Beruflich Dokumente
Kultur Dokumente
Recommended Applications
1. Battery pack
2. Motherboard, notebook and personal computer device
3. Liquid crystal display
4. Cellular phone
5. Bluetooth headset
6. Wi-Fi module
Product Type
THINKING
TSM NTC Thermistor
TSM Series
Size (EIA)
A
0
1
2
0201
0402
0603
0805
Definition
of
B Value
A
B
B25/85
B25/50
Zero Power
Resistance at 25
(R25)
102
103
473
10x10 = 1 K
3
10x10 =10 K
3
47x10 = 47K
10
11
Tolerance
of R25
F
G
H
J
K
1%
2%
3%
5%
10%
12
13
B Value
338
34D
395
39H
405
3380
3435
3950
3975
4050
14
15
Tolerance
of B Value
1
2
3
1%
2%
3%
16
Optional Suffix
Z
RoHS & HF
Compliant
Packaging
R
B
Reel
Bulk
Part No.
Size
L1
H max.
L2 & L3
TSMA
0201
0.600.05
0.300.05
0.35
0.150.05
TSM0
0402
1.000.15
0.500.10
0.60
0.200.10
TSM1
0603
1.600.15
0.800.15
0.95
0.400.15
TSM2
0805
2.000.20
1.250.20
1.00
0.400.20
66
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2012.08
Part No.
TSMAB103338*
TSMAB683425*
TSMAB104425*
TSM0A10334D*
TSM0A103395*
TSM0A223395*
TSM0A333405*
TSM0A683410*
TSM0A104405*
TSM0A104436*
TSM0B103338*
TSM0B473405*
TSM0B104354*
TSM0B104480*
TSM0B224470*
TSM0B474470*
TSM1A202340*
TSM1A47234D*
TSM1A472370*
TSM1A50234D*
TSM1A502385*
TSM1A68234D*
TSM1A682395*
TSM1A10334D*
TSM1A10339H*
TSM1A103430*
TSM1A223392*
TSM1A47339H*
TSM1A68339H*
TSM1A104405*
TSM1A104436*
TSM1A154406*
TSM1A204410*
TSM1A474415*
TSM1B221350*
TSM1B222395*
TSM1B472425*
TSM1B103338*
TSM1B103420*
TSM1B104355*
TSM1B224460*
TSM2A 50234D*
TSM2A10334D*
TSM2A103395*
TSM2A47339H*
TSM2A104405*
TSM2A684450*
Size
0201
0402
0603
0805
Zero Power
Resistance
at 25C
Tolerance
of
R25
B
Value
R25(K)
( %)
(K)
10
68
100
10
10
22
33
68
100
100
10
47
100
100
220
470
2
4.7
4.7
5
5
6.8
6.8
10
10
10
22
47
68
100
100
150
200
470
0.22
2.2
4.7
10
10
100
220
5
10
10
47
100
680
1, 2, 3,
5, 10
25/50
25/85
1, 2, 3,
5, 10
25/50
5, 10
1, 2,
3, 5, 10
5, 10
25/85
1, 2,
3, 5, 10
5, 10
25/50
1, 2, 3,
5, 10
1, 2, 3,
5, 10
5, 10
25/85
3380
4250
4250
3435
3950
3950
4050
4100
4050
4360
3380
4050
3540
4800
4700
4700
3400
3435
3700
3435
3850
3435
3950
3435
3975
4300
3920
3975
3975
4050
4360
4060
4100
4150
3500
3950
4250
3380
4200
3550
4600
3435
3435
3950
3975
4050
4500
Thermal
Time
Constant
Operating
Temperature
Range
(%)
Pmax(mW)
(mW/C)
(Sec.)
TL~TU(C)
1, 2, 3
140
Approx.
1.4
Approx.
1.2
-40 ~ +125
170
Approx.
1.7
Approx.
2.0
-40 ~ +125
210
Approx.
2.1
Approx.
3.1
-40~+125
240
Approx.
2.4
Approx.
5.4
-40~+125
1, 2, 3
Safety
Approvals
UL/
TUV CQC
cUL
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
67
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2012.08
100%
0
0
TL
TU
25
Ambient temperature ()
TSM0A10334D* ~ TSM0B474470*
100000
100000
10000
10000
1000
100
Resistance(K)
Resistance(K)
1
2
1000
3
4
5
6
7
100
10
10
1:TSM0B474470*
2:TSM0B104480*
3:TSM0A104405*
1:TSMAB104425*
2:TSMAB683425*
4:TSM0A683410*
5:TSM0B473405*
3:TSMAB103338*
6:TSM0A223395*
7:TSM0A10334D*
0.1
0.1
-40 -30 -20 -10
Temperature ()
Temperature ()
68
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2012.08
TSM1A202340* ~ TSM1A204410*
100000
100000
10000
10000
1
2
1000
3
1000
3
4
Resistance(K)
Resistance(K)
5
6
100
100
5
6
7
8
9
10
1:TSM1A204410*
2:TSM1A104436*
10
3:TSM1A68339H*
1
1:TSM0B224470*
4:TSM1A223392*
5:TSM1A10339H*
2:TSM0A104436*
6:TSM1A682395*
3:TSM0B104354*
7:TSM1A472370*
0.1
4:TSM0A333405*
8:TSM1A502385*
5:TSM0A103395*
9:TSM1A202340*
6:TSM0B103338*
0.01
0.1
-40 -30 -20 -10
Temperature ()
Temperature ()
TSM1A47234D* ~ TSM1A474415*
TSM1B221350* ~ TSM1B224460*
100000
100000
10000
2
3
1000
1000
Resistance(K)
Resistance(K)
10000
4
5
100
6
7
8
9
100
2
3
4
5
6
10
1:TSM1B224460*
1:TSM1A474415*
2:TSM1B104355*
3:TSM1B103420*
2:TSM1A154406*
10
4:TSM1B103338*
3:TSM1A104405*
4:TSM1A47339H*
5:TSM1B472425*
0.1
6:TSM1B222395*
5:TSM1A10334D*
7:TSM1B221350*
6:TSM1A68234D*
7:TSM1A50234D*
0.01
8:TSM1A103430*
9:TSM1A47234D*
0.001
0.1
-40 -30 -20 -10
10
20 30 40 50
60 70 80
Temperature ()
Temperature ()
69
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2012.08
1
10000
2
3
Resistance(K)
1000
4
5
100
1:TSM2A684450*
10
2:TSM2A104405*
3:TSM2A47339H*
4:TSM2A103395*
5:TSM2A10334D*
6:TSM2A50234D*
0.1
-40 -30 -20 -10
Temperature ()
Soldering Recommendation
Peak temp
Cooling
Temperature
255~260
60~150 sec
217
15020
150~200
Tamb
3/sec
(max.)
60~180
sec
3/sec
(max.)
20~40
sec
6/sec
(max.)
8 minutes max.
Time
70
www.thinking.com.tw
2012.08
Conditions
360 (max.)
Soldering Time
3 sec. (max.)
3mm (max.)
Caution: Please do not touch the component surface with soldering iron directly to
avoid its damage.
G
Z
Size
Z (mm)
G (mm)
X (mm)
Y (mm)
0201
0.8
0.3
0.3
0.25
0402
1.7
0.5
0.6
0.6
0603
3.0
1.0
1.0
1.0
0805
3.4
1.0
1.4
1.2
71
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2012.08
(a) Incorrect
Nozzle for
Chip Mounting
Nozzle for
Chip Mounting
PC Board
Board Guide
Supporting Pins
For mounting SMDs on a PC board, supporting pin is suggested for use (refer to figure b) to avoid cracks caused by
external stress (refer to figure a).
(c)Cracks
If circuit bending is needed for PC board design, please refer to figure (c) for mounting positions to avoid cracks caused
by stress imposed on the product. O means better, is acceptable, and X is worst.
Incorrect Orientation
Correct Orientation
72
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2012.08
Standard
Specifications
No visible damage
R25/R25 5 %
Bending Strength
IEC 60068-2-21
Solderability
IEC 60068-2-58
Resistance to
Soldering Heat
IEC 60068-2-58
260 5, 10 1 sec.
No visible damage
R25/R25 3 %
High
Temperature
Storage
IEC 60068-2-2
No visible damage
R25/R25 5 %
Damp Heat,
Steady State
IEC 60068-2-78
No visible damage
R25/R25 3 %
Rapid Change of
Temperature
Max. Power
Dissipation
IEC 60068-2-14
IEC 60539-1
Step
Temperature ()
Period (minutes)
-40 5
30 3
Room temperature
53
125 5
30 3
Room temperature
53
73
No visible damage
R25/R25 3 %
No visible damage
R25/R25 5 %
www.thinking.com.tw
2012.08
(Unit: mm)
K0
A0
B0
P1
P2
P0
D0
0.05
0.12
0.2
0.1
0.05
0.1
0.05
0.1
0.1
0.1
0201
0.38
0.68
1.75
3.5
1.55
0.38
0402
0.62
1.12
1.75
3.5
1.55
0.60
Index
Size
(Unit: mm)
Index
A0
B0
P1
P2
P0
D0
K0
0.2
0.2
0.2
0.1
0.05
0.1
0.05
0.1
0.1
0.1
0603
1.1
1.9
1.75
3.5
1.55
0.95
0805
1.5
2.3
1.75
3.5
1.55
1.0
Size
74
www.thinking.com.tw
2012.08
Size
Quantity (pcs/reel)
0201
15,000
0402
10,000
0603
4,000
0805
3,500
75
www.thinking.com.tw
2012.08