Beruflich Dokumente
Kultur Dokumente
2005
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INTRODUCTION
Electronic Switches
Thyristor
Can be turned on by gate signal but can only be turned off by reversal of the anode current
TRANSISTORS
BIPOLAR TRANSISTOR
Collector
N P N
DARLINGTON TRANSISTOR
P
Base
N P
Gate
Gate
MOSFET
Emitter
Power Semiconductors
Turn-off Devices
Thyristors
Line commutated
Diodes
Fast
Transistors
Thyristors
Darlingtons IGBTs
GTOs IGCTs
Power Semiconductors
are switches.
VDC
VAC
Millions of Barrels/Day
0.1
ABB Switzerland Ltd - 8 -
Energy trend
By 2020:
Energy consumption will double Electricity generation will double Electrification of end-consumption will quintuple
Today, only 15% of electricity flows via electronics Medium Voltage conversion has only been economically possible in the last 10 years
ABB Switzerland Ltd - 9 -
Basic Topologies
R L S1 DclampLs S3 S5
IGCT Inverter
VR
Cclamp
Clamp circuit
S2
S4
S6 FWD6
FWD1
S1
S3
S5
VDC S2 S4 S6
IGBT Inverter
Iswitch
f(t) ton t0
ABB Switzerland Ltd - 12 -
t1
t2
Irr
t3
t3
DEVICES
IGBTs
Transistors with insulated gate Allow dv/dt and di/dt control via gate signal (losses) High on-state voltage (transistor) High turn-on losses (no snubber) Low gate power requirements (voltage control) No passives required (independant dv/dt and di/dt control)
ABB Switzerland Ltd - 15 -
Part Number 5SNA 1200E250100 5SNA 1200E330100 5SNA 1200G330100* 5SNA 0600G650100*
IGBT Press-packs
molybdenum ceramic copper inert gas
close-up
copper
StakPak IGBT presspack with individual springs: suitable for long stacks with compounded tolerances
x
base-plate
on assembly over time with temperature cycling with shock and vibration
IGBT Trends
IGBT Trends
Higher voltages Higher Safe Operating Area (SOA) Softer (controlled) switching
2200 Vce 2000 1800 1600 1400 Ic 1200 Vce (V) 1000 800 600 Vge 400 200 0 -200 -400
2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 0 VR (V)
IGBT Turn-off Vcc= 1800V Ic= 50A RGoff= 33ohm Ls= 2.4H Tj= 125C
Diode Turn-off VR= 1800V IF= 100A RGon= 33ohm Ls= 2.4H Tj= 125C
90 80 70
50 2500 40 30 20 10
0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
time [microseconds]
voltage [V]
current [A]
60
VR (V)
IF (A)
0 -50 VR
3000 2500 2000 1500 Dynam ic Avalanche 1000 500 Tim e [250 nsec/div] 0
-250 -300
5500 SSCM 5000 4500 4000 Vce Ic = 3 x Inominal 3500 3000 2500 Dynamic Avalanche Inominal 2000 1500 1000 500 Vge Time [250 nsec/div] 0 -500
Vce (V)
20 0 -20
Vce (V)
In o m in a l
D yn a m ic A v a la n c h e
Vge T im e [2 5 0 n s e c /d iv ]
6000
5500 5000 4500 4000 3500 3000 2500 2000 1500 1000 500
Vce (V)
25 0 Time [2 usec/div]
No clamp, no snubbers
IGCTs
Thyristor with integrated gate unit Low on-state voltage (thyristor) Negligible turn-on losses (turn-on snubber) No explosive failures (fault current limitation by circuit)
Anode
P N
VAK
I AK
P N
Gate
P N
Gate
P N
I GK
Cathode
- VGK Cathode
Conducting Thyristor
Blocking Transistor
IGCT turn-off
Vd (kV) Vdm 4 3 2 1 0 -10
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Ia (kA) anode voltage Vd Itgq anode current Ia transistor Tj = 90C 4 3 2 1 0 starts to block gate voltage Vg
thyristor
-20 Vg (V) 15 20 25 30 35 t ( s)
Eon-circuit
Vswitch or L = VDC Iswitch Iload IFWD
Ipk
di/dton
Vswitch = f(t)
ton t0 t1 t2
IRR
t3
Eon-device
EON circuit
time [ 2 s/div]
EON-circuit = 4.1 Ws
EON-device
0.1 0 3.E-05
5.E-06
1.E-05
2.E-05
2.E-05
t [s]
4000
VAK
3000 2000
IA
1000 0
10
12
14
t [ s]
4 kA/4.5 kV IGCTs
power supply connection
IGCT
all copper housing
zzzz
Status Feedback
Command Signal
GCT
15 + 15 MW 3-Level Back-to-Back Converter for three-phase to single-phase conversion Converter efficiency = 99.2%
4500 4000 3500 3000 2500 2000 1500 1000 500 0 0.E+00
v I
2.E-04
4.E-04
6.E-04
8.E-04
1.E-03
time (s)
ITGQ peak = 4 kA
IGCT Outlook
IGDT
G1
G1
K G1
G1
N P N P
G2
G2
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G2
G2 A
Dual Gate Turn-off Thyristor
no tail current
Dual-gate IGCT @ 85C - gates triggered simultaneously VDC = 2.8 kV ITGQ = 3.3 kA VDRM = 4.5 kV VTM = 2.1 V @ 4 kA/125C
(V DC = 2800 V)
40 20
150
175
35 30 25 20 15 10 5 0 0 5 10 15 20 25
IGA Anode gate current [mA]
2.0
1.8
Increased SOA
250 kW/cm2
ABB Switzerland Ltd - 49 -
400 kW/cm2
91 mm asymmetric
IT
Snubberless turn-off Tj = 125C, VD = 2.8kV
5 0 -5
VAK, IT [V. A]
VAK
t [ s]
Developmental 4 4.5 kV IGCT with improved GU and silicon design allowing 50% SOA improvement
VGK [V]
Ioff P
VAK
1.4 1.2 1
TJ = 115C
0 -3 -2 -1 0 1 2 3 4 5 6 7
t [ s]
Developmental 2 4.5 kV RC_IGCT with improved GU and silicon design allowing 300% SOA improvement
Ioff [kA]
10 kV IGCT
Switching characteristics: Eoff = 14.8 J, VAK,max = 8 kV, toff = 8s, tf = 1s, ttail = 5s, 250 kW/cm2
Conclusions
nxI 2xI
New Limits
nom State-Of-The-Art Limits
Vrated
ABB Switzerland Ltd - 58 -
VSSCM
Devices withstands dynamic avalanche mode IGBTs withstands SSCM mode Devices achieve the ultimate square SOA behaviour
Switching-Self-Clamping-Mode SSCM
dv/dt Dynamic Avalanche Self Clamping
IC
VDC
di
VSSCM VDC = dt LS
devices start to limit voltage during turn-off over-voltage safely reaches the static breakdown after turn-off
IGBT IGCT
Safe Operating Area is increasing from 250 kW/cm2 to 1 MW/cm2 IGDT offers possibility of high voltage devices with low losses (future?)
Challenges
Dynamic Avalanche ruggedness (for reliable operation) Short Circuit Failure Modes (IGBT) and fault interruption (IGCT) Design Trade-off between Losses and SOA Critical Punch-Through voltages (for controllable voltage, low EMI) High DC link voltage (leakage stability, cosmic ray withstand) Large inductance and overshoot voltages in HV power systems High frequency (limited by losses, TJ)
System cost-reduction
(e.g. pay-back times 1 year for MV Drives)
Reduced