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I. INTRODUCTION Directional Detection of Special Nuclear Material cuts down the time required for detection. Operating conditions of most detectors requires cryogenic temperatures, cooling apparatus for detector crystal and higher potential. The paper presents operation schemes and the preliminary results of the modeling work done to simulation to propose a novel type of Graphene Field Effect (GFET) as nanoscale-based radiation detection devices which can operate at lower voltage ranges required for current radiation detection devices and eliminate the need for cryogenic temperature conditions. 530
Sharp change of resistivity in graphene due to change of electrical field caused by ionizing radiation is used as basis for detection scheme. It is aimed to provide better resolution at room temperature to register amount of radiation and energy spectrum. Graphene exhibits Low noise, high mobility (ballistic transport), higher speed [THz], high sensitivity. This has led to intensive research activities across the world in developing new sensing materials and technologies with the advent of nanotechnology, for example detection of dirty bomb or special nuclear material at main entry points of any country. High resolution at room temperature with high signal to noise ratios with background rejection is needed and which poses a major challenge in the development of radiation sensors, particularly those for -rays. The exceptional electronic properties of graphene are explored [1] in order to improve the potential application and performance for radiation detection. Here we present the operating principles of detector and the results of our modeling work for radiation sensor based on graphene. The device architecture is Graphene Field Effect Transistor (GFET) which has undoped electrically gated semiconductor substrate as radiation absorber with a thin dielectric buffer on top which separates the graphene and absorber [2]. The strategy here is to utilize sharp change in resistance of graphene when approaching the charge neutrality point on local electric field In this study focus is on hierarchy, using Monte Carlo simulations in conjunction with a model of Interaction of radiation with semiconductors absorber material is done using GEANT4 [14].Further studies include a focus on detection of -radiation. For the dominant mode of first interaction (Compton scattering), transport of energetic Compton electrons in the absorber has been subsequently modeled using CASINO Monte Carlo code for different absorber and buffer materials of Field Effect Transistor [13].
Fig.2. A GFET consists of an absorber with an insulating buffer layer which serves as a gate dielectric.VG is the gate voltage applied to the sample. Current is supplies across the graphene sample, and the voltage is measured to obtain the resistance of the graphene layer.
The medium of interaction for the radiation is an undoped semiconductor detector absorber. Buffer layer accounts for few different purposes: primarily, for insulating the absorber and graphene. Secondly, electrons are prevented from draining out before they are cleared by the side electrodes, source and drain. Electric field induced by charges is sensed by graphene and proportionally resistance changes. The electrons that are collected at the buffer layer are cleared by Source and Drain by applying suitable gate voltage. III. DETECTING PRESENCE OF RADIATION WITHOUT DRIFTING OF CHARGES
Fig.1.Sharp peak (Dirac point ) in resistance as function of electric field.
Small changes in electric field are sensed by graphene, due to the sensitivity of resistance to charge carriers near Dirac point and this feature allows to sense ionizing radiation(that causes change in electric field).The idea has some analogy with the sharp feature of superconductivity transition in a transition edge sensor(TES)[2,6]. A. Device Architecture: The prototype device or GFET has three main components: the semiconductor as absorber, a buffer layer of dielectric oxide, and the graphene on top of it. An electric field is created by applying gate voltage to absorber and electrode present on graphene (Fig.2). 531
A. Principle of operation: Scheme employed for Graphene Field Effect Transistor radiation detection consists of resistivity change resulting from changes in the electric field caused by ionizing radiation changes. The gate voltage drops across both the absorber and the buffer layer, when using an undoped insulation (low conductivity) semiconductor as the absorber (Fig.3). Electric field increases when semiconductor absorber is a conductive as the gate voltage drops primarily across the buffer layer (Fig.4). The conductivity of absorber increases when an ionizing radiation interacts with the absorber, resulting in an increase electric field, on applying suitable gate voltage at the back gate of the absorber and underneath graphene (Fig.4).
Fig.4.The incoming radiation ionizes the intrinsic semiconductor to create a conducting absorber. The gate voltage (VG) is now effectively transferred through the absorber and drops across the insulator. This result in an increased electric which is detected by graphene via the field effect (Fig.3) and is signaled by a corresponding change in resistance.
Fig.3.when the undoped absorber acts as an insulator, the gate voltage (VG) drops across the both absorber and the insulator, resulting in a relatively small electric field.
The energy deposited in the substrate has the poor correlation with electric field change near graphene, which could compromise the ability to measure deposited energy through change of resistance. Drifting of charges to the surface of the absorber, each interaction position to the layer at a constant distance from graphene is effectively normalized. The top electrode (graphene) and back gate electrode (absorber) is applied with a drift electric field, a curved electric field line, which become denser as they get closer to the graphene, is created due to the configuration of involving a large back gate electrode and small graphene. Under the graphene, field lines funnel electrons created by the ionizing radiation in the absorber are directed directly which results in an electric field response independent of where these ionization occur spatially in the absorber and dependent on the amount of such ionized electrons.
Fig.5.A cross section of GFET showing electrons both before and after they are drifted. The path of electrons taken is determined from the electric field lines, which are signified by dotted lines.
The insulation buffer layer as mentioned above in the Graphene Field Effect Transistor prevents the electrons from flowing out the gate drain electrode. The maximum change in electric field experienced by the graphene is directly related to the number of electrons created. Before the electrons are being collected through the drain, such that drift velocity in the transverse direction can be made much smaller than that in the vertical direction , which allows the electrons to settle under the graphene IV. MONTE CARLO MODEL FOR RADIATION INTERACTION A. Detector Modeling: Geant4 Monte Carlo code is used for modeling Si-based GFET, with a 600Mev gamma ray source from the bottom of the absorber, emitting into 4 Solid angle.
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Fig 7(b).A CASINO Simulation of a beam of 600Mev electrons being emitted normal to a GaAs wafer of 500m.The red tracks are the electrons which have been backscatered out of the absorber
Fig.6.A.model of Interaction of Radiation from Geant4,where an synthetic 60Co which interacts with the detector block and a scintillator is placed to track any radiation passitng through the block [14].
B.COMSOL Model for Electronic Response: To estimate the electric field distribution for a simplified model of proposed Graphene Field Effect Transistor Finite Element Method simulations were conducted. COMSOL Multiphysics 3.5a is the FEM platform utilized in the simulation in which Conductive media DC application mode for two dimensions is employed. Poissons equation is solved in the model: (1) Where V is the voltage, Qj is the current source is the conductivity Je is external current density For simplicity and taking into consideration of important physics ,the conductivity values of SiO2 and the idealized highly intrinsic silicon substrate were taken to be 110-14 S/m in the model. Since the Je and Qj parameters were zero in the simulations, on solving poissons equation was reduced to Laplace equation. The device model considered here consists of a squaredshaped highly insulation intrinsic silicon substrate, measuring 500m by 500m, with a rectangular SiO2 top layer, measuring 500m by 300nm.The Graphene region was modeled as a grounded portion of the top surface of the SiO2 while the back gate of GFET structure is located in the bottom of the Si substrate. The left and right border boundaries in the model were designated as insulating boundary conditions while continuity conditions were designated for interior boundaries.
Fig 7(a).A CASINO Simulation of a beam of 600Mev electrons being emitted normal to a GaAs wafer of 500m.The red tracks are the electrons which have been backscatered out of the absorber.
The use of HfO2 as the buffer provide more significant fraction of electrons to travel through the buffer material limiting the electron-electron interactions and hole-electron traps once they reach energies of about ~600KeV.Here,when buffer HfO2 is used number of back scattered electrons and Secondary electrons can be distinguished by different color (BSE RED, SE BLUE in these cases). The interactions volume can also be estimated using scaling shown on screen.
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Fig.8.A triangular mesh of 2804 for the geometry of the model using FEM platform of COMSOL
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Fig.10 .Calculated distribution of the euipotential lines (1) and electric field profile (2) 1nm into the top of SiO2 top surface for two examples of ionization regions:one that reaches the Si/SiO2 and one that starts form the back gate boundary. The model assumed that the back gate biased at 10V.The shape and profile of the ionization region (width=10m).
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Fig.9.Calculated distribution of equpotential line (1) and electric field profile (2)
In an ionizing event the simulation investigated the modulation of electric field due to the generation of charges in the intrinsic silicon substrate. Carrier concentration data generated by GEANT4 simulations were used to determine the conductivity of the ionized regions in the model. Surrounding media (undoped Si or Sio2) has low conductivities than those of the ionization regions. A back gate voltage of 10V is assumed in the model .For two different energy deposition profiles, fig 9 illustrates the effect of ionization regions on the distribution of the equipotential lines in the Si absorber. It can be analyzed FEM simulations that ,in principle, the modulation of electric field in such a way as to produce a substantial change in the resistance of nearby graphene layer in GFET, in case of an ionizing event.
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Fig.11:1) COMSOL Simulation of the field lines created with the gate voltage of VG =-100V, applied from the electrode on the bottom of the absorber to the graphene (taken to be 2m wide in this simulation).The field lines, shown as red arrows, reveal the path of the drifted electrons, which converge under the graphene, independent of initial position. 2) The line plot shows the electric field strength 5nm below the SiO2 near the graphene region.
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