Gary Barker Tucson, Arizona 85747 (520) 850-7793 cell garyrobertbarker@gmail.

com

RE: Senior Mixed Signal Test Engineer w/Expertise in Semiconductor, DFT, TTR & Product Engineering Dear Sir or Madam, My name is Gary Barker. I am seeking employment as an experienced semiconductor test engineer. I am currently a lead test engineer at Texas Instruments with 14 years direct experience developing test solutions for probe and packaged mixed-signal ICs that include DACs, ADCs, ASICs, and temperature sensors. I have additional experience in design, product engineer, and failure analysis of power op-amps. I have some leadership training and experience. I have a BSEE from the University of Arizona and a MSEE from Arizona State University. I am a solid and reliable experienced test engineer with a great attitude and strong work ethic. I communicate well and work well as part of a team or leader of a team. Please refer to my resume and list of accomplishments which illustrate my broad background and track record of going above and beyond what is expected. I can provide multiple references that will attest to my work ethic and qualifications. I am willing to put in the extra hours and extra effort that is part of working in the semiconductor business and customer demands I am looking forward to talking with you about this engineering position. I have excellent references that include past supervisors and managers. Thank you for your consideration.

Best regards, Gary Barker http://www.linkedin.com/pub/gary-barker/6a/598/95a

Gary Barker, Tucson, Ariozona 85747. (520) 850-7793, garyrobertbarker@gmail.com

PROFESSIONAL SUMMARY
14 year experienced test engineer with additional experience in design, project and product engineering. Strong work ethic. Great attitude. Team player with leadership experience. DFT, DOE, statistical analysis. Experienced with (ATE) Teradyne Eagle, Catalyst, VLCT, laser probe, bench test development, C++, Pascal, VHDL, Verilog

EMPLOYMENT HISTORY Texas Instruments/Burr Brown: Lead Test Engineer, Tucson, AZ (1999-present)
Recognized as leader in test cost reduction, having made significant reductions on several products Made significant contributions to DFT and cost reduction as member of Tucson Test Council. Developed test solutions for Data Converters, Mixed Signal ASICs, and temperature sensors Designed 16 bit DAC, two mixed-signal ASICs using digital and analog design skills on Cadence platform Developed bench test solutions as engineering support technician (1990 1994)

Medtronic/MicroRel, Tempe, Arizona: Senior Product Engineer (1996 - 1999)

Earned customer focused quality award for shared leadership of development of targeted use pacemaker Chaired local and world-wide yield improvement teams Led teams and drove root cause isolation and corrective action as responsible engineering authority (REI) Improved yields and resolved manufacturing issues for several medical implantable pacemaker products

Biotronic/Micro Systems Engineering, Portland, Oregon: Project Engineer (1995 - 1996)

Successfully carried development pacemaker project from 1st silicon to customer samples Simultaneously resolved several technical issues while supporting OEM/military hybrid division

Automated Research Systems, Sierra Vista, Arizona: Senior Electrical Engineer (1994 - 1995)
Member of team responsible for consolidating and upgrading communications facilities worldwide.

APEX Microtechnology, Tucson, Arizona: Failure Analyst (1988-1990)

Isolated root cause and drove corrective action of failures for hybrid power Op-Amps Supported applications engineering by troubleshooting customer failures and providing feedback. Significant contributions to scrap reduction, yield improvement, and product quality. Responsible for analysis of root cause and developing and implementing corrective action

EDUCATION
Masters of Science in Electrical Engineering Arizona State University, Phoenix, Arizona Bachelor of Science in Electrical Engineering University of Arizona, Tucson, Arizona Patent "Multi-output DAC and Method using single DAC and Multiple S/H Circuits" # 6,570,516 B1: May 27, 2003

SOME CAREER HIGHLIGHTS AND ACCOMPLISHMENTS

Lead Test Engineering

Made significant contributions to drive modification of PCB layout rules, documenting a cost reduction of $400K using these techniques on a test solution. Aggressively and significantly reduced test costs by taking initiative to increase site count and to analyze test methods, developing new methods to perform tests more efficiently. Completed and documented Validation/Characterization of several Mixed Signal devices, including IC, WCSP, and package As member of test council, made significant contributions to test quality site-wide. Championed improvements in multiple areas including standardization and Design For Test. Significant improvements in test techniques across several tester platforms including Teradyne Eagle, Catalyst, VLCT and in-house wafer probe laser trim system for high precision DACs. Proficient at analyzing large amounts of data for production trends and statistical methods for validating test capabilities and ensuring that products meet datasheet specifications. Excellent written and verbal communication skills. Work very well as part of development team having performed nearly every role in development from design, to bench characterization, to final test, and project leadership. Experienced in C++, Pascal, and some basic.

Product/Project Engineering
Both personally or as leader of a team, resolved several technical issues by analyzing test data and using design of experiments techniques to identify root cause and implement corrective action to significantly improving product quality and reduce failures. Successfully performed leadership roles as chairman of local yield improvement team and chairman of world-wide yield improvement team. Drove effort to implement a web based database to track status of production/quality efforts. Both individually and as part of team successfully released several products into production

Mixed Signal Design

Completed complex ASIC containing both analog and digital functions. Performed design debugging, identified several design issues root causes and solutions through circuit analysis, experimentation, and simulation. Successfully released to production. Developed 2 ASIC monitor and control designs involving both digital and analog design. Developed 16 bit string DAC involving integrating existing blocks from other designs. Designed differential inputs, current and voltage gain stages, output stages, current sources, current limiting circuits, temperature compensation, feedback, and frequency compensation. Projects completed using VHDL and Verilog and mixed signal simulation tools. Developed new design of temperature monitor and fan controller chips including digital I/F, sequence controller, memory mapping, etc. (Required mostly VHDL and Verilog design.) Developed technique for utilizing multiple clocks to minimize switching noise coupling into analog circuitry while maintaining ability to implement scan and DFT.