Compact solution for motor drive applications

Modules with the flow-concept allow the routing of the PCB without crossing and short power tracks
Michael Frisch, TYCO Electronics

The situation is now to take necessary additional actions to achieve sinusoidal current, for Power applications with connection to the public power line. Some general topics have to be investigated and integrated in the design: Compact design and low EMC, and optimised power losses.

The benefits of a compact design does not need to generate higher cost than standard design To achieve a compact PFC design, it is necessary to increase the switching frequency for a small PFC inductor. The modul But this inductor needs a high performance core and thermal contact to the heat sink. So it can handle the increased power dissipation. The semiconductors need higher performance to avoid, that won space is occupied by a bigger heat sink. But there are also arguments for a small design. A compact design allows complete different mechanical solutions, which can save significant system costs. For example to keep the application in the existing housing, it is necessary to have a PFC design which needs not too much extra space. Additional there exists a runaway effect in the EMC design. A higher switching frequency will force small circuit design and smaller components for the EMC-filtering. In a compact circuit, EMC emission is easier to handle and less filtering is necessary. This creates an advantage in time to market and cost.

Optimised Power Losses - MOSFET versus IGBT The decision depends on the chopper frequency, the Input- and DC-Link Voltage, and the technology cost of the semiconductor seen in cost per given die area. The switching losses are proportional with the frequency. At higher frequency the MOSFET becomes more attractive because of the lower switching losses. Important is also the total system loss generated by the active switch, IGBT or MOSFET together with the FRED Diode. The right choice of correspondent elements can optimise the design to a minimum in total losses. The efficiency of a chip technology with the frequency, are not a real indicator for selecting a chip for PFC applications. The reason is given by switching non - constant currents. In the sine maximum of the current, it is only a short pulse necessary to boot the 300V up to the 400V of the DC-Link. Closed to the minimum the pulse length is wider but the switched current is much lower, so that the switching losses are much more significant then the on state losses. To optimise cost of the circuit, static and switching losses should be equivalent. The semiconductor is fitting optimal into the application when Pstat/Pswitch = 1. The balance of conduction and switching loss is always the goal for the designer to achieve

To satisfy the challenges addressed above, appropriate functions will be integrated in a power module and the following ideas will be realised: Integration of all power semiconductors in one module; no additional action for the handling of the power dissipation to the heat sink is needed. Integration of shunts for current sensing in the DC Link and for controlling of the PFC transistor. Integration of a temperature sensor for detection of the substrate temperature. Realisation of a power flow concept, allowing a compact PCB design. LeadPins with similar voltage are concentrated as voltage islands Integration of a capacitor in the module allows to short-circuit the high frequency noise with low inductance on the module.

The solution is a module called flowPIM with the following features: 1 Phase Input Rectifier; PFC Transistor + extreme fast Diode; 3 Phase Inverter IGBT + FRED; HF-Capacitor in DC Link; Current sense shunt in the DCCurrent sense shunt for PFC controlling in the DC; NTC temperature sensor; Approved flow concept for easy routing of the system PCB; Clip-In technology for mechanical PCBassembly.
I Inside circuitry

The advantage is: Optimised PFC losses; Optimised EMC for low inductance design; Very compact mechanical outline (66mm x 31.5mm); Flow-Concept for easy PCB layout.

Wide power range with 2 packages: flowPIM 0 UCMax=600V / ICMax=7....14A at Tc=80C flowPIM 1 UCMax=600V / ICMax=14..19A at Tc=80C

The flow concept is a compact system solution, it is not only important to have a small package for the power module. It is also necessary to take the tracking on the system PCB into account. Modules with the flowconcept allow the routing of the PCB without crossing and short power tracks. The stand off under the module offers the possibility to place the gate driver circuit on the PCB under the power module to get a optimised tracking between the gate driver circuit and the power transistor in the module.

Mechanical outline