HP and SIMULIA

Innovation through realistic simulation

Improve development from design concept to final-stage testing and validation

Engineers in all industries use realistic simulation to accelerate the development of reliable and innovative products. Companies producing electronic devices strive to design products that will withstand impacts, such as accidental drops. Airplane manufacturers must ensure the structural integrity of new composite materials. Automobile makers seek to optimize the performance of powertrain, brake, and suspension systems. Energy producing companies endeavor to accurately simulate structures subjected to stresses, such as deep underwater pressure and thermal expansion.

HP and SIMULIA have partnered to help these industries improve product performance, reduce the number of physical prototypes, and drive innovation. SIMULIAs Abaqus FEA product suite combined with the HP BladeSystem unites an essential design tool with a powerful computing system.

SIMULIAdelivering innovative streamlined solutions

SIMULIA delivers a scalable portfolio of realistic simulation solutions, including the Abaqus product suite for Unified Finite Element Analysis and multiphysics solutions for challenging engineering problems. Dedicated to advancing realistic mechanical and physics simulation technology, SIMULIAs solutions enable products, materials, and manufacturing processes to be fully tested in a virtual environment.

HP 32- to 64-core Workgroup System Rack Abaqus/Standard (Structural Analysis) Server Options 4 -8 ProLiant DL160 (Intel Xeon) or DL165 (AMD Opteron) server nodes, each using two quad-core processors 8 cores per compute node Four 72GB SAS drives Optional xw460c Graphics node with HP RGS for pre/post processing Optional Head node with extra memory for very large jobs Total Memory for Cluster: Head node: up to 4GB/core (up to 32GB/node) Compute nodes: For nonlinear jobs 2 or 4GB/core (16 or 32GB/node) For linear jobs 4GB/core (32GB per node) Cluster Interconnect Integrated Gigabit Ethernet or InfiniBand DDR (recommended for jobs using more than 16 cores) Storage 4 internal 72GB SAS drives striped RAID-0 on each node Optional HP SFS G3 Cluster File System Operating Environment 64-bit Linux or Microsoft Windows HPC Server 2008 Suggested workloads: Ideally suited for one model greater than 5MDOF or 2-4 simultaneous models less than 5MDOF

Administration Keyboard/Monitor GigE or InfiniBand Switch Storage Head/Compute Node Compute Nodes (DL16x)

Unified Finite Element Analysis The Abaqus Unified FEA product suite offers powerful and complete solutions for both routine and sophisticated engineering problems covering a vast spectrum of industrial applications. Best-in-class companies are taking advantage of Abaqus Unified FEA to consolidate their structural analysis processes and tools, reduce costs and inefficiencies, and gain a competitive advantage. The Abaqus Unified FEA product suite employs a hybrid modeling approach that enables users to work with geometry-based data alongside imported meshes without associated geometry. Abaqus/CAE provides a powerful modeling and visualization environment that emphasizes ease-of-use and ease-of-customization. Using Abaqus/CAE, dedicated users can create, edit, monitor, diagnose, and visualize basic to complex finite element or multiphysics analyses.

Multiphysics Analysis One way to get closer to realistic behavior in simulation is to include more than one physical aspect in a coupled approachwhere one aspect of physics (for example, structural response) affects and is affected by another (for example, fluid flow). Multiphysics solutions from SIMULIA enable engineers to reach beyond the boundaries of a single domain, which allows them to simulate two or more interacting physical phenomena. Examples include fluidstructure interaction, structural acoustics, and other applications. SIMULIA also provides simulation automation and optimization solutions that increase the efficiency of the design process. For example, the Isight and Fiper applications combine multiple cross-disciplinary models together in a simulation process flow that can be executed across distributed compute resources. The automation allows exploration of the resulting design space and identification of the optimal design parameters within specified constraints.

HP Cluster Platform Workgroup System

The HP Cluster Platform Workgroup System is a smaller, versatile blade system enclosureideal for small sites like business offices or branch locations that only need four to eight server or storage components at a time. It can plug right into the wall1, uses standard power, and doesnt need special air conditioning.
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HP 32- to 64-core Bladesystem c3000 Cluster Workgroup System Abaqus/Explicit (Dynamic Analysis) Server Options: 4 -8 ProLiant BL460c (Intel Xeon) or BL465c (AMD Opteron) nodes, each using two quad-core processors 8 cores per compute node Two 72GB SAS drives Options: Configure an xw460c graphics node with HP RGS for pre/post processing Configure a head node with extra memory for very large jobs Replace a compute node with a storage blade Total Memory for the Cluster: Compute nodes: 2GB/core (16 GB/node) Optional Head node or Graphics node: up to 4GB/core (up to 32GB/node) Cluster Interconnect: Integrated Gigabit Ethernet or InfiniBand DDR (recommended for jobs using 32 cores and above) Storage: Optional SB40c storage blade Extended direct attached storage on the head node, up to 6 SFF SAS drives Operating Environment: 64-bit Linux or Microsoft Windows HPC Server 2008

Active Onboard Administrator Compute Nodes (BL46xc) Head/Compute Node Optional Storage Blade Onboard Administrator Console Expansion room for more compute nodes Enclosure DVD drive BL46Xc BL46Xc BL46Xc SB40c

Facility planning may be necessary. HP BladeSystem Power Sizer is available to help size power consumption and heat load.

HP Unified Cluster Portfolio scalable power in a compact solution

Large-scale Finite Element Analysis (FEA) and multiphysics models often require significant computational resources. SIMULIAs Abaqus software is highly scalable, making it able to take advantage of dozens and even hundreds of processors. HP, the market leader in HPC, provides a range of scalable systems with the computing power engineers need to exploit Abaqus softwares significant scalability. The scalability of both the software and the hardware allow engineers to tackle extremely complex FEA and multiphysics simulations. HPs Unified Cluster Portfolio (UCP) provides a flexible framework for rapidly deploying an optimized HPC solution. Available with both award-winning rackmount HP ProLiant servers and HP BladeSystems, these offerings consolidate and package all supporting infrastructure elements, providing pre-configured, turnkey implementations of clusters. Standard UCP options include QDR InfiniBand as well as Gigabit Ethernet, Linux, Windows HPC Server 2008, and the latest Intel and AMD processors.

BL46Xc

BL46Xc

Suggested workloads: Ideally suited for 2 simultaneous models >100K elements or 4 simultaneous models <100K elements

Plus, HP cluster management tools integrate with applications to provide an easy-to-manage environment. The HP UCP is complemented by the HP StorageWorks Scalable File Share G3 (HP SFS G3)a reliable, highbandwidth, scalable storage specifically designed for Linux clusters. HP SFS G3 eliminates the I/O bottlenecks typically found in large-scale simulation environments. Based on low-cost, off-the-shelf RAID disk arrays and open technology, the subsystem provides exceptional price/performance and dovetails well with SIMULIA applications. From a small, free-standing supercomputer-in-a-box (Cluster Platform Workgroup System) to multiple, high-density racks in a central computing facility, the HP Cluster Platform enhances reliability, provides unprecedented server density, and places increased computing power directly into the hands of design engineers. HPC options for cluster management simplify administration and accelerate time to deployment. For example, the HP BladeSystem c-Class architecture requires a quarter less floor space and consumes a quarter less power than a traditional rack-based configuration. The c-Class enclosure features an

HP BladeSystem c7000 Enclosure

The BladeSystem c7000 enclosure provides all of the power, cooling, and I/O infrastructure needed to support modular server, interconnect, and storage components. The enclosure is10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a shared, five terabit/s midplane for wire-once connectivity of server blades to network and shared storage.

HP 64- to 128-core HP BladeSystem c7000 Abaqus/Explicit (Dynamic Analysis) Server Options: 8-16 ProLiant BL460c (Intel Xeon) or BL465c (AMD Opteron) nodes, each using two quad-core processors 8 cores per compute node Two 72GB SAS drives Options: Configure an xw460c graphics node with HPRGS for pre/post processing Configure a head node with extra memory for very large jobs Replace a compute node with a storage blade or add DL38x as fileserver Total Memory for the Cluster: Compute nodes: 2GB/core (16GB/node) Optional Head node or Graphics node: up to 4GB/core (up to 32GB/node) Cluster Interconnect: Integrated Gigabit Ethernet or InfiniBand DDR (recommended for jobs using 32 cores and above) Storage: Extended direct attached storage on the head node Up to 6 SFF SAS drives Operating Environment: 64-bit Linux or Microsoft Windows HPC Server 2008

GigE Management Switch Compute (BL46xc) and Storage (SB40c) blades InfiniBand DDR Switch (back) Onboard Administrator Console Compute Nodes (BL46xc) Expansion room for more compute or storage nodes

Suggested workloads: Ideally suited for 4 simultaneous models >100K elements or 8 simultaneous models <100K elements

innovative new cooling technology that uses builtin instrumentation to monitor changes in workload demand and environment. It also includes a shared, five terabit/second midplane for wireonce connectivity of server blades to networks and shared storage. Engineers running Abaqus on HP BladeSystem c-Class systems increase performance capabilities while reducing operating costs and power/cooling expenditures. In addition, SIMULIA has standardized on HP-MPI, a high performance and production quality implementation of the Message-Passing Interface (MPI) standard. HP-MPI helps SIMULIA scale on distributed memory systems by transparently and dynamically taking advantage of the highest-performing interconnect available on the cluster.

A powerful partnership
Rapid improvements in simulation software and inexpensive, powerful computing systems allow application developers to explore more effective ways to simulate complex physical behavior. As the complexity of computer models increase, HP has responded with more powerful and innovative computers. And as higher performance computing systems are employed, SIMULIA has delivered more sophisticated software. To utilize both hardware and software innovations to their full potential, a close partnership between platform vendors and application vendors is essential. For more than twenty-years, the partnership between SIMULIA and HP has given these two companies an in-depth knowledge of each others productsyielding a common framework to develop the highest quality solutions available. Together, SIMULIA and HP share a vision to deliver unique and innovative solutions that will meet future simulation challenges.

Technology for better business outcomes.

Copyright 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. AMD and AMD Opteron are registered trademarks or trademarks of Advanced Micro Devices, Inc. in the United States and other countries.

To learn more, visit www.hp.com/go/cae, www.simulia.com

4AA2-5831ENW, May 2009