CSCI 4974 / 6974 Hardware Reverse Engineering

Lecture 2: Packaging Andrew Zonenberg zonena@rpi.edu

Packaging

Bare silicon devices are useless if you can t talk to t!e" #o"et!ing !as to connect t!e" to t!e board $o get to t!e silicon% we !ave to know w!at s in t!e way

Parts of an IC

Die $!e actual silicon &c!ip' Leadframe Pins t!at are soldered to t!e board o!ding com"o#nd Protects die and wires $ires or %#m"s (lectrically connects die to leadfra"e Die attac& )ec!anically connects die to leadfra"e

Die vs circ#it t&ickness

#!ti'die "ackages

#everal dies in one package *P+A , flas!

-e "ay see one of t!ese ne.t *riday s lab

)()# , A#/0 1ig!2density 3A34546A)

Leadframe

$!e actual pins w!ic! get soldered to t!e board

Package c!assification

)aterial 2 cera"ic% plastic% etc )ounting type 2 t!roug! !ole or surface "ount 0avity direction 2 up5down -ire bond vs flip c!ip $!roug! !ole vs #)$ $opology 2 linear vs area array

Packaging evo!#tion

Large% fragile devices% low logic density 3ot "any pins 1er"etically sealed packages re7uired (P68) needs 9: e.posure

Package t("es

0era"ic 4ual /nline Package ;04/P or 0(64/P< w5 soldered lid

Package t("es

04/P wit! window

Packaging evo!#tion

0era"ic is e.pensive% can we do so"et!ing c!eaper= Plastic costs a lot less 0era"ic is still used in rare cases ;so"e "il2spec etc< but nearly un!eard of in "odern consu"er devices

Package t("es

Plastic 4ual /nline Package ;P4/P<

Packaging evo!#tion

4/Ps waste a lot of space for !ig!2density devices 4rilling !oles re7uires "ore "anufacturing ti"e

#urface "ount tec!nology>

Package t("es

#"all 8utline /0 ;#8/0< #"all 8utline Package ;#8P<

Packaging evo!#tion

1aving pins on only two sides "akes for long% skinny% awkwardly s!aped packages -!at if we used all four=

Package t("es

?uad *lat Pack ;?*P<

Package t("es

?uad *lat 3o2Leads ;?*3<

Packaging evo!#tion

(ven !ig!er density is re7uired for "odern electronics -!y only use t!e peri"eter of t!e package=

Package t("es

Pin2grid array ;P+A<

Package t("es

Ball2grid array ;B+A<

Package t("es

0olu"n +rid Array ;0+A<

Package t("es

0!ip2scale B+A ;0#B+A<

Packaging evo!#tion

#pecial needs call for special device packages

Package t("es

Package t("es

0!ip on Board ;08B<

H(%rid circ#its

8ne or "ore dies bonded to a cera"ic ;usually< substrate *il" passives printed directly on substrate% optional laser tri"

C&i" on )!ass *Co)+

4ie is attac!ed directly to glass substrate )ostly used for L04s

#!tic&i" mod#!e * C +

,&erma!!( en&anced "ackages

+enerally "eant to be used wit! a !eatsink Always flip2c!ip packaging :ery difficult to "icroprobe

0!ip will fry if not cooled

(.tra care re7uired to decap

Do#%!e inter"osers

4ie in a B+A package soldered to a larger B+A or P+A :ery rare% / ve only seen t!is once

eta! cans *,-'.+

8ften used for old discrete transistors% laser diodes #o"e "ilitary 5 auto"otive /0s +ood t!er"al properties +lass5"etal !er"etic seal Low pin count

Camera sensors

Package is optically transparent )ay not need to decap at all 2 @ust i"age t!roug! window $ypically cera"ic wit! glass lid

-t&er sensors

Packaging varies widely depending on w!at s "easured (.a"ple: )()# "ass airflow sensor

Potting

Protects board fro" water% dirt% etc )ay also "ake ta"pering !arder 3eeds to be re"oved to get to c!ips or probe board

Conforma! coating

Like potting% but a t!in layer t!at doesn t fill t!e enclosure )ay be clear or opa7ue

/)0 #nderfi!!

Provides "ec!anical stability to balls /"proves resistance to cracking )akes desoldering difficult

Die coats

Protection against particulates and ;=< li7uid ingress Polyi"ide fil" #ilicone goo

Package constr#ction

1ow is t!e c!ip connected to t!e leadfra"e=

$ire %onding

9sually Au% but Al and 0u are used in special applications 0!eapest way of connecting to leadfra"e

Concentric %ond rings

#een in !ig!2density devices

Do#%!e %onds

$wo wires fro" die to t!e sa"e package pin /ndicates a !ig!2current line ;often power<

/a!! %onding

-ire feeds t!roug! needle (lectrically "elt tip into a ball Press onto bond pad wit! needle Apply !eat and ultrasound to weld

$edge %onding

-ire feeds t!roug! wedge2s!aped nozzle Press onto pad Apply !eat and ultrasound to weld 3ote probe scrub fro" wafer test

1!i" c&i"

Large% !ig!2perfor"ance devices wit! lots of pins Active side of die goes down #older bu"ps fro" top "etal layer to interposer /nterposer is basically a fine2pitc! P0B wit! lots of layers Breaks super2fine solder bu"ps out to saner pitc! *ront2side attacks very !ard Back2side attacks easier% top of die is already e.posed :4

Carrier is!and / "add!e

#urface t!at t!e die rests on $ypically connected to die substrate and electrically grounded Plastic packages: 0u wit! #n plating 0era"ic packages: Au plating over cofired leadfra"e "etal 8ften fully covered by "olding co"pound (.posed in ?*3s for t!er"al reasons

Die attac&

0onnects die to island 0o""on "aterials:

#ilver epo.y #older Au2#i eutectic alloy 3ano*oil ;Al23i , solder<

Package materia!s

$o reverse t!e device% we !ave to get t!e package off Anowing e.actly w!at it s "ade of !elps

P!astic "ackage materia!s

&Plastic' c!ips are not actually plastic> 3or"ally a co"posite% glass beads in epo.y -ire bonds are Au 5 0u Leadfra"es #n% 0u

P!astic "ackage materia!s

(po.y is a t!er"oset ;won t "elt% @ust burns or deco"poses< +lass content varies greatly% but is usually fairly !ig! ;BB CDE<

#o"eti"es a lot !ig!er>

Ceramic "ackage materia!s

*ired cera"ic clays Pieces often !eld toget!er wit! glass 0ofired packages use )o or - interconnect Lids "ay be !eld on wit! solder or glass (.tre"ely c!e"ical resistant% very little will etc! it :ery good seals% used for !ig!2reliability applications Brittle% can crack

Ceramic "ackage materia!s

0an be w!ite% brown% or purple Al28F is by far t!e "ost co""on cera"ic 8ften "i.ed wit! #i82 Al3 and Be8 are used in so"e special cases% rare All are colorless Brown color co"es fro" a few percent of )n8

P#r"!e ceramic ana!(sis

0cknow!edgement

#o"e package i"ages were taken by:

Go!n )c)aster "ars!all!