/V SYNC VIDEO POWER CONSUMPTION LED COLOR ON/ON ACTIVE OFF/ON ON/OFF

Surface Treatment

: 2-CCFL

: Normally White, Transmissive mode

less than 27 W less than 1 W less than 1 W less than 1 W less than 1 W

BLUE AMBER AMBER AMBER OFF

OFF OFF

2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio

10

DPMS OFF POWER S/W Off

OFF/OFF OFF -

Left : -70 min., -80(Typ) Right : +70 min., +80(Typ) Top :+60 min., +75(Typ) Bottom : -70 min., -85(Typ) 2-2. Luminance : 175(min), 250(Typ) (Full White pattern, 0.70V) -6500K : 110(min) (Full White pattern, 0.70V) -9300K 75%(min) : 5000:1 (DFC)

2-3. Contrast Ratio

3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal Type : Separate Sync, SOG 3-2. Video Input Signal 1) Type 2) Voltage Level a) Color 0, 0 b) Color 7, 0 c) Color 15, 0 3) Input Impedance : R, G, B Analog : 0~0.71 V : 0 Vp-p : 0.467Vp-p : 0.714Vp-p : 75

6. ENVIRONMENT 6-1. Operating Temperature : 10C~35C (50F~95F) (Ambient) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90% Confidence Lamp Life : 50,000 Hours(Min) 7. DIMENSIONS (with TILT/SWIVEL) Width Depth Height : 409.3 mm (16.11'') : 204.0 mm (8.03'') : 362.0mm (14.25'')

8. WEIGHT (with TILT/SWIVEL) Net. Weight Gross Weight : 2.8 kg (6.17 lbs) : 4.0 kg (8.82 lbs)

3-3. Operating Frequency Horizontal : 30 ~ 83kHz Vertical : 56 ~ 75Hz

-2-

PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturers specified parts to prevent electric shock, fire or other hazard. Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

WARNING
BE CAREFUL ELECTRIC SHOCK ! If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. Must mount the module using mounting holes arranged in four corners. Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. Protect the module from the ESD as it may damage the electronic circuit (C-MOS). Make certain that treatment persons body are grounded through wrist band. Do not leave the module in high temperature and in areas of high humidity for a long time. The module not be exposed to the direct sunlight. Avoid contact with water as it may a short circuit within the module. If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

Leakage Current Hot Check Circuit

AC Volt-meter

To Instruments exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

1.5 Kohm/10W

CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

-3-

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

-4-

General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500 F to 600 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

-5-

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

-6-

TIMING CHART

VIDEO D SYNC C B

A E

DOT mode section polarity CL O CK [MHz] 1 H(P ixels) V( Lines) H(P ixels ) V( Lines) H(P ixels ) V( Lines) H(P ixels ) V( Lines) H(P ixels ) V( Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) H(P ixels) V(Lines) + + + + + + +/+/+/+/+/+/+ + 25.175

Freque n cy [kHz] /[Hz] 31.469 70.09 31.468 70.08 31.469 59.94 37.5 75 37.879 60.317 46.875 75.0 49.725 74.55 48.363 60.0 60.123 75.029 68.681 75.062 61.805 65.96 63.981 60.02

Total

Display

Front Porch (D) 16 37 18 12 16 10 16 1 40 1 16 1 32 1 24 3 16 1 32 3 18 2 48 1

Syn c . (C ) 96 2 108 2 96 2 64 3 128 4 80 3 64 3 136 6 96 3 128 3 134 4 112 3

Back Porch (B) 48 60 54 35 48 33 120 16 88 23 160 21 224 39 160 29 176 28 144 39 200 31 248 38

Resol ution

Period (E ) (A) 800 449 900 449 800 525 840 500 1056 628 1056 625 1152 667 1344 806 1312 800 1456 915 1504 937 1688 1066 640 350 720 400 640 480 640 480 800 600 800 600 832 624 1024 768 1024 768 1152 870 1152 900 1280 1024

640 350 720 400 640 480 640 480 800 600 800 600 832 624 1024 768 1024 768 1152 870 1152 900 1280 1024

28.321

25.175

31.5

40.0

49.5

57.283

65.0

78.75

10

100.0

11

92.978

12

108.0

-7-

DISASSEMBLY
1. Put a cushion or soft cloth on a flat
surface.

2. Place the monitor face down on

the cushion or soft cloth.

3. Slide the Cable Deco Cover out from the stand body.

4. Nip Latch inside, Take off the stand base from stand body.

5. Please pull the stand body lightly

to separate it from the hinge body.

6. Remove the screws.

7. Pull the front cover upward,then separate all the latches.

8. Place the monitor face down,then disassemble back cover.

-8-

TSUMU58CWHL
Display Processing Engine

LVDS Panel Interface

1440*900@60Hz

LVDS Module

D-Sub

Analog(R/G/B) 3.3V

Dual Interface Engine

Analog(Vsync/Hsync) 1. 8V SDATA /SCLK

OSD

Clock Generator

MCU

BLOCK DIAGRAM
KEY
interface

-9-

LIPS
EEPROM (System)
3. 3 V 5V 12V 12V 5V

Crystal Flash ROM

14.318MHz

3.3V

Filter

Regulator LVDS Transmitter

3. 3 V 1.8V

Inverter( 2Lamps )

POWER

INVERTER

Module Vcc

12V 5V

High
Over Voltage Protection

Inverter On/OFF (3.3V) Dimming (Lamp Current Control)

13V

Main Board (Scaler & DC DC converter)

Aux
12V 5V

P-ch Inverter Trans N-ch

Drive
Power Control IC SMPS

Inverter Control IC

BLOCK DIAGRAM-POWER

- 10 Start
Feedback Line Filter

LAMP

Drive Block

Lamp Current Feedback

Low

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 136MHz. This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 12V is provided for inverter, 5V is provided for LCD panel. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module. 3. MICOM Part. This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.

- 11 -

LIPS Board Block Diagram

12V
50 ~ 60Hz HVDC

LINE 100 ~ 240V

EMI COMPONENTS

INPUT RECTIFIER AND FILTER

SWITCHING TRANSFORMER

100KHz

OUTPUT RECTIFIER AND FILTER

5V GND

PWM CONTROL CIRCUIT

PHOTO-COUPLER ISOLATION

SIGNAL COLLENTION

PRIMARY

SECONDARY

12V

INVERTER CIRCUIT

High Voltage

Operation description_LIPS
1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is for transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage. 6. Signal collection. This part function is to collect the any change from the DC output and feed back to the primary through photo transistor.

- 12 -

ADJUSTMENT
Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Dont need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy UserPort.sys file to c:\WINNT\system32\drivers folder b) Run Userport.exe 2. EDID Read & Write 1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click Update button c) Click Write button

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

- 13 -

SERVICE OSD
1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module.

A
Video Signal Generator IBM Compatible PC PARALLEL PORT
23 2C

15 10 5

11 6 1

C
13 25 14 1

No tu se d

Control Line

PA RA

LL E

5V

OFF

ON

RS

F
5V ON OFF 5V 4.7K 74LS06 4.7K 4.7K 74LS06

Power inlet (required)

PO W
VG S

V-S YN C

MO

NI TO R

Power Select Switch (110V/220V) Power LED E ST Switch

220

ER

ST

F V-Sync On/Off Switch (Switch must be ON.)

Figure 1. Cable Connection

- 14 -

TROUBLESHOOTING GUIDE
1. NO POWER - MAIN

NO POWER (POWER INDICATOR OFF)

CHECK J703 VOLTAGE PIN5, PIN6 (5V)? YES

NO

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

CHECK U601 PIN2 VOLTAGE (3.3V) ? YES CHECK KEY CONTROL CONNECTOR ROUTINE

NO

CHECK 3.3V LINE (OPEN CHECK) NO PROBLEM

IS U201 PIN75 (3.3V) VOLTAGE ? YES

NO

CHECK 3.3V LINE

CHECK U201 PIN 96 PULSE YES

NO

CHECK X-TAL

CHECK U201

Waveforms
1 U201-#96

- 15 -

2. NO RASTER (OSD IS NOT DISPLAYED) LIPS

NO RASTER (OSD IS NOT DISPLAYED)

J703 PIN5, PIN6 5V? YES

NO

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

J703 PIN9 5V? YES

NO

CHECK MICOM INV ON/OFF PORT.

J703 PIN10 5V? YES

NO

1. CONFIRM BRIGHTNESS OSD CONTRL STATE. 2. CHECK MICOM DIM-ADJ PORT

CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE? YES

NO

LIPS

REPLACE CCFL LAMP IN THE LCD MODULE

- 16 -

3. NO RASTER (OSD IS NOT DISPLAYED) MAIN

NO RASTER (OSD IS NOT DISPLAYED)

U201 PIN 16, 75 3.3V? YES

NO

CHECK U601

U201 PIN96, 97 OSCILLATE AS 14.31MHZ? YES

NO

1. CHECK C509, C510 SOLDERING CONDITION 2. CHECK X501 3. TROUBLE IN U201

U201 PIN27 IS 48KHz H-SYNC? PIN28 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? AT MODE 12?

NO

CHECK CONNECTION LINE FROM D-SUB TO U201

YES

TROUBLE IN CABLE OR LCD MODULE

Waveforms
1 U201-#96, 97 2 U201-#27 H-SYNC 2 U201-#28 V-SYNC

- 17 -

4. TROUBLE IN DPM - MAIN

TROUBLE IN DPM

CHECK R730, R731 YES

NO

CHECK PC PC IS NOT GOING INTO DPM OFF MODE

CHECK U201 PIN 27,28 SYNC PULSE ? YES

NO

CHECK H/V SYNC LINE

TROUBLE IN U201

Waveforms
3 R442 H-Sync 3 R443 V-Sync

- 18 -

5. POWER - LIPS

NO POWER (POWER INDICATOR OFF)

CHECK Fuse F101 OK?

YES

NO

Trouble in Fuse (F101)

CHECK C101 Voltage (AC110V->160Vdc (AC220V->304Vdc

NO

Check BD101

YES

Check IC101 PIN5 Voltage

NO

Trouble in IC101

YES
NO

Check D201, D202 Voltage YES

CHECK 5V, 12V Line

Trouble in D201, D202

- 19 -

6. Raster - LIPS

NO Raster (Lamp Off)

CHECK P201 Pin9 3.3V?

NO

Check Scaler Output (Main Board)

YES

Check IC301 Pin2 5V?

YES

NO

Check Q301, Q302

Check U301 Pin6 VSEN, Less than 3V

NO

Check the waveform of U301 Pin1, 15

YES

Check U301 Pin12 SSTCMT, Less than 1V

NO

Check the waveform of U301 Pin2, 3

If waveform is no problem

Check U301 Drain waveform YES

NO

Check D304 Or Trouble in U301

CHECK T301

- 20 -

WIRING DIAGRAM

30P

11P

EAD37413101

6P

6631T20023J

6631900030F

4P

6631V12031H

- 21 -

300 200 430 410 520 400

510

420

500 900

EXPLODED VIEW

- 22 -

310

910 920

930

EXPLODED VIEW PARTS LIST

Ref. No. Part No.
Description

EAJ38936201 EAJ39167201 200 EAJ39167202 EAJ39167203 EAJ39167204 300 ABJ34560301

LCD,Module-TFT,LM171WX3-TLA1 WXGA 17.1INCH 1280X720 250CD COLOR 60% 16/10 800:1 LPL 17"W response time :8ms,P4,Color Depth:16.7M. Viewing Angle:160/160 LG PHILIPS LCD LCD,Module-TFT,HSD170MGW1-B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. HANNSTAR DISPLAY CORPORATION LCD,Module-TFT,HSD170MGW1- B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80, Non-Glare HANNSTAR DISPLAY CORPORATION LCD,Module-TFT,HSD170MGW1-B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W, ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. Source/Gate IC : Novatek. HANNSTAR DISPLAY CORPORATION LCD,Module-TFT,HSD170MGW1- B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare.Source/Gate IC : Novatek HANNSTAR DISPLAY CORPORATION Cabinet Assembly,L177WSB . 17" Cabinet Assy black NT local

310

Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens , MFB38581401 power LED Knob Double injection Power LED for L1972, Lxx7W MFB38581403 Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens , power LED Knob Double injection Power LED for L1972, Lxx7W-"01" for CKD

400 410

ACQ34560801 Cover Assembly,Rear,L177WSB . 17" Back cover Assy Black NT local ADV33844405 Frame Assembly,L177WSB . 17" L177WSB REAR FRAME ASSY LPL-HSD MAZ40651001 Bracket,PRESS SBHG 0.6T BRACKET L177WSB - SBHG L177WSB Metal Bracket HSD MAZ39062501 Bracket,PRESS SBHG 0.6 BRACKET L177W - SBHG L177W Metal Bracket

420

430 500 510 520 900 910 920 930

MDQ39702401 Frame,PRESS SPTE 0.3t L177WSB. SUS L177WSB Lamp Wire Shield(Metal) Set EBR38509601 EBR39262801 EAY38422101 Upper SMT PCB,CONTROL S.T - L177WS PCB Assembly,MAIN T.T S chassis L177WSB BFS Power Supply Assembly,FREE L177WS LCD Lianchang

ACQ33707104 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local MCK38601901 Cover,MOLD ABS L1954 ABS L1954 COVER, STAND BODY MCK38602601 Cover,MOLD ABS L1954 ABS L1954, COVER CABLE AAN33777301 Base Assembly,ASSY L177W - L177W Stand base Assy_black

- 23 -

REPLACEMENT PARTS LIST

DATE:2007.07.20
CAPACITORs C501 0CK104CK56A
C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C601 C602 C603 C604 C605 C702 C703 C704 C705 C706 C720 C721 C722 C723
LOC NO. PART NO.

0CK473CK56A 0CK473CK56A 0CK473CK56A 0CK473CK56A 0CC102CK41A 0CK473CK56A 0CK473CK56A 0CC220CK41A 0CC220CK41A 0CK104CK56A 0CE106CF638 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CK104CK56A 0CE107EF610 0CK103CK51A 0CK475CC94A 0CE107EF610 0CE477EF638 0CK103CK51A 0CK103CK51A 0CK104CK56A 0CK105CD56A 0CC101CK41A 0CC680CK41A 0CC680CK41A 0CC680CK41A 0CC680CK41A

Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,AL,Radial,KMG16VB100M 100uF 20 Capacitor,Ceramic,Chip,0603B103K500CT 10nF Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u Capacitor,AL,Radial,KMG16VB100M 100uF 20 Capacitor,AL,Radial,KMG5.0TP16VB470M 470 Capacitor,Ceramic,Chip,0603B103K500CT 10nF Capacitor,Ceramic,Chip,0603B103K500CT 10nF Capacitor,Ceramic,Chip,0603B104K500CT 100nF Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF Capacitor,Ceramic,Chip,C1608C0G1H680JT 68pF Diode,Switching,ENKMC2837-T112 1.2V Diode,Switching,ENKMC2837-T112 1.2V Diode,Switching,ENKMC2837-T112 1.2V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V Diode,Zener,BZT52C5V6S-(F) 5.6V IC,Protocol Controller,TSUMU58BWHL-LF -0.3T IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25 IC,EEPROM,FM24C08 8KBIT 1KX8BI IC,LDO Voltage Regulator,AZ1117H-3.3 4.75TO10 IC,LDO Voltage Regulator,AZ1117H-

Capacitor,Ceramic,Chip,0603B104K500CT 100nF

DESCRIPTION/SPECIFICATION

LOC NO.

PART NO.

DESCRIPTION/SPECIFICATON

TRANSISTORs
Q501 Q601 Q602 Q701 Q702 R1 R2 R3 R4 R5 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R511 R512 R513 R514 R515 R516 R517 R518 R519 R520 R521 R522 R524 R525 R6 R601 R602 R603 R604 R605 R606 R607 R608 R701 R702 R703 R704 R705 R706 R707 R708 R709 R710 R711 R726 R727 R728 R729 R730 R731 R732 R733 R734 0TRKE80046A 0TRKE80046A 0TR127309AA 0TR390609DC 0TR390609DC 0RJ7501D677 0RJ7501D677 0RJ1201D677 0RJ1801D677 0RJ1201D677 0RJ0562D677 0RJ0562D677 0RJ0562D677 0RJ0562D677 0RJ1001D677 0RJ0562D677 0RJ0562D677 0RJ1002D677 0RJ3900D677 0RJ4700D677 0RJ2002D677 0RJ1002D677 0RJ1002D677 0RJ1002D677 0RJ1002D677 0RJ4701D677 0RJ4701D677 0RJ1000D677 0RJ4701D677 0RJ0332D677 0RJ0332D677 0RJ4701D677 0RJ0000D677 0RJ0000D677 0RJ1801D677 0RJ2001D677 0RJ3900D677 0RJ3900D677 0RJ1002D677 0RX0681K668 0RJ0000D677 0RH1002D622 0RJ1002D677 0RJ0000D677 0RJ4701D677 0RJ4701D677 0RJ1200D677 0RJ1200D677 0RJ1000D677 0RJ1000D677 0RJ1000D677 0RJ2001D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ4701D677 0RJ0332D677 0RJ0000D677 0RJ0682D677 0RJ0682D677 0RJ0332D677 0RJ0752D677 0RJ0752D677 TR,Bipolar,2N3904S NPN 6V 60V 4 TR,Bipolar,2N3904S NPN 6V 60V 4 TR,Bipolar,KTA1273 PNP -5V -30V TR,Bipolar,2N3906S-RTK PNP -5V TR,Bipolar,2N3906S-RTK PNP -5V Resistor,Chip,MCR03EZPJ752 7.5KOHM Resistor,Chip,MCR03EZPJ752 7.5KOHM Resistor,Chip,MCR03EZPJ122 1.2KOHM Resistor,Chip,MCR03EZPJ182 1.8KOHM Resistor,Chip,MCR03EZPJ122 1.2KOHM Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ102 1KOHM 5 Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ560 56OHM 5 Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ391 390OHM Resistor,Chip,MCR03EZPJ471 470OHM Resistor,Chip,MCR03EZPJ203. 20KOHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ101 100OHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ330 33OHM 5 Resistor,Chip,MCR03EZPJ330 33OHM 5 Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ000 0OHM 5% Resistor,Chip,MCR03EZPJ000 0OHM 5% Resistor,Chip,MCR03EZPJ182 1.8KOHM Resistor,Chip,MCR03EZPJ202 2KOHM 5 Resistor,Chip,MCR03EZPJ391 390OHM Resistor,Chip,MCR03EZPJ391 390OHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Metal Oxide Film,RSD02F36R80J Resistor,Chip,MCR03EZPJ000 0OHM 5% Resistor,Chip,MCR10EZHJ103 10KOHM Resistor,Chip,MCR03EZPJ103 10KOHM Resistor,Chip,MCR03EZPJ000 0OHM 5% Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ121 120OHM Resistor,Chip,MCR03EZPJ121 120OHM Resistor,Chip,MCR03EZPJ101 100OHM Resistor,Chip,MCR03EZPJ101 100OHM Resistor,Chip,MCR03EZPJ101 100OHM Resistor,Chip,MCR03EZPJ202 2KOHM 5 Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ472 4.7KOHM Resistor,Chip,MCR03EZPJ330 33OHM 5 Resistor,Chip,MCR03EZPJ000 0OHM 5% Resistor,Chip,MCR03EZPJ680 68OHM 5 Resistor,Chip,MCR03EZPJ680 68OHM 5 Resistor,Chip,MCR03EZPJ330 33OHM 5 Resistor,Chip,MCR03EZPJ750 75OHM 5 Resistor,Chip,MCR03EZPJ750 75OHM 5

RESISTORs

DIODEs
D711 D712 D713 ZD1 ZD2 ZD3 ZD4 ZD5 ZD6 ZD7 ZD705 ZD706 ZD707 ZD709 ZD710 ZD8 0DSIH00018A 0DSIH00018A 0DSIH00018A 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB EAN39545901 EAN37157001 0IMMR00203A 0IPMGA0010A 0IPMG00049A

ICs

U201 U502 U503 U601 U602

- 24 -

R736 J1 J2 J404 J701 J703 J707 P2

LOC NO.

0RJ0752D677

PART NO.

Resistor,Chip,MCR03EZPJ750 75OHM 5 Connector,Wafer,12505WR-06A00 6P 1.2 Connector,Wafer,12505WR-04A00 4P 1.2 Connector,Wafer,TJC2004-6A 6P 2.0MM Connector,DSUB,DZ11AA1-HVG-PF D-SUB Connector,Wafer,TJC2004-11A 11P 2.0M Connector,FFC/FPC/PIC,10031HR-30 30P 1.00M Connector,Wafer,12505WS-04A00 4P 1.2 Switch,Tact,JTP1127WEM 1C1P 15VD Switch,Tact,JTP1127WEM 1C1P 15VD Switch,Tact,JTP1127WEM 1C1P 15VD Switch,Tact,JTP1127WEM 1C1P 15VD Switch,Tact,JTP1127WEM 1C1P 15VD Switch,Tact,JTP1127WEM 1C1P 15VD LED,Chip,GPTD1210YBC BLUE/YEL Crystal,HLX-U-F-14.31818M-18

DESCRIPTION/SPECIFICATON

LOC NO.

PART NO.

DESCRIPTION/SPECIFICATON

CONNECTORs
6602T12005E 6602T12005C 6630V90220E 6630G100316 6630V90220K EAG37060101 6602T12004C 6600R00004C 6600R00004C 6600R00004C 6600R00004C 6600R00004C 6600R00004C 0DLGP0128AA 6212AA2001G

SWITCHs
SW1 SW2 SW3 SW4 SW5 SW6

OTHERs
D1 X501

- 25 -

SCHEMATIC DIAGRAM
1. SCALER

- 26 -

2. POWER & WAFER

- 27 -

3. INVERTER

G1

D1/D2

G2

S1

S2

- 28 -

4. POWER

- 29 FM D GND FB Vcc

P/NO : MFL30290846

JULY. 2007 Printed in China