Surface Mount Technology

INTRODUCTION
Compact size of electronic equipment is due to surface mount technology. Surface mount technology allow packaging of electronic components so that the overall assembly is compact.

In SMT both components and conductive tracer i.e. connections! are installed on the same side of substrate or surface. Substrate can be ceramic" paper plastic" rigid and fle#ible $C%&s.

SURFACE MOUNT COMPONENTS

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Surface Mount Technology

Many but not all through whole components have a surface mountable counter part. (ue to some physical limitations so conventional components cannot be manufactured as SMC Surface Mount Components!. e.g. )igh capacity capacitor and power transformers" still most circuit can be assembled" using SMT" even though some conventional through hole components are required. It is important for SMT surface designer and service technician to know the general physical configuration and operating parameters of various SMC&s. *ll SMC&s in familiar are available separately SMC&s used for automatic assemblies are supplied in rills of paper or in magazine. DETAILS ABOUT SOME (SMCS) 1. Chip resister : These are most widely produced of all SMC&s. They are originally developed for used in hybrid micro circuit. The chip registers are leadless registers. Constructionally deice is similar to thick film resister. The typical size of resisters are '.+ ,.- mm." '.. - mm" -.+ ,., mm. The resistance range of most chip resistor is '/ to -.- M some companies manufacture up to the value of '/ M or higher than this.

2. Chip Capacitor :

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Surface Mount Technology

There are originally developed from use in hybrid micro circuits. There are basically three types of surface mountable chip capacitor. a! Multi layer Ceramic b! 0lectrolytic c! Tantalum Ceramic multi layer chip capacitors are commonly used. They are stable and highly reliable. The capacitance value available are from ' $1 to ' 1. $ackage style is identical to chip resister. The size of chip capacitor depends on the value of capacitor. 1or high capacity electrolytic and tantalum capacitor are used. Tantalum capacitors are available for the values of /.' 1 to '// 1. *luminium electrolytic capacitors are larger than that of tantalum. Tantalum capacitors are available in the values of '.2 1 to .3 1. 3. ote!tio"eter : %oth single and multiterm trimming potentiometers are available in surface mountable configuration. They are made from ceramic or high temperature plastic so as to protect than from emertion soldering. The dimension of smallest single term trimmer is . # . mm. Multi terms trimmers are not designed for repeated ad4ustments. They can be ad4usted mostly '/ times. The trimmers are designed to be ad4usted by means of miniature screw driver or special tools.

#. I!$%ctors :
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Surface Mount Technology

Many kind of surface mountable lead and leadless inductors and even transformers are available. Inductance&s value ranges from few '/&s of nano henry to ' milli )enry '/&s of nano h to mh ! &. Descript Se"ico!$%ctors : Many diodes" transistors and descript semiconductors are available in miniature surface mountable packages. The S 5 ( Small outline (iode ! package is leadless cylinder used for diodes. The S5T Small outline transistor ! packages are used for transistors"

diodes various up opto electronic components. $ackage configuration determines power dessipation of any semiconductor. '. I!te(rate$ Circ%its (ICs) : Surface mountable IC&s are developed by Te#al Instruments. The most popular surface mountable IC packages is small 6 outlet S5! configuration developed by $hilips. It resembles" a miniature (ual In 7ine $ackage ! (I$. *n 2/ i.e. small outlet device occupies '8.th board space of an equipment $ackage ! (I$. ). Other S%r*ace Mo%!ta+,e Co"po!e!ts : There are many other surface mountable devices available like photo transistor opto isolators8couplers" infrared 70(&s" ceramic filters" switches and relays. (ual In 7ine

SMT ASSEMBLY METHODS

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Surface Mount Technology

Surface mountable components like conventional through hole components can be placed an a board or soldier in place either by hand or by machine.

)and assembly is used by home e#perimental and electronic companies for the production of prototype SMT circuit boards.

AUTOMATIC SMT ASSEMBL*utomatic placement equipment can select the position on circuit board from '/// to 2 lakhs components per hour. There are three other categories of automatic SMC placements equipment Mass placement!.

CO.DUCTI./ BO.DI./ Soldering is a cheap method for bonding SMCs and socket terminals to circuit board pads. Conductive adhesive also used" both methods are important.

TYPES OF SOLDERING
There are various methods of soldering
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Surface Mount Technology

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)and soldering. 9ave soldering. :eflow soldering.

In hand soldering the soldering paste is applied to the board and the SMCs are placed on it by hand" so it is called as hand soldering.

:eflow soldering is most important conductive bonding method for SMC&s. The simplest form of reflow soldering occurs when tinned terminals and thickly tinned pad is heated by soldering iron or other means. ;ntil the two tinned layers melt and merged together.

CO.DUCTI0E AD1ESI0E BO.DI./ : Conductive adhesives are used to bond the terminals of components to the conductive traces. They are relatively easy to use and they eliminate thermal shock of soldering. <umbers of families of adhesive are available" all of them contain conductive powder in one or two part base. The most common conductive powder in order of increasing resistance includes gold" silver" copper" nickel" carbon and graphite. *dhesive base includes urathene" polyster and one or two part epo#ies.

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Surface Mount Technology

Conductive adhesives can be applied by hand using squeezable dispenser" 4ust like tooth paste and automatically metered gringe or a piece of wire. They can also be applied by screening.

Thermoplastic conductive adhesives can be rework using heat from ordinary soldering iron or hot air gun. The SMC&s can be removed after adhesive becomes soften. * new SMCs can be bonded to the same location by reheating the adhesive.

The ma4or draw back of conductive adhesive is cost" self life" remains for + to '- month and hazardous vapour.

ADVANTAGES OF SMT
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Surface Mount Technology

There are various advantages of SMT. 1. 2e$%ce Circ%it Boar$ Si3e : The compact size of SMC&s considerably reduces area of circuit board. 2. Li(ht i! 4ei(ht : SMC&s are lighter than their through hole counter port. e.g. = 6 pin (I$" 7M ,/= M opamp weighs +// mg. The so package vargen of same IC 9eighs +/ gm. 3. The low weight of SMC&s and smaller circuit board together gives 2 to ' weight advantages over conventional board. *lso SMT boards are thin therefore they gives =>' volume advantage over conventional boards. #. Do%+,e 5 Si$e$ Circ%it Boar$ : SMT can also used double sided board with an advantage that components can be placed on the both sides. &. S%+"i!iat%re Circ%its : SMT circuits are nearly as tiny as hybrid integrated circuits. '. A%to"ate$ asse"+,6 : SMCs are much more compacted with automatic assembly equipment. The time consuming in drilling holes in circuit board is climinated. SMC&s have no wire leads to cut" bend and insert. Therefore SMT boards can be automatically assemble quickly than conventional boards. ). Lo4er Cost : The SMC&s cost is generally more" till SMT can reduce over all board cost for variety of reasons. e.g. saving of ./? cost results from elimination of drilling hole equipment. 7. Other A$8a!ta(es : Some advantages of SMT are less obvious than above. i! Compact size of SMT so it is used in mobile.

DISADVANTAGES OF SMT
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Surface Mount Technology

1.

SMC Sta!$ar$isatio! : The same SMC from two different manufacturers may have different dimensions" which may create a problem. )ence standardisation is necessary. Till today no standardisation is made.

2.

SMC A8ai,a+i,it6 : Some '2"/// components are available as SMC but not all of them may be available when needed i.e. wanted.

3.

1i(h start %p e9pe!ses : The start up cost of SMT for both manufacturers and individual e#perimenters can be high. 1or manufacturers automated production equipment is most e#pensive investment. 1or e#perimenters requires new

assembly tools and stock of surface mountable resisters" capacitors" (iodes" transistors" ICs" etc.

Thus the overall cost is very high.

INSPECTION, TESTING AND REPAIRING

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Surface Mount Technology

(ue to small size of components SMT board requires very careful inspection particularly for solder ball" improperly soldered 4oints and missed soldver connections" etc. Some components are specially difficult to inspect like quad $7CC&s $lastic 7oaded Chip Carrier! i.e. IC having A 6 profile pins along each four sides and it has more than -= pins. Complete SMT board can be tested by hand or automatic testing equipment. 9hether testing is done by hand or automatically the test probes should be touch to SMC&s solder pad or their conductive traces. The test probes should not be touch to terminals of SMC&s properly designed SMT boards have test point location. :eplacing defective SMC&s required more patience and care because they are very small and are placed very closed to other components. 9hile desoldering care must be taken to prevent over heating of board and nearby SMC&s. 9hen solder melts SMC&s should be twisted before it is lifted from the board to broke the solder surface tension otherwise solder pad may comes out of the mode. Installing new SMC is not difficult 4ust place the SMC and heat its terminal for best result and old solder should be removed using desoldering tools. Thus the repairing of SMT circuit is difficult" so we can install new circuit instead repairing faulty circuit.

CONCLUSION
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Surface Mount Technology

1rom the above discussion I conclude that SMT is more advantages than the conventional circuit board. %ecause it reduces the size of circuit board" cost" weight etc. (ue to above advantages SMT circuit can be mount on the coin or on the postal stamp. *lso the circuit can be mounted on both sides of the circuit board. So now a days it is used in mobile" calculator or the circuit where small space circuit is required.

REFERENCE
'. 9.9.9. Smta. 5rg ''

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Surface Mount Technology

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0lectronic $ackaging and Integrating )and book. B %y )arper

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0lectronics for you 6 Auly '@@2 0lectronics for you 6 5ct. '@@@

Internal 0lectrode Secondary 0lectrode $rotective Class

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Surface Mount Technology

5vercoat 0#ternal 0lectrode Solder!

Ceramic Substrate

:egister I.SIDE A LEADLESS C1I 2E/ISTO2

0#ternal 0lectrode Solder!

Ceramic Substrate Interleaved 0lectrodes (ielectric INSIDE A CERAMIC CHIP CAPACITOR

Cull 9ing

A B 7ead S5$ $7CC

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Surface Mount Technology

$C% (iscrete Component MS$ %utt 7ead 0A2IOUS S1A ES O: T1E I.S (I$ (iscrete Component $C%

Through )ole (ISC:0T0 C5M$5<0<TS Soldered S57(0:0( 5< 5$$5SIT0 SI(0 51

C5M$5<0<T SI(0 S5$ $7CC

$C% (iscrete Component MS$ SU2:ACE MOU.T COM O.E.T SOLDE2ED O. :OOT 2I.TS O: CB

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Surface Mount Technology

Solderability Testing

Component $retin

Component $reform 7eaded!

%oard $rebake

%oard Surface $reparation

Stencil Solder $aste

Component *ssembly

Solder $aste Cure

:eflow

(eflu# *ssembled %oard

Component Coat REFLOW SOLDERING PROCESS PLAN

C5M$5<0<TS

S;%ST:*T0S

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S57(0: $*ST0 SC:00< 070CT:IC*7 I<S$0CTI5< :01759 (0DIC0 C70*<I<C %*E0 $7*C0M0<T S57(0:I<C F :095:E T0ST

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Surface Mount Technology

FLOW CHART FOR SMT

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