Pac Tech Asia Sdn Bhd

Pac Tech is a worldwide leader in low-cost electroless Ni/Au wafer bumping and advanced solder placement technology with volume production facilities in Germany, USA, and Japan. In line with our expansion plans, we have set up our new state-of-the-art wafer bumping and back-end processing facility in Penang, Malaysia. We are seeking individuals with strong background in electroless Ni/Au plating, chemical engineering, material science, backend processing and wafer level packaging for our Pac Tech Asia operations. We have immediate vacancies for the following positions:

Process Engineers (Plating)

(Penang - Bayan Lepas)

Responsibilities: Responsible for the development, qualification and production of wafer plating. To characterize and qualify new process and new materials, and new equipment for production use. Responsible for the maintenance and trouble shooting of new machines. Responsible for quality, yield, process, productivity, and cost improvement. Define process problems that lead to throughput or quality issues, evaluate root cause, implement solutions to stabilize processes and evaluate results Define and generate relevant design rules, defect catalog and process documentation Provide training and leadership for a team of technicians and operators

Requirements: Candidate must possess at least a Bachelor's Degree in Engineering (Material Science), Engineering (Chemical), Engineering (Mechanical), Engineering (Electrical/Electronic), Physics, Chemistry or equivalent. At least 1-2 years experience in plating (electro/electroless) Knowledgeable in DOE, SPC, GR&R, FMEA and 8D methodologies. Good interpersonal and analytical skills with the ability to work independently. Good communication skills in English (both verbal & written). Applicants should be Malaysian citizens or hold relevant residence status. Process own transport.

An attractive remuneration package will be offered to successful candidates. Interested applicants who meet the above requirements are encouraged to submit your resume stating qualifications, working experience, current/expected salary, e-mail, contact number and a recent passport-sized photograph and copies of all relevant certificates to: HR Manager PAC TECH ASIA SDN. BHD. No. 14, Medan Bayan Lepas Technoplex, Phase 4 Bayan Lepas Industrial Zone 11900 Bayan Lepas Penang, Malaysia Web Site : www.pactech.com Email to: humanresources@pactech-asia.com Only shortlisted candidates will be notified for interview.