Modeling IC Packages with FLOTHERM & FLOPACK

Package Level Modeling Goals and Challenges Basic Packaging Concepts Package Characterization Introduction to FLOPACK

Modeling Goals

Why is package level modeling necessary ?

The only reliable way to obtain accurate case temperature The only reliable way of obtaining accurate junction temperature Junction temperature drives reliability; Case temperature provided to end-user

Modeling Challenges
Keeping

up with the rapidly changing field of IC packaging is difficult, especially for system designers (end-users). Some modeling assumptions are not obvious
Do I model my trace layers in a PBGA discretely? Can I neglect the bond wires in modeling a PQFP? Can I represent my thermal vias as a lumped block?
Generating

and tedious Information about the internal details of a package may be difficult to obtain

component models is time consuming

Basic Packaging Concepts

What

is an electronics package?

The combination of engineering and manufacturing technologies required to convert an electronic circuit into a manufactured assembly Martin Miller, Electronic Packaging, Microelectronics and Interconnection Dictionary
What

is an electronics package? (Intelligible definition)

An intermediary between the IC chip (die) and the PCB

Basic Packaging Concepts

Highly

multi-disciplinary field:

Materials Manufacturing Thermal Electrical

Functions

of a package:

Electrical
Power distribution Interconnection

Mechanical
Die protection

Thermal
Heat dissipation

Basic Packaging Concepts

Die enclosure

Die

Level 1 interconnect Level 2 interconnect PCB Substrate

A package need not have all of the above elements The die, of course, is always present!

Basic Packaging Concepts

Package Classifications:
Plastic Packages
Generally, more challenging to model Cheaper Less reliable Non-hermetic Often need thermal enhancements Majority of the worlds packages Applications: ASICs, Logic chips, Memory chips, low powerprocessors

Ceramic Packages
More expensive More reliable Best electrical characteristics (fine line widths, multiple layers) Hermetic Excellent thermal performance Small number of packages in use Applications: High-power processors

Package Characterization
Standard

test methods defined by JEDEC are provided as a basis for comparison between various packages and devices. Well defined environments are used to ensure reliability and consistency between vendors. The thermal resistance values are not meant to and will not predict the performance of a package in an application-specific environment.

Package Characterization
Thermal

Resistance of a Package:

Defined as the resistance to heat transfer between two specified points.

jx

T j Tx P

Tj = temperature at active surface of die (junction) Tx = temperature at some reference point P = package power

Package Characterization
ja

(Natural Convection)

Most common concept Defined by JEDEC 51_2 :

ja

T j Ta P

Ta = ambient temperature, taken inside a specific enclosure defined by JEDEC (Still-Air Test) Measurements taken either with a High-k (2S2P) and Low-k (1S0P) board

Package Characterization
jma

(Forced Convection)

Speeds from 0-1000 LFM Defined by JEDEC 51_6 :

jma

T j Ta P

Ta = ambient temperature, taken upstream in the wind tunnel Board orientation is an important factor

Package Characterization
jc (junction to case resistance) The thermal resistance from the junction to the outside surface of the package (case) closest to the chip mounting area when that same surface is properly heat sunk so as to minimize temperature variation across that surface.

jc
Ambient Die

T j Tc P
Case Junction

Substrate PCB

Package Characterization

Thermal Resistance of a Package

Convection/Radiation Conduction Convection Conduction Radiation Convection/Radiation

Case

qjc

Junction

Conduction

Package Characterization

jb (junction to case resistance) The thermal resistance from the junction to the board.

jb

T j Tb P

Package Characterization

Thermal Resistance of a Package

jc tries to represent the many complex heat flow paths with a single thermal resistance Problem is most problematic with PBGAs Plastic Encapsulant exaggerates temperature gradient on surface Solder balls and vias increase parasitic losses to the board

Compact Models
Generates

Compact Models (Two-resistor and DELPHI)

SmartParts Available Today

21 Package Families 5 Ancillary Parts

Packaging Materials
Plastics/Resins Epoxy, FR-4, Polyimide, BT, die attach materials Metals/Alloys Copper, Solders (Pb/Sn alloys), Kovar, Alloy-42, Aluminum, Gold, Tungsten, etc. Ceramics Alumina (Al2O3), AlN, BeO Semiconductors Silicon, Gallium Arsenide (GaAs)

Packaging Materials
Relevant

properties of packaging materials:

Conductivity - Usually invariant with temperature Exceptions :

Silicon, AlN, BeO

Glass transition temperature for organic materials (Tg) - Temperature above which material loses its laminate
characteristics. Typical values: FR-4 = 125 C, BT = 200 C

Coefficient of Thermal Expansion (CTE) - Must match

for reliability. Particularly bad combinations: Si-FR4, Si-BT, Si-Cu. Good combinations: Cu-FR4, Si-Ceramics

Specific Heat Density

Silicon die BT substrate

Underfill

Interconnections

Recall the basic structure of a package:

Die enclosure Die

Level 1 interconnect Level 2 interconnect PCB Substrate

Die

level interconnections (Level 1)

Wire Bonding, Tape Adhesive Bonding, Flip Chip

Board level interconnections (Level Pins, Peripheral Leads, Solder Balls

2)

Interconnections: Level 1
Level

1 Interconnect is the coupling between the die and the substrate

Objective: to route signals and power to die while minimizing electrical degradation

Three

types of Level 1 Interconnect:

Wire Bonding Tape Adhesive Bonding (TAB) Flip-Chip (C4)

Interconnections: Level 1 Wire Bonding

Traditional

technology Bond wires typically

0.8 - 1.2 mil in diameter Gold or Aluminum
Advantages:
Substrate Bond Wire Pad on Substrate Die

Mature, low cost technology Reliable

Disadvantages:

Peripheral, not area array; low I/O density Pitch on die limited to usually of 3 mils Large signal lengths; high self-inductance

Interconnections: Level 1 Wire Bonding

Modeling Bond Wires

Can be ignored in ceramic packages May be significant in plastic packages with low metal content

Suggested modeling approach:

Represent as cuboid with equivalent (volume averaged) orthotropic conductivity

Interconnections: Level 1 Tape Adhesive Bonding (TAB)

Technology

introduced in the 1970s Popular in Japan, not much in the U.S. Leadframe is directly bonded to the I/O pads on die periphery, in a process known as Inner Lead Bonding Leadframe is normally attached to a (usually polyimide) tape, hence the name
Bumped die Die Polyimide Tape Cu leadframe

Interconnections: Level 1 Tape Adhesive Bonding (TAB)

Disadvantages:

More expensive today than wire-bonding Peripheral array, I/O density not high
Advantages:

Short interconnect length, excellent electrical performance Can handle up to 2 mil pitch on die periphery
Modeling:

This interconnection can usually be ignored in CFD modeling (insignificant thermal resistance)

Interconnections: Level 1 Flip-Chip Bonding

Has

its roots in an IBM technology of the 1960s ( called C4) Did not become popular till late 1980s Die connected with substrate through solder balls
Usually not in regular array Common solders: 37Pb/63Sn, 95Pb/5Sn Typical dia ~ 3 mils
C4 Die Substrate Underfill

Interconnections: Level 1 Flip-Chip Bonding (C4)

Disadvantages:

Can have major CTE mismatch problems Underfill makes rework practically impossible Higher cost (although this is dropping)
Advantages:

Collapsed Cuboid Die Substrate

Best electrical performance of all methods Area array leads to highest I/O density
Modeling:

Usually have a small, but significant thermal resistance, especially for ceramic packages. Negligible spreading in Flip-chip layer Best modeled as collapsed cuboid with volume averaged conductivity

Interconnections: Level 2
Level

2 interconnect: coupling between the package substrate and PCB Can generally be classified by mechanical attachment method and I/O arrangement:
Surface mount (SMT) : I/Os rest (usually soldered) on PCB surface.
Surface Mount/Peripheral leaded

Through-hole(TH): I/O physically penetrate the PCB through holes

Through Hole/Area Array

Interconnections: Level 2
Three

ways of coupling substrate and board:

Pins Peripheral leads Solder balls

Interconnect method Peripheral Leads Solder Balls Pins Mechanical Surface Mount, Through Hole Surface Mount Through Hole I/O Arrangement Peripheral Area Array Area Array

Peripheral Leads

These

are most commonly surface mounted (exception, Dual In-line Package) in PQFPs, SOPs etc. Pitches have shrunk to as low as 16 mils (0.4 mm) I/O counts up to ~ 400 Mature, low cost technology I/O limits due to peripheral array, co-planarity problems Leads typically of Copper (older packages, Alloy-42)

Modeling Peripheral Leads

Gull-wing leads

Advantages:

J-leads

Low cost, mature technology Easy to inspect for faults No CTE mismatch problems with FR-4 boards
Disadvantages

Long interconnect lengths, high self-inductance Lead co-planarity problem Peripheral array; low I/O density

Modeling Peripheral Leads

Modeling advice:
Form a critical heat transfer path for peripheral leaded packages Model as equivalent cuboid of volume averaged orthotropic conductivity. Modeling leads discretely does not improve model accuracy significantly for packages with a large number of leads.

Solder Balls

Package

using solder balls is knownPeripheral Balls Central/Thermal as Ball Grid Array (BGA) Balls Technology pioneered by IBM in the 1960s, Found wide acceptance in the 1990s BGA use is rising almost exponentially, especially in the U.S. Solder balls typically of 95Pb/5Sn or 37Pb/63Sn Array can be peripheral, with solder additional central balls Underfill rarely present

Solder Balls
Advantages

of solder ball interconnect:

High I/O density Excellent electrical performance (low self-inductance) Self-aligning during reflow, low manufacturing defect rate
Disadvantages:

Difficult to inspect for defects Possible CTE mismatch Not cheap (although cost is dropping)

Modeling Solder Balls

Modeling

choices:

Each solder ball discretely, as a cuboid:

Actual solder balls

FLOPACK discrete solder balls modeled as cuboids with

equivalent crosssectional area

Modeling Solder Balls

Modeling

choices:

As full cuboid (orthotropic)

Full Cuboid

Low conductivity in in-plane directions

High conductivity in through-plane direction

Pins

Package

using pins is called a Pin Grid Array (PGA). (More on PGAs later.....) Pins are typically made of Kovar (an alloy) They are often by means of a socket, connecting with the PCB through its own pins
Package pins Socket Socket pins

Modeling Pins
Most

pins have pitches of 50 mils or 100 mils and diameters of about 15 mils I/O counts of up to ~ 800 Modeling approach:
Ceramic packages: can model as equivalent volume averaged cuboid, as ceramic substrate is a good heat spreader Plastic packages: may need to model as discrete pins, especially if die size is small

Modeling ICs

Component Building Blocks Boards Heatsinks JEDEC standard test configurations

The Die
Term

for the piece of semiconductor on which all the active circuits lie Usually made of Silicon Gallium Arsenide is used in some special applications (microwave/high speed) Circuitry present within a thin layer on one side only, known as active surface
Circuitry Active surface

Die body (typically silicon)

The Die

Modeling advice:
Model as a cuboid with temperature dependent conductivity (for Silicon) Place collapsed source on active surface to represent heat dissipation Do not forget to set the source direction inwards, within the die!

Collapsed source

Cuboid

Die Flag

Die Flag:
The die is often placed (usually in plastic packages) on a thin metal plate known as the die flag or die pad. The die flag serves either a manufacturing or a thermal function, or both. The die flag is usually made of copper, and is typically larger than the die

Die Flag

Die

Die Flag
Die

Flag: the Die Flag:

Because the die flag is metallic, it can act as a very effective heat spreader
Modeling

It is recommended that the die flag be modeled discretely Spreading within the die flag can reduce the thermal resistance of a package by ~ 15 % This is small, but not insignificant!

Die Attach

Die

Attach:

The die is often attached to the substrate or the die pad by an adhesive known as the die attach It is often made of an epoxy based compound Typical values for die attach: Thickness = 1-2 mils, Conductivity = 1- 2 W/mK
Die Attach Die pad Die

Die Attach

Modeling the Die Attach:

Negligible spreading, but thermal resistance can be significant Model as collapsed cuboid

Die Protection
The die is fragile and needs protection (although packages with bare dies do exist) Two common means of protection:

Overmolding Capping

Overmolding

Overmolding:

Overmold is almost always an epoxy based compound Low conductivity (0.6 - 0.8 W/mK) A significant contributor to thermal resistance To reduce this resistance, a metallic slug is sometimes placed inside a plastic package
Metal Slug Adhesive Overmold

Die

Capping

Die

Capping:

In ceramic packages Capping seals off the die cavity Cap usually made of aluminum Model cap as cuboid May need to consider effects of radiation between cap and die
Cap Ceramic substrate

Die

Leadframes
Leadframes:

A characteristic of all peripheral leaded packages Most packages with leadframes are plastic (PQFP, SOP, PLCC), but ceramic ones do exist (CQFP) Leadframes normally made of Copper, although Alloy-42 (a Ferrous alloy) can be found in older designs
Die Flag

Internal Leadframe External Leadframe

Die

Leadframes
Leadframe

attachment:

Leadframe typically wire bonded to die TAB bonded in TAB packages When wire bonded, gap between die flag and leadframe is an important thermal bottleneck
Bond wire Die Die flag Leadframe Thermal bottleneck Die attach

Modeling Leadframes

Leadframe modeling:
Can be modeled as cuboid blocks with volume averaged, orthotropic conductivity Take average extent for internal leadframe

Substrates
A

substrate is an element on which the die is mounted to and which routes the I/Os from die to PCB Critical element from thermal standpoint Packages without a substrate: PQFP, SOP (e.g) Substrates:
Ceramic Organic

Ceramic Substrates
Ceramic

Substrates:

Most commonly made of Alumina (k = 20 W/mK) For better thermal performance, AlN or BeO also used (k ~ 200 W/mK) BeO is hazardous, requires special handling Ceramic layers placed together and fired in high temperature oven Metal traces usually made of Tungsten or Molybdenum

Ceramic Substrates

Ceramic substrate

Ceramic Substrates
Advantages:

Hermetic; highly reliable Fine line widths Excellent thermal performance Many (20 +) trace layers possible Good CTE match with silicon die
Disadvantages:

Require specialized, expensive manufacturing technique CTE mismatch with FR-4 PCB, large packages need underfill

Ceramic Substrates

Applications:
High power, heavy duty packages such as processors

Modeling Ceramic Substrates:

Relatively high conductivity Model simply as cuboid blocks Metal traces can be usually ignored Vias can be usually ignored

Organic Substrates
Organic

substrates:

Present only in plastic packages e.g. Plastic Ball Grid Array (PBGA), Plastic Pin Grid Array (PPGA) Challenging to model Dielectric made of a plastic based laminate resin; metal is usually copper

Die

Resin

Organic Substrate Metallization

Organic Substrates
Advantages:

Lower dielectric constant than ceramic substrates Manufacturing technology similar to that for PCBs Less expensive to manufacture Excellent CTE match with PCB
Disadvantages:

Limited number of layers Need thermal enhancements Poor CTE match with silicon die
Applications:

ASICs, low power processors etc.

Organic Substrates

Traces:

Cu traces can be signal layers or power/ground planes Typical organic substrates are either 2-layer or 4layer 2-layer substrate often (but not always) has signal layers only (no power and grounds)
Bond wire Two signal traces Die Die Flag

Organic Substrates

Traces:
4-layer substrates have two additional power and ground planes

Bond wire

Additional power and ground planes

Die Die Flag

Organic Substrates Modeling Traces

Modeling

traces:

Lumping traces and resin together as a single cuboid or block-and-plate is not recommended! Model traces as discrete layers Within each layer, volume average based on Cu coverage

Cuboids

Organic Substrates Vias

Vias

Originally created for increasing interconnection density in multiple layer PCBs Technology migrated to organic packages Today, also used for thermal enhancement (thermal vias)
Cu plating

Air Substrate

Organic Substrates Vias

Via classification:
Signal vias electrical function can be blind/buried Thermal vias serve purely thermal function usually thru-hole

Organic Substrates Modeling Thermal Vias

Modeling

vias:

Typically model only thermal vias Difficult to model signal vias! Signal vias may be thermally significant in some packages (e.g. flip-chip), need investigation.......
Modeling

approaches for thermal vias:

as discrete
most refined approach accounts for constriction resistance Takes up more grid; introduces large aspect ratio grid cells

Modeling Boards
Technology

for manufacturing organic substrates and PCBs is similar Compatibility - Detailed Model and Board Model Need to pay attention to:
Copper Planes Vias Connectors
Radiation

important in natural convection

Modeling Boards

FLOPACK

PCB macro can create a model with an arbitrary number of layers as well as compact or discrete via groups.

Copper Planes

Dielectric

Heatsinks
If

a heatsink is present on detailed package model, it must be modeled accurately for consistency Heatsinks:
Parallel Fin
Can use FLOTHERM SmartPart, or FLOPACK

Pin Fin
Can use FLOTHERM SmartPart, or FLOPACK

Disk-fin
FLOPACK generator

Heatsinks: Gridding Tips

Proper

gridding important for resolving boundary layers within heatsinks Focus on extruded heatsinks (most common) Transverse and streamwise directions are key Transverse direction:
Use 3 cells between fins No extra grid needed within fins 2 cells sufficient to resolve base

Heatsinks: Gridding Tips

3 Grid Cells between Fins

Keypoint Cells within Fins

2 Cells in Base

Heatsinks: Gridding Tips

Streamwise

direction:

Losses = Skin friction + Contraction/Expansion Transverse gridding resolves Skin Friction Losses Streamwise gridding critical to resolving Contraction/Expansion Losses Cluster cells at entrance and exit of extruded heatsink
Normal

direction:

Less critical 3-4 cells are usually sufficient

Heatsinks: Gridding Tips

Fins

Grid clustered at heatsink entrance and exit

Heatsinks: Miscellaneous
Model radiation on heatsink surfaces in natural convection Do not forget thermal grease (model as collapsed cuboid)

JEDEC Test Configurations

JEDEC

JC 15.1 subcommittee Standards to provide Figures of Merit for comparing package performance (http:///www.jedec.org) Examples of Standards available:
Still Air Test for Theta-JA (Rja) Forced Air Test for Theta-JMA (Rjma) Ring Cold Plate for Theta-JB (Rjb) Low Conductivity Test Board (1S Board) High Conductivity Test Board (2S2P Board)

JEDEC Test Configurations

Standards

being discussed:

Cold Plate for Theta-JC Various standards for new test boards
Other:

Validation beds for computational models Reporting format for detailed models Standards for compact modeling

JEDEC Standard Test Configurations

Ring Cold Plate

Example:

Standard for Theta-JB (Ring Cold Plate)

Compact Modeling
Introduction Compact Deriving Deriving

Model Topologies 2-Resistor Models

DELPHI Compact Models

Detailed Models

Recall

that .....

A Detailed Model attempts to capture thermal behavior of a package by reproducing the physical structure of the package as completely as possible

Why Compact Models?

Limitations

of Detailed Models

Reveal internal (proprietary) construction details of packages Are computationally demanding due to large grid required
A

Compact Model seeks to capture the thermal behavior of the package accurately ....
... at pre-determined (critical) points (junction, case etc.) .... by using a reduced set of parameters to represent the package

These

parameters need not be geometric The most popular approaches use some sort of thermal resistance network representation

The First Step: 2-Resistor Models

2-Resistor

Compact Models:
T Rjc J Rjb B

A significant improvement over single-resistor metrics Simple topology Can be used in System/Boardlevel/EDA tools (via IDF 3.0) Can be derived experimentally or computationally Typical accuracy for most cases is < 20%

Generating 2-Resistor Models Current (JEDEC) Experimental Approach:

by Top Cold Plate Test jb by Ring Cold Plate Test
jc

http://www.jedec.org

FLOPACK

Computational Approach:

Shadow experimental approach Advantages:

Consistent with JEDEC standards One-to-one correspondence with experiment Intuitive; easily understood by users

2-Resistor Models in FLOPACK

Ring Cold Plate Harness

Detailed Model Top Cold Plate Harness

Conduction Solver Engine

2-Resistor Network FLOTHERM Compact Model

The Traditional Approach ( ja and jc)

The

and jc approaches lump all heat paths together as one - use with caution.
ja

and

jc

are environmentally dependent.

Inaccuracies

in predicting junction temperatures can be as high as 100%!

Arbitrary Resistance Networks

Some components may need more complex networks, especially when heat spreading within the component is significant TI Often involve Shunt resistors

TO

Shunt Resistors

BI

BO

Boundary Condition Independent Resistance Networks

DELPHI
What

is (was) DELPHI? Project that proposed new methodologies for creating and validating computational component models Ultimate Goal: to enable component manufacturers to supply validated compact thermal models of their parts to end-users Results were:
Modeling methodology for Detailed Models 2 experimental systems (Double Cold Plate and Submerged Double Jet Impingement) Modeling methodology for Compact Models

The DELPHI Methodology

Package Parameters (Geometry, Material Properties)

Deliverable

Validate against Experiments

Create a Detailed Model

Detailed Model

Run Detailed Model N Times for N sets of representative Boundary Conditions

OptimiseResistance Network to Minimize Error for N Runs

Compare Compact Model Results with Detailed Model Results to Estimate Accuracy

Create CFD Equivalent of Resistance Network Model

Compact Model

N Sets of Boundary Conditions?

...A wide variety of boundary conditions within the spectrum of possible environments encountered in electronics cooling.

Example: 100-Lead PQFP

Detailed

Model

Internal Leads

Tie Bar

Die Die Paddle External Leads

Encapsulant

100-Lead PQFP
DELPHI

Compact Resistance Network

Top Inner

Top Outer

Sides 32.5

34.9 55.9 12.2

Junction

Leads

55.2 29.1

10.3

Bottom Inner

Bottom Outer

Compact Models in FLOPACK

Users

can either :

Generate their own compact models using FLOPACK Use compact models generated by component supplier
FLOPACK

generates a compact model as a PDML downloadable Compact Component SmartPart User simply imports the model and locates it correctly in their model User should not change entries except power

Package Styles
SmartPart

construction dependent on whether the package is:

Area Array (BGA, PGA, etc.) Peripheral Leaded (PQFP, TSOP, etc.)

Area

Array:

Heat transfer through top and bottom only Two solder ball regions possible
Leaded:

Heat transfer through top, bottom, and leads Leadframe could be 2-sided (Dual) or 4-sided (Quad)

The Compact Component SmartPart (Area Array)

Top Outer Bot Outer

Top Inner Junction Bot Inner

Top Outer Bot Outer

Cuboid blocks in three layers create isothermal nodes Cuboids representing solder balls (not included in SmartPart)

Top Outer Top Outer Top Outer

Top Outer Top Inner

Top Outer Top Outer Top Outer

Top Outer

The Compact Component SmartPart (Leaded)

Extra Cuboids representing peripheral lead resistance

Obtaining Junction Temperature

Place

monitor point in the middle of the junction region Can also use Tables Window

Example
As

an example, we will examine the implementation for an area array package, a Flip-Chip Plastic Ball Grid Array (FC-PBGA) Bare die protruding at top Inner and outer solder balls

FC-PBGA: Top Nodes

Top

surface partitioned to Top Inner and Top Top Inner Outer

Top Outer

FC-PBGA: Bottom Nodes

Bottom

surface partitioned to Bottom Inner and Bottom Outer

Bottom Inner

Bottom Outer

Network Menu

Node

Resistance (C/W)

Changing Power in SmartPart

Compact Models in FLOPACK

Two-Resistor Compact Models:

Currently available for all package styles

Complex (DELPHI) Compact Models:

Have already been introduced in FLOPACK for some package styles. New styles will be added periodically

What are Thermal Networks?

Thermal Network Models (TNM) are an extremely convenient method to represent heat transfer problems in terms of Thermal Resistances and Thermal Capacitance. It is useful to exploit the Electric Circuit analogy and make use of the existing well developed techniques to solve the network problem. Thermal Electrical

Heat Energy (Joules) Heat Flow Rate - Q (Watts) Temperature Difference - T (Kelvin) Thermal Resistance - Rth (K/W) Thermal Capacitance - Cth (J/K) Charge - Q (Coulomb) Current - I (Amperes) Potential Difference - V (Volts) Electrical Resistance R (Ohm- V/A) Electrical Capacitance - C (Farad C/V)

Typical Characteristics of TNM

Steady State
Only Resistance elements are necessary Conduction Very well suited for problems which result in predominantly one-dimensional heat flow pattern. Complicated networks may be needed to represent multidimensional problems. Convection and Radiation Not suitable for most of the engineering problems of interest. May be used as an simplified boundary condition for the conduction problems.

Transient
Both Resistance and Capacitance elements are necessary Otherwise quite similar to the Steady State Models

Compact Transient Thermal Model in FLOTHERM

Transient Thermal data

Transient Thermal data

From detailed model (or) datasheet (or) experiments

Network Identification
Number of RC Components and interconnections Needs good understanding of the thermal paths

Network Identification

Network Parameter Calculation

Lots of Mathematics! Laplace Transforms, Matrix Algebra, Inverse Transforms etc etc..

Network Parameters Calculation

Material Property Calculation

To represent R,C parameters in terms of k, and C with appropriate geometry

Material Property Calculation Implementation in FLOTHEM

Implementation in FLOTHERM
Model an equivalent network in FLOTHERM using existing options

Transient Thermal Data

The input data can be from

Detailed Model The package internal details are required Component level simulations for various conditions Device datasheet Supplier specified Transient Thermal Impedance curve Experimental data Only if both of the above are not available (or) reliable.

Transient Thermal data

Network Identification

Network Parameters Calculation

Material Property Calculation

Implementation in FLOTHEM

Network Identification

Networks can be of
One-Dimensional Only one major heat path Very short transients (semi-infinite assumption) Multidimensional More than one major heat path MCMs Interaction between various power cells within a die

Transient Thermal data

Network Identification

Network Parameters Calculation

Typical Types of Network

Foster No physical significance Simple circuit equations Cauer Physically meaningful Extremely complicated Transformation is possible from one from to another

Material Property Calculation

Implementation in FLOTHEM

Network Parameter Calculation

One-Dimensional Networks

Assumed RC Values

Transient Thermal data

Foster Network

Network Identification

Measured Temperature Step Response Tm(t)

Simulated Temperature Step Response Ts(t)

Changed Network Parameter

Network Parameters Calculation

Material Property Calculation

Compare Ts and Tm Good

Bad

Implementation in FLOTHEM

Foster to Cauer Transformation

Calculated Network Parameter

Network Parameter Calculation

Multi-Dimensional Networks
The most complicated steps
Assumed RC Values

Transient Thermal data

Network Identification

Transfer Function in Laplace Domain

Network Parameters Calculation

Measured Temperature Step Response Tm(t)

Simulated Temperature Step Response Ts(t)

Changed Network Parameter

Material Property Calculation

Compare Ts and Tm Good Calculated Network Parameter

Bad

Implementation in FLOTHEM

Material Property Calculation

This step is pretty straight-forward

Assume suitable dimensions for the network components Resistance Component Low Density and Specific heat (i.e Very low Capacitance) Thermal Conductivity (k) can be directly calculated Capacitance Component High Conductivity (i.e Low Resistance) Suitable Combination of Density and Specific Heat Need to consider numerical instability if this results in excessively high or low numbers Resistance and Capacitance may be lumped in a single block

Transient Thermal data

Network Identification

Network Parameters Calculation

Material Property Calculation

Implementation in FLOTHEM

Implementation in FLOTHERM

One-Dimensional Networks
Very simple Model blocks with appropriate dimensions and stack them to represent the network and Resistance

Transient Thermal data

Network Identification

Capacitance Resistance Capacitance Resistance Capacitance

Network Parameters Calculation

Material Property Calculation

Implementation in FLOTHEM

Multidimensional Networks
Complicated May not be possible to implement in FLOTHERM

Beyond FLOTHERM

In-house Network Analysis Tools

Reasonably simple algorithms Possible to combine Electrical-Thermal Networks Extension of the methods to Infra-Red Image processing Thermal diffusivity measurements Interaction between devices Excel based tools Expert interactions may still be necessary Resources in TCI People
Electrical Thermal Software ( Math-based, Tools etc..)

Tools
Matlab Mathcad MS Excel

Suggested Readings

Mathematics

Laplace Transforms Matrix Algebra Curve fitting methods Inverse Transforms Complex Numbers Numerical Methods

Network Synthesis
Passive Networks

Heat Transfer

Conduction Analytical methods Multidimensional Spreading Resistance Transients