MAHAMAYA TECHNICAL UNIVERSITY, NOIDA

M.TECH. SECOND YEAR COURSES Syllabus FOR 1. Advanced Electronics and Communication Engineering. 2. VLSI 3. VLSI Design 4. VLSI System Design 5. VLSI and Embedded System [Effective from the Session: 2013-14]

SEMESTER III
S No Sub code Subject name L T P Evaluation Scheme Sessional End Sem Th P Th P 70 70 50 50 200 130 130 50 250 Subject Total 200 200 150 450 1000 Credits

1 2 3 4

VL-93? VL-93? VL-938 VL-939

Elective-III Elective-IV Seminar Course Design Pre Dissertation Total

4 4 1 9

2 2

0 12 12

4 4 3 9 20

SEMESTER IV
S No Sub code Subject name L T P Evaluation Scheme Sessional End Sem Th P Th P - 200 500 300 Subject Total 700 300 1000 Credits

1 2

VL-940 VL-941

Dissertation Comprehensive Viva Total

16 16

14 06 20

Elective-III: 1. 2. 3. 4. VL-930: VLSI Design Verification VL-931/EC-937: Radio Frequency Micro Electro Mechanical Systems (RF MEMS) VL-932: VLSI for Wireless Communication VL-933: VLSI Testing and Testability VLSI DESIGN VERIFICATION 4 Text Book 0 0

VL-930 Unit 1.

Topic Importance of Design Verification: In the SoC Design context. SoC Design flow and the role of Design Verification in the flow. Difference between verification, testing, and post-silicon validation. Why is pre-silicon verification required? Types of Design Verification Functional Verification,

Lectures 8

2.

Performance Verification. Simulation, Emulation, Formal and Semi-formal verification. System-level Verification: System-level test benches and their merits. Applying systemlevel test benches, Emulation, hardware acceleration. Block-level Veriifcation. Functional Verification through simulation. Whitebox, blockbox and Graybox testing. Coverage Metrics and code coverage analysis. Creating testbenches in Verilog/.VHDL Programming Language Interfaces (PLI). Formal checking of blocks linting and formal model checking. Examples. Design Representation: Creating hardware models. Verilog and VHDL models. SPICE models for Analog circuits. Analog and Mixed-Signal Verification. Using SPICE for simulation. Simulation: Event based and cycle based simulation. Speeding up of simulation through hardware accelerators. Rigid Prototyping. FPGA as Logic Emulators. Static Timing Verification. Concept of static timing analysis. Timing constraints, timing models, critical path analysis, false paths. Physical Design Verification. Layout rule checks and electrical rule checks. Parasitic extraction. Antenna, cross talk and reliability checks. IP-Reuse in modern-day SoC. SoC Integration and the problem of verification of IP-based designs. Verification IP and their importance. Formal Verification: Techniques for FSM Models: Models Checking and Formal Engines. SAT Solvers, BDDs, Symbolic Model Checking with BDDs, Model Checking using SAT, and Equivalence Checking.

3.

4.

5.

TEXT/REFERENCE BOOKS: 1. Prakash Rashinkar, Peter Paterson and Leena Singh System on a Verification Methodology and Techniques , Kulwer Publishers, 2001. Chip

2. An excellent source for instructors for Formal Verification techniques (website developed by) Prof. V. Narayanan, Penn State University, USA. http://www.cse.psu.edu/~vijay/verify/instuctors.html 3. S. Minato Binary Decision Diagram and Applications for VLSI CAD, Kulwer Academic Pub. November 1996. 4. Edmund M Clarke, O. Grumberg & D. Long Model Checking,. WEB LINKS: 1. http://www.csee.umbc.edu/~cpatel2/links/418/lectures/chap1_lect00_testintro.pdf 2. http://vlsi.cse.yzu.edu.tw/related/SoC/04_Verify.pdf 3. http://www.nptel.iitm.ac.in/courses/106103016/ 4. http://iiscs.wssu.edu/drupal/node/4437 5. http://inst.eecs.berkeley.edu/~cs250/fa09/lectures/lec03.pdf VL-931/EC-937 RADIO FREQUENCY MICRO ELECTRO MECHANICAL SYSTEMS (RF MEMS) 4 0 0

It may include introduction to RF MEMS technologies and switching that covers relays and switches. Students can become familiar with various MEMS components like MEMS inductor and capacitor along with MEMS phase shifter. It can help the students to extend their knowledge antenna field to micro machined antennas. Unit 1. Text Book

Topic Review Introduction to MEMS. Fabrication for MEMS, MEMS transducers and Actuators . Microsensing for MEMS, Materials for MEMS. MEMS materials and fabrication techniques Metals, Semiconductors, thin films, Materials for Polymer MEMS, Bulk Machining for silicon based MEMS, Surface machining for Silicon based MEMS, Micro Stereo Lithography for Polymer MEMS.

Lectures 8

2.

RF MEMS Switches and micro relays. Switch Parameters, Basics of Switching, Switches for RF and microwave Applications , Actuation mechanisms, micro relays and micro actuators, Dynamics of Switch operation, MEMS Switch Design and design considerations. MEMS Inductors and capacitors. Micromachined RF Filters and Phase shifters. RF Filters, Modeling of Mechanical

3.

Filters, Micromachanical Filters, SAW filters Basics, Design considerations. Bulk Acoustic Wave Filters, Micromachined Filters for Millimeter Wave frequencies. Micromacbined Phase Shifters, Types and Limitations, MEMS and Ferroelectric Phase shifters, Applications. 4. Micromachined transmission lines and components. Micromachined Transmission Lines Losses in Transmission lines, coplanar lines, Meicroshield and membrane supported lines, Microshield components, Micromachined waveguides, directional couplers and mixers, Resonators and Filters. Micomachined antennas. Design, Fabrication and Measurements. Integration and Packaging for RF MEMS. Roles and types of Packages, Flip Chip Techniques, Multichip module packaging and Wafer bonding, Reliability issues and Thermal issues. 8

5.

TEXT/REFERENCE BOOKS: 1 RF MEMS V K Varadan, A Laktakia and K J Vinoy, John Wiley, 2003 Reprint 2. RF MEMS Circuit Design J De Los Santos, Artech House, 2002 3. Transaction Level Modeling with SystemC: TLM Concepts and Applications for Embedded Systems, by Frank Ghenassia, Springer, 2005 4 Networks on Chips: Technology and Tools, by Luca Benini and Giovanni De Micheli , Morgan Kaufmann Publishers, 2006. WEB LINKS: 1. http://www.uio.no/studier/emner/matnat/ifi/INF5490/v08/undervisningsmateriale/L1_eng.p df 2. http://www.imagova.se/RFMEM_04.pdf 3. http://www.memsjournal.com/2006/10/rf_mems_a_brief.html 4. http://www.mecheng.iisc.ernet.in/~suresh/memscourse/pcontent.html 5. http://www.mems.ece.ufl.edu/EEL6935/Calendar/MEMSIIL16RFMEMS4.pdf 6. www.freevideolectures.com Electronics IIT Kharagpur 7. www.nptel.iitm.ac.in/video.php?subjectId=117105082 8. www.eng.utah.edu/.../mems/Lecture 9. www.memsjournal.com/2006/10/rf_mems_a_brief.html 10. www.ocw.mit.edu Courses

VL-932 Unit 1.

VLSI FOR WIRELESS COMMUNICATION

4 Text Book

Topic Overview of Modulation Schemes. Classical Channel. Wireless Channel Description. Path Loss: Detailed Discussion. Multipath Fading: Channel Model and Envelope Fading. Multipath Fading: Frequency Selective and Fast Fading. Summary of Standard Translation. Receiver Front End: General Discussion. Filter Design. Rest of Receiver Front End: Nonidealities and Design Parameters. Nonlinearity. Noise. Derivation of NF, IIP3 of Receiver Front End. Partitioning of Required NF rec_front and IIP3, rec_front into Individual NF, IIP3. Wideband LNA Design. Narrowband LNA: Impedance Matching. Narrowband LNA: Core Amplifier. Balancing. Qualitative Description of the Gilbert Mixer. Conversion Gain. Distortion, Low Frequency Case: Analysis of Gilbert Mixer. Distortion, High-Frequency Case. Noise. A Complete Active Mixer. Switching Mixer. Distortion in Unbalanced Switching Mixer. Conversion Gain in Unbalanced Switching Mixer. Noise in Unbalanced Switching Mixer. A Practical Unbalanced Switching Mixer. Sampling Mixer. Conversion Gain in Single Ended Sampling Mixer. Distortion in Single Ended Sampling Mixer. Intrinsic Noise in Single Ended Sampling Mixer. Extrinsic Noise in Single Ended Sampling Mixer. Demodulators. A/D Converters Used in a Receiver. Low-Pass Sigma-Delta Modulators. Implementation of Low-Pass Sigma-Delta Modulators. Bandpass Sigma-Delta Modulators. Implementation of Bandpass Sigma-Delta Modulators. PLL-Based Frequency Synthesizer. Phase Detector/Charge Pump. Dividers. VCO: Introduction. LC Oscillators. Ring Oscillator.

Lectures 8

2.

3.

4.

5.

Phase Noise. Loop Filter: General Description. Loop Filter: Design Approaches. A Complete Synthesizer Design Example (DECT Application). TEXT BOOKS: 1. Bosco Leung, VLSI for Wireless Communication, Prentice Hall PTR. 2. R. Ludwig and P. Bretchko, RF Circuit Design, Pearson, 2000. REFERENCE BOOKS: 1. 2. 3. 4. 5. B. Razavi, RF Microelectronics, PH, 1998. B. Razavi, Phase-Locking in High-Performance Systems, Wiley/IEEE, 2003. B. Razavi, Monolithic Phase-Locked Loops and Clock Recovery Circuits, IEEE Press, 1996. V. F. Kroupa, Phase Lock Loops and Frequency Synthesis, Wiley, 2003. C. Plett, J. W. M. Rogers and M. A. Copeland, Radio Frequency Integrated Circuit Design, Artech, 2003. 6. R. E. Best, Phase-Locked Loops : Design, Simulation and Applications, Fifth Edition, MH, 2003. 7. D. H. Wolaver, Phase-locked Loop Circuit Design, PH, 1991. WEB LINKS: 1. http://class.ee.iastate.edu/djchen/ee507/ 2. http://www.satishkashyap.com/2012/01/video-lectures-and-lecture-notes-on-rf.html 3. http://ieee-cas.org/lectures VL-933 Unit 1. VLSI TESTING & TESTABILITY 4 Text Book 0 0

Topic Introduction: The need for testing, the problems of digital and analog testing, Design for test, Software testing. Faults in Digital circuits: General introduction, Controllability and Observability, Fault Modeling- Logic, RTL and Structure level models, Compiled Simulation, Event- Driven Simulation, Delay Models, Element Evaluation, Hazard Detection, Gate-Level Event- Driven Simulation, Simulation Engines. Fault models Stuck-at faults, Bridging faults, intermittent faults. Digital test pattern generation: Test pattern

Lectures 8

2.

3.

generation for combinational logic circuits, Manual test pattern generation, Automatic test pattern generation - Roth's D-algorithm, Developments following Roth's D-algorithm, Pseudorandom test pattern generation, Test pattern generation for sequential circuits, Exhaustive, non-exhaustive and pseudorandom 90-150 test pattern Generation, Delay fault testing Signatures and self test: Input compression Output compression Arithmetic, Reed-Muller and spectral coefficients, Arithmetic and ReedMuller coefficients, Spectral coefficients, Coefficient test signatures, Signature analysis and Online self test. Testability Techniques: Functional TestingBasic Issues, Exhaustive, pseudo exhaustive testing, Partitioning and ad hoc methods and Scan-path testing, Testability Ad-Hoc design for testability, Board level and System level DFT approach, Some advance scan concepts, BIST-memory BIST, Logic BIST, Hardware description languages and test. Testing of Analog and Digital circuits: Testing techniques for Filters, A/D Converters, RAM, Programmable logic devices and DSP.

4.

5.

TEXT/REFERENCE BOOKS: [1] VLSI Testing: digital and mixed analogue digital techniques. Stanley L. Hurst Pub: Inspec/IEE ,1999. [2] M L Bushnell and V D Agrawal, Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits, Springer, 2005. [3] Digital systems testing and testable design - Miron Abramovici et al , Computer Science Press (1991) [4] Test generation for VLSI chips by VD Agrawal and SC Seth, IEEE Computer Society Press (2003) ISBN 0-8186-8786 -X. WEB LINKS: 1. http://www.ee.iitb.ac.in/~viren/Courses/2012/EE709.htm 2. http://www.cmosvlsi.com/lect17.pdf 3. http://www.engineering.uiowa.edu/~vlsi1/notes/lect12.pdf 4. http://homepages.cae.wisc.edu/~ece553/

Elective-IV: 1. 2. 3. 4. VL-934: Design of VLSI System VL-935: Nano-electronics VL-936/EC-930: Microwave Integrated Circuits (MIC) VL-937/EC-931: Radio Frequency Circuit Design

VL-934 Unit 1.

DESIGN OF VLSI SYSTEM

2.

3.

4. 5.

Text Book VLSI System Design Methodology: Structure T1 Design Techniques, Microprocessor/DSP, Programmable Logic, Gate Array and Sea of Gate Design, Cell-based Design, Full Custom Design, Platform based Design System on a Chip. Design Flows Automated Layout Generation, Mixed Signal or Custom Design Flow, Programmed Behavioral Synthesis. Design Economics: Nonrecurring and recurring engineering Costs, Fixed Costs, Schedule, Person power, Project Management, Design Re-Use. Data Path Sub System Design: Introduction, T1 Addition, Subtraction, One Zero Detectors, Comparators, Counters, Boolean Logical Operations, Coding, Shifters, Multiplication, Division, Parallel Prefix Computations. Array Subsystem Design: SRAM, DRAM, Read T1 only Memory, Serial Access Memories, Content Addressable memory, Programmable Logic Arrays, Array Yield, Reliability, and Self Test. Special Purpose Subsystems: Packaging, T1 Power Distribution, I/O, Clock, Analog Circuits. VLSI System Testing & Verification: T1 Introduction, Testers, Test Fixtures, and Test Programs, Logic Verification Principles, Silicon Debug Principles, Manufacturing Test Principles, Design for Testability, Boundary Scan. Topic

Lectures 8

8 8

TEXT/REFERENCE BOOKS: 1. Neil H.E. Weste, Davir Harris, CMOS VLSI Design: A Circuits and System Perspectives Addison Wesley - Pearson Education, 3rd Edition, 2004. 2. Wayne, Wolf, Modern VLSI Design: System on Silicon Prentice Hall PTR/Pearson Education, Second Edition, 1998 3. Douglas A Pucknell & Kamran Eshragian , Basic VLSI Design PHI 3rd Edition (original Edition 1994) WEB LINKS: 1. http://www.eecg.utoronto.ca/~najm/courses/ece451.pdf 2. http://www.ee.duke.edu/~jmorizio/ece261/261.html 3. http://cse.unl.edu/~seth/434/ 4. http://www.eecs.harvard.edu/cs148/ho_01.pdf VL 935 Unit 1. NANO-ELECTRONICS Text Book 4 0 0

Topic Shrink-down Approaches: Introduction, CMOS Scaling, The nanoscale MOSFET, Finfets, Vertical MOSFETs, limits to scaling, system integration limits (interconnect issues etc.), Resonant Tunneling Transistors, Single electron transistors, new storage, optoelectronic, and spintronics devices. Atoms-up Approaches: Molecular electronics involving single molecules as electronic devices, transport in molecular structures, Molecular systems as alternatives to conventional electronics, molecular interconnect; Carbon nano-tube electronics, band structure & transport, devices, applications.

Lectures 8

2.

3.

4. 5.

8 8

TEXT /REFERENCE BOOKS: 1. C.P. Poole Jr., F.J. Owens, Introduction to Nanotechnology, Wiley (2003). 2. Waser Ranier, Nanoelectronics and Information Technology (Advanced Electronic Materials and Novel Devices), Wiley-VCH (2003) 3. K.E. Drexler, Nano systems, Wiley (1992)

4. John H. Davies, The Physics of Low-Dimensional Semiconductors, Cambridge University Press, 1998 WEB LINKS: 1. http://ocw.mit.edu/courses/electrical-engineering-and-computer-science/6-701introduction-to-nanoelectronics-spring-2010/readings/MIT6_701S10_notes.pdf 2. https://nanohub.org/resources/8340 3. http://www-users.york.ac.uk/~ah566/lectures/nanoelec01_introduction_transport.pdf 4. https://ece.uwaterloo.ca/~ece493t1/t1/documents.html 5. http://nanosf.kaist.ac.kr/lecture/mse331/notes/lecture09.pdf

VL-936/EC-930 MICROWAVE INTEGRATED CIRCUITS (MIC) 4 0 0 Students will learn about basic concepts of microwave integrated circuits and fabrication process of MIC, hybrid MICs, dielectric substances, thick film and thin film techniques and materials and devices.

Unit 1.

Topic Basic Concepts of Microwave Integrated Circuits: Wave propagation and Circuit Theory, Transmission Lines, Planar Circuits, Analytical Methods Associated with MIC Theory. Passive Elements, Components, and Devices : Basic Elements, Filters, Couplers, Circulators and Isolators, Antenna Elements, Acoustic Devices, Three Dimensional Components. Microwave Semiconductor Devices: Introduction, Microwave Passive Diodes, Microwave Active Diodes, Bipolar Transistors, GaAs MESFET, High Electron Mobility Transistors. Materials and Fabrication Technologies: Materials, Basic Technologies, Examples of IC fabrication flow. Microwave Integrated Circuits: Amplifiers, Oscillators, Mixers, and Frequency Dividers. Digital Modulators, Switches, and Phase Shifters, Multipliers and Up-Convertors. System Application: Microwave Radio System, Satellite Communication Systems,

Text Book

Lectures 8

2.

3.

4.

5.

Broadcast Systems, Future Trends in MIC technology. REFERENCE/ TEXT BOOKS: 1. Yoshihiro konishi Microwave Integraed circuits mdi Dekker. 2. Gupta K C and Amarjit Singh, Microwave Integrated Circuits, John Wiley and sons, Wiley Eastern Reprint, 1978. 3. Hoffmann R K, Handbook of Microwave Integrated Circuits, Artech House, 1987. Web Links 1. www.webcrawler.com/ 2. www.awrcorp.com/products/microwave-of ice 3. www.gobookee.net/microwave-integrated-circuit-last-universityquestion... 4. www.ocw.mit.edu Courses 5. cepqip.iitd.ac.in/.../Revised%20list%20of%20faculty%20mentors%20S 6. http://140.122.79.140/course/982RFIC/C0%5B1%5D.0%20Opening.pdf 7. http://ee.sharif.edu/~mmic/ 8. http://faculty.kfupm.edu.sa/EE/sheikhsi/EE_407_Microwave_Engineering/ EE407_lec_27_28_1.pdf VL-937/EC-931 RADIO FREQUENCY CIRCUIT DESIGN 4 0 0

This subject will be useful to M Tech students to deal with performance of discrete components at high frequencies, behaviour of chip resistors, inductors and chip capacitors. It may include coupled micro-strip and lumped elements, non reciprocal components with active devices. Students will become familiar single port and multiport networks. Application of these in designing RF amplifier and oscillators. Unit 1. Text Book

Topic Introduction: Importance of RF Design, Dimensions and Units, Frequency Spectrum, RF Behaviour of Passive Components, High Frequency Resistors, High Frequency Capacitors, High Frequency Inductors, Chip Components and circuit board considerations, Chip Resistors, Chip Capacitors, Surface Mount Inductors. Transmission Line Analysis: Why Transmission Line Theory? Examples of Transmission Lines, Equivalent Circuit Representation, Theoretical Foundation, Circuit Parameters for a Parallel Plate Transmission Line, Summary of Different Line Configurations, General Transmission Line

Lectures 8

2.

3.

4.

Equation, Microstrip Transmission Lines, Terminated Lossless Transmission Line, Special Termination Conditions, Sourced and Loaded Transmission Line. Introduction to Smith Chart. Single- and Multi-Port Networks: Basic Definitions, Interconnecting Networks, Network Properties and Applications, Scattering Parameters. RF Filter Design: Basic Resonator and Filter Configurations, Special Filter Realizations, Filter implementation, Coupled Filter. Active RF Components: Semiconductor Basics. RF Diodes, Bipolar Junction Transistor, RF Field-Effect Transistors, High Electron Mobility Transistors. Active RF Component Modelling: Diode Models, Transistor Models, Measurement of Active Devices. Scattering Parameter Device Characterization. RF Transistor Amplifier Designs: Amplifier Power Relations, Stability Considerations, Constant Gain, Noise Figure Circles, Constant VSWR Circles, Broad-Band, and High Power, and Multi-Stage Amplifiers. Oscillators and Mixers: Basic Oscillator Model, High Frequency Oscillator Configuration, Basic Characteristics of Mixers.

5.

TEXT/REFERENCE BOOKS: 1. Reinhold Ludwig and Pavel Bretchko, RF Circuit Design: Theory and Applications, Pearson Education (Asia) Pte. Ltd., 2004. 2. Thomas H Lee, The design of CMOS Radio-Frequency Integrated Circuits, 2nd Edition, Cambridge Publication. 3. Matthew M. Radmanesh, Radio Frequency and Microwave Electronics Illustrated," Pearson Education (Asia) Pte. Ltd., 2004 WEB LINKS: 1. http://www.ee.iitm.ac.in/~ani/2011/ee6240/lectures.html 2. http://www.ece.ucsb.edu/Faculty/rodwell/Classes/ECE218a/ECE218a.htm 3. www.awrcorp.com/products/microwave-of ice 4. www.minicircuits.com/ 5. 101science.com/rfdesign.htm 6. www.rfcafe.com/ 7. http://wr.lib.tsinghua.edu.cn/sites/default/files/1190948120898.pdf

VL-938: Seminar Course Design

Course Objectives: To train the M.Tech students in the Art & Science of teaching, assessment and evaluation so that after Post-Graduation they can be effective and good teachers. The course also gives opportunity to the students to explore various new paradigms of pedagogy and integrate them in their course delivery for effective and dynamic transfer of knowledge that they will be called upon to do as a teacher. Further, the course provides for the content exploration on the web to enrich their own knowledge in the most recent topics and areas of enquiry which can open the possibility of conducting research and creating new knowledge in the chosen area. Course Learning Outcomes: 1. The student after completing the course should be able to create course content on the assigned topics. 2. Develop perspective on how to arrange, organize and deliver the knowledge that he/ she collects from the various sources like books, web sources and also from journals etc. related to the topic. 3. The student should also be able to understand the difference between plagiarism and actual content development by knowledge mining from the available resources. 4. The student shall understand what are the different pedagogical techniques and how to apply them and for which conditions. 5. The students shall also learn how to assess and evaluate the course delivery, the content creation and the learning attributes by actually participating in the peer evaluation process in every part of these activities individually and in groups. 6. The student shall be able to translate his / her learning into group learning by this course which shall be also evaluated by the mentoring teacher who is the course Instructor. Course Title and Syllabus: The subject matter to be allotted for this course must not be same or similar to any course or its syllabus already being taught to the candidates, but must be on new topics which are the latest in their area of specialization. In order to ensure that the same topic is given to every student going through the M. Tech. program in different Colleges/Institutes for that specialization the different teachers from that specialization shall propose the course with content to the University one semester in advance and then the University through its BOS in that area shall select the course title for ensuing academic session. This selected course will then be announced by the University for that academic session and the same shall be followed by all the colleges offering M. Tech. in that specialization. The course title shall not be repeated in the next year, but the same process shall be repeated to select a new course title and content for the succeeding year.

Course Distribution & Evaluation: The course shall have V Units as in any other course of the University and the M. Tech. batch of students shall be divided into a number of groups depending upon the strength of the class and each Unit allotted one Unit of the course as per the group choice. Every member of the group can then select the portion that he/ she would like to deliver lectures on. Normally every student shall have to deliver 2 lectures on the topic of his / her selection and the same may be done in one slot or in a round robin manner depending upon the direction of the faculty member of the course or as defined in the course.