N-CHANNEL 100V - 0.

115 - 13A IPAK/DPAK LOW GATE CHARGE STripFET II POWER MOSFET

TYPE STD10NF10
I I I

STD10NF10

VDSS 100 V

RDS(on) <0.13

ID 13 A

TYPICAL RDS(on) = 0.115 EXCEPTIONAL dv/dt CAPABILITY APPLICATION ORIENTED CHARACTERIZATION THROUGH-HOLE IPAK (TO-251) POWER PACKAGE IN TUBE (SUFFIX -1") SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX T4")

3 2 1
IPAK TO-251 (Suffix -1) DPAK TO-252 (Suffix T4)

3 1

DESCRIPTION
This MOSFET series realized with STMicroelectronics unique STripFET process has specifically been designed to minimize input capacitance and gate charge. It is therefore suitable as primary switch in advanced highefficiency, high-frequency isolated DC-DC converters for Telecom and Computer applications. It is also intended for any applications with low gate drive requirements.

INTERNAL SCHEMATIC DIAGRAM

APPLICATIONS I HIGH-EFFICIENCY DC-DC CONVERTERS I UPS AND MOTOR CONTROL

ABSOLUTE MAXIMUM RATINGS

Symbol VDS VDGR VGS ID ID IDM() Ptot dv/dt
(1)

Parameter Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 k) Gate- source Voltage Drain Current (continuous) at TC = 25C Drain Current (continuous) at TC = 100C Drain Current (pulsed) Total Dissipation at TC = 25C Derating Factor Peak Diode Recovery voltage slope Single Pulse Avalanche Energy Storage Temperature Operating Junction Temperature

Value 100 100 20 13 9 52 50 0.33 9 70 -55 to 175

Unit V V V A A A W W/C V/ns mJ C

EAS (2) Tstg Tj

() Pulse width limited by safe operating area. June 2002

.

(1) ISD 13A, di/dt 300A/s, VDD V(BR)DSS, Tj TJMAX (2) Starting T j = 25 oC, ID = 15A, VDD = 50V

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THERMAL DATA
Rthj-case Rthj-amb Tl Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose Max Max 3.0 100 300 C/W C/W C

ELECTRICAL CHARACTERISTICS (Tcase = 25 C unless otherwise specified) OFF

Symbol V(BR)DSS IDSS IGSS Parameter Drain-source Breakdown Voltage Zero Gate Voltage Drain Current (VGS = 0) Gate-body Leakage Current (VDS = 0) Test Conditions ID = 250 A, VGS = 0 VDS = Max Rating VDS = Max Rating TC = 100C VGS = 20 V Min. 100 1 10 100 Typ. Max. Unit V A A nA

ON (*)
Symbol VGS(th) RDS(on) Parameter Gate Threshold Voltage Static Drain-source On Resistance Test Conditions VDS = VGS VGS = 10 V ID = 250 A ID = 5 A Min. 2 Typ. 3 0.115 Max. 4 0.13 Unit V

DYNAMIC
Symbol gfs (*) Ciss Coss Crss Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VDS = 15 V ID = 5 A Min. Typ. 20 460 70 30 Max. Unit S pF pF pF

VDS = 25V, f = 1 MHz, VGS = 0

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ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symbol td(on) tr Qg Qgs Qgd Parameter Turn-on Delay Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions ID = 5 A VDD = 50 V RG = 4.7 VGS = 10 V (Resistive Load, Figure 3) VDD = 80V ID = 10A VGS= 10V Min. Typ. 16 25 15.3 3.7 4.7 21 Max. Unit ns ns nC nC nC

SWITCHING OFF
Symbol td(off) tf Parameter Turn-off Delay Time Fall Time Test Conditions ID = 5 A VDD = 27 V RG = 4.7, VGS = 10 V (Resistive Load, Figure 3) Min. Typ. 32 8 Max. Unit ns ns

SOURCE DRAIN DIODE

Symbol ISD ISDM () VSD (*) trr Qrr IRRM Parameter Source-drain Current Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 10 A VGS = 0 90 230 5 Test Conditions Min. Typ. Max. 13 52 1.5 Unit A A V ns nC A

di/dt = 100A/s ISD = 10 A VDD = 50 V Tj = 150C (see test circuit, Figure 5)

(*)Pulsed: Pulse duration = 300 s, duty cycle 1.5 %. ()Pulse width limited by safe operating area.

Safe Operating Area

Thermal Impedance

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Output Characteristics Transfer Characteristics

Transconductance

Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage

Capacitance Variations

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Normalized Gate Threshold Voltage vs Temperature Normalized on Resistance vs Temperature

Source-drain Diode Forward Characteristics

Normalized Breakdown Voltage vs Temperature

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Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform

Fig. 3: Switching Times Test Circuits For Resistive Load

Fig. 4: Gate Charge test Circuit

Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times

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TO-251 (IPAK) MECHANICAL DATA

DIM. MIN. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 2.2 0.9 0.7 0.64 5.2 mm TYP. MAX. 2.4 1.1 1.3 0.9 5.4 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033

H
C A C2

L2

D
B3 B6

A1

B5

A3
=

B2

G
=

L1

0068771-E

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TO-252 (DPAK) MECHANICAL DATA

mm MIN. A A1 A2 B B2 C C2 D E G H L2 L4 0.6 2.2 0.9 0.03 0.64 5.2 0.45 0.48 6 6.4 4.4 9.35 0.8 1 0.023 TYP. MAX. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 6.6 4.6 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397

DIM.

C2

DETAIL "A"

A1

L2

D DETAIL "A"
B

B2

L4

A2

0068772-B

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*on sales type

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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics 2002 STMicroelectronics - All Rights Reserved All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com

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