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PCB Design
PCB Design
Many companies have PCB design departments. Proper PCB design is an INTEGRAL part of design. PCB layout may break operation and performance of design (eg high speed digital, low level analog and RF). Note: ALL PCB traces have R,L&C Designing PCB is like painting a picture artistic If it looks good itll work is an old catch phrase. (Ref: D.L.Jones www.alternatezone.com)
PCB Design
First create SCHEMATIC (Garbage IN - Garbage OUT!)
GOOD PRACTICE for SCHEMATIC ! Signals inputs on left, outputs on right ! Bypass capacitors next to components ! Add notes on schematic (Pin requires guard track to GND)
! Thickness of copper (ounces per square foot) 1oz/ft2 most common (others 0.5,2,4 oz/ft2) ! Rule of thumb 10C rise is safe ! For 1oz/ft2 1 amp & 10C rise for 10 thou track Track inductance ! A great improvement may be obtained by running opposite current paths (outgoing & returning) close to each other, where the mutual coupling will cancel. ! This is easily achieved by running power rails one above the other on opposite sides of the PCB.
Different types of vias: (1) Through hole. (2) Blind via. (3) Buried via. The grey and green layers are non-conducting, while the thin orange layers and vias are conductive.
Source: http://en.wikipedia.org/wiki/File:Bga_und_via_IMGP4531_wp.jpg
Poor Bypass/Decoupling
VC
C
VGN
D
Circuit (b)
Placing a guard around high impedance inputs reduces possible effect of surface leakage. With a guard between input, the input isolation is improved, crosstalk is reduced and resistance between inputs is increased. The guard must be taken to a low impedance reference.
Solder paste applied using stencil (both sides) Flip Components on 2nd side (NC machine) with adhesive (heat or UV cure) Flip Components placed on first side (Pick & Place NC machine) Heated in oven solder surface tension aligns components to pads Boards washed to remove flux residues
Pick and Place Robot (Wiki)
! Smaller, lighter components on both sides of board ! SMT parts generally cost less than through-hole parts ! Fewer holes need to be drilled through abrasive boards ! Small errors in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads) ! Lower lead resistance and inductance (leading to better performance for high frequency parts) ! Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics
Definitions
! Track - copper conductors patterned on the board as interconnects between components. Via - Inter-layer conductors connected through vertical holes. Pad - A mounting or electrical contact point for a component or test point. Solder mask - A solder resistant protective coating applied where solder will not be applied Overlay/Legend/Silk screen - A component or text overlay added for identification or use during construction or fault finding.
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