Beruflich Dokumente
Kultur Dokumente
Features
VDS (V) = 30V ID = 85A RDS(ON) < 7.0m (VGS = 10V) RDS(ON) < 10.5m (VGS = 4.5V)
Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol VDS Drain-Source Voltage VGS Gate-Source Voltage Continuous Drain Current B,G Pulsed Drain Current Avalanche Current C Repetitive avalanche energy L=0.1mH TC=25C Power Dissipation B Power Dissipation
A C
Units V V A A mJ W W C
TC=25C
TC=100C B
Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A A Maximum Junction-to-Ambient C Maximum Junction-to-Lead
Max 20 50 1.5
AOD412
Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS IGSS VGS(th) ID(ON) RDS(ON) gFS VSD IS Zero Gate Voltage Drain Current Gate-Body leakage current Gate Threshold Voltage On state drain current Static Drain-Source On-Resistance VGS=4.5V, ID=20A Forward Transconductance VDS=5V, ID=20A Diode Forward Voltage IS=1A,VGS=0V Maximum Body-Diode Continuous Current Conditions ID=250A, VGS=0V VDS=24V, VGS=0V TJ=55C VDS=0V, VGS= 20V VDS=VGS ID=250A VGS=10V, VDS=5V VGS=10V, ID=20A TJ=125C 1.5 85 5.5 8.8 8.25 60 0.72 7 11 10.5 1 85 1320 VGS=0V, VDS=15V, f=1MHz VGS=0V, VDS=0V, f=1MHz 533 154 0.95 26 VGS=4.5V, VDS=15V, ID=20A 13.3 3.2 6.6 7.2 12.5 22 6 29.7 22.3 2.15 Min 30 1 5 100 2.5 Typ Max Units V A nA V A m m S V A pF pF pF nC nC nC nC ns ns ns ns ns nC
DYNAMIC PARAMETERS Ciss Input Capacitance Coss Output Capacitance Crss Rg Reverse Transfer Capacitance Gate resistance
SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qg(4.5V) Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge tD(on) tr tD(off) tf trr Qrr Turn-On DelayTime Turn-On Rise Time Turn-Off DelayTime Turn-Off Fall Time
IF=20A, dI/dt=100A/s Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=20A, dI/dt=100A/s
2
A: The value of R JA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA =25C. The Power dissipation PDSM is based on steady-state R JA and the maximum allowed junction temperature of 150C. The value in any a given application depends on the user's specific board design, and the maximum temperature fo 175C may be used if the PCB or heatsink allows it. B. The power dissipation P D is based on TJ(MAX)=175C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. C: Repetitive rating, pulse width limited by junction temperature T J(MAX)=175C. D. The R JA is the sum of the thermal impedence from junction to case R JC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. F. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25C. The SOA curve provides a single pulse rating. G. The maximum current rating is limited by the package current capability.
AOD412
12 125C 8
AOD412
Ciss
1000 RDS(ON) limited 1ms 10ms 0.1s 1s 1 TJ(Max)=150C TA=25C 10s DC 10s 100s Power (W)
100 80 60 40 20 0 0.01
100 ID (Amps)
TJ(Max)=150C TA=25C
10
0.1 0.1 1 VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) 10 100
0.1
10
100
1000
Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.1 PD 0.01 Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 Ton T 100 1000
10
Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
AOD412
tA =
L ID BV VDD
100 80 Current rating ID(A) 60 40 20 0 0 25 50 75 100 125 150 175 TCASE (C) Figure 14: Current De-rating (Note B)
DIMENSIONS IN INCHES MIN. 0.088 0.000 0.035 0.027 0.035 0.205 0.018 0.019 0.235 0.170 0.255 0.170 NOM. 0.090 --------0.030 --------0.020 ----0.240 ----0.260 ----0.090 BSC. 0.180 BSC. MAX. 0.094 0.004 0.045 0.035 0.045 0.215 0.022 0.023 0.245 0.210 0.265 -----
NOM. 2.286 --------0.762 ----4.45 0.508 ----6.096 ----6.604 ----2.286 BSC. 4.572 BSC.
MAX. 2.388 0.102 1.143 0.889 1.143 5.461 0.559 0.584 6.223 5.334 6.731 -----
2.235 0.000 0.889 0.686 0.889 5.207 0.457 0.483 5.969 4.318 6.477 4.318
b2 c c1 D D1 E E1 e e1 H L L1 L2
-----------------
-----------------
DETAIL 'D'
NOTE 1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS 2. DIMENSION L IS MEASURED IN GAGE PLANE 3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED 4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 5. FOLLOWED FROM JEDEC TO-252 (AA)
NOTE:
D412 FAYWLC
1 2 3
D412 F A Y W LC
- AOS LOGO - PART NUMBER CODE. - FAB LOCATION - ASSEMBLY LOCATION - YEAR CODE - WEEK CODE. - ASSEMBLY LOT CODE
CODE D412
UNIT: mm
Rev. A