Sie sind auf Seite 1von 232

Internal Use Only

Service Manual

Service Manual KT520

Model : KT520

Date: June, 2008 / Issue 1.0

Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 4.14 Procedure to check ............................121 4.15 Checking Common Power Source Block ..................................................122 4.16 Checking VCXO Block .......................127 4.17 Checking Front End Module Block.....132 4.18 Checking Front End Module Block input logic...........................................133 4.19 Checking WCDMA Block ...................142 4.20 Checking GSM Block .........................155

2. PERFORMANCE...............................7
2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................9 2.4 Current Consumption.............................18 2.5 RSSI.......................................................18 2.6 Battery Bar .............................................18 2.7 Sound Pressure Level............................19 2.8 Charging ................................................20

5. DOWNLOAD .................................167
5.1 The Purpose of Downloading Software...............................................167 5.2 Download Environment Setup .............167 5.3 KT520 Download .................................168 5.4 How to KT520 Download .....................172

3. TECHNICAL BRIEF ........................21


3.1 Digital Baseband(DBB) & Multimedia Processor...............................................21 3.2 GAM Hardware Subsystem ...................45 3.3 Audio Part ..............................................57 3.4 GPADC(General Purpose ADC) and AUTOADC2 ...........................................65 3.5 Charger control ......................................66 3.6 Voltage Regulation.................................72 3.7 RF Technical Description.......................73

6. BLOCK DIAGRAM ........................175 7. Circuit Diagram ............................177 8. BGA Pin Map ................................187 9. PCB LAYOUT ................................193 10. Calibration ..................................201
10.1 General Description ...........................201 10.2 XCALMON Environment ....................201 10.3 Calibration Environment.....................202 10.4 Program Operation ............................203

4. TROUBLE SHOOTING ...................84


4.1 Power ON Trouble .................................84 4.2 USB Trouble ..........................................85 4.3 SIM Detect Trouble ................................86 4.4 MicroSD card Trouble ............................87 4.5 Keypad, Touch Button and Touch Screen Trouble ...........................88 4.6 Camera Trouble .....................................91 4.7 Main LCD Trouble..................................94 4.8 Keypad Backlight Trouble ......................96 4.9 Folder ON/OFF Trouble .........................98 4.10 Audio Trouble Shooting .....................100 4.11 Charger Trouble Shooting..................115 4.12 Checking Bluetooth Block ..................118

11. EXPLODED VIEW & REPLACEMENT PART LIST ......209


11.1 EXPLODED VIEW .............................209 11.2 Replacement Parts ............................213 11.3 Accessory ..........................................231

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

-3-

LGE Internal Use Only

LGE Internal Use Only

-4-

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information


A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

-5-

LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions


This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation


A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices ATTENTION


Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.

Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

-6-

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time Specification GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset 101.4X49.6X15.3 mm 90g (with standard battery) 800mAh Li-Polymer Over 170 Min (WCDMA, Tx=12 dBm, Voice) Over 200 Min (GSM, Tx=Max, Voice) Standby Time Over 260 hrs (WCDMA, DRX=2.56) Over 260 hrs (GSM, Paging period=5) Antenna Main LCD Main LCD BL Vibrator Speaker MIC Receiver Earphone Jack SIM Socket Volume Key Voice Key External Memory I/O Connect Intenna type 2.0"(320x240), 260K TFT Color LCD White LED Backlight Yes (Coin Type) Yes Yes (SMD Type) Yes Yes Yes(SIM Block Type) : 3.0V & 1.8V Push Type ( + , - ) Push Type T - Flash Socket 18 Pin

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

-7-

LGE Internal Use Only

2. PERFORMANCE

2.2 Usable environment


1) Environment
Item Voltage Operation Temp Storage Temp Humidity Specification 3.7 (Typ), 3.4 (Min), (Shut Down: 3.35) -20 ~ + 60 -30 ~ + 85 max. 85 Unit V C C %

2) Environment (Accessory)
Item Power
* CLA : 12~24V(DC).

Spec. Available power

Min 100

Typ. 220

Max 240

Unit Vac

LGE Internal Use Only

-8-

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

2.3 Radio Performance


1) Transmitter-GSM Mode
No 1 Conducted Spurious Emission Item MS allocated Channel 1G~12.75GHz -33dBm GSM 100k~1GHz -39dBm DCS/PCS 9k~1GHz 1G~1710MHz 1710M~1785MHz -39dBm -33dBm -39dBm

1785M~12.75GHz -33dBm Idle Mode 100k ~ 880MHz 880M ~ 915MHz 915M~1000Mz 1G~1.71GHz -60dBm -62dBm -60dBm -50dBm 100k~880MHz 880M~915MHz 915M~1000MHz 1G~1.71GHz 1.71G~1.785GHz -60dBm -62dBm -60dBm -50dBm -56dBm

1.71G~1.785GHz -56dBm 1.785G~12.75GHz -50dBm Radiated Spurious Emission MS allocated Channel 1G~4GHz -30dBm 30M~1GHz -36dBm

1.785G~12.75GHz -50dBm 30M~1GHz 1G~1710MHz 1710M~1785MHz 1785M~4GHz -36dBm -30dBm -36dBm -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm

Idle Mode

30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~1.71GHz

-57dBm -59dBm -57dBm -47dBm

30M~880MHz 880M~915MHz 915M~1GHz 1G 1.71GHz 1.71G~1.785GHz 1.785G~4GHz

1.71G~1.785GHz -53dBm 1.785G~4GHz -47dBm

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

-9-

LGE Internal Use Only

2. PERFORMANCE

No 2 3

Item Frequency Error Phase Error 0.1ppm 5(RMS) 20(PEAK)

GSM

DCS/PCS 0.1ppm 5(RMS) 20(PEAK) 3dB below reference sensitivity RA250: 250Hz HT100: 250Hz TU50: 150Hz TU1.5: 200Hz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB 400kHz 600kHz 1200kHz 1800kHz Frequency offset -22dB -24dB -24dB -27dB 800kHz 0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz 6000kHz +0.5dB -30dB -33dB -60dB -60dB -65dB -73dB

Frequency Error Under Multipath and Interference Condition

3dB below reference sensitivity RA250 : 200Hz HT100 : 100Hz TU50 : 100Hz TU3 : 150Hz

Output RF Spectrum

Due to modulation

0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 3000kHz 3000 ~ 6000kHz 6000kHz

Due to Switching transient

400kHz 600kHz 1200kHz 1800kHz

Intermodulation attenuation

Intermodulation product should be Less than 55dB below the level of Wanted signal

LGE Internal Use Only

- 10 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

No 8

Item Transmitter Output Power Level 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

GSM Power 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 Toler. 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

DCS/PCS Power 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Toler. 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5

Burst timing

Mask IN

Mask IN

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 11 -

LGE Internal Use Only

2. PERFORMANCE

2) Transmitter-WCDMA Mode
No 1 Item Maximum Output Power Specification Class 3 : +24dBm(+1/-3dB) Class4: +21dBm(2dB) 2 3 4 Frequency Error Open Loop Power control in uplink Inner Loop Power control in uplink 0.1ppm 9dB@normal, 12dB@extreme Adjust output(TPC command) cmd +1 0 -1 1dB +0.5/1.5 -0.5/+0.5 -0.5/-1.5 2dB +1/3 -0.5/+0.5 -1/-3 3dB +1.5/4.5 -0.5/+0.5 -1.5/-4.5

Group (10 equel command group) +1 5 6 Minimum Output Power +8/+12 +

-50dBm(3.84MHz)

Out-of-synchronization handling of output power Qin/Qout : PCCH quality levels Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB

7 8

Transmit OFF Power Transmit ON/OFF Time Mask

-56dBm(3.84MHz) 25us PRACH,CPCH,uplinlk compressed mode

Change of TFC

25us Power varies according to the data rate DTX : DPCH off (minimize interference between UE)

10 11 12

Power setting in uplink compressed Occupied Bandwidth(OBW) Spectrum emission Mask

3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M -39-10*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M

13

Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm

LGE Internal Use Only

- 12 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

No 14

Item Spurious Emissions (*: additional requirement)

Specification -36dBm@f=9~150KHz, 1K BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k -30dBm@f=1~12.75GHz, 1M -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k

15

Transmit Intermodulation

-31dBc@5MHz, Interferer -40dBc -41dBc@10MHz, Interferer -40dBc

16

Error Vector Magnitude (EVM)

17.5%(>-20dBm) (@12.2K, 1DPDCH+1DPCCH)

17

Transmit OFF Power

-15dB@SF=4, 768kbps, multi-code transmission

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 13 -

LGE Internal Use Only

2. PERFORMANCE

3)Receiver-GSM Mode
No 1 2 Item Sensitivity (TCH/FS Class II) Co-Channel Rejection (TCH/FS Class II, RBER, TU high/FH) 3 Adjacent Channel Rejection 4 400kHz C/Ia2=-44dB Wanted Signal: -98dBm 1st interferer: -44dBm 2st interferer: -45dBm 5 Blocking Response (TCH/FS Class II, RBER) Wanted Signal: -101dBm Unwanted Signal: Depend on freq. C/Ia2=-44dB Wanted Signal :-96dBm 1st 1st interferer: -44dBm 2st interferer: -44dBm Wanted Signal: -101dBm Unwanted Signal: Depend on freq. 200kHz C/Ia1=-12dB C/Ia1=-12dB GSM850/900 -105dBm C/Ic=7dB DCS & PCS -105dBm C/Ic=7dB

Intermodulation Rejection

LGE Internal Use Only

- 14 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

4) Receiver-WCDMA Mode
No 1 2 Item Reference Sensitivity Level Maximum Input Level Specification -106.7dBm(3.84M) -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 3 Adjacent Channel Selectivity (ACS) 33dB UE@+20dBm output power(class3) 4 In-band Blocking -56dBm/3.84MHz@10MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) 5 Out-band Blocking -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 & 2230~2255MHz, band a) UE@+20dBm output power(class3) -15dBm/3.84MHz@f=1~2025 & 2255~12500MHz, band a) UE@+20dBm output power(class3) 6 Spurious Response -44dBm CW UE@+20dBm output power(class3) 7 Intermodulation Characteristic -46dBm CW@10MHz & -46dBm/3.84MHz@20MHz UE@+20dBm output power(class3) -57dBm@f=9KHz~1GHz, 100k BW 8 Spurious Emissions -47dBm@f=1~12.75GHz, 1M -60dBm@f=1920~1980MHz, 3.84MHz -60dBm@f=2110~2170MHz, 3.84MHz

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 15 -

LGE Internal Use Only

2. PERFORMANCE

5) Transmitter
5.1 Transmitter
No 1 2 3 Out Power Power Density Power Control Item Specification Class 2 : -6~4dBm Power density < 20dBm per 100kHz EIRP Option 2dB step size 8dB 4 TX Output Spectrum -Frequency range fmax & fmin @ below the level of -30dBm (100khz BW) within 2.4GHz~2.4835GHz 5 6 TX Output Spectrum -20dB Bandwidth Tx Output Spectrum -Adjacent channel Po 1MHz -20dBm @ C/I = 2MHz -40dBm @ C/I 3MHz 7 Modulation Characteristics 140kHz delta f1 avg 175kHz delta f2max 115kHz at least 99.9% of all deltaf2max delta f2avg/deata f1avg 0.8 8 9 Init. Carrier Freq. Tolerance Carrier Frequency Drift 75KHz 1 slot : 25kHz 3 slot : 40kHz 5 slot : 40kHz Maximum drift rate 20KHz/50usec 10 Out of Band Spurious Emissions Freq.Range 30MHz~1GHz Above 1GHz~ 12.75GHz 1.8~1.9GHz 5.15~5.3GHz -47dBm -47dBm -47dBm -47dBm Operating -36dBm -30dBm Standby -57dBm -47dBm

LGE Internal Use Only

- 16 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

5.2 Transmitter
No 1 2 3 Item Sensitivity single slot packets Sensitivity multi slot packets C/I performance Specification BER 0.1%@-70dBm BER 0.1%@-70dBm BER 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz Interference Co-Channel interference, C/I co-channel Adjacent(1MHz)interference, C/I 1MHz Adjacent(2MHz)interference, C/I 2MHz Adjacent( 3MHz)interference, C/I 3MHz Adjacent( 3MHz)interference to in band mirror frequency, C/I image 1MHz 4 Blocking Characteristic BER 0.1%@wanted signal -67dBm interfering Signal Frequency 30MHz~2000MHz 2000MHz~2400MHz 2500MHz~3000MHz 3000MHz~12.75GHz 5 Intermodluation Performance BER 0.1%@wanted signal -64dBm static sinwave signal at f1=-39dBm a BT modulated signal f2=-39dBm(payload PRBS15) 6 Maximum Input Level BER 0.1%@-20dBm PowerLevel -10dBm -27dBm -27dBm -10dBm Ratio 11dB 0dB -30dB -40dB -9dB -20dB

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 17 -

LGE Internal Use Only

2. PERFORMANCE

2.4 Current Consumption


(VT test : Speaker off, LCD backlight On) Stand by WCDMA Only 250 Hours = 3.0 mA (DRX=2.56) GSM 260 Hours = 3.0 mA (paging=5period) Voice Call 180 Min = 250 mA (Tx=12dBm) 200 Min = 220 mA (Tx=Max) VT 110 Min= 410 mA (Tx=12dBm)

2.5 RSSI
No 1 2 3 4 5 6 BAR 7 BAR 5 BAR 4 BAR 2 BAR 1 BAR 0 GSM -92 2 =< RSSI -97 2 =< RSSI -100 2 =< RSSI - -103 2 =< RSSI -105 2 =< RSSI -105 2 > RSSI WCDMA -89 2 =< RSSI -103 2 =< RSSI -107 2 =< RSSI -109 2 =< RSSI -111 2 =< RSSI -111 2 > RSSI

2.6 Battery Bar


Indication BAR 3 (100%) : level full BAR 3 (40%) -> 2 (12%) BAR 2 (12%) -> 1 (3%) BAR 1 (3%) -> Icon Blinking&Alerting Sound POWER OFF 3.2 0.05V Voltage 4.17V 0.05V 3.67 0.05V 3.52 0.05V 3.4 0.05V

LGE Internal Use Only

- 18 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

2. PERFORMANCE

2.7 Sound Pressure Level


No 1 Test Item Sending Loudness Rating (SLR) NOM MAX 2 Receiving Loudness Rating (RLR) NOM MAX 3 Side Tone Masking Rating (STMR) NOM MAX 4 5 6 7 Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) NOM MS MAX refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX 8 Idle Noise-Receiving (INR) NOM MAX 9 Sending Loudness Rating (SLR) NOM MAX 10 Receiving Loudness Rating (RLR) NOM MAX 11 Side Tone Masking Rating (STMR) NOM MAX 12 13 14 15 Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) HEAD SET NOM MAX refer to TABLE 30.3 refer to TABLE 30.4 NOM MAX 16 Idle Noise-Receiving (INR) NOM MAX -45dBPA under -40dBPA under -55dBm0p under 40dB over -1 3dB -12 3dB 25dB over -47dBPA under -36dBPA under 8 3dB -64dBm0p under 40dB over -1 3dB -15 3dB 17dB over Specification 8 3 dB

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 19 -

LGE Internal Use Only

2. PERFORMANCE

No TDMA NOISE GSM: Power Level: 5

Test Item GSM MS DCS: Power Level: 0 DCS

Specification SEND REV. SEND REV. GSM Headset SEND REV. DCS SEND REV. -62dBm under

17

(Cell Power: -90 ~ -105dBm) Acoustic(Max Vol.) MS/HEADSET SLR: 8 3dB MS/HEADSET RLR: -13 1dB/-15dB (SLR/RLR: mid-Value Setting)

2.8 Charging
Normal mode: Complete Voltage: 4.2V Charging Current: 700mA Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) Extend await mode: At Charging prohibited temperature(0C under or 45C over) (GSM: It should be kept 3.7V in all power level WCDMA: It will not be kept 3.7V in some power level)

LGE Internal Use Only

- 20 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF
3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
Access subsystem - Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM - Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA, Universal Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on - Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory (SRAM), and Program Data Read Only Memory (PDROM) - EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators - WCDMA subsystem - WCDMA hardware accelerators Application subsystem - Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM - Application peripheral subsystems - I2C, keypad, UART, and so on - Graphics subsystem - XGAM subsystem - Audio Processing Execution (APEX) and video encoder subsystems In addition to the two subsystems above, there is also a test block, chip control block, and a pad multiplexing block residing at the top level DSP - The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. - The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 21 -

LGE Internal Use Only

3. TECHNICAL BRIEF

WCDMA subsystem - The digital baseband controller WCDMA subsystem incorporate a WCDMA modem - An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMA subsystem has three AHB slave interfaces. - The Ericsson DB 3150 also includes HSDPA class 6 functionality. - The WCDMA subsystem is handled and provided by Ericsson. XGAM subsystem - The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. - The XGAM subsystem is handled and provided by Ericsson. Operation and Services - I2C Interface - SIM Interfaces - General Purpose I/O (GPIO) Interface - External Memory Interface that supports NAND, NOR, PSRAM, SDRAM - JTAG - RTC - ETM (in Prototype Package)

LGE Internal Use Only

- 22 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

KT520 Block Diagram

DB3150 Digital Baseband Processor (Dual core)


<3 Mega>

<Optical Joystick>

<USB Transceiver>

<Bluetooth >

Figure 3-1-1 KT520 Block Diagram

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 23 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.2 External memory interface


Device and battery Part Name Timememory Size RF calibration data, Audio parameters calibration Maker data etc are Item stored in flash Speed

area.

A. KT520
1Gb NAND flash memory + 512Mb SDRAM

Device Part Name Maker NAND flash

Part Name

Maker

Item

Time

Size

Speed 2.64MByte/s 8MByte/s

Program speedSpeed 200s 1 page = 528 Byte Item Time Size K5D1G12ACB-D075 Samsung Erase speed 2ms 1 Block = 16K Byte

Table 3- 1- 1. External Memory Interface Spec. of KT520

Figure 3- 1- 2. External Memory Configuration of KT520

Data Communication - IrDA (SIR) - UARTs (ACB, EDB (RS232)) - Slave USB

Package - 12 by 12 mm 344 balls, 0.5mm pitch FPBGA Production Package

LGE Internal Use Only

- 24 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.1.3 Hardware Architecture


A. Block Diagram

Figure 3-1-3. Access system of Ericsson DB3150

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 3-1-4. Application system of Ericsson DB3150

LGE Internal Use Only

- 26 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

B. CPU Subsystem
Access CPU subsystem The digital baseband controller includes an access CPU subsystem, which includes the submodules described below. - 32 KiB I-cache - 16 KiB D-cache - Page table - Memory Management Unit (MMU) - JTAG - ETM9 - 26 KiB I-TCM - 8 KiB D-TCM Application CPU subsystem The digital baseband controller includes an Application CPU subsystem, which includes the submodules described below. - 32 KiB I-cache - 16 KiB D-cache - Page table - MMU - JTAG - ETM9 - 8 KiB I-TCM - 8 KiB D-TCM

C. Peripheral Hardware Subsystem


The digital baseband controller includes hardware that supports mobile terminal peripherals such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem. The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate bridges, which provide a simple interface to support different timing and memory access arrangements.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

D. DSP Hardware Subsystem


The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

E. XGAM Subsystem
The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. The XGAM subsystem is handled and provided by Ericsson.

F. System Control Subsystem


The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices. The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.

LGE Internal Use Only

- 28 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.1.4 RF Interface
A. Asta Interface
DB3150 controls GSM RF part using these signals through GSM RF chip-RF3000. RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB

RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB

Y4 AA2 Y3 Y2

QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR

Figure 3-1- 5. Schematic of GSM RF Interface

B. WCDMA Radio Link Interface


RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN
RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB Y4 AA2 Y3 Y2 AB8 V7 AB5 AB6 Y10 W10 W9 Y9 Y8 W8 W7 Y7 AB7 QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR WTX_BAND_1_EN WDCDC_EN WPOW_DET_EN WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P WTX_I_N WTX_I_P WTX_Q_N WTX_Q_P WPOW_DET

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS DAC_I_NEG DAC_I_POS DAC_Q_NEG DAC_Q_POS TX_POW

Figure 3-1-6. Schematic of WCDMA RF Interface

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.5 SIM Interface


SIM interface scheme is shown in Figure3-1-6. SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(DB3150) with ABB(AB3000) and filter.

SIM (Interface between DBB and ABB) SIMDAT0 SIMCLK0 SIMRST0 SIM card bidirectional data line SIM card reference clock SIM card async/sync reset Table 3-1-2. SIM Interface

DB3150

VDDE 10K

SIMVCC AB3000 10K VDD SDAT SCLK SRST SIMDAT SIMCLK SIMRST DAT CLK RST CARD

SIMDAT0 SIMCLK0 SIMRST0

Figure 3-1-7. SIM Interface

3.1.6 UART Interface


UART signals are connected to DB3150 GPIO through IO connector Resource Name UART0 ACC_GPIO_2 ACC_GPIO_3 ACC_GP02_UART0_RX ACC_GP03_UART0_TX UART1 APP_GPIO_0 APP_GPIO_1 APP_GP00_UART_RX APP_GP01_UART_TX Table 3-1-3. UART Interface APP Receive Data APP Transmit Data ACC Receive Data ACC Transmit Data Note

LGE Internal Use Only

- 30 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.1.7 GPIO (General Purpose Input/Output) map


In total 39 allowable resources. This model is using 39 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table.

Access GPIO
GPIO ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_14 ACC_GPIO_15 ACC_GPIO_16 ACC_GPIO_17 ACC_GPIO_18 ACC_GPIO_19 ACC_GPIO_20 ACC_GPIO_21 ACC_GPIO_22 ACC_GPIO_23 Assigned Name ACC_GP00_USB_STP ACC_GP01_USB_DIR ACC_GP02_UART0_RX ACC_GP03_UART0_TX ACC_GP04_USB_CLK ACC_GP05_USB_NXT ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP12_KEY_LED_ON ACC_GP13_SPK_AMP_EN ACC_GP14_BT_SPI_INT NA ACC_GP16_MC_DETECT NA ACC_GP20_USB_CS_PD NA ACC_GP22_USB_DAT3 ACC_GP23_BT_SPI_CS0n ACC_GP24_BT_SPI_DAT0 ACC_GP25_BT_SPI_DAT1 ACC_GP26_BT_SPI_CLK ACC_GP27_AMP_SW_EN input / Output Output High Output low Input Output low Output low Init Status Output low input input Output input input input / Output input / Output input / Output input / Output Output low Output low Input Output Low Input Output Low input / Output

Table 3-1-4. DB3150 ACC GPIO Map Table

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 31 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Application GPIO
GPIO APP_GPIO_0 APP_GPIO_1 APP_GPIO_2 APP_GPIO_3 APP_GPIO_4 APP_GPIO_5 APP_GPIO_6 APP_GPIO_7 APP_GPIO_8 APP_GPIO_9 APP_GPIO_10 APP_GPIO_11 APP_GPIO_12 APP_GPIO_13 APP_GPIO_14 Assigned Name APP_GP00_UART_RX APP_GP01_UART_TX APP_GP02_MC_IO_OFF APP_GP03_FLIPSENSE APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP10_BL_CTRL APP_GP11_OJ_CS_n APP_GP12_PHFSENSE APP_GP13_MC_CLKRET APP_GP14_VC_IO_OFF ACC_GP15_CAM_LDO_CTRL NA Table 3-1-5. DB3150 APP GPIO Map Table Init Status Input Output Output Low (Hi-Z : low) Input Input Output Output Input Output low Output Input Input Output Low (Hi-Z : low) Output low Output low

LGE Internal Use Only

- 32 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.1.8 USB
The USB block supports the implementation of a High-speed device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO register access. The USB block can request up to six DMA channels, three for IN endpoints and three for OUT endpoints.

USB Function USB_STP USB_DIR USB_CLK USB_NXT USB_DAT0 USB_DAT1 USB_DAT2 USB_DAT3 USB_DAT4 USB_DAT5 USB_DAT6 USB_DAT7 USB_CS_PD VBUS

Note ULPI stop signal ULPI direction signal USB clock ULPI next signal USB data0 USB data1 USB data2 USB data3 USB data4 USB data5 USB data6 USB data7 USB chip select Power supply for Asta USB block Table 3-1-6. USB Signal Interface of DB3150

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 33 -

LGE Internal Use Only

3. TECHNICAL BRIEF

ACC_GP00_USB_STP ACC_GP01_USB_DIR ACC_GP02_UART0_RX ACC_GP03_UART0_TX ACC_GP04_USB_CLK ACC_GP05_USB_NXT ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7

J9 K9 P2 N9 M9 N4 P3 P4 R4 R3 R2

ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9

USB_DAT1 USB_DAT0 USB_DAT2

L4 L3 M4

USB_DAT_VP USB_SE0_VM USB_OE

Figure 3-1-8. Schematic of DB3150 USB block

VBAT

VDDE_1V8

C408 0.1u

C409 4.7u 10V

VCC NC2 NC1

F3 F2 F1

ACC_GP20_USB_CS_PD ACC_GP04_USB_CLK USB_DAT0 USB_DAT1 USB_DAT2 ACC_GP22_USB_DAT3 ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP05_USB_NXT ACC_GP00_USB_STP ACC_GP01_USB_DIR 51K

GND3 E4 GND2 D2 GND1 C5

C3 A4 B1 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6 4.7u 0.1u

TEST CHIP_SEL VCC_IO1 CLOCK VCC_IO2 DATA0 RREF DATA1 DATA2 DM U402 DP DATA3 DATA4 ISP1508AET FAULT DATA5 DATA6 DATA7 NXT STP DIR CFG0 REF1V8 ID CFG2 CFG1 PSW_N VBUS REG3V3 XTAL1 XTAL2

C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 R419 1% 12K 0.1u 4.7u 0.1u 2.2u

R415

USB_DM USB_DP

R417

1K

VBUS_USB_TRX USB_XTAL1

C412

C414

C413

C415

C416

Figure 3-1-9. Schematic of USB Transceiver

LGE Internal Use Only

- 34 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

C417

3. TECHNICAL BRIEF

3.1.9 Slider ON/OFF Detection


There is a magnet to detect the slide module status, up or down. If a magnet is close to the hall-effect switch(U502), the voltage at Pin 4 of U502 goes to 0V. Otherwise 1.8V. This APP_GP03_FILPSENSE signal is delivered to DB3150 APP_GP03.

VDDC_2V65

VDDE_1V8

U502 1 2 C525 0.1u 3 VDD GND1 NC

TK60012BM5 6 IO_VDD GND2 OUT 5 4 APP_GP03_FLIPSENSE

C526 0.1u

HALL EFFECT SWITCH


Figure 3-1-10. Slider On/Off Detector

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 35 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.10 Bluetooth Interface


KT520 supports Bluetooth operation using STs STLC2500C Bluetooth module.

A. General Description
The Bluetooth interface utilizes the SPI interface for control signals going to and from the Bluetooth module. The SPI is also used for data transmissions. It uses the PCM interface for transmitting audio to and from the Bluetooth module. The Bluetooth module uses both the 26 MHz master clock signal and the 32,768 kHz low-frequency clock signal for internal timing within the Bluetooth module. The intention is to use the low-frequency clock as a low-power timing provider and to use the 26 MHz as a high precision timing reference used mainly by the Bluetooth radio during operation. The clock request mechanism is used to minimize current consumption for the total system. The intention is to use the CLKREQ signal to ask for the master clock when needed, for example, when the Bluetooth radio is operating.

B. SPI Interface
The physical SPI interface is made up of 5 signals : clock, chip select, data in, data out and interrupt. When the SPI mode is selected , these signals are available through the BT_UART and BT_HOST_WAKEUP pins. The SPI interface is Master at the Host side, and Slave at the BT Controller side. It is designed to work with the H4 protocol. It does not support HCI synchronous data packet transfer. Data are transferred on the SPI interface in byte format, LSB first. The SPI interface can operate only in half duplex mode.

C. PCM Interface
The PCM interface is used to send audio to and from the Bluetooth module. The interface is a synchronous interface using a PCM clock and a PCM sync signal for synchronization. Two data signals are used for data, one in each direction. The PCM clock signal operates at frequencies as high as 1 MHz. The word length of the audio data can be 8 or 16 bits. Furthermore, the PCM interface has a function known as MP-PCM, which is an addressing scheme, used to have more than two devices talking on the bus. To add this function, the data pins have to be bi-directional. Additionally, the position of the audio data relative to the frame sync pulse must be selectable. During the periods within a frame that a device is not transmitting audio data, it must put both PCM data signals in a high-impedance state to allow other devices access.

LGE Internal Use Only

- 36 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

D. Master Clock and Clock Request Interface


The master clock (MCLK) is a 26 MHz signal used as the high precision clock signal for the Bluetooth module. The signal can be switched on and off by the platform. The master clock request (CLKREQ) is used by the Bluetooth module to ask for the master clock. If the Bluetooth module asserts the signal high, it gets the master clock. The other alternative for the Bluetooth module is to set the clock request output to high impedance state, indicating that it does not need the master clock. The Bluetooth module receives the master clock, if other parts of the chipset request it.

E. Low Frequency Clock Interface


The low-frequency clock signal (RTCCLK) is used by the Bluetooth module as a low-power clock. The clock is used in different Bluetooth modes, like sniff and park, to have a correct timing on the Bluetooth air interface without having the master clock running. The low-frequency clock is always present, in some applications even when the chipset is powered down.

F. STLC2500C
Bluetooth specification compliance: V2.0 + EDR. Based on Ericsson Technology Licensing Baseband Core (EBC) Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability Asynchronous Connection Oriented (ACL) logical transport link Synchronous Connection Oriented (SCO) link: 2 simultaneous SCO channels Supports Pitch-Period Error Concealment (PPEC) - Improves speech quality in the vicinity of interference like e.g. WLAN - Used with CVSD air coding - Works at receiver, no Bluetooth implication Adaptive Frequency Hopping (AFH): hopping kernel, channel assessment as Master and as Slave Faster Connection: Interlaced scan for Page and Inquiry scan, first FHS without random back off, RSSI used to limit range Extended SCO (eSCO) links

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 37 -

LGE Internal Use Only

3. TECHNICAL BRIEF

HW support for packet types - ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3,2-DH5,3-DH1,3-DH3, 3-DH5 - SCO: HV1, HV3 and DV - eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 Clock support - System clock input (digital or sine wave) at 9.6, 10, 13, 16, 16.8, 19.2, 26, 33.6 or 38.4MHz - LP clock input at 3.2, 16.384, 32 or 32.768 kHz ARM7TDMI CPU - 32-bit Core - AMBA (AHB-APB) bus configuration Patch RAM capability Memory organization - On chip RAM, including provision for patches - On chip ROM, preloaded with FW up to HCI Communication interfaces - Fast UART up to 4Mbit/s - SPI interface - PCM/I2S interface - Up to 10 additional flexibly programmable GPIOs - External interrupts possible through the GPIOs - Fast master I2C interface Efficient and flexible support for WLAN coexistence in collocated scenario

LGE Internal Use Only

- 38 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

G. KT520 Bluetooth Schematic


U101
RESOUT2_n BT_CLK RTCCLK D3 RESET_N D6 REF_CLK_IN G3 LP_CLK C5 ACC_GP25_BT_SPI_DAT1 ACC_GP26_BT_SPI_CLK ACC_PCM_CLK ACC_PCM_SYNC ACC_PCM_DLD ACC_PCM_ULD CLK_REQ_OUT_1 BT_WAKEUP F6 UART_TXD F4 UART_RTS ACC_GP24_BT_SPI_DAT0 ACC_GP23_BT_SPI_CS0n

STLC2500C

C4

F5 UART_RXD G4 UART_CTS D1 PCM_CLK C2 PCM_SYNC D2 PCM_A E1 PCM_B B3 GPIO_16 C3 GPIO_8 B1 GPIO_9 C1 GPIO_10

GPIO_11

B2

VDDE_1V8 ACC_GP14_BT_SPI_INT

D5 GPIO_0 E6 CLK_REQ_IN_1 G6 CLK_REQ_IN_2 F7 HOST_WAKEUP E2 CONFIG_1 F2 CONFIG_3 F1 CONFIG_2

A2 VSS_RF1 A5 VSS_RF2 VSS_BT_RF A3 RFP A4 RFN FL100 5 4 BP1 BP2 DEA212450BT-7043C1 1 U_BP BP_DC 2 L100 NA L101 NA VSS_BT_RF C105 100p
FEED

ANT100 AMAA802012LG09
GND1 GND2

BT_CLKREQ_n VDDK_2V75 VDDE_1V8

CLK_REQ_OUT2 E3 VSS_DIG1 E4 VSS_DIG2

A6 TOUT_IP_QN B5 TOUT_IN_QP G2 VSS_BT_ANA

VDD_D VDD_IO_A VDD_IO_B VDD_CLD VDD_HV_A VDD_HV_D B4 VSS_ANA1 B6 VSS_ANA2 C6 VSS_ANA3

VSS_BT_RF

6 3

G2 G1

G7

VSS_BT_RF VSS_BT_RF

R119

G5 F3

R118

DNI

R124

E7 A7 G1

B7 VDD_DSM C7 VDD_N D7 VDD_CL A1 VDD_RF

VSS_BT_ANA AF_PRG E5

Bluetooth
C106 0.22u C107 0.22u C108 0.22u C109 0.1u C110 0.22u C111 0.1u C112 0.1u C113 0.22u

VSS_BT_ANA

VSS_BT_RF

Figure 3-1-11. Schematic of STLC2500C Clock - Clock request Connected to CLKREQ of DB3150 and AB3000, input to RF3000 - Fast clock : 26MHz Supplied MCLK from RF3000 Frequency deviation : 20ppm - Low power clock : 32.768kHz Supplied RTCCLK from AB3000 Power - Supplied 2.75V, 1.8V from internal regulators of AB3000 Reset - RESOUT2_n signal of DB3150 controls STLC2500C reset. SPI - Connected to SPI of DB3150 - HCI interface between DB3150 and STLC2500C PCM - Audio signal interface between DB3150/AB3000 and STLC2500C ANT - 2.4GHz, 50 ohm matching

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 39 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.11 MicroSD Interface card


KT520 supports the MicroSD card interface as external memory card. MicroSD card has 4-data line, so KT520 uses 4-data lines. All control and data lines are connected to DB3150. Cause of the difference between DB3150 and MicroSD card, a level shifter should be added. MicroSD card Interface ACC_GP16_MC_DETECT MICROSD_CMD_2V7 MICROSD_CLK_2V7 MICROSD_DAT_2V7 VDDG_2V75 Card detection, connected to GPIO of DB3150 Command/Response Clock Data line Supply voltage from AB3000 internal LDO Table 3-1-7. MicroSD card Interface Card detection - Card detection - When there are no card in MicroSD card socket, MICROSD_DETECT pin is high cause of an external pull-up. - If card is inserted in socket, MICROSD_DETECTpin changes Low cause of the mechanical switch in the socket. - VDDG_2V75 always supply power. - If card is removed, ACC_GP16_MC_DETECT pin changes high.

VDDE_1V8

VDDG_2V75

VDDG_2V75 100K 100K 100K 100K 100K C100 0.1u C101 0.1u

R101

R100

R102

R103

R104

S100 FL101 MICROSD_DAT_DIR MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CLK APP_GP13_MC_CLKRET A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 VCCA DAT0_DIR DAT0A DAT123_DIR DAT1A DAT2A DAT3A CMD_DIR CMDA CLKA CLK_F GND1 GND2 SN74AVCA406EZXYR D5 VCCB DAT0B D2 MICROSD_DAT0_2V7 ACC_GP16_MC_DETECT MICROSD_CMD_2V7 MICROSD_CLK_2V7 MICROSD_DAT0_2V7 GND C2 CMDB D3 CLKB MICROSD_CMD_2V7 MICROSD_CLK_2V7 0.1u SCHA1A0102 GND
DAT2_RSV CD_DAT3_CS CMD_DI VDD CLK_SCLK VSS DAT0_DO DAT1_RSV

D1 DAT1B C4 DAT2B D4 DAT3B

R116

470K

MicroSD Socket
Molex : ENSY0014101 (500873-0802) Alps : ENSY0013501 (SCHA1A0102)

MicroSD Level Shifter

Figure 3-1-12. MicroSD card and Schematic of MicroSD card Interface

LGE Internal Use Only

- 40 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

C102

3. TECHNICAL BRIEF

3.1.12 Power On Sequence


User presses END key and then ONSWAn signal is changed to Low. AB3000 initiates the internal oscillator and powers on the regulators. AB3000 generates power for DB3150. AB3000 releases the power reset signal(PWRRSTn) and generates an interrupt(IRQ0n) to DB3150.

AB3000 Power for DB3150 Press END key PWRRST ONSWAn ONSWA IRQ PWRRSTn IRQ0n

DB3150

RESPOW_N IRQ0_N

Figure 3-1-13. Power On Sequence

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 41 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.13 Key Pad and Touch key


There are 22 buttons and 3 side keys and 1 Optical Joystick key in Figure 3-1-13/14. Shows the Keypad circuit. END Key is connected ONSWAn for AB3000.

KEYIN0 KEYOUT0

KEYIN1

KEYIN2 Camera1 Side key 3 6 9 #

KEYIN3 Camera2 Side key soft1 left hot call

KEYIN4

KEYIN5

GND END

Volume up Volume down side key side key 1 4 7 * 2 5 8 0

KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4

up OK down

Soft2 right cancel

Table 3-1-8. Key Matrix Mapping Table

KEYIN0

KEYIN1

KEYIN2

KEYIN3

RB521S-30 ONSWA_n D501

6 5 4 3 2 1 CN523

Volume Camera

1
1

2
2

3
3 KEYOUT0

KEYOUT1

4
4

5
5

6
6 INSTPAR INSTPAR INSTPAR INSTPAR INSTPAR ESD9X5.0ST5G ESD9X5.0ST5G ZD505

KEYOUT2

ESD9X5.0ST5G

ZD501

ZD502

ZD503

KEYOUT3

KB_STAR

0
0

#
KB511

ZD504

ESD9X5.0ST5G

ESD9X5.0ST5G

R642 DNI INSTPAR KEYOUT4

110 ZD506

Figure 3-1-14. MAIN PCB KeyPad Circuit

LGE Internal Use Only

- 42 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

ESD9X5.0ST5G

KEY PAD AND SIDE KEY PAD

R643

3. TECHNICAL BRIEF

KEYIN3

KEYIN4

SOFT100

KEYIN5
UP SOFT101

KEYOUT1

LEFT

RIGHT

KEYOUT2

HOT

DOWN

CANCEL

KEYOUT3

CALL ONSWA_n

END

KEYOUT4

OJ KEY PAD

Figure 3-1-15. KEY PCB Key Pad Circuit

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 43 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.14 Optical Joystick


The Optical Joystick (OJ) is specially designed to support the graphic user interface (GUI) in advanced mobile devices (cellular phone, PDA, PMP, DSC etc.). The principles of operation and optical/mechanical structures are originally similar to the optical mice of PC, however, the design and principles are modified so that Optical Joystick will fit into extremely small space on mobile devices. Self-adjusting power-saving modes for longest battery life Smart Speed self-adjusting frame rate for optimum performance Internal oscillator - no clock input needed Wide operating voltage range: 2.6V ~ 3.6V nominal Six (6) wired serial port(3~5 wired serial port may be used optionally) Keyin4 and Keyout2 are used for OK key button.

VDDG_2V75

CN102 G1 G2 1 2 3 4 5 ZD103 ZD104 G3 G4 ZD100 10 9 8 7 6 R118 100K APP_GP07_OJ_MOTION_n_2V75 KEYIN4 KEYOUT2

APP_GP11_OJ_CS_n_2V75 APP_GP04_OJ_MISO_2V75 APP_GP05_OJ_MOSI_2V75 APP_GP06_OJ_SCLK_2V75

ESD9X5.0ST5G INSTPAR

ESD9X5.0ST5G INSTPAR

ESD9X5.0ST5G INSTPAR

10pin Optical Joystick Connector


AXK7L10227G (0.9T socket)

Figure 3-1-16. Optical Joystick

LGE Internal Use Only

- 44 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.2 GAM Hardware Subsystem

Figure 3-2-1. GAM Subsystem Functional Block Diagram

3.2.1 General Description


The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of visual imagery and the transfer of this data to the display. GAM also provides support for the camera module. The visual data could be graphics, still images or video. The GAM subsystem consists of five modules: GRAM : graphics memory (160 kB). GAMCON : GAM controller. GRAPHCON : graphics controller. PDI/SSI : programmable display interface for parallel/serial displays. CDI : camera data interface.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 45 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.2 Block Description


A. GAM Controller(GAMCON)
The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI. The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display module respectively, see Figure 2.28. The CIPCLK is used to clock the received data into the camera data interface. The CIPCLK can be in the range of 100 kHz to 16 MHz.

B. Graphics RAM (GRAM) Block


GAM includes 160 kB of graphics memory (GRAM) in order to support display screen sizes of QCIF + alfa display size and three frame buffers when decoding QCIF video. The GRAM can be accessed in 8, 16 or 32-bit mode. Write access takes a single AHB clock cycle. Non-sequential read and the first access of a sequential read access takes two AHB clock cycles. Subsequent sequential read access take a single AHB clock cycle. The GRAM contains both frame buffer and temporary data. There are three image areas with one used for normal MMI graphics and the other two areas used for still images, video frames or camera frames. The three image areas can be combined into one frame buffer. GRAM is required to transfer a VGA (640 by 480 pixels) image from the camera data interface (CDI) over DMA at 100 MBit/s, within a 50 ms timeframe. The GRAM is used as a buffer, but the average transfer bandwidth required is approximately 3 Mword/s (32-bit word), that is 12 MByte/s.

C. Graphics Controller (GRAPHCON) Block


GRAPHCON is controlled by the application CPU and can perform operations on pixels and image areas. Images can be moved and merged with other images and text. The GRAPHCON block receives graphical objects from GRAM and performers the appropriate graphical manipulation. The resulting data is transfers to the display interface (PDI). GRAPHCON can receive images from the camera data interface (CDI) and send them to the PDI automatically. GRAPHCON performs conversion from YUV to RGB and can scale (zoom) still or video images.

D. Programmable Display Interface (PDI) Block


The programmable display interface (PDI) is designed to interface both parallel and serial display modules. The display data is transferred from the 32 word FIFO on GAMCON to the display module via the PDI block. The PDI block is built around a micro controller and executes 16-bit instruction words to individually control the I/O ports. It has a 128 byte program memory, programmable by the CPU, which can store up to 64 instructions.

LGE Internal Use Only

- 46 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

The CPU transfers all set-up and control data to the display. Data is transferred to PDI as 32- bit words, which in turn writes 8-bit data to the display. The programmable PDI block is configured at the software build stage, to support either parallel interface such as PPI or serial interface such as SSI or I2C.

E. Camera Data Interface (CDI) Block


The camera data interface (CDI) block is designed to support a range of still image camera modules. An 8-bit parallel bus supports data transfer from the camera module to the CDI. The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the parallel bus. One byte of data is captured on each rising edge of the pixel clock. CDI allows the pixel clock to be in the range of 100 kHz to 16 MHz. The horizontal synchronization line is an input from the camera module and defines one scanline of image data. The horizontal synchronization line can be programmed to be active high or low. The vertical synchronization line is an input from the camera module and defines one image frame (image height) of data. The vertical synchronization line can be programmed to be active high or low. The frame rate can be adjusted by skipping frames and various interrupts are used to inform the application CPU regarding the progress of incoming images and potential errors. The normal data format on the data bus is YUV 4:2:2 (raw binary image data) according to the CCIR-656 standard. A function within the CDI can be programmed to reorder the YUV parameters as they pass through the CDI. In addition, the CDI is able to detect the end of an image and perform some truncation as well as overflow conditions. There is nothing preventing the use of other data types such as JPEG or RGB (as long as the timing is followed), but only YUV data can be sent to the display. Camera images can also be sent to a DMA channel to store the image in external memory. The I2C interface and GPIO are part of the interface to the camera module, but they are not part of the CDI block. The I2C is used to set-up and control the camera module. The camera module I2C lines must go high impedance when the supply is removed from the camera. The I2C commands needed to control the camera, as well as the functional behavior of the module, are also different for each implementation. The ON-signal (GPIO) is used to power-on the camera from Standby or Off mode (implementation dependent). This signal must be held low when the mobile equipment is powered down and during the mobile equipment reset period. The GPIO pin can also be an input or high impedance during mobile equipment reset and start. In this case, it must have pull-down to ground. The camera module reset signal is an output to the camera module.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 47 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.3 Camera & Camera Interface


PDI_RES_N PDI_C0 PDI_C1 PDI_C2 PDI_C3 PDI_C4 PDI_C5 PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7 CI_RES_N CI_PCLK CI_VSYNC CI_HSYNC CI_RES_n CI_PCLK CI_VSYNC CI_HSYNC E20 F20 E19 F18

R309

LCD_WR LCD_RS_n LCD_CS_n LCD_RD LCD_VSYNC PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7

LCD_RES_n

L14 DNI M20 M19 L21 L20 L19 K19 K20 J19 K21 J20 J21 J22 H19 H20

Figure 3-2-2. Camera Interface (in DB3150)

CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7


VDDH_CAM_CORE VDD_CAM_1V8 C504 1u 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 G4 C552 22p C551 DNI C505 0.1u CI_D7 CI_D6 CI_D5 CI_D4 CI_D3 CI_D2 CI_D1 CI_D0 R551 SYSCLK0 47 CI_VSYNC CI_HSYNC

CN501 G2 G1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 G3 C506 1u C507 0.1u C508 0.1u C509 0.01u C510 1u

CI_PCLK

CI_RES_n VDD_CAM_2V8 VDD_CAM_AF

APP_I2C_SDA APP_I2C_SCL

FB501

APP_GP02_MC_IO_OFF

FB502

34pin 3M CAMERA CONNECTOR


AXK7L34227G (0.9T socket)

Figure 3-2-3. 3M Camera Connector(34Pin Main Board)

LGE Internal Use Only

- 48 -

F19 G21 F21 G20 H21 G19 G22 H22

CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

VDD_CAM_2V8 VDD_CAM_1V8 CN503 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G3 G4 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36

VDDE_1V8

VDDG_2V75

SPK_RCV_P SPK_RCV_N

R501 R503

0 0 APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP11_OJ_CS_n KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4

VBAT

LCD_RD

C501 22p C502 22p

MOTOR_P MOTOR_N
1 9 8 7 6

G1

CI_D0 CI_D1 CI_D2 CI_D3

6 7 8 9

INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

4 3 2 1

LCD_WR LCD_RS_n LCD_CS_n LCD_VSYNC LCD_RES_n

R505 R506

47 47

G2

G1

ICVE10184E070R100FR

FL501 CI_RES_n APP_I2C_SDA APP_I2C_SCL CI_VSYNC CI_HSYNC SYSCLK0


1 2 3 4

10

FL502

10 5

G2

APP_GP10_BL_CTRL APP_GP15_CAM_LDO_CTRL APP_GP14_VC_IO_OFF ACC_GP12_KEY_LED_ON

2 3 4

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4

PDI_D7 PDI_D6 PDI_D5 PDI_D4

ICVE10184E150R500FR
9 8 7 6

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2

PDI_D3 PDI_D2 PDI_D1 PDI_D0

R508

47

G2

G1

INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

C513 C514 C515

C517

C518

70pin Main to FPCB CONNECTOR


AXK7L70227 (0.9T socket)

Figure 3-2-4. Main to LCD FPCB Connector(70Pin - Main)

C516

C519

VA500

ICVE10184E070R100FR

ULCE0505C015FR

22p 22p 22p

22p

22p

DNI

DNI

CI_D4 CI_D5 CI_D6 CI_D7

6 7 8 9

INOUT_B4 INOUT_A4

4 3 2 1

CI_PCLK

R509

47

ONSWA_n

VDD_CAM_2V8

CN100 APP_GP14_VC_IO_OFF SYSCLK0 CI_PCLK CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11

VDD_CAM_1V8

10

FL504

10 5

CI_RES_n APP_I2C_SCL APP_I2C_SDA


TP104 TP105

CI_HSYNC CI_VSYNC CI_D7 CI_D6

Figure 3-2-5. VGA LCD FPCB Connector

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 49 -

LGE Internal Use Only

RB521S-30 D603

KEYIN3 KEYIN4 KEYIN5

C503

1u

FL500

ICVE10184E150R500FR

3. TECHNICAL BRIEF

The 3M Camera modules are connected to 34-pin main board and VGA Camera module is connected to LCD FPCB with 20-pin Board to Board through 70 pin Board to Board connector. Its interface is dedicated camera interface port in DB3150. The camera port supply 24MHz master clock to camera module and receive 60MHz pixel clock(15fps) for 3M camera, 24MHZ pixel clock(15fps) for VGA camera, vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module. The camera module is controlled by I2C port.

pin no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Symbol GND PCLK GND GND RSTN(Ative Low) GND NC SDA SCL NC NC GND STBYN(Ative Low) LVDD1(Actuator) LVDD2(Driver IC) VDDA VDDA

pin no. 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

Symbol HSYNC VSYNC GND EXTCLK GND D0 D1 D2 D3 D4 D5 D6 D7 VDDIO VDDIO VDDD VDDD

Table 2-2-1. Interface between Main board and 2M camera (in Main)

LGE Internal Use Only

- 50 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

No. 1 2 3 4 5 6 7 8 9 10

Symbol PWDN CKIN GND_A DCLK D0 D1 D2 D3 D4 D5

Description N.C Input Clock Power Ground Video Clock 8Bit Data[0] 8Bit Data[1] 8Bit Data[2] 8Bit Data[3] 8Bit Data[4] 8Bit Data[5]

No. 20 19 18 17 16 15 14 13 12 11

Symbol D6 D7 Vsync Hsync GND_D SDA SCL #Reset Vdd_L Vdd_H

Description 8Bit Data[6] 8Bit Data[7] Vertical sync Horizontal sync Power Ground I2C Data I2C Clock #Reset 1.8V 2.8V

Table 2-2-2. Interface between VGA Camera Module and FPCB (in LCD FPCB)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 51 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.4 Camera Regulator


APP_GP15_CAM_LDO_CTRL enables 1.8V & 2.8V Camera Regulator for both 3M and VGA Camera. Charge Pump includes two voltage regulators. (3M : 2.8V for analog, 1.8V for I/O, 1.8V for digital), (VGA : 2.8V for analog, 1.8V for I/O, digital)
VBAT

U100 MAX8631XETI 23 1 C1P PIN 2 IN C101 10u 3 GND 24 PGND 29 BGND C1N C2P 22 26

C100 1u

C2N OUT APP_GP10_BL_CTRL 20 19 21 18 28 17 ENM1 ENM2 ENF ENLDO P1 P2

27 25

C102 1u VDD_BACKLIGHT

APP_GP15_CAM_LDO_CTRL

ESD9X5.0ST5G INSTPAR ZD101

8 7

SETM SETF REFBP

M1 M2 M3 M4 F1 F2 F3 F4 LDO1 LDO2

16 15 14 13 12 11 10 9 4 5 C104 1u C105 1u C106 10u

LCD_BL1 LCD_BL3 LCD_BL5 LCD_BL2 LCD_BL4

100K R102

R103

100K

6.8K

20K

6 C103 0.01u

VDD_CAM_2V8 VDD_CAM_1V8

R104 1%

BACKLIGHT CHARGE PUMP

Figure 3-2-6. 1.8V and 2.8V Camera Regulator in Charge Pump

1.5V LDO is used for only 2M digital core. Its derived from AB3000 and controlled by camera driver file.

R105 1%

VDDD_1V5 R639 R603 0 VDDE_1V8 0 VDIGRAD_1V8 C601 1u C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E A11 VDD_C B12 VDD_H A9 VDD_F A7 VDD_G VDD_K VDDLP M12 J11 C606 1u C607 1u C608 1u C609 1u C610 1u C611 1u R636 R637 R605 0 VDDG_2V75 0 VDDK_2V75 4.7K VBACKUP C602 1u C603 2.2u VDDC_2V65 VDDH_CAM_CORE VDDF_2V5 VDDG_2V75 VDDK_2V75

to AB3000 CODECs/ADC/PLL to All I/O Supplies and Memory to RF3000 and RF3100 digital

VDDC_2V65 VDDH_CAM_CORE VDDF_2V5

to Hall Switch, AB3000 BEAR SS 1.2V to DB3100 analog to SD Card and LCD and OJ to Bluetooth to AB3000 RTC module

VBAT_C 1608 120ohm(@100MHz) FB600

VBAT VCORE

VBUCK VDDBUCK SWBUCK

B2 A2 A1 BLM18PG121SN1J 3*3*1.2 0.85A 155mohm 30% L600 4.7uH Parallel with VCORE VBUCK_FB VCORE to DB3100 CORE

Figure 3-2-7. 1.5V Camera LDO in AB3000

LGE Internal Use Only

- 52 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.2.5 Display & LCD FPC Interface


LCD module include device in table 3-2 Device Main LCD Main LCD Backlight Type 320 x RGB x 240, 262K Color TFT LCD 5 White LEDs Table 3-2-3. Device in LCD Module LCD Module is connected to Key PCB with 35-pin Connector in sub PCB. The LCD is controlled by 8-bit PDI(Parallel Data Interface) in DB3150.

Table 3-2-4. Interface between LCD module and SUB PCB

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 53 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.6 LCD Module

Vibrator

Ear Piece

LCD Module

40 pin Connector

SUBPCB

35pin zip Connector

LCD FPCB

70pin BtoB Connector

Main Board

VGA Camera 3M Camera

Figure 3-2-8. LCD Module Block Diagram

262K TFT LCD 320 X 240 pixels

Main LCD Driver IC JBT6K85

Figure 3-2-9. LCD Module(Main LCD)

LGE Internal Use Only

- 54 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.2.7 LCD Backlight Illumination


There are 5 white LEDs in LCD Backlight circuit which is driven by Charge Pump(MAX8631). APP_GP10_BL_CTRL is used for Backlight brightness control.

VBAT

U100 MAX8631XETI 23 1 C1P PIN 2 IN C101 10u 3 GND 24 PGND 29 BGND C1N C2P 22 26

C100 1u

C2N OUT APP_GP10_BL_CTRL 20 19 21 18 28 17 ENM1 ENM2 ENF ENLDO P1 P2

27 25

C102 1u VDD_BACKLIGHT

APP_GP15_CAM_LDO_CTRL

ESD9X5.0ST5G INSTPAR ZD101

8 7

SETM SETF REFBP

M1 M2 M3 M4 F1 F2 F3 F4 LDO1 LDO2

16 15 14 13 12 11 10 9 4 5 C104 1u C105 1u C106 10u

LCD_BL1 LCD_BL3 LCD_BL5 LCD_BL2 LCD_BL4

100K R102

R103

100K

6.8K

20K

6 C103 0.01u

VDD_CAM_2V8 VDD_CAM_1V8

R104 1%

BACKLIGHT CHARGE PUMP

Figure 3-2-10. Charge Pump Circuit LCD Backlight

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

R105 1%

- 55 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.8 Keypad Illumination


There are 2 side view white LEDs in Main board backlight circuit, which are driven by LED1, LED2 port from AB3000.

VBAT

2 1 SSC-SWTS1007

2 1 SSC-SWTS1007

LD501 A

LD502 A

150

R517

R518

150

C524 0.1u

MCLK SLEEPA SLEEPB

VIBR

MAIN_LED1

Figure 3-2-11. Keypad Backlight LED Interface and Backlight Circuit

LGE Internal Use Only

MAIN_LED2

- 56 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

LED1 LED2 LED3

SDA SCL

H12 H10

K4 J10 L12

A6 D6 B7

B6

SHARED_I2C_SDA SHARED_I2C_SCL

SYSCLK1 ACC_SLEEP APP_SLEEP

MAIN_LED1 MAIN_LED2

MOTOR_EN

3. TECHNICAL BRIEF

3.3 Audio Part


3.3.1 Audio Part Block Diagram

Figure 3-3-1. Audio Part Block Diagram

3.3.2 Audio Signal Processing & Interface


Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (DB3150). This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip. The downlink path amplifies the signal from DBB chip (DB3150) and outputs it to Receiver (or Speaker). The audio interface consists of PCM encoding and decoding circuitry, microphone amplifiers and earphone drivers. The PCM encoder and decoder blocks are two-channel, 16-bit circuits with programmable gain amplifiers (PGA). The decoder has a receive volume control. The audio inputs and outputs can be switched to normal or auxiliary ports.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 57 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 3-3-2. Audio Interface Detailed Diagram(AB3000)

VSSBUCK PBIAS

B1 D1 C618 0.1u 10V F1 1u C622 Close to ABB SIMVCC Local Ground Plane

SIMVCC

Use Multiple Vias

J2 SIMRST_N H5 SIMCLK SIMDAT H2

SIMRST_n SIMCLK SIMDAT

D4 SCK1 D3 WS1 C2 SDI1 C1 SDO1 E4 SCK2 C3 WS2 D2 SDI2 F4 SDO2 MIC1P MIC1N MIC2P MIC2N MIC3P MIC3N MIC4P MIC4N K8 J8 L8 M9 M10 H8 K9 L9

I2S0_CLK I2S0_WS I2S0_ULD I2S0_DLD I2S1_CLK I2S1_WS I2S1_ULD I2S1_DLD DNI DNI DNI DNI

Main MIC
MIC1P MIC1N MIC2P MIC2N CCO1

Close to Main MIC


R612 0 C624 0.1u 0.1u MIC600 1 2 3 4 5 6 0
OUT G1 G2 G3 PWR G4

MIC1P C625 MIC1N

C626

C627

C628

C629

R614

SPM0204LE5-QB

CCO1 CCO2 SPKRP SPKRN BEARP BEARN AUXO1 AUXO2 LINEIN1 LINEIN2 MIDR

M7 K7 M2 M3 M4 J6 K6 M6 L10 K10 L5 47n C635 DNI C636 DNI C637 DNI C638 DNI

CCO1 CCO2 SPKRP SPKRN BEARP BEARN EAR_R EAR_L

Speaker Amp.

VBAT

MIDR R617 1% 39K

C630 2.2u VBAT

J5 C631 DEC3 J4 DEC4

C633 0.1u SWBOOST BOOST_ISENSE+ BOOST_ISENSEV_BOOST BOOST_SW1 BOOST_SW2 BOOST_SW3 BOOST_FB+ VSSBOOST A4 B5 C5 B3 C4 B4 A3 D5 E5

C634 0.1u

U601 C639 SPKRN C640 SPKRP ACC_GP13_SPK_AMP_EN 47n 47n R619 1%10K R620 1%10K C3 C2 B1 C1 100K 220n ININ+

TPA6205A1ZQVR VDD VO+ VOGND A3 B3 A1 C643 DNI B2 C644 DNI

BEARP

R618 1% 15

10 1

U602 FSA2268TUMX 8 1B0 1A 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 6 9 C646 0.01u

SPK_RCV_P

BEARN

R621 1% 15

2 3 4

SPK_RCV_N

_SHUTDOWN BYPASS

R624

C647

R625 1% 39K ACC_GP27_AMP_SW_EN

R627

Figure 3-3-3 . Audio Section scheme

LGE Internal Use Only

- 58 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

51K

3. TECHNICAL BRIEF

3.3.3 Audio Mode


Audio Mode includes three states.( Voice call, Midi.MP3). Each states is sorted by the total 7 Modes according to external Devices (Receiver,Loud Speaker,Headset). Video Telephony Mode Operate on state of the WCDMA CALL.

Mode Receiver Mode Loud Sp eaker Mode Voice ca ll Headset Mod e Vid eo Teleph on y Mod e MIDI MP3 Headse t Mode Only Lo ud Speaker Loud Speaker Mode

AB3000 In /Out Port IN MIC1P/MIC1N MIC1P/MIC1N MIC2P/MIC2N MIC1P/MIC1N OUT BEARP/BEARN SPKRP/SPKRN AUXO1/AUXO2 SPKRP/SPKRN SPKRP/SPKRN SPKR/SPKN AUXO1/AUXO2

Table 3-3-1. Audio Mode

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 59 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.3.4 Voice Call


A. Voice call Downlink Mode(Receiver, Speaker, Headset)
This section provides a detailed description of the Voice Call RX functions.

Figure 3-3-4. Voice call Downlink Scheme

The voice decoder accepts a serial input stream of linear PCM coded speech. The receive bandpass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path. The final step in the receive path is the auxiliary output. The auxiliary audio amplifier is intended to drive low impedance headphones. The earphone amplifier and the auxiliary audio outputs can be powered down (muted) via I2C. Both the earphone driver and one of the auxiliary drivers can simultaneously provide an output signal during voice decoding. Receiver Mode : BEARP/N Port Receiver(32) Loud Speaker / Video Telephony Mode : AB3000 SPK Amp SPKR/N AUDIO AMP(TPA6205) Speaker(8) Headset Mode : Auxiliary audio amplifier AUXO1/2 AUDIO AMP(TPA4411) Head Phone

LGE Internal Use Only

- 60 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

B. Voice Call Uplink Mode (Receiver,Speaker,Headset)


This section provides a detailed description of the Voice Call TX functions.

Figure 3-3-5. Voice call Uplink Scheme

From the audio path view point, voice call has the same structure as video telephony. The TXMIX connection enables insertion of audio into the uplink audio path. This can, for example, be used to play dictation recordings for the listener at the other party, in a voice call or video telephony call. The connection to TXMIX from the Audio Mixer must be performed in 8 kHz mono, since this is supported by the Voice mode. Due to performance reasons it may not be possible to decode every audio format during video telephony. Each Voice Uplink Mode paths shown below. Receiver Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Loud Speaker Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Video Telephony Mode : C-MIC(SP0102BE3) Veronica Input(MIC1N/1P) Headset Mode : Headset MIC Veronica Input(AUXI1N/1P) When the headset is inserted, EAR_DETECT_n(Circuit Diagram net Name) converted into low state So, the headset icon is displayed on Main LCD.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 61 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.3.5 MIDI (Ring Tone Play)


This section provides a detailed description of the MIDI and WAV-file functions.

Figure 3-3-6 External MIDI path

In Figure 2-4-6, External MIDI path is the same as Voice Loudspeaker downlink Mode , except source in DB3150 (DSP and Audio Mixer). MIDI : DB3150 PCM Decoder Auxiliary audio amplifier SPKRP/N Port AUDIO AMP(TPA6205) Speaker(8)

LGE Internal Use Only

- 62 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.3.6 MP3 (Audio Player)


This section provides a detailed description of the MP3 file functions.

Figure 3-3-7. MP3 Scheme

MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a audio amp and one speaker.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 63 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.3.7 Video Telephony


This section provides a description of the Video Telephony functions.

Figure 3-3-8. Video Telephony Scheme

Video Telephony Mode has same paths with Loud Speaker Mode.

3.3.8 Audio Main Component


There are 4 components in KT520 schematic Diagram. Part Number marked on KT520 Schematic Diagram.

NO 1 2 3 4

ITEM Speaker/Receiver MIC Audio AMP Ear-Jack SET

PART NUMBER SUSY0027501 SP0102BE3 TPA6205A SGEY0003327

MAKER EM-Tech Sisonic TI I - sound

Table 3-3-2. Audio Component List

LGE Internal Use Only

- 64 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.4 GPADC(General Purpose ADC) and AUTOADC2


The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention. The AUTOADC2 periodically measures the battery voltage or current. (Fig.3-41) shows the schematic of GPADC part. The GPADC channel spec is as following (Table 3-4-1).

Fig 3-4-1. Schematic of GPADC and AUTOADC2

Fig 3-4-2. GPADC and AUTOADC2 Block diagram

ADC 6 channels Resource GPA0 GPA2 GPA3 GPA4 GPA6 GPA7 Name RTEMP VLOOP WPOWERSENSE WRFLOOP GPA6 VBACKUP Description Radio temperature sense Loop voltage sense Reference voltage for PAM Lock inform Headset detect Backup battery

Table 3-4-1. GPADC channel spec

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 65 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.5 Charger control


A programmable charger in AB3000 is used for battery charging. It is possible to set limits for the output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-. The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the GPADC. Instead, the two measuring amplifiers translate these inputs to a voltage proportional to the input and within the range of the GPADC. (Fig.3-5-1) shows the schematic of charging control part.

300K

K12 XTAL1 K11 XTAL2 4 3 MC-146_12_5PFX600 C612 24p 32.768KHz C613 24p RTCCLK J12 1 32KHZ

VBAT R606 Close to Pin 1 KDS221E_RTK


1 C1 A2 2

A1_C2 3

SRST_n SCLK SDAT

G10 SIMOFF_N K2 SRST_N J3 SCLK K3 SDAT H4

D601

BDATA FGSENSE+

33u

Battery Conn.

G12 2012 1% 1/4W C621 47p Close to AB G11

3 2 1

C617

Phone ground return path CN600 VBAT

R608 Close to Pin 3 0.025

route as a differential pair

FGSENSE-

BATT_GND

R610

H1 E1

VBAT_D CHSENSE+

2012 1% 1/4W

R611 0.1

route as a differential pair F2 CHSENSE-

S2

G2

E2

CHREG

DCIN_A

D2

D4

R613 47K DCIN F3 J1

D3

DCIO VBUS

D1

VBUS
S1 G1

SIA911DJ Q600

Fig. 3-5-1. Battery charging circuit

Fig. 3-5-2. Battery charging block diagram

Name CHSENSE+ CHSENSE-

Type Analog Analog

Unused VBAT VBAT

Description Current sensing input positive Current sensing input negative

Table 3-5-1. Charger Control channel spec

LGE Internal Use Only

- 66 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.5.1 Fuel Gauge


AB3000 supports the measurement of the current consumption/charging current in the KT520 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in (Fig.3-5-3). A sense resistor R_FGSENSE is connected in series with the battery. The voltage across the resistor, equivalent to the current entering/leaving the battery, is integrated using an ADC block.

Fig. 3-5-3. The analog front-end of the fuel gauge block

Fig. 3-5-4 The Schematic of the fuel gauge block

Name FGSENSE+ FGSENSE-

Type Analog Analog

Unused VBAT VBAT

Description Fuel gauge current sensing input positive Fuel gauge current sensing input negative

Table 3-5-2. Fuel Gauge channel spec

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 67 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.5.2 Battery Temperature Measurement


The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. (Fig.3-5-5) shows the schematic of battery temperature measurement part.

300K

K12 XTAL1 K11 XTAL2 4 3 MC-146_12_5PFX600 C612 24p 32.768KHz C613 24p RTCCLK J12 1 32KHZ

A2

R606

SRST_n SCLK SDAT

G10 SIMOFF_N K2 SRST_N J3 SCLK K3 SDAT H4

D601

BDATA

Fig 3-5-5. Battery Temperature Measurement

Name BDATA

Type Digital Input/Output

Unused Unconnected

Description current output

Table 3-5-3 BDATA channel spec

LGE Internal Use Only

- 68 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.5.3 Charging Part


The charging block in AB3000 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. (Fig.3-5-6) shows the schematic of charging part.
G11 VBAT

FGSENSE-

BATT_GND

R610

H1 E1

VBAT_D CHSENSE+

2012 1% 1/4W

R611 0.1

route as a differential pair F2 CHSENSE-

S2

G2

E2

CHREG

DCIN_A

D2

D4

R613 47K DCIN F3 J1

D3

DCIO VBUS

D1

VBUS
S1 G1

SIA911DJ Q600

Fig. 3-5-6. Charging Part

When VBAT is below a certain value, 3.2V, a current generator take care of initial charging of the CHSENSE+ node and internal trickle charge signal is active. This part of the charging block is powered on and active when DCIO is asserted. The DCIO signal is asserted when its voltage is above the voltage at VBAT. As soon as generator is turned off and all parts of the charging block are functional and active. Battery block indication as shown in (Fig.3-5-7)

4.17 ~3.67 (V) 100~40 (%)

3.67 ~3.52 (V) 40~12 (%)

3.52 ~3.4 (V) 12~3 (%)

3.4 ~3.2 (V) 3~0(%)

Fig. 3-5-7 Battery Block Indication

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 69 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Trickle charging
When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA. Parameter Trickle current Min 30 Typ 50 Max 60 Unit mA

Table. 3-5-4. Trickle charging spec

Normal charging
When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active. The charging method is CCCV. (Constant Current Constant Voltage) This charging method is used for Lithium chemistry battery packs. The CCCV method regulates the charge current and the VBAT voltage. This charging method prevents the battery voltage to go above the charge set in the CCCV algorithm. (Fig.3-5-8) shows the charging voltage(a) and charging current change(b).

(a) Charging voltage

(b) Charging current

Fig. 3-5-8. CCCV charging method

LGE Internal Use Only

- 70 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

Charging Method : CCCV (Constant Current Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 700mA Nominal Battery Capacity : 800 mAh Charger Voltage : 5.1V Charging time : Max 3.5h Full charge indication current (icon stop current) : 80mA Low battery POP UP : Idle - 3.52V, Dedicated - 3.48V Low battery alarm interval : Idle - 3 min, Dedicated - 1 min Cut-off voltage : WCDMA call - 3.1V, ELSE - 3.2V

Charging of Extended Temperature


When the battery temperature is outside the normal charging specification, the battery voltage, VBAT, is maintained at 3.7V. Under 0 C : Extended temperature From 0 C to 45 C : Normal charging temperature Over 45 C : Extended temperature

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 71 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.6 Voltage Regulation


The LDO regulators and the BUCK converter generate a range of programmable voltages, each optimized for its load. When the analog baseband controller boots up or down, internal signals activate or deactivate the LDO regulators and the BUCK converter. In active mode, the LDO regulators and the BUCK converter are activated and deactivated through I2C. The low power regulator is on all the time and has extremely low power consumption with limited output current. It provides power for the 32 kHz oscillator and the real-time clock (RTC).

Table. 3-6-1. LDO and Buck

LGE Internal Use Only

- 72 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.7 RF Technical Description


3.7.1 General Description
The RF platform of KT520 supports two different communication modes (WCDMA/GSM modes) including four communication bands (WCDMA2100/GSM900/GSM1800/GSM1900). The all the RF blocks can be divided into three main parts, which are a WCDMA part, a GSM, and a RF front-end. Different from other general solutions, the RF front-end of KT520 consists of an antenna switch and an EDGE power amplifier module (PAM). The simplified block diagram is shown in Figure 3-7-1.

Figure 3-7-1. Block diagram of RF part

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 73 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.7.2 WCDMA Part


The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces, that is an IQ-interface, both in the receiver and transmitter information path. The transceiver has the following general features: Power class : Power class 3 (+24dBm) in Band I Zero-IF Receiver.No IF filter needed Direct IQ modulation transmitter

Figure 3-7-2. WCDMA RF structure

A. Transmitter Part
The W-CDMA transmitter architecture is an on frequency linear direct up-conversion IQ-modulator. The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to RF output frequency and is designed to achieve LO and image suppression. The in-phase and quadraturephase reconstruction filters are fully integrated and a programmable gain amplifier implements the gain control. The transmit output stage provides at least +5 dBm at maximum power control at the singleended 50 output. Gain is set through the 3-wire bus. An external SAW filter between the WCDMA circuit and the power amplifier is used to improve noise performance. Two 10-bit DACs are used to control the DC/DC converter and the PA gain. After the power amplifier, the signal is sent through an isolator and through the duplex filter, which directs the transmit signal to the antenna connector through the antenna switch. The supply voltage and bias of the power amplifier are adapted depending on the output power to achieve high efficiency at every transmitter power level. A high efficiency DC/DC converter regulates the supply voltage and the bias operation point is controlled by a D/Aconverter in the W-CDMA radio circuit. These DACs are controlled through the 3-wire-bus
LGE Internal Use Only Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 74 -

3. TECHNICAL BRIEF

Figure 3-7-3. WCDMA Transceiver Architecture

B. Receiver Part
The W-CDMA receiver architecture is a direct down-conversion Zero Intermediate Frequency (ZIF) receiver with integrated low-pass channel filter, i.e. the front-end receiver converts the aerial RF signal from W-CMDA band I down to a ZIF. The first stage consists of one single-ended low noise amplifier (LNA) with a 16 dB gain step. This LNA is followed through an external filter by an IQ down-mixer which consists of a mixer in parallel driven by quadrature out-of-phase LO signals. The In phase (I) and Quadrature phase (Q) ZIF signal are then low pass filtered to provide protection from high frequency offset interferer fed into the channel filter. The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter with a provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6 pole, 2 zero filter with a cut-off frequency around 2.15 MHz and a second order group delay compensation (2 poles, 2 zeroes). Once filtered, the zero IF I and Q signals are further amplified with provision of 31 x 1 dB steps and DC offset compensation. The zero IF output buffer provides close rail-to-rail outputs signal.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 75 -

LGE Internal Use Only

3. TECHNICAL BRIEF

C. Synthesizer
The RX and TX RF VCOs are fully integrated and self-calibrated on manufacturing tolerances. They have 16 different frequency ranges that are selected internally depending on the frequency programming. The calibration is done on each low to high logical transition of the SYNON bit in the control register or on each change of the integer divider ratio of the RF fractional N synthesizer. A high-performance RF fractional-N synthesizer PLL is included on-chip which enables the frequency of the RF VCO to be synthesized. The frequency is set through the 3-wire serial programming bus. The PLL is based on Sigma-Delta () fractional-N synthesis that enables the required channel frequency, including Automatic Frequency Control (AFC) from a free running external 26 MHz reference frequency. Very low close-in-phase noise is achieved. This allows widening of the PLL loop bandwidth and shorter settling time. The programmable main dividers are controlled by a second order -modulus controller. They divide the RF VCO signals down to frequencies of 26 MHz (12 Hz step programmability). Their phase is then compared in a digital Phase/Frequency Detector (PFD) to the 26 MHz reference clock signal. The phase error information is fed back to the RF VCO through the charge pump circuit that .sources. into or .sinks. current from the loop filter capacitor, thus changing the VCO frequency such that the loop finally gets phase-locked.

C218 DNI FL201 4 5


O2 G2

C217 56p SAFEB2G14FA0F00 3 2 VRADA_2V8


IN

VRADA_2V8 5 2 WTXMOD_BAND_I 4 1 SAFEB1G95KA0F00 3 FL202


G2 G1 IN OUT G3

C219 56p WPA_BIAS WPA_VCC 41 40 39 38 37 36 35 34 33 32 31 VDIGRAD_1V8 VRADA_2V8

VRADA_2V8

11 12 13 14 15 16 17 18 19 20

VGACTL DATA CLK EN REFIN NC4 RXIA RXIB RXQA RXQB

WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N

1 2 3 4 5 6 7 8 9 10

PGND VCCTX RF_DAC2 RF_DAC1 NC13 MIX1_B MIX1_A NC12 NC11 NC10 VCCRX

L204 5.6nH

O1 G1

GNDTX NC1 NC2 TX_1 NC3 VCCLOTX TXIA TXIB TXQA TXQB

U204

RF3100_OM6195HN

NC9 LNA1_OUT NC8 LNA1_IN NC7 NC6 VCCLORX NC5 VDD TST

30 29 28 27 26 25 24 23 22 21

C225

5.6p WRX_BAND_1

L205 4.7nH

R206 RF_CTRL_DATA R207 RF_CTRL_CLK R208 RF_CTRL_STRB C230 5.6p R209

200 WRX_Q_N 200 WRX_Q_P 200 WRX_I_N 200 WRX_I_P

WCLK

Figure 3-7-4. WCDMA Transceiver schematic

LGE Internal Use Only

- 76 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

D. Power Amplifier Module


The SKY77174 Power Amplifier module is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1920 - 1980 MHz bandwidth into a single compact package.

Figure 3-7-5. SKY77174 Functional Block Diagram

VCC_PA

C201 0.01u WTX_BAND_1_EN WPA_BIAS C207 22p C205 10p C204 1000p U201 1 2 3 C208 WTXMOD_BAND_I 56p C211 DNI C210 DNI VBAT GND2 5 VBIAS GND1 4 VCC1 ENABLE VCONTROL RF_IN SKY77174 PGND VCC2 GND3 RF_OUT 11 10 9 8 7 6 10nH L203 C212 0.5p L201 1.5nH 1 2 3 LDC181G9519B-327 N201 IN GND1 M_OUT 5 GND2 4 6 IS201 CES201G95DCB000 GND1 GND2 IN OUT GND3 GND4 WTX_BAND_1

C206 1000p

C_OUT TERMINATE

R201 WPOW_SENSE

Figure 3-7-6. WCDMA PAM schematic

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

47

- 77 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.7.3 EDGE/GPRS/GSM RF block


The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data. The receive interface is based on I and Q data and the transmitter interface is based on envelop and frequency data. The quad band EDGE/GSM/GPRS transceiver has the following general features: Power class GMSK low bands: Class 4 (33 dBm) GMSK high bands: Class 1 (30 dBm) 8PSK low bands: Class E2 (27 dBm) 8PSK high bands: Class E2 (26 dBm) Multi slot class 12 (4+4=5) Dual Transfer Mode (DTM) class 9 (3+2=5) Zero-IF receiver Polar modulation transmitter

Figure 3-7-7. GSM Transceiver Architecture

LGE Internal Use Only

- 78 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

A. Transmitter Part
Polar modulation transmitter architecture based on the direct phase/frequency modulation/synthesizer architecture is implemented for GSM, GPRS and EDGE. This architecture has the capability of generating both the GSM/GPRS constant envelope GMSK modulation and the linear EDGE 8-PSK modulation in a very cost efficient way. The motivation for a polar modulation transmitter architecture compared to traditionally linear architectures is to reduce the output noise (thus eliminating the need for off-chip filters) reduce the power consumption by utilizing non-linear switching analog signal processing blocks, and to eliminate the need for an RF isolator. The transmitter block consists of several sub-blocks: A separate block is used to convert the digital bit streams from the baseband into parallel words to be used in the DACs and the Sigma Delta modulator. The combined DAC and LP-filter is used to convert the digital words of the digital block into analog signals. The second FM-path is used to add the high frequency part of the FM to the VCO. It also includes an auto-tuning block that compensates VCO gain variations. In the Sigma Delta modulator block, the phase/frequency modulator in this polar modulation architecture is a sigma-delta controlled fractional-N frequency synthesizer with an additional frequency insertion point after the loop filter at the input of the VCO. In addition, The TX-buffer is used to drive the PA with the correct power level. A divide by 2 or 4 block is used to generate the correct output frequency from the 4 GHz VCO. The phase locked loop has two information inputs: the divider ratio in the feedback path and a direct path to the VCO. The phase locked loop generates the radio frequency carrier including the phase modulation information at the desired channel frequency.

B. Receiver part
Direct down-conversion zero-IF receiver architecture is used for the four EDGE/GSM/GPRS frequency bands 800, 900, 1800 and 1900 MHz. The complete receiver with four Low Noise Amplifiers (LNAs), one for each supported band, is integrated on chip. After the down-conversion, the in-phase and quadrature-phase components are low pass filtered with two anti-alias filters before the signals are fed to the integrated high dynamic range sigma-delta A/D-converters. The only required external components are the band selectivity SAW filters in front of the LNAs. One filter is required per supported frequency band. The digital output signals are sent over a serial interface to the digital baseband circuit for further processing and detection.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 79 -

LGE Internal Use Only

3. TECHNICAL BRIEF

C. Synthesizer
The synthesizer contains all the frequency generating blocks in the RF3000 circuit: The reference 26 MHz frequency generation is made in a external crystal oscillator, which is fully integrated in the circuit (except for the crystal). The digital bus controls the center frequency of the XO. All RFfrequencies are generated in a single 4GHz VCO, subsequently divided by 2 or 4 to arrive at the final frequency. To cover the required frequency range, the integrated Voltage Controlled Oscillator (VCO) operates at twice the frequency for band 1800/1900, and at four times the desired frequency for band 800/900. The RF-VCO is locked to the XO in a fractional-N PLL consisting of a prescaler, a phase-frequency detector, a charge-pump, a sigma-delta modulator and a fully integrated loop filter. Automatic trimming of the VCO center frequency and the RC constant makes sure that the variation of the PLL dynamics is sufficiently low. The XO also has an external reference mode where a differential 26 MHz clock reference signal can be supplied externally at the XoP and XoN pins. A single-ended clock reference buffer MCLK sources a harmonically controlled square wave reference signal to be used in the baseband. An additional single-ended clock is generated for use in the W-CDMA circuit. This output is activated by a control signal in the digital bus.

LGE Internal Use Only

- 80 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.7.4 Front-End Module (FEM)


A single antenna is used for all four bands. The antenna switch and the EDGE/GSM/GPRS power amplifiers are integrated to a single circuit containing: Antenna Switch with support for W-CDMA band 1 Power amplifiers for high and low band EDGE/GSM/GPRS AM modulator/control circuit Lowpass transmitter filtering The antenna switch block connects the proper block in the radio system to the antenna connection. In GSM/GRPS/EDGE systems, transmit and receive operations are divided in time, and the switch connects the proper block in accordance with the mode of operation (that is, transmit or receive; one at a time in the GSM, DCS, and PCS bands). In W-CDMA systems, the transmitter and the receiver operate simultaneously (that is, full duplex). The switch is used only for selecting the W-CDMA mode of operation . the split between transmit and receive frequencies is handled by the W-CDMA duplexer.

Figure 3-7-8. Front-End Module

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 81 -

LGE Internal Use Only

3. TECHNICAL BRIEF

A. Front End Part


SKY77513 TX-RX Front End Module (FEM) offers a complete transmit VCO-to-Antenna and Antennato-receive SAW filter solution in a low profile (1.2 mm), compact form factor for handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation, Polar EDGE modulation, and provides single UMTS band (band 1 or band 2) antenna switch-through via a dedicated UMTS port.

Figure 3-7-9. SKY77513 Functional Block Diagram

48 49 50 51 52 53 54 55 56 57 58 59 60 61 62

ANT101

OUT101

GND101

VBAT ANTSW0 TX_DCSPCS ANTSW1 ANTSW2 VAPC TX_EGSM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

GND34 GND35 GND36 GND37 GND38 GND39 GND40 GND41 GND42 GND43 GND44 GND45 GND46 GND47 GND48

RX1800 RX1900 RX900

ENABLE DCS_PCS_IN BS_1 BS_2 VBATT VAPC GSM_IN MODE GND1 GND2 GND3 GND4 GND5 DCS_RX1 DCS_RX2 GSM_RX1

U101 SKY77513

GND18 GND17 GND16 GND15 GND14 GND13 WCDMA GND12 GND11 GND10 GND9 ANT GND8 GND7 GND6 GSM_RX2

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 R130 51 DNI C648

C107

C109

C110

WRF_BAND_1

C114

22p

KMS-512 SW101
RF G2 ANT G1

C115 0 DNI C116

GND19 GND20 GND21 GND22 GND23 GND24 GND25 GND26 GND27 GND28 GND29 GND30 GND31 GND32 GND33

L101 22nH

C104 10u

C103 10u

C102 0.01u

C101 22p

C112 22p

C113 22p

C105 22p

Figure 3-7-10. Front End part schematic

LGE Internal Use Only

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

- 82 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.7.5 Control Flow


The access side of the digital baseband controller controls the overall radio system. In both EDGE/GSM/GPRS and W-CDMA air interface mode, the digital baseband controller controls the radio system through a three-wire serial bus. The digital baseband controller also manages PA band control and the antenna switch mechanism in the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE transceiver is turned on only when required, the digital baseband controller initiates this. The EDGE/GSM/GPRS RF system requires control, which is temperature dependent. The temperature within the RF system is estimated by a voltage measurement performed by the analog baseband controller. The control flow for the RF system is shown in Figure 3-7-11.

Figure 3-7-11. RF Control Flow

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 83 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 Power ON Trouble
START

The voltage of main battery is higher than 3.2V ? Yes

No

change main battery

END key operates well? ONSWBn level is low when END key pressed.

No

Follow the keypad Trouble shooting guide

Yes

ONSWBn
Check the voltage.
VRADA_2V8 (C601) 2.8V VDDD_1V5 (C602) 1.5V VDDE_1V8 (C603) 1.8V VDDC_2V65(C606) 2.65V VDDF_2V5 (C608) 2.5V VDDG_2V75 (C609) 2.75V VDDK_2V75(C610) 2.75V VCORE(C616) 1.5V

No Change main board

LGE Internal Use Only

- 84 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.2 USB Trouble


START (Measure during the state of USB module running) Yes
VBAT power(C408,C409) is same to battery?

No

Resolder C408,C409

Yes No ACC_GP20_USB_CS_PD is 1.8V? Yes Finish Change main board

C409 C408

U402

< Main Board Bottom side >

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 85 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.3 SIM Detect Trouble


SIM control path - DB3150 generates SIM interface signals(1.8V level) to AB3000. - AB3000 converts SIM interface signals to 3V.

START

Reconnect SIM card

SIM works well? No Resolder J1 on main PCB and check the contact between J1 and SIM card

Yes

Finish

J1

SIM works well? No Change SIM card

Yes

Finish

< Main Board - Bottom side >

SIM works well? No Change main board

Yes

Finish

LGE Internal Use Only

- 86 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.4 MicroSD card Trouble


START

Re-insert MicroSD card

MicroSD works well? No Check operation of MicroSD card using other notebook or PDA

Yes

Finish

MicroSD works well? Yes Re-insert MicroSD Yes

No

Change the MicroSD

APP_GP16_MC_DETECT(R116) is 0 V?

No

Resolder R116

Yes MicroSD works well? No Change main board Yes Finish S100

R116 < Sub Board - Bottom side >

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 87 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.5 Keypad And Optical Joystick key Trouble


4.5.1 Keypad Trouble

START

Press the Keypad

YES Keypad operates well? Resolder side key (Camera key or volum key) NO YES Check side key short? Keypad operates well? NO 1 Check BtoB connector short? CN503(Main Bd) YES NO Resolder BtoB connector CN503(Main Bd) YES

NO

NO Keypad operates well?

YES

NO Change Keypad

Keypad operates well?

YES

NO Change Main Board Finish

LGE Internal Use Only

- 88 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

35

Pin #11 ~ #14 KEYOUT1 KEYOUT2 KEYOUT3

CN503

KEYOUT4 Pin # 59 ~ #61

36

70

KEYIN5 KEYIN4 KEYIN3

< Main Board Top side >

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 89 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.5.2 Optical Joystick key Trouble

START

Reboot the phone CN102 1 OJ key works well? No 5 Board to Board CN reconnect (Main : CN501, Key : CN100) < Key Board BOTTOM side > Yes Yes Finish 6 10

OJ key works well? No Change Key PCB

Finish

OJ key works well? No Change OJ key module

Yes

Finish

< OJ Key module >

LGE Internal Use Only

- 90 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Camera Trouble


Camera control signals are generated by DB3150

4.6.1 3M Camera

START

Press END Key to turn on the power

NO Is the circuit powered?

Follow the Power On Trouble Shooting

YES Reconnect the 3M 34pin B to B connector

YES 3M Cameras Operation is OK?

CN501

NO 34 pin 3M Camera Connector in Main Board


Change Main board

NO YES Change 3M Camera

3M Camera Works

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 91 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.2 VGA Camera

START

Press END Key to turn on the power

NO Is the circuit powered?

Follow the Power On Trouble Shooting

YES 1 Reconnect the 70pin BtoB connector CN503 and VGA 20 pin Camera Connector (FPCB)

YES VGA Camera Operation OK? YES NO 2 NO


Pin4 of U101 or C104(key)=2.8V? Pin5 of U101 or C105(key)=1.8V?

Change U101 NO

YES Change VGA Camera

NO VGA Cameras Operation OK? Change the Camera&LCD FPCB NO YES VGA Camera Works Change the Main Board

LGE Internal Use Only

- 92 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

CN503

CN100

Main Board 70 pin BtoB Connector (TOP side)

LCD FPCB 20 pin VGA Connector (TOP side)

U101

C105 C104

U101

Charge Pump in Key Board (BOTTOM side)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 93 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7 Main LCD Trouble


LCD control signals are generated by DB3150

START

Press END Key to turn on the power

NO Is the circuit powered?

Follow the Power On Trouble Shooting

YES 1 Disconnect and Reconnect the 70pin B-to-B (Main)

YES LCD Display OK?

NO Disconnect and Reconnect the LCD FPCB 40pin and 35pin LCD connector (Key PCB) YES

NO LCD Display OK? Change LCD FPCB or Key PCB NO YES Change LCD Module

YES The LCD Works LCD Display OK?

NO Change the Main Board

LGE Internal Use Only

- 94 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

CN503

Main Board 70 pin B to B Connector

LCD FPCB 40 pin BtoB Connector (BOTTOM side)

Keyb PCB 35 pin LCD Connector (BOTTOM side)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 95 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.8 Keypad Backlight Trouble


START

Press END Key to turn on the power

YES Keypad Backlights Works?

NO 1 NO Backlights Control Signal is 2.8V at R120? YES 2 Resolder or Change Q100

NO Keypad Backlights Works?

YES Finish Change Main Board

LGE Internal Use Only

- 96 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

VBAT

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

SSC-TWH104-HL

LD105

LD106

LD100

LD101

LD102

LD103

LD104

LD107

C107 0.1u

150

150

150

150

51

51

51

ACC_GP12_KEY_LED_ON 2.2K

R123

R124

R121

R122

R125

R126

R127

R129 27 R130 100K Q100 1 R131 27 6 5 4 2 3 EMX18

UPPER KEY LED

Q100
R120

2 1

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 97 -

LGE Internal Use Only

R128

51

R120

4. TROUBLE SHOOTING

4.9 Folder ON/OFF Trouble


Start START
Yes Turn the power on 2 1 Pin 1 of U502 = 2.65V Yes Place magnet on U502 Yes Slide OK? Pin 4 of U502 = 0V No Yes Yes No VDDE=1.8V at Pin6 No Change Main board

No Change keypad

Slide OK? No Change Main board

Yes

Finished

LGE Internal Use Only

- 98 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

VDDC_2V65

VDDE_1V8

U502 1 2 C525 0.1u 3 VDD GND1 NC

TK60012BM5 6 IO_VDD GND2 OUT 5 4 APP_GP03_FLIPSENSE

C526 0.1u

HALL EFFECT SWITCH

U502

1 2

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 99 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Audio Trouble Shooting


4.10.1 Receiver
Signals to the receiver - Receiver signals are generated at AB3000 BEARP, BEARN - Receiver path : AB3000 (BEARP, BEARN) C637,C638 on main board LCD FPCB Speaker/Receiver

Note: It is recommended that engineer should check the soldering of R, L, C along the

corresponding path before every step.

LGE Internal Use Only

- 100 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

START

Connect the phone to network Equipment and setup call. Setup 1KHz tone out.

NO

Does the sine wave appear at R618, R621 ?

Change the main board

YES The sine wave not appear Does the sine wave appear at Number 2, 4 pin in the main Bd CN503? NO Change U601

YES

Does the sine wave appear at EAR(+) PAD in LCD FPCB?

NO

Change the LCD FPCB

YES

Is the soldering of the receiver OK?

NO Resolder the Receiver

YES

Can you hear sine wave out of the receiver ?

NO Change the Receiver

YES

END

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 101 -

LGE Internal Use Only

4. TROUBLE SHOOTING

R621

1 R618

Main PCB Bottom

2 35

Pin 2, 4 1

CN503

36 Main PCB To p

70

FPCB Top

LGE Internal Use Only

- 102 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

1 2

Measured 1khz Sine Wave Signal

Measured 1khz Sine Wave Signal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 103 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10.2 Speaker (Voice Loud Speaker,Midi, MP3,Key Tone)


Signals to the speaker - Speaker signals are generated at Veronica SPKRP, SPKRN - Speaker path: 1.Veronica (SPKRP, SPKRN) 2. C531, C532 on the main board 3. U500(audio amp) on the main board 4. U501 (Analog switch) on the main board 5. LCD FPCB 5.Speaker/Receiver

Note: It is recommanded that engineer should check the soldering of R, L, C along the

corresponding path before every step.

LGE Internal Use Only

- 104 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

START

Connect the phone to network Equipment and setup call Setup 1KHz tone out

Does the sine wave appear at C639,C640?

NO Change the main board

YES The sine wave not appear

Does the sine wave appear at U601 ? YES

NO Change the U601

Does the sine wave appear at C643,C644 ?

NO Change the main board

YES

Does the sine wave appear At R501,R502?

NO Change the main board

YES

Can you hear sine wave out of a speaker ?

NO Change each Speaker

YES

END

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 105 -

LGE Internal Use Only

4. TROUBLE SHOOTING

B SIDE

1 2 U601 C639,C640

3 C643, C644

4 R501,R502

LGE Internal Use Only

- 106 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Measured 1khz Sine Wave Signal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 107 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10.3 Microphone (Voice call, Voice Recorder, Video Recorder)


Microphone Signal Flow - MIC is enable by MIC Bias - CCO, MIC1P, MIC1N signals to AB3000 Check Points Check Points - Microphone bias - Audio signal level of the microphone - Soldering of components Signal from the mic - MIC - R616 on main board - C624,C625 on main board - AB3000

LGE Internal Use Only

- 108 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

START

Check the MIC bias level at the pad of MIC

2 1
Is the level of MIC+ AND MIC2.4Volt ? No Check the signal level at C624 at the putting Audio signal in MIC

Yes Yes A few hundred of mV of the signal measured ? Change the MIC Yes Change the main B,d No

3
Resolder C624.C625 and try again. If fail again, change the main Bd

Yes

No Does it work properly ?

Yes

END

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 109 -

LGE Internal Use Only

B SIDE

1 C623

LGE Internal Use Only

- 110 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

Measured Some Noise Signal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 111 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10.4 Headset Receiver (Voice call, Video Telephony,MP3 )

START
Connect the phone to network Equipment and setup call Setup 1KHz tone out

1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R412 under 0.5Volt ? NO

YES YES YES

2
Does the level of R412 over 2.0Volt ?

Does the sine wave appear at C410,C411 ?

NO

Change the the U604 4

N0

YES

Resolder R603,R605 And try again from the start NO Change the main B,d

Does the sine wave appear at FB400,FB401 ? YES

7
Resolder CN400 Pins or change the Headset

Can you hear sine wave out of the receiver ?

NO

Change the main Bd

YES

END

LGE Internal Use Only

- 112 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.10.5 Headset MIC(Voice call, Video Telephony )


START

1
Insert Headset. Does the Headset icon display on the main LCD? NO Does the level of R640 under 0.5Volt ? NO

YES

YES

2
YES Does the level of R412 over 2.0Volt ?

3
Check the signal level at C406 at the putting Audio signal in MIC Change the main B,d N0

Resolder R640, And try again from the start

6
A few hundred of mV Of the signal measured at C406 ? YES NO Resolder C406 and try again. If fail again, Change the main Bd

Change the main Bd

NO Does it work properly ??

Try again from the start

YES

END

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 113 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10.6 Headset
B SIDE CN400

1,4 R640

3 2 R412

5 C406

LGE Internal Use Only

- 114 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.11 Charger Trouble Shooting


G11 VBAT FGSENSE-

BATT_GND

R610

H1 E1

VBAT_D CHSENSE+

2012 1% 1/4W

R611 0.1

route as a differential pair F2 CHSENSE-

S2

G2

E2

CHREG

DCIN_A

D2

D4

R613 47K DCIN F3 J1

D3

DCIO VBUS

D1

VBUS
S1 G1

SIA911DJ Q600

Main Battery Charging Path

Charging Procedure - Connecting TA and Charger Detection - Control the charging current by AB3000 - Charging current flows into the battery Check Point - Connection of TA - Charging current path - Battery Trouble shooting setup - Connect TA and battery to the phone Trouble Shooting Procedure - Check the charger connecter - Check the Charging current Path - Check the battery

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 115 -

LGE Internal Use Only

4. TROUBLE SHOOTING

start

1 1

Check the pin and battery connect terminals of I/O connector

Connection OK?

NO

Change I/O connector

YES

NO
2 2

Is the TA voltage 5.1V?

Change TA

YES

3 3

Is it charging properly after changing Q600?

YES

END

NO

Change the board

Trouble Shooting - Charging

LGE Internal Use Only

- 116 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Main Board ( Bottom side) - I/O connector and FET

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 117 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12 Checking Bluetooth Block

start

1. Check AB3000 Block

2. Check BT Chip Block

VDDK_2V75(C610)

VDDE_1V8 (C603)

Main Board ( Bottom side) - AB3000 block

LGE Internal Use Only

- 118 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Chip Antenna

BT chip Output

VDDK_2V75(C109) BT chip VDDE_1V8(C112)

Sub Board ( Bottom side) - Bluetooth Chip and Antenna

CN100 20 21 Pin 38 1 40

Sub Board (Top side)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 119 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 RF Component
U202 U102 R112 FL101, FL102, FL103 U103 X101 N201 IS201 U101 FL203 U204 FL201 FL202 U203 U201

Main Board : Bottom side

Reference U101 FL101 FL102 FL103 FL203 IS201 U203 U103 SW101

Description GSM/DCS/PCS/EDGE PA + Ant. SW DCS Rx SAW Filter PCS Rx SAW Filter GSM Rx SAW Filter WCDMA Duplexer WCDMA Isolator WCDMA Power Detector GSM / EDGE Transceiver(RF3000) RF Test Connector

Reference X101 R112 N201 U201 U202 FL201 FL202 U204 U102

Description 26MHz Crystal Thermistor WCDMA Power Coupler WCDMA PA WCDMA DC/DC Converter WCDMA Rx SAW Filter WCDMA Tx SAW Filter WCDMA Transceiver(RF3100) Bluetooth Clock Buffer

LGE Internal Use Only

- 120 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.14 Procedure to check


start

Oscilloscope setting

1. Check Power Source Block

2. Check VCXO Block

3. Check Ant. SW Module

Agilent 8960 : Test mode(WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink)

4. Check WCDMA Block

Agilent 8960 : Test mode(GSM) Ch. 62, P.L. 7 level setting Ch. 62, -60dBm setting

5. Check GSM Block

Redownload SW, Cal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 121 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15 Checking Common Power Source Block

Step 3 WCDMA PAM Block

Step 2 GSM PAM Block

WCDMA DC/DC VBAT GSM PA VBAT

Step 1 PAM VBAT Block

Main Board : Bottom side - Common Source Block

LGE Internal Use Only

- 122 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.15.1 Step 1
Check point (C617) C213

C103 C104

Main Board (bottom side) - Step 1 : VBAT Block

Check point (CN600) Main Board (bottom side) - Power Source Block

Step 1 Check Point (C618) in Power Source Block To Check Power source to Check if main power source input or not

3.7V OK? Yes

No

Proceed to the Step 2

Check Point (CN600) in Power Source Block To Check Power source

3.7V OK? Yes

No

Check the Power Supply

Check (C617 & CN600) in Block to check inner line connection From C617 to D601

Short? Yes

No

Change Board

Soldering Check Component (CN600) In Power Source Block

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 123 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15.2 Step 2

GSM PAM C103 C104

(Bottom) Figure 4-6. Step 2 : GSM PAM Block

Step 2 Check VBATI (C103, C104) in GSM PAM Block to Check if main power source input or not

3.7V OK? Yes

No

Proceed to the Step 3

Check Point (C617) in Power Source Block To Check Power source Check (C617 & C103, C104) in Block to check inner line connection From C617 to C103, C104
Short? Yes 3.7V OK? Yes

No

Check the Power Supply

No

Change Board

Soldering Check Component (CN600) In Power Source Block

LGE Internal Use Only

- 124 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.15.3 Step 3
Check point (C617) C213 DC/DC Converter

WCDMA PAM

Check point (CN600)

Step 3 :WCDMA PAM Block

Main Board (bottom side) - PAM Power Source

Step 3 Check VBAT (C213) in WCDMA PAM Block

3.7V OK? Yes

No

See the Next Page

Check Point (C617) in Power Source Block To Check Power source

3.7V OK? Yes

No

Check the Power Supply

Check (C213 & C617) in Block , to check inner line connection From C213 to C617

No Short ? Yes

Change Board

Soldering Check Component (CN600) In Power Source Block

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 125 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15.4 Checking VCC

AB3000

R603 (VDIGRAD_1V8)

R602 (VRADA_2V8)

Main Board (Bottom side) : Power for Radio ASIC

VRADA_2V8 VDDD_1V5 VDDE_1V8 VDIGRAD_1V8

VBAT

VBAT R602 0 VRADA_2V8

VRADA_2V8 (RF3000, RF3100 analog, Power Detector)


VDDD_1V5 R639 R603 0 VDDE_1V8 0 VDIGRAD_1V8 C601 1u C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E C602 1u C603 2.2u VDDC_2V65 VDIGRAD_1V8 (RF3000, RF3100 digital) VDDH_CAM_CORE VDDF_2V5 VDDG_2V75 VDDK_2V75

TP06_RF C503 (VDD_E)

VDDC_2V65

AB3000 Schematic (Power)

Check Point VRADA_2V8 (R602) Check Point VDIGRAD_1V8 (R603)

2.8V OK?

No Yes

Check the AB3000

1.8V OK?

No Yes Common Input Power is OK See The Next Part

Check the AB3000

LGE Internal Use Only

- 126 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.16 Checking VCXO Block


The reference frequency (26MHz) from U103(GSM Transceiver RF3000) is used WCDMA TX part and BB part. Therefore, 3 test points in the following figure should be checked.

U301 Digital Base Band (DB3100)

U204 WCDMA Transceiver (RF3100) U103 X101 GSM CrystalTransceiver (RF3000)

Main board : bottom side

Notebook to send TP command Oscilloscope

Phone

Connection for Checking VCXO Block

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 127 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check 1. Crystal and RF3000(GSM Transceiver) part If you already check this crystal part, you can skip check 1

C139

Test Point (Crystal Part)

WCLK

X101 4 1 3 2 R111 100K

26MHz KSX-23-26000KFA-QA0R

R113 100K

MCLK 120K C139

C139 MCLK Schematic (Crystal Part)

Figure 4-15. 26MHz at R211

LGE Internal Use Only

- 128 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11 12 13 14 15 16 17

WBCLK GNDA11 XON XOP GNDA12 MCLK GNDD

4. TROUBLE SHOOTING

Check 2. 26MHz at WCDMA TX part

C230

Figure 4-16-1. Test point (26MHz at part) TX part) Figure 4-16-1. Test point (26MHz at TX
VGACTL DATA CLK EN REFIN NC4 RF_CTRL_DATA RF_CTRL_CLK RF_CTRL_STRB C230 5.6p 11 12 13 14 15 16

WCLK

C230

Figure 4-16-2. Schematic (26MHz at TX part)

Figure 4-17. 26MHz C230 Figure 4-17. 26MHz at at C230

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 129 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check 3. 26MHz at BB part

C139

Figure 4-18. Test point (26MHz at BB part)

WBCLK GNDA11 XON XOP GNDA12 MCLK GNDD

VDDE_1V8

LK

11 12 13 14 15 16 17

R304

X101 4 1 3 2 R111 100K

100K

26MHz KSX-23-26000KFA-QA0R

Baseband (DB3100)

R113 100K

MCLK
MCLK SYSCLK0 W14 MCLK Y16 SYSCLK0

C139
MCLK

MCLK

120K C139

Figure 4-19. Schematic (26MHz at BB Part)

Figure 4-20. 26MHz at C139

LGE Internal Use Only

- 130 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Check C139 Refer to Figure 4-15

Checking 1, 3 26MHz at VCXO Yes

No

VCXO part has a problem. Changing XTAL or U103

Check C230 Refer to Figure 4-17

Checking 2 26MHz at TX part

No

VCXO part has a problem. Changing XTAL or U103

Yes

VCXO part is O.K. Check next stage

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 131 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.17 Checking Front End Module Block


<Bottom> Antsw0 (C105) Antsw1 (C113) Antsw2 (C112)

Antenna Switch Module (+ GSM/EDGE PA)


Figure 4-21. Front End Module Block (Bottom and Top)

VBAT ANTSW0 TX_DCSPCS ANTSW1 ANTSW2 VAPC TX_EGSM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

GND34 GND35 GND36 GND37 GND38 GND39 GND40 GND41 GND42 GND43 GND44 GND45 GND46 GND47 GND48

48 49 50 51 52 53 54 55 56 57 58 59 60 61 62

RX1800 RX1900 RX900

ENABLE DCS_PCS_IN BS_1 BS_2 VBATT VAPC GSM_IN MODE GND1 GND2 GND3 GND4 GND5 DCS_RX1 DCS_RX2 GSM_RX1

U101 SKY77513

GND18 GND17 GND16 GND15 GND14 GND13 WCDMA GND12 GND11 GND10 GND9 ANT GND8 GND7 GND6 GSM_RX2

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17

C104 10u

C103 10u

C102 0.01u

C101 22p

C112 22p

C113 22p

C105 22p

Antenna Switch Module (+ GSM/EDGE PA)

LGE Internal Use Only

- 132 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

GND19 GND20 GND21 GND22 GND23 GND24 GND25 GND26 GND27 GND28 GND29 GND30 GND31 GND32 GND33

4. TROUBLE SHOOTING

4.18 Checking Front End Module Block input logic


4.18.1 Mode Logic by TP Command
EGSM Tx

WCDMA

ANTSW0

ANTSW1

ANTSW2

DCS/PCS Tx

EGSM RX

ANTSW0

ANTSW1

ANTSW2

DCS Rx

PCS Rx

ANTSW0

ANTSW1

ANTSW2

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 133 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Mode EGSM Tx DCS Tx PCS Tx EGSM Rx DCS Rx PCS Rx WCDMA

Antsw0 L L L H H H L

Antsw1 L H H L H H H

Antsw2 H H H H L H L

Table 4-1. Front End module Logic

LGE Internal Use Only

- 134 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.18.2 Checking Switch Block power source


Before Checking this part, must check common power source(through AB3000) part

TP Command MODE=0 SWRX=64,1024

No
Check Soldering It is necessary to check short condition. Using Tester. Check 3 capacitors ANTSW0(C105),ANTSW1(C113) ANTSW2(C112)

Open?

Yes

Check soldering (C105)

High?
Check ANTSW0(C105) To check Switch input power source

No

OK?

No

Resoldering

Yes

Yes

Check each mode By TP command

Change the Board

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 135 -

LGE Internal Use Only

4. TROUBLE SHOOTING

A. EGSM Rx mode

EGSM Rx MODE=0 SWRX=64,1024 ANTSW0 High ANTSW1

Low

ANTSW2

High

Figure 4-22. EGSM Rx Mode

No
EGSM Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (EGSM Tx Mode)

Change the Board

LGE Internal Use Only

- 136 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

B. EGSM Tx mode

EGSM Tx MODE=0 SWTX=1,64,7 ANTSW0 Low ANTSW1 Low

ANTSW2

High

Figure 4-23. EGSM Tx Mode

No
EGSM Tx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (DCS Tx Mode)

ANTSW0:High ANTSW1:Low ANTSW2:High WON : Low

No
Change the Board

Yes

Change U101

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 137 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C. DCS Rx mode

DCS Rx MODE=2 SWRX=699,1024

ANTSW0 High ANTSW1

High

ANTSW2

Low

Figure 4-24. DCS Rx Mode

No
DCS Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (DCS Tx Mode)

Change the Board

LGE Internal Use Only

- 138 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

D. PCS Rx mode

PCS Rx MODE=1 SWRX=661,1024

ANTSW0

High

ANTSW1

High

ANTSW2

High

Figure 4-25. PCS Rx Mode

No
PCS Rx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

See the Next mode (PCS Tx Mode)

Change the Board

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 139 -

LGE Internal Use Only

4. TROUBLE SHOOTING

E. DCS / PCS Tx mode

DCS / PCS Tx MODE=2 SWTX=1,699,0

ANTSW0 Low ANTSW1

High

ANTSW2

High

Figure 4-26. DCS / PCS Tx Mode

No
DCS Tx Logic OK? 4.17 part Check OK?

No
Try 4.17 part

Yes

Yes

WCDMA Mode

Change the Board

LGE Internal Use Only

- 140 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

F. WCDMA mode

WCDMA Mode MODE=4 WTXC=10700,1,890,903,542,557

ANTSW0 Low ANTSW1 High

ANTSW2

Low

Figure 4-27. WCDMA Mode

No WCDMA Logic OK? Yes 4.17 part Check OK? Yes

No Try 4.17 part

Input Signal and Power to Front End Module block is OK. See the Next Page

Change the Board

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 141 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.19 Checking WCDMA Block


start

1. Check VCXO Block

2. Check Front End Module

3. Check Control Signal

4. Check RF TX Level

Bottom View

5. Check PAM Block

6. Check RF RX Level

Re-download SW, Cal

LGE Internal Use Only

- 142 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.19.1 Checking VCXO Block


Refer to 4.17

4.19.2 Checking Ant. SW module


Refer to 4.18

4.19.3 Checking Control Signal


First of all, control signal should be checked. (data, clk, strobe)

PIN14 (STROBE) PIN13 (CLK) PIN12 (DAT)

Figure 4-28-1. Test points (Control Signal)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 143 -

LGE Internal Use Only

4. TROUBLE SHOOTING

RF_CTRL_DATA

RF_CTRL_CLK

RF_CTRL_STRB C230 5.6p

WCLK

Figure 4-28-2. Schematic (Control Signal)

Oscilloscope

Figure 4-29. Connection for Checking Control Signal

LGE Internal Use Only

11 12 13 14 15 16 17 18 19 20

VGACTL DATA CLK EN REFIN NC4 RXIA RXIB RXQA RXQB

Notebook to send TP command

Phone

- 144 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

PIN6 (STROBE)

PIN7 (DAT))

PIN8 (CLK)

PIN6 (STROBE)

PIN7 (DAT))

PIN8 (CLK)

Figure 4-30. Control Signal

Check PIN12,PIN13 PIN14. Check shape and pk-pk level Refer to Figure 4-30

TP Command MODE=4 WTXC=10700, 1,890,903,542,557 SYCT=10700

No

Similar ?

Download the SW If signal is not OK even after downloading, Change the U301

Yes

Control Signal is O.K. Check next stage

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 145 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.19.4 Checking RF TX Level


Check 6 C208 PAM Input

Check 7 C219 RF3100 Output

Check 5 IS201 Isolator Input

Check 2 C114 FEM Output Check 1 SW101 Check 3 C115.Ant

Check 4 IS201 Isolator Output

Figure 4-31. Test point (RF TX Level)

Notebook to send TP command Spectrum Analyzer

Phone

Fig. 4-32 Connection for Checking RF TX Level

LGE Internal Use Only

- 146 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Fig. 4-33-1 Output Level at RF test connector ( SW101)

Fig. 4-33-2 Output Level at FEM Output (C107) (C114)

Fig. 4-33-3 Output Level at C115.Ant

Fig. 4-33-4 Output Level at Isolator Output (IS201.2.Out )

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 147 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Fig. 4-33-5 Output Level at Isolator Input (IS201.3. In)

Fig. 4-33-6 Output Level at PAM Input ( C208)

Fig. 4-33-7 Output Level at RF3100 Output ( C219)

LGE Internal Use Only

- 148 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

To verify that the phone fulfils requirements on maximum output power.

Set the FDD Test of the Agilent 8960 Set the Maximum Power

TP Command MODE=4 WTXC=10700, 1,890,903,542,557 SYCT=10700 TFTI=10700

Check output power at the SW101 with antenna Cable. Refer to Figure 4-33-1

Check 1 About 22~23dBm?

Yes RF TX Level is OK Check next stage

No Check the power at the C114 with probe. Refer to Figure 4-33-2 Check 2 About 15dBm? Yes The SW101 has any problem. Change the SW101

No Check the power at the C115.Ant with probe. Refer to Figure 4-33-3 Check 3 About 19dBm? Yes The C114 will be broken. Change the C114

No Check the power at the IS201.2 with probe. Refer to Figure 4-33-4 Check 4 About 19dBm? No Check the power at the IS201.3.I with probe. Refer to Figure 4-33-5 Check 5 About 17dBm? Yes The IS201 has any problem. Change the IS201 Yes The C115 has any problem. Change the C115

No Check the power at the C208 with probe. Refer to Figure 4-33-6 Check 6 About -6dBm? No The U204 will be not operated. Change the board Yes The U201 has any problem. You have to check PAM block.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 149 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.19.5 Checking PAM Block

(Bottom)

WPAM input (C208)

DC/DC converter

WCDMA PAM

VCC_PA (C201) from DC/DC

Duplexer Output (C227)

Figure 4-34. Test points of WCDMA TX PAM block

LGE Internal Use Only

- 150 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

TP Command -mode =4 - WTXC=10700, 1,890,903,542,557

Check Duplex output (C227) To Check PAM output

No 23dBm ?

Level <10dBm? Yes

No

Download the SW & Calibrate

Yes

WCDMA PAM is OK See the Next page

Check C208 To Check PAM Input level

Level >2dBm No Yes

Check the WCDMA RF Tx Chip (RF3100)

Check C207 To Check PAM control signal from RF3100 (WPA_BIAS) Check C201 To Check PAM VCC BIAS from DC/DC converter (VCC_PA)

1.3V ? No Yes

Check the RF3100 to WCDMA PAM Signal line

3.2V ? No Yes

Change the DC/DC

Change The PAM

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 151 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.19.6 Checking RX I,Q


To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q.

WRX_Q_ N(R206)

WRX_Q_ P(R207)

WRX_I_N (R208)

WRX_I_P (R209)

Figure 4-35. RF3100, WCDMA Transceiver (Bottom)

LGE Internal Use Only

- 152 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

About 2 MHz
Feed a CW signal at 2142MHz with a power level of 60dBm.

Figure 4-36-1. RX I,Q signal (CW:2142MHz)

WRX_Q_P (R207) WRX_Q_N (R206) WRX_I_P (R209) WRX_I_N (R208)

Figure 4-36-2. RX I, Q signal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 153 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Set the CW Mode of the Agillent 8960 Feed a CW signal at 2142MHz Set the RX Continuous mode

TP Command MODE=4 WRXC=10700

Check the pk-pk level at R206 ,R207, R208, R209 With Oscilloscope. Refer to Figure 4-36-1

No About 130mVp-p? Change RF3100 (U204)

Yes Check the Mean level at R206 ,R207, R208, R209 With Oscilloscope. Refer to Figure 4-36-1 No About 160mV? Change RF3100 (U204)

Yes Check the frequency at R206 ,R207, R208, R209 With Oscilloscope. Refer to Figure 4-36-2 No About 2MHz? Change RF3100 (U204)

Yes Verify whether the signal was similar as Figure 4-36-2 with Oscilloscope. No Similar? Change RF3100 (U204)

Yes

Check Next Stage

LGE Internal Use Only

- 154 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20 Checking GSM Block


start

1. Check VRADA_2V75 VDIGRAD_1V8

2. Check VCXO Block

3. Check FEM Module

4. Check Control Signal

5. Check RF TX Path

6. Check RF RX Path

Re-download SW, Cal

Figure 4-37-1. GSM Block (Bottom)

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 155 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.20.1 Checking Regulator Circuit


Refer to 4.16 Checking Power Source block IF you already check this point while checking power source block (4.15), You can skip this test.

4.20.2 Checking VCXO Block


Refer to 4.17 Checking VCXO block IF you already check this point while checking VCXO block (4.17), You can skip this test.

4.20.3 Checking Front End Module


Refer to 4.19.2 Checking Ant. SW Module IF you already check this point while checking Ant. SW module (4.19.2), You can skip this test.

LGE Internal Use Only

- 156 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20.4 Checking Control Signal


Test Program Script MODE=0 SWTX=1,64,7,1024,1

RF_CTRL_CLK (PIN8)

RF_CTRL_DAT A(PIN7)

RF_CTRL_STR B (PIN6)

RF3000

GSM PAM

Figure 4-38. Test points of RF control signals

STRB CLK DATA

Figure 4-39. GSM RF Control signal

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 157 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check PIN6,PIN7,PIN8 of RF3000. Check if there is any Major difference. Refer to Figure 4-39 No No

Similar? Yes

Short? Yes Change the board

Re-download SW

Control signal is OK. See next page to check

LGE Internal Use Only

- 158 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.20.5 Checking RF Tx Path


A. GSM Tx path Level

Figure 4-40. GSM/DCS/PCS Tx Path Level

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 159 -

LGE Internal Use Only

4. TROUBLE SHOOTING

PIN 19, 20, 21, 22

(Bottom)
Figure 4-41. Test Points of GSM/DCS/PCS Tx Path

LGE Internal Use Only

- 160 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

B. GSM Tx Output Level Check

Figure 4-42. GSM/DCS/PCS Tx Level at

Test Program Script 1. GSM Tx MODE=0 SWTX=1,64,5,1024,1 2. DCS Tx MODE=2 SWTX=1,699,0,1024,1 3. PCS Tx MODE=1 SWTX=1,661,0,1024,1

v Agilent 8960 Setting : GSM BCH+TCH Mode v Oscilloscope Setting

Check GSM/DCS/PCS output power at Check if there is any Major difference. Refer to Figure 4-42. GSM>32dBm DCS>29dBm PCS>29dBm

. Similar? No See Next page to check Tx path

Yes

GSM/DCS/PCS Tx path OK. See Chapter 4.8.6 to check Rx path

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 161 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C. GSM RF Transceiver Check

GSM Tx (R104) Vapc (PIN 2)

DCS/PCS Tx (C135)

RF3000 (U103)

Figure 4-43. GSM/DCS/PCS Transceiver (RF3000)

Check GSM RF Transceiver Output power at .

GSM/DCS/PCS >5dBm Yes

No

Redownload SW

See Next page to check Tx path

LGE Internal Use Only

- 162 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

D. GSM PAM Check

Vapc (PIN 2)

GSM/EDGE PAM (+Ant. SW) U101 DCS/PCS Tx (C114) GSM Tx (C114)

Figure 4-44-1. Test points of GSM/DCS/PCS Tx

Check Vapc level. Check if there is any Major difference. Refer to Figure 4-44-1

GSM>1.5 V? DCS/PCS>1.3 V? Yes

No

Redownload SW, Cal

Check GSM/DCS PAM output power at C114.

GSM:32.0dBm DCS: 30.0dBm Yes

No

Changing GSM PAM (U101)

GSM Tx path OK. See Next page to check

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 163 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.20.6 Checking RF Rx Path


A. GSM Rx path Level

DCS/PCS : -51.7dBm

GSM : -51.5dBm

GSM : 50dBm DCS : 50dBm PCS : -50dBM

Figure 4-45. GSM/DCS/PCS Rx Path Level

LGE Internal Use Only

- 164 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

GSM Transceiver RF3000/U103

DCS Rx PCS Rx GSM Rx

GSM/EDGE PAM U101

Figure 4-46. Test Points of GSM/DCS/PCS Rx

Test Program Script 1. GSM Rx MODE=0 SWRX=1,64,5,1024,1 2. DCS/PCS Rx MODE=2(DCS),1(PCS) SWRX=1,699,0,1024,1

v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz) v Oscilloscope Setting

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 165 -

LGE Internal Use Only

4. TROUBLE SHOOTING

B. GSM RF Level Check

GSM Transceiver RF3000/U103

DCS Rx PCS Rx GSM Rx

GSM/EDGE PAM U101

Figure 4-49. GSM/DCS/PCS Rx path

v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) PCS : -50dBm@ch700(1967.8MHz)

Check GSM/DCS/PCS Rx GSM:-51.5dBm signal level at . DCS/PCS:-51.7dBm Yes GSM Rx path OK.

No

Change Ant. SW module (U101)

LGE Internal Use Only

- 166 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD
5.1 The Purpose of Downloading Software
To make a phone operate at the first manufacturing - A phone = Hardware + Software - A phone cannot operate with hardware alone. - The hardware with the suitable software can operate properly. To upgrade the software of the phone - The software of the phone may be changed to enhance the performance of the phone. - The older version software of the phone can be replaced to the newer version. Download Tools - LGDP2 : Download tool for KT520 software

5.2 Download Environment Setup


Items needed to download SW images with LGDP2. A. USB Cable B. Cable Adapter ( Gender for KT520 ) C. Target( KT520 Phone ) D. PC and LGDP2 Software E. SW Images

Figure 5-2-1. Items for KT520 Downloading

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 167 -

LGE Internal Use Only

5. DOWNLOAD

5.3 KT520 Download


5.3.1 USB Driver Install
A. If you use LGDP2 Tool firstly, Error will happen because of USB Driver uninstalled. You have to do LGDP2 USB Driver Installation only at the first time of installation 1 step : go to the directory = ../LGDP2_VXX/wrapper_USBDriver 2 step : click erasedrv.exe 3 setp : click installme.bat Although install is to do, not install USB driver. And then, can be operate plug & play. If you see Found New Hardware when phone is connect after complete install, and then follow as indicated blew. when connect the phone, must be check that phone should be turn off and battery should be fullgauge (At lease three(75%) more).

B. Push the Next Button in Found New Hardware Wizard

LGE Internal Use Only

- 168 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

C. Select Search for the best driver in these locations in Found New Hardware Wizard D. Select Include this location in the search in Found New Hardware Wizard E. Push the Browse Button , and then select USB driver Information file This File is provided with LGDP2.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 169 -

LGE Internal Use Only

5. DOWNLOAD

F. Select Mobile Equipment USB Flash in Found New Hardware Wizard

You must be select this..!

G. Continue Anyway

LGE Internal Use Only

- 170 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

H. Please wait while the wizard installs the software.. I. Push the Finish Button in Found New Hardware Wizard

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 171 -

LGE Internal Use Only

5. DOWNLOAD

5.4 How to KT520 Download


5.4.1 How to set the position of Download files [dll,S/W]
Copy KT520 Model Dll [KT520_Date_MP.dll] to C:\DOWNLOAD\Model\KT520 Phone SW for download: Copy the BIN Image[APP], DZ Image[Modem] To C:\DOWNLOAD\Model\KT520

5.4.2 After running LGDP2, how to initial Setting


Run LGDP2_V34_UMTS.exe In the window of Model Buyer Choice, Select OK key after checking the UMTS in Division Selection Press the OK after the following setting. Port Selection : After checking the USB Mode , it should be checked for the download port from COM57 to COM72. DLL Selection : Selecting the DLL file in C:\DOWNLOAD\Model\KT520 Run Download Configuration : - AP Image : Select the BIN file in C:\DOWNLOAD\Model\KT520 - MP Image : Select the DZ file in C:\DOWNLOAD\Model\KT520 - Select the Update Boot, Update Modem Boot when changing the buyer. Exception for Update Modem Boot in CS version. DLL Information : Display Download Configuration information.

LGE Internal Use Only

- 172 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

Select USB Mode

KT520

KT520

KT520 KT520

KT520 KT520

KT520

KT520

KT520

KT520

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 173 -

LGE Internal Use Only

5. DOWNLOAD

5.4.3 How to Download


Click the START button : Select before Download cf. Before click the START button, Though connecting phone, it can not be processed. Click the STOP button : selection for no more download. Before connecting the Phone, it is standby mode for Download. After connecting Phone, the download will be processed. cf. If cannot be process when connecting to Phone, check the USB LED and displaying the port in device management of NEXUS II During the D/Load : Displaying the message about port D/Load Error : Font color turn to red and display the Fail D/Load PASS : Font color turn to blue and display the Pass In case of Fail, it will be reconnected. In case of Pass, connect the new phone.

KT520

KT520

LGE Internal Use Only

- 174 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM
GSM & WCDMA RF Block
UMTS RF Filter FL201

Duplexer FL203

DCDC U202

Isolator IS201 UMTS TX Filter FL202

UMTS PAM U201 UMTS TRx U204(RF3100)

Antenna GSM PAM with FEM U101 GSM TRx U103(RF3000)

Test Conn. SW101

Crystal -26M X101

STLC2500

Bluetooth Antenna

Bluetooth U101

Figure 6-1. RF Block Diagram

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 175 -

LGE Internal Use Only

Block Common

Ref. Name U101 SW101 X101

Part Name SKY77513 KMS-512 KSX-23-26000KFA-QA0R SAYZY1G95EA0B00 RF3100 SAFEB2G14FA0F00 SAFEB1G95KA0F00 LM3208DS SKY77174 CES201G95DCB000 LMV221 LDC181G9519B-327 DB3150 RF3000 SKY77513 SAFEB942MFL0F00 SAFEB1G96FA0F00 SAFEB1G84FA0F00 DB3150 STLC2500

Function FEM Test Connector Crystal Duplexer TRx RX RF Filter Tx RF Filter DC/DC PAM Isolator Power Detecting Directional Coupler Modem TRx PAM Filter Filter Filter Modem Bluetooth

Comment Band Select Calibration, etc Reference -13M TRX TRX RX TX TX TX TX TX TX TRX TRX GSM/DCS/PCS Tri with FEM RX RX RX TRX TRX

WCDMA

FL203 U104 FL100 FL102 U103 U201 IS201 U202 N201 U301

GSM

U103 U101 FL103 FL102 FL103 U301

Bluetooth

U101

Table 6-1. RF Block Component

LGE Internal Use Only

- 176 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

LGE Internal Use Only


A A

48 49 50 51 52 53 54 55 56 57 58 59 60 61 62

ANT101

OUT101

GND101

VBAT

GND34 GND35 GND36 GND37 GND38 GND39 GND40 GND41 GND42 GND43 GND44 GND45 GND46 GND47 GND48

ANTSW0 TX_DCSPCS ANTSW1 ANTSW2 VAPC TX_EGSM

RX1800 RX1900 RX900

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

ENABLE DCS_PCS_IN BS_1 BS_2 VBATT VAPC GSM_IN MODE GND1 GND2 GND3 GND4 GND5 DCS_RX1 DCS_RX2 GSM_RX1

U101 SKY77513

GND18 GND17 GND16 GND15 GND14 GND13 WCDMA GND12 GND11 GND10 GND9 ANT GND8 GND7 GND6 GSM_RX2

32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 R130 51 DNI C648

VDDK_2V75

C107

C109

C110

WRF_BAND_1 FB101 60 C114 22p KMS-512 SW101


RF G2 ANT G1

C115 0 DNI C116 BT_CLKREQ_n MCLK

U102 SN74LVC1G125DRLR 1 _OE VCC 5 2 A 4 3 GND Y

R101 BT_CLK 33

R102

100K

GND19 GND20 GND21 GND22 GND23 GND24 GND25 GND26 GND27 GND28 GND29 GND30 GND31 GND32 GND33

C121 0.1u

C122 4.7u

L101 22nH

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

C104 10u

C103 10u

C102 0.01u

C101 22p

C112 22p

C113 22p

C105 22p

C123 RX1800

22p

C126

22p

C124

22p

C125

22p

RX1900

L102 10nH FL101 4 5


O2 G2

L103 10nH SAFEB1G84FA0F00 3 2 FL102 4 5


O2 G2

SAFEB1G96FA0F00 3 2 C134 5.6p

IN

O1 G1

IN O1 G1

L104 5.6nH

L107 5.6nH

C130 5.6p

C131 5.6p

C133 5.6p

E
R103 TX_EGSM 36 R104 R105 150 150 41 40 39 38 37 36 35 34 33 32 31 C129 12p 4 5 30 29 28 27 26 25 24 23 22 21 L105 18nH C132 12p L106 10nH VRADA_2V8 AMP_LSB_FREQ_LSB DCLK_DATSTR RTEMP
O2 G2 IN O1 G1

PGND GNDA1 TXLB GNDA2 NC GNDA3 RX1800N RX1800P GNDA4 RX1900P RX1900N

FL103 1 SAFEB942MFL0F00

C127

22p

C128

22p

VAPC L108 TX_DCSPCS 2.7nH 24 RF_CTRL_STRB RF_CTRL_DATA RF_CTRL_CLK TESTOUT MCLKREQ 100K R109 R106

WBCLK GNDA11 XON XOP GNDA12 MCLK GNDD VCCD DATAB DATAA

C135 3.3p

C136 2.7p

R107 220

R108 220

1 2 3 4 5 6 7 8 9 10

RX900

ADOUT

GNDA6 GNDA5 RX900N AMMOD RX900P GNDA7 TXHB GNDA8 RX800P GNDA9 U103 STR RX800N VCCA DATA RF3000_OM6191HN GNDA10 CLK DATAC TESTOUT MCIKREQ DATASTR

3 2

R110

4.7K

F
R112 4.7K

27p C137

C138 0.01u

WCLK

X101 4 1 3 2 R111 100K QDATA_AMP_MSB

26MHz KSX-23-26000KFA-QA0R

11 12 13 14 15 16 17 18 19 20

IDATA_FREQ_MSB

G
R113 100K VDIGRAD_1V8

MCLK 120K C139 27p C140

10

11

12

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 177 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

VCC_PA

B
C201 0.01u WTX_BAND_1_EN WPA_BIAS C207 22p C205 10p C204 1000p U201 1 2 3 C208 WTXMOD_BAND_I 56p C211 DNI C210 DNI VBAT GND2 5 VBIAS GND1 4 VCC1 ENABLE VCONTROL RF_IN SKY77174 PGND VCC2 GND3 RF_OUT 11 10 VBAT 9 8 7 6 10nH L203 C212 0.5p L201 1.5nH 1 2 3 LDC181G9519B-327 N201 IN GND1 M_OUT 5 GND2 4 6 IS201 CES201G95DCB000 GND1 GND2 IN OUT GND3 GND4 WTX_BAND_1 U202 LM3208TL B1 VDD SW A1 PVIN FB C2 VCON SGND C1 PGND EN L202 3.3uH C3 B3 A3 C213 4.7u

C206 1000p

VCC_PA

A2

WPA_VCC WDCDC_EN

C_OUT TERMINATE

R201

WPOW_SENSE

47

C202 10u

C203 0.01u

VRADA_2V8

C218 DNI FL201 4 5


O2 G2

C217 56p SAFEB2G14FA0F00 3 2 VRADA_2V8


IN

C215 0.1u

C216 10p

O1 G1

U203 1 R203 WPOW_SENSE 2 3 R205 62 VDD RF_IN

LMV221 OUT REF DAP EN 6 5 4

R202 WPOW_DET 1K

E
L204 5.6nH

E
WPOW_DET_EN

220 R204 62

GND

VRADA_2V8 5 2 WTXMOD_BAND_I 4 G3 1 SAFEB1G95KA0F00 3 FL202


G2 G1 OUT IN

C219 56p WPA_BIAS WPA_VCC 41 40 39 38 37 36 35 34 33 32 31 VDIGRAD_1V8 VRADA_2V8

C220 33nF

VRADA_2V8

VGACTL DATA CLK EN REFIN NC4 RXIA RXIB RXQA RXQB

WTX_I_P WTX_I_N WTX_Q_P WTX_Q_N

1 2 3 4 5 6 7 8 9 10

PGND VCCTX RF_DAC2 RF_DAC1 NC13 MIX1_B MIX1_A NC12 NC11 NC10 VCCRX

GNDTX NC1 NC2 TX_1 NC3 VCCLOTX TXIA TXIB TXQA TXQB

U204

RF3100_OM6195HN

NC9 LNA1_OUT NC8 LNA1_IN NC7 NC6 VCCLORX NC5 VDD TST

30 29 28 27 26 25 24 23 22 21

F
C225 5.6p WRX_BAND_1 22p C227 WRF_BAND_1 L206 NA

L205 4.7nH

11 12 13 14 15 16 17 18 19 20

FL203 2 ANT

SAYZY1G95EB0B00 7 RX TX 5

WRX_BAND_1 WTX_BAND_1

G
R206 RF_CTRL_DATA R207 RF_CTRL_CLK R208 RF_CTRL_STRB C230 5.6p R209 200 WRX_I_P 200 WRX_I_N 200 WRX_Q_P 200 WRX_Q_N

1 4 8

GND1 GND2 GND3

3 GND6 6 GND5 9 GND4

WCLK

10

11

12

LGE Internal Use Only

- 178 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

VDDF_2V5

VDDE_1V8

VCORE

VBUCK_FB

R300

QDATA_AMP_MSB IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR

R301

WTX_BAND_1_EN

RF_CTRL_CLK RF_CTRL_STRB RF_CTRL_DATA

WDCDC_EN WPOW_DET_EN

TX_ADC_STRB

WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P

WTX_I_N WTX_I_P WTX_Q_N WTX_Q_P

VDDE_1V8 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u

C325 33nF

C326 33nF

C303 C304

C305 C306

C307

C308 C309 C310 C311

C322

C313 C314 C315

C316 C317 C318 C319

C312

C320

C321

100K

R304

A10 A2 A22 E1 A7 AA1 AA11 AA22 AB1 AB2 AB21 AB22 B1 B22 A16 B21 K22 N1 R22 T1 Y11 AA14

AB12 AB11 AB15 AB14

AA12 AB13

AA10 W11 AA6 AA9 L2

Y4 AA2 Y3 Y2

AB8 V7 AB5 AB6

W4 W5 Y5 AA5 W2

AB4 AB3 AA4 AA3

AB7

A11 AB17 A18 E22 B2 L1 K1 M22 T22 W1

Y10 W10 W9 Y9

C323 C324

ACC_PCM_CLK ACC_PCM_SYNC ACC_PCM_ULD ACC_PCM_DLD

ANTSW0 ANTSW1 ANTSW2

WPOW_DET

C300

1u

C301

1u C302 1u

ANT_SW0 ANT_SW1 ANT_SW2 ANT_SW3 TX_ADC_STRB

DAC_I_NEG DAC_I_POS DAC_Q_NEG DAC_Q_POS

EFUSE_HV4

ADC_I_NEG ADC_I_POS ADC_Q_NEG ADC_Q_POS

RF_CTRL_CLK RF_CTRL_STRB RF_CTRL_DATA RF_CTRL_RESERVED

RF_DATA_A RF_DATA_B RF_DATA_C RF_DATA_STRB

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN RF_WCDMA_DCDC_EN RF_WCDMA_PWRDET_EN

PLL_26_FILTVDD PLL_26_VCONT PLL_PG_416_FILTVDD PLL_PG_416_VCONT

VDDCO_PLL_1 VDDCO_PLL_2

VCCAD VDDAD VCCDA VCCGPAD VDDCO_AF

VDDIO_2V5_1 VDDIO_2V5_2

VDDIO_1V8_00 VDDIO_1V8_01 VDDIO_1V8_02 VDDIO_1V8_03 VDDIO_1V8_04 VDDIO_1V8_05 VDDIO_1V8_06 VDDIO_1V8_07 VDDIO_1V8_08 VDDIO_1V8_09

VDDCO_1V2_00 VDDCO_1V2_01 VDDCO_1V2_02 VDDCO_1V2_03 VDDCO_1V2_04 VDDCO_1V2_05 VDDCO_1V2_06 VDDCO_1V2_07 VDDCO_1V2_08 VDDCO_1V2_09 VDDCO_1V2_10 VDDCO_1V2_11 VDDCO_1V2_12 VDDCO_1V2_13 VDDCO_1V2_14 VDDCO_1V2_15 VDDCO_1V2_16 VDDCO_1V2_17 VDDCO_1V2_18 VDDCO_1V2_19 VDDCO_1V2_20 VDDCO_1V2_21

PCMCLK PCMSYN PCMULD PCMDLD

TX_POW

NA1 NA2

G18 V6

W6 Y13

Y8 W8 W7 Y7

V4 W3 V5 Y1

L9

SD_ADDR(1:13) C2 C1 D2 D1 E3 E2 F2 G2 F1 G1 H1 H2 J1 J2 K2 C3 D3 E5 E4 F5 F4 F3 G3 G4 G5 H3 H4 J4 J3 K4 K3 B5 D4 A4 B4 C4 C5 B3 A3 B13 A12 A13 A14 B14 B15 A15 B16 C16 A17 B17 C18 B18 A20 A19 B19 B20 C20 C19 C21 D21 C22 D20 D22 E21 F22 D12 C12 D13 C13 D14 C14 D15 C15 D16 E16 C17 D17 E17 D18 E18 D19 E6 E7 J10 A9 D9 C10 B11 B10 D10 C11 D11 B12 B9 C9 NF_IO(0) NF_IO(1) NF_IO(2) NF_IO(3) NF_IO(4) NF_IO(5) NF_IO(6) NF_IO(7) SD_ADDR(1) SD_ADDR(2) SD_ADDR(3) SD_ADDR(4) SD_ADDR(5) SD_ADDR(6) SD_ADDR(7) SD_ADDR(8) SD_ADDR(9) SD_ADDR(10) SD_ADDR(11) SD_ADDR(12) SD_ADDR(13) SD_BA0 SD_BA1 SD_DATA(0) SD_DATA(1) SD_DATA(2) SD_DATA(3) SD_DATA(4) SD_DATA(5) SD_DATA(6) SD_DATA(7) SD_DATA(8) SD_DATA(9) SD_DATA(10) SD_DATA(11) SD_DATA(12) SD_DATA(13) SD_DATA(14) SD_DATA(15) SD_CS_n SD_CLK SD_CKE SD_CAS_n SD_RAS_n SD_WE_n SD_DQML_n SD_DQMU_n SD_DATA(0:15) SD_DATA(0) SD_DATA(1) SD_DATA(2) SD_DATA(3) SD_DATA(4) SD_DATA(5) SD_DATA(6) SD_DATA(7) SD_DATA(8) SD_DATA(9) SD_DATA(10) SD_DATA(11) SD_DATA(12) SD_DATA(13) SD_DATA(14) SD_DATA(15) B3 C4 C3 D4 D3 E4 E3 F4 J4 K3 K4 L3 L4 M3 M4 N3 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15

B
MCLK SYSCLK0 SYSCLK1 USB_XTAL1 TP301 PWRRST_n C327 1000p RESOUT0_n RESOUT2_n TP302 Q300 C R305 VPPFLASH 120K E
GND

W14 MCLK Y16 SYSCLK0 Y15 SYSCLK1 W16 SYSCLK2

P11 PWRRST_N V18 RESOUT0_N AB16 RESOUT1_N AA16 RESOUT2_N AA17 Y14 V16 W15 V17 AA15 W18 N2 M1 M2 M3 P1 N3 A21 A1 D6 A5 C6 D5 B6 A8 D8 C8 D7 B8 C7 B7 A6 SERVICE_N MCLKREQ SYSCLKREQ_N RTCCLKIN ACCSLEEP APPSLEEP DCON TCK TMS TDI TDO TRST_N RTCK TEMU0_N TEMU1_N ETM_PSTAT0 ETM_PSTAT1 ETM_PSTAT2 ETM_TSYNC ETM_TCLK ETM_TPKT0 ETM_TPKT1 ETM_TPKT2 ETM_TPKT3 ETM_TPKT4 ETM_TPKT5 ETM_TPKT6 ETM_TPKT7

OUT

IN

DNU1 DNU2 DNU3 DNU4 DNU5 DNU6 DNU7 DNU8 DNU9 DNU10 DNU11 NC1 NC2 NC3 NC4 NC5 NC6

RN1107

MCLKREQ BT_CLKREQ_n RTCCLK ACC_SLEEP APP_SLEEP DCON

EMIF1_A01 EMIF1_A02 EMIF1_A03 EMIF1_A04 EMIF1_A05 EMIF1_A06 EMIF1_A07 EMIF1_A08 EMIF1_A09 EMIF1_A10 EMIF1_A11 EMIF1_A12 EMIF1_SDBS0_A13 EMIF1_SDBS01_A14 EMIF1_SDBS1_A15 EMIF1_D00 EMIF1_D01 EMIF1_D02 EMIF1_D03 EMIF1_D04 EMIF1_D05 EMIF1_D06 EMIF1_D07 EMIF1_D08 EMIF1_D09 EMIF1_D10 EMIF1_D11 EMIF1_D12 EMIF1_D13 EMIF1_D14 EMIF1_D15 EMIF1_SDCS_N EMIF1_SDCLK EMIF1_SDCKEN EMIF1_SDCAS_N EMIF1_SDRAS_N EMIF1_WE_N EMIF1_BE0_N EMIF1_BE1_N

A2 A9 A10 B1 B10 N1 N10 P1 P2 P9 P10 B2 B7 B9 E8 F3 F6

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12

C7 C8 C9 B8 M9 L9 K9 J9 H7 H8 D9 H9 G7

SD_ADDR(1) SD_ADDR(2) SD_ADDR(3) SD_ADDR(4) SD_ADDR(5) SD_ADDR(6) SD_ADDR(7) SD_ADDR(8) SD_ADDR(9) SD_ADDR(10) SD_ADDR(11) SD_ADDR(12) SD_ADDR(13)

100K

R306

VDDE_1V8

SDRAM B4 VDD1 G9 VDD2 H2 VDD3 M2 VDD4 D2 VDDQ1 F2 VDDQ2 K2 VDDQ3 C2 VSS1 F9 VSS2 G2 VSS3 N4 VSS4 E2 VSSQ1 J2 VSSQ2 L2 VSSQ3

SD_CS_n SD_CLK SD_CKE SD_WE_n SD_BA0 SD_BA1 SD_RAS_n SD_CAS_n SD_DQML_n SD_DQMU_n

E9 H4 G8 F8 D7 D8 E7 F7 G3 H3

_CS CLK CKE _WED BA0 BA1 _RAS _CAS LDQM UDQM

U300 K5D1G12ACD-D075

ACC_IRQ_n APP_IRQ_n I2S0_CLK I2S0_WS I2S0_ULD I2S0_DLD I2S1_CLK I2S1_WS I2S1_ULD I2S1_DLD

AB20 MSACCIRQ_N AA20 MSAPPIRQ_N R20 R19 T21 T19 T20 U22 U20 U21 I2S0CLK I2S0WS I2S0ULD I2S0DLD I2S1CLK I2S1WS I2S1ULD I2S1DLD

U301 DB3150

VDDE_1V8

SRST_n SCLK SDAT

P10 SRST_N U5 SCLK P9 SDAT ACC_GP00_USB_STP ACC_GP01_USB_DIR ACC_GP02_UART0_RX ACC_GP03_UART0_TX ACC_GP04_USB_CLK ACC_GP05_USB_NXT ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP12_KEY_LED_ON ACC_GP13_SPK_AMP_EN ACC_GP14_BT_SPI_INT ACC_GP16_MC_DETECT ACC_GP20_USB_CS_PD ACC_GP22_USB_DAT3 J9 K9 P2 N9 M9 N4 P3 P4 R4 R3 R2 R1 T2 T4 U1 T3 T5 U4 V3 V1 U2 U3 V2 R21 M14 N14 P13 P14 N22 N21 M21 L22 N20 N19 P21 P22 P19 P20 P12 ACC_GPIO_0 ACC_GPIO_1 ACC_GPIO_2 ACC_GPIO_3 ACC_GPIO_4 ACC_GPIO_5 ACC_GPIO_6 ACC_GPIO_7 ACC_GPIO_8 ACC_GPIO_9 ACC_GPIO_10 ACC_GPIO_11 ACC_GPIO_12 ACC_GPIO_13 ACC_GPIO_14 ACC_GPIO_15 ACC_GPIO_16 ACC_GPIO_17 ACC_GPIO_18 ACC_GPIO_19 ACC_GPIO_20 ACC_GPIO_21 ACC_GPIO_22 ACC_GPIO_23 APP_GPIO_0 APP_GPIO_1 APP_GPIO_2 APP_GPIO_3 APP_GPIO_4 APP_GPIO_5 APP_GPIO_6 APP_GPIO_7 APP_GPIO_8 APP_GPIO_9 APP_GPIO_10 APP_GPIO_11 APP_GPIO_12 APP_GPIO_13 APP_GPIO_14 I2CSCL I2CSDA I2CSCL2 I2CSDA2

ACC_GP23_BT_SPI_CS0n ACC_GP24_BT_SPI_DAT0 ACC_GP25_BT_SPI_DAT1 ACC_GP26_BT_SPI_CLK ACC_GP27_AMP_SW_EN APP_GP00_UART_RX APP_GP01_UART_TX APP_GP02_MC_IO_OFF APP_GP03_FLIPSENSE APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP10_BL_CTRL APP_GP11_OJ_CS_n APP_GP12_PHFSENSE APP_GP13_MC_CLKRET APP_GP14_VC_IO_OFF APP_GP15_CAM_LDO_CTRL

EMIF2_D00 EMIF2_D01 EMIF2_D02 EMIF2_D03 EMIF2_D04 EMIF2_D05 EMIF2_D06 EMIF2_D07 EMIF2_D08 EMIF2_D09 EMIF2_D10 EMIF2_D11 EMIF2_D12 EMIF2_D13 EMIF2_D14 EMIF2_D15 EMIF2_CS0_N EMIF2_CS1_N EMIF2_CS2_N EMIF2_SDCAS_RE_OE_N EMIF2_WE_N EMIF2_SDCLK EMIF2_CLK EMIF2_FBCLK EMIF2_SDCLKEN EMIF2_SDRAS_ADV_N EMIF2_BE0_N EMIF2_BE1_N EMIF2_NFIF_READY EMIF2_WAIT_N CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7

SAMSUNG MCP 1Gbits 1.8V x8 LB NAND + 512Mbits 1.8V x16 SDRAM

G4 G5 G6 H5 H6 J3 K5 K6 K7 K8 M5 M6 M7 M8 N2 N9

EMIF2_A01 EMIF2_A02 EMIF2_A03 EMIF2_A04 EMIF2_A05 EMIF2_A06 EMIF2_A07 EMIF2_A08 EMIF2_A09 EMIF2_A10 EMIF2_A11 EMIF2_A12 EMIF2_SDBS0_A13 EMIF2_SDBS01_A14 EMIF2_SDBS1_A15 EMIF2_A16 EMIF2_A17 EMIF2_A18 EMIF2_A19 EMIF2_A20 EMIF2_A21 EMIF2_A22 EMIF2_A23 EMIF2_A24 EMIF2_A25 EMIF2_CRE_A26

C328 0.1u

C329 0.1u

C330 0.1u

C331 0.1u

C332 0.1u

VDDE_1V8

R308

2.2K

NF_IO(0) NF_IO(1) NF_IO(2) NF_IO(3) NF_IO(4) NF_IO(5) NF_IO(6) NF_IO(7)

J5 L5 J6 L6 J7 L7 J8 L8

IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7

R307

10K

B6 VCC1 N7 VCC2 VCCQ N6

NAND

NF_CE_n NF_CLE NF_ALE NF_ALE NF_CLE NF_RE_n NF_READY NF_WE_n RESOUT0_n

C6 D5 C5 E5 E6 D6 F5

_CE E ALE CLE _RE R__B _WE _WP B5 VSS5 N5 VSS6 N8 VSS7 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 C333 0.1u C334 0.1u C335 0.1u

NF_IO(0:7)

NF_CE_n

NF_RE_n NF_WE_n

VSSCO_PLL_1 VSSCO_PLL_2

VSSAD GNDAD VSSDA VSSGPAD VSSCOMMON

USB_DAT_VP USB_SE0_VM USB_OE

MCCLK MCCMD MCCMDDIR MCDAT0 MCDAT1 MCDAT2 MCDAT3 MCDATADIR

PDI_RES_N PDI_C0 PDI_C1 PDI_C2 PDI_C3 PDI_C4 PDI_C5 PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7

NF_READY

KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5

VDD_CAM_1V8 VDDE_1V8

Y22 W19 V22 V20 W22 V19 W21 V21 U18 U19 T18

GND_00 GND_01 GND_02 GND_03 GND_04 GND_05 GND_06 GND_07 GND_08 GND_09 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND1_1 GND1_2 GND1_3

CI_RES_N CI_PCLK CI_VSYNC CI_HSYNC E20 F20 E19 F18 CI_RES_n CI_PCLK CI_VSYNC CI_HSYNC

AA21 Y20 W20 Y21

Y19 AA19 Y18 Y17 AB19 AB18 AA18 W17

AB9 AB10 AA7 Y6 AA8

K10 K11 K12 K13 K14 L10 L11 L12 L13 M10 M11 M12 M13 N11 N12 N13 J11 J12 J13 J14 N10 W12 W13

R312 R313 R314 R316

3300 3300 3300 3300

100K

R315

MICROSD_CLK MICROSD_CMD MICROSD_CMD_DIR MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_DAT_DIR

KEYOUT0 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5

R309

LCD_WR LCD_RS_n LCD_CS_n LCD_RD LCD_VSYNC PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7

L14 DNI M20 M19 L21 L20 L19 K19 K20 J19 K21 J20 J21 J22 H19 H20

AA13 Y12

SHARED_I2C_SCL SHARED_I2C_SDA APP_I2C_SCL APP_I2C_SDA

USB_DAT1 USB_DAT0 USB_DAT2

LCD_RES_n

CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7

F19 G21 F21 G20 H21 G19 G22 H22

L4 L3 M4

H
OJ300 OJ301 OJ302 OJ303

10

11

12

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 179 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

VBAT

VBAT

VDD_CAM_AF

R402

150mA 0 R410 U401 BH28FB1WHFV 5 STBY NC 6 GND BGND 4 VIN VOUT J1 1 VCC GND 2 RST VPP 3 I_O CLK 7 GND1 GND2 R406 10K C403 1u C404 1u

R641 MOTOR_P DNI R405 MOTOR_EN 5.6K 6 5 4 Q401 EMX18 R404 47K

APP_GP15_CAM_LDO_CTRL

1 2 3

SIMVCC SIMRST_n SIMCLK

4 5 6 8 L401 0

If you want to use MOTOR_EN (2.7V) for motor power, remove R402 and R405, mount R403 and R408 by 0 ohm.
SIMDAT

SIMDAT and SIMCLK Siganls to be separated when routing 1 2 3 MOTOR_N R407 0 R409 3.3 C650 DNI C649 DNI C401 DNI C402 1u Close to SIM CN

Add LDOs 2007.05.23 SIM CONNECTOR

MOTOR DRIVER

CCO2 R411 HOOK 47K C405 0.01u FL401 1 IN1 2 NC1 3 NC2 4 IN2 NUF2116MN 8 OUT1 7 NC4 6 NC3 5 OUT2 R412 2.7K

VBAT

VDDE_1V8 C406 MIC2P C407 MIC2N C408 0.1u C409 4.7u 10V 0.1u 0.1u

MIDR

R413 1% 470 R414 1% 470

ACC_GP20_USB_CS_PD ACC_GP04_USB_CLK USB_DAT0 USB_DAT1 USB_DAT2 ACC_GP22_USB_DAT3 ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7 ACC_GP05_USB_NXT ACC_GP00_USB_STP ACC_GP01_USB_DIR 51K

GND3 E4 GND2 D2 GND1 C5

C3 A4 B1 A1 A2 A3 A5 A6 B6 C6 D5 D6 E5 E1 E6 4.7u 0.1u

VCC NC2 NC1

F3 F2 F1

CHIP_SEL TEST CLOCK VCC_IO1 DATA0 VCC_IO2 DATA1 RREF DATA2 DM U402 DATA3 DP DATA4 ISP1508AET FAULT ID DATA5 CFG2 DATA6 CFG1 DATA7 NXT PSW_N STP VBUS DIR REG3V3 CFG0 XTAL1 REF1V8 XTAL2

C4 B5 B2 C2 C1 D1 E2 D3 B3 B4 D4 F4 E3 F5 F6 R419 1% 12K 0.1u 4.7u 0.1u 2.2u

C410 EAR_L VDDE_1V8 C411 USB_DM USB_DP EAR_R

100u

FL402 1 2 3 4 IN1 NC1 NC2 IN2

PGND

100u

R415

NUF2114MN 8 OUT1 7 NC4 6 NC3 5 OUT2

PGND

FB401 CN402 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22 FM_ANT HS_MIC JACK_TYPE EAR_L EAR_R USB_DP USB_DM EAR_DETECT_n VBAT_+4.2V VBAT_+4.2V ONSWB_n VCHG_+5V VCHG_+5V VPPFLASH USB_POWER UART_TX UART_RX GND

FB402

R416 220K R417 1K VBUS_USB_TRX USB_XTAL1 USB_DP USB_DM APP_GP12_PHFSENSE R640 1K VBAT CTS_ON C418 0.1u VPPFLASH_E VBUS APP_ACC_UART_TX APP_ACC_UART_RX VBUS_USB_TRX VA402 ULCE0505C015FR VA403 ULCE0505C015FR RSB6.8CST2R C419 2.2u DNI DNI DNI C421 C422 C423 DNI C420 D401 USFB13L

C412

C413

C414

C415

C416

USB Transceiver for High Speed

C417

VDDE_1V8 VBAT C4 KNATTE2-C2 APP_GP00_UART_RX ACC_GP02_UART0_RX ACC_GP03_UART0_TX APP_GP01_UART_TX DCIN VPPFLASH ONSWB_n D2 C3 D4 D3 C5 D5 D1 DTMS_I CTMS_I CFMS_I DFMS_I DCIO_I VPPFLS_I CTS_ON_I FL403 DTMS_E CTMS_E CFMS_E DFMS_E DCIO_E VPPFLS_E CTS_ON_E A1 A3 A4 A2 B5 A5 B1 R629 R631 R632 R628 DNI 0 0 DNI DCIN_A VPPFLASH_E CTS_ON ACC UART Connection APP_ACC_UART_TX CTS_ON DCIN_A APP_ACC_UART_TX APP_ACC_UART_RX
ON TX RX

ZD401

9 NCP348MTR2G U403 10
CTS RTS DSR

_EN GATE_OUT GATE OUT2 OUT1

IN1 IN2 IN3 _FLAG

1 4 5 3
TP402

APP_ACC_UART_RX

USB

INSTPAR

VPPFLASH_E USB_DP USB_DM VBUS

R421 DNI R423 DNI close to 18Pin Con

UART

1mm pad

2.5G 3G UR401

EMI Filter Close to 18pin CON

GND5 GND4 GND3 GND2 GND1

DOWNLOAD POINT

EMI/ESD Filter for UART and DCIN

C2 C1 B4 B3 B2

ESD9X5.0ST5G

ZD402

12 11 10 9 8 7 6 5 4 3 2 1

9 8 FB403

VCC

UTXD NC3 URXD NC2 PWR VBAT VBAT ON_SW ON_SW NC1 VCHAR TX TX RX RX GND GND
NC4

DCIN_A

7 6

C424 1u

C425 0.01u

2 GND 11 NC1 12 NC2

10

11

12

LGE Internal Use Only

- 180 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

VDD_CAM_2V8 VDD_CAM_1V8 CN503 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G3 G4 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36

VDDE_1V8

VDDG_2V75

A
SPK_RCV_P SPK_RCV_N

VBAT

R501 R503

0 0 APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP11_OJ_CS_n KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4

LCD_RD

C501 22p C502 22p

MOTOR_P MOTOR_N
1 9 8 7 6

G1

CI_D0 CI_D1 CI_D2 CI_D3

6 7 8 9

INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

4 3 2 1

LCD_WR LCD_RS_n LCD_CS_n LCD_VSYNC LCD_RES_n

R505 R506

47 47

G2

G1

10

FL502

10 5

G2

APP_GP10_BL_CTRL APP_GP15_CAM_LDO_CTRL APP_GP14_VC_IO_OFF ACC_GP12_KEY_LED_ON

2 3 4

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4

PDI_D7 PDI_D6 PDI_D5 PDI_D4

RB521S-30 D603

KEYIN3 KEYIN4 KEYIN5

C503

1u

FL500

ICVE10184E150R500FR

ICVE10184E070R100FR

FL501 CI_RES_n APP_I2C_SDA APP_I2C_SCL CI_VSYNC CI_HSYNC SYSCLK0


1 2 3 4

ICVE10184E150R500FR
9 8 7 6

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2

PDI_D3 PDI_D2 PDI_D1 PDI_D0

R508

47

G2

G1

INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

ULCE0505C015FR

22p 22p 22p

22p

22p

DNI

DNI

CI_D4 CI_D5 CI_D6 CI_D7

6 7 8 9

INOUT_B4 INOUT_A4

4 3 2 1

CI_PCLK

R509

47

10

FL504

10 5

ONSWA_n

VDDH_CAM_CORE

VDD_CAM_1V8

VDDE_1V8

VDDG_2V75

VDDK_2V75

C513 C514 C515

C517

C518

C516

C519

VA500

ICVE10184E070R100FR

C
C504 1u 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 G4 C552 22p C551 DNI G2 C505 0.1u VBACKUP CN502 G1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 RESOUT2_n BT_CLK ACC_PCM_SYNC ACC_PCM_CLK ACC_PCM_DLD ACC_PCM_ULD ACC_GP14_BT_SPI_INT BT_CLKREQ_n RTCCLK

CN501 G2 G1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 G3 KEYIN0 KEYIN1 KEYIN2 KEYIN3 C506 1u C507 0.1u C508 0.1u C509 0.01u C510 1u

CI_PCLK

70pin Main to FPCB CONNECTOR


AXK7L70227 (0.9T socket)
VDD_CAM_2V8 VDD_CAM_AF

CI_RES_n

APP_I2C_SDA APP_I2C_SCL

FB501

CI_D7 CI_D6 CI_D5 CI_D4 CI_D3 CI_D2 CI_D1 CI_D0 R551 SYSCLK0 47 CI_VSYNC CI_HSYNC

MICROSD_CMD ACC_GP16_MC_DETECT APP_GP13_MC_CLKRET MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_DAT_DIR MICROSD_CLK MICROSD_CMD_DIR ACC_GP26_BT_SPI_CLK ACC_GP25_BT_SPI_DAT1

APP_GP02_MC_IO_OFF

D
FB502

D
ACC_GP24_BT_SPI_DAT0 ACC_GP23_BT_SPI_CS0n

40pin Main to Sub PCB


AXK740327G (2.5T socket)

34pin 3M CAMERA CONNECTOR


E
RB521S-30 ONSWA_n D501

AXK7L34227G (0.9T socket)

6 5 4 3 2 1 CN523

Volume Camera

VBAT

1
1

2
2

3
3 KEYOUT0

2 1 SSC-SWTS1007

4
4

5
5

6
6 INSTPAR INSTPAR INSTPAR INSTPAR INSTPAR

2 1 SSC-SWTS1007

KEYOUT1 LD501 A LD502 A

VDDC_2V65

VDDE_1V8

C524 0.1u

U502 1 2 VDD GND1 NC

TK60012BM5 6 IO_VDD GND2 OUT 5 4 APP_GP03_FLIPSENSE

150

150

KEYOUT2

C525 0.1u

ESD9X5.0ST5G

ESD9X5.0ST5G

ESD9X5.0ST5G

ESD9X5.0ST5G

ESD9X5.0ST5G

R517

R518

ZD502

ZD503

ZD504

ZD501

ZD505

G
C526 0.1u

MAIN_LED1

KEYOUT3

MAIN_LED2

KB_STAR

0
0

#
KB511

HALL EFFECT SWITCH KEYPAD BACKLIGHT LED

R642 INSTPAR KEYOUT4

DNI

H
ESD9X5.0ST5G

KEY PAD AND SIDE KEY PAD

R643 110

ZD506

10

11

12

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 181 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

SHARED_I2C_SDA SHARED_I2C_SCL

SYSCLK1 ACC_SLEEP APP_SLEEP

ONSWA_n ONSWB_n DCON ACC_IRQ_n APP_IRQ_n PWRRST_n

MAIN_LED1 MAIN_LED2

MOTOR_EN

TX_ADC_STRB

A
ADOUT VDDD_1V5 VRADA_2V8 VDDD_1V5 VDDE_1V8 VDIGRAD_1V8 VBAT R602 0 VRADA_2V8 to RF3000, RF3100 analog and WCDMA Power Detector to WCDMA & GSM PAM, Backlights, Speaker Amp, USB/RMT Switch, and Ext. LDOs VBAT

VBAT

VBAT_C RB521S-30

D600

VBACKUP

TESTOUT RTEMP

HOOK

VDDD_1V5 R639 R603 0 VDDE_1V8 0 VDIGRAD_1V8 C601 1u C602 1u C603 2.2u VDDC_2V65 VDDH_CAM_CORE VDDF_2V5 VDDG_2V75 VDDK_2V75

to AB3000 CODECs/ADC/PLL to All I/O Supplies and Memory to RF3000 and RF3100 digital

H12 H10

D8 A10 B10 C9 D9 E9 F11 E11 F10 GPA0 GPA1 GPA2 GPA3 GPA4 GPA5 GPA6 GPA7 GPA12

MCLK SLEEPA SLEEPB

LED1 LED2 LED3

ONSWA_N ONSWB_N ONSWC IRQA_N IRQB_N PWRRST_N

TXON ADSTR ADOUT VDDADC

VIBR

SDA SCL

C600 4.7u C604 4.7u C605 1u D11 E12 A12 A8 M11 A5 C10 VBAT_A VBAT_B VBAT_E VBAT_F VBAT_G VBAT_C MOD1

H11 G4 B9 C8

C7 B8 G9 J9 L11 H9

K4 J10 L12

A6 D6 B7

B6

C12 VDD_A B11 EXTLDO F12 VDD_D D12 VDD_E A11 VDD_C B12 VDD_H A9 VDD_F A7 VDD_G VDD_K VDDLP M12 J11 C606 1u C607 1u C608 1u C609 1u C610 1u C611 1u R636 R637 R605 0

VDDC_2V65 VDDH_CAM_CORE VDDF_2V5 VDDG_2V75 0 VDDK_2V75 4.7K VBACKUP

to Hall Switch, AB3000 BEAR SS 1.2V to DB3100 analog to SD Card and LCD and OJ to Bluetooth to AB3000 RTC module

300K

C
VBAT

K12 XTAL1 K11 XTAL2 4 3 MC-146_12_5PFX600 C612 24p 32.768KHz C613 24p RTCCLK J12 32KHZ VBUCK VDDBUCK G10 SIMOFF_N K2 SRST_N J3 SCLK K3 SDAT H4 SWBUCK B2 A2 A1 1

VBAT_C 1608 120ohm(@100MHz) FB600 BLM18PG121SN1J

VBAT VCORE

R606

Parallel with VCORE 3*3*1.2 0.85A 155mohm 30% L600 4.7uH RB521S-30 VBUCK_FB VCORE D602 to DB3100 CORE

Close to Pin 1 KDS221E_RTK

C1

A2

D601

A1_C2 3

SRST_n SCLK SDAT

C614 10u B1 D1 C618 0.1u 10V F1 1u C622 Close to ABB J2 SIMRST_N H5 SIMCLK SIMDAT H2 SIMRST_n SIMCLK SIMDAT SIMVCC

C615 0.1u

C616 10u

BDATA FGSENSE+

VSSBUCK PBIAS

33u

Battery Conn.

G12 2012 1% 1/4W C621 47p Close to AB G11

Local Ground Plane

3 2 1

C617

Phone ground return path CN600 VBAT

R608 Close to Pin 3 0.025

route as a differential pair

SIMVCC

Use Multiple Vias

FGSENSE-

U600 AB3000

BATT_GND

R610

H1 E1

VBAT_D CHSENSE+

2012 1% 1/4W

R611 0.1

route as a differential pair F2 CHSENSE-

D4 SCK1 D3 WS1 C2 SDI1 C1 SDO1 E4 SCK2 C3 WS2 D2 SDI2 F4 SDO2 MIC1P MIC1N MIC2P MIC2N MIC3P MIC3N MIC4P MIC4N K8 J8 L8 M9 M10 H8 K9 L9

I2S0_CLK I2S0_WS I2S0_ULD I2S0_DLD I2S1_CLK I2S1_WS I2S1_ULD I2S1_DLD DNI DNI DNI DNI

Main MIC
MIC1P MIC1N MIC2P MIC2N CCO1

Close to Main MIC


R612 0 C624 0.1u 0.1u MIC600 1 2 3 4 5 6 0
OUT G1 G2 G3 PWR G4

S2

G2

E2

MIC1P C625 MIC1N

CHREG

DCIN_A

D2

R614

D4

R613 47K DCIN F3 J1

C626

C627

C628

C629

D3

SPM0204LE5-QB

DCIO VBUS

D1

VBUS
S1 G1

SIA911DJ Q600

G1

TRICKLE CCO1 CCO2 SPKRP SPKRN BEARP BEARN AUXO1 AUXO2 LINEIN1 LINEIN2 MIDR

J7 VDDC_2V65 VDDD_1V5 L3 K5 R630 0 M8 E3 M1 VDDE_1V8 F9 VBAT L6

VDD_ADC1 VDD_ADC23 VDD_SPKR VDD_BEAR VDD_CODEC VDD_DIG VDD_PLL

M7 K7 M2 M3 M4 J6 K6 M6 L10 K10 L5 47n C635 DNI C636 DNI C637 DNI C638 DNI

CCO1 CCO2 SPKRP SPKRN BEARP BEARN EAR_R EAR_L

Speaker Amp.

VBAT

MIDR R617 1% 39K

C630 2.2u VBAT

F
C632 0.1u

J5 C631 DEC3 J4 DEC4

C633 0.1u SWBOOST BOOST_ISENSE+ BOOST_ISENSEV_BOOST BOOST_SW1 BOOST_SW2 BOOST_SW3 BOOST_FB+ VSSBOOST A4 B5 C5 B3 C4 B4 A3 D5 E5

C634 0.1u

U601 C639 SPKRN C640 SPKRP ACC_GP13_SPK_AMP_EN 47n 47n R619 1%10K R620 1%10K C3 C2 B1 C1 100K 220n ININ+

TPA6205A1ZQVR VDD VO+ VOGND A3 B3 A1 C643 DNI B2 C644 DNI

BEARP

R618 1% 15

U602 FSA2268TUMX 10 8 1B0 1A 1 1B1 2B0 2B1 GND S1 2A S2 VCC 7 5 6 9 C646 0.01u

SPK_RCV_P

VDD_IO

BEARN

R621 1% 15

2 3 4

SPK_RCV_N

C641 DNI

C642 0.1u

OTP_TEST

VSS_DIG VSS_CODEC VSS_BEAR VSS_SPKRP VSS_SPKRN VSS_PLL

F7 VSSTH1 G7 VSSTH2 G6 VSSTH3

VSSTH5 VSSTH6 VSSTH7 VSSTH8 VSSTH9 VSSTH10 VSSTH11 VSSTH12

100K

E8 TEST D10 VREF H3 IREF

_SHUTDOWN BYPASS

1u

C11 SUB G2 SUB2

E10 VSS_A K1 VSS_B C6 VSS_C G3 VSS_D

C645

R623

E6 E7 F8 G8 H7 H6 G5 F5

D7 L7 M5 L2 L4 L1

R624

C647

R625 1% 39K ACC_GP27_AMP_SW_EN

G
R627 51K

Separate VSS_DIG & VSS_PLL GND

10

11

12

LGE Internal Use Only

- 182 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

11

12

VDDE_1V8

VDDG_2V75

VDDE_1V8

VDDG_2V75 VDDK_2V75

100K

100K

VBACKUP

MICROSD_CMD ACC_GP16_MC_DETECT APP_GP13_MC_CLKRET MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_DAT_DIR MICROSD_CLK MICROSD_CMD_DIR ACC_GP26_BT_SPI_CLK ACC_GP25_BT_SPI_DAT1

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G2

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

100K

100K

100K

CN100 G1 RESOUT2_n BT_CLK ACC_PCM_SYNC ACC_PCM_CLK ACC_PCM_DLD ACC_PCM_ULD ACC_GP14_BT_SPI_INT BT_CLKREQ_n RTCCLK

C100 0.1u

C101 0.1u

B
R104

R101

R100

R102

R103

FL101 MICROSD_DAT_DIR MICROSD_DAT0 MICROSD_DAT1 MICROSD_DAT2 MICROSD_DAT3 MICROSD_CMD_DIR MICROSD_CMD MICROSD_CLK APP_GP13_MC_CLKRET A5 C5 B2 C1 A2 B4 A4 B5 B1 A3 A1 B3 C3 VCCA DAT0_DIR DAT0A DAT123_DIR DAT1A DAT2A DAT3A CMD_DIR CMDA CLKA CLK_F GND1 GND2

SN74AVCA406EZXYR D5 VCCB DAT0B D2 MICROSD_DAT0_2V7

D1 DAT1B C4 DAT2B D4 DAT3B

ACC_GP24_BT_SPI_DAT0 ACC_GP23_BT_SPI_CS0n

C2 CMDB D3 CLKB

MICROSD_CMD_2V7 MICROSD_CLK_2V7 VDDG_2V75

40 pin SUB to MAIN PCB


AXK840125WG (1.3T Header)
S100

MicroSD Level Shifter


ACC_GP16_MC_DETECT MICROSD_CMD_2V7 MICROSD_CLK_2V7 MICROSD_DAT0_2V7

GND
DAT2_RSV CD_DAT3_CS CMD_DI VDD CLK_SCLK VSS DAT0_DO DAT1_RSV

D
0.1u 470K R116

GND SCHA1A0102

MicroSD Socket
Molex : ENSY0014101 (500873-0802) Alps : ENSY0013501 (SCHA1A0102)

U101
RESOUT2_n BT_CLK RTCCLK D3 RESET_N D6 REF_CLK_IN G3 LP_CLK C5 ACC_GP25_BT_SPI_DAT1 ACC_GP26_BT_SPI_CLK ACC_PCM_CLK ACC_PCM_SYNC ACC_PCM_DLD ACC_PCM_ULD

STLC2500C

CLK_REQ_OUT_1 BT_WAKEUP

C4

F5 UART_RXD G4 UART_CTS D1 PCM_CLK C2 PCM_SYNC D2 PCM_A E1 PCM_B B3 GPIO_16 C3 GPIO_8 B1 GPIO_9 C1 GPIO_10

F6 UART_TXD F4 UART_RTS

ACC_GP24_BT_SPI_DAT0 ACC_GP23_BT_SPI_CS0n

C102

E
GPIO_11 B2

VDDE_1V8 ACC_GP14_BT_SPI_INT

D5 GPIO_0 E6 CLK_REQ_IN_1 G6 CLK_REQ_IN_2 F7 HOST_WAKEUP E2 CONFIG_1 F2 CONFIG_3 F1 CONFIG_2

A2 VSS_RF1 A5 VSS_RF2 VSS_BT_RF A3 RFP A4 RFN FL100 5 4 BP1 BP2 DEA212450BT-7043C1 1 U_BP BP_DC 2 L100 NA L101 NA VSS_BT_RF C105 100p
FEED

ANT100 AMAA802012LG09
GND1 GND2

BAT100 VBACKUP

BT_CLKREQ_n VDDK_2V75 VDDE_1V8

CLK_REQ_OUT2 E3 VSS_DIG1 E4 VSS_DIG2

A6 TOUT_IP_QN B5 TOUT_IN_QP G2 VSS_BT_ANA

F
R119

6 3

G2 G1

G7

F
VDD_D VDD_IO_A VDD_IO_B VDD_CLD VDD_HV_A VDD_HV_D B4 VSS_ANA1 B6 VSS_ANA2 C6 VSS_ANA3 VSS_BT_RF VSS_BT_RF VSS_BT_RF

G5 F3

BACKUP BATTERY

R118

DNI

R124

E7 A7 G1

B7 VDD_DSM C7 VDD_N D7 VDD_CL A1 VDD_RF

VSS_BT_ANA AF_PRG E5

G
C106 0.22u C107 0.22u C108 0.22u C109 0.1u C110 0.22u C111 0.1u C112 0.1u C113 0.22u

Bluetooth

VSS_BT_ANA

VSS_BT_RF

10

11

12

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 183 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

10

11

12

VDD_CAM_2V8 VDD_CAM_1V8

VDDG_2V75 VDDE_1V8

VBAT

VDDE_1V8

VDDG_2V75

CN100 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G3 R134 ESD9X5.0ST5G NA 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 G4

PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7 LCD_RD LCD_VSYNC LCD_RES_n LCD_WR LCD_RS_n LCD_CS_n APP_GP10_BL_CTRL APP_GP15_CAM_LDO_CTRL

ACC_GP12_KEY_LED_ON APP_GP11_OJ_CS_n APP_GP07_OJ_MOTION_n APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK KEYIN3 KEYIN4 KEYIN5 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 ONSWA_n

TP100

PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7 LCD_RES_n LCD_WR LCD_RD LCD_CS_n LCD_RS_n

100K

100K

40 pin OJ key Connector


AXK7L40227G (0.9T Socket)

R100 10K

R104 1%

ESD9X5.0ST5G INSTPAR ZD102

BACKLIGHT CHARGE PUMP


VDDE_1V8 VDDG_2V75

LCD_Connector(35pin)
04-6293-035-000-829

IC?

NLSX3013 I_OVCC1 I_OVCC2 I_OVCC3 I_OVCC4 I_OVCC5 I_OVCC6 I_OVCC7 VL VCC GND EN I_OVCC8 C1 D1 C2 D2 C3 D5 C4 C5 APP_GP11_OJ_CS_n_2V75 APP_GP04_OJ_MISO_2V75 APP_GP05_OJ_MOSI_2V75 APP_GP06_OJ_SCLK_2V75 ZD103 ZD104 1 2 3 4 5 G3 G4 ZD100 APP_GP04_OJ_MISO_2V75 APP_GP05_OJ_MOSI_2V75 APP_GP06_OJ_SCLK_2V75 APP_GP07_OJ_MOTION_n_2V75 APP_GP11_OJ_CS_n_2V75 CN102 G1 G2 10 9 8 7 6 R118 100K APP_GP07_OJ_MOTION_n_2V75 KEYIN4 KEYOUT2 VDDG_2V75

APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP11_OJ_CS_n

B1 A1 B2 A2 B3 A5 B4 B5

R105 1%

LCD_VSYNC LCD_BL5 LCD_BL4 LCD_BL3 LCD_BL2 LCD_BL1 VDD_BACKLIGHT

CN101 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35

VBAT

U100 MAX8631XETI 23 1 C1P PIN 2 IN C101 10u 3 GND 24 PGND 29 BGND C1N C2P 22 26

C100 1u

B
C102 1u VDD_BACKLIGHT

C2N OUT APP_GP10_BL_CTRL 20 19 21 18 28 17 ENM1 ENM2 ENF ENLDO P1 P2

27 25

APP_GP15_CAM_LDO_CTRL

ESD9X5.0ST5G INSTPAR ZD101

8 7

SETM SETF REFBP

M1 M2 M3 M4 F1 F2 F3 F4 LDO1 LDO2

16 15 14 13 12 11 10 9 4 5 C104 1u C105 1u C106 10u

LCD_BL1 LCD_BL3 LCD_BL5 LCD_BL2 LCD_BL4

R102

R103

6.8K

20K

6 C103 0.01u

VDD_CAM_2V8 VDD_CAM_1V8

I_OVL1 I_OVL2 I_OVL3 I_OVL4 I_OVL5 I_OVL6 I_OVL7 I_OVL8

A4 R109

A3 D3 D4

10K ESD9X5.0ST5G INSTPAR ESD9X5.0ST5G INSTPAR ESD9X5.0ST5G INSTPAR

Optical Joystick Level Shifter

10pin Optical Joystick Connector


AXK7L10227G (0.9T socket)

VBAT

KEYIN3

KEYIN4

F
SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL SSC-TWH104-HL

KEYIN5

SOFT100

UP

SOFT101 LD100

LD101

LD105

LD106

LD102

LD103

LD104

LD107

C107 0.1u

KEYOUT1
51 R120 ACC_GP12_KEY_LED_ON 2.2K LEFT RIGHT

150

150

150

150

51

51

R122

R121

R123

R126

R124

R129

KEYOUT2
R130 100K

27 Q100 1 R131 27 6 5 4 2 3 EMX18

HOT

DOWN

CANCEL

R125

R127

R128

51

KEYOUT3

CALL ONSWA_n

END

UPPER KEY LED


KEYOUT4

OJ KEY PAD

10

11

12

LGE Internal Use Only

- 184 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

10

VDD_CAM_2V8 VDD_CAM_1V8 CN101 G1 G2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G3 G4 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36

VDDE_1V8

VDDG_2V75

VDD_CAM_2V8

SPK_RCV_N APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK APP_GP07_OJ_MOTION_n APP_GP11_OJ_CS_n KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4

LCD_RD

LCD_WR LCD_RS_n LCD_CS_n LCD_VSYNC LCD_RES_n CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 CI_D6 CI_D7 CI_PCLK

MOTOR_P MOTOR_N KEYIN3 KEYIN4 KEYIN5 APP_GP10_BL_CTRL APP_GP15_CAM_LDO_CTRL APP_GP14_VC_IO_OFF ACC_GP12_KEY_LED_ON PDI_D7 PDI_D6 PDI_D5 PDI_D4 PDI_D3 PDI_D2 PDI_D1 PDI_D0 CI_RES_n APP_I2C_SDA APP_I2C_SCL CI_VSYNC CI_HSYNC SYSCLK0

CN100 APP_GP14_VC_IO_OFF SYSCLK0 CI_PCLK CI_D0 CI_D1 CI_D2 CI_D3 CI_D4 CI_D5 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11

VDD_CAM_1V8

SPK_RCV_P

VBAT

CI_RES_n APP_I2C_SCL APP_I2C_SDA


TP104 TP105

CI_HSYNC CI_VSYNC CI_D7 CI_D6

FPCB to VGA Camera


AXK720147 (1.5T socket)

ONSWA_n

70 pin main connector


AXK8L70125BG (0.9T Header)

VDD_CAM_2V8

VDD_CAM_1V8

VDDG_2V75

VDDE_1V8

VBAT

SPK_RCV_P

OUT100 MOTOR_P OUT101

CN102 G1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G2 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 SPK_RCV_N

MOTOR_N OUT103

OUT102

VIBRATOR PAD
ACC_GP12_KEY_LED_ON APP_GP11_OJ_CS_n APP_GP07_OJ_MOTION_n APP_GP04_OJ_MISO APP_GP05_OJ_MOSI APP_GP06_OJ_SCLK KEYIN3 KEYIN4 KEYIN5 KEYOUT1 KEYOUT2 KEYOUT3 KEYOUT4 ONSWA_n

PDI_D0 PDI_D1 PDI_D2 PDI_D3 PDI_D4 PDI_D5 PDI_D6 PDI_D7 LCD_RD LCD_VSYNC LCD_RES_n LCD_WR LCD_RS_n LCD_CS_n APP_GP10_BL_CTRL APP_GP15_CAM_LDO_CTRL

Audio Filter & PAD

Main to OJ key PCB


AXK8L40125 (0.9T Header)

TP100 TP101 TP102 TP103

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 185 -

LGE Internal Use Only

LGE Internal Use Only

- 186 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

8. BGA Pin Map


DB3150 ( Digital BB)

: NC Pin

Index mark

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 187 -

LGE Internal Use Only

8. BGA Pin Map

AB3000(Analog BB)

Index mark

LGE Internal Use Only

- 188 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

RF3000 (GSM Transceiver)

: NC Pin

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 189 -

LGE Internal Use Only

8. BGA Pin Map

RF3100 (WCDMA Transceiver)

: NC Pin

LGE Internal Use Only

- 190 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA Pin Map

STLC2500 (BT Chip)

Bottom View

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 191 -

LGE Internal Use Only

8. BGA Pin Map

K5D1G12ACD-D075 (Memory)

: NC Pin

LGE Internal Use Only

- 192 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

CN503 Main conn No VGA Camera No Speaker No Display No Vibration No Optical Mouse No Power On

CN502 Hall Effect IC No Slider off detection

LD501/502 Key Backlight LED No Key LED

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 193 -

LGE Internal Use Only

9. PCB LAYOUT

U602 Speaker/Receiver MUX No Sound (Speaker/Receiver) U601 Speaker Amp No Sound (Speaker) CN501 3M Camera Conn No 3M Camera U401 3M Cameras LDO No 3M Camera U600 PMIC No Power On No Service No Charging U301 BB chip(DB3150) No Power On No Display No Service U102 BT Buffer BT Connection U101 FEM WCDMA/GSM RX Sensitivity & Tx Power No Service U103 GSM Transceiver GSM RX Sensitivity & Tx Power No Service FL101/102/103 GSM Rx SAW Filter GSM RX Sensitivity No Service U204 WCDMA Transceiver WCDMA RX Sensitivity & Tx Power No Service FL202 WCDMA Tx SAW Filter WCDMA Tx Power No Service FL201 WCDMA Rx SAW Filter WCDMA RX Sensitivity No Service U201 WCDMA PAM WCDMA Tx Power No Service FL203 WCDMA Duplexer WCDMA RX Sensitivity & Tx Power No Service CN502 Sub PCB Conn No Micro-SD No BT connection U300 Memory No Booting

LGE Internal Use Only

- 194 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

FL101 Micro-SD Level Shifter No Micro-SD CN100 Sub PCB conn No Micro-SD No BT Connection

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 195 -

LGE Internal Use Only

9. PCB LAYOUT

BAT100 Backup Battery RTC Reset

FL100 BT Balun No BT Connection U101 BT Chip No BT Connection

LGE Internal Use Only

- 196 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 197 -

LGE Internal Use Only

9. PCB LAYOUT

CN100 LCD FPCB conn No VGA Camera No Speaker No Display No Vibration No Optical Mouse No Power On CN102 Optical Mouse conn No Optical Mouse

CN101 LCD Conn No Display U100 Optical Mouse Level Shifter No Optical Mouse

LGE Internal Use Only

- 198 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

CN101 Main conn No VGA Camera No Speaker No Display No Vibration No Optical Mouse No Power On

CN102 LCD FPCB conn No VGA Camera No Speaker No Display No Vibration No Optical Mouse No Power On

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 199 -

LGE Internal Use Only

9. PCB LAYOUT

CN100 VGA Camera conn No VGA Camera

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 200 -

LGE Internal Use Only

10. Calibration

10. Calibration
10.1 General Description
This document describes the installation and software usage for the calibration of LGs GSM/GPRS/EDGE/WCDMA Multimedia Mobile Phone. The calibration menu and its result is displayed in PC terminal by Mobile phone.

10.2 XCALMON Environment


10.2.1 H/W Environment
- PC with RS-232 Interface & GPIB card installed - GSM/GPRS/EDGE/WCDMA Multimedia Mobile Set - Agilent 8960 Series 10 E5515C Instrument (E1987A ver A.05.28) - Tektronix PS2521G Power Supply or Agilent A66311B - ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)

10.2.2 S/W Environment


- National Instrument GPIB & VISA (ver 2.60 full) driver install - Agilent 8960 VXI driver(E1960) install - Hot Kimchi EXE files - OS : Window98, Window2000, WindowXP

10.2.3 Configuration Diagram of Calibration Environment

KT520

Figure 10-1. Calibration Configuration Figure

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 201 -

LGE Internal Use Only

10. Calibration

10.3 Calibration Environment


Ensure that the following conditions are maintained throughout the duration of the tests and calibrations described within this document.

Parameter Temperature Relative Humidity Vbatt Supply current

Min 15 20 3.6 0

Typ 25 40 3.7

Max 30 75 3.8 3

Unit C % V A

Table 10-1. Nominal Environmental Test Conditions

LGE Internal Use Only

- 202 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. Calibration

10.4 Program Operation


10.4.1 Hot Kimchi Program Overview
When trying to calibrate the mobile phone, the service engineers make a configuration of calibration environment like Figure10-1. And if you finish making configuration, please execute the Hot Kimchi program. See Figure10-2. Hot Kimchi supports following functions. - Calibration of EGSM 900, DCS 1800, PCS1900, and WCDMA - Instrument (Agilent8960, Tektronix PS2521G) control - UART communication with mobile phone

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 203 -

LGE Internal Use Only

10. Calibration

10.4.2 Setting
Select a ezlooks

Select Off-line in the EZLOOKS MODE.

LGE Internal Use Only

- 204 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. Calibration

Select a Line System

Select Manual in the RUN MODE. Select your com port appropriately.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 205 -

LGE Internal Use Only

10. Calibration

Select a Logic Operation

Select Logic Mode you want. 1. CAL only 2. AUTO only 3. CAL + AUTO Select your com port appropriately. MONitor Port is to communicate with 2.5G mobile phone

LGE Internal Use Only

- 206 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. Calibration

10.4.3 Calibration Procedure


Select a model name - KT520. Click the START button.

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 207 -

LGE Internal Use Only

LGE Internal Use Only

- 208 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST


11.1 EXPLODED VIEW

45 33 34 35 36 43

46

30 19 20 21

31 32

18 7 8 11 9 10

29 44 22 26 27 38

41 24 25 28 40 37 39 76

42

23 14 12 13 52 53 29 15 16 17

77 78

79

67 65

68 69

70

73 71 72

49 50 48 47

51

83 74 75

57 84 56 58 80 66 61 59 55 54 60 62 63 64 81 82 85

86

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 209 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36

86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71

LGE Internal Use Only

- 210 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST


ASSY

18 17 15 14 12 7 8 10 11 16

4 1

18 17 16 13 15 14 13 3 5 9 12 11 10 9 8 7 6 5 4 3 2 1

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 211 -

LGE Internal Use Only

Copyright 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 212 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Mechanic component>


Level 1 3 2 3 4 4 4 4 4 4 4 4 4 4 4 3 4 4 4 5 5 5 5 6 5 5 5 5 5 MCJA00 APEY ACGM00 MCCF00 MCJN00 MIDZ00 MLAB00 MPBT00 MPBU00 MPBU01 MPFD00 MTAB00 MTAD00 MWAE00 ACGQ00 ABGF00 ABGG00 ACGK00 MBJL00 MCCC00 MCCG00 MCJK00 MICC00 MDAG00 MFBD00 MGAD00 MIDZ00 MIDZ01 Location No. Description IMT-2000(SLIDE) COVER,BATTERY PHONE COVER ASSY,REAR CAP,MOBILE SWITCH COVER,REAR INSULATOR LABEL,A/S PAD,CAMERA PAD,CONNECTOR PAD,CONNECTOR PLATE,GROUND TAPE,PROTECTION TAPE,WINDOW WINDOW,CAMERA COVER ASSY,SLIDE BUTTON ASSY,MAIN BUTTON ASSY,SUB COVER ASSY,FRONT BUTTON,SIDE CAP,EARPHONE JACK CAP,MULTIMEDIA CARD COVER,FRONT INSERT,FRONT(UPPER) DECO,FRONT FILTER,MIKE GASKET,SHIELD FORM INSULATOR INSULATOR Part Number TISL0003104 MCJA0055501 APEY0540649 ACGM0105301 MCCF0051401 MCJN0078501 MIDZ0154101 MLAB0001102 MPBT0052701 MPBU0028801 MPBU0020201 MPFD0004801 MTAB0210901 MTAD0079901 MWAE0031601 ACGQ0022801 ABGF0001601 ABGG0001401 ACGK0103501 MBJL0050901 MCCC0051201 MCCG0010601 MCJK0082101 MICC0010001 MDAG0033501 MFBD0028101 MGAD0170101 MIDZ0175401 MIDZ0175501 Spec

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Color Silver

Remark

MOLD, PC LUPOY SC-1004A, , , , ,

Black Silver Without Color

R, 86

Q 82 76 72 81 73 71 74 75 79 77 78

COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , C2000 USASV DIA 4.0 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , PRESS, STS, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, Tempered Glass, , , , ,

Black Black Without Color White Without Color Black Black Without Color Without Color Without Color Black Black Silver Black Without Color

M, 61 B, 23 L 60 51 53 48

COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , D2.2 L2.0 KURL 45 MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Black Black Black Black Gold Silver Without Color Without Color Without Color Without Color

54

52 59 57

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 213 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 5 5 5 5 5 4 5 5 5 5 5 5 5 5 5 5 5 5 5 4 5 5 6 6 5 5 5 5 5 5 5 5 5

Location No. MIDZ03 MSGB00 MSIY00 MTAA00 MTAK00 ACGR00 MCJV00 MGDA00 MGDA01 MGDB00 MGDB01 MGDC00 MMAA00 MPBJ00 MPBN00 MPBT00 MPBU00 MPBU02 MTAG00 ACGS00 MBFF00 MCJW00 MICA00 MICZ00 MDAP00 MFBC00 MPBG00 MPBN00 MPBT00 MTAA00 MTAB00 MTAB01 MTAD00

Description INSULATOR STOPPER,HINGE SHAFT TAPE,DECO TAPE,CAMERA COVER ASSY,SLIDE(LOWER) COVER,SLIDE(LOWER) GUIDE,LEFT GUIDE,LEFT GUIDE,RIGHT GUIDE,RIGHT GUIDE,BUTTON MAGNET,SWITCH PAD,MOTOR PAD,SPEAKER PAD,CAMERA PAD,CONNECTOR PAD,CONNECTOR TAPE,BUTTON COVER ASSY,SLIDE(UPPER) BRACKET,LCD COVER,SLIDE(UPPER) INSERT,FRONT INSERT DECO,SLIDE(UPPER) FILTER,SPEAKER PAD,LCD PAD,SPEAKER PAD,CAMERA TAPE,DECO TAPE,PROTECTION TAPE,PROTECTION TAPE,WINDOW

Part Number MIDZ0177501 MSGB0024901 MSIY0001101 MTAA0155101 MTAK0006901 ACGR0014201 MCJV0014401 MGDA0012001 MGDA0012301 MGDB0007101 MGDB0007401 MGDC0000701 MMAA0000901 MPBJ0050401 MPBN0051001 MPBT0052601 MPBU0017301 MPBU0017501 MTAG0008001 ACGS0016301 MBFF0018401 MCJW0018601 MICA0019901 MICZ0014901 MDAP0001501 MFBC0036601 MPBG0071301 MPBN0050901 MPBT0052501 MTAA0152701 MTAB0210501 MTAB0238201 MTAD0079801

Spec COMPLEX, (empty), , , , , MOLD, Urethane Rubber S190A, , , , , CUTTING, STS, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Color Without Color Black Silver Without Color Without Color Without Color

Remark 56 47 49 55 50 J 33 36 42 35 41 37 34 30 31 32 39 40 38 A 6 5

MOLD, PC LUPOY SC-2302, , , , , MOLD, POM LUCEL N109-LD, , , , , MOLD, POM LUCEL N109-LD, , , , , MOLD, POM LUCEL N109-LD, , , , , MOLD, POM LUCEL N109-LD, , , , , MOLD, Urethane Rubber S185A, , , , , G7000 12x2x0.7t COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Silver Silver Silver Black Silver Without Color Metal Silver Without Color Without Color Without Color Without Color Without Color Black Without Color

CASTING, Al Alloy, , , , , MOLD, PC LUPOY SC-1004A, , , , , M1.4 D2.2 L1.5

Black Silver Gold Without Color

MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Black Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color

12 10 14 8 9 13 1 2 4

LGE Internal Use Only

- 214 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 5 5 5 4 4 4 4 4 4 4 4 4 4 4 6 6 6 3 3 5 5 5 5 6 5 5

Location No. MTAF00 MTAJ00 MWAC00 ARDY00 GMEY00 GMZZ00 MCCH00 MCCH01 MIDZ00 MIDZ01 MLAZ00 MTAC00 MTAC01 MTAC02 MPBF00 ADCA00 MTAC00 GMEY00 MLAK00 ACKA00 ADCA00 MLAZ00 MFEA00 MTAZ00 MGAD00 MPBZ00

Description TAPE,MOTOR TAPE,FLEXIBLE PCB WINDOW,LCD RAIL ASSY,SLIDE SCREW MACHINE,BIND SCREW MACHINE CAP,SCREW CAP,SCREW INSULATOR INSULATOR LABEL TAPE,SHIELD TAPE,SHIELD TAPE,SHIELD PAD,FLEXIBLE PCB DOME ASSY,METAL TAPE,SHIELD SCREW MACHINE,BIND LABEL,MODEL CAN ASSY,SHIELD DOME ASSY,METAL LABEL FRAME,SHIELD TAPE GASKET,SHIELD FORM PAD

Part Number MTAF0015901 MTAJ0004401 MWAC0091601 ARDY0002509 GMEY0010601 GMZZ0024001 MCCH0121401 MCCH0121501 MIDZ0162501 MIDZ0170901 MLAZ0038303 MTAC0072901 MTAC0072801 MTAC0071101 MPBF0034601 ADCA0075001 MTAC0070401 GMEY0011201 MLAK0018622 ACKA0004601 ADCA0075101 MLAZ0038301 MFEA0019301 MTAZ0215101 MGAD0159401 MPBZ0212801

Spec COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, PMMA HI835M, , , , ,

Color Without Color Without Color Black Silver

Remark 7 11 3 K, 43 44 29 46 45 28 62

1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK 1.4 mm,1.5 mm,SWCH18A ,N ,+ ,- , ,; ,CH ,+ ,3.5 ,0.3 ,NYLON ,BLACK ,[empty] ,[empty] COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , PRINTING, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , SUB COMPLEX, (empty), , , , , 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK PRINTING, (empty), , , , , SUS 0.3T MAIN PID Label 4 Array MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Black Black Silver Silver Without Color Blue White Gold Gold Gold Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color

17 15 22

24 26 83 84 66 63

67 68 70

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 215 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Main component>


Level 4 6 4 5 5 6 Location No. SNGF00 BFAA00 SACY00 SACB SACE00 SACC00 Description ANTENNA,GSM,FIXED FILM,INMOLD PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,INSERT Part Number SNGF0032603 BFAA0080301 SACY0067802 SACB0047401 Spec

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Color

Remark 80

3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+WCDMA BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 ; ,BLACK , , , Without Color

I, 18

PCB ASSY,FLEXIBLE,SMT SACE0062301 PCB ASSY,FLEXIBLE,SMT SACC0040401 BOTTOM CONNECTOR,BOARD TO BOARD

CN100

ENBY0019501

20 PIN,.4 mm,ETC , ,H=1.5, Socket

SACD00

PCB ASSY,FLEXIBLE,SMT SACD0051901 TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD PCB,FLEXIBLE PCB ASSY,KEYPAD PCB ASSY,KEYPAD,INSERT PCB ASSY,KEYPAD,SMT PCB ASSY,KEYPAD,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD

CN101

ENBY0022901

70 PIN,0.4 mm,ETC , ,H=0.9, Plug

7 6 4 5 5 6 7 7 7 7 7 7 7 7 7

CN102 SPCY00 SAEY00 SAEB00 SAEE00 SAEC00 C100 C101 C102 C103 C104 C105 C106 C107 CN100

ENBY0020201 SPCY0123701 SAEY0060401 SAEB0024701 SAEE0027601 SAEC0026101 ECCH0004904 ECZH0000816 ECCH0004904 ECCH0000155 ECCH0004904 ECCH0004904 ECCH0005604 ECCH0000182 ENBY0020301

40 PIN,0.4 mm,ETC , ,H=0.9, Header POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , , C, 25

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 40 PIN,0.4 mm,ETC , ,H=0.9, Socket

LGE Internal Use Only

- 216 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 6 7 7 7 7 7 7 7 7 7 7

Location No. CN101 CN102 IC1 Q100 R100 R102 R103 R104 R105 R109 R118 R120 R129 R130 R131 R134 U100 ZD100 ZD101 ZD102 ZD103 ZD104 SAED00 LD100 LD101 LD102 LD103 LD104 LD105 LD106 LD107 R121 R122

Description CONNECTOR,FFC/FPC CONNECTOR,BOARD TO BOARD IC TR,BJT,NPN RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER DIODE,TVS IC DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS PCB ASSY,KEYPAD,SMT TOP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ENQY0013901 ENBY0018601 EUSY0342404 EQBN0013701 ERHZ0000203 ERHZ0000406 ERHZ0000406 ERHY0000187 ERHZ0000237 ERHZ0000405 ERHZ0000406 ERHZ0000443 ERHZ0000451 ERHZ0000406 ERHZ0000451 EDTY0009101 EUSY0295501 EDTY0009101 EDTY0009101 EDTY0009101 EDTY0009101 EDTY0009101 SAED0025701 EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901 EDLH0011901 ERHZ0000490 ERHZ0000490

Spec 35 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FPC ,STRAIGHT ,BOTH ,SMD ,R/TP ,[empty] , 10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET FLIP CHIP ,20 PIN,R/TP ,Level shifter ,; ,IC,Bus Controller EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS 10 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 6.8 Kohm,1/16W ,F ,1005 ,R/TP 20 Kohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 27 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 27 ohm,1/16W ,J ,1005 ,R/TP SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 TQFN , PIN,R/TP ,6 BLU+2 LDO+1 Flash LED Drv, 4*4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4

Color

Remark

WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) WHITE ,1608 ,R/TP ,PB-FREE(ZENER) 51 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 217 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 7 7 7 7 7 7 6 4 4 4 4 4 5 5 4 3 4 5 6 7 7 8 7 4 5 6 6 6

Location No. R123 R124 R125 R126 R127 R128 SPEY00 SMJY00 SMZY00 SUSY00 SVCY00 SVCY01 MTAC00 SVCY00 SVLM00 SAFY00 SAFB SAKY00 SAKF00 SAKC00 SAKD00 SW1 SPKY00 SAFF00 SAFC00 C101 C102 C103

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB,KEYPAD VIBRATOR,MOTOR MODULE,ETC SPEAKER CAMERA CAMERA ASSY TAPE,SHIELD CAMERA LCD MODULE PCB ASSY,MAIN PCB ASSY,MAIN,INSERT PCB ASSY,SIDEKEY PCB ASSY,SIDEKEY,SMT PCB ASSY,SIDEKEY,SMT BOTTOM PCB ASSY,SIDEKEY,SMT TOP SWITCH,TACT PCB,SIDEKEY PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ERHZ0000420 ERHZ0000420 ERHZ0000420 ERHZ0000420 ERHZ0000490 ERHZ0000490 SPEY0053601 SJMY0008406 SMZY0018201 SUSY0027502 SVCY0013401 ACMY0006601 MTAC0069001 SVCY0016301 SVLM0028101 SAFY0266501 SAFB0081901 SAKY0007201 SAKF0000601 SAKC0000401 SAKD0000601 ESCY0005301 SPKY0055101 SAFF0181101 SAFC0105201 ECCH0000115 ECCH0000155 ECCH0005604

Spec 150 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , , 3 V,80 mA,10*2.7 ,17mm ,; ,3V , , ,12000 , , , ,31 Optical Mouse module ,; ,Module Assembly ASSY ,8 ohm,90 dB,1812 mm,15mm ,; , , , , , , ,WIRE CMOS ,VGA ,Magna 1/7.4"

Color

Remark

F, 19 E, 27 G, 20 H, 21 White O, 65

COMPLEX, (empty), , , , , CMOS ,MEGA ,3M AF [Samsung LSI, 1/4" SOC, FPCB] MAIN ,240*320 ,57(74.4)*40*1.5 ,262k ,TFT ,TM ,TBJT6K98 ,2.2Inch Single _CR_2000

Without Color

D, 16 64

1 V,1 A,HORIZONTAL ,1 G, ,; ,10C2P ,[empty] ,[empty] ,[empty] , ,[empty] POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,

22 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 22 pF,50V,J,NP0,TC,1005,R/TP

6 6 6

C104 C105 C107

CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP PCB ASSY,MAIN,PAD SHORT

ECCH0005604 ECCH0000115 SAFP0000501

LGE Internal Use Only

- 218 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6

Location No. C109

Description PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP RES,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number SAFP0000501

Spec

Color

Remark

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

C110 C112 C113 C114 C115 C116 C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C134 C135 C136 C137 C138 C139 C140 C201 C202 C203 C204 C205

SAFP0000501 ECCH0000115 ECCH0000115 ECCH0000115 ELCH0004720 ECZH0000802 ECCH0000182 ECCH0007802 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECZH0000816 ECCH0000185 ECCH0000185 ECZH0000816 ECCH0000185 ECCH0000185 ECCH0000180 ECCH0000175 ECCH0000117 ECCH0000155 ERHZ0000414 ECCH0000117 ECCH0000155 ECCH0005604 ECCH0000155 ECCH0000143 ECCH0000110 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1.2 nH,S ,1005 ,R/TP , 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 120 Kohm,1/16W ,J ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 219 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C206 C207 C208 C212 C213 C215 C216 C217 C219 C220 C225 C227 C230 C300 C301 C302 C303 C304 C305 C306 C307 C308 C309 C310 C311 C312 C313 C314 C315 C316 C317 C318 C319 C320

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000143 ECCH0000115 ECZH0000841 ECZH0000802 ECCH0006201 ECCH0000182 ECCH0000110 ECZH0000841 ECZH0000841 ECCH0000161 ECCH0000185 ECCH0000115 ECCH0000185 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182

Spec 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

- 220 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C321 C322 C323 C324 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334 C335 C402 C403 C404 C405 C406 C407 C408 C409 C410

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP

Part Number ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000161 ECCH0000161 ECCH0000143 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000155 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0007802 ECTH0005705

Spec 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

Color

Remark

6 6 6 6 6 6 6 6 6

C411 C412 C413 C414 C415 C416 C417 C418 C419

CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECTH0005705 ECCH0006201 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0006201 ECCH0000198 ECCH0000182 ECCH0000198

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 221 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C424 C425 C504 C505 C506 C507 C508 C509 C510 C552 C600 C601 C602 C603 C604 C605 C606 C607 C608 C609 C610 C611 C612 C613 C614 C615 C616

Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECZH0001215 ECCH0000155 ECCH0004904 ECCH0000182 ECCH0004904 ECCH0000182 ECCH0000182 ECCH0000155 ECCH0004904 ECCH0000115 ECCH0006201 ECCH0004904 ECCH0004904 ECCH0005602 ECCH0006201 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECZH0000901 ECZH0000901 ECCH0005604 ECCH0000182 ECCH0005604

Spec 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color

Remark

6 6 6 6 6

C617 C618 C621 C622 C624

CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

ECTH0005704 ECCH0000182 ECCH0000122 ECCH0004904 ECCH0000182

LGE Internal Use Only

- 222 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C625 C630 C631 C632 C633 C634 C639 C640 C642 C645 C646 C647 CN402 CN501

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CONNECTOR,I/O CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,ETC DIODE,SWITCHING

Part Number ECCH0000182 ECCH0000198 ECCH0002002 ECCH0000182 ECZH0003103 ECZH0003103 ECCH0000163 ECCH0000163 ECCH0000182 ECCH0004904 ECCH0000155 ECZH0001216 ENRY0006401 ENBY0015601

Spec 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT

Color

Remark

6 6 6

CN502 CN600 D401

ENBY0029501 ENZY0020401 EDSY0017601

40 PIN,0.4 mm,ETC , ,H=3.0, Socket 3 PIN,2.5 mm,BOTTOM , , USF ,30 V,1 A,R/TP , ,; , , ,22A , , ,667mW ,[empty] ,[empty] ,[empty] ,1 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SMT ,20 V,200 A,R/TP , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 60 ohm,1005 , 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , ,SMD ,R/TP 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , ,SMD ,R/TP 120 ohm,1608 ,CHIP BEAD, 2000mA 120 ohm,1608 ,CHIP BEAD, 2000mA 120 ohm,1608 ,CHIP BEAD, 2000mA 120 ohm,1608 ,CHIP BEAD, 2000mA 1842.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 1960 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150 942.5 MHz,1.4*1.1*0.6 ,SMD ,5pin, Unbal-Bal, 50//150

6 6 6 6 6

D600 D601 D602 FB101 FB401

DIODE,SWITCHING DIODE,SWITCHING DIODE,SWITCHING FILTER,BEAD,CHIP FILTER,BEAD,CHIP

EDSY0011901 EDSY0014001 EDSY0011901 SFBH0000909 SFBH0008103

6 6 6 6 6 6 6 6

FB402 FB403 FB501 FB502 FB600 FL101 FL102 FL103

FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,SAW FILTER,SAW FILTER,SAW

SFBH0008103 SFBH0002302 SFBH0002302 SFBH0002302 SFBH0002302 SFSY0024302 SFSY0024303 SFSY0024301

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 223 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6

Location No. FL201

Description FILTER,SAW

Part Number SFSY0029201

Spec 2140 MHz,1.35*1.05*0.6 ,SMD ,Pbfree_WCDMA_Rx_200ohm 1950 MHz,1.4*1.1*0.6 ,SMD ,1920M~1980M, IL 2.9, 5pin, U-U, 50-50, W-BAND I Tx , ,1950 ,1.4*1.1*0.6 ,SMD ,R/TP 1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45 dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45 ,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP SMD ,2ch Audio EMI/ESD Filter (64ohm, 50pF) SMD ,2ch Audio EMI/ESD Filter (8.4ohm, 60pF) 1950 MHz,3.2x2.5x1.2 ,SMD ,IL 0.5dB, Isolation 14.5dB 6 PIN,ETC , ,2.54 mm,H=1.5 6.8 nH,J ,1005 ,R/TP , 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 18 nH,J ,1005 ,R/TP ,PBFREE 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 2.7 nH,S ,1005 ,R/TP ,PBFREE 15 pF,50V,J,NP0,TC,1005,R/TP 3.3 uH,M ,2.5*2.0*1.0 ,R/TP ,Chip power 3.9 nH,S ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE

Color

Remark

FL202

FILTER,SAW

SFSY0028101

FL203

DUPLEXER,IMT

SDMY0001202

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

FL401 FL402 IS201 J1 L101 L102 L103 L104 L105 L106 L107 L108 L201 L202 L203 L204 L205 L401 L600 MIC600

FILTER,EMI/POWER FILTER,EMI/POWER ISOLATOR,GSM CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP PCB ASSY,MAIN,PAD SHORT INDUCTOR,SMD,POWER MICROPHONE

SFEY0013901 SFEY0014001 SQGY0000101 ENSY0018101 ELCH0004713 ELCH0003824 ELCH0003824 ELCH0001036 ELCH0001032 ELCH0003824 ELCH0001036 ELCH0001039 ECCH0000112 ELCP0008003 ELCH0001057 ELCH0001036 ELCH0001035 SAFP0000501 ELCP0005903 SUMY0010604

UNIT ,-38 dB,4.72*3.76 ,1.25T Bottom Silicon type ,; , , ,UNI ,1.5V , ,SMD 19.3 dB,0.3 dB,25 dB,1.6*0.8*0.6 ,SMD ,1920M ~ 1980M, 6pin 2-2H1A ,.1 W,R/TP ,VEBO=6V, Pb free SC70-6 ,6.5 W,-20 V,-4.5 A,R/TP ,P channel FET ,; ,PCHANNEL ,MOSFET ,-20 ,8 ,-4.5 ,0.153 ,6.5 ,SC70 ,R/TP ,6P 33 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 36 ohm,1/16W ,J ,1005 ,R/TP

6 6

N201 Q300

COUPLER,RF DIRECTIONAL TR,BJT,NPN

SCDY0003501 EQBN0013301

Q600

TR,FET,P-CHANNEL

EQFP0009101

6 6 6

R101 R102 R103

RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

ERHZ0000463 ERHZ0000406 ERHZ0000469

LGE Internal Use Only

- 224 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R130 R201 R202 R203 R204 R205 R206 R207 R208 R209 R300 R301 R304 R305 R306 R307 R308 R312 R313 R314 R315 R316 R406

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER THERMISTOR RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ERHZ0000420 ERHZ0000420 ERHZ0000522 ERHY0003501 ERHY0003501 ERHZ0000406 ERHZ0000485 ERHZ0000406 SETY0007101 ERHZ0000406 ERHZ0000490 ERHZ0000483 ERHZ0000404 ERHY0003501 ERHZ0000500 ERHZ0000500 ERHZ0000527 ERHZ0000527 ERHZ0000527 ERHZ0000527 SAFP0000501 SAFP0000501 ERHZ0000406 ERHZ0000414 ERHZ0000406 ERHZ0000405 ERHZ0000443 ERHZ0000465 ERHZ0000465 ERHZ0000465 ERHZ0000406 ERHZ0000465 ERHZ0000405

Spec 150 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP 24 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 4700 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP NTC ,4700 ohm,SMD ,1005 J B:3500K 100 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 220 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 62 ohm,1/16W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP

Color

Remark

100 Kohm,1/16W ,J ,1005 ,R/TP 120 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 225 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6

Location No. R410 R411 R412 R413 R414 R415 R416 R417 R419 R551 R602

Description PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP PCB ASSY,MAIN,PAD SHORT

Part Number SAFP0000501 ERHZ0000486 ERHY0003601 ERHZ0000285 ERHZ0000285 ERHZ0000493 ERHZ0000445 ERHZ0000404 ERHZ0000212 ERHZ0000483 SAFP0000501

Spec

Color

Remark

47 Kohm,1/16W ,J ,1005 ,R/TP 2700 ohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/16W ,F ,1005 ,R/TP 470 ohm,1/16W ,F ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 220 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 12 Kohm,1/16W ,F ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP

6 6 6 6 6

R603 R605 R606 R608 R610

SAFP0000501 ERHZ0000485 ERHZ0000265 ERHY0017201 SAFP0000501 4700 ohm,1/16W ,J ,1005 ,R/TP 300 Kohm,1/16W ,F ,1005 ,R/TP 0.025 ohm,1/4W ,F ,2012 ,R/TP

R611

RES,CHIP,MAKER

ERHZ0003901

0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012 ,R/TP

6 6 6 6 6 6 6 6 6 6 6 6 6

R612 R613 R614 R617 R618 R619 R620 R621 R623 R624 R625 R627 R630

PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT

SAFP0000501 ERHZ0000486 SAFP0000501 ERHZ0000279 ERHY0000181 ERHZ0000203 ERHZ0000203 ERHY0000181 ERHZ0000406 ERHZ0000406 ERHZ0000279 ERHZ0000493 SAFP0000501 39 Kohm,1/16W ,F ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,F ,1005 ,R/TP 15 ohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 39 Kohm,1/16W ,F ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 47 Kohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only

- 226 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6

Location No. R636

Description PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD OPEN RES,CHIP,MAKER CONN,RF SWITCH RF MODULE,HANDSET IC IC PAM IC IC IC

Part Number SAFP0000501

Spec

Color

Remark

R637

SAFP0000501

6 6 6 6 6 6 6 6 6 6 6 6

R639 R640 R642 R643 SW101 U101 U102 U103 U201 U202 U203 U204

SAFP0000501 ERHZ0000404 SAFO0000501 ERHZ0000408 ENWY0002304 SMRH0003401 EUSY0245902 EUSY0296201 SMPY0013601 EUSY0222103 EUSY0299401 EUSY0327901 1 Kohm,1/16W ,J ,1005 ,R/TP 0OHM_1005_DNI 110 ohm,1/16W ,J ,1005 ,R/TP STRAIGHT ,SMD ,0.8 dB,MUSE MODEL MHz, MHz, ,Quad Edge WCDMA DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7 HVQFN40 ,40 PIN,R/TP ,RF3000 EDGE Transceiver, 6x 6x1.0, 40 HVQFN dBm,40 %,90 mA, dBc,29 dB,4x4x1 ,SMD ,HSDPA MicroSMD ,8 PIN,R/TP ,DCDC for PAM 650mA, ~3.4V ,6 PIN,R/TP ,0.3_2v HVQFN40 ,40 PIN,R/TP ,WCDMA Transceiver, 6 * 6 * 1.0, OM6195HN FBGA ,107 PIN,ETC ,FULLY 1.8V 1G(LB/128Mx8) NAND+512M(8Mx4x16) SDRAM ,; ,IC,MCP BGA ,344 PIN,R/TP ,3.6Mbps HSDPA Digital Baseband HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 2.8V TFBGA ,36 PIN,R/TP ,USB2.0 Transceiver, 3.5X3.5X0.8 DFN ,10 PIN,R/TP ,OVP BGA ,143 PIN,R/TP ,HSDPA Analog baseband ,; ,IC,Digital Baseband Processor BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,Audio Amplifier uMLP ,10 PIN,R/TP ,typ Rdson 0.4ohm, 1.4X1.8 ,; ,IC,Analog Switch 5 V,<0.5pF ,SMD , 5 V,<0.5pF ,SMD , 26 MHz,10 PPM,15 pF,40 ohm,SMD ,3.2*2.5*0.85 ,10ppm at -30'C ~ +85'C, C0 1.6pF, C1 5.7fF .032768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 , VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1

6 6 6 6 6 6

U300 U301 U401 U402 U403 U600

IC IC IC IC IC IC

EUSY0338202 EUSY0327501 EUSY0223002 EUSY0320201 EUSY0319201 EUSY0297502

U601

IC

EUSY0349001

6 6 6 6

U602 VA402 VA403 X101

IC VARISTOR VARISTOR X-TAL

EUSY0340301 SEVY0007301 SEVY0007301 EXXY0022801

X600

X-TAL

EXXY0004602

ZD401

DIODE,TVS

EDTY0009401

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 227 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 5 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. ZD402 SAFD00 C501 C502 C503 C513 C514 C515 C517 C518 C524 C525 C526 CN503 D501

Description DIODE,TVS

Part Number EDTY0009101

Spec SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4

Color

Remark

PCB ASSY,MAIN,SMT TOP SAFD0103801 CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD DIODE,SWITCHING ECCH0000115 ECCH0000115 ECCH0004904 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000182 ECCH0000182 ECCH0000182 ENBY0022801 EDSY0011901 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 70 PIN,0.4 mm,ETC , ,H=0.9, Socket EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) CSP ,20 PIN,R/TP ,ESD protection & Filtering for analog signals, Pb-free SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , , ,[empty] ,[empty] ,2P WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , , ,[empty] ,[empty] ,2P EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS

D603

DIODE,SWITCHING

EDSY0011901

6 6 6 6 6 6

FL403 FL500 FL501 FL502 FL504 LD501

IC FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER DIODE,LED,CHIP

EUSY0269001 SFEY0011601 SFEY0011601 SFEY0011701 SFEY0011701 EDLH0013401

6 6 6 6 6 6 6 6

LD502 Q401 R402 R404 R405 R407 R409 R501

DIODE,LED,CHIP TR,BJT,NPN PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT

EDLH0013401 EQBN0013701 SAFP0000501 ERHZ0000486 ERHZ0000499 SAFP0000501 ERHZ0000478 SAFP0000501

47 Kohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP

3.3 ohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only

- 228 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6

Location No. R503 R505 R506 R508 R509 R517 R518 R631

Description PCB ASSY,MAIN,PAD SHORT RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT PCB,MAIN IC VARISTOR DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS PCB ASSY,SUB PCB ASSY,SUB,INSERT PCB ASSY,SUB,SMT PCB ASSY,SUB,SMT BOTTOM

Part Number SAFP0000501 ERHZ0000483 ERHZ0000483 ERHZ0000483 ERHZ0000483 ERHZ0000420 ERHZ0000420 SAFP0000501

Spec

Color

Remark

47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W ,J ,1005 ,R/TP

6 6 6 6 6 6 6 6 6 6 3 4 4 5

R632 SPFY00 U502 VA500 ZD501 ZD502 ZD503 ZD504 ZD505 ZD506 SAJY00 SAJB00 SAJE00 SAJC00

SAFP0000501 SPFY0168301 EUSY0268101 SEVY0007301 EDTY0009101 EDTY0009101 EDTY0009101 EDTY0009101 EDTY0009101 EDTY0009101 SAJY0030101 SAJB0015501 SAJE0023701 SAJC0022601 FR-4 ,0.8 mm,STAGGERED-8 , ,; , , , , , , , , , SON2017-6 ,6 PIN,R/TP ,HALL SWITCH, Pb Free 5 V,<0.5pF ,SMD , SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 P, 69

ANT100

ANTENNA,GSM,FIXED

SNGF0027401

3.0 ,-2 dBd, ,BLUETOOTH, SMD, 8.0*2.0*1.3 ,; ,SINGLE ,-2.0 ,50 ,3.0 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 6 6 6 6 6 6 6

BAT100 C105 C106 C107 C108 C109 C110 C111

BATTERY,CELL,LITHIUM CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP

SBCL0001701 ECZH0000813 ECZH0001216 ECZH0001216 ECZH0001216 ECCH0000182 ECZH0001216 ECCH0000182

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 229 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6

Location No. C112 C113 FL100 R118

Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER FILTER,SAW PCB ASSY,MAIN,PAD SHORT PCB ASSY,MAIN,PAD SHORT

Part Number ECCH0000182 ECZH0001216 SFSY0027301 SAFP0000501

Spec 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW

Color

Remark

R124

SAFP0000501

6 5 6 6 6 6

U101 SAJD00 C100 C101 C102 CN100

IC PCB ASSY,SUB,SMT TOP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD

EUSY0357001 SAJD0025201 ECCH0000182 ECCH0000182 ECCH0000182 ENBY0043301

WFBGA48 ,48 PIN,R/TP ,Bluetooth V2.1 4.5x4.5x0.8 ,; ,IC,Bluetooth

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 40 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,[empty] , , BGA ,20 PIN,R/TP ,Levelshifter,sdcard,6ch ,; ,IC,Bus Controller 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 8 PIN,ETC , ,1.1 mm,T-Flash Memory Socket FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,

6 6 6 6 6 6 6 6 5

FL101 R100 R101 R102 R103 R104 R116 S100 SPJY00

IC RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER CONN,SOCKET PCB,SUB

EUSY0334202 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000487 ENSY0014101 SPJY0050101

LGE Internal Use Only

- 230 -

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location No. SBPP00

Description BATTERY PACK,LIPOLYMER

Part Number

Spec 3.7 V,800 mAh,1 CELL,PRISMATIC ,383450,INNERPACK,EU ,; ,3.7 ,800 ,160 ,PRISMATIC ,3.8X34X50 ,4.4X34.15X54 ,BLACK ,INNERPACK , ; ,[empty] ,[empty] ,[empty] ,18 ,BLACK ,6.2mm Plug Datacable ,[empty] ; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty] ,BLACK,EARPHONE HOUSING:SILVER ,18P MMI CONNECTOR ,LOW COST STEREO,18P(5P) , 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V (+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,

Color

Remark

SBPP0026202

85

SGDY00

DATA CABLE

SGDY0010904

SGEY00

EAR PHONE/EAR MIKE SET

SGEY0003213

SSAD00

ADAPTOR,AC-DC

SSAD0024501

ADAPTOR,AC-DC

SSAD0024502

ADAPTOR,AC-DC

SSAD0024503

ADAPTOR,AC-DC

SSAD0024504

Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 231 -

LGE Internal Use Only

Note

Note

Das könnte Ihnen auch gefallen