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com

1
2
3
14
13
12
VBST
DRVH
LL
EN_PSV
TON
VOUT
TPS51117PW
4
5
6
7
11
10
9
8
TRIP
V5DRV
DRVL
PGND
V5FILT
VFB
PGOOD
GND
+
VOUT
Q2
L1
Q1
-
PGND
C2
C4
C1
R6
PGOOD
+5V
EN_PSV
R4
R1
R2
R3
VIN
1.8V~28V
C3
GND
+
+
R5

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VBST
LL
V5DRV
1
EN_PSV
TON
PGOOD
DRVH
DRVL
VFB
VOUT
14
13
12
11
10
9
2
3
4
5
6
V5FILT
TRIP
7 8 GND PGND
TSSOP (PW) PACKAGE
(TOP VIEW)

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2.9
3.9 /3.6
48

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V
OUT
[1 *
R
1
R
2
0.75 V

I
OUT(LL)
[
1
2 L
sw

V
IN
*V
OUT
V
OUT
V
IN

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T
ON
19 10
[12
R
TON
(23)V
OUT
* 100 mV
V
IN
* 50 ns

0
100
200
300
400
500
600
f

-

F
r
e
q
u
e
n
c
y

-

k
H
z
100
R - k
TON
W
400 500 600
700
200 300
V = 15 V,
V = 2.5 V,
PWM
IN
OUT

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V
TRIP
(mV) *R
TRIP
(kq ) 10 (mA)

I
ocp
V
TRIP
R
DS(on)
* I
ripple
2
V
TRIP
R
DS(on)
*
1
2 L

V
IN
[V
OUT

V
OUT
V
IN

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0
100
200
300
400
500
600
700
800
-50 0 50 100 150
T - Junction Temperature - C
J

I
-

S
u
p
p
l
y

C
u
r
r
e
n
t

-
A
V
5
F
I
L
T
P
W
M
m
0
1
2
3
4
5
6
7
8
-50 0 50 100 150
T - Junction Temperature - C
J

I
-

S
h
u
t
d
o
w
n

C
u
r
r
e
n
t

-
A
V
5
F
I
L
T
_
S
H
D
N
m
4
6
8
10
12
14
16
-50 0 50 100 150
I
-

T
R
I
P
S
o
u
r
c
e

C
u
r
r
e
n
t

-
A
T
R
I
P
m
T - Junction Temperature - C
J

50
60
70
80
90
100
110
120
130
-50 0 50 100 150
OVP
UVP
T - Junction Temperature - C
J

V
,

V
-

O
V
P
/
U
V
P
T
h
r
e
s
h
o
l
d

-

%
O
V
P
U
V
P

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0
50
100
150
200
250
300
350
400
450
500
5 9 13 17 21 25
V = 2.5 V
O
V = 1.05 V
O
V = 15 V,
PWM Mode
I
f
s
w
-

S
w
i
t
c
h
i
n
g

F
r
e
q
u
e
n
c
y

-

k
H
z
V - Input Voltage - V
I
0
100
200
300
400
500
600
700
800
100 200 300 400 500 600 700
V = 1.05 V
O
V = 2.5 V
O
V = 15 V,
PWM Mode
I
f
s
w
-

S
w
i
t
c
h
i
n
g

F
r
e
q
u
e
n
c
y

-

k
H
z
R - TON Resistance - k
TON
W
0
50
100
150
200
250
300
350
400
450
0.001
0.010
0.1 1 10
f
-

S
w
i
t
c
h
i
n
g

F
r
e
q
u
e
n
c
y

-

k
H
z
s
w
PWM Only
Auto Skip
I - Output Current - A
O
0
50
100
150
200
250
300
350
400
450
0.001 0.010 0.100 1.000 10.000
f
-

S
w
i
t
c
h
i
n
g

F
r
e
q
u
e
n
c
y

-

k
H
z
s
w
PWM Only
Auto Skip
I - Output Current - A
O

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1.03
1.04
1.05
1.06
1.07
0 2 4 6 8 10
PWM Only
Skip Mode
V
-

O
u
t
p
u
t

V
o
l
t
a
g
e

-

V
O
I - Output Current - A
O
2.46
2.48
2.50
2.52
2.54
0 2 4 6 8 10
PWM Only
Auto Skip
V
-

O
u
t
p
u
t

V
o
l
t
a
g
e

-

V
O
I - Output Current - A
O
1.03
1.04
1.05
1.06
1.07
5 9 13 17 21 25
I = 10 A
O
I = 0 A
O
V
-

O
u
t
p
u
t

V
o
l
t
a
g
e

-

V
O
V - Input Voltage - V
I
Auto Skip
2.46
2.48
2.50
2.52
2.54
5 9 13 17 21 25
I = 10 A
O
I = 0 A
O V
-

O
u
t
p
u
t

V
o
l
t
a
g
e

-

V
O
V - Input Voltage - V
I
Auto Skip

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0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
h
-

E
f
f
i
c
i
e
n
c
y

-

%
V = 8 V
I
V = 12 V
I
V = 20 V
I
V = 8 V
I
V = 12 V
I
V = 20 V
I
PWM Only
f = 350 kHz
sw
Auto Skip
I - Output Current - A
O
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
h
-

E
f
f
i
c
i
e
n
c
y

-

%
V = 20 V
I
V = 8 V
I
V = 12 V
I
V = 20 V
I
V = 8 V
I
V = 12 V
I
PWM Only
f = 300 kHz
sw
I - Output Current - A
O
t - Time - 10 s/div m
I (5 A/div)
IND
I (5 A/div)
O
V (50 mV/div)
O
t - Time - 10 s/div m
V (50 mV/div)
O
I (5 A/div)
IND
I (5 A/div)
O

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V (20 mV/div)
O
LL (10 V/div)
DRVL (5 V/div)
EN_PSV (5 V/div)
V (20 mV/div)
O
LL (10 V/div)
DRVL (5 V/div)
EN_PSV (5 V/div)
EN_PSV (2 V/div)
V (1 V/div)
O
PGOOD (5 V/div)
t - Time - 1 ms/div
EN_PSV (2 V/div)
V (1 V/div)
O
PDOOD (5 V/div)
DRVL (5 V/div)
t - Time - 10 ms/div

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Control
Logic
and
Driver
R1
R2
+
VFB
-
DRVL
I
L
Voltage Divider
PWM
VIN
Lx
DRVH
Io
Vc
Co
ESR
RL
Ic
Switching Modulator
0.75V
+
Output Capacitor

o
*
1
2q ESRCo
[

sw
4

R1 [
V
OUT
*0.75
0.75
R2

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T
ON(max)
*
1

V
OUT
V
IN(min)

R
TON

3
2

T
ON(max)
[ 50 ns
19 10
[12

V
IN(min)
V
OUT
* 150 mV
[q ]

L
IND
[
1
I
IND(ripple)

V
IN(max)
*V
OUT
V
OUT
V
IN(max)
[
3
I
OUT(max)

V
IN(max)
*V
OUT
V
OUT
V
IN(max)

I
IND(peak)

V
TRIP
R
DS(on)
*
1
L

V
IN(max)
[ V
OUT
V
OUT
V
IN(max)

ESR *
V
OUT
0.015
I
ripple
0.75
[
V
OUT
I
OUT(max)
60 [mq ]

30 mV
1.2 I
OUT(max)
*0.5 I
ripple
[ R
DS(on)
[
200 mV
1.2 I
OUT(max)
*0.5 I
ripple

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I
G
*Q
g

sw

W
DRIVE
[V
V5DRV
Q
g(top)
*Q
g(btm)

sw

W
PKG
*
T
J(max)
T
A(max)
q
JA

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1
2
3
14
13
12
VBST
DRVH
LL
EN_PSV
TON
VOUT
TPS51117PW
4
5
6
7
11
10
9
8
TRIP
V5DRV
DRVL
PGND
V5FILT
VFB
PGOOD
GND
+
VO
1.05V/10A
Q2
L1
1.0uH
Q1
-
PGND
C2
20 mF
C1A C1B
R6
100kW
PGOOD
+5V
EN_PSV
R4 R1
8.5k W
R2
22k W
R3
249kW
R5
300 W
+VBAT
C3
1u F
GND
+
+
C4
0.1 F m
GND

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
TPS51117PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS51117PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS51117PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS51117PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jan-2006
Addendum-Page 1
MECHANICAL DATA


MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M 0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20 16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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