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2.

MICROSTRIP PATCH ANTENNA

2.1 Structure of patch antenna

In its most basic form, a Microstrip patch antenna consists of a radiating patch on one
side of a dielectric substrate which has a ground plane on the other side as shown in Figure 2.1.
The patch is generally made of conducting material such as copper or gold and can take any
possible shape. The radiating patch and the feed lines are usually photo etched on the dielectric
substrate.

Patch

Dielectric Substrate

Ground Plane

Figure 2.1 Structure of a Microstrip Patch Antenna

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In order to simplify analysis and performance prediction, the patch is generally square,
rectangular, circular, triangular, elliptical or some other common shape as shown in Figure 2.2.
For a rectangular patch, the length L of the patch is usually 0.3333λ < L < 0.5λ , where λ is
o o o
the free-space wavelength. The patch is selected to be very thin such that t < λ (where t is the
o
patch thickness). The height h of the dielectric substrate is usually 0.003 λ < h < 0.05λ . The
o o
dielectric constant of the substrate ( € ) is typically in the range 2.2 ≤€ ≤ 12 .
r r

Square Rectangular Dipole Circular

Triangular Circular Ring Elliptical


Figure 2.2 Common shapes of microstrip patch elements

Microstrip patch antennas radiate primarily because of the fringing fields between the
patch edge and the ground plane. For good antenna performance, a thick dielectric substrate
having a low dielectric constant is desirable since this provides better efficiency, larger
bandwidth and better radiation [5]. However, such a configuration leads to a larger antenna size.
In order to design a compact Microstrip patch antenna, higher dielectric constants must be used
which are less efficient and result in narrower bandwidth. Hence a compromise must be reached
between antenna dimensions and antenna performance.

2.2 Advantages and Disadvantages

Microstrip patch antennas are increasing in popularity for use in wireless applications due
to their low-profile structure. Therefore they are extremely compatible for embedded antennas in
handheld wireless devices such as cellular phones, pagers Etc... The telemetry and

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communication antennas on missiles need to be thin and conformal and are often Microstrip
patch antennas. Another area where they have been used successfully is in Satellite
communication. Some of their principal advantages discussed by [5] and Kumar and Ray [9] are
given below:
∗ Light weight and low volume.
∗ Low profile planar configuration which can be easily made conformal to host surface.
∗ Low fabrication cost, hence can be manufactured in large quantities.
∗ Supports both, linear as well as circular polarization.
∗ Can be easily integrated with microwave integrated circuits (MICs).
∗ Capable of dual and triple frequency operations.
∗ Mechanically robust when mounted on rigid surfaces.
Microstrip patch antennas suffer from a number of disadvantages as compared to
Conventional antennas. Some of their major disadvantages discussed by [9] and Garg et al [10]
are given below:
∗ Narrow bandwidth
∗ Low efficiency
∗ Low Gain
∗ Extraneous radiation from feeds and junctions
∗ Poor end fire radiator except tapered slot antennas
∗ Low power handling capacity.
∗ Surface wave excitation
Microstrip patch antennas have a very high antenna quality factor (Q). Q represents the
losses associated with the antenna and a large Q leads to narrow bandwidth and low efficiency.
Q can be reduced by increasing the thickness of the dielectric substrate. Bu t as the thickness
increases, an increasing fraction of the total power delivered by the source goes into a surface
wave. This surface wave contribution can be counted as an unwanted power loss since it is
ultimately scattered at the dielectric bends and causes degradation of the antenna characteristics.
However, surface waves can be minimized by use of photonic band gap structures as discussed
by Qian et al [11]. Other problems such as lower gain and lower power handling capacity can be
overcome by using an array configuration for the elements

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3. FEED TECHNIQUES

Microstrip patch antennas can be fed by a variety of methods. These methods can bee
classified into two categories- contacting and non-contacting. In the contacting method, the RF
power is fed directly to the radiating patch using a connecting element such as a micro strip line.
In the non-contacting scheme, electromagnetic field coupling is done to transfer power between
the micro strip line and the radiating patch [5]. The four most popular feed techniques used are
the microstrip line, coaxial probe (both contacting schemes), aperture coupling and proximity
Coupling (both non-contacting schemes).

3.1 Microstrip Line Feed

In this type of feed technique, a conducting strip is connected directly to the edge of the
microstrip patch as shown in Figure 3.1. The conducting strip is smaller in width as compared to
the patch and this kind of feed arrangement has the advantage that the feed can be etched on the
same substrate to provide a planar structure.

Microstrip Feed
Patch

Substrate

Ground Plane
Figure 3.1 Microstrip Line Feed

The purpose of the inset cut in the patch is to match the impedance of the feed line to the
patch without the need for any additional matching element. This is achieved by properly
controlling the inset position. Hence this is an easy feeding scheme, since it provides ease of

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fabrication and simplicity in modelling as well as impedance matching. However as the thickness
of the dielectric substrate being used, increases, surface waves and spurious feed radiation also
increases, which hampers the bandwidth of the antenna [5]. The feed radiation also leads to
undesired cross polarized radiation.

3.2 Coaxial Feed

The Coaxial feed or probe feed is a very common technique used for feeding Microstrip
patch antennas. As seen from Figure 3.2, the inner conductor of the coaxial connector extends
through the dielectric and is soldered to the radiating patch, while the outer conductor is
connected to the ground plane.

Patch

Substrate

Coaxial Ground Plane


Connector
Figure 3.2 Probe fed Rectangular Microstrip Patch Antenna

The main advantage of this type of feeding scheme is that the feed can be placed at any
desired location inside the patch in order to match with its input impedance. This feed method is
easy to fabricate and has low spurious radiation. However, its major disadvantage is that it

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provides narrow bandwidth and is difficult to model since a hole has to be drilled in the substrate
and the connector protrudes outside the ground plane, thus not making it completely planar for
thick substrates( h< 0 .02λ ). Also, for thicker substrates, the increased probe length makes the
o
input impedance more inductive, leading to matching problems [9]. It is seen above that for a
thick dielectric substrate, which provides broad bandwidth, the microstrip line feed and the
coaxial feed suffer from numerous disadvantages. The non-contacting feed techniques which
have been discussed below, solve these problems.

3.3 Aperture Coupled Feed

In this type of feed technique, the radiating patch and the microstrip feed line are
separated by the ground plane as shown in Figure 3.3. Coupling between the patch and the feed
line is made through a slot or an aperture in the ground plane.

P a t c h A p e r t u r e / S l o t
Microstrip Line

Substrate 1
Ground Plane
Substrate 2

Figure 3.3 Aperture-coupled feed

The coupling aperture is usually centred under the patch, leading to lower cross-
polarization due to symmetry of the configuration. The amount of coupling from the feed line to
the patch is determined by the shape, size and location of the aperture. Since the ground plane
separates the patch and the feed line, spurious radiation is minimized. Generally, a high dielectric

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material is used for the bottom substrate and a thick, low dielectric constant material is used for
the top substrate to optimize radiation from the patch [5]. The major disadvantage of this feed
technique is that it is difficult to fabricate due to multiple layers, which also increases the
antenna thickness. This feeding scheme also provides narrow bandwidth.

3.4 Proximity Coupled Feed

This type of feed technique is also called as the electromagnetic coupling scheme. As
shown in Figure 3.4, two dielectric substrates are used such that the feed line is between the two
substrates and the radiating patch is on top of the upper substrate. The main advantage of this
feed technique is that it eliminates spurious feed radiation and provides very high bandwidth (as
high as 13%) [5], due to overall increase in the thickness of the microstrip patch antenna. This
scheme also provides choices between two different dielectric media, one for the patch and one
for the feed line to optimize the individual performances.

Patch

Microstrip Line

Substrate 1

Substrate 2

Figure 3.4 Proximity-coupled Feed

Matching can be achieved by controlling the length of the feed line and the width-to-line
ratio of the patch. The major disadvantage of this feed scheme is that it is difficult to fabricate

9
because of the two dielectric layers which need proper alignment. Also, there is an increase in
the overall thickness of the antenna.

Table3. 1 below summarizes the characteristics of the different feed techniques.

Table3. 1 Comparing the different feed techniques

Aperture Proximity
Characteristics Microstrip Line Coaxial Feed
Feed coupled Feed coupled Feed
Spurious feed More More Less Minimum
radiation
Reliability Better Poor due to Good Good
soldering
Ease of Easy Soldering Alignment
Alignment
fabrication And drilling
required required
Impedance
Easy Easy Easy Easy
Matching
Bandwidth
(achieved with
2-5% 2-5% 2-5% 13%
impedance
matching)

4. METHODS OF ANALYSIS
The most popular models for the analysis of Microstrip patch antennas are the

transmission line model, cavity model, and full wave model [5] (which include primarily integral
equations/Moment Method). The transmission line model is the simplest of all and it gives good
physical insight but it is less accurate. The cavity model is more accurate and gives good
physical insight but is complex in nature. The full wave models are extremely accurate, versatile
and can treat single elements, finite and infinite arrays, stacked elements, arbitrary shaped
elements and coupling. These give less insight as compared to the two models mentioned above
and are far more complex in nature

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4.1 Transmission Line Model

This model represents the microstrip antenna by two slots of width W and height h,
separated by a transmission line of length L. The microstrip is essentially a nonhomogeneous
line of two dielectrics, typically the substrate and air.

Strip conductor

Dielectric Substrate
h W
Ground Plane

Figure 4.1 Microstrip Line Figure 4.2 Electric Field Lines

Hence, as seen from Figure 4.2, most of the electric field lines reside in the substrate and
parts of some lines in air. As a result, this transmission line cannot support pure transverse-
electric-magnetic (TEM) mode of transmission, since the phase velocities would be different in
the air and the substrate. Instead, the dominant mode of propagation would be the quasi-TEM
mode. Hence, an effective dielectric constant ( € ) must be obtained in order to account for the
reff
fringing and the wave propagation in the line. The value of € is slightly less then € because
reff r
the fringing fields around the periphery of the patch are not confined in the dielectric substrate
but are also spread in the air as shown in Figure 3.8 above. The expression for € is given by
reff
Balanis [12] as:

€ + € - 1
€ = r 1 + r 1 +[1+ 12 h ] 2 (1)
reff 2 2 W

Where € = Effective dielectric constant


reff
€ = Dielectric constant of substrate
r
h = Height of dielectric substrate
W = Width of the patch

11
Consider Figure 3.3below, which shows a rectangular microstrip patch antenna of
length L , width W resting on a substrate of height h . The co-ordinate axis is selected such that
the length is along the x direction, width is along the y direction and the height is along the z
direction.

Microstrip Feed Patch

L
h Substrate

z
y
Ground Plane

x
Figure 4.3 Microstrip Patch Antenna

In order to operate in the fundamental TM Mode, the length of the patch must be
10
Slightly less than λ / 2 Where λ Is the wavelength in the dielectric medium and is equal to
λ / € Where λ is the free space wavelength. The TM Mode implies that the field varies
o reff o 10
one λ / 2 cycle along the length, and there is no variation along the width of the patch. In the
Figure 4.3 shown below, the microstrip patch antenna is represented by two slots, separated by
a transmission line of length L and open circuited at both the ends. Along the width of the patch,
the voltage is maximum and current is minimum due to the open ends. The fields at the edges
can be resolved into normal and tangential components with respect to the ground plane.

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Ground
Radiating Slots Plane

E
L V
E E
H H
Patch
E
L V
W
h

∆L Ground Plane

Patch
Figure 4.4 Top View of Antenna Figure 4.5 Side View of Antenna

It is seen from Figure 4.5 that the normal components of the electric field at the two
edges along the width are in opposite directions and thus out of phase since the patch isλ / 2
long and hence they cancel each other in the broadside direction. The tangential components
(seen in Figure 4.5), which are in phase, means that the resulting fields combine to give
maximum radiated field normal to the surface of the structure. Hence the edges along the width
can be represented as two radiating slots, which are λ / 2 apart and excited in phase and radiating
in the half space above the ground plane. The fringing fields along the width can be modelled as
radiating slots and electrically the patch of the microstrip antenna looks greater than its physical
dimensions. The dimensions of the patch along its length have now been extended on each end
by a distance ∆L , which is given empirically by Hammers tad [13] as:
(W
€ + 0.3 + 0.264)
reff h
L= 0.412h (2)
€ - 0.258( w + 0.8)
reff
h

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The effective length of the patch L now becomes:
eff
L= L + 2 ∆ L (3)
Eff
For a given resonance frequency f , the effective length is given by [9] as:
o
c
L = (4)
eff 2 f €
o reff
For a rectangular Microstrip patch antenna, the resonance frequency for any TM Mode is
mn
given by James and Hall [14] as:

c m 2 n 2
f=sqrt + (5)
2 € L W
reff
Where m and n are modes along L and W respectively.
For efficient radiation, the width W is given by Bahl and Bhartia [15] as:
c
W= (6)
€ +1
2f r
2

4.2 Cavity Model

Although the transmission line model discussed in the previous section is easy to use, it
has some inherent disadvantages. Specifically, it is useful for patches of rectangular design and it
ignores field variations along the radiating edges. These disadvantages can be overcome by using
the cavity model. A brief overview of this model is given below.
In this model, the interior region of the dielectric substrate is modelled as a cavity
bounded by electric walls on the top and bottom. The basis for this assumption is the following
observations for thin substrates [10].
∗ Since the substrate is thin, the fields in the interior region do not vary much in the z
direction, i.e. normal to the patch.
∗ The electric field is z directed only, and the magnetic field has only the transverse
components H and H in the region bounded by the patch metallization and the ground
x y
plane. This observation provides for the electric walls at the top and the bottom

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W

J
--- +++ t
- +
- --- + + ++
J
h b
++++++ ---------

Figure 4.6 Charge distribution and current density creation on the microstrip patch

Consider Figure 3.6 shown above. When the micro strip patch is provided power, a
charge distribution is seen on the upper and lower surfaces of the patch and at the bottom of the
ground plane. This charge distribution is controlled by two mechanisms-an attractive mechanism
and a repulsive mechanism as discussed by Richards [16]. The attractive mechanism is between
the opposite charges on the bottom side of the patch and the ground plane, which helps in
keeping the charge concentration intact at the bottom of the patch. The repulsive mechanism is
between the like charges on the bottom surface of the patch, which causes pushing of some
charges from the bottom, to the top of the patch. As a result of this charge movement, currents
flow at the top and bottom surface of the patch. The cavity model assumes that the height to
width ratio (i.e. height of substrate and width of the patch) is very small and as a result of this the
attractive mechanism dominates and causes most of the charge concentration and the current to
be below the patch surface. Much less current would flow on the top surface of the patch and as
the height to width ratio further decreases, the current on the top surface of the patch would be
almost equal to zero, which would not allow the creation of any tangential magnetic field
components to the patch edges. Hence, the four sidewalls could be modelled as perfectly
magnetic conducting surfaces. This implies that the magnetic fields and the electric field
distribution beneath the patch would not be disturbed. However, in practice, a finite width to
height ratio would be there and this would not make the tangential magnetic fields to be
completely zero, but they being very small, the side walls could be approximated to be perfectly
magnetic conducting [5].

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Since the walls of the cavity, as well as the material within it are lossless, the cavity
would not radiate and its input impedance would be purely reactive. Hence, in order to account
for radiation and a loss mechanism, one must introduce a radiation resistance R and a loss
r
resistance R . A lossy cavity would now represent an antenna and the loss is taken into account
L
by the effective loss tangent € which is given as:
eff
€ =1/ Q (7)
eff T
Q is the total antenna quality factor and has been expressed by [4] in the form:
T
1 = 1 1 1
+ + (8)
Q Q Q Q
T d c r
Q represents the quality factor of the dielectric and is given as :
d
λ rWT = 1
Q = (9)
d P tan ς
d
where λ is the angular resonant frequency.
r
W is the total energy stored in the patch at resonance.
T
P is the dielectric loss.
d
tan ς is the loss tangent of the dielectric.
Q represents the quality factor of the conductor and is given as :
c
λ WT = h
Q= r (10)
c P ς
c
Where P is the conductor loss.
c
ς is the skin depth of the conductor.
h is the height of the substrate.
Q represents the quality factor for radiation and is given as:
r
λ W
Q= r T (11)
r P
r
where P is the power radiated from the patch.
r

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5. POLARIZATION

This is the polarization of the wave radiated by the antenna in that particular direction .This is

usually dependent on feeding techniques. When the direction is not specified, it is in

the direction of maximum radiation. Shown below are two mostly widely used

polarization techniques

5.1 Linear polarization

A slot antenna is the counter part and the simplest form of a linearly polarized antenna. On a slot

antenna the E field is orientated perpendicular to its length dimension . The usual microstrip patches

are just different variations of the slot antenna and all radiate due to linear polarization

5.2 Circular polarization

Circular polarization (CP) is usually a result of orthogonally fed signal input. When two signals

of equal amplitude but 90o phase shifted the resulting wave is circularly polarized. Circular

polarization can result in Left hand circularly polarized(LHCP) where the wave is rotating

anticlockwise, or Right hand circularly polarized(RHCP) which denotes a clockwise rotation. The

main advantage of using CP is that regardless of receiver orientation, it will always receive a

component of the signal. This is due to the resulting wave having an angular variation.

5.3 Bandwidth

The bandwidth of the patch is defined as the frequency range over which it is matched with

that of the feed line within specified limits .In other words, the frequency range over which the

antenna will perform satisfactorily. This means the channels have larger usable frequency range and

thus results in increased transmission.

The bandwidth of an antenna is usually defined by the acceptable standing wave ratio (SWR) value

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over the concerned frequency range. The fig 4 shows a typical broadband phenomenon in

terms of frequency band usage. Most commercial antennas use a 1.5:1 ratio ,as shown in

figure 5.1,suggesting that the range is covered Between the SWR of 1 up to 1.5 is the

bandwidth .

Figure 5.1: Narrowband vs. Broadband


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5.4 Substrate Permittivity

The dielectric constant plays a major role in the overall performance of the antenna. It

affects both the width, in turn the characteristic impedance and the length resulting in an

altered resonant frequency and reduced transmission efficiency. Initially we are using the

G10 fibreglass substrate (also known as FR4) but the permittivity ( r ε )of the substrates alters

from batch to batch, sometimes even between different sheets of the substrate. Three different

methods were investigated to determine the ε .

• The Napoli-Hughes opened edged cavity method [5]: this method

uses a dielectric with copper on both sides of the substrate. When

tested the results would show sharp spikes at resonant

frequencies. This can be used to determine the eff ε .However, this

method is often deemed inaccurate

• The closed cavity method [5]: The setup is somewhat similar to

the previous method, except the edges of the copper are short-

circuited. As a result only the Non-TEM waves propagate.

However, this method is very complicated to implement.


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6. SIMULATION OF RECTANGULAR PATCH ANTENNA USING WIPL-D

SOFTWARE:

6.1Experimental Setup and Observations

The following values were taken as constant in the experimental patch antenna we

designed

to study the effect of height of substrate:

Dielectric constant of substrate, εr =2.22

Loss tangent=0.0001

Length of patch=9.06mm

Width of patch=11.8mm

Distance of circular probe from centre, Y=7mm

Radius of probe=0.6mm

Case1: height=1.59 mm ; Bandwidth=500 to 700 MHz

Case 2: height= 2 mm ; Bandwidth = >700mhz

Case 3: height= 3 mm ; Bandwidth = Undeterminable as the VSWR never falls below 2

dB
20

Procedure:

o After entering into WIPL-D software make sure that antenna’s type is

marked as all generators

o After that the range of frequency which we make use are given here

the starting frequency is 1.5GHZ and the stop frequency is 1.GHZ

o After that according to the given structure the symbols, nodes, plates,

junctions, and excitations are taken into considerations.

o According to the values given the preview is generated and it is shown

in another window and it’s a 3D image

o After entering the values ,run the program with help of RUN button

o After compilation of given program the waveforms for radiation

pattern, impedance parameters, admittance parameters and scattering

parameters are obtained.

The waveforms of radiation pattern, impedance parameters, scattering parameters and admittance

parameters for given values are shown in the appendices.

6.2 Effect of ‘h’:

The most direct approach to increase the bandwidth of patch antenna is to increase the

thickness of the substrate, while using a low dielectric substrate [3]. This can extend efficiency

(as much as 90% if surface waves are not included) and bandwidth (up to 35%).
21

However, surface waves must be included, since surface waves extract power from the

direct radiation pattern, resulting in increased side lobe levels, antenna loss, and a decrease in

efficiency.

Moreover, the probability of surface wave formation increases as the thickness of the

substrate increases. As patch antenna radiates, a portion of the total available power for direct

radiation becomes trapped along the surface of the substrate. This trapped electromagnetic

energy leads of the development of surface waves. In fact, the Ratio of power that radiates into

the substrate compared to the power that radiates into air is approximately (03/2:1). Is this

governed by the rules of total internal reflection, which states that any field radiated into the

substrate at angles greater than the critical angle are totally internally reflected at the top and

bottom surfaces. This is illustrated I figure [1]. Therefore, for a substrate with dielectric Constant

Er=10.2, nearly 3.1 of total radiated power is trapped in substrate with a critical angle of

Roughly 18.2 degrees. Surface waves effect can be eliminated by using cavities or stacked

Substrate techniques. The excitation of surface wave is a function of ε r and h. However, this

has the fundamental drawbacks of increasing the weight, Thickness, and complexity of the

microstrip antennas. These complications and others prevent microstrip antennas from becoming

the standard in the microwave communication community


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7. FUTURE RECOMMENDATIONS

The results reflect it is possible to produce broadband microstrip patch antennas, that meet initial

product requirements for WLAN applications and perform moderately well when compared with the

commercial product. It is expected however further work is required in order to improve the current

broadband antennas. The following sections suggest a few issues to consider, if further attempts are

made to improve the existing broadband antennas.

7.1 Substrate

It is important to understand that at frequencies above 500 MHz, a signal

trace becomes an element itself of the circuit with distributed resistance, capacitance and

inductance. The current G10 substrates have been found to be exceedingly “lossy”, contains

uneven substrate heights and a large tolerance for er.

As a result it is important to use substrates consisting of constant dielectric control,

low dissipation factor and controlled thickness rather than employ typically used high volume

printed circuit boards similar to G10 substrates [10].A substrate with a lower er will increase the

bandwidth, and similar behaviour is also observed when the height of the substrate is increased

[BLUEBOOK, p 45]. These attributes have been known to improve antenna performance and

should be considered for use in a broadband situation.


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7.2 Closer input match method

Improvements in terms of better input impedance match are possible, which will result in

a “smoother” VSWR response over the 2.4 – 2.5 GHz. Ideally the VSWR of an broadband

antenna should be flat over the frequency band concerned, reflecting a VSWR of 1. The VSWR

response is never flat but ripples along the bottom end. When compared to the commercial

\product, the commercial antenna showed a steady VSWR response. Similar response is desired

from all broadband antennas. In future the broadband input impedance match can be optimized

to flatten the VSWR response over the concerned frequency band. Subsequently, the rectangular

broadband antenna requires further inspection since it did not meet the VSWR of

1.5:1requirement.

7.3 Reduction in real-estate area

When the decision was made to apply the parasitic patch scheme in order to broadband

the antennas, it was also obvious the trade off was a larger real estate patch area. Though the

rectangular antenna produced acceptable results, but in terms of patch area the antenna was

disadvantaged.

Subsequently the triangular broadband antenna was fabricated in order to reduce the

patch area without any reduction in performance. Ensuing research suggests however, the use of

shorting posts to reduce the size of the base patch by almost 50% .If implemented correctly, this

method could potentially halve the patch area of the current antennas. And as mentioned as

above in section 7.1, substrates with lower r e and a larger height can also be used to keep the

bandwidth response unchanged while reducing the patch area.


24

7.4 Circularly polarized broadband antennas

A WLAN antenna needs to be versatile and perform without prior alignment in order to

reach the optimum throughput. When circularly polarized the receiving antenna does not require

to be configured and will pickup signal no matter the orientation. This attribute of the antennas

will be ideal for WLAN applications.

7.5 Use of other broad band schemes

The use of parasitic rings in order to broadband narrowband antennas was chosen

because of its ease of implementation. But there are other schemes that will meet the

performance requirements while utilizing a smaller patch area. Other schemes utilising patches

with slotted gaps and circles with slotted lines have been known to perform effectively

under broadband situations .Keeping in mind, the ease of manufacture and being able to be

implemented using the copper tape


25

8. RESULTS AND CONCLUSIONS:

8.1: Results

The radiation pattern, Impedance, Admittance and scattering parameters are analysed

with the help of software named as WIPL-D. Those results are included in appendices.

8.2: Conclusion

In the radiation pattern shown in appendix-A, its gain decreases along the frequency. In

Linear polarization the typical gain obtained is 6dB; it has narrow band width lower frequency

limit of 50 MHz and upper frequency limit of 18 GHz. But in the simulation we obtained gain of

6.8 dB; with frequency limits of 500 MHz to 700 MHz. It decreases its value up to a point (i.e.

666.7MHz), again increases.

The model takes the frequency as an input and provides the real and imaginary parts of

the S-parameters as outputs. The maximum recorded percentage error in the prediction of the real

and imaginary parts of S-parameters is 3.29%.In simulation the values obtained are -0.48 dB at

500 MHz and -6.41 dB at 700mhz.

In the Smith chart as shown in appendix-F, its input impedance increases along the

frequency. In Linear polarization, in the simulation we obtained impedance of 336+i885.0 mu at

500 MHz and its values increases with frequency up to 665.9 MHz and then decreases.
26

According to the appendix-G ,in Linear polarization, in the simulation we obtained the

values of VSWR varies from 500mhz to 700 MHz it has highest value of 36.4U at 500 MHz

and the value obtained at 681.5 MHz is 2.92U

In the Y-parameters as shown in appendix-H, its real value increases along the frequency.

In Linear polarization, in the simulation we obtained real value of admittance as 918.0 ms at 500

MHz and its values increases with frequency up to 665.9 MHz and its value is 8549.0ms. . Its

imaginary value increases along the frequency, real value of admittance as -16374 ms at 500

MHz and its values increases with frequency up to 665.9 MHz and its value is -3993.0ms.

In the Z-parameters as shown in appendix-I, its real value increases along the frequency.

In Linear polarization, in the simulation we obtained real value of impedance as 3.41 ohms at

500 MHz and its values increases with frequency up to 665.9 MHz and its value is 124.9 ohms. .

Its imaginary value increases along the frequency real value of impedance as -60.88 ohms at 500

MHz and its values increases with frequency up to 665.9 MHz and its value is 121.6 MHz

As the height of the substrate increases the performance of the antenna steadily improves

.However after a certain height, the surface take their toll and the performance of the antenna

declines. The performance of patch antenna can be further improved by using substrates with low

insertion losses as well the emergence of an improved implementation technique


27

REFERENCES

[1] Bahl, I. J and Bhartia, P; “Microstrip Antennas”, Artech House, 1980.

[2] Garg, R and Ittipiboon, A; “Microstrip Antenna Design Handbook”, Artech House,

2001.

[3] Zurcher, J-Francois and Gardiol, F; “Broadband Patch Antenna” Artech House,

1995.

[4] Kumar, G and Ray, K.P; “Broadband Microstrip Antenna”, Artech House, 2003.

[5] Rogers Corporation: Techtip #3. [Online]. Available: http://www.rogerscorp.

com/mwu/techtip4.htm

[6] Brown, S; “Microstrip Patch Antennas for PCS Applications”, Department

Electrical and Electronics Engineering; The University of Auckland, 1997.

[7] Ascom Systec AG; Miniature Broadband Antennas, Datasheet: Model MBA-5,

http://www.art-solutions.ch, [online]

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BIBILOGRAPHY

[1] James, J. R., and P. S. Hall, Handbook of Microstrip Antennas, Vol. 1, London: Peter

Peregrinus, Ltd., 1989.

[2] Srinivasan, V., ‘‘MNM for Variations in Rectangular Microstrip Antennas,’’ Ph.D.

thesis, Indian Institute of Technology, Bombay, India, 2000.

[3] Ray, K. P., ‘‘Broadband, Dual-Frequency and Compact Microstrip Antennas,’’ Ph.D.

thesis, Indian Institute of Technology, Bombay, India, 1999.

[4] Okoshi, T., and T. Miyushi, ‘‘The Planar Circuit—An Approach to Microwave Integrated

Circuitry,’’ IEEE Trans. Microwave Theory Tech., Vol. 20, April 1972,

pp. 245–252.

[5] Gupta, K. C., R. Chadha, and R. Garg, Computer-Aided Design of Microwave Circuits,

Dedham, MA: Artech House, 1981.

[6] Bahl, I. J., and P. Bhartia, Microstrip Antennas, Dedham, MA: Artech House,
29

APPENDIX-A
30
APPENDIX-B

31
APPENDIX-C

32
APPENDIX-D

33
APPENDIX-E

34
APPENDIX-F

35
APPENDIX-G

36
APPENDIX-H

37
APPENDIX-I

38

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