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DFx Checklist

Zebulon Solutions, LLC


Electrical PCB Thermal Has TCE mismatch between BGA and PCB been taken into account? Have chip and PCB manufacturers guidelines been taken into account? Are there any high thermal mass components that need special consideration? Do thermal pads meet both IC and fabricator guidelines? Do all plated through holes that connect to poured copper utilize proper thermal pads? Do all vias connecting to poured copper utilize proper thermal pads
This can be waived in cases where there are narrow traces between the solder pad and the via

Do surface traces that connect to top or bottom layer copper pours utilize proper thermal pads? Silkscreen Have all polarized components (e.g. diodes and EL caps) been aligned in the same direction on each axis? Are polarity indicators visible after component attach? Panelization Is there room for at least two tabs on each side of the PCB to allow a stable panel?
More are needed for large boards

Has the panel size been determined and the panelization layout / number calculated?
Is this panel size a standard size for the chosen fabricator? Will this panel size fit the assembler's equipment?

PCB Materials How many layers


If other than 1, 2. 4 , 6 or 8, has a supplier been identified?

Thickness?
If not 0.062", is the thickness standard? If not, has a supplier been identified?

Material
In not FR4, has a supplier been identified

Copper
Are standard thicknesses of copper used? If not, has a supplier been identified? Are layer pairs properly balanced wrt total copper weight? Copper thieving?

Vias / holes and traces Are all vias through hole?


If so, do they meet the PCB manufacturers via diameter requirements If not are there Blind or buried vias? If so, has a supplier been identified Do they meet the suppliers guidelines Microvias? If so, has a supplier been identified Do they meet the suppliers guidelines

Is the hole density at or below the fabricator's maximum hole density?

Are all drill sizes standard? Do all plated and unplated vias meet manufacturers tolerances? Are minimum trace widths and spaces consistent with fabricator's requirements? Do spaces between high voltage traces meet guidelines? Solder mask Does the solder mask meet the manufacturers requirements? Do the solder makes defined pads meet the fabricators requirements Do the solder makes defined pads meet the assembler's requirements Does the solder mask meet stencil guidelines? PCBA Weight Have component weight calculations been done for any heavy components wrt double sided assembly? Through hole Are all through hole components on the same side of the board? Are any through hole components flying above other components?
If so have clearance and potential shorting issues been addressed?

Rework Are all components on the board positioned so as they may be reworked without removing other components? General Are all components of the same part number on the same side?
Not necessary but can save reels and help with MOQ issues

BGAs Is there a viable BGA escape and routing plan? Are all other components below or adjacent to the BGA placed so as to allow rework of the BGA? Are the solder mask pads defined properly? RF Printed antennas Are printed antenna dimensions called out exactly? Are ground plane keepouts near antennas clearly specified? Stitched vias Are the spacings between stitched vias short compared the wavelength (typical less than 1/10th)? Dielectric materials Do the properties of the dielectric materials meet RF requirements? Striplines and microstrips Can the required tolerances for controlled impedance traces be met?
E.g. 50 ohm microstrips and striplines This needs to be accurately calculated taking into account all tolerances

Are ground planes under microstrips uninterrupted? Are ground planes above and below striplines uninterrupted? Has the solder mask thickness and properties been taken into account for microstrips? Does silkscreen avoid cross all controlled impedance traces RF ground Is RF ground separated from digital ground?
Is a star connection used?

Analog General Does silkscreen avoid cross all sensitive analog traces Are all sensitive analog nets guardringed with analog ground? Analog ground Is analog ground separated from digital ground?
Is a star connection used?

Test Test Coverage Has a test coverage calculation or simulation been conducted? Process Test Has a test plan for either MDA or ICT been defined? Are there test pads for all nets?
If not, are there good reasons for each and every net not having a testpad? Do the test pads meet the assembler's guidelines

Functional Test Has a functional test plan been defined? Are test pads or test header provided of all nets that need to be accessed for functional test? Debug and rework Is there a debug plan? Is there a debug tree? Is there a rework plan post debug? Isolation Is RF isolation required?
If so are isolation chambers or fixtures defined and tested? Have near field effects been taken into account Are there to be prohibitions on any type of RF transmitters near the line (e.g. cell phones)? If so have these regulations been worked out and approved?

Real time data Is real time access to the internet or an intranet required
If so, has an up-time requirement been specified and a solution identified Have security issues been addressed Is there a backup solution?

General RoHS Are there requirements for RoHS?


If so, Do all components come with RoHS certs? Do all processes comply with RoHS (e.g. lead free)?

www.zebulonsolutions.com
Copyright 2011 Zebulon Solutions, LLC

General

h between BGA and PCB been taken into account? CB manufacturers guidelines been taken into account? h thermal mass components that need special consideration? meet both IC and fabricator guidelines? ough holes that connect to poured copper utilize proper thermal pads? cting to poured copper utilize proper thermal pads

ed in cases where there are narrow traces between the solder pad and the via

s that connect to top or bottom layer copper pours utilize proper thermal pads?

d components (e.g. diodes and EL caps) been aligned in the same direction on each axis? ators visible after component attach? at least two tabs on each side of the PCB to allow a stable panel?

d for large boards

e been determined and the panelization layout / number calculated?

a standard size for the chosen fabricator? ze fit the assembler's equipment?

2. 4 , 6 or 8, has a supplier been identified?

he thickness standard? upplier been identified? supplier been identified

cknesses of copper used? upplier been identified? roperly balanced wrt total copper weight?

eet the PCB manufacturers via diameter requirements

supplier been identified meet the suppliers guidelines

supplier been identified meet the suppliers guidelines

y at or below the fabricator's maximum hole density?

unplated vias meet manufacturers tolerances? ce widths and spaces consistent with fabricator's requirements? en high voltage traces meet guidelines?

mask meet the manufacturers requirements? kes defined pads meet the fabricators requirements kes defined pads meet the assembler's requirements mask meet stencil guidelines?

weight calculations been done for any heavy components wrt double sided assembly?

ole components on the same side of the board? hole components flying above other components?

nce and potential shorting issues been addressed?

nts on the board positioned so as they may be reworked without removing other components?

nts of the same part number on the same side?

ut can save reels and help with MOQ issues

BGA escape and routing plan? mponents below or adjacent to the BGA placed so as to allow rework of the BGA? ask pads defined properly?

nna dimensions called out exactly? e keepouts near antennas clearly specified?

between stitched vias short compared the wavelength (typical less than 1/10th)?

s of the dielectric materials meet RF requirements? tolerances for controlled impedance traces be met?

rostrips and striplines accurately calculated taking into account all tolerances

es under microstrips uninterrupted? es above and below striplines uninterrupted? ask thickness and properties been taken into account for microstrips? void cross all controlled impedance traces

arated from digital ground?

void cross all sensitive analog traces analog nets guardringed with analog ground?

separated from digital ground?

ge calculation or simulation been conducted?

or either MDA or ICT been defined? ds for all nets?

good reasons for each and every net not having a testpad? meet the assembler's guidelines

test plan been defined? test header provided of all nets that need to be accessed for functional test?

plan post debug?

n chambers or fixtures defined and tested? d effects been taken into account prohibitions on any type of RF transmitters near the line (e.g. cell phones)? se regulations been worked out and approved?

s to the internet or an intranet required

ime requirement been specified and a solution identified issues been addressed kup solution?

ements for RoHS?

nents come with RoHS certs? es comply with RoHS (e.g. lead free)?

Meet Guidelines for? Fabrication Assembly

Covered Component By DRC?

Issues noted

DFx Checklist
Zebulon Solutions, LLC
Mechanical Plastic Molding Material Has a resin been identified?
Does the molder have an established supply chain to procure this resin? Does the molder have presses that can handle the resin and the size of the part?

Are there unusual resin properties required? What are the strength, flex requirements? Has a color been defined?
Will the resin be purchased colored? Has the color code ID for the resin manufacturer been confirmed?

Is regrind allowed?
If so, what percentage? If yes/no, does the pricing reflect this?

Molding Has the cycle time been calculated and is it less than or equal to the cycle times used for quoting?
Is the cycle time less than or equal to the cycle times used for quoting? If not, has the price been reverified?

Has the monthly capacity been calculated based on cycle time, cavities and effective shifts?
Does the monthly capacity exceed the max monthly volume? If not, the cavitation needs to be revisited

Wall thicknesses
Are all wal thicknesses similar (with +/- 15%)?

Gating and ejector pins


Have locations for gates and ejector pins been specified and checked for cosmetic or functional ramifications?

Has part draft been added to the part design for the tool manufacturing? Tooling Are the tool specs defined?
Has the tool construction material and hardness been specified? Has the tool life been specified? Does the toolmaker warrant the tool against expected life?

Have first articles, shipping and a contingency for tool mods / travel been included in the tooling budget? Has the tool been designed so that areas of potential design change are steel-safe? Have all areas of the design that require tool action been identified?
Are the impacts for such action incorporated in the tool cost, tool life, and cycle time costs?

Assembly Has the part assembly been analyzed to include the mold draft to verify assembly?
Has a drafted SLA or 3D part been made to confirm this?

Are all assembly steps defined?


Glue or hot glue? Screws or other fasteners? Snaps?

Secondary Operations Have any secondary operations been defined for the product?

I.e. pad printing, silk screen, etc If so, has the art work been created?

Will there be any sonic welding required for the assembly?


If so, is the cost and timing built into the overall budget? Has the part been designed to accommodate sonic welding assembly?

Sheet Metal Material Has the type of metal been defined? I.E. strength vs cost analysis Will the outside need any secondary coatings or paint? Stamping Has the budget been defined for the tooling?
Has a bend analysis been completed to help define cost?

Will this be a domestic or overseas manufacturing operation? Can the product be made within a progressive stamp operation? Or will there be multiple tools needed for the product? Punching Are all punches standard to the fabricator? Has the design been optimized to allow for multi-punch where applicable? Secondary Operations If the product is to have an outside coating, has this been defined?
I.e. has a paint specification and color been determined? Has the coating supplier been identified with costs outlined along with application method? Will the coating withstand normal wear requirements?

Will PEMs be required for assembly?


If so, has the weld equipment or supplier been identified along with the weld fixtures developed?

Machining Material Has an ROI analysis of machining vs tooled solutions been conducted? What type of metal or plastic is required?
Are there any particular properties that are required to be replicated?

Has the design been reviewed for optimized machining operation? Secondary Operations If the product is to have an outside coating, has this been defined?
I.e. has a paint specification and color been determined?

Has the coating supplier been identified with costs outlined along with application method? Will the coating withstand normal wear requirements? Will PEMs be required for assembly?
If so, has the weld equipment or supplier been identified along with the weld fixtures developed?

Castings Material Has the cast metal specification been identified? Has the method of casting been identified? I.E Sand vs hard tool Are there specific thermal property requirements necessary for the metal? Secondary Operations

If the product is to have an outside coating, has this been defined?


I.E. has a paint specification and color been determined?

Has the coating supplier been identified with costs outlined along with application method? Will the coating withstand normal wear requirements? Will tap screw holes be necessary for assembly? General ROI Have ROI calculations been done on the chosen tooling option?
Have these calculations been compared to other options with more or less tooling wrt ROI?

Packout Has the shipping packaging been design so as not to induce scratches during shipment? Design Validation testing Will there be any validation testing required for the assembly?
I.e. drop test, environmental etc Has the product been designed to meet these requirements?

Assembly Are there any specific requirements necessary for the assembly? Will there be any jigs or fixtures required for assembly? How will it be assembled? Snaps, screws, etc. Are there any moving parts in the assembly?
If so, have prototypes been exhaustively tested?

Has a tolerance analysis been conducted


Are the datum(s) well defined Do the tolerance stackups meet specification?

Does the assembly include any blind attachments for connectors? How many stations will be required for assembly? Will the assembly be required to be unassembled for warranty? Rework Will the assembly be required to be unassembled for warranty? Are there any parts that would need to be destroyed or risk damage during disassembly? Has the rework time process been defined? Parts Have the number of parts been scruitized for ways to reduce? Have similar parts been scruitinized to see if they can be made identical instead?

www.zebulonsolutions.com
Copyright 2011 Zebulon Solutions, LLC

General

have an established supply chain to procure this resin? have presses that can handle the resin and the size of the part?

al resin properties required? ength, flex requirements?

purchased colored? de ID for the resin manufacturer been confirmed?

he pricing reflect this?

e been calculated and is it less than or equal to the cycle times used for quoting?

less than or equal to the cycle times used for quoting? price been reverified?

capacity been calculated based on cycle time, cavities and effective shifts?

y capacity exceed the max monthly volume? tion needs to be revisited

nesses similar (with +/- 15%)?

or gates and ejector pins been specified and checked for cosmetic or functional ramifications?

en added to the part design for the tool manufacturing?

struction material and hardness been specified? been specified? maker warrant the tool against expected life?

s, shipping and a contingency for tool mods / travel been included in the tooling budget? n designed so that areas of potential design change are steel-safe? the design that require tool action been identified?

for such action incorporated in the tool cost, tool life, and cycle time costs?

mbly been analyzed to include the mold draft to verify assembly?

A or 3D part been made to confirm this?

steps defined?

ary operations been defined for the product?

silk screen, etc work been created?

sonic welding required for the assembly?

and timing built into the overall budget? n designed to accommodate sonic welding assembly?

metal been defined? I.E. strength vs cost analysis need any secondary coatings or paint?

een defined for the tooling?

ysis been completed to help define cost?

mestic or overseas manufacturing operation? be made within a progressive stamp operation? e multiple tools needed for the product?

tandard to the fabricator? een optimized to allow for multi-punch where applicable?

o have an outside coating, has this been defined?

pecification and color been determined? supplier been identified with costs outlined along with application method? withstand normal wear requirements?

uired for assembly?

eld equipment or supplier been identified along with the weld fixtures developed?

sis of machining vs tooled solutions been conducted? tal or plastic is required?

rticular properties that are required to be replicated?

een reviewed for optimized machining operation?

o have an outside coating, has this been defined?

pecification and color been determined?

g supplier been identified with costs outlined along with application method? g withstand normal wear requirements? uired for assembly?

ld equipment or supplier been identified along with the weld fixtures developed?

al specification been identified? of casting been identified? I.E Sand vs hard tool c thermal property requirements necessary for the metal?

o have an outside coating, has this been defined?

pecification and color been determined?

g supplier been identified with costs outlined along with application method? g withstand normal wear requirements? oles be necessary for assembly?

tions been done on the chosen tooling option?

ulations been compared to other options with more or less tooling wrt ROI?

packaging been design so as not to induce scratches during shipment? validation testing required for the assembly?

vironmental etc been designed to meet these requirements?

ecific requirements necessary for the assembly? jigs or fixtures required for assembly? sembled? Snaps, screws, etc. oving parts in the assembly?

types been exhaustively tested?

nalysis been conducted

) well defined e stackups meet specification?

ly include any blind attachments for connectors? ns will be required for assembly? y be required to be unassembled for warranty?

y be required to be unassembled for warranty? rts that would need to be destroyed or risk damage during disassembly? me process been defined?

r of parts been scruitized for ways to reduce? s been scruitinized to see if they can be made identical instead?

Meet Guidelines for? Fabrication Assembly

Covered Component By DRC?

Issues noted